Barron structure and electronic device

Abstract

The balun structure and the electronic device provided by the embodiments of the present disclosure comprise: a dielectric substrate; a first ground conductive layer, a first transmission line, a second transmission line, and a third transmission line, wherein at least one coupling structure is connected in series between the first end and the second end of the third transmission line; the coupling structure comprises a first coupling part and a second coupling part; in the same coupling structure, the first coupling part has at least one first bifurcated line at one end facing the second coupling part, and the second coupling part has at least one second bifurcated line at one end facing the first coupling part; in the same coupling structure, the first bifurcated line is electrically connected to the first ground conductive layer through a first through hole at one end close to the second coupling part, and the second bifurcated line is electrically connected to the first ground conductive layer through a second through hole at one end close to the first coupling part; and in the same coupling structure, the first bifurcated line of the first coupling part and the second bifurcated line of the second coupling part are coupled and connected.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of microwave communication, and in particular to a balun structure and an electronic device. BACKGROUND

[0002] A balun is a kind of three-port device, which can realize mutual conversion between differential signals and single-ended signals as a conversion device between balanced ports and unbalanced ports, and is widely used in balanced layouts in the field of microwave communication. With the continuous development of electronic devices towards miniaturization, lightness and high performance, higher requirements are put forward for the size and performance of the balun. For example, a magnetic flux coupling transformer balun is the most common type of balun, which is basically composed of a magnetic core and two different conductive lines wound on the magnetic core, and has a large volume, and the most suitable working frequency of this balun is below 1 GHz. For another example, a classic transformer balun has two independent coil windings wound on the transformer core. For another example, a self-coupled transformer balun has one coil or two or more coils, and the electrical connection of these coils is also wound on the ring core. In addition, there are delay line baluns, self-resonant baluns, etc., but the forms and volumes of these baluns are relatively large. SUMMARY

[0003] The balun structure provided by the embodiments of the present disclosure comprises:

[0004] a dielectric substrate;

[0005] a first ground conductive layer located on one side of the dielectric substrate;

[0006] a first transmission line located on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the first transmission line is electrically connected with an unbalanced signal port;

[0007] a second transmission line located on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the second transmission line is electrically connected with a second end of the first transmission line, and a second end of the second transmission line is electrically connected with a first balanced signal port;

[0008] a third transmission line located on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the third transmission line is electrically connected with the second end of the first transmission line, and a second end of the third transmission line is electrically connected with a second balanced signal port;

[0009] wherein at least one coupling structure is connected in series between the first end and the second end of the third transmission line; the coupling structure comprises a first coupling part and a second coupling part; wherein in the same coupling structure, the first coupling part has at least one first bifurcated line facing one end of the second coupling part, and the second coupling part has at least one second bifurcated line facing one end of the first coupling part.

[0010] And, in the same coupling structure, the first branch line is electrically connected to the first ground conductive layer through a first via hole at one end of the first branch line close to the second coupling part, and the second branch line is electrically connected to the first ground conductive layer through a second via hole at one end of the second branch line close to the first coupling part; and, in the same coupling structure, the first branch line of the first coupling part and the second branch line of the second coupling part are coupled and connected.

[0011] In some examples, in the same coupling structure, the first branch line and the second branch line are alternately and spacedly arranged in the orthographic projection of the dielectric substrate.

[0012] In some examples, the first coupling part and the second coupling part in each of the coupling structures are arranged in the same layer.

[0013] In some examples, the first transmission line, the second transmission line, the third transmission line, and each of the coupling structures are located in the same film layer.

[0014] In some examples, the first coupling part and the second coupling part in at least one of the coupling structures are arranged in different layers.

[0015] In some examples, the first transmission line, the second transmission line, and the first coupling part are located in the same film layer;

[0016] The second coupling part is located between the first coupling part and the dielectric substrate.

[0017] The balun structure further comprises:

[0018] A first insulating layer is located between the second coupling part and the first coupling part.

[0019] The first via hole further penetrates the first insulating layer.

[0020] In some examples, the first transmission line, the second transmission line, and the first coupling part are located in the same film layer;

[0021] The second coupling part is located on the side of the first coupling part away from the dielectric substrate.

[0022] The balun structure further comprises:

[0023] A second insulating layer is located between the second coupling part and the first coupling part.

[0024] The second via hole further penetrates the second insulating layer.

[0025] In some examples, the balun structure further comprises:

[0026] A third insulating layer covers the first transmission line, the second transmission line, and the third transmission line;

[0027] The second grounded conductive layer is located on the side of the third insulating layer that is away from the dielectric substrate.

[0028] Wherein, the end of the first branch line near the second coupling part is electrically connected to the second grounding conductive layer through a third through hole, and the end of the second branch line near the first coupling part is electrically connected to the second grounding conductive layer through a fourth through hole; wherein, the third through hole and the fourth through hole respectively penetrate the third insulating layer.

[0029] In some examples, when the balun structure further includes a first insulating layer, the fourth through-hole also penetrates the first insulating layer;

[0030] When the balun structure further includes a second insulating layer, the third through-hole also penetrates the second insulating layer.

[0031] In some examples, at least one of the coupling structures is connected in series between the first end and the second end of at least one of the first transmission line and the second transmission line.

[0032] In some examples, in the same coupling structure, the shapes of the first bifurcation line and the second bifurcation line in the orthographic projection of the dielectric substrate include straight lines, bends, wavy lines, and curves.

[0033] In some examples, the balun structure also includes:

[0034] At least one resistor is electrically connected between the second end of the second transmission line and the second end of the third transmission line.

[0035] This disclosure also provides an electronic device, including the balun structure described above. Attached Figure Description

[0036] Figure 1a Some top view structural schematic diagrams of the balun structure provided in the embodiments of this disclosure;

[0037] Figure 1b for Figure 1a The diagram shows some cross-sectional views of the balun structure along the AA' direction.

[0038] Figure 1c for Figure 1a The diagram shows some cross-sectional views of the balun structure along the BB' direction.

[0039] Figure 1d Other top view schematic diagrams of the balun structure provided in the embodiments of this disclosure;

[0040] Figure 2a A return loss schematic diagram of the balun structure in the embodiment of the present disclosure when applied to the transmission of radio frequency signals in the 12 GHz frequency band;

[0041] Figure 2b An insertion loss schematic diagram of the balun structure in the embodiment of the present disclosure when applied to the transmission of radio frequency signals in the 12 GHz frequency band;

[0042] Figure 2c A phase schematic diagram of the signal of the balun structure in the embodiment of the present disclosure when applied to the transmission of radio frequency signals in the 12 GHz frequency band;

[0043] Figure 3 Still another top view structural schematic diagram of the balun structure provided by the embodiment of the present disclosure;

[0044] Figure 4a A top view structural schematic diagram of the balun structure shown in FIG. 1 is shown in FIG. 2; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 3; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 4;

[0045] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 5; Figure 4b Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 6; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 7; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 8;

[0046] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 9; Figure 5a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 10; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 11; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 12;

[0047] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 13; Figure 5b Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 14; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 15; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 16;

[0048] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 17; Figure 6a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 18; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 19; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 20;

[0049] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 21; Figure 6b Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 22; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 23; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 24;

[0050] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 25; Figure 7 Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 26; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 27; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 28;

[0051] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 29; Figure 8 Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 30; Figure 1a Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 31; Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 32;

[0052] Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the AA' direction is shown in FIG. 33; Figure 9 Another cross-sectional structural schematic diagram of the balun structure shown in FIG. 1 along the BB' direction is shown in FIG. 34;

[0053] Figure 10a Yet another top view structural schematic diagram of the balun structure provided by the embodiments of the present disclosure;

[0054] Figure 10b Yet another top view structural schematic diagram of the balun structure provided by the embodiments of the present disclosure. DETAILED DESCRIPTION

[0055] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. And the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0056] Unless otherwise defined, technical terms or scientific terms used in the present application shall be understood as the usual meaning understood by those of ordinary skill in the art to which the present application belongs. The terms "first", "second" and similar words used in the present application do not represent any order, number or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect.

[0057] It should be noted that the size and shape of each figure in the drawings do not reflect the true proportions, but only serve to illustrate the content of the present application. And the same or similar reference numbers represent the same or similar elements or elements with the same or similar functions throughout.

[0058] In the field of microwave radio frequency, differential circuits and baluns are widely used in communication base station products, mobile products and chip design. Differential signals are generally used to eliminate common mode noise, and baluns are used to realize mutual conversion between single-ended signals and differential signals. Differential signals are composed of a pair of power division signals with opposite phases.

[0059] As Figures 1a to 1cAs shown, the balun structure provided by the embodiments of the present disclosure can include a dielectric substrate 100, a first ground conductive layer 210 located on one side of the dielectric substrate 100, a first transmission line 310, a second transmission line 320 and a third transmission line 330 located on the side of the dielectric substrate 100 away from the first ground conductive layer 210. Exemplarily, the dielectric substrate 100 can be formed by a dielectric layer. The dielectric layer can be formed by an insulating material.

[0060] In the embodiments of the present disclosure, as shown, Figures 1a to 1c Exemplarily, the first end of the first transmission line 310 can be electrically connected with the unbalanced signal port 01. The first end of the second transmission line 320 is electrically connected with the second end of the first transmission line 310, and the second end of the second transmission line 320 is electrically connected with the first balanced signal port 021. In addition, the first end 330-a of the third transmission line 330 is electrically connected with the second end of the first transmission line 310, and the second end 330-b of the third transmission line 330 is electrically connected with the second balanced signal port 022. Wherein, at least one coupling structure 400 is connected in series between the first end 330-a and the second end 330-b of the third transmission line 330. Wherein, the coupling structure 400 can include a first coupling part 410 and a second coupling part 420.

[0061] Exemplarily, as shown, Figure 1aAs shown, in the same coupling structure 400, the first coupling part 410 has at least two first bifurcated lines (such as 411, 412) at one end facing the second coupling part 420, and the second coupling part 420 has at least two second bifurcated lines (such as 421, 422) at one end facing the first coupling part 410. In the same coupling structure 400, the first bifurcated lines (such as 411, 412) are electrically connected to the first ground conductive layer 210 through the first via hole GK1 near one end of the second coupling part 420, and the second bifurcated lines (such as 421, 422) are electrically connected to the first ground conductive layer 210 through the second via hole GK2 near one end of the first coupling part 410. In the same coupling structure 400, the first bifurcated lines of the first coupling part 410 and the second bifurcated lines of the second coupling part 420 are coupled and connected. For example, the first bifurcated line 411 and the second bifurcated line 421 have a gap and are coupled and connected, the second bifurcated line 421 and the first bifurcated line 411, 412 have a gap and are coupled and connected, and the first bifurcated line 412 and the second bifurcated line 421, 422 have a gap and are coupled and connected. In this way, the signal transmitted to the first bifurcated line (such as 411, 412) can be transmitted to the second bifurcated line (such as 421, 422) through the coupling effect, and then transmitted to the connected device through the second end 330-b of the third transmission line 330. Alternatively, the signal transmitted to the second bifurcated line (such as 421, 422) can be transmitted to the first bifurcated line (such as 411, 412) through the coupling effect, and then transmitted to the device connected to the first transmission line 310 through the first end 330-a of the third transmission line 330.

[0062] In the embodiments of the present disclosure, a layer of metal material (for example, Cu, Ag, Au, Al, etc.) can be plated on the sidewalls of the first via hole and the second via hole, or the first via hole and the second via hole can be first filled with metal material (for example, Cu, Ag, Au, Al, etc.), and then the first bifurcated line is connected to the metal material filled in the first via hole, and the second bifurcated line is connected to the metal material filled in the second via hole. Alternatively, the material for preparing the first bifurcated line and the second bifurcated line can be filled into the first via hole and the second via hole at the same time as the first bifurcated line and the second bifurcated line are prepared.

[0063] Exemplarily, in the balun structure provided by the embodiments of the present disclosure, the unbalanced signal port 01 can be connected with a coaxial line, a microstrip line or other unbalanced transmission line, and the first balanced signal port 021 and the second balanced signal port 022 can be connected with a push-pull amplifier, a balanced mixer, a balanced antenna or other device or balanced transmission line. The balun structure can also be applied to a liquid crystal phase shifter of a liquid crystal phased array antenna system. In this way, when a device connected with the unbalanced signal port 01 inputs an unbalanced signal through the unbalanced signal port 01, the unbalanced signal can be converted into a differential signal through the balun structure and output to the device connected with the first balanced signal port 021 and the second balanced signal port 022. Alternatively, when a device connected with the first balanced signal port 021 and the second balanced signal port 022 inputs a differential signal through the first balanced signal port 021 and the second balanced signal port 022, the differential signal can be converted into an unbalanced signal through the balun structure and output to the device connected with the unbalanced signal port 01. For example, the balun structure is used for converting a coaxial connection to a balanced antenna. In this way, a phase shift of 180° can be generated and balanced input is provided.

[0064] In the balun structure provided by the embodiments of the present disclosure, in the same coupling structure 400, at least one first branch line is arranged at one end of the first coupling part 410 facing the second coupling part 420, at least one second branch line is arranged at one end of the second coupling part 420 facing the first coupling part 410, and the first branch line of the first coupling part 410 and the second branch line of the second coupling part 420 are coupled and connected in the same coupling structure 400, so that a coupling effect is generated between the first branch line and the second branch line. The coupling effect generates a phase delay, so that the phase difference between the signal transmitted by the first balanced signal port 021 and the signal transmitted by the second balanced signal port 022 is 180°. In addition, by appropriately designing the sizes of the first transmission line 310, the second transmission line 320, the third transmission line 330, the first branch line and the second branch line (for example, the lengths of the second transmission line 320 and the third transmission line 330 can be approximately one-quarter of the medium wavelength, and the widths can be appropriate sizes meeting the impedance matching requirements), the output power of the first balanced signal port 021 and the output power of the second balanced signal port 022 can be made the same. In addition, the first ground conductive layer 210 is grounded, and the one end of the first branch line close to the second coupling part 420 is electrically connected with the first ground conductive layer 210 through the first through hole GK1, and the one end of the second branch line close to the first coupling part 410 is electrically connected with the first ground conductive layer 210 through the second through hole GK2, so that the electromagnetic shielding property is improved and noise interference is suppressed. In addition, the design of the balun structure provided by the embodiments of the present disclosure is relatively simple, and the balun structure is easy to manufacture and integrate.

[0065] In the embodiments of the present disclosure, as Figures 1a to 1cAs shown, in the same coupling structure 400, the first branch lines and the second branch lines can be arranged alternately and spaced apart in the orthographic projection of the dielectric substrate 100. For example, the first branch line 411, the second branch line 421, the first branch line 412, and the second branch line 422 are arranged alternately and spaced apart in the orthographic projection of the dielectric substrate 100. In this way, the coupling structure 400 can form an interdigital line structure, so that the phase delay can be generated through the coupling effect between the first branch lines and the second branch lines staggered with each other in the same coupling structure 400, so that the phase difference between the signals transmitted by the first balanced signal port 021 and the second balanced signal port 022 is 180°.

[0066] In the embodiments of the present disclosure, as shown in Figure 1a The material of the first transmission line 310 can be a metal material, for example, Cu, Ag, Au, Al, etc. The first transmission line 310 can be arranged in the form of a linear trace. For example, as shown in Figure 1a The shape of the first transmission line 310 in the orthographic projection of the dielectric substrate 100 can be arranged in a straight line shape. Of course, the shape of the first transmission line 310 in the orthographic projection of the dielectric substrate 100 can also be arranged in a bent line, a wavy line, a curve, etc., which can be determined according to the actual application requirements, and is not limited here.

[0067] In the embodiments of the present disclosure, as shown in Figure 1a The material of the second transmission line 320 can be a metal material, for example, Cu, Ag, Au, Al, etc. The second transmission line 320 can also be arranged in the form of a linear trace. For example, as shown in Figure 1a The shape of the second transmission line 320 in the orthographic projection of the dielectric substrate 100 can be arranged in a straight line shape. Of course, the shape of the second transmission line 320 in the orthographic projection of the dielectric substrate 100 can also be arranged in a bent line, a wavy line, a curve, etc., which can be determined according to the actual application requirements, and is not limited here.

[0068] In the embodiments of the present disclosure, as shown in Figure 1a The material of the first branch line (such as 411, 412) and the second branch line (such as 421, 422) can be a metal material, for example, Cu, Ag, Au, Al, etc. In the same coupling structure 400, the shape of the first branch line (such as 411, 412) and the second branch line (such as 421, 422) in the orthographic projection of the dielectric substrate 100 can be arranged in a straight line shape. Alternatively, as shown in Figure 3As shown, in the same coupling structure 400, the shapes of the first branch line (such as 411, 412) and the second branch line (such as 421, 422) projected onto the dielectric substrate 100 can also be set as bent lines to further reduce the size. Of course, in the same coupling structure 400, the shapes of the first branch line and the second branch line projected onto the dielectric substrate 100 can also be set as wavy lines and curves, etc., which are not limited here.

[0069] In the embodiments disclosed herein, such as Figure 1a and Figure 1c As shown, the first coupling portion 410 and the second coupling portion 420 in each coupling structure 400 can be arranged in the same layer. In this way, the patterns of the first coupling portion 410 and the second coupling portion 420 in each coupling structure 400 can be formed in a single patterning process, which simplifies the manufacturing process, saves production costs, and improves production efficiency.

[0070] In the embodiments disclosed herein, such as Figures 1a to 1c As shown, the first transmission line 310, the second transmission line 320, the third transmission line 330, and each coupling structure 400 can be located on the same film layer, so that the balun structure can be fabricated in the form of a microstrip line. In this way, the patterns of the first transmission line 310, the second transmission line 320, the third transmission line 330, and each coupling structure 400 can be formed in a single patterning process, which simplifies the fabrication process, saves production costs, and improves production efficiency.

[0071] In the embodiments disclosed herein, such as Figure 1d As shown, the balun structure may further include at least one resistor RS. Each resistor RS is electrically connected between a second terminal of the second transmission line 320 and a second terminal 330-b of the third transmission line 330. This improves the matching of the output ports of the balun structure and the isolation between the output ports. Exemplarily, the balun structure may include one resistor. Alternatively, the balun structure may include two resistors. Alternatively, the balun structure may include three or more resistors. Of course, in embodiments of this disclosure, as... Figure 1a As shown, the balun structure can also be without a resistor RS. In practical applications, the number of resistors can be determined according to the specific requirements, and is not limited here.

[0072] When the balun structure of this embodiment is applied to RF signal transmission in the 12GHz band, the return loss of the unbalanced signal port 01 is as follows: Figure 2a (The horizontal axis represents frequency, and the vertical axis represents return loss.) As shown, the insertion loss from unbalanced signal port 01 to the first balanced signal port 021 and the second balanced signal port 022 is as follows: Figure 2b (The horizontal axis represents frequency, and the vertical axis represents insertion loss) As shown, the phases of the signals at the first balanced signal port 021 and the second balanced signal port 022 are as follows:Figure 2c It can be seen that the return loss of the unbalanced signal port 01 is less than -20 dB in the range of 11 GHz-12 GHz. It can be seen that the insertion loss of the unbalanced signal port 01 to the first balanced signal port 021 and the second balanced signal port 022 is -3.02 dB and -3.32 dB respectively at 12 GHz. It can be seen that the signal phases of the first balanced signal port 021 and the second balanced signal port 022 are different by 180.9°. Figure 2a It can be seen that the return loss of the unbalanced signal port 01 is less than -20 dB in the range of 11 GHz-12 GHz. It can be seen that the insertion loss of the unbalanced signal port 01 to the first balanced signal port 021 and the second balanced signal port 022 is -3.02 dB and -3.32 dB respectively at 12 GHz. It can be seen that the signal phases of the first balanced signal port 021 and the second balanced signal port 022 are different by 180.9°. Figure 2b It can be seen that the return loss of the unbalanced signal port 01 is less than -20 dB in the range of 11 GHz-12 GHz. It can be seen that the insertion loss of the unbalanced signal port 01 to the first balanced signal port 021 and the second balanced signal port 022 is -3.02 dB and -3.32 dB respectively at 12 GHz. It can be seen that the signal phases of the first balanced signal port 021 and the second balanced signal port 022 are different by 180.9°. Figure 2c It can be seen that the return loss of the unbalanced signal port 01 is less than -20 dB in the range of 11 GHz-12 GHz. It can be seen that the insertion loss of the unbalanced signal port 01 to the first balanced signal port 021 and the second balanced signal port 022 is -3.02 dB and -3.32 dB respectively at 12 GHz. It can be seen that the signal phases of the first balanced signal port 021 and the second balanced signal port 022 are different by 180.9°.

[0073] The present disclosure provides another structure diagram of the balun structure, as shown in Figure 4a As shown in Figure 4b The differences between the present embodiment and the above embodiments will be described below, and the same parts will not be described herein.

[0074] In the present embodiment, the first coupling part 410 and the second coupling part 420 in at least one coupling structure 400 can be arranged in different layers. For example, a plurality of coupling structures 400 can be arranged in the third transmission line 330, the first coupling part 410 and the second coupling part 420 in one of the coupling structures 400 can be arranged in different layers, and the first coupling part 410 and the second coupling part 420 in the remaining coupling structures 400 can be arranged in the same layer. Alternatively, the first coupling part 410 and the second coupling part 420 in two of the coupling structures 400 can be arranged in different layers, and the first coupling part 410 and the second coupling part 420 in the remaining coupling structures 400 can be arranged in the same layer. Alternatively, the first coupling part 410 and the second coupling part 420 in three of the coupling structures 400 can be arranged in different layers, and the first coupling part 410 and the second coupling part 420 in the remaining coupling structures 400 can be arranged in the same layer. Of course, as Figure 4a As shown in Figure 4bAs shown, a coupling structure 400 can be arranged in the third transmission line 330, and the first coupling part 410 (including the first bifurcated lines 411 and 412) and the second coupling part 420 (including the second bifurcated lines 421 and 422) in the coupling structure 400 can be arranged in different layers. For example, the first transmission line 310, the second transmission line 320 and the first coupling part 410 can be arranged in the same film layer. The second coupling part 420 (including the second bifurcated lines 421 and 422) is arranged between the first coupling part 410 (including the first bifurcated lines 411 and 412) and the dielectric substrate 100. The balun structure further includes a first insulating layer 510 arranged between the second coupling part 420 and the first coupling part 410, and the first via hole GK1 further penetrates the first insulating layer 510. For example, the first insulating layer 510 can be formed by a dielectric layer. It should be noted that the first coupling part 410 (including the first bifurcated lines 411 and 412) and the first end 330-a of the third transmission line 330 are an integrated structure arranged in the same layer. The second coupling part 420 (including the second bifurcated lines 421 and 422) and the second end 330-b of the third transmission line 330 are an integrated structure arranged in the same layer. That is, the first coupling part 410 (including the first bifurcated lines 411 and 412) and the first end 330-a of the third transmission line 330 are arranged as one film layer, and the second coupling part 420 (including the second bifurcated lines 421 and 422) and the second end 330-b of the third transmission line 330 are arranged as another film layer, and the first insulating layer 510 is arranged between the two film layers.

[0075] The present disclosure provides structure diagrams of some other balun structures. Figure 5a The present disclosure provides structure diagrams of some other balun structures. Figure 5b As shown, the embodiments are modified for the embodiments in the above-mentioned embodiments. The differences between the present embodiments and the above-mentioned embodiments will be described below, and the same parts will not be described herein.

[0076] In the present disclosure, as shown in FIG. 1, the first transmission line 310, the second transmission line 320 and the third transmission line 330 can be arranged in the same film layer. Figure 5a The present disclosure provides structure diagrams of some other balun structures. Figure 5bAs shown, a coupling structure 400 can be provided in the third transmission line 330, and the first coupling portion 410 and the second coupling portion 420 in the coupling structure 400 can be disposed in different layers. Exemplarily, the first transmission line 310, the second transmission line 320, and the first coupling portion 410 can be located in the same film layer, with the second coupling portion 420 located on the side of the first coupling portion 410 facing away from the dielectric substrate. Furthermore, the balun structure also includes a second insulating layer 520 located between the second coupling portion 420 and the first coupling portion 410, and the second via GK2 also penetrates the second insulating layer 520. Exemplarily, the second insulating layer 520 can be formed using a dielectric layer. It should be noted that the first coupling portion 410 (including the first branch lines 411, 412) and the first end 330-a of the third transmission line 330 are integral structures disposed in the same layer. Also, the second coupling portion 420 (including the second branch lines 421, 422) and the second end 330-b of the third transmission line 330 are integral structures disposed in the same layer. That is, the first coupling part 410 (including the first branch lines 411, 412) and the first end 330-a of the third transmission line 330 form a film layer, and the second coupling part 420 (including the second branch lines 421, 422) and the second end 330-b of the third transmission line 330 form another film layer, and a second insulating layer 520 is provided between the two film layers.

[0077] This disclosure provides structural schematic diagrams of some other balun structures, such as... Figure 6a and Figure 6b As shown, this embodiment is a variation of the implementation described in the above embodiments. The differences between this embodiment and the above embodiments will be described below, while the similarities will not be repeated.

[0078] In the embodiments disclosed herein, such as Figure 6a and Figure 6bAs shown, the balun structure can further include a third insulating layer 530 covering the first transmission line 310, the second transmission line 320, and the third transmission line 330, and a second ground conductive layer 220 located on the side of the third insulating layer 530 away from the dielectric substrate 100. Moreover, one end of the first branch line (e.g., 411) close to the second coupling portion 420 is electrically connected to the second ground conductive layer 320 through a third via hole GK3, and one end of the second branch line (e.g., 421) close to the first coupling portion 410 is electrically connected to the second ground conductive layer 220 through a fourth via hole GK4. The third via hole GK3 and the fourth via hole GK4 pass through the third insulating layer 530, respectively. In this way, the balun structure can be formed in the form of a stripline. Since the first ground conductive layer 210 and the second ground conductive layer 220 are provided, metal layers are present on both sides of the first transmission line 310, the second transmission line 320, the third transmission line 330, and the coupling structure 400, so that the crosstalk and electromagnetic interference radiation can be small, and the signal transmission can be more stable. Since the second ground conductive layer 220 is provided for grounding, one end of the first branch line (e.g., 411) close to the second coupling portion 420 is electrically connected to the second ground conductive layer 220 through the third via hole GK3. In this way, when the grounding performance of one end of the first branch line (e.g., 411) close to the second coupling portion 420 through the first via hole GK1 is poor, the grounding performance of one end of the first branch line (e.g., 411) close to the second coupling portion 420 through the third via hole GK3 can be ensured. Alternatively, when the grounding performance of one end of the first branch line (e.g., 411) close to the second coupling portion 420 through the third via hole GK3 is poor, the grounding performance of one end of the first branch line (e.g., 411) close to the second coupling portion 420 through the first via hole GK1 can be ensured. Moreover, one end of the second branch line (e.g., 421) close to the first coupling portion 410 is electrically connected to the second ground conductive layer 220 through the fourth via hole GK4. In this way, when the grounding performance of one end of the second branch line (e.g., 421) close to the first coupling portion 410 through the second via hole GK2 is poor, the grounding performance of one end of the second branch line (e.g., 421) close to the first coupling portion 410 through the fourth via hole GK4 can be ensured. Alternatively, when the grounding performance of one end of the second branch line (e.g., 421) close to the first coupling portion 410 through the second via hole GK2 is poor, the grounding performance of one end of the second branch line (e.g., 421) close to the first coupling portion 410 through the fourth via hole GK4 can be ensured.

[0079] It should be noted that the third insulating layer 530 can cover the first transmission line 310, the second transmission line 320, the first end 330-a and the second end 330-b of the third transmission line 330, and the coupling structure 400.

[0080] In the embodiments of the present disclosure, a layer of metal material (for example, Cu, Ag, Au, Al, etc.) can be plated on the sidewalls of the third via hole and the fourth via hole, or the metal material (for example, Cu, Ag, Au, Al, etc.) can be filled in the third via hole and the fourth via hole first, and then the first bifurcated line is connected with the metal material filled in the third via hole, and the second bifurcated line is connected with the metal material filled in the fourth via hole.

[0081] In the embodiments of the present disclosure, as shown in Figure 7 When the balun structure further includes the first insulating layer 510, the fourth via hole GK4 also penetrates the first insulating layer 510.

[0082] In the embodiments of the present disclosure, as shown in Figure 8 When the balun structure further includes the second insulating layer 520, the third via hole GK3 also penetrates the second insulating layer 520.

[0083] The embodiments of the present disclosure provide structure diagrams of still other balun structures, as shown in Figure 9 which are transformed for the implementation manners in the above embodiments. Only the differences between the present embodiments and the above embodiments will be described below, and the same parts will not be described herein.

[0084] In the embodiments of the present disclosure, as shown in Figure 9 The first end and the second end of the second transmission line 320 can be connected in series with the coupling structure 400. Exemplarily, the coupling structure can be one, two, three or more, which can be determined according to the actual application requirements, and is not limited herein. It should be noted that the implementation manner of the coupling structure arranged between the first end and the second end of the second transmission line 320 can be basically the same as the implementation manner of the coupling structure arranged between the first end and the second end of the third transmission line 330, and will not be described herein.

[0085] In the embodiments of the present disclosure, as shown in Figure 9 The first end and the second end of the first transmission line 310 can also be connected in series with the coupling structure 400. Exemplarily, the coupling structure can be one, two, three or more, which can be determined according to the actual application requirements, and is not limited herein. It should be noted that the implementation manner of the coupling structure arranged between the first end and the second end of the first transmission line 310 can be basically the same as the implementation manner of the coupling structure arranged between the first end and the second end of the third transmission line 330, and will not be described herein.

[0086] The present disclosure provides structure diagrams of some other balun structures, such as Figure 10a As shown in Figure 10b , which is deformed for the implementation in the above embodiment. Only the differences between the present embodiment and the above embodiment are described below, and the same parts are not described here.

[0087] Exemplarily, as shown in Figure 10a , in the same coupling structure 400, the first coupling part 410 has two first bifurcated lines (such as 411, 412) facing one end of the second coupling part 420, and the second coupling part 420 has one second bifurcated line (such as 421) facing one end of the first coupling part 410. In addition, in the same coupling structure 400, the first bifurcated lines (such as 411, 412) are electrically connected to the first ground conductive layer 210 through the first through hole GK1 near one end of the second coupling part 420, and the second bifurcated line (such as 421) is electrically connected to the first ground conductive layer 210 through the second through hole GK2 near one end of the first coupling part 410. In addition, in the same coupling structure 400, the first bifurcated line of the first coupling part 410 and the second bifurcated line of the second coupling part 420 are coupled and connected. For example, the second bifurcated line 421 and the first bifurcated lines 411, 412 have a gap and are coupled and connected. In this way, the signal transmitted to the first bifurcated lines (such as 411, 412) can be transmitted to the second bifurcated line (such as 421) through the coupling effect, and then transmitted to the connected device through the second end 330-b of the third transmission line 330. Alternatively, the signal transmitted to the second bifurcated line (such as 421) can be transmitted to the first bifurcated lines (such as 411, 412) through the coupling effect, and then transmitted to the device connected to the first transmission line 310 through the first end 330-a of the third transmission line 330.

[0088] Exemplarily, as shown in Figure 10bAs shown, in the same coupling structure 400, the first coupling part 410 has a first branch line (e.g. 411) at one end facing the second coupling part 420, and the second coupling part 420 has a second branch line (e.g. 421) at one end facing the first coupling part 410. In the same coupling structure 400, the first branch line (e.g. 411) is electrically connected to the first ground conductive layer 210 through a first via hole GK1 near one end of the second coupling part 420, and the second branch line (e.g. 421) is electrically connected to the first ground conductive layer 210 through a second via hole GK2 near one end of the first coupling part 410. In the same coupling structure 400, the first branch line of the first coupling part 410 and the second branch line of the second coupling part 420 are coupled. For example, the second branch line 421 and the first branch line 411 have a gap and are coupled. In this way, the signal transmitted to the first branch line (e.g. 411) can be transmitted to the second branch line (e.g. 421) through coupling, and then transmitted to the connected device through the second end 330-b of the third transmission line 330. Alternatively, the signal transmitted to the second branch line (e.g. 421) can be transmitted to the first branch line (e.g. 411) through coupling, and then transmitted to the device connected to the first transmission line 310 through the first end 330-a of the third transmission line 330.

[0089] It should be noted that in actual application, the number of the first branch lines in the first coupling part can be 3, 4, etc., which can be determined according to the actual application requirements, and is not limited herein.

[0090] It should be noted that in actual application, the number of the second branch lines in the second coupling part can be 3, 4, etc., which can be determined according to the actual application requirements, and is not limited herein.

[0091] The embodiments of the present disclosure also provide an electronic device including any of the above balun structures. The principle of solving problems of the electronic device is similar to the above balun structure, and therefore the implementation of the electronic device can be referred to the implementation of the above balun structure, and the repeated parts will not be described herein.

[0092] In the embodiments of the present disclosure, the electronic device can be, for example, a communication base station product, a mobile product, and a product of other structures provided with a chip, a balanced antenna, or the like, which is not limited herein.

[0093] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make additional changes and modifications to the embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted as including all changes and modifications falling within the scope of the present disclosure.

[0094] It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, it is intended that such changes and modifications be included within the scope of the present disclosure.

Claims

1. A balun structure, comprising: a dielectric substrate; a first ground conductive layer on one side of the dielectric substrate; a first transmission line on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the first transmission line is electrically connected to an unbalanced signal port; a second transmission line on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the second transmission line is electrically connected to a second end of the first transmission line, and a second end of the second transmission line is electrically connected to a first balanced signal port; a third transmission line on the side of the dielectric substrate away from the first ground conductive layer; wherein a first end of the third transmission line is electrically connected to the second end of the first transmission line, and a second end of the third transmission line is electrically connected to a second balanced signal port; wherein at least one coupling structure is connected in series between the first end and the second end of the third transmission line; the coupling structure comprises a first coupling part and a second coupling part; wherein in the same coupling structure, the first coupling part has at least one first bifurcated line at one end facing the second coupling part, and the second coupling part has at least one second bifurcated line at one end facing the first coupling part; and in the same coupling structure, one end of the first bifurcated line close to the second coupling part is electrically connected to the first ground conductive layer through a first via hole, and one end of the second bifurcated line close to the first coupling part is electrically connected to the first ground conductive layer through a second via hole; and the first bifurcated line of the first coupling part and the second bifurcated line of the second coupling part are coupled in the same coupling structure. In the same coupling structure, the first bifurcated line and the second bifurcated line are alternately and spacedly arranged in the orthographic projection of the dielectric substrate. The first coupling part and the second coupling part in the coupling structure are arranged in the same layer. The first transmission line, the second transmission line, the third transmission line and each coupling structure are arranged in the same film layer. The first coupling part and the second coupling part in at least one coupling structure are arranged in different layers. The first transmission line, the second transmission line and the first coupling part are arranged in the same film layer; the second coupling part is arranged between the first coupling part and the dielectric substrate; the balun structure further comprises: a first insulating layer arranged between the second coupling part and the first coupling part; and the first via hole further penetrates the first insulating layer. The first transmission line, the second transmission line and the first coupling part are arranged in the same film layer; the second coupling part is arranged on the side of the first coupling part away from the dielectric substrate; the balun structure further comprises: a second insulating layer arranged between the second coupling part and the first coupling part; and the second via hole further penetrates the second insulating layer. The balun structure further comprises: a third insulating layer covering the first transmission line, the second transmission line and the third transmission line; a second ground conductive layer on the side of the third insulating layer away from the dielectric substrate. ​ ​ ​ ​ ​ ​ ​ 2. The balun structure of claim 1, wherein, ​ 3. The balun structure of claim 2, wherein, ​ 4. The balun structure of claim 3, wherein, ​ 5. The balun structure of claim 2, wherein, ​ 6. The balun structure of claim 5, wherein, ​ ​ ​ ​ ​ 7. The balun structure of claim 5, wherein, ​ ​ ​ ​ ​ 8. The balun structure of any of claims 1-7, wherein, ​ ​ ​ The first branch line is electrically connected with the second ground conductive layer through a third via hole at one end close to the second coupling part, and the second branch line is electrically connected with the second ground conductive layer through a fourth via hole at one end close to the first coupling part; the third via hole and the fourth via hole respectively pass through the third insulating layer.

9. The balun structure of claim 8, wherein, When the balun structure further comprises a first insulating layer, the fourth via hole further passes through the first insulating layer. When the balun structure further comprises a second insulating layer, the third via hole further passes through the second insulating layer.

10. The balun structure of claim 1, wherein, The first end and the second end of at least one of the first transmission line and the second transmission line are connected in series with at least one coupling structure.

11. The balun structure of claim 1, wherein, In the same coupling structure, the first branch line and the second branch line have a shape of a straight line, a bent line, a wavy line or a curved line in the orthographic projection of the dielectric substrate.

12. The balun structure of claim 1, wherein, The balun structure further comprises: At least one resistor electrically connected between the second end of the second transmission line and the second end of the third transmission line.

13. An electronic device, comprising: A balun structure as claimed in any one of claims 1 to 12.

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