Conductive shielding device for high-density integrated circuit lead frame apparatus
By using the cathode conductive transport component, anode conductive electroplating component, and shielding component of the conductive shielding device, the problem of uneven electroplating of the lead frame was solved, and a higher quality electroplating effect was achieved.
CN116815274BActive Publication Date: 2026-07-24DONGGUAN ALLMERIT TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DONGGUAN ALLMERIT TECH CO LTD
- Filing Date
- 2023-03-01
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
In existing electroplating tanks, the electroplating effect of the lead frame is uneven, and the metal film reacts in a concentrated manner at the bottom edge of the frame, resulting in a poor electroplating effect in other areas.
Method used
A conductive shielding device is adopted, including a cathode conductive transport component, an anode conductive electroplating component, and a shielding component. The electric arc is shielded by the shielding box to ensure that metal ions are uniformly released to the surface of the lead frame.
Benefits of technology
This improved the uniformity and quality of electroplating of the lead frame, enhancing the electroplating effect.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116815274B_ABST
Abstract
The present application relates to integrated circuit lead frame electroplating conductive technical field, especially to high-density integrated circuit lead frame equipment's conductive shielding device, including electroplating tank, the cathode conductive conveying assembly of electroplating tank is arranged in and the anode conductive electroplating assembly of the lead frame electroplating to the forward conveying of the lead frame arranged longitudinally, the shielding assembly of the partial shielding of electric arc is further provided to electroplating tank;The transmission cooperation of the steel clamp mounted with lead frame is realized by the compression of ratchet and feeding wheel, so that ratchet advances with the drive of steel clamp, cathode conductive block and steel clamp cathode conductive;At this time, the anode arc between the metal basket after electrification and lead frame is generated and realizes anode conductive with lead frame;Shielding box can shield the electric arc between the bottom of lead frame and anode conductive electroplating assembly, the anode arc generated will not concentrate to the bottom of lead frame, so that the metal ions in the electroplating tank can be relatively evenly ionized to the lead frame plate surface along the arc to realize electroplating.
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