Dual configuration fusion soil conductivity measuring device and method

Abstract

The application discloses a dual-configuration fused soil conductivity measuring device and method, belongs to the technical field of intelligent agricultural equipment detection, and mainly comprises a test system, a rack and a detection device, wherein the test system and the detection device are both installed on the rack, the test system is installed above the rack, and the detection device is installed below the inside of the rack; according to different configurations, sensor electrodes are inserted into soil; soil conductivity values obtained by two configurations are transmitted to a JESTON nano through a controller; and a dual-configuration fused soil conductivity calculation model established based on a BP neural network is used to take the soil conductivity values obtained by the two configurations as model input parameters, to perform real-time calculation through the JESTON nano, and to display and output the optimized soil conductivity values on a touch liquid crystal display screen. The application can realize accurate measurement and storage of soil conductivity values at different depths in soil, is simple to operate, and is high in practicability.

Description

Technical Field

[0001] This invention belongs to the field of intelligent agricultural equipment testing technology, specifically relating to a soil conductivity measurement device and method with dual configuration fusion. Background Technology

[0002] Soil is a crucial foundational environment for agricultural production, and obtaining more information about soil is the first step in carrying out agricultural operations; therefore, acquiring soil parameters is extremely important. Soil electrical conductivity, as an important soil parameter, is studied to varying degrees by existing research and can reflect parameters such as soil salinity, moisture, organic matter content, soil texture, and porosity. These parameters are vital to crop growth and yield.

[0003] In recent decades, researchers have conducted a series of studies on real-time soil conductivity detection technology. The current-voltage four-terminal method, due to its measurement accuracy and flexibility, has shown good overall performance in large-scale in-situ soil conductivity measurement and is the most widely used. Based on the three measurement configurations (Wenner configuration, Schlumberger configuration, and Polar Diple configuration) of the current-voltage four-terminal method, existing research shows that different configurations have different detection accuracies for soil conductivity under different soil environmental conditions. Experiments have shown that the Wenner and Schlumberger configurations are well applicable to different soil environmental conditions, but their applicable ranges are not entirely the same. Therefore, this patent proposes a dual-configuration fusion soil conductivity measurement device and method, which can provide a reference for improving the accuracy of soil conductivity acquisition. Summary of the Invention

[0004] This invention provides a dual-configuration fusion soil conductivity measurement device and method, which improves detection accuracy, is simple to operate, and has universality.

[0005] This invention comprises a frame A, a detection device B, and a testing system C. The detection device B is located within an n-shaped frame structure formed by the upper plate 1, left plate 2, and right plate 3 of the frame A. In the detection device B, the front slider I9 and rear slider I8 of the support plate B1 are slidably connected to the front slide groove I4 and rear slide groove I5 of the left plate 2 of the frame A, respectively. Similarly, the front slider II16 and rear slider II17 of the support plate B1 are slidably connected to the front slide groove II6 and rear slide groove II7 of the right plate 3 of the frame A, respectively. The testing system C is located above the upper plate 1 of the frame A. The detection device B includes electrode assemblies IB2, IIB3, IIIB4, IVB5, VB6, and electrode groups. The six telescopic wires of component VIB7 are respectively connected to rubber sockets I27, II28, III29, IV30, V31 and VI32 of the test system C; the telescopic wires of electrode assembly VIB7 and electrode assembly IB2 in the detection device B are respectively connected to the constant current source module 35 via rubber sockets VI32 and I27 of the test system C; the telescopic wires of electrode assembly IIB3, electrode assembly IIIB4, electrode assembly IVB5 and electrode assembly VB6 in the detection device B are respectively connected to the differential amplifier module 34 via rubber sockets II28, III29, IV30 and V31 of the test system C.

[0006] The frame A consists of an upper plate 1, a left plate 2, and a right plate 3. The left end of the upper plate 1 is fixedly connected to the upper end of the left plate 2, and the right end of the upper plate 1 is fixedly connected to the upper end of the right plate 3, forming an n-shaped frame structure. The left plate 2 has a scale I2a on the front and a front slide groove I4 and a rear slide groove I5 on the right side. The right plate 3 has a scale II3a on the front and a front slide groove II6 and a rear slide groove II7 on the left side.

[0007] The detection device B consists of a support plate B1, electrode assembly IB2, electrode assembly IIB3, electrode assembly IIIB4, electrode assembly IVB5, electrode assembly VB6, electrode assembly VIB7, nuts I10a, nut II11a, nut III12a, nut IV13a, nut V14a, and nut VI15a. The support plate B1 is a rectangular plate. The left end of the support plate B1 has a rear slider I8 and a front slider I9, and the right end of the support plate B1 has a front slider II16 and a rear slider II17. The longitudinal centerline of plate B1 is provided with threaded holes I10, II11, III12, IV13, V14 and VI15; nuts I10a, II11a, III12a, IV13a, V14a and VI15a are fixed to the top of support plate B1, and are concentric with and have the same threads as threaded holes I10, II11, III12, IV13, V14 and VI15 respectively.

[0008] In the detection device B, the six threaded posts of electrode assemblies IB2, IIB3, IIIB4, IVB5, VB6, and VIB7 are threadedly connected to nuts I10a, II11a, III12a, IV13a, V14a, and VI15a. The center distance L1 between threaded holes I10 and II11 is 150mm; the center distance L2 between threaded holes II11 and III12 is 50mm; the center distance L3 between threaded holes III12 and IV13 is 200mm; and the center distance L4 between threaded holes IV13 and V14 is... The distance from L4 is 50mm; the center distance L5 between threaded holes V14 and VI15 is 150mm; electrode assemblies IB2, IIB3, IIIB4, IVB5, VB6 and VIB7 have the same structure and are arranged from left to right. Each electrode assembly consists of a telescopic wire 18, a telescopic wire box 19, a cross-shaped boss 20, a threaded post 21, a cylindrical boss II 22 and a probe 23. The telescopic wire 18, telescopic wire box 19, cross-shaped boss 20, threaded post 21, cylindrical boss II 22 and probe 23 are arranged and fixed from top to bottom.

[0009] The test system C consists of an electrical control box 24, a touch-screen LCD display 25, a switch 26, rubber sockets I 27, II 28, III 29, IV 30, V 31, and VI 32, a power supply 33, a differential amplifier module 34, a constant current source module 35, a controller 36, a JESTON nano 37, and a Beidou positioning module 38. Rubber sockets I 32, II 33, III 34, IV 35, V 36, and VI 37 are fixed to the front of the electrical control box 30. The Beidou positioning module 38 is used to record soil measurement location information of different plots over a large area.

[0010] The JESTON nano37 is connected to the controller 36 and the touch screen LCD display 25 via wires. The controller 36 is connected to the differential amplifier module 34 and the constant current source module 35 via wires. The touch screen LCD display 25, the differential amplifier module 34, the constant current source module 35, the controller 36, the JESTON nano37, and the Beidou positioning module 38 are all fixedly installed in the electrical control box 30. The power supply 33 is connected to the touch screen LCD display 25, the switch 26, the differential amplifier module 34, the constant current source module 35, the controller 36, the JESTON nano37, and the Beidou positioning module 38 via wires. The touch screen LCD display 25 is located at the center of the top of the electrical control box 24, and the switch 26 is located near the front of the top of the electrical control box 24.

[0011] The measurement method of the dual-configuration fusion soil conductivity measuring device includes the following steps:

[0012] 1) Set the constant current source I = 100mA via controller 36;

[0013] 2) Rotate electrode assemblies IB2, IIB3, VB6, and VIB7 downwards around their respective internal threaded holes until the lower end of the cross-shaped boss 20 contacts the upper end of its corresponding nut. Control the soil penetration depth by sliding the side guide rails. Rotate electrode assemblies IIIB4 and IVB5 upwards around their respective internal threaded holes until the upper end of the cylindrical boss 22 contacts the lower end of the threaded hole. At this point, the measuring device is in Schlumberger configuration. Place the lower end faces of the left plate 2 and right plate 3 of the measuring device on the ground to be measured. On the surface, adjust the support plate B1 to move it down along the slide rails of the left plate 2 and the right plate 3 to the specified measurement depth h1, where 0mm≤h1≤200mm. At this time, the support plate B1 mainly relies on the resistance between the soil and the electrode to prevent it from sliding down. Because the electrode and the support plate B1 are fixed by threads, the distance measurement will not slip. Turn on the switch 26, and read and record the soil conductivity value x1 under the Schlumberger configuration through the touch LCD screen 25. At the same time, record the operation location information through the Beidou positioning module 38.

[0014] 3) Turn off switch 26. In the original measuring position, adjust support plate B1 to move it upward along the slide rails of left plate 2 and right plate 3 until the electrode is detached from the soil. Rotate electrode assembly IB2, electrode assembly IIIB4, electrode assembly IVB5, and electrode assembly VIB7 downward around their respective internal threaded holes until the lower end of the cross-shaped boss 20 contacts the upper end of its corresponding nut. Rotate electrode assembly IIB3 and electrode assembly VB6 upward around their respective internal threaded holes until the upper end of the cylindrical boss 22 contacts the lower end of the threaded hole. At this time, the measuring device is in the Wenner group. In the Wenner configuration, adjust the support plate B1 to move it downwards along the slide rails of the left plate 2 and the right plate 3 to the specified measurement depth h2. At this time, the support plate B1 mainly relies on the resistance between the soil and the electrode to prevent it from sliding down. Because the electrode and the support plate B1 are fixed by threads, the distance measurement will not slip. And h1=h2, where 0mm≤h2≤200mm. Turn on the switch 26, and read and record the soil conductivity value x2 under the Wenner configuration through the touch LCD screen 25. At the same time, record the operation location information through the Beidou positioning module 38.

[0015] 4) The soil electrical conductivity values ​​of x1 and x2 are calculated based on the model F(x1, x2) and displayed on the touch-screen LCD (25). This value is the final result of the measured soil electrical conductivity. The calculation formula for F(x1, x2) is as follows:

[0016] F(X) = f[V·f(W·X+θ1)+θ2]

[0017] Where X = [x1, x2] T μs / mm θ2 = [-0.0558].

[0018] The beneficial effects of this invention are as follows:

[0019] 1. The invented dual-configuration fusion soil conductivity measurement device and method is simple to operate, can achieve accurate detection and is easy to carry. It is applicable not only to farmland but also to greenhouses.

[0020] 2. The proposed dual-configuration fusion soil conductivity measurement device and method, combined with the BP neural network model, can achieve accurate detection of soil conductivity at different underground depths.

[0021] 3. The proposed dual-configuration fusion soil conductivity measurement device and method are applicable to different work sites and soil environmental conditions. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a soil conductivity measurement device with dual configuration fusion.

[0023] Figure 2 This is a schematic diagram of the frame structure;

[0024] Figure 3 This is a side view of the left panel;

[0025] Figure 4 This is a sectional view of the left and right plates along the AA direction;

[0026] Figure 5 This is a side view of the right panel;

[0027] Figure 6 This is a schematic diagram of the detection device structure;

[0028] Figure 7 This is a top view of the support plate on the testing device;

[0029] Figure 8 This is a front view of the support plate on the testing device;

[0030] Figure 9 This is a schematic diagram of the electrode assembly structure;

[0031] Figure 10 This is a schematic diagram of the test system structure;

[0032] Figure 11 This is a schematic diagram of the internal structure of the electrical control box;

[0033] Figure 12 This is a schematic diagram of a BP neural network structure;

[0034] Figure 13 A schematic diagram of the Schlumberger measurement configuration.

[0035] Figure 14 A schematic diagram of the Wenner measurement configuration;

[0036] Among them: A. Frame B. Detection device C. Test system B1. Support plate B2. Electrode assembly I B3. Electrode assembly II B4. Electrode assembly III B5. Electrode assembly IVB6. Electrode assembly VB7. Electrode assembly VI1. Upper plate 2. Left plate 2a. Scale I 3. Right plate 3a. Scale II 4. Front slide groove I 5. Rear slide groove I 6. Front slide groove II 7. Rear slide groove II 8. Rear slider I 9. Front slider I 10. Threaded hole I 11. Threaded hole II 12. Threaded hole III 13. Threaded hole IV 14. Threaded hole V 15. Threaded hole VI 10a. Nut I 11a. Nut II 12a. Nut III 13a. Nut IV 14a. Nut V 15a. Nut VI 16. Front slider II 17. Rear slider II 18. Telescopic wire 19. Telescopic wire box 20. Cross-shaped boss 21. Threaded post 22. Cylindrical boss 23. Probe 24. Electrical control box 25. Touch screen LCD display 26. Switch 27. Rubber socket I 28. Rubber socket II 29. Rubber socket III 30. Rubber socket IV 31. Rubber socket V 32. Rubber socket VI 33. Power supply 34. Differential amplifier module 35. Constant current source module 36. Controller 37. JESTON nanao 38. Beidou positioning module. Detailed Implementation

[0037] The following explanation, in conjunction with the accompanying drawings, further illustrates the following:

[0038] like Figure 1As shown, the present invention consists of a frame A, a detection device B, and a testing system C. The detection device B is located in the n-shaped frame structure formed by the upper plate 1, left plate 2, and right plate 3 of the frame A. The front slider I9 and rear slider I8 of the support plate B1 in the detection device B are slidably connected to the front slide groove I4 and rear slide groove I5 of the left plate 2 of the frame A, respectively. The front slider II16 and rear slider II17 of the support plate B1 in the detection device B are slidably connected to the front slide groove II6 and rear slide groove II7 of the right plate 3 of the frame A, respectively. The testing system C is located on top of the upper plate 1 of the frame A. The detection device B includes electrode assemblies IB2, IIB3, IIIB4, IVB5, VB6, and electrode... The six telescopic wires of component VIB7 are connected to rubber sockets I27, II28, III29, IV30, V31 and VI32 of test system C, respectively; the telescopic wires of electrode components VIB7 and IB2 in detection device B are connected to constant current source module 35 via rubber sockets VI32 and I27 of test system C, respectively; the telescopic wires of electrode components IIB3, IIIB4, IVB5 and VB6 in detection device B are connected to differential amplifier module 34 via rubber sockets II28, III29, IV30 and V31 of test system C, respectively.

[0039] like Figures 2 to 5 As shown, the frame A consists of an upper plate 1, a left plate 2, and a right plate 3. The left end of the upper plate 1 is fixed to the upper end of the left plate 2, and the right end of the upper plate 1 is fixed to the upper end of the right plate 3, forming an n-shaped frame structure. The left plate 2 has a scale I2a on the front and a front slide groove I4 and a rear slide groove I5 on the right side. The right plate 3 has a scale II3a on the front and a front slide groove II6 and a rear slide groove II7 on the left side.

[0040] like Figures 6 to 8As shown, the detection device B consists of a support plate B1, electrode assembly IB2, electrode assembly IB3, electrode assembly IIIB4, electrode assembly IVB5, electrode assembly VB6, electrode assembly VIB7, nuts I10a, nut II11a, nut III12a, nut IV13a, nut V14a, and nut VI15a. The support plate B1 is a rectangular plate. The left end of the support plate B1 has a rear slider I8 and a front slider I9, and the right end of the support plate B1 has a front slider II16 and a rear slider II17. Threaded holes I10, II11, III12, IV13, V14, and VI15 are provided along the longitudinal center line of the support plate B1. Nuts I10a, II11a, III12a, IV13a, V14a, and VI15a are fixed to the top of the support plate B1 and respectively connected to threaded holes I10a, II11a, III12a, IV13a, V14a, and VI15a. 10. Threaded holes II11, III12, IV13, V14, and VI15 are concentric and have the same thread; the six threaded posts of electrode assemblies IB2, IIB3, IIIB4, IVB5, VB6, and VIB7 in the detection device B are threadedly connected to nuts I10a, II11a, III12a, IV13a, V14a, and VI15a; the center distance L1 between threaded holes I10 and II11 is 150mm; the center distance L2 between threaded holes II11 and III12 is 50mm; the center distance L3 between threaded holes III12 and IV13 is 200mm; the center distance L4 between threaded holes IV13 and V14 is 50mm; and the center distance L5 between threaded holes V14 and VI15 is 150mm.

[0041] like Figure 9 As shown, electrode assemblies ⅠB2, ⅡB3, ⅢB4, ⅣB5, ⅤB6, and ⅥB7 have the same structure and are arranged in order from left to right. Each electrode assembly consists of a telescopic wire 18, a telescopic wire box 19, a cross-shaped boss 20, a threaded post 21, a cylindrical boss II 22, and a probe 23. The telescopic wire 18, telescopic wire box 19, cross-shaped boss 20, threaded post 21, cylindrical boss II 22, and probe 23 are arranged and fixed in order from top to bottom.

[0042] like Figure 10 As shown, the test system C consists of an electrical control box 24, a touch-screen LCD display 25, a switch 26, rubber sockets I 27, II 28, III 29, IV 30, V 31, VI 32, a power supply 33, a differential amplifier module 34, a constant current source module 35, a controller 36, a JESTON nano 37, and a Beidou positioning module 38. Rubber sockets I 32, II 33, III 34, IV 35, V 36, and VI 37 are fixed to the front of the electrical control box 30.

[0043] like Figure 11 As shown, the JESTON nano37 is connected to the controller 36 and the touch screen LCD display 25 via wires. The controller 36 is connected to the differential amplifier module 34 and the constant current source module 35 via wires. The touch screen LCD display 25, power supply 33, differential amplifier module 34, constant current source module 35, controller 36, JESTON nano37 and Beidou positioning module 38 are all fixed in the electrical control box 30. The power supply 33 is connected to the touch screen LCD display 25, switch 26, differential amplifier module 34, constant current source module 35, controller 36, JESTON nano37 and Beidou positioning module 38 via wires. The touch screen LCD display 25 is located at the center of the top of the electrical control box 24, and the switch 26 is located near the front of the top of the electrical control box 24.

[0044] The measurement method of the dual-configuration fusion soil conductivity measuring device includes the following steps:

[0045] 1) Set the constant current source I = 100mA via controller 36;

[0046] 2) Rotate electrode assemblies IB2, IIB3, VB6, and VIB7 downwards around their respective internal threaded holes until the lower end of the cross-shaped boss 20 contacts the upper end of the threaded hole. Control the soil penetration depth by sliding the side guide rails. Before measurement, connect electrode assemblies IIIB4 and IVB5 and rotate them upwards around their corresponding internal threaded holes until the upper end of the cylindrical boss 22 contacts the lower end of the threaded hole. At this time, the measuring device is in the Schlumberger configuration. Figure 13 As shown, place the lower surfaces of the left plate 2 and right plate 3 of the measuring device on the ground to be measured, and adjust the support plate B1 to move it down along the slide rails of the left plate 2 and right plate 3 to the specified measurement depth h1, where 0mm≤h1≤200mm. At this time, the support plate B1 mainly relies on the resistance between the soil and the electrode to prevent it from sliding down. Because the electrode and the support plate B1 are fixed by threads, the distance measurement will not slip. Turn on the switch 26, and read and record the soil conductivity value x1 under the Schlumberger configuration through the touch LCD screen 25. At the same time, record the operation location information through the Beidou positioning module 38.

[0047] 3) Turn off switch 26. At the original measuring position, adjust support plate B1 to move it upwards along the slide rails of left plate 2 and right plate 3 until the electrode detaches from the soil. Rotate electrode assemblies IB2, IIIB4, IVB5, and VIB7 downwards around their respective internal threaded holes until the lower end of the cross-shaped boss 20 contacts the upper end of the threaded hole. Rotate electrode assemblies IIB3 and VB6 upwards around their corresponding internal threaded holes until the upper end of the cylindrical boss 22 contacts the lower end of the threaded hole. At this point, the measuring device is in Wenner configuration. Figure 14 As shown, adjust the support plate B1 to move downwards along the slide rails of the left plate 2 and the right plate 3 to the specified measurement depth h2, where h1 = h2, and 0mm ≤ h2 ≤ 200mm. At this time, the support plate B1 mainly relies on the resistance between the soil and the electrode to prevent it from sliding down. Because the electrode and the support plate B1 are fixed by threads, the distance measurement will not slip. Turn on the switch 26, and read and record the soil conductivity value x2 under the Wenner configuration through the touch LCD screen 25. At the same time, record the operation location information through the Beidou positioning module 38.

[0048] 4) The soil electrical conductivity values ​​of x1 and x2 are calculated based on the model F(x1, x2) and displayed on the touch-screen LCD (25). This value is the final result of the measured soil electrical conductivity. The calculation formula for F(x1, x2) is as follows:

[0049] F(X) = f[V·f(W·X+θ1)+θ2]

[0050] in:

Claims

1. A measurement method for soil electrical conductivity based on a dual-configuration fusion device, characterized in that... Includes the following steps: 1) Install a soil conductivity measurement device with dual configuration integration. The dual-configuration integrated soil conductivity measuring device consists of a frame (A), a detection device (B), and a testing system (C). The frame (A) consists of an upper plate (1), a left plate (2), and a right plate (3). The detection device (B) consists of a support plate (B1), electrode assembly I (B2), electrode assembly II (B3), electrode assembly III (B4), electrode assembly IV (B5), electrode assembly V (B6), and electrode assembly Ⅴ. VI (B7), Nut I (10a), Nut II (11a), Nut III (12a), Nut IV (13a), Nut V (14a) and Nut VI (15a); the test system (C) consists of an electrical control box (24), a touch-screen LCD display (25), a switch (26), rubber socket I (27), rubber socket II (28), rubber socket III (29), rubber socket IV (30), rubber socket V (31), rubber socket VI (32), a power supply (33), a differential amplifier module (34), a constant current source module (35), a controller (36), and JESTON The device consists of nano (37) and Beidou positioning module (38); the detection device (B) is located in the n-shaped frame structure formed by the upper plate (1), left plate (2) and right plate (3) of the frame (A). The front slider I (9) and rear slider I (8) of the support plate (B1) in the detection device (B) are slidably connected to the front slide groove I (4) and rear slide groove I (5) of the left plate (2) of the frame (A) respectively; the front slider II (16) and rear slider II (17) of the support plate (B1) in the detection device (B) are slidably connected to the front slide groove II (6) and rear slide groove II (7) of the right plate (3) of the frame (A) respectively; the test system (C) is located on the upper plate (1) of the frame (A); the detection device (B) consists of electrode assembly I (B2), electrode assembly II (B3) and electrode assembly III (B4). The six telescopic wires of electrode assembly IV (B5), electrode assembly V (B6), and electrode assembly VI (B7) are respectively connected to the rubber sockets I (27), II (28), III (29), IV (30), V (31), and VI (32) of the test system (C); the telescopic wires of electrode assembly VI (B7) and electrode assembly I (B2) in the detection device (B) are respectively connected to the constant current source module (35) via the rubber sockets VI (32) and I (27) of the test system (C); the telescopic wires of electrode assembly II (B3), electrode assembly III (B4), electrode assembly IV (B5), and electrode assembly V (B6) in the detection device (B) are respectively connected to the rubber sockets II (28), II (29), III (20), IV (31), V (32), and VI (32) of the test system (C). Ⅲ(29), rubber jack Ⅳ(30) and rubber jack Ⅴ(31) are connected to the differential amplifier module (34); The upper plate (1) of the frame (A) is fixedly connected to the upper end of the left plate (2) at the left end, and the upper plate (1) is fixedly connected to the upper end of the right plate (3) at the right end, forming an n-shaped frame structure; the left plate (2) has a scale I (2a) on the front, and a front slide groove I (4) and a rear slide groove I (5) on the right side; the right plate (3) has a scale II (3a) on the front, and a front slide groove II (6) and a rear slide groove II (7) on the left side; The support plate (B1) of the detection device (B) is a rectangular plate. The left end of the support plate (B1) is provided with a rear slider I (8) and a front slider I (9), and the right end of the support plate (B1) is provided with a front slider II (16) and a rear slider II (17). A threaded hole is provided on the longitudinal center line of the support plate (B1). Ⅰ(10), threaded hole Ⅱ(11), threaded hole Ⅲ(12), threaded hole Ⅳ(13), threaded hole Ⅴ(14) and threaded hole Ⅵ(15); nut Nuts I (10a), II (11a), III (12a), IV (13a), V (14a), and VI (15a) are fixed to the top of the support plate (B1), and are concentric and have the same thread as threaded holes I (10), II (11), III (12), IV (13), V (14), and VI (15), respectively; the six threaded posts of electrode assemblies I (B2), II (B3), III (B4), IV (B5), V (B6), and VI (B7) in the detection device (B) are connected to the nuts. Nuts I (10a), II (11a), III (12a), IV (13a), V (14a), and VI (15a) are threaded together; the center distance L1 between threaded holes I (10) and II (11) is 150mm; the center distance L2 between threaded holes II (11) and III (12) is 50mm; the center distance L3 between threaded holes III (12) and IV (13) is 200mm; the center distance L4 between threaded holes IV (13) and V (14) is 50mm; and the center distance L5 between threaded holes V (14) and VI (15) is 150mm. m; The electrode assembly I (B2), electrode assembly II (B3), electrode assembly III (B4), electrode assembly IV (B5), electrode assembly V (B6) and electrode assembly VI (B7) have the same structure and are arranged in order from left to right. Each electrode assembly consists of a telescopic wire (18), a telescopic wire box (19), a cross-shaped boss (20), a threaded post (21), a cylindrical boss (22) and a probe (23). The telescopic wire (18), telescopic wire box (19), cross-shaped boss (20), threaded post (21), cylindrical boss (22) and probe (23) are arranged in order from top to bottom and fixed together. The rubber sockets I (27), II (28), III (29), IV (30), V (31), and VI (32) of the test system (C) are fixed to the front of the electrical control box (30); the JESTON nano (37) is connected to the controller (36) and the touch screen (25) via wires, and the controller (36) is connected to the differential amplifier module (34) and the constant current source module (35) via wires; the touch screen (25), power supply (33), differential amplifier module (34), constant current source module (35), controller (36), JESTON nano (37), and Beidou positioning module (38) are all fixed in the electrical control box (30), and the power supply (33) is connected to the touch screen (25), switch (26), differential amplifier module (34), constant current source module (35), controller (36), and JESTON nano (37). The nano (37) and the Beidou positioning module (38) are connected by wires; the touch screen LCD display (25) is located at the center of the top of the electrical control box (24), and the switch (26) is located on the top of the electrical control box (24) near the front end; 2) Set the constant current source I = 100mA via the controller (36); 3) Rotate electrode assembly I (B2), electrode assembly II (B3), electrode assembly V (B6) and electrode assembly VI (B7) downward around their respective internal threaded holes until the lower end of the cross-shaped boss (20) contacts the upper end of its corresponding nut. Control the soil penetration depth by sliding the side guide rail. Rotate electrode assembly III (B4) and electrode assembly IV (B5) upward around their respective internal threaded holes until the upper end of the cylindrical boss (22) contacts the lower end of the threaded hole. At this time, the measuring device is in Schlumberger configuration. Place the lower end face of the left plate (2) and right plate (3) of the measuring device on the ground to be measured. Adjust the support plate (B1) so that it moves downward along the slide rail of the left plate (2) and right plate (3) to the specified measurement depth h1, where 0mm≤h1≤200mm. Turn on the switch (26) and read and record the soil conductivity value x1 under Schlumberger configuration through the touch LCD screen (25). 4) Turn off the switch (26). At the original measurement position, adjust the support plate (B1) to move it upward along the slide rails of the left plate (2) and the right plate (3) until the electrode is separated from the soil. Rotate the electrode assembly I (B2), electrode assembly III (B4), electrode assembly IV (B5) and electrode assembly VI (B7) downward around their respective internal thread holes until the lower end of the cross-shaped boss (20) contacts the upper end of its corresponding nut. Rotate the electrode assembly II (B3) and electrode assembly V (B6) upward around their respective internal thread holes until the upper end of the cylindrical boss (22) contacts the lower end of the thread hole. At this time, the measuring device is in the Wenner configuration. Adjust the support plate (B1) to move it downward along the slide rails of the left plate (2) and the right plate (3) to the specified measurement depth h2, and h1=h2, where 0mm≤h2≤200mm. Turn on the switch (26) and read and record the soil conductivity value x2 under the Wenner configuration through the touch LCD screen (25). 5) The soil electrical conductivity values ​​of x1 and x2 are calculated based on the model F(x1, x2) and displayed on the touch screen LCD (25). This value is the final result of the measured soil electrical conductivity. The calculation formula of F(x1, x2) is as follows: F(X) = f[V·f(W·X+θ1)+θ2] where X = [x1, x2] T , μs / mm, θ2 = [-0.0558].

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