Laser processing machine

Abstract

Provided are: a laser processing unit that irradiates a laser beam to a processed material to perform laser processing on the processed material; a control unit that controls the laser processing unit in accordance with a processing condition for processing the processed material; a light detection unit that detects light from a processed portion of the processed material that has been irradiated with the laser beam; and a processing determination unit that is connected to the light detection unit. The control unit controls the laser processing unit by performing a product processing mode that processes the processed material as a product and a preliminary processing mode that performs preliminary processing on the processed material before the product processing. The light detection unit is capable of detecting a light intensity distribution of a predetermined wavelength band of light. The processing determination unit determines whether or not the processed material can be processed (processability) based on the light intensity distribution detected by the light detection unit at the time of the preliminary processing.

Description

Technical Field

[0001] This invention relates to laser processing machines. Background Technology

[0002] When processing materials, laser processing machines invoke pre-set processing conditions based on the material's composition, thickness, and processing method. Even with the same type of material, there are individual differences between manufacturers, and even within the same manufacturer, there are batch-to-batch variations. Therefore, even with the same type of material, there are situations where normal processing cannot be performed under the pre-set conditions of the laser processing machine.

[0003] Therefore, a laser processing machine is known that uses a beam splitter installed on the laser processing head to detect the light level of a specific wavelength band of the returned light generated during laser processing, and compares the detected level with a preset threshold to monitor the processing state of the laser processing (see Patent Document 1). Additionally, a method is known that detects the processing light generated from the workpiece during laser processing in a first wavelength range (Δλ1) with bright lines and a second wavelength range (Δλ2) without bright lines, thereby monitoring the laser cutting processing state (see Patent Document 2).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 6725572

[0007] Patent Document 2: Description of European Patent No. 3455028 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] However, while the aforementioned laser processing machines monitor the processing status of the material during product processing, they cannot determine the machinability of the material before processing. That is, to determine whether a material can be processed, a single product processing operation or various test processing methods must be performed on the material. In this case, the processed material is wasted.

[0010] One aspect of the present invention is a laser processing machine that can determine before product processing whether the material to be processed can be processed based on laser processing.

[0011] Methods for solving problems

[0012] One aspect of the laser processing machine of the present invention includes: a laser processing unit that irradiates a workpiece with a laser beam to perform laser processing on the workpiece; a control unit that controls the laser processing unit according to processing conditions for processing the workpiece; a light detection unit that detects light from the processing unit on the workpiece irradiated with the laser beam; and a processing determination unit connected to the light detection unit. The control unit controls the laser processing unit through a product processing mode for processing the workpiece and a pre-processing mode for pre-processing the workpiece prior to product processing. The light detection unit is capable of detecting the light intensity distribution of a predetermined wavelength band. The processing determination unit determines whether the workpiece can be processed based on the light intensity distribution detected by the light detection unit during pre-processing.

[0013] According to one aspect of the laser processing machine of the present invention, the control unit performs pre-processing of the material to be processed in a pre-processing mode prior to product processing, and the processing determination unit determines whether the material to be processed can be processed based on the light intensity distribution detected by the light detection unit during the pre-processing. Therefore, it is possible to know whether the material to be processed can be processed before product processing.

[0014] Invention Effects

[0015] According to one aspect of the laser processing machine of the present invention, it is possible to know whether the material can be processed based on laser processing before product processing. Attached Figure Description

[0016] Figure 1 This is an explanatory diagram showing the basic structure of a laser processing machine according to an embodiment of the present invention.

[0017] Figure 2 This is an explanatory diagram showing the schematic structure of the laser processing machine according to this embodiment.

[0018] Figure 3 This is a block diagram that roughly represents the functional structure of the laser processing machine according to this embodiment.

[0019] Figure 4 This is a diagram illustrating the pre-processing steps of this embodiment.

[0020] Figure 5 It is a diagram used to illustrate the data detected by the optical detection unit during scribing.

[0021] Figure 6 This is a diagram used to illustrate the data detected by the optical detection unit during the piercing process.

[0022] Figure 7This is a diagram showing the confusion matrix used to explain the determination results during scribing processing based on the processing determination unit 60.

[0023] Figure 8 This is a diagram showing the confusion matrix used to explain the determination results during piercing processing based on the processing determination unit 60.

[0024] Figure 9 This is a flowchart illustrating an example of a laser processing method using the laser processing machine of this embodiment. Detailed Implementation

[0025] The preferred embodiments for carrying out the present invention will now be described with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the invention to the various technical solutions for which patents are claimed, and the combination of features described in the embodiments is not limited to those necessary for the solution of the invention.

[0026] [The overall structure of the laser processing machine in this embodiment]

[0027] Figure 1 This is an explanatory diagram showing the basic structure of a laser processing machine according to an embodiment of the present invention. Figure 2 This is an explanatory diagram showing the schematic structure of the laser processing machine according to this embodiment.

[0028] like Figure 1 and Figure 2 As shown, the laser processing machine 100 of this embodiment basically includes: a laser processing unit 1, which irradiates a laser beam L onto a workpiece W to perform laser processing on the workpiece W; a control unit 54, which controls the laser processing unit 1 according to the processing conditions for processing the workpiece W; a light detection unit 40, which detects the luminous phenomenon of light BR' from the processing section SP of the workpiece W irradiated with the laser beam L; and a processing determination unit 60, which is connected to the light detection unit 40. The control unit 54 controls the laser processing unit 1 through a product processing mode for processing the workpiece W into a product and a pre-processing mode for pre-processing the workpiece W before product processing. The light detection unit 40 is capable of detecting the light intensity distribution of a predetermined wavelength band of light BR'. The processing determination unit 60 determines whether the workpiece W can be processed (processability) based on the light intensity distribution detected by the light detection unit 40 during pre-processing.

[0029] like Figure 2As shown, specifically, the laser processing machine 100 includes a laser processing unit 1, a photodetector 40, and an NC (Numerical Control) device 50. The laser processing unit 1 includes a laser oscillator 10, a laser processing head 20, a processing table 30, an auxiliary gas supply device 70, and a drive mechanism (not shown). The drive mechanism (not shown) drives at least one of the laser processing head 20 and the processing table 30.

[0030] The laser oscillator 10 is controlled by the NC device 50 to generate a laser beam L, which is supplied to the laser processing head 20 via the process fiber 11. For example, the laser oscillator 10 is preferably a type that excites a Yb (Ytterbium) laser in a resonator using seed light emitted from a laser diode and amplifies it to emit a laser beam L of a predetermined wavelength, or a type that directly utilizes the laser beam L emitted from a laser diode. Examples of solid-state laser oscillators for the laser oscillator 10 include fiber laser oscillators, YAG (Yttrium Aluminum Garnet) laser oscillators, disk laser oscillators, and DDL (Direct Diode Laser) oscillators.

[0031] The laser oscillator 10 emits, for example, a 1μm band laser beam L with a wavelength of 900nm to 1100nm. For example, a DDL oscillator emits a laser beam L with a wavelength of 910nm to 950nm, and a fiber laser oscillator emits a laser beam L with a wavelength of 1060nm to 1080nm. Additionally, a blue semiconductor laser emits a laser beam with a wavelength of 400nm to 460nm. The green laser can be a fiber laser oscillator or a DDL oscillator emitting a laser beam with a wavelength of 500nm to 540nm, or it can be a multi-wavelength resonator that optically combines with the 1μm band laser beam L.

[0032] The laser processing head 20 is controlled by the NC device 50 to irradiate the workpiece W on the processing table 30 with a laser beam L transmitted from the laser oscillator 10 via the process fiber 11. The laser processing head 20 has a cylindrical housing 20a containing the irradiation center axis C of the laser beam L. The laser processing head 20 has: a collimating lens 21 that causes the laser beam L emitted from the exit end of the process fiber 11 to be incident inside the housing 20a; and a beam splitter 22 that causes the laser beam L emitted from the collimating lens 21 to be reflected downward in the Z-axis direction, which is perpendicular to the X-axis and Y-axis.

[0033] For example, the beam splitter 22 is filtered to reflect only a portion of the laser beam L's wavelength (1080 nm, 650 nm). Furthermore, the beam splitter 22 can be designed to change its transmittance wavelength characteristics according to the wavelength of any laser beam L used in laser processing, thus allowing filtering to be performed only on the laser beam used for processing. Additionally, the laser processing head 20 has a processing focusing lens 23 that focuses the laser beam L reflected by the beam splitter 22.

[0034] The housing 20a is formed into a tapered shape at the front end of the laser processing head 20. A nozzle 20b is provided at the front end of the laser processing head 20, which has a circular opening for irradiating the workpiece W with the laser beam L. In order to remove the molten workpiece W, the nozzle 20b has a nozzle function for making the gas flow supplied from the auxiliary gas supply device 70 coaxial with the laser beam L and directed towards the workpiece W, and is detachably mounted.

[0035] The processing table 30 can hold a metal plate or other material to be processed, such as a metal plate, on its opposing surface opposite the laser processing head 20. The material to be processed, W, is subjected to cutting, scribing, and piercing processes, for example, by a laser beam L irradiated from the laser processing head 20 on the processing table 30.

[0036] The light detection unit 40 includes functions for splitting the input light and detecting the light intensity distribution. A beam splitter is preferably used as the light detection unit 40, for example. The light detection unit 40 is connected to the housing 20a of the laser processing head 20 via an optical fiber 42. Specifically, one end of the optical fiber 42 is the transmission end of the beam splitter 22 of the housing 20a, which allows light from the work-processed material W to pass through, and is mounted on the irradiation center axis C of the laser beam L in a manner opposite to the work-processed material W. The light detection unit 40 is mounted on the other end of the optical fiber 42.

[0037] The light detection unit 40 inputs the light BR', which is the light transmitted through the beam splitter 22, from the light BR emitted by the processing section SP of the workpiece W along with laser irradiation towards the beam splitter 22, as the emission state of the processing section SP. The light detection unit 40 splits the input light BR' and detects the light intensity distribution in a predetermined wavelength band. In this embodiment, the predetermined wavelength band is preferably from the near-ultraviolet wavelength region to the near-infrared wavelength region, specifically the band from 300 nm to 1000 nm.

[0038] Here, the processing section SP includes not only the processing point (not shown) of the workpiece W irradiated by the laser beam L, but also the pre-cutting section and its surrounding area, which is an inclined section receiving the laser beam L in the processing direction within the cutting groove. That is, the light BR from the processing section SP and the light BR' input to the light detection section 40 contain light emitted from the processing section SP. The light emitted from the processing section SP includes high-temperature light emitted by the thermal radiation of the workpiece W heated by the laser beam L and plasma light emitted by laser-induced plasma. Furthermore, the light BR from the processing section SP and the light BR' input to the light detection section 40 also include reflected light, scattered light, etc., from the laser beam L.

[0039] The light detection unit 40 is capable of detecting the light intensity distribution of light BR' in a time sequence. The time sequence data of the light intensity distribution of a predetermined wavelength band input to the light detection unit 40 is input to the NC device 50 via cable 41.

[0040] Figure 3 This is a block diagram that roughly represents the functional structure of the laser processing machine according to this embodiment.

[0041] In addition to performing axis control and oscillator control for laser processing, the NC device 50 also performs processing monitoring. Functionally, it includes a storage unit 51, a display unit 52, a data processing unit 53, a control unit 54, an input unit 55, and a processing determination unit 60. The processing determination unit 60 includes a learning unit 62, which can learn the relationship between the light intensity distribution detected by the photodetector 40 and whether the workpiece material W can be processed; and a determination unit 64, which determines whether the workpiece material W can be processed. In general, the processing determination unit 60 determines whether the workpiece material W can be processed based on the time-series data of the light intensity distribution of light BR' detected by the photodetector 40.

[0042] The storage unit 51 has storage media such as RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), and SSD (Solid State Drive), and stores various data in a read-write manner. The display unit 52 displays various screens such as setting input screens for inputting laser processing conditions and the judgment results of the processing judgment unit 60. The input unit 55 is composed of input devices such as a keyboard and mouse. In addition, the data processing unit 53, the control unit 54, and the processing judgment unit 60 are composed of integrated computing processing devices such as a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).

[0043] The display unit 52 can be composed of a touch panel that has the function of an input unit 55. When the display unit 52 is composed of a touch panel, the user can, for example, input the material, thickness and other information of the workpiece W to the control unit 54 of the NC device 50 via the interface (I / F) 3 by operating the display unit 52.

[0044] The data processing unit 53 processes the timing data of the light intensity distribution of the light BR' input from the light detection unit 40 via the cable 41 and the interface (I / F) 2 into data for the learning unit 62 of the processing determination unit 60 to learn and analyze.

[0045] The control unit 54 controls the operation of the laser processing unit 1 via the interface (I / F) 4. Specifically, in product processing mode, the control unit 54 controls the product processing of the laser processing unit 1 according to the product processing conditions and product processing tool path read from the storage unit 51, and in pre-processing mode, it controls the pre-processing of the laser processing unit 1 according to the pre-processing conditions and pre-processing tool path read from the storage unit 51.

[0046] Figure 4 This is a diagram illustrating the pre-processing steps of this embodiment.

[0047] In this embodiment, pre-processing is a trial processing performed to investigate the processability of the material W to be processed before product processing. Examples of pre-processing in this embodiment include scribing (marking) and perforation (piercing). Figure 4 As shown, the material W to be processed has a part (product part) Wm used as a product and a part (edge ​​part) Wp not used as a product. The laser processing unit 1 performs product processing on the part Wm used as a product of the material W to be processed, and performs pre-processing on the part Wp not used as a product of the material W to be processed.

[0048] The processing determination unit 60 is configured to input the timing data of the light intensity distribution detected by the light detection unit 40 into the learning unit 62. The learning unit 62 analyzes the data, and the determination unit 64 determines whether the material W to be processed can be processed, and provides the optimal processing conditions (optimal conditions) for product processing. The learning unit 62 of the processing determination unit 60 analyzes the timing data of the light intensity distribution detected by the light detection unit 40 during or after laser processing. That is, the learning unit 62 learns in advance the determination information corresponding to the processing conditions for various products. The learning unit 62 has learned determination information corresponding to the processing conditions for product processing read from the storage unit 51, and the determination unit 64 uses this learned determination information to determine whether processing is possible.

[0049] In this embodiment, the determination unit 64 of the processing determination unit 60 determines whether the material W can be processed in three stages: good (processable under pre-set product processing conditions); fair (processable but higher quality processing is possible by changing the processing conditions); and poor (processing is not possible). The poor (processing is not possible) category includes cases where processing is possible but quality is problematic, and cases where processing is impossible even after changing the processing conditions.

[0050] After pre-processing is completed, the determination unit 64 of the processing determination unit 60 determines whether the material W can be processed before product processing begins. This determination result can be displayed on the display screen of the display unit 52. It is preferable to display the determination result, for example, after pre-processing is completed and before product processing begins. Furthermore, after displaying the determination result indicating whether processing is possible, optimal conditions are displayed on the screen of the display unit 52.

[0051] The processing determination unit 60 enables the learning unit 62 to pre-learn the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material W to be processed can be processed. Specifically, firstly, the laser processing unit 1 performs N scribing and perforation processes on M types of materials of the same thickness under the same processing conditions, and the light detection unit 40 detects the time-series data of the light intensity distribution. The time-series data of each light intensity distribution is labeled with whether laser processing is possible (good, fair, or poor). The labeled time-series data of the light intensity distribution is used as learning data for the learning unit 62 to learn and generate a learning model.

[0052] Figure 5 and Figure 6 It is a diagram used to illustrate the data detected by the optical detection unit during scribing and drilling processes.

[0053] like Figure 5 and Figure 6 As shown, the time-series data of the light intensity distribution detected in the light detection unit 40 is represented as a heatmap with wavelength [nm] on the vertical axis, time [s] on the horizontal axis, and color concentration as light intensity [-].

[0054] Each element constituting the material W to be processed possesses an inherent emission spectrum. By weighting and summing these emission spectra according to the mass ratio of each element in the material W, the emission spectrum of the material W can be determined. Therefore, the emission spectrum of the material W reflects the actual mass ratio of the elements contained in the material W. Scribing reflects the main surface composition of the material W. Piercing reflects the main internal composition of the material W. By analyzing these surface and internal compositions using emission spectra, the processability of the material W under predetermined processing conditions can be determined. Preparatory processing only needs to be performed at the minimum laser beam power required to obtain an analyzable emission spectrum. Therefore, preparatory processing can also be performed at a different power than during product processing. The determination can be made using machine learning.

[0055] Figure 7 as well as Figure 8 This is a diagram showing the confusion matrix used to explain the determination results of scribing and piercing processes based on the machining determination unit 60.

[0056] Here, the actual determination results of whether the material can be processed based on the processing determination unit 60 will be explained. First, before making the determination, the processing determination unit 60 performs 100 pre-processing operations on each of the 13 types of mild steel materials, so that the learning unit 62 learns a total of 1300 learning data and generates a learning model. The generated learning model is then used to determine whether the material can be processed 260 times.

[0057] like Figure 7 As shown, in the marking process, the actual processability (True Label) matches the processability (Predicted Label) determined by the processing determination unit 60 in 91% of cases, which can be considered a good correct answer rate. Furthermore, as... Figure 8 As shown, even in piercing, the actual machinability and the machinability determination based on the machining determination unit 60 are consistent in 84% of cases, and the good determination capability is recognized as unchanged.

[0058] Thus, according to the laser processing machine 100 of this embodiment, by determining whether laser processing of the material W can be performed based on the time-series data of the light intensity distribution of the observed light BR' during pre-processing, it is possible to know with high accuracy whether the material W can be used before product processing.

[0059] [Operation of the laser processing machine in this embodiment]

[0060] Figure 9 This is a flowchart illustrating an example of a laser processing method using the laser processing machine of this embodiment.

[0061] Reference Figure 9 This describes a series of actions of the laser processing method using the laser processing machine 100 of this embodiment. As a prerequisite, the learning unit 62 of the processing determination unit 60 learns in advance the relationship between the timing data of the light intensity distribution detected by the light detection unit 40 and whether the material to be processed W can be processed.

[0062] In addition, unless otherwise specified in this flowchart, the main body of each process's actions and their relationship to... Figure 3 The processes related to data transmission and reception (exchange) in each part 51-54, 60, 62 and 64 of each I / F2 to 4 in the NC device 50 shown above can be applied, so they are omitted.

[0063] First, the control unit 54 reads the pre-processing mode for performing pre-processing from the storage unit 51 and starts it (S1). Next, the control unit 54 reads the pre-processing conditions and pre-processing tool paths recorded in the started pre-processing mode (S2).

[0064] Based on the read information, the control unit 54 controls the laser processing unit 1 according to the pre-processing conditions and the pre-processing tool path. The laser processing unit 1 irradiates the edge portion Wp of the workpiece W with a laser beam L, and begins the pre-processing of the workpiece W (scribing or drilling, or both) (S3). At this time, the light detection unit 40 splits the light BR' that passes through the beam splitter 22 from the processing portion SP irradiated with the laser beam L on the edge portion Wp toward the beam splitter 22, and detects the light intensity distribution in a time sequence.

[0065] The data processing unit 53 receives the timing data of the light intensity distribution of light BR' from the light detection unit 40 via cable 41 and interface (I / F) 2, processes the timing data of the light intensity distribution into data suitable for analysis by the learning unit 62 of the processing determination unit 60, and inputs the data into the learning unit 62. In addition, the data used for analysis by the learning unit 62 includes at least three-dimensional data of wavelength, light intensity, and time.

[0066] The learning unit 62 of the processing determination unit 60 analyzes the timing data of the light intensity distribution input from the data processing unit 53 during or after the pre-processing. The determination unit 64 of the processing determination unit 60 receives the analysis from the learning unit 62 and determines whether the material W to be processed based on the pre-processing is suitable for processing in three stages: good, fair, and poor (S4). The determination result is then displayed on the display unit 52 (S5).

[0067] If the determination result of the processing determination unit 60 is good or fair (in S6, it is YESgood or fair), the determination unit 64 of the processing determination unit 60 calculates the optimal conditions based on the analysis results of the pre-processing and displays the optimal conditions on the display unit 52 (S9). The control unit 54 selects the optimal conditions suggested by the determination unit 64 of the processing determination unit 60 (S10), reads the product processing mode for performing product processing from the storage unit 51 and starts it (S11).

[0068] Based on the selected optimal conditions and the information read from the storage unit 51, the control unit 54 controls the laser processing unit 1 according to the processing conditions and the tool path for product processing. The laser processing unit 1 irradiates the product part Wm of the material to be processed with a laser beam L to perform product processing on the material W (S12), thus ending the series of processes in this flowchart.

[0069] If the processing determination unit 60 determines the result as poor (poor in S6), and if the quality is problematic but processing is possible (yes in S7), the product is processed using the same steps as in the good or poor cases (S9-S12). On the other hand, if processing is impossible even with changes to the processing conditions (no in S7), the process is not transferred to product processing. The material to be processed W is changed to another material W' (S8), and the control unit 54 reads the pre-processing mode for implementing pre-processing from the storage unit 51 again and activates it (S1). After the pre-processing mode is activated, the steps from S2 onwards are repeated.

[0070] [Advantages of the laser processing machine in this embodiment]

[0071] As described above, the laser processing machine 100 of this embodiment includes: a laser processing unit 1, which irradiates a laser beam L onto a workpiece W to perform laser processing on the workpiece W; a control unit 54, which controls the laser processing unit 1 according to the processing conditions for processing the workpiece W; a light detection unit 40, which detects the light BR' from the processing section SP of the workpiece W irradiated with the laser beam L; and a processing determination unit 60, which is connected to the light detection unit 40. The control unit 54 controls the laser processing unit 1 through a product processing mode for processing the workpiece W and a pre-processing mode for pre-processing the workpiece W before product processing. The light detection unit 40 is capable of detecting the light intensity distribution of a predetermined wavelength band of the light BR'. The processing determination unit 60 determines whether the workpiece W can be processed (processability) based on the light intensity distribution detected by the light detection unit 40 during pre-processing.

[0072] Furthermore, the laser processing machine 100 of this embodiment, by having such a structure, can know whether the material W to be processed can be processed by laser processing before product processing.

[0073] Furthermore, in the laser processing machine 100 of this embodiment, the processing determination unit 60 determines whether the material W to be processed can be processed based on the time-series data of the light intensity distribution of light BR' detected by the light detection unit 40. By having such a structure, the laser processing machine 100 of this embodiment has the advantage of being able to determine whether the material W to be processed can be processed based on the time-varying changes in the light intensity distribution, such as the stability of the molten state of the material W to be processed within a predetermined time.

[0074] Furthermore, in the laser processing machine 100 of this embodiment, the processing determination unit 60 includes a learning unit 62 capable of learning the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material W to be processed can be processed. With this structure, the laser processing machine 100 of this embodiment has the following advantages: the learning unit 62 of the processing determination unit 60 can perform machine learning on the patterns (feature quantities) implicit in the relationship between light intensity distribution and whether processing is possible, and can generate a learning model to determine whether processing is possible based on data of unknown light intensity distribution. For example, even for materials of the same steel grade, the composition of the metal elements contained may differ due to differences in country, manufacturer, manufacturing plant, batch, etc. Therefore, the learning unit 62 can learn feature quantities suitable for new processing condition labels corresponding to this environmental change, and retrieve / adjust or create processing conditions corresponding to unknown materials. In addition, these feature quantities include the results obtained by machine learning on complex combinations of wavelengths or light intensities of light emitted by ionization of the metal elements contained in these steel grades, elements of the auxiliary gas, etc., through a laser beam L, etc.

[0075] Furthermore, in the laser processing machine 100 of this embodiment, the processing determination unit 60 enables the learning unit 62 to learn in advance the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material to be processed W can be processed. With this structure, the laser processing machine 100 of this embodiment has the following advantages: it can learn feature quantities based on learning data, and based on the learned feature quantities, it can determine whether the material to be processed W can be processed based on the unknown light intensity distribution detected by the light detection unit 40.

[0076] Furthermore, in the laser processing machine 100 of this embodiment, the processing determination unit 60 inputs the light intensity distribution detected by the light detection unit 40 to the learning unit 62 to determine whether the material W to be processed can be processed. With this structure, the laser processing machine 100 of this embodiment has the advantage of being able to determine whether processing is possible without using complex calculation formulas.

[0077] Furthermore, the laser processing machine 100 of this embodiment has the following advantages: by making the pre-processing a scribing process, it is possible to determine whether the material W to be processed can be cut to the desired quality through the irradiation of the laser beam L during scribing. Moreover, the laser processing machine 100 of this embodiment has the following advantages: by making the pre-processing a perforation process, it is possible to determine whether the material W to be processed can be cut to the desired quality through the irradiation of the laser beam L during perforation.

[0078] Furthermore, in the laser processing machine 100 of this embodiment, the laser processing unit 1 performs pre-processing on the portion of the product (edge ​​material portion) Wp that is not used as the processed material W. With this structure, the laser processing machine 100 of this embodiment has the following advantages: it can reduce the waste of the processed material W, and it can effectively utilize the edge material portion Wp that is discarded as edge material.

[0079] Furthermore, in the laser processing machine 100 of this embodiment, during pre-processing, the laser processing unit 1 irradiates the material W to be processed with a laser beam L of lower power than that used during product processing. By having such a structure, the laser processing machine 100 of this embodiment can reduce wear and breakage of the laser processing unit 1 caused by pre-processing, and can also reduce the power consumption of the laser processing machine 100.

[0080] [Variation Example]

[0081] The preferred embodiments of the present invention have been described above, but the technical scope of the present invention is not limited to the scope described in the above embodiments. Various modifications or improvements can be made to the above embodiments.

[0082] For example, in the above embodiment, it is explained that the processing determination unit 60 determines whether the material to be processed W can be processed based on the time-series data of the light intensity distribution of light BR' detected by the light detection unit 40. However, it is not limited to this. The processing determination unit 60 may also determine whether the material to be processed W can be processed based on the light intensity distribution of light BR' at any time.

[0083] In the above embodiments, it is described that the processing determination unit 60 includes a learning unit 62 that can learn the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material to be processed W can be processed. However, it is not limited to this, and the processing determination unit 60 may not include a learning unit 62.

[0084] In the above embodiments, it is explained that the processing determination unit 60 enables the learning unit 62 to learn in advance the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material to be processed W can be processed, but it is not limited thereto. For example, the processing determination unit 60 may also enable the learning unit 62 to learn without enabling the learning unit 62 to learn in advance the relationship between the light intensity distribution detected by the light detection unit 40 and whether the material to be processed W can be processed, and to learn as so-called unsupervised learning.

[0085] In the above embodiment, it is described that the processing determination unit 60 inputs the timing data of the light intensity distribution detected by the light detection unit 40 to the learning unit 62 to determine whether the material W to be processed can be processed, but it is not limited to this. The processing determination unit 60 may also not input the timing data of the light intensity distribution detected by the light detection unit 40 to the learning unit 62.

[0086] In the above embodiments, it is described that the pre-processing is scribing (marking) and / or piercing (piercing), but it is not limited to these. For example, it may also be cutting (cutting), etc.

[0087] In the above embodiment, it is described that the laser processing unit 1 performs pre-processing on the part of the product (edge ​​part) Wp that is not used as the material to be processed W, but it is not limited to this. For example, the part (product part) Wm that is used as the material to be processed W may also be pre-processed as part of the product processing.

[0088] In the above embodiments, it is explained that the pre-processing can be carried out at a lower power than that used during product processing, but it is not limited to this. The pre-processing can also be carried out at a power higher than that used during product processing.

[0089] In the above embodiments, it is described that the control unit 54 controls the product processing based on the laser processing unit 1 according to the product processing conditions in the product processing mode, and controls the pre-processing based on the laser processing unit 1 according to the pre-processing conditions in the pre-processing mode, but is not limited thereto. For example, the control unit 54 may also control the pre-processing based on the laser processing unit 1 according to the product processing conditions during pre-processing.

[0090] In the above embodiment, it is described that the optical detection unit 40 is connected to the housing 20a of the laser processing head 20 via the optical fiber 42, but it is not limited thereto. For example, the optical detection unit 40 may be provided on the transmission side of the beam splitter 22 inside the housing 20a of the laser processing head 20, or it may be provided on the side of the laser processing head 20.

[0091] In the above embodiments, the light detection unit 40 is described as including a beam splitting function and a light intensity distribution detection function, suitable for situations where a beam splitter is used, but not limited thereto. For example, the light detection unit 40 may not include a beam splitting function. The light detection unit 40 may adopt a structure including a photodiode with a light intensity distribution detection function and a diffraction grating or a transmission bandpass filter that is arranged opposite to the photodiode and selects a specific wavelength band that is effective for determining whether it can be processed, or it may adopt various arbitrary structures.

[0092] It has been explained that the predetermined wavelength range for the light intensity distribution detected by the light detection unit 40 is preferably a range of 300 nm to 1000 nm, but it is not limited thereto. For example, the predetermined wavelength range can be the visible light wavelength region, or it can include the ultraviolet wavelength region below 300 nm, or it can include the infrared wavelength region above 1000 nm.

[0093] Explanation of reference numerals in the attached figures

[0094] 1 Laser processing unit

[0095] 10 laser oscillators

[0096] 1 Laser processing unit

[0097] Interfaces 2, 3, and 4

[0098] 10 laser oscillators

[0099] 11 process optical fiber

[0100] 20 laser processing heads

[0101] 20a casing

[0102] 30 processing tables

[0103] 40 Optical Detection Department

[0104] 41 cable

[0105] 42 fiber optic cables

[0106] 50NC device

[0107] 51 Storage Department

[0108] 52 Display Section

[0109] 53 Data Processing Department

[0110] 54 Control Department

[0111] 55 Input Section

[0112] 56 Study Department

[0113] 60 Processing Judgment Department

[0114] 62 Study Department

[0115] 64 Judgment Department

[0116] 70 Auxiliary Gas Supply Unit

[0117] 100 laser processing machine

[0118] BR light from the processing section side toward the beam splitter side

[0119] BR' is the light transmitted through the beam splitter 22.

[0120] L laser beam

[0121] SP Machining Department

[0122] W processed material

[0123] Wm is used as part of the product (Product Department)

[0124] Wp is the part not used for the product (edge ​​material).

Claims

1. A laser processing machine characterized by comprising: a laser processing unit that irradiates a laser beam to a processed material to perform laser processing on the processed material; a control section that controls the laser processing unit in accordance with a processing condition for processing the processed material; a light detection section that detects light from a processed portion of the processed material that has been irradiated with the laser beam; and a processing determination section that is connected to the light detection section, the control section controls the laser processing unit by a product processing mode that performs product processing of the processed material and a preliminary processing mode that performs preliminary processing of the processed material before the product processing, the light detection section spectrally separates the light and detects a light intensity distribution of a predetermined wavelength band of the light, the processing determination section determines whether or not the processed material can be processed based on the light intensity distribution detected by the light detection section at the time of the preliminary processing.

2. The laser processing machine according to claim 1, characterized in that the processing determination section determines whether or not the processed material can be processed based on time-series data of the light intensity distribution of the light detected by the light detection section.

3. The laser processing machine according to claim 1 or 2, characterized in that the processing determination section includes a learning section that can learn a relationship between the light intensity distribution detected by the light detection section and the processability of the processed material.

4. The laser processing machine according to claim 3, characterized in that the processing determination section causes the learning section to learn in advance the relationship between the light intensity distribution detected by the light detection section and the processability of the processed material.

5. The laser processing machine according to claim 3, characterized in that the processing determination section inputs the light intensity distribution detected by the light detection section to the learning section and determines whether or not the processed material can be processed.

6. The laser processing machine according to claim 1, characterized in that the preliminary processing is scribe processing and / or perforation processing.

7. The laser processing machine according to claim 1, characterized in that the laser processing unit performs the preliminary processing on a portion that is not used as a product of the processed material.

8. The laser processing machine according to claim 1, characterized in that the laser processing unit irradiates the processed material with a laser beam having a lower power at the time of the preliminary processing than at the time of the product processing.

9. The laser processing machine according to claim 1, characterized in that the light detected by the light detection section includes light emitted from the processed portion of the processed material, the processing determination section determines whether or not the processed material can be processed based on the light emitted from the processed portion.

10. The laser processing machine according to claim 9, characterized in that the light emitted from the processed portion includes light of high-temperature luminescence generated by heat radiation of the processed material after heating with the laser beam and light of plasma luminescence generated by laser-induced plasma, ​ ​ The processing determination unit determines whether or not the workpiece can be processed, based on light of high-temperature luminescence generated by the thermal radiation of the workpiece after the workpiece is heated by the laser beam and light of plasma luminescence generated by the laser-induced plasma.

Images