Display panel and display device

Abstract

This disclosure provides a display panel and a display device, belonging to the field of display technology. The display panel includes at least a display area. The display panel includes a substrate and a plurality of sub-pixels disposed on the substrate. Each sub-pixel includes at least a light-emitting device, which is located in the display area. The light-emitting device includes a first electrode, a light-emitting layer, and a second electrode sequentially disposed along a direction away from the substrate. The display panel further includes a heat-conducting structure disposed on the side of the first electrode away from the light-emitting layer, and the heat-conducting structure and the first electrode's orthogonal projection on the substrate at least partially overlap.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display panel and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are a new type of current-driven semiconductor light-emitting device. They emit light by controlling the injection and recombination of charge carriers to excite organic materials, representing a self-emissive technology. Compared to passively emitting liquid crystal displays (LCDs), self-emissive OLEDs offer advantages such as faster response times, higher contrast ratios, and wider viewing angles. They are also easier to implement in flexible displays and are widely regarded as promising candidates for the next generation of display technology.

[0003] When the electrode material of an organic light-emitting diode (OLED) is made of a material with high light transmittance, it can be fabricated into a transparent display panel. A transparent display panel can transmit light like glass and display images like a screen, offering significant market potential in applications such as architectural glass, automotive glass, and exhibition displays.

[0004] When OLED transparent display panels are applied to automotive glass, there is a problem that the OLED display panel temperature is high and the OLED display panel deteriorates in high-temperature environments. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a display panel and a display device.

[0006] In a first aspect, this disclosure provides a display panel, which includes at least a display area; the display panel includes a substrate, a plurality of sub-pixels disposed on the substrate, each sub-pixel including at least a light-emitting device, the light-emitting device being located in the display area; the light-emitting device includes a first electrode, a light-emitting layer, and a second electrode sequentially disposed along a direction away from the substrate; wherein, the display panel further includes a heat-conducting structure disposed on the side of the first electrode away from the light-emitting layer, and the heat-conducting structure and the orthographic projection of the first electrode on the substrate at least partially overlap.

[0007] The heat-conducting structure and the light-emitting device are arranged in a one-to-one correspondence.

[0008] It also includes a heat dissipation structure disposed on the side of the heat-conducting structure opposite to the first electrode.

[0009] The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; the first heat-conducting sheet is connected to the first electrode of the light-emitting device, and the second heat-conducting sheet is connected to the heat dissipation structure.

[0010] The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; an insulating heat-conducting layer is disposed between the first heat-conducting sheet and the first electrode of the light-emitting device, and the second heat-conducting sheet is connected to the heat dissipation structure.

[0011] The display panel is divided into multiple pixel units, and each pixel unit includes multiple sub-pixels; at least a portion of the heat-conducting structures corresponding to each pixel unit is an integral structure.

[0012] The thermally conductive structure and the heat dissipation structure are both disposed on the side of the substrate near the first electrode.

[0013] The thermally conductive structure is disposed on the side of the substrate close to the first electrode; the heat dissipation structure is disposed on the side of the substrate away from the first electrode.

[0014] The material of the heat dissipation structure includes a copper alloy.

[0015] The thermally conductive structure is disposed on the side away from the substrate.

[0016] It also includes multiple first control signal lines and multiple second control signal lines; one of the heat-conducting structures is electrically connected to one of the first control signal lines and one of the second control signal lines.

[0017] The display panel further includes multiple first display signal lines, the first control signal lines and the second control signal lines overlap with the orthographic projections of the first display signal lines on the substrate, and the orthographic projections of the first control signal lines and the second control signal lines on the substrate do not overlap.

[0018] The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; the first control signal line and the second control signal line are electrically connected to the semiconductor layer and are arranged in the same layer as the semiconductor layer.

[0019] The thermally conductive structures are arranged in an array on the side of the substrate near the first electrode, and the first control signal line and the second control signal line connected to the same thermally conductive structure are located on opposite sides of the thermally conductive structure.

[0020] It includes multiple heat-conducting structures arranged sequentially along the column direction; the heat-conducting structures located in the same column are connected to the same first control signal line and the same second control signal line; each column of heat-conducting structures is divided into multiple heat-conducting structure groups, and the heat-conducting structures in different heat-conducting structure groups are different;

[0021] The first control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted, and the second control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted.

[0022] Each column of heat-conducting structures is divided into three heat-conducting structure groups, and the heat-conducting structures in different groups are different; every three columns of heat-conducting structures are located in three different heat-conducting structure groups in sequence.

[0023] The heat-conducting structure is divided into multiple heat-conducting structure groups arranged in an array; the first control signal lines connected to each heat-conducting structure in a heat-conducting structure group are short-circuited, and the second control signal lines connected to each heat-conducting structure in a heat-conducting structure group are short-circuited.

[0024] The device further includes: a first driving circuit; the first driving circuit and the heat-conducting structure are electrically connected; the first driving circuit is configured to provide a first control signal to the heat-conducting structure according to the temperature of the display panel; the heat-conducting structure is configured to conduct heat from the light-emitting device under the control of the first control signal.

[0025] The device further includes: a temperature sensing component and a first controller; the temperature sensing component is disposed on the side of the first electrode opposite to the light-emitting layer, and the orthographic projection of the temperature sensing component and the first electrode on the substrate at least partially overlaps; the temperature sensing component is configured to generate a first sensing signal based on the temperature of the display panel; the first controller is configured to control the operation of the heat-conducting structure based on the first sensing signal.

[0026] It also includes at least one first sensing signal line and at least one second sensing signal line; the first sensing signal line and the second sensing signal line are respectively connected to the temperature sensing component.

[0027] It also includes multiple second display signal lines; the first sensing signal line and the second sensing signal line overlap with the orthographic projection of the second display signal line on the substrate, and the orthographic projections of the first sensing signal line and the second sensing signal line on the substrate do not overlap.

[0028] It also includes a temperature conversion circuit; the temperature conversion circuit is configured to convert the first sensing signal into an electrical signal and transmit it to the first controller.

[0029] The temperature sensing component includes at least one of a thermistor or a thermocouple.

[0030] The display panel is a transparent display panel; the display panel also includes a transparent area; the thermal conductive structure and the transparent area do not overlap in their orthogonal projections on the substrate.

[0031] Secondly, this disclosure also provides a display device that includes the display panel described above. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of an existing display panel;

[0033] Figure 2 This is a cross-sectional view of an existing display panel;

[0034] Figure 3 This is a schematic diagram of a pixel driving circuit in an existing display panel.

[0035] Figure 4 This is a display panel according to an embodiment of the present disclosure;

[0036] Figure 5 This is a heat-conducting structure according to an embodiment of the present disclosure;

[0037] Figure 6 This is another display panel according to an embodiment of the present disclosure;

[0038] Figure 7 This is a partial enlarged view of the display panel according to an embodiment of the present disclosure;

[0039] Figure 8 for Figure 7 A partial cross-sectional view of the display panel shown;

[0040] Figure 9 for Figure 7 Another partial cross-sectional view of the display panel shown;

[0041] Figure 10 This is another display panel according to an embodiment of the present disclosure;

[0042] Figure 11 This is another partial enlarged view of the display panel according to an embodiment of the present disclosure;

[0043] Figure 12 This is another cross-sectional schematic diagram of the display panel according to an embodiment of the present disclosure;

[0044] Figure 13 This is a schematic diagram of the arrangement of the heat-conducting structure according to an embodiment of the present disclosure;

[0045] Figure 14 This is a schematic diagram of another arrangement of the heat-conducting structure according to an embodiment of the present disclosure;

[0046] Figure 15 This is a schematic diagram of another arrangement of the heat-conducting structure according to an embodiment of the present disclosure;

[0047] Figure 16 This is a schematic diagram of another arrangement of the heat-conducting structure according to an embodiment of the present disclosure;

[0048] Figure 17 This is a schematic diagram of another arrangement of the heat-conducting structure according to an embodiment of the present disclosure;

[0049] Figure 18 This is a circuit diagram of a first driving circuit according to an embodiment of the present disclosure;

[0050] Figure 19 This is another schematic diagram of a display panel according to an embodiment of the present disclosure;

[0051] Figure 20 This is another partial enlarged view of the display panel according to an embodiment of the present disclosure;

[0052] Figure 21 This is a schematic diagram of the arrangement of sensing components according to an embodiment of the present disclosure;

[0053] Figure 22 This is a schematic diagram showing another arrangement of sensing components according to an embodiment of the present disclosure;

[0054] Figure 23 This is a schematic diagram of a temperature conversion circuit according to an embodiment of the present disclosure;

[0055] Figure 24 This is another schematic diagram of a display panel according to an embodiment of the present disclosure. Detailed Implementation

[0056] To enable those skilled in the art to better understand the technical solutions of this disclosure, the disclosure will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0057] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0058] Figure 1 This is an exemplary display panel 0, which can be applied inside a glass window. See details. Figure 1 The display panel 0 includes a display area DR and a transparent area TR. The display area DR includes at least one sub-pixel d, and each sub-pixel d is arranged in an array on the substrate 1 along a first direction X and a second direction Y, respectively. Each sub-pixel d includes at least one transparent light-emitting device 2. In the exemplary display panel 0, because the transparent area TR is provided and the light-emitting device 2 in the display area DR is a transparent light-emitting device 2, the display panel 0 has high transparency and can be applied inside glass windows.

[0059] Figure 2 yes Figure 1 A cross-sectional schematic diagram of sub-pixel d is shown, as follows: Figure 2 As shown. The exemplary transparent light-emitting device 2 in sub-pixel d is illustrated using a top-emitting organic light-emitting diode (OLED) as an example. See details... Figure 2The transparent light-emitting device 2 includes at least a first electrode 201, a light-emitting layer 202, and a second electrode 203 sequentially disposed in a direction away from the substrate 1. In the exemplary transparent light-emitting device 2, the first electrode 201 can be a reflective anode, and the second electrode 203 can be a transmissive cathode. In the exemplary display panel 0, the reflective anode can be a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, or a stacked structure formed of metal and transparent conductive material, such as ITO / Ag / ITO, Mo / AlNd / ITO, and other reflective materials. The transmission cathode can be any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of metal and transparent conductive material. The light-emitting layer 202 can include small molecule organic materials or polymeric organic materials, or it can be a fluorescent light-emitting material or a phosphorescent light-emitting material. The light-emitting layer 202 can emit red, green, blue, or white light, etc. Furthermore, depending on the specific needs, in different examples, the light-emitting layer 202 can further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.

[0060] Continue to refer to Figure 2 The sub-pixel d may also include a pixel driving circuit 28. In the exemplary display panel 0, since the exemplary display panel 0 is a transparent display panel 0, to ensure the transparency of the transparent display panel 0, the orthogonal projection of the anode on the substrate 1 covers the orthogonal projection of the pixel driving circuit 28 on the substrate 1, and the pixel driving circuit 28 and the anode are electrically connected through interlayer vias. In some exemplary transparent display panels 0, the pixel driving circuit 28 may also be disposed in the opaque region TR outside the sub-pixel d, and electrically connected to the transparent light-emitting device 2 in the sub-pixel d through traces. The pixel driving circuit 28 may be disposed on the buffer layer 5 on the substrate 1. Continuing to refer to... Figure 2 The exemplary sub-pixel d further includes a pixel defining part 3, an interlayer insulating layer 29 disposed between the substrate 1 and the anode, and an encapsulation layer 4, wherein the encapsulation layer 4 includes a first sub-encapsulation layer 401, a second sub-encapsulation layer 402, and a third sub-encapsulation layer 403. The pixel defining part 3 corresponds to a transparent light-emitting device 2 and defines the light-emitting area of ​​the transparent light-emitting device 2. At the same time, in order to ensure the transparency of the transparent display panel 0, the interlayer insulating layer 29 and the encapsulation layer 4 can be highly transparent insulating materials.

[0061] Figure 3 for Figure 2 The circuit diagram shown illustrates the pixel driving circuit 28 in sub-pixel d. This pixel driving circuit 28 may include a 7T1C (i.e., seven transistors and one capacitor) structure, such as a driving transistor T3, a data writing transistor T4, a storage capacitor Cst, a threshold compensation transistor T2, a first reset transistor T1, a second reset transistor T7, a first light-emitting control transistor T5, and a second light-emitting control transistor T6. (Refer to...) Figure 3 The source of data writing transistor T4 is electrically connected to the source of driving transistor T3. The drain of data writing transistor T4 is configured to be electrically connected to data line Vd to receive data signals, and the gate of data writing transistor T4 is configured to be electrically connected to the first scan signal line Ga1 to receive scan signals. The first plate of storage capacitor Cst is electrically connected to the first power supply voltage terminal VDD, and the second plate of storage capacitor Cst is electrically connected to the gate of driving transistor T3. The source of threshold compensation transistor T2 is electrically connected to the drain of driving transistor T3, and the drain of threshold compensation transistor T2 is electrically connected to the gate of driving transistor T3. The gate of threshold compensation transistor T2 is configured to be electrically connected to the second scan signal line Ga2 to receive compensation control signals. The source of first reset transistor T1 is configured to be electrically connected to the first reset power supply terminal Vinit1 to receive the first reset signal, the drain of first reset transistor T1 is electrically connected to the gate of driving transistor T3, and the gate of first reset transistor T1 is configured to be electrically connected to the first reset control signal line Rst1 to receive the first sub-reset control signal. Signals; the source of the second reset transistor T7 is configured to be electrically connected to the first reset power supply terminal Vinit1 to receive the first reset signal, the drain of the second reset transistor T7 is electrically connected to the first electrode 201 of the light-emitting device 2, and the gate of the second reset transistor T7 is configured to be electrically connected to the second reset control signal line Rst2 to receive the second sub-reset control signal; the source of the first light-emitting control transistor T5 is electrically connected to the first power supply voltage terminal VDD, the drain of the first light-emitting control transistor T5 is electrically connected to the source of the driving transistor T3, and the gate of the first light-emitting control transistor T5 is configured to be electrically connected to the first light-emitting control signal line EM1 to receive the first light-emitting control signal; the source of the second light-emitting control transistor T6 is electrically connected to the drain of the driving transistor T3, the drain of the second light-emitting control transistor T6 is electrically connected to the first electrode 201 of the light-emitting device 2, and the gate of the second light-emitting control transistor T6 is configured to be electrically connected to the second light-emitting control signal line EM2 to receive the second light-emitting control signal; the second electrode 203 of the light-emitting device 2 is electrically connected to the second power supply voltage terminal VSS.

[0062] When the exemplary transparent display panel 0 is applied inside a vehicle window, the high temperature inside the window during vehicle operation can easily affect the operation of the electronic components inside the transparent display panel 0. In particular, the transparent light-emitting device 2 inside the transparent display panel 0 is more prone to overheating due to sunlight, resulting in poor display performance. Furthermore, excessively high temperatures inside the window can cause permanent damage to the transparent display panel 0.

[0063] To address the aforementioned issues, this disclosure provides a display panel 0 and a display device.

[0064] Firstly, such as Figure 4 As shown, this disclosure provides a display panel 0, which can be applied to a glass window. The display panel 0 includes: a substrate 1 and a plurality of sub-pixels d disposed on the substrate 1. Each sub-pixel d includes at least a light-emitting device 2, which includes a first electrode 201, a light-emitting layer 202, and a second electrode 203 sequentially disposed along a direction away from the substrate 1. The display panel 0 also includes a heat-conducting structure 7, which is disposed on the side of the first electrode 201 away from the light-emitting layer 202, and the orthogonal projections of the heat-conducting structure 7 and the first electrode 201 on the substrate 1 at least partially overlap.

[0065] In the embodiments disclosed herein, such as Figure 4 As shown, the display panel 0 includes a plurality of sub-pixels d arranged in an array on a substrate 1, each sub-pixel d including at least one light-emitting device 2. The display panel 0 also includes a heat-conducting structure 7 for conducting heat from the light-emitting device 2 to the outside of the display panel 0. Specifically, as shown... Figure 4As shown, the heat-conducting structure 7 is disposed on the side of the first electrode 201 of the light-emitting device 2 facing away from the light-emitting layer 202, and the heat-conducting structure 7 at least partially overlaps with the orthographic projection of the first electrode 201 on the substrate 1. In this way, the heat-conducting structure 7 directly conducts the heat of the light-emitting device 2 to the outside of the display panel 0, avoiding the impact on the operation of the light-emitting device 2 or damage to the light-emitting device 2 when the temperature of the display panel 0 is high. In some embodiments, the heat-conducting structure 7 and the anode of the light-emitting device 2 are attached to each other facing away from the light-emitting layer 202. In this way, the light-emitting device 2 directly transfers heat to the heat-conducting structure 7, and because they are connected by attachment, the contact area between the light-emitting device 2 and the heat-conducting structure 7 is large, and the heat of the light-emitting device 2 is more effectively transferred to the heat-conducting structure 7. In this embodiment, to maximize the heat conduction efficiency of the heat-conducting structure 7, the orthographic projection of the heat-conducting structure 7 on the substrate 1 covers the orthographic projection of the first electrode 201 of the light-emitting device 2 on the substrate 1. It should be noted that the light-emitting device 2 can be an organic light-emitting diode (OLED). In this case, the light-emitting device 2 can be a top-emitting OLED or a bottom-emitting OLED. This embodiment of the present disclosure only uses a top-emitting OLED as an example for illustration. In this case, the first electrode 201 can be an anode, and the second electrode 203 can be a cathode.

[0066] In some embodiments, the display panel 0 further includes a heat dissipation structure 6 disposed away from the heat-conducting structure 7. In this embodiment, the heat-conducting structure 7 is configured, under the control of a first control signal, to conduct heat emitted by the light-emitting device 2 through the heat dissipation structure 6. See details... Figure 5 , Figure 5 This is a schematic diagram of a heat-conducting structure 7 in an embodiment of this disclosure. For example... Figure 5The heat-conducting structure 7 includes a first heat-conducting sheet 12, a second heat-conducting sheet 13, and a semiconductor layer disposed between the first heat-conducting sheet 12 and the second heat-conducting sheet 13. Two different conductive electrodes 16 in the semiconductor layer are respectively connected to a first control signal line 10 and a second control signal line 11, and the first heat-conducting sheet 12 and the second heat-conducting sheet 13 are insulated from the first control signal line 10 and the second control signal line 11, respectively. In this embodiment, the semiconductor layer is disposed on the same layer as the first control signal line 10 and the second control signal line 11. The semiconductor layer also includes a plurality of first semiconductors 14 and second semiconductors 15, which are alternately arranged, with one first semiconductor 14 and one second semiconductor 15 connected in series through a conductive electrode 16. Both the first semiconductor 14 and the second semiconductor 15 are in direct contact with the first heat-conducting sheet 12 and the second heat-conducting sheet 13. In this embodiment, when the signal between the first control signal line 10 and the second control signal line 11 is the first control signal, the semiconductor layer transfers heat from one side of the first heat-conducting sheet 12 to the side of the second heat-conducting sheet 13, so that the temperature of the first heat-conducting sheet 12 is lower than that of the second heat-conducting sheet 13. In this embodiment, the first heat-conducting sheet 12 in the heat-conducting structure 7 faces the anode of the light-emitting device 2, and the second heat-conducting sheet 13 in the heat-conducting structure 7 faces the heat dissipation structure 6 and is connected to the heat dissipation structure 6. Therefore, under the control of the first control signal, the heat-conducting structure 7 can transfer heat from the first heat-conducting sheet 12 side of the heat-conducting structure 7 to the second heat-conducting sheet 13 side of the heat-conducting structure 7, and then transfer it to the outside of the display panel 0 via the heat dissipation structure 6 connected to the second heat-conducting sheet 13. In this way, heat dissipation of the light-emitting device 2 in the display panel 0 is achieved.

[0067] It should be noted that in some embodiments, the heat dissipation structure 6 can be made of copper alloy, with one side connected to the hot end of the heat-conducting structure 7 and the other side connected to a high thermal conductivity material outside the display panel 0. In the embodiments of this disclosure, the material of the heat dissipation structure 6 can be other high thermal conductivity materials, and the high thermal conductivity material outside the display panel 0 can be a metal structure outside the display panel 0; this disclosure does not limit this. Similarly, in some embodiments, the materials of the first semiconductor 14 and the second semiconductor 15 can be ternary solid solution alloys based on bismuth telluride, for example, the first semiconductor 14 can be Bi2Te3-Bi2Se3, and the material of the second semiconductor 15 can be Bi2Te3-Sb2Te3. It should be noted that the embodiments of this disclosure only use the above-mentioned materials of the first semiconductor 14 and the second semiconductor 15 as examples for illustration.

[0068] In some embodiments, Figure 6 This is another display panel 0 according to an embodiment of the present disclosure, such as... Figure 6As shown, the display panel 0 can be a transparent display panel 0. The transparent display panel 0 includes a display area DR and a transparent area TR. The display area DR includes at least one sub-pixel d, and the transparent area TR is a non-light-emitting area. The sub-pixel d includes at least one light-emitting device 2, which can be as follows: Figure 1-3 The light-emitting device 2 shown is an anode, a light-emitting layer 202, and a cathode, all facing away from the substrate 1. In embodiments of this disclosure, a light-emitting device 2 can display any one of the following colors: red (R), green (G), blue (B), or white (W). Figure 6 In the transparent display panel 0 shown, to ensure the transparency of the transparent display panel 0, the area of ​​the transparent area TR is greater than or equal to the area of ​​the display area DR. In some embodiments, the orthographic projections of the heat-conducting structure 7 and the transparent area TR on the substrate 1 do not overlap, thereby further improving the transparency of the transparent display panel 0. It should be noted that... Figure 6 The display panel 0 shown is only an exemplary transparent display panel 0 of this disclosure embodiment, and transparent display panels 0 with other structures are also within the protection scope of this disclosure.

[0069] In this disclosure embodiment, reference continues to be made to Figure 6 Since the heat-conducting structure 7 is located on the side of the anode of the light-emitting device 2 facing away from the light-emitting layer 202, and the heat-conducting structure 7 and the anode of the light-emitting device 2 on the substrate 1 at least partially overlap, and since the anode of the light-emitting device 2 in the display area DR of the transparent display panel 0 can be an opaque structure, this method places the heat-conducting structure 7 between the opaque structure in the display area DR and the substrate 1, without occupying the area of ​​the transparent area TR in the transparent display panel 0. This method neither affects the light transmittance of the transparent display panel 0 nor blocks the light emission of the sub-pixels d in the display area DR, thus not affecting the aperture ratio of the sub-pixels d. This achieves cooling of the transparent display panel 0 without affecting its display effect.

[0070] In some embodiments, Figure 7 As described in this embodiment of the disclosure Figure 6 This is a partially enlarged schematic diagram of the display panel 0 shown. (See attached image.) Figure 7 As shown, the heat-conducting structure 7 and the light-emitting device 2 are arranged in a one-to-one correspondence. The first heat-conducting sheet 12 in the heat-conducting structure 7 is connected to the heat dissipation structure 6, and the second heat-conducting sheet 13 in the heat-conducting structure 7 is directly connected to the anode of the light-emitting device 2. In this embodiment, since the first heat-conducting sheet 12 in the heat-conducting structure 7 is directly connected to the heat dissipation structure 6, and the second heat-conducting sheet 13 in the heat-conducting structure 7 is directly connected to the anode of the light-emitting device 2, the heat-conducting structure 7 is in direct contact with both the light-emitting device 2 and the heat dissipation structure 6, resulting in better heat dissipation. (See attached reference for details.) Figure 8 , Figure 8for Figure 7 The image shows a partial cross-sectional view of display panel 0. (See image for details.) Figure 8 As shown in this embodiment, the second heat sink 13 in the heat-conducting structure 7 is directly attached to the heat dissipation structure 6, and the first heat sink 12 in the heat-conducting structure 7 is directly attached to the anode of the light-emitting device 2. In this way, the light-emitting device 2 directly transfers heat to the heat-conducting structure 7. Because they are connected by attachment, the contact area between the light-emitting device 2 and the heat-conducting structure 7 is large, and the heat from the light-emitting device 2 is transferred to the heat-conducting structure 7 more effectively. In this embodiment, to further improve the thermal conductivity of the heat-conducting structure 7, the orthogonal projection of the heat-conducting structure 7 on the substrate 1 covers the orthogonal projection of the anode of the light-emitting device 2 on the substrate 1, and the orthogonal projection of the heat dissipation structure 6 on the substrate 1 covers the orthogonal projection of the heat-conducting structure 7 on the substrate 1. This maximizes the contact area, thereby further improving the thermal conductivity of the heat-conducting structure 7.

[0071] In some embodiments, such as Figure 9 As shown, Figure 9 for Figure 7 Another partial cross-sectional view of the display panel 0 shown. The second heat-conducting sheet 13 in the heat-conducting structure 7 is connected to the heat dissipation structure 6, and an insulating heat-conducting layer 8 is disposed directly between the first heat-conducting sheet 12 in the heat-conducting structure 7 and the anode of the light-emitting device 2. In this embodiment, since the second heat-conducting sheet 13 in the heat-conducting structure 7 is directly connected to the heat dissipation structure 6, and the first heat-conducting sheet 12 in the heat-conducting structure 7 and the anode of the light-emitting device 2 are connected through an insulating heat-conducting layer 8, the heat-conducting structure 7 and the light-emitting device 2 only transfer heat through an insulating heat-conducting layer 8, resulting in better heat dissipation. In this embodiment, as... Figure 9 As shown, the second heat-conducting sheet 13 in the heat-conducting structure 7 is directly attached to the heat dissipation structure 6, and the first heat-conducting sheet 12 in the heat-conducting structure 7 is attached to one side of the insulating heat-conducting layer 8, while the other side of the insulating heat-conducting layer 8 is directly attached to the anode of the light-emitting device 2. Because they are connected by attachment, the contact area between the light-emitting device 2 and the heat-conducting structure 7 is large, and the heat from the light-emitting device 2 is transferred to the heat-conducting structure 7 more effectively. In this embodiment, to maximize the thermal conductivity of the heat-conducting structure 7, the orthogonal projection of the heat-conducting structure 7 on the substrate 1 covers the orthogonal projection of the anode of the light-emitting device 2, and the orthogonal projection of the heat dissipation structure 6 on the substrate 1 covers the orthogonal projection of the heat-conducting structure 7 on the substrate 1. This maximizes the contact area, thereby further improving the thermal conductivity of the heat-conducting structure 7.

[0072] Meanwhile, the insulating and thermally conductive layer 8 can electrically insulate the anode of the light-emitting device 2 from the first thermally conductive sheet 12 in the thermally conductive structure 7, preventing the thermally conductive structure 7 from affecting the electrical signal of the anode of the light-emitting device 2. In this embodiment, since the thermally conductive structure 7 avoids affecting the electrical signal of the anode of the light-emitting device 2, one thermally conductive structure 7 can be set to correspond to multiple light-emitting devices 2, that is, one thermally conductive structure 7 can dissipate heat for multiple light-emitting devices 2. Figure 10 As shown, in some embodiments, the display panel 0 is divided into multiple pixel units D, each pixel unit D includes multiple sub-pixels d, and at least a portion of the heat-conducting structures 7 corresponding to each pixel unit D is an integral structure.

[0073] Continue to refer to Figure 10 The display panel 0 includes a substrate 1 and a plurality of pixel units D disposed on the display substrate. Each pixel unit D includes at least one sub-pixel d, and each sub-pixel d includes at least one light-emitting device 2. See details. Figure 11 , Figure 11 yes Figure 10 A partial enlarged view of the display panel 0 shown, such as Figure 11 As shown, a pixel unit D comprising four sub-pixels d, with each sub-pixel d displaying red (R), green (G), blue (B), and white (W) respectively, is used as an example. The sub-pixels d in each pixel unit D are distributed within the display area DR of the display panel 0, and each sub-pixel d is arranged in an array along the first direction X and the second direction Y within the pixel unit D. It should be noted that sub-pixels d in pixel unit D including sub-pixels d of other colors, and sub-pixels d in pixel unit D arranged in other ways, are all within the scope of this disclosure.

[0074] Continue to refer to Figure 11 Since one pixel unit D in this embodiment includes four sub-pixels d, one pixel unit D corresponds to four heat-conducting structures 7. For example, Figure 11As shown, the four heat-conducting structures 7 are combined in pairs to form a first heat-conducting structure 9, meaning that one pixel unit D essentially corresponds to only two first heat-conducting structures 9. In this embodiment, the second heat-conducting sheet 13 in the first heat-conducting structure 9 is connected to its corresponding heat dissipation structure 6, and an insulating heat-conducting layer 8 is directly disposed between the first heat-conducting sheet 12 in the first heat-conducting structure 9 and the anode of the light-emitting device 2. In this embodiment, since the second heat-conducting sheet 13 in the first heat-conducting structure 9 is directly connected to the heat dissipation structure 6, and the first heat-conducting sheet in the first heat-conducting structure 9 and the anode of the light-emitting device 2 are connected through an insulating heat-conducting layer 8, the heat-conducting structure 7 and the light-emitting device 2 transfer heat only through an insulating heat-conducting layer 8, resulting in better heat dissipation. Simultaneously, due to the insulating heat-conducting layer 8, the anodes of different light-emitting devices 2 corresponding to the same first heat-conducting structure 9 will not be electrically connected to each other through the first heat-conducting structure 9, thus affecting the display of the display panel 0.

[0075] In some embodiments, the second heat-conducting sheet 13 in the first heat-conducting structure 9 and its corresponding heat-conducting structure 7 are directly attached to each other. The first heat-conducting sheet 12 in the first heat-conducting structure 9 is attached to one side of the insulating heat-conducting layer 8, and the other side of the insulating heat-conducting layer 8 is directly attached to the anode of the light-emitting device 2. In this way, the light-emitting device 2 directly transfers heat to the first heat-conducting structure 9 through the insulating heat-conducting layer 8. Since they are connected by attachment, the contact area between the light-emitting device 2 and the first heat-conducting structure 9 is large, and the heat of the light-emitting device 2 is more effectively transferred to the first heat-conducting structure 9. It should also be noted that since one pixel unit D in this embodiment includes four sub-pixels d, this embodiment only uses one pixel unit D corresponding to four heat-conducting structures 7 as an example, with the four heat-conducting structures 7 combined in pairs to form the first heat-conducting structure 9. In some embodiments, three of the four heat-conducting structures 7 are combined into a single first heat-conducting structure 9; the four heat-conducting structures 7 combined into a single first heat-conducting structure 9 are also within the protection scope of this disclosure.

[0076] In some embodiments, such as Figure 4-11 In the display panel 0 shown, both the thermally conductive structure 7 and the heat dissipation structure 6 are disposed on the side of the substrate 1 near the anode of the light-emitting device 2. In this embodiment, the thermally conductive structure 7 and the heat dissipation structure 6 can be disposed in the film layer structure of the display panel 0 during fabrication. This method allows for higher integration of the display panel 0 with the thermally conductive structure 7, facilitating a thinner and lighter design. Simultaneously, it makes it easier to determine the positional relationship between the thermally conductive structure 7 and the anode of the light-emitting device 2, making it easier to ensure that the orthogonal projections of the thermally conductive structure 7 and the anode of the light-emitting device 2 on the substrate 1 at least partially overlap during fabrication, thereby improving the yield of the transparent display panel 0.

[0077] Similarly, in some embodiments, such as Figure 12 As shown, the heat-conducting structure 7 can also be disposed on the side facing away from the substrate 1. In this case, as... Figure 12 As shown, the first heat-conducting plate 12 in the heat-conducting structure 7 is connected to the substrate 1, and the second heat-conducting plate 13 in the heat-conducting structure 7 is connected to the heat dissipation structure 6. This method facilitates the installation of the heat-conducting structure 7.

[0078] Meanwhile, in this embodiment, the first heat-conducting sheet 12 in the heat-conducting structure 7 can also be directly attached to the substrate 1, and the second heat-conducting sheet 13 in the heat-conducting structure 7 can be directly attached to the heat dissipation structure 6. In this way, because they are connected by attachment, the contact area between the transparent display panel 0 and the heat-conducting structure 7 is large, and the heat of the light-emitting device 2 is more effectively transferred to the heat-conducting structure 7.

[0079] In this embodiment, after the display substrate with the light-emitting device 2 is fabricated, a thin film including a thermally conductive structure 7 can be attached to the side facing away from the substrate 1 by means of an attachment method, such that the thermally conductive structure 7 and the orthogonal projection of the anode of the light-emitting device 2 on the substrate 1 at least partially overlap. In this way, the temperature of the display panel 0 can be reduced without adjusting the fabrication process of the display panel 0, without affecting the light transmittance of the display panel 0.

[0080] In some embodiments, the transparent display panel 0 may also have a heat-conducting structure 7 disposed on the side of the substrate 1 near the anode of the light-emitting device 2, and a heat dissipation structure 6 disposed on the side of the substrate 1 away from the anode of the light-emitting device 2. In this embodiment, the first heat-conducting sheet 12 in the heat-conducting structure 7 is connected to the anode of the light-emitting device 2, and the second heat-conducting sheet 13 in the heat-conducting structure 7 is connected to the heat dissipation structure 6.

[0081] In some embodiments, the display panel 0 further includes a plurality of first display signal lines, the first control signal line 10 and the second control signal line 11 respectively overlap with the orthographic projection of the first display signal line on the substrate 1, and the orthographic projections of the first control signal line 10 and the second control signal line 11 on the substrate 1 do not overlap. In embodiments of this disclosure, when the display panel 0 is as follows... Figure 4-12In the transparent display panel 0 shown, the first control signal line 10 and the second control signal line 11 used to control the operation of the heat conduction structure 7 can be designed to overlap with the first display signal line on the display substrate on the substrate 1 via orthographic projection, respectively. This avoids the addition of the first control signal line 10 and the second control signal line 11, which would affect the light transmittance and pixel aperture ratio of the transparent display panel 0. Specifically, since the existing first control signal line 10 on the transparent display panel 0 can be an opaque structure, this method of placing the first control signal line 10 and the second control signal line 11 between the opaque structure of the display panel 0 and the substrate 1 will not occupy a large area of ​​the light-transmitting region in the transparent display panel 0. This will not affect the light transmittance of the transparent display panel 0, nor will it block the light emission of the sub-pixels d in the display area DR, thus affecting the pixel aperture ratio. It should be noted that the first display signal line can be any type of signal line on the display panel 0 used to drive the sub-pixels d to display the image, such as a gate signal line, a data signal line, or a power signal line. This disclosure does not limit this.

[0082] In some embodiments, such as Figure 13 As shown, Figure 13 This is an exemplary arrangement of the heat-conducting structure 7 in the display panel 0. In this embodiment, the heat-conducting structure 7 is arranged in an array on the side of the substrate 1 near the first electrode 201, and the first control signal line 10 and the second control signal line 11 connected to the same heat-conducting structure 7 are located on opposite sides of the heat-conducting structure 7. This arrangement makes the signal line wiring on the display panel 0 more uniform, while avoiding interference between the first control signal line 10 and the second control signal line 11 and the signal lines on the display panel 0.

[0083] In some embodiments, such as Figure 14 As shown, Figure 14 This is another exemplary arrangement of the heat-conducting structure 7 in the display panel 0. It includes multiple heat-conducting structures 7 arranged sequentially along a column direction. Heat-conducting structures 7 located in the same column are connected to the same first control signal line 10 and the same second control signal line 11. For example... Figure 15-17 As shown, each column of heat-conducting structures 7 is divided into multiple heat-conducting structure groups 24, and the heat-conducting structures 7 in different groups are different. The first control signal line 10 connected to each heat-conducting structure 7 in a heat-conducting structure group 24 is short-circuited, and the second control signal line 11 connected to each heat-conducting structure 7 in a heat-conducting structure group 24 is short-circuited.

[0084] Specifically, refer to Figure 15In this embodiment, the heat-conducting structure 7 is divided into multiple heat-conducting structure groups 24 according to its column direction, and the heat-conducting structures 7 in different groups are different. Each heat-conducting structure 7 within the same heat-conducting structure group 24 is connected to the same first control signal line 10 and the same second control signal line 11. By driving the heat-conducting structures 7 in groups in this way, on the one hand, compared to each heat-conducting structure 7 being connected to a separate first control signal line 10 and second control signal line 11, the number of first control signal lines 10 and second control signal lines 11 required in this embodiment is greatly reduced, and the driving circuit for driving the first control signal lines 10 and second control signal lines 11 is greatly simplified. On the other hand, different driving voltages can be applied to different heat-conducting structure groups 24 to achieve better heat dissipation of the display panel 0.

[0085] In some embodiments, refer to Figure 16 , Figure 16 This is another grouping method in this embodiment. Each column of heat-conducting structures 7 is divided into three heat-conducting structure groups 24. The heat-conducting structures 7 in each group are different, and every three columns of heat-conducting structures 7 are located sequentially within three different heat-conducting structure groups 24. Specifically, in this embodiment, each column of heat-conducting structures 7 is divided into a first heat-conducting structure group 25, a second heat-conducting structure group 26, and a third heat-conducting structure group 27. The display panel 0 includes N columns of heat-conducting structures 7, and each column of heat-conducting structures 7 is arranged sequentially along the row direction. Since every three columns of heat-conducting structures 7 are located sequentially within three different heat-conducting structure groups 24, the first heat-conducting structure group 25 includes the heat-conducting structures 7 in columns 1, 4, 7…N-2; the second heat-conducting structure group 26 includes the heat-conducting structures 7 in columns 2, 5, 8…N-1; and the third heat-conducting structure group 27 includes the heat-conducting structures 7 in columns 3, 6, 9…N. Therefore, the heat-conducting structure 7 in the display panel 0 only requires three first control signals to drive all the heat-conducting structures 7 on the display panel 0. At the same time, the heat dissipation effect of the heat-conducting structure 7 with this group driving method is better.

[0086] In some embodiments, such as Figure 17 As shown, Figure 17 This is another grouping method in an embodiment of the present disclosure. The heat-conducting structure 7 is divided into multiple heat-conducting structure groups 24 arranged in an array. The first control signal lines 10 connected to each heat-conducting structure 7 in a heat-conducting structure group 24 are short-circuited, and the second control signal lines 11 connected to each heat-conducting structure 7 in a heat-conducting structure group 24 are short-circuited. In this embodiment of the present disclosure, please refer to... Figure 17As shown. In this way, on the one hand, compared to each heat-conducting structure 7 being connected to a separate first control signal line 10 and second control signal line 11, the number of first control signal lines 10 and second control signal lines 11 required in this embodiment is greatly reduced. Simultaneously, the driving circuits for driving the first control signal lines 10 and second control signal lines 11 are greatly simplified. On the other hand, different driving voltages can be applied to heat-conducting structure groups 24 in different areas, resulting in better heat dissipation of the display panel 0.

[0087] In some embodiments, the display panel 0 further includes a first driving circuit 17. The first driving circuit 17 is configured to provide a first control signal to the heat-conducting structure 7 based on the temperature of the display panel 0. In some embodiments, the first driving circuit 17 may be a switching power supply circuit or other DC driving circuit; this disclosure describes the first driving circuit 17 as a switching power supply circuit. Specifically, as shown... Figure 18 As shown, Figure 18 This is an exemplary switching power supply circuit, comprising: a first power control terminal K1, a second power control terminal K2, a signal output terminal Vout, a driver sub-circuit, and peripheral circuitry of the driver sub-circuit. In this embodiment, the driver sub-circuit may be a switching power supply chip LM5145. When the first driving circuit 17 operates, power control signals are written to the first power control terminal K1 and the second power control terminal K2. The switching power supply chip LM5145 outputs a corresponding first control signal to the signal output terminal Vout based on the power control signals written to the first power control terminal K1 and the second power control terminal K2. In this embodiment, the first power control terminal K1 and the second power control terminal K2 may be connected to a first controller 18, so that the first driving circuit 17 can output an adjustable first control signal according to changes in the power control signal output by the first controller 18. This allows the heat-conducting structure 7 to be programmed with an adjustable first control signal, meaning the heat conduction capability of the heat-conducting structure 7 can change according to the changes in the first control signal. In this way, the heat-conducting structure 7 can adjust its heat conduction capability according to actual needs.

[0088] It should be noted that in this embodiment, only the LM5145 switching power supply chip is used as an example for the driving sub-circuit; driving sub-circuits using other chips are also within the scope of this disclosure. Similarly, Figure 18 The first driving circuit 17 shown may also include multiple power control terminals and signal output terminals Vout. This disclosure only uses the example of the first driving circuit 17 including a first power control terminal K1, a second power control terminal K2 and a signal output terminal Vout for illustration. The first driving circuit 17 may also include multiple power control terminals and multiple signal output terminals Vout, which are also within the protection scope of this application.

[0089] In some embodiments, such as Figure 19 and Figure 20 As shown, the display panel 0 also includes a temperature sensing component 20 and a first controller 18. The temperature sensing component 20 is disposed on the side of the first electrode 201 opposite to the light-emitting layer 202, and the orthographic projections of the temperature sensing component 20 and the first electrode 201 on the substrate 1 at least partially overlap. The temperature sensing component 20 is configured to generate a first sensing signal based on the temperature of the display panel 0. The first controller 18 is configured to control the operation of the heat-conducting structure 7 based on the first sensing signal.

[0090] In this embodiment, the temperature sensing component 20 is disposed on the side of the anode of the light-emitting device 2 facing away from the light-emitting layer 202, and the orthogonal projections of the temperature sensing component 20 and the anode of the light-emitting device 2 on the substrate 1 at least partially overlap. Therefore, when the display panel 0 is a transparent display panel 0, since the anode of the light-emitting device 2 in the transparent display panel 0 can be an opaque structure, the heat dissipation component is disposed between the opaque structure of the display panel 0 and the substrate 1 in this way. This does not occupy a large area of ​​the light-transmitting region in the transparent display panel 0, and neither affects the light transmittance of the transparent display panel 0 nor blocks the light emission of the sub-pixel d in the display area DR, thus affecting the aperture ratio of the sub-pixel d. This achieves the cooling of the display panel 0 by controlling the heat-conducting structure 7 through the temperature sensing component 20 and the first controller 18 without affecting the display effect of the transparent display panel 0.

[0091] Specifically, the temperature sensing component 20 can generate a first sensing signal based on the temperature of the display panel 0. The first controller 18 can receive and process the first sensing signal through an analog-to-digital converter sub-circuit. In some embodiments, when the first controller 18 determines that the temperature on the display panel 0 exceeds a preset value based on the first sensing signal, i.e., when it determines that the temperature of the display panel 0 is too high, the first controller 18 outputs a first control signal to control the heat dissipation component on the display panel 0 to dissipate heat from the light-emitting device 2 on the display panel 0, thereby cooling the display panel 0 and preventing it from being damaged due to excessively high temperature.

[0092] In some embodiments, the number of temperature sensing components 20 on the display panel 0 can be one or more. See details... Figure 21 When there is only one temperature sensing component 20, since the temperature is highest in the central area of ​​the display panel 0, placing the temperature sensing component 20 in the central area of ​​the display panel 0 allows for a more accurate determination of whether the light-emitting device 2 in the display panel 0 needs heat dissipation, thus making the temperature sensing of the display panel 0 more accurate. When there are multiple temperature sensing components 20, such as... Figure 22As shown, the temperature sensing components 20 can be evenly arranged on the display panel 0. In this way, multiple first sensing signals can be generated based on the temperature of different areas of the display panel 0. In this embodiment, the first controller 18 can process the multiple first sensing signals using a preset temperature control algorithm to make the temperature sensing of the display panel 0 more accurate.

[0093] In some embodiments, the display panel 0 further includes a temperature conversion circuit 23. The temperature conversion circuit 23 is configured to convert the first sensing signal into an electrical signal and transmit it to the first controller 18. In this embodiment, temperature sensing on the display panel 0 can be achieved by using only a relatively simple temperature sensing component 20. This makes the display panel 0 simple in structure, easy to implement, and conducive to a thinner and lighter design.

[0094] Specific examples Figure 23 As shown, Figure 23 This is an exemplary temperature conversion circuit 23. In some embodiments, the temperature sensing component 20 includes at least one of a thermistor or a thermocouple. Figure 21-23 The temperature conversion circuit 23 shown is illustrated using only the temperature sensing component 20 as an example of a thermistor. For details, please refer to... Figure 21-23 A thermistor is disposed on the display panel 0, and one end of a first sensing signal line 21 and one end of a second sensing signal line 22 are respectively connected to it. The other ends of the first sensing signal line 21 and the second sensing signal line 22 are respectively connected to the temperature conversion circuit 23. In this way, the temperature conversion circuit 23 and the thermistor can be arranged inside and outside the display panel 0, respectively. When the display panel 0 is a transparent display panel 0, this helps to improve the transparency of the display panel 0. In the embodiments of this disclosure, reference continues to be made to... Figure 17 The temperature conversion circuit 23 further includes a first operational sub-circuit 231, a second operational sub-circuit 232, and multiple resistors. The resistance of the thermistor changes with temperature; therefore, the electrical signal on the thermistor changes with the resistance. The first operational sub-circuit 231 and the second operational sub-circuit 232 calculate and amplify the electrical signal on the thermistor, and output it to the first controller 18 through the output terminal of the temperature conversion circuit 23. It should be noted that the first and second operational sub-circuits in this embodiment can be operational amplifiers. Furthermore, this embodiment only uses... Figure 23 The temperature conversion circuit 23 shown is used as an example for illustration. Other circuits that perform temperature / voltage conversion through thermistors are all within the protection scope of this application.

[0095] In some embodiments, the display panel 0 further includes a plurality of second display signal lines, wherein the first sensing signal line 21 and the second sensing signal line 22 overlap with the orthographic projection of the second display signal line on the substrate 1, and the orthographic projections of the first sensing signal line 21 and the second sensing signal line 22 on the substrate 1 do not overlap. In embodiments of this disclosure, when the display panel 0 is a transparent display panel 0, the first sensing signal line 21 and the second sensing signal line 22 connected to the thermistor can be designed to overlap with the orthographic projection of the second display signal line on the display panel 0 on the substrate 1, respectively, to avoid the addition of the first sensing signal line 21 and the second sensing signal line 22 affecting the light transmittance and pixel aperture ratio of the transparent display panel 0. Specifically, since the existing first control signal line 10 on the transparent display panel 0 can be an opaque structure, by placing the first sensing signal line 21 and the second sensing signal line 22 between the opaque structure of the display panel 0 and the substrate 1 in this way, the area of ​​the light-transmitting region in the transparent display panel 0 will not be significantly occupied. This will not affect the light transmittance of the transparent display panel 0, nor will it obstruct the emission of sub-pixels d within the display area DR. It should be noted that in some embodiments, the aforementioned first display signal line and second display signal line can be the same display signal line or the same type of display signal line; this disclosure does not limit this aspect.

[0096] In some embodiments, the first controller 18 can be disposed outside the display panel 0. Especially when the display panel 0 is applied to a glass window, the first controller 18 can be disposed on a SOC (System on a Chip) board outside the display panel 0. This method can further increase the area of ​​the transparent region TR of the transparent display panel 0. Simultaneously, when the display panel 0 is applied to a glass window, the first controller 18 can also control an external cooling system to cool the display panel 0 based on its temperature. The external cooling system can be an air conditioning system or other cooling system.

[0097] In some embodiments, the display panel 0 may further include a second controller 19. For example... Figure 24As shown, the second controller 19 is configured to control the sub-pixel d in the display panel 0 to emit light according to the first sensing signal. In this embodiment of the present disclosure, the second controller 19 controls the light emission of each pixel according to the image to be displayed. Since the first sensing signal generated by the temperature sensing component 20 based on the temperature of the display panel 0 can be converted into temperature information of the display panel 0, when the temperature of the display panel 0 is too high, the second controller 19 can reduce the power of the sub-pixel d in the display panel 0 according to the first sensing signal to reduce the heat generated by the sub-pixel d; or, it can also control the sub-pixel d to display a prompt image to remind relevant personnel to cool down the display panel 0. It should be noted that in some embodiments, the first controller 18 and the second controller 19 can be integrated on the same SOC.

[0098] Secondly, this disclosure also provides a display device, which includes the display panel 0 provided in the preceding embodiments.

[0099] The display device provided in this disclosure can be any product or component with display function, such as a display panel, flexible wearable device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the invention.

[0100] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display panel, comprising at least a display area; the display panel comprising a substrate, a plurality of sub-pixels disposed on the substrate, each sub-pixel comprising at least a light-emitting device, the light-emitting device being located in the display area; the light-emitting device comprising a first electrode, a light-emitting layer, and a second electrode sequentially disposed along a direction away from the substrate; wherein, The display panel further includes a heat-conducting structure, which is disposed on the side of the first electrode away from the light-emitting layer, and the heat-conducting structure and the orthogonal projection of the first electrode on the substrate at least partially overlap; It also includes multiple first control signal lines and multiple second control signal lines; one of the heat-conducting structures is electrically connected to one first control signal line and one second control signal line; The display panel further includes multiple first display signal lines, the first control signal lines and the second control signal lines respectively overlap with the orthographic projection of the first display signal lines on the substrate, and the orthographic projections of the first control signal lines and the second control signal lines on the substrate do not overlap. The display panel is a transparent display panel; the display panel also includes a transparent area; The first display signal line is an opaque structure, and the first control signal line and the second control signal line are disposed between the opaque structure of the display panel and the substrate.

2. The display panel according to claim 1, wherein, The heat-conducting structure and the light-emitting device are configured in a one-to-one correspondence.

3. The display panel according to claim 1 or 2, wherein, It also includes a heat dissipation structure disposed on the side of the heat-conducting structure opposite to the first electrode.

4. The display panel according to claim 3, wherein, The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; the first heat-conducting sheet is connected to the first electrode of the light-emitting device, and the second heat-conducting sheet is connected to the heat dissipation structure.

5. The display panel according to claim 3, wherein, The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; an insulating heat-conducting layer is provided between the first heat-conducting sheet and the first electrode of the light-emitting device, and the second heat-conducting sheet is connected to the heat dissipation structure.

6. The display panel according to claim 5, wherein, The display panel is divided into multiple pixel units, and each pixel unit includes multiple sub-pixels; at least a portion of the heat-conducting structures corresponding to each pixel unit is an integral structure.

7. The display panel according to any one of claims 4-6, wherein, Both the heat-conducting structure and the heat-dissipating structure are disposed on the side of the substrate near the first electrode.

8. The display panel according to any one of claims 4-6, wherein, The thermally conductive structure is disposed on the side of the substrate close to the first electrode; the heat dissipation structure is disposed on the side of the substrate away from the first electrode.

9. The display panel according to claim 3, wherein, The heat dissipation structure is made of copper alloy.

10. The display panel according to claim 1, wherein, The thermally conductive structure is disposed on the side away from the substrate.

11. The display panel according to claim 1, wherein, The heat-conducting structure includes a first heat-conducting sheet, a semiconductor layer, and a second heat-conducting sheet arranged sequentially away from the direction of the light-emitting layer; the first control signal line and the second control signal line are electrically connected to the semiconductor layer and are arranged in the same layer as the semiconductor layer.

12. The display panel according to claim 1, wherein, The thermal conductive structures are arranged in an array on the side of the substrate near the first electrode, and the first control signal line and the second control signal line connected to the same thermal conductive structure are located on opposite sides of the thermal conductive structure.

13. The display panel according to claim 1, wherein, It includes multiple heat-conducting structures arranged sequentially along the column direction; the heat-conducting structures located in the same column are connected to the same first control signal line and the same second control signal line; Each column of heat-conducting structures is divided into multiple heat-conducting structure groups, and the heat-conducting structures in different heat-conducting structure groups are different. The first control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted, and the second control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted.

14. The display panel according to claim 13, wherein, Each column of heat-conducting structures is divided into three groups of heat-conducting structures, and the heat-conducting structures in different groups are different. Each set of three columns of the heat-conducting structures is located sequentially within three different groups of the heat-conducting structures.

15. The display panel according to claim 1, wherein, The heat-conducting structure is divided into multiple heat-conducting structure groups arranged in an array; The first control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted, and the second control signal lines connected to each of the heat-conducting structures in a heat-conducting structure group are shorted.

16. The display panel according to claim 3, wherein, It also includes: a first driving circuit; the first driving circuit and the heat-conducting structure are electrically connected; The first driving circuit is configured to provide the first control signal to the heat-conducting structure according to the temperature of the display panel; The heat-conducting structure is configured to dissipate heat from the light-emitting device under the control of the first control signal.

17. The display panel according to claim 1, wherein, Also includes: Temperature sensing component and first controller; The temperature sensing component is disposed on the side of the first electrode away from the light-emitting layer, and the orthographic projections of the temperature sensing component and the first electrode on the substrate at least partially overlap. The temperature sensing component is configured to generate a first sensing signal based on the temperature of the display panel; The first controller is configured to control the operation of the heat-conducting structure based on the first sensing signal.

18. The display panel according to claim 17, wherein, It also includes at least one first sensing signal line and at least one second sensing signal line; the first sensing signal line and the second sensing signal line will be connected to the temperature sensing component respectively.

19. The display panel according to claim 18, wherein, It also includes multiple second display signal lines; the first sensing signal line and the second sensing signal line respectively overlap with the orthographic projection of the second display signal line on the substrate, and the orthographic projections of the first sensing signal line and the second sensing signal line on the substrate do not overlap.

20. The display panel according to claim 17, wherein, Also includes: Temperature conversion circuit; The temperature conversion circuit is configured to convert the first sensing signal into an electrical signal and transmit it to the first controller.

21. The display panel according to any one of claims 17-20, wherein, The temperature sensing component includes at least one of a thermistor or a thermocouple.

22. The display panel according to claim 1, wherein, The orthographic projection of the thermally conductive structure onto the substrate does not overlap with the transparent area.

23. A display device comprising a display panel as claimed in any one of claims 1-22.

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