An automatic powder scraping device for a glass passivation process for producing semiconductor devices

Abstract

The application discloses a kind of for producing semiconductor device glass passivation process automatic powder scraping device, including powder scraping table, the bottom of the powder scraping table is equipped with the support column one of uniform arrangement, the bottom of the support column one is equipped with the object plate one, the top of the object plate one is equipped with servo motor one;The output end of the servo motor one is equipped with connecting column, the top of two groups of the support column two is equipped with hydraulic push rod one, the output end of two groups of the hydraulic push rod one is equipped with storage box and is installed in the bottom of top plate. The application is provided with powder scraping table, servo motor one, top plate and storage box, when using the automatic powder scraping device, according to the needs of starting servo motor one, so that connecting column can drive top plate to rotate, then the position of two groups of storage box can be exchanged, so that the powder scraping device can be different powder scraping operation to semiconductor device glass according to actual needs, so as to improve the flexibility when using the powder scraping device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to an automatic powder scraping device for the glass passivation process in the production of semiconductor devices. Background Technology

[0002] Passivation is a process of covering the surface of semiconductor devices with a protective dielectric film to prevent surface contamination and improve the stability of semiconductor chip. However, the automatic powder scraping devices used in the passivation process of existing semiconductor device glass have relatively simple functions and are not convenient to be flexibly changed according to the needs of use, which has certain defects.

[0003] The existing automatic powder scraping devices have the following drawbacks:

[0004] 1. A patent document provides an electrolytic copper powder processing device, including an electrolytic cell and a cathode plate located in the electrolytic cell, wherein: it further includes a water jet assembly that moves up and down along the cathode plate, the water jet assembly includes a nozzle and a delivery pipe, the nozzle is connected to the outlet of the delivery pipe, the outlet end of the nozzle is a flat end, and the nozzle is set at an angle to the cathode plate. However, the electrolytic copper powder processing device in the above-disclosed document mainly considers how to improve the effect of automatic powder scraping when in use, and does not consider the problem that the existing automatic powder scraping device cannot flexibly change direction when in use, resulting in poor flexibility;

[0005] 2. A patent document relates to a powder scraping device, which includes a rotating component and at least two scraper assemblies connected to the rotating component. At least one scraper assembly includes a scraper, configured such that the scraping area formed by one rotation of the rotating component exactly covers the surface to be scraped. Each scraper assembly includes several guide plates, with an acute angle between each guide plate and the rotation direction of the rotating component. The combined scraping area formed by the guide plates rotating one rotation of the rotating component exactly covers the surface to be scraped. The guide plates and scrapers work together to effectively prevent powder from accumulating and falling off to the periphery under centrifugal force, ensuring uniform powder loading and avoiding powder waste. However, the powder scraping device in the aforementioned disclosure mainly considers how to improve the uniformity of powder loading and does not take into account that existing automatic powder scraping devices lack protective devices, which can easily damage the glass of semiconductor devices during the scraping process.

[0006] 3. A patent document discloses a powder spreading and scraping device, including a base plate, a vertical plate vertically connected to the upper surface of the base plate, an opening on the side wall of the vertical plate with a movable plate matched within the opening, a driving structure for driving the movable plate to move on the vertical plate, a mounting plate on the lower side of the movable plate, an adjustment structure for driving the mounting plate to move up and down on the upper surface of the movable plate, a connecting body connected to the lower surface of the mounting plate, and a set of scrapers longitudinally connected to the lower surface of the connecting body. This patent, through a connecting body made of soft material and scrapers divided into multiple modules, can combine the advantages of soft and hard scrapers, improving the powder scraping effect and increasing the printing success rate. However, the powder spreading and scraping device in the above-disclosed document mainly considers how to improve the powder scraping effect when in use, without considering that existing automatic powder scraping devices cannot clean up residual powder during use, thus affecting the passivation effect of the glass.

[0007] 4. A patent document discloses a vacuum pump dust scraping device, which includes at least one screw and at least one boss dust scraping component. The screw includes a screw body and helical teeth. The screw body is inserted into a gear end plate. The helical teeth are connected to the screw body and extend outward along the radial direction of the screw body. The helical teeth have grooves on their end faces facing the gear end plate. The boss dust scraping component is detachably connected to the grooves and protrudes from the end faces of the helical teeth to scrape dust off the gear end plate. During the rotation of the screw, the boss dust scraping component will rotate, efficiently removing a large amount of dust accumulated on the end face of the gear end plate, thereby improving the service life of the vacuum pump and effectively reducing the failure rate. It does not affect the radial sealing of the screw, and the vacuum level is guaranteed. However, the vacuum pump dust scraping device in the above-disclosed document mainly considers how to avoid the impact of dust on the vacuum pump and reduce the failure rate, but does not consider the problem that existing automatic dust scraping devices do not have a limiting structure during use, resulting in poor practicality. Summary of the Invention

[0008] The purpose of this invention is to provide an automatic powder scraping device for the glass passivation process in the production of semiconductor devices, so as to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an automatic powder scraping device for glass passivation process in semiconductor device production, comprising a powder scraping table, wherein a uniformly arranged support column is installed at the bottom of the powder scraping table, a placement plate is installed at the bottom of the support column, and a servo motor is installed at the top of the placement plate.

[0010] The output end of the servo motor 1 is connected to a connecting column through the top of the powder scraping table. The top of the connecting column is equipped with symmetrically and evenly arranged support columns 2. The top of each of the two sets of support columns 2 is equipped with a hydraulic push rod 1. The output end of each of the two sets of hydraulic push rod 1 is connected to a storage box through the bottom of the top plate, and the storage box is located above the powder scraping table.

[0011] The two sets of storage boxes are located on both sides of the connecting column.

[0012] Preferably, a servo motor 2 is installed on the rear wall of both sets of storage boxes, and a reciprocating lead screw is installed at the output end of both sets of servo motor 2. One end of each set of reciprocating lead screws is connected to the front wall of the storage box through a shaft. A sliding sleeve is fitted on the outer surface of each set of reciprocating lead screws, and the cross-section of the sliding sleeve is a "T" shaped structure. A sliding groove is provided through the bottom of both sets of storage boxes. A connecting block is installed inside the sliding groove through the outer surface of one set of sliding sleeves. Insertion holes are provided at the four corners of the bottom of the connecting block. A scraper is installed at the center of the bottom of the connecting block. An insertion rod is fitted inside the insertion hole. A rubber sleeve is installed at the bottom end of the insertion rod, and the rubber sleeve is fitted with the scraper.

[0013] Preferably, a connecting box is installed inside the sliding groove through the outer surface of another set of sliding sleeves, and the top of the connecting box is in contact with the bottom of another set of storage boxes. Storage frames are slidably installed on both outer walls of the connecting box. A symmetrically arranged vacuum cleaner fan is installed on the top wall of the connecting box. A conveying pipe is installed at the output end of the vacuum cleaner fan, and a connecting pipe is installed at the input end of the vacuum cleaner fan. A symmetrically arranged connecting pipe is installed on the bottom wall of the connecting box, and the connecting pipe is located below the vacuum cleaner fan. A uniformly symmetrically arranged vacuum head is embedded in the bottom of the connecting box. A branch pipe is installed on the top of the vacuum head, and the top end of the branch pipe is connected to the outer surface of the connecting pipe. A soft brush is installed at the bottom of the connecting box, and the soft brush is wrapped around the vacuum head.

[0014] Preferably, the bottom of the powder scraping table is equipped with shallowly arranged support columns three, the bottom of each of the two sets of support columns three is equipped with a shelf two, the top of each of the two sets of shelf two is equipped with a hydraulic push rod two, the output end of each of the two sets of hydraulic push rod two is equipped with a bearing plate, the top of the bearing plate is equipped with symmetrically arranged connecting rods, the top of each of the two sets of connecting rods is embedded with an electromagnet, the top of the powder scraping table is equipped with a silicone pad, the top of the silicone pad is equipped with a connecting plate, the top of the bearing plate is equipped with a limit rod, and the bottom of the powder scraping table, the connecting plate and the silicone pad are all provided with three sets of equidistantly arranged slots, and the bottom of the connecting plate is equipped with symmetrically arranged iron plates.

[0015] Preferably, the top plate is larger than the powder scraping table. When the servo motor rotates, it drives the connecting column to rotate, so that the two sets of storage boxes can be swapped.

[0016] The scraper is located inside the socket. The scraper has a triangular cross-section. The top of the connecting block fits into the bottom of one of the storage boxes. The length of the connecting block is equal to the length of the storage box.

[0017] One end of the connecting pipe is connected to the inner surface of the connecting pipe. The surfaces of the two sets of storage frames that are close to each other are provided with slots. One end of the conveying pipe is fitted into the slots, and the connecting pipe is located in the middle of the two sets of storage frames.

[0018] The second shelf is located on one side of the first shelf. The limiting rod is fitted with the middle set of slots. The two sets of connecting rods are located inside the other two sets of slots. The iron sheet is located inside the other two sets of slots. The top of the electromagnet is attached to the bottom of the iron sheet. The bearing plate is located inside the third support column.

[0019] Preferably, the tops of both sets of storage frames are semi-open structures, a storage groove is provided on one outer wall of the storage frame, a partition is slidably installed inside the storage groove, a protrusion is installed on one outer wall of the partition, a groove is provided on one inner wall of the storage frame, and the groove and the protrusion are fitted together, and a lever is installed on the top of the partition.

[0020] Preferably, the top of the powder scraping table is equipped with symmetrically arranged baffles, and the baffles are located on one side of the connecting column. The two sets of baffles are located on both sides of the connecting plate, and the distance between the two sets of baffles is greater than the length of the storage box.

[0021] Preferably, the automatic powder scraping device is used as follows:

[0022] S1. Before using the automatic powder scraping device, first place the semiconductor device glass on the powder scraping table as needed, then start the hydraulic push rod on the second plate, which will then drive the support plate to move upward, so that the connecting rod can be inserted into the slot.

[0023] S2. Then start one set of hydraulic push rods, which will push one set of storage boxes downward until the rubber sleeve can contact the surface of the semiconductor device glass. Then start the servo motor 2 in the storage box, which will drive the reciprocating screw connected to it to rotate, so that the sliding sleeve can drive the connecting block to move in the vertical direction, and then the surface of the semiconductor device glass can be scraped.

[0024] S3. After the powder is scraped off, start the servo motor on the first shelf. Then, under the action of the connecting column, the top plate will rotate until the positions of the two sets of storage boxes are changed.

[0025] S4. After swapping the positions of the two sets of storage boxes, start the second servo motor in the other set of storage boxes, which drives the reciprocating screw connected to it to rotate, so that the sliding sleeve can drive the connecting box to move in the vertical direction, so that the soft brush can clean the surface of the semiconductor device glass.

[0026] Preferably, step S1 further includes the following steps:

[0027] S11. Next, energize the electromagnet and place the connecting plate with the silicone pad on the powder scraping table so that the electromagnet and the iron plate are attracted. Then, the silicone pad can limit the position of the semiconductor device glass placed on the powder scraping table.

[0028] Step S2 further includes the following steps:

[0029] S21. Before using the scraper, the rubber sleeve can be removed from the scraper as needed, so that the insert rod is no longer engaged with the insertion hole, and other rubber sleeves can be replaced as needed, thereby reducing the probability of the scraper scratching the glass surface after it comes into direct contact with the semiconductor device glass to a certain extent.

[0030] Step S4 further includes the following steps:

[0031] S41. During the cleaning process, start the vacuum fan in the connection box so that the vacuum head can suck the residual powder on the semiconductor device glass into the inside of the connecting tube. Then, the residual powder is transported into the inside of the storage box through the connecting tube and the conveying tube. When processing the residual powder later, pull the storage box outward so that the conveying tube is no longer engaged with the slot. Then, move the lever to drive the partition to retract into the inside of the storage slot. Then the residual powder can be poured out from the storage box.

[0032] Compared with the prior art, the beneficial effects of the present invention are:

[0033] 1. This invention comprises a powder scraping platform, a storage plate, a servo motor, a top plate, a support column, a hydraulic push rod, and storage boxes. When using this automatic powder scraping device, the servo motor on the storage plate is activated as needed, which in turn drives the connecting column to rotate, thereby causing the top plate to rotate. This allows the positions of the two sets of storage boxes to be interchanged, enabling the powder scraping device to perform different powder scraping operations on semiconductor device glass according to actual needs, thus improving the flexibility of the powder scraping device in use to a certain extent.

[0034] 2. This invention comprises a servo motor, a reciprocating lead screw, a slide groove, a sliding sleeve, a connecting block, a scraper, a socket, a rod, and a rubber sleeve. Before using the powder scraping device, the rubber sleeve is first fixed to the surface of the scraper by the engagement of the rod and the socket, allowing the rubber sleeve to cover the scraper and thus providing a certain degree of protection. During subsequent use, the servo motor can be started to drive the reciprocating lead screw to rotate, causing the sliding sleeve to move the connecting block vertically. Then, the rubber sleeve can be used to scrape powder from the semiconductor device glass, thereby reducing the probability of scratching the glass to a certain extent.

[0035] 3. This invention, by installing a connecting box, storage frame, vacuum fan, connecting pipe, vacuum head, connecting pipe, conveying pipe, and soft brush, allows the vacuum fan to be activated as needed during the powder scraping process. The vacuum head then sucks the remaining powder cleaned by the soft brush into the connecting pipe, and then sends it into the storage frame through the connecting pipe and conveying pipe, thereby improving the efficiency and quality of powder scraping to a certain extent.

[0036] 4. This invention comprises a support column three, a placement plate two, a hydraulic push rod two, a connecting rod, a limiting rod, a connecting plate, an iron sheet, a silicone pad, and an electromagnet. Before using the automatic powder scraping device, the electromagnet is first energized so that it can attract the iron sheet in the slot. Then, the connecting plate can be fixed on the connecting rod and the limiting rod. In subsequent use, the hydraulic push rod two on the placement plate two is first activated. Then, under the action of the support plate, the connecting rod is moved downward, so that the bottom of the silicone pad can fit against the top of the semiconductor device glass, thereby playing a certain limiting role and improving the stability of the semiconductor device glass during the subsequent powder scraping process. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0038] Figure 2 This is a schematic diagram of the assembly structure of the rubber sleeve of the present invention;

[0039] Figure 3 This is a schematic diagram of the assembly structure of the silicone pad of the present invention;

[0040] Figure 4 This is a schematic diagram of the assembly structure of the storage box of the present invention;

[0041] Figure 5 This is a schematic diagram of the planar assembly structure of the silicone pad of the present invention;

[0042] Figure 6 This is a schematic diagram of the planar assembly structure of the connecting box of the present invention;

[0043] Figure 7 This is a schematic diagram of the planar assembly structure of the servo motor II and the reciprocating lead screw of the present invention;

[0044] Figure 8 This is a schematic diagram of the assembly structure of the connecting plate and the silicone pad of the present invention;

[0045] Figure 9 This is a flowchart of the process of the present invention.

[0046] In the diagram: 1. Powder scraper; 2. Support column 1; 3. Shelf 1; 4. Servo motor 1; 5. Connecting column; 6. Top plate; 7. Support column 2; 8. Hydraulic push rod 1; 9. Storage box; 10. Servo motor 2; 11. Reciprocating screw; 12. Slide groove; 13. Sliding sleeve; 14. Connecting block; 15. Scraper; 16. Insertion hole; 17. Insert rod; 18. Rubber sleeve; 19. Connecting box; 20. Storage Frame; 21. Vacuum blower; 22. Connecting pipe; 23. Vacuum head; 24. Connecting pipe; 25. Conveying pipe; 26. Soft brush; 27. Storage slot; 28. Partition; 29. ​​Support column three; 30. Storage plate two; 31. Hydraulic push rod two; 32. Connecting rod; 33. Limiting rod; 34. Slot; 35. Connecting plate; 36. Iron sheet; 37. Silicone pad; 38. Baffle; 39. Electromagnet. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] Please see Figure 1 , Figure 4 and Figure 9An embodiment of the present invention provides an automatic powder scraping device for glass passivation process in semiconductor device production, comprising a powder scraping table 1 and a storage box 9. The bottom of the powder scraping table 1 is equipped with uniformly arranged support columns 2. The bottom of the support columns 2 is equipped with a shelf 3. The top of the shelf 3 is equipped with a servo motor 4. The output end of the servo motor 4 passes through the top of the powder scraping table 1 and is connected to a connecting column 5. The top of the connecting column 5 is equipped with symmetrically arranged support columns 7. The tops of both sets of support columns 7 are equipped with hydraulic push rods 8. The output ends of both sets of hydraulic push rods 8 pass through the bottom of a top plate 6 and are connected to storage boxes 9. The storage boxes 9 are located above the powder scraping table 1, and the two sets of storage boxes 9 are located on both sides of the connecting column 5. The size of the top plate 6 is larger than the size of the powder scraping table 1. The rotation of the servo motor 4 drives the connecting column 5 to rotate, allowing the two sets of storage boxes 9 to be interchanged.

[0051] Furthermore, when using this automatic powder scraping device, the semiconductor device glass to be scraped is first placed on the powder scraping table 1 and the semiconductor device glass is limited. Then, the hydraulic push rod 8 on the top plate 6 is activated, thereby driving the corresponding storage box 9 to move downward, so that the storage box 9 can be located in the middle of the two sets of baffles 38. When it is necessary to clean the residual powder on the surface of the semiconductor device glass, the servo motor 4 on the placement plate 3 is activated, which can then drive the connecting column 5 to rotate, so that the connecting column 5 can drive the top plate 6 to rotate, and then the positions of the two sets of storage boxes 9 can be changed, thereby improving the flexibility of the automatic powder scraping device to a certain extent.

[0052] Please see Figure 2 and Figure 7 This invention provides an embodiment of an automatic powder scraping device for glass passivation processes in semiconductor device manufacturing. The device includes a servo motor 10 and a rubber sleeve 18. The rear walls of two sets of storage boxes 9 are each equipped with a servo motor 10. The output ends of both servo motors 10 are equipped with reciprocating lead screws 11. One end of each reciprocating lead screw 11 is connected to the front wall of the storage box 9 via a shaft. The outer surfaces of both reciprocating lead screws 11 are fitted with sliding sleeves 13, the cross-section of which is T-shaped. The bottoms of both storage boxes 9 are provided with through-grooves 12. A set of sliding sleeves 13 has a connecting block 14 installed inside the sliding groove 12 through the outer surface of the sliding sleeve 13. The four corners of the bottom of the connecting block 14 are provided with insertion holes 16. A scraper 15 is installed at the center of the bottom of the connecting block 14. An insertion rod 17 is fitted inside the insertion hole 16. A rubber sleeve 18 is installed at the bottom end of the insertion rod 17 and the rubber sleeve 18 is fitted with the scraper 15. The scraper 15 is located inside the insertion hole 16 and has a triangular cross-section. The top of the connecting block 14 is in contact with the bottom of one of the storage boxes 9. The length of the connecting block 14 is equal to the length of the storage box 9.

[0053] Furthermore, before using the automatic powder scraping device, the rubber sleeve 18 is first fitted onto the surface of the scraper 15 by the engagement of the insert rod 17 and the insertion hole 16. Then, when in use, the servo motor 10 in the storage box 9 is started, which drives the reciprocating screw 11 to rotate, so that the sliding sleeve 13 can move in the sliding groove 12. Then, the connecting block 14 can be driven to move in the vertical direction, and then the rubber sleeve 18 can be used to scrape the powder on the semiconductor device glass, thereby reducing the probability of the scraper 15 scratching the glass surface to a certain extent.

[0054] Please see Figure 6 This invention provides an embodiment of an automatic powder scraping device for glass passivation processes in semiconductor device manufacturing. The device includes a connecting box 19 and a partition 28. The connecting box 19 is installed inside a sliding groove 12 through the outer surface of another set of sliding sleeves 13. The top of the connecting box 19 is flush with the bottom of another set of storage boxes 9. Storage frames 20 are slidably installed on both outer walls of the connecting box 19. Symmetrically arranged dust collectors 21 are installed on the top wall of the connecting box 19. A conveying pipe 25 is installed at the output end of each dust collector 21, and a connecting pipe 24 is installed at the input end. Symmetrically arranged connecting pipes 22 are installed on the bottom wall of the connecting box 19, with the connecting pipes 22 located below the dust collectors 21. Uniformly and symmetrically arranged dust collection heads 23 are embedded in the bottom of the connecting box 19. A branch pipe is installed on the top of the dust head 23, and the top of the branch pipe is connected to the outer surface of the connecting pipe 22. A soft brush 26 is installed at the bottom of the connecting box 19, and the soft brush 26 is wrapped around the dust head 23. One end of the connecting pipe 24 is connected to the inner surface of the connecting pipe 22. The surfaces of the two sets of storage frames 20 that are close to each other are provided with slots. One end of the conveying pipe 25 is fitted into the slot. The connecting pipe 22 is located in the middle of the two sets of storage frames 20. The tops of the two sets of storage frames 20 are semi-open structures. A storage groove 27 is provided on one outer wall of the storage frame 20. A partition 28 is slidably installed inside the storage groove 27. A protrusion is installed on one outer wall of the partition 28. A groove is provided on one inner wall of the storage frame 20, and the groove fits into the protrusion. A lever is installed on the top of the partition 28.

[0055] Furthermore, when using this automatic powder scraping device, firstly, the lever is turned as needed to pull the partition 28 out of the storage slot 27 until the protrusion can fit into the groove, thereby playing a certain protective role and reducing the probability of residual powder splashing outward. Then, the storage frame 20 is inserted into the connection box 19, and the vacuum fan 21 is started during the subsequent use of the connection box 19. Then, the residual powder swept by the soft brush 26 can be sucked into the connection tube 22 through the vacuum head 23, and then transported to the inside of the conveying tube 25 after passing through the connecting tube 24, and finally discharged into the inside of the storage frame 20, thereby improving the functionality and powder scraping effect of the automatic powder scraping device to a certain extent.

[0056] Please see Figure 3 , Figure 5 and Figure 8 An embodiment of the present invention provides an automatic powder scraping device for the glass passivation process of semiconductor devices, comprising support columns 29 and electromagnets 39. The bottom of the powder scraping table 1 is equipped with shallowly arranged support columns 29. Each set of support columns 29 has a placement plate 30 at its bottom end, and each set of placement plates 30 has a hydraulic push rod 31 at its top. Each set of hydraulic push rods 31 has a bearing plate at its output end. Symmetrically arranged connecting rods 32 are installed on the top of the bearing plates. Electromagnets 39 are embedded in the top of each set of connecting rods 32. A silicone pad 37 is placed on the top of the powder scraping table 1, and a connecting plate 35 is installed on the top of the silicone pad 37. A limit rod 33 is installed on the top of the bearing plate. The powder scraping table 1… The bottom of the connecting plate 35 and the silicone pad 37 are both provided with three sets of equally spaced slots 34. The bottom of the connecting plate 35 is equipped with symmetrically arranged iron plates 36. The second shelf 30 is located on one side of the first shelf 3. The limiting rod 33 is fitted with the middle set of slots 34. The two sets of connecting rods 32 are located inside the other two sets of slots 34. The iron plates 36 are located inside the other two sets of slots 34. The top of the electromagnet 39 is attached to the bottom of the iron plate 36. The bearing plate is located inside the third support column 29. The top of the powder scraping table 1 is equipped with symmetrically arranged baffles 38, and the baffles 38 are located on one side of the connecting column 5. The two sets of baffles 38 are located on both sides of the connecting plate 35. The distance between the two sets of baffles 38 is greater than the length of the storage box 9.

[0057] Furthermore, before using the automatic powder scraping device, the connecting plate 35 is first fitted onto the surface of the connecting rod 32 according to the usage requirements, so that the limiting rod 33 can be engaged with the middle slot 34. Then, the electromagnet 39 is energized so that the electromagnet 39 can be attracted to the iron sheet 36. Then the connecting plate 35 can be fixed on the connecting rod 32. In subsequent use, the hydraulic push rod 31 on the second placement plate 30 is activated, which can then drive the bearing plate to move downward. Then, under the pull of the connecting rod 32, the silicone pad 37 can limit the semiconductor device glass placed between the two sets of baffles 38, thereby improving the stability of the semiconductor device glass to a certain extent during subsequent powder scraping.

[0058] Furthermore, the method of using this automatic powder scraping device is as follows:

[0059] S1. Before using the automatic powder scraping device, first place the semiconductor device glass on the powder scraping table 1 as needed, then start the hydraulic push rod 31 on the second placement plate 30, which will then drive the support plate to move upward, so that the connecting rod 32 can be inserted into the slot 34.

[0060] S2. Then start one of the hydraulic push rods 8, which will push one of the storage boxes 9 downward until the rubber sleeve 18 can contact the surface of the semiconductor device glass. Then start the servo motor 10 in the storage box 9, which will drive the reciprocating screw 11 connected to it to rotate, so that the sliding sleeve 13 can drive the connecting block 14 to move in the vertical direction, and then the surface of the semiconductor device glass can be scraped.

[0061] S3. After the powder is scraped off, start the servo motor 4 on the storage plate 3. Then, under the action of the connecting column 5, the top plate 6 will rotate until the positions of the two sets of storage boxes 9 are changed.

[0062] S4. After swapping the positions of the two sets of storage boxes 9, start the servo motor 10 in the other set of storage boxes 9, which drives the reciprocating screw 11 connected to it to rotate, so that the sliding sleeve 13 can drive the connecting box 19 to move in the vertical direction, so that the soft brush 26 can clean the surface of the semiconductor device glass.

[0063] Step S1 also includes the following steps:

[0064] S11. Next, energize the electromagnet 39, and then place the connecting plate 35 with the silicone pad 37 on the powder scraping table 1 so that the electromagnet 39 and the iron plate 36 are attracted together. Then, the silicone pad 37 can be used to limit the semiconductor device glass placed on the powder scraping table 1.

[0065] Step S2 also includes the following steps:

[0066] S21. Before using the scraper, the rubber sleeve 18 can be removed from the scraper 15 as needed, so that the insertion rod 17 is no longer engaged with the insertion hole 16, and other rubber sleeves 18 can be replaced as needed, thereby reducing the probability of the scraper 15 scratching the glass surface after it comes into direct contact with the semiconductor device glass to a certain extent.

[0067] Step S4 also includes the following steps:

[0068] S41. During the cleaning process, start the vacuum fan 21 in the connecting box 19 so that the vacuum head 23 can suck the residual powder on the semiconductor device glass into the interior of the connecting tube 22. Then, the residual powder is transported into the interior of the storage frame 20 through the connecting tube 24 and the conveying tube 25. When processing the residual powder, pull the storage frame 20 outward so that the conveying tube 25 is no longer engaged with the slot. Then, move the lever to drive the partition 28 to retract into the interior of the storage slot 27. Then the residual powder can be poured out of the storage frame 20.

[0069] Working principle: Before using the automatic scraping powder device, first place the semiconductor device glass on the scraping table 1 as needed, and limit the semiconductor device glass placed on the scraping table 1 by the silicone pad 37. Then, start one set of hydraulic push rods 8, which can push one set of storage boxes 9 to move downward until the rubber sleeve 18 can contact the surface of the semiconductor device glass. Then, start the servo motor 10 in the storage box 9, which drives the reciprocating screw 11 to rotate, so that the connecting block 14 can drive the rubber sleeve 18 on the surface of the scraper 15 to perform a scraping powder operation on the surface of the semiconductor device glass.

[0070] After the powder scraping is completed, servo motor 4 is started to drive the top plate 6 to rotate. After the positions of the two sets of storage boxes 9 are changed, another set of hydraulic push rods 8 and another set of servo motors 10 in the storage box 9 are started to drive the connecting box 19 to move downward and drive the reciprocating screw 11 to rotate. After the reciprocating screw 11 rotates, it can drive the soft brush 26 to clean the surface of the semiconductor device glass. At the same time, the vacuum fan 21 is started so that the vacuum head 23 can suck the remaining powder on the semiconductor device glass into the interior of the connecting tube 22, and then transport it into the interior of the storage frame 20 through the conveying tube 25. This can improve the practicality and flexibility of the powder scraping device to a certain extent.

[0071] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A device for automatic powder scraping in a glass passivation process for producing semiconductor devices, comprising a powder scraping station (1), characterized in that: The bottom of the powder scraping table (1) is provided with uniformly arranged support columns (2), the bottom of the support columns (2) is provided with a storage plate (3), and the top of the storage plate (3) is provided with a servo motor (4); The output end of the servo motor (4) is provided with a connecting column (5) penetrating through the top of the powder scraping table (1), the top of the connecting column (5) is provided with symmetrically and uniformly arranged support columns (7), the top of the two groups of support columns (7) is provided with hydraulic push rods (8), the output end of the two groups of hydraulic push rods (8) is provided with storage boxes (9) penetrating through the bottom of the top plate (6), and the storage boxes (9) are located above the powder scraping table (1); The two groups of storage boxes (9) are located on the two sides of the connecting column (5); The rear wall of the two groups of storage boxes (9) is provided with servo motors (10), the output end of the two groups of servo motors (10) is provided with reciprocating lead screws (11), one end of the two groups of reciprocating lead screws (11) is connected with the front wall of the storage box (9) through a shaft, the outer surface of the two groups of reciprocating lead screws (11) is provided with sliding sleeves (13), the cross section of the sliding sleeve (13) is in a "T" shape structure, the bottom of the two groups of storage boxes (9) is provided with sliding grooves (12), the outer surface of one group of sliding sleeves (13) penetrates through the inside of the sliding groove (12) and is provided with a connecting block (14), the bottom of the connecting block (14) is provided with insertion holes (16) at the four corners, the bottom of the connecting block (14) is provided with a scraper (15) at the center position, the insertion hole (16) is provided with an insertion rod (17) embedded therein, the bottom end of the insertion rod (17) is provided with a rubber sleeve (18), and the rubber sleeve (18) is embedded with the scraper (15); The outer surface of the other group of sliding sleeves (13) penetrates through the inside of the sliding groove (12) and is provided with a connecting box (19), and the top of the connecting box (19) is attached to the bottom of the other group of storage boxes (9), the two side walls of the connecting box (19) are slidingly provided with storage frames (20), the top wall of the connecting box (19) is provided with symmetrically arranged dust collection fans (21), the output end of the dust collection fan (21) is provided with a conveying pipe (25), the input end of the dust collection fan (21) is provided with a connecting pipe (24), the bottom wall of the connecting box (19) is provided with symmetrically arranged connecting pipes (22), and the connecting pipes (22) are located below the dust collection fan (21), the bottom of the connecting box (19) is embedded with symmetrically arranged dust collection heads (23), the top of the dust collection head (23) is provided with a branch pipe, the top end of the branch pipe is connected with the outer surface of the connecting pipe (22), the bottom of the connecting box (19) is provided with a soft brush (26), and the soft brush (26) is wrapped around the dust collection head (23). The bottom of the powder scraping table (1) is provided with shallowly arranged supporting columns three (29), the bottom ends of the two groups of supporting columns three (29) are provided with storage plates two (30), the top portions of the two groups of storage plates two (30) are provided with hydraulic push rods two (31), the output ends of the two groups of hydraulic push rods two (31) are provided with bearing plates, the top portions of the bearing plates are provided with symmetrically arranged connecting rods (32), the top portions of the two groups of connecting rods (32) are inlaid with electromagnets (39), the top portion of the powder scraping table (1) is provided with a silica gel pad (37), the top portion of the silica gel pad (37) is provided with a connecting plate (35), the top portion of the bearing plate is provided with a limiting rod (33), the bottom portions of the powder scraping table (1), the connecting plate (35) and the silica gel pad (37) are provided with three groups of equidistantly arranged slot holes (34), and the bottom portion of the connecting plate (35) is provided with symmetrically arranged iron sheets (36).

2. The automatic powder scraping device for a glass passivation process for producing semiconductor devices according to claim 1, characterized in that: The size of the top plate (6) is greater than that of the powder scraping table (1), the servo motor one (4) rotates to drive the connecting column (5) to rotate, so that the two groups of storage boxes (9) can be exchanged positions; The scraping plate (15) is located on the inner side of the insertion hole (16), the cross section of the scraping plate (15) is triangular, the top portion of the connecting block (14) is attached to the bottom portion of one of the two groups of storage boxes (9), and the length of the connecting block (14) is equal to the length of the storage box (9); One end of the connecting pipe (22) is connected with the inner surface of the connecting pipe (22), the mutually close surfaces of the two groups of storage frames (20) are provided with slot openings, one end of the conveying pipe (25) is embedded in the slot opening, and the connecting pipe (22) is located between the two groups of storage frames (20). The storage plate two (30) is located on one side of the storage plate one (3), the limiting rod (33) is embedded in the middle one of the slot holes (34), the two groups of connecting rods (32) are located on the inner sides of the other two groups of slot holes (34), the iron sheet (36) is located on the inner sides of the other two groups of slot holes (34), the top portion of the electromagnet (39) is attached to the bottom portion of the iron sheet (36), and the bearing plate is located on the inner side of the supporting column three (29).

3. The automatic powder scraping device for a glass passivation process for producing semiconductor devices according to claim 1, characterized in that: The top portions of the two groups of storage frames (20) are half-open structures, one side outer wall of the storage frame (20) is provided with a storage groove (27), the inside of the storage groove (27) is slidably provided with a partition plate (28), one side outer wall of the partition plate (28) is provided with a protruding block, one side inner wall of the storage frame (20) is provided with a groove, and the groove is embedded in the protruding block, and the top portion of the partition plate (28) is provided with a pushing piece.

4. The automatic powder scraping device for a glass passivation process for producing semiconductor devices according to claim 1, characterized in that: The top portion of the powder scraping table (1) is provided with symmetrically arranged baffles (38), and the baffles (38) are located on one side of the connecting column (5), the two groups of baffles (38) are located on the two sides of the connecting plate (35), and the distance between the two groups of baffles (38) is greater than the length of the storage box (9).

5. The method of using an automatic powder scraping device for a glass passivation process for producing semiconductor devices according to any one of claims 1 to 4, characterized in that, The use method of the automatic powder scraping device is as follows: S1, before using the automatic powder scraping device, first, according to the need, the semiconductor device glass is placed on the powder scraping table (1), then the hydraulic push rod two (31) on the storage plate two (30) is started, then the bearing plate can be driven to move upwards, so that the connecting rod (32) can be inserted into the inside of the slot hole (34). S2, then start one of the hydraulic push rod (8), then can push one of the group of storage box (9) to move down, until the rubber sleeve (18) can be in contact with the surface of the semiconductor device glass, then start the servo motor (10) in the storage box (9), then can drive the reciprocating screw rod (11) connected to the sleeve (13), so that the block (14) can move along the vertical direction, then can be on the surface of the semiconductor device glass powder scraping operation; S3, when the powder scraping is completed, start servo motor (4) on the board (3), then can drive the top plate (6) under the action of the connecting column (5) rotation, until the exchange of two groups of storage box (9) position; S4, after the exchange of two groups of storage box (9) position, start another servo motor (10) in the storage box (9), drive the reciprocating screw rod (11) connected to the sleeve (13), so that the block (14) can move along the vertical direction, so that the soft brush (26) can clean the surface of the semiconductor device glass.

6. The method of using an automatic powder scraping device for a glass passivation process for semiconductor device production of claim 5, wherein, In the step S1, further comprising the following steps: S11, then give the electromagnet (39) power, then the head of the silicone pad (37) of the adapter plate (35) placed on the powder scraping table (1), so that the electromagnet (39) and iron sheet (36) suction, then can be placed on the powder scraping table (1) by the silicone pad (37) on the semiconductor device glass limiting; In the step S2, further comprising the following steps: S21, before using the powder scraping device, can also be according to the needs of the use of the rubber sleeve (18) from the scraper (15) to remove, so that the plug rod (17) is no longer embedded with the plug hole (16), and according to the needs of other rubber sleeve (18) is replaced, so as to reduce the probability of scratching the glass surface after the scraper (15) directly in contact with the semiconductor device glass directly; In the step S4, further comprising the following steps: S41, in the process of cleaning, start the dust collection fan (21) in the connecting box (19), so that the dust collection head (23) can be on the semiconductor device glass on the powder into the connecting pipe (22) inside, then through the adapter pipe (24) and the conveying pipe (25) will be powder into the storage frame (20) inside, and in the subsequent processing of the powder, pull the storage frame (20) to the outside, so that the conveying pipe (25) is no longer embedded with the slot, then the dial dial, drive the baffle (28) contraction in the storage slot (27) inside, then can be from the storage frame (20) pour out the powder.

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