Driver IC and display device

Abstract

An embodiment of the present disclosure provides a driver IC and a display device, wherein the driver IC includes at least one GOA pad area, each GOA pad area includes multiple rows and columns of first pads, each column of first pads is divided into at least two independently arranged first pad groups, each first pad group includes at least two adjacent first pads, and each first pad group is electrically connected; and further includes multiple leads electrically connected to each first pad group, and each first pad group is electrically connected to different leads.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a driver IC and a display device. Background Art

[0002] As flexible Organic Light-Emitting Diode (OLED) screen technology matures, foldable phones are becoming a popular form factor for future mobile phones. When folded, foldable phones can reduce the screen area, making them easier to carry. When unfolded, they can become a tablet-sized communication device, providing users with a better visual experience. Foldable screens are generally around 8-10 inches, significantly larger than ordinary phones. To achieve high-resolution foldable products, we generally need two cascaded driver chips (ICs). A single foldable IC can reduce costs, but the current bonding process for foldable ICs is difficult. Under extreme process conditions, we must ensure both yield and cost while also producing a driver IC that supports high resolution. This requires continuous experimentation and innovation. Summary of the Invention

[0003] The present disclosure provides a driver IC and a display device, and the specific solutions are as follows:

[0004] An embodiment of the present disclosure provides a driver IC, including at least one GOA pad area, each of the GOA pad areas including multiple rows and columns of first pads, each column of the first pads being divided into at least two mutually independent first pad groups, each first pad group including at least two adjacent first pads, and each first pad group being electrically connected;

[0005] The device further includes a plurality of leads electrically connected to the first pad groups, and each first pad group is electrically connected to a different lead.

[0006] In a possible implementation, the driver IC provided in an embodiment of the present disclosure includes: a ground signal pad area, an output signal pad area and an input signal pad area located outside and opposite to each other, and a first pad area and a second pad area located outside and opposite to each other.

[0007] The driver IC includes a first side and a second side that are opposite to each other, and a third side and a fourth side that are opposite to each other, wherein the third side and the fourth side are adjacent to the first side and the second side respectively;

[0008] The output signal pad area corresponds to the first side, the input signal pad area corresponds to the second side, the first pad area corresponds to the third side, and the second pad area corresponds to the fourth side; wherein,

[0009] The GOA pad area is located at an edge region of the output signal pad area.

[0010] In a possible implementation, in the driver IC provided in an embodiment of the present disclosure, the output signal pad area further includes a data signal pad area, and the number of the GOA pad areas is two;

[0011] The two GOA pad areas are respectively located at two ends of the data signal pad area.

[0012] In a possible implementation, in the driver IC provided in an embodiment of the present disclosure, the two GOA pad areas are symmetrically arranged with respect to the data signal pad area.

[0013] In a possible implementation, in the driver IC provided by the embodiment of the present disclosure, leads electrically connected to each of the first pad groups away from the input signal pad area are directly led out from the top of the first pad group.

[0014] In a possible implementation, in the driver IC provided in the embodiment of the present disclosure, the leads electrically connected to each first pad group near the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads.

[0015] In one possible implementation, in the driver IC provided by an embodiment of the present disclosure, for the GOA pad area close to the first pad area, leads electrically connected to each of the first pad groups close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the first pad area;

[0016] For the GOA pad area close to the second pad area, the leads electrically connected to each of the first pad groups close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the second pad area.

[0017] In one possible implementation, in the driver IC provided by an embodiment of the present disclosure, for the GOA pad area close to the first pad area, leads electrically connected to a portion of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads, and leads electrically connected to another portion of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the first pad area.

[0018] For the GOA pad area close to the second pad area, the leads electrically connected to a part of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads, and the leads electrically connected to another part of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the second pad area.

[0019] In a possible implementation, the driver IC provided in an embodiment of the present disclosure includes: a ground signal pad area, an output signal pad area and an input signal pad area located outside and opposite to each other, and a first pad area and a second pad area located outside and opposite to each other.

[0020] The driver IC includes a first side and a second side that are opposite to each other, and a third side and a fourth side that are opposite to each other, wherein the third side and the fourth side are adjacent to the first side and the second side respectively;

[0021] The output signal pad area corresponds to the first side, the input signal pad area corresponds to the second side, the first pad area corresponds to the third side, and the second pad area corresponds to the fourth side; wherein,

[0022] The GOA pad area is located on one side of an edge of the input signal pad area.

[0023] In a possible implementation, in the driver IC provided in the embodiment of the present disclosure, the number of the GOA pad areas is two, and the two GOA pad areas are respectively located at two ends of the input signal pad area.

[0024] In a possible implementation, in the driver IC provided in an embodiment of the present disclosure, the two GOA pad areas are symmetrically arranged with respect to the input signal pad area.

[0025] In a possible implementation, the driver IC provided in the embodiment of the present disclosure further includes a first initialization signal pad area and a second initialization signal pad area, wherein the first initialization signal pad area and the second initialization signal pad area are respectively located between the input signal pad area and the corresponding GOA pad area.

[0026] In a possible implementation, the above-mentioned driver IC provided in the embodiment of the present disclosure further includes a first initialization signal pad area and a second initialization signal pad area, the first pad area is multiplexed as the first initialization signal pad area, and the second pad area is multiplexed as the second initialization signal pad area.

[0027] In one possible implementation, in the above-mentioned driver IC provided in an embodiment of the present disclosure, the first initialization signal pad area and the second initialization signal pad area both include multiple second pad groups, each second pad group includes at least two adjacent second pads, and each second pad of each second pad group is electrically connected.

[0028] In a possible implementation, the driver IC provided in the embodiment of the present disclosure further includes a first initialization signal pad area and a second initialization signal pad area, wherein the first initialization signal pad area and the second initialization signal pad area are respectively located at the two ends of the input signal pad area.

[0029] Correspondingly, an embodiment of the present disclosure also provides a display device, including a display panel and the above-mentioned driver IC provided by an embodiment of the present disclosure, the display panel includes a display area and a peripheral area arranged around the display area, and the driver IC is bound to the peripheral area. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of a driver IC provided in the related art;

[0031] Figure 2 A schematic structural diagram of a driver IC provided in an embodiment of the present disclosure;

[0032] Figure 3 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0033] Figure 4 A schematic diagram of the structure of another driver IC provided in the related art;

[0034] Figure 5 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0035] Figure 6 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0036] Figure 7 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0037] Figure 8 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0038] Figure 9 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0039] Figure 10 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0040] Figure 11 A schematic structural diagram of another driver IC provided in an embodiment of the present disclosure;

[0041] Figure 12 A schematic structural diagram of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0043] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “include” or “comprise” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0044] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0045] The size of a folding screen is generally around 8-10 inches, which is significantly larger than a mobile phone. If you want to make a high-resolution folding product, you generally need two ICs in cascade to support it. If you make a single folding IC, it can have the advantage of reducing costs, such as Figure 1 As shown, Figure 1This is a schematic diagram of a driver IC in the related art, which includes: a ground signal pad area 1, an output signal pad area 2 and an input signal pad area 3 located on the periphery of the ground signal pad area 1 and arranged opposite to each other, and a first floating pad area 4 and a second floating pad area 5 located on the periphery of the ground signal pad area 1 and arranged opposite to each other; the output signal pad area 2 includes: a data signal pad area 21, GOA pad areas (represented by GOA1 and GOA2) located on both sides of the data signal pad area 21, and a first initialization signal pad area 4" and a second initialization signal pad area 5" located between the GOA pad area and the data signal pad area 21; the input signal pad area 3 is used to be electrically connected to an FPC (flexible printed circuit); the first floating pad area 4 and the second floating pad area 5 are used to play a supporting role when the driver IC is bound to the display panel, and the first floating pad area 4 and the second floating pad area 5 are dummy pad areas with no internal wiring. In order to improve the resolution of large-size folding products, it is necessary to increase the number of data signal pads in the data signal pad area 21. Since the number of pads in the GOA pad area (represented by GOA1 and GOA2), the first initialization signal pad area 4", and the second initialization signal pad area 5" is limited when the size of a single driver IC is certain, the number of data signal pads in the data signal pad area 21 is limited, which is not conducive to the realization of high-resolution folding products. If a driver IC is used to drive a folding product to reduce costs, it is necessary to have a driver IC that can ensure that the number of pads in the GOA pad area (represented by GOA1 and GOA2), the first initialization signal pad area 4", and the second initialization signal pad area 5" remains unchanged, while increasing the number of data signal pads. That is, designing a folding single driver IC that can support high resolution and low cost is a problem that needs to be solved urgently by those skilled in the art.

[0046] In view of this, the present disclosure provides a driver IC, such as Figure 2 and Figure 3 As shown, at least one GOA pad area is included (taking two as an example, GOA1 and GOA2 are used to represent them respectively), each GOA pad area (GOA1 and GOA2) includes multiple rows and columns of first pads 10 (taking 5 rows and 3 columns as an example), each column of first pads 10 is divided into at least two mutually independent first pad groups A1 (taking each column of first pads 10 as an example, being divided into two mutually independent first pad groups A1), each first pad group A1 includes at least two adjacent first pads 10 (taking a part of the first pad groups A1 as an example, including two adjacent first pads 10, and a part of the first pad groups A1 as an example, and the first pads 10 of each first pad group A1 are electrically connected;

[0047] The device also includes a plurality of leads electrically connected to each first pad group A1, and each first pad group A1 is electrically connected to a different lead (not shown). In other words, each first pad group A1 in the disclosed embodiment is equivalent to outputting a corresponding GOA signal (e.g., a trigger signal, a clock signal, etc.). Furthermore, each GOA signal in the disclosed embodiment is electrically connected using at least two first pads 10 to ensure that the driver IC has sufficient driving force.

[0048] It should be noted that the driver IC provided in the embodiment of the present disclosure is used to provide electrical signals to the foldable display panel. The display panel generally includes a display area and a peripheral area. The display area includes gate lines, data lines, etc. The driver IC is bound to the peripheral area. The peripheral area includes a gate drive circuit (GOA), etc. The GOA circuit generally includes a plurality of gate signal output terminals, each of which is electrically connected to a gate line for inputting a gate scan signal to each gate line row by row. The gate scan signal output by the GOA circuit needs to be realized by the cooperation of an initial trigger signal, a clock signal, etc. The first pad groups A1 of the GOA pad area provided in the embodiment of the present disclosure can be pads (pads) for providing an initial trigger signal, a clock signal, etc. to the GOA circuit. These pads are bound to the pads on the display panel for providing an initial trigger signal, a clock signal, etc. to the GOA circuit.

[0049] like Figure 1 As shown, each GOA pad area (GOA1 and GOA2) in the related art generally includes 20 independently set first pad groups A1 ( Figure 1 Taking GOA1 and GOA2 as an example, each of which includes 6 independently arranged first pad groups A1, each first pad group A1 is composed of all first pads 10 located in the same column electrically connected (taking the same column as an example, which includes 5 electrically connected first pads 10), so GOA1 and GOA2 each occupy 100 (20×5) first pads 10; and the above-mentioned driver IC provided by the embodiment of the present disclosure, by dividing each column of first pads 10 into at least two independently arranged first pad groups A1, since the 20 first pad groups A1 of each GOA pad area in the related art require 20 columns, and each GOA in the embodiment of the present disclosure has 100 (20×5) first pads 10. The 20 first pad groups A1 in the A pad area only require 10 columns, which can save 100 first pads 10. That is, the embodiment of the present disclosure can reduce the occupied space of the GOA pad area (GOA1 and GOA2) by reducing the number of first pads 10 corresponding to each GOA pad area. This can increase the space for making data signal pads (when the driver IC is integrated with the folding product, the data signal pads are used to electrically connect with the data lines of the folding product), thereby increasing the number of data signal pads. When the driver IC is integrated with a large-size folding product, a high-resolution folding product can be achieved based on the use of a single driver IC.

[0050] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 2 As shown, it includes: a ground signal pad area 1, an output signal pad area 2 and an input signal pad area 3 located on the periphery of the ground signal pad area 1 and arranged oppositely, and a first pad area 4' and a second pad area 5' located on the periphery of the ground signal pad area 1 and arranged oppositely; the first pad area 4' is equivalent to Figure 1 The first floating pad area 4 and the second pad area 5' are equivalent to Figure 1 The second floating pad area 5;

[0051] The driver IC includes a first side aa and a second side bb that are opposite to each other, and a third side cc and a fourth side dd that are opposite to each other, wherein the third side cc and the fourth side dd are adjacent to the first side aa and the second side bb respectively;

[0052] The output signal pad area 2 corresponds to the first side aa, the input signal pad area 3 corresponds to the second side bb, the first pad area 4' corresponds to the third side cc, and the second pad area 5' corresponds to the fourth side dd; wherein,

[0053] The GOA pad areas ( GOA1 and GOA2 ) are located at the edge of the output signal pad area 2 .

[0054] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 2 As shown, the output signal pad area 2 also includes a data signal pad area 21, and the number of GOA pad areas is two (GOA1 and GOA2);

[0055] The two GOA pad regions (GOA1 and GOA2) are respectively located at two ends of the data signal pad region 21.

[0056] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 2 As shown, the two GOA pad areas (GOA1 and GOA2) can be symmetrically arranged with respect to the data signal pad area 21. Since the number of first pads 10 of GOA1 and GOA2 in the present disclosure is reduced compared to that of GOA1 and GOA2 in the related art, the occupied space of GOA1 and GOA2 can be reduced, thereby increasing the manufacturing space of the data signal pad area 21, and the number of data signal pads can be increased, thereby realizing high-resolution folding products.

[0057] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 3As shown, it also includes a first initialization signal pad area 4", and a second initialization signal pad area 5", and the first pad area 4' is multiplexed as the first initialization signal pad area 4", and the second pad area 5' is multiplexed as the second initialization signal pad area 5". That is, the embodiment of the present disclosure moves the first initialization signal pad area 4" and the second initialization signal pad area 5" to the first pad area 4' and the second pad area 5' on both sides of the ground signal pad area 1. This can further increase the production space of the data signal pad area 21, further increase the number of data signal pads, and thus further improve the resolution of the folding product driven by a single driver IC, thereby designing a single driver IC for folding products that can support higher resolution and low cost.

[0058] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 3 As shown, the first initialization signal pad area 4" and the second initialization signal pad area 5" each include a plurality of second pad groups A2, each second pad group A2 includes at least two adjacent second pads 20, and the second pads 20 of each second pad group A2 are electrically connected. Each second pad group A2 is used to output an initialization signal, for example, Vinit1, Vinit2, Vinit3, Vinit1', Vinit2', Vinit3' respectively represent the output of the corresponding initialization signal.

[0059] Specifically, Figure 1 and Figure 2 The first initialization signal pad area 4" and the second initialization signal pad area 5" are respectively located between the data signal pad area 21 and the GOA pad area. The first initialization signal pad area 4" and the second initialization signal pad area 5" each include three independently set second pad groups A2. Each second pad group A2 is composed of two columns of 10 second pads 20 electrically connected. Therefore, the first initialization signal pad area 4" and the second initialization signal pad area 5" each occupy 30 (10×3) second pads 20; the embodiment of the present disclosure provides Figure 2 Compared with related technologies Figure 1 The purpose is to reduce the space occupied by the GOA pad area, and the embodiment of the present disclosure provides Figure 3 Compared to Figure 2 Further, the first initialization signal pad area 4" and the second initialization signal pad area 5" are moved to the Dummy pad area (the first pad area 4' and the second pad area 5') on both sides of the driver IC. The Dummy pads in the Dummy pad area that originally played a supporting role can also be used to output signals, thereby improving the utilization rate of the entire driver IC. When the driver IC is bound to the display panel, the position of the corresponding Dummy pad area in the display panel is also more convenient for wiring. In this way, Figure 3 Compared to Figure 1The space occupied by 100+30×2=160 pads will be saved to make data signal pads, which can increase the resolution by 160. Therefore, the resolution of large-size folding products is greatly improved without increasing the cost of the driver IC.

[0060] like Figure 4 As shown, Figure 4 for Figure 1 The lead wires L electrically connected to the first pad groups A1 in the corresponding GOA pad areas (GOA1 and GOA2) are directly drawn out from the top of the first pad groups A1. Figure 2 and Figure 3 The embodiment shown in FIG. 1 includes two first pad groups A1 in each column. This does not allow all the leads L electrically connected to the first pad groups A1 to be directly drawn out from the top of the first pad groups A1. This poses a challenge to the way the leads L electrically connected to each first pad group A1 in the GOA pad area are drawn out. Therefore, in a specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, Figure 5-Figure 7 As shown, Figure 5-Figure 7 All are based on Figure 3 The structure shown is used as an example to illustrate the layout of the lead L, and Figure 5-Figure 7 The GOA1 and GOA2 indicate that there are more first pad groups A1, wherein the leads L electrically connected to each first pad group A1 away from the input signal pad area 3 are directly led out from the top of the first pad group A1.

[0061] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 5 As shown, the leads L electrically connected to each first pad group A1 near the input signal pad area 3 are led out from the bottom end of the first pad group A1 along the gap between two adjacent columns of first pads 10 .

[0062] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 6 As shown, for the GOA pad area (GOA1) close to the first pad area 4', the lead L electrically connected to each first pad group A1 close to the input signal pad area 3 is led out from the bottom end of the first pad group A1 along the gap of the first pad area 4';

[0063] For the GOA pad area (GOA2) near the second pad area 5', the leads L electrically connected to the first pad groups A1 near the input signal pad area 3 are led out from the bottom end of the first pad group A1 along the gap of the second pad area 5'.

[0064] It should be noted that if Figure 6As shown, since there is a certain gap between the first pad area 4' and GOA1, and between the second pad area 5' and GOA2, some of the leads L electrically connected to each first pad group A1 close to the input signal pad area 3 can also be led out from between the first pad area 4' and GOA1, and between the second pad area 5' and GOA2.

[0065] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 7 As shown, for the GOA pad area (GOA1) near the first pad area 4', the lead L electrically connected to a portion of the first pad group A1 (the two leftmost columns) near the input signal pad area 3 is led out from the bottom end of the first pad group A1 along the gap between the first pads 10 in two adjacent columns, and the lead L electrically connected to another portion of the first pad group (columns 3-5 from the left) near the input signal pad area 3 is led out from the bottom end of the first pad group A1 along the gap in the first pad area 4';

[0066] For the GOA pad area (GOA2) close to the second pad area 5', the lead L electrically connected to a part of the first pad group A1 (the two rightmost columns) close to the input signal pad area 3 is led out from the bottom end of the first pad group A1 along the gap between the two adjacent columns of first pads, and the lead L electrically connected to another part of the first pad group A1 (columns 3-5 from the right) close to the input signal pad area 3 is led out from the bottom end of the first pad group A1 along the gap of the second pad area 5'.

[0067] The embodiments of the present disclosure provide Figure 5-Figure 7 The lead method of the GOA pad area shown solves the lead layout problem when the number of pads in the GOA pad area is reduced.

[0068] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 8 As shown, it includes: a ground signal pad area 1, an output signal pad area 2 and an input signal pad area 3 located on the periphery of the ground signal pad area 1 and arranged oppositely, and a first pad area 4' and a second pad area 5' located on the periphery of the ground signal pad area 1 and arranged oppositely; the first pad area 4' is equivalent to Figure 1 The first floating pad area 4 and the second pad area 5' are equivalent to Figure 1 The second floating pad area 5;

[0069] The driver IC includes a first side aa and a second side bb that are opposite to each other, and a third side cc and a fourth side dd that are opposite to each other, wherein the third side cc and the fourth side dd are adjacent to the first side aa and the second side bb respectively;

[0070] The output signal pad area 2 corresponds to the first side aa, the input signal pad area 3 corresponds to the second side bb, the first pad area 4' corresponds to the third side CC, and the second pad area 5' corresponds to the fourth side DD; wherein,

[0071] The GOA pad area (GOA1 and GOA2) is located on one side of the edge of the input signal pad area 3. Specifically, Figure 8 The structure of the GOA pad area (GOA1 and GOA2) is similar to Figure 2 The structure is the same as in, and the first initialization signal pad area 4" and the second initialization signal pad area 5" are located at both ends of the data signal pad area 21, Figure 8 The GOA pad area (GOA1 and GOA2) is moved to one side of the edge of the input signal pad area 3, which can also increase the space of the data signal pad area 21 and increase the number of data signal pads in the data signal pad area 21, thereby improving the resolution.

[0072] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 8 As shown, there are two GOA pad areas ( GOA1 and GOA2 ), and the two GOA pad areas ( GOA1 and GOA2 ) are respectively located at two ends of the input signal pad area 3 .

[0073] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 8 As shown, the two GOA pad regions ( GOA1 and GOA2 ) may be symmetrically arranged with respect to the input signal pad region 3 .

[0074] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 9 As shown, the two GOA pad areas (GOA1 and GOA2) are respectively located at the two ends of the input signal pad area 3, and the driver IC also includes a first initialization signal pad area 4" and a second initialization signal pad area 5". The first initialization signal pad area 4" and the second initialization signal pad area 5" are respectively located between the input signal pad area 3 and the corresponding GOA pad area (GOA1 and GOA2). For example, the first initialization signal pad area 4" is located between the input signal pad area 3 and GOA1, and the second initialization signal pad area 5" is located between the input signal pad area 3 and GOA2. In this way, the GOA pad areas (GOA1 and GOA2), the first initialization signal pad area 4" and the second initialization signal pad area 5" are all moved to the two ends of the input signal pad area 3, which can further increase the space of the data signal pad area 21, further increase the number of data signal pads in the data signal pad area 21, and thus further improve the resolution.

[0075] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 10 As shown, the two GOA pad areas (GOA1 and GOA2) are respectively located at the two ends of the input signal pad area 3, and the driver IC also includes a first initialization signal pad area 4" and a second initialization signal pad area 5", and the first pad area 4' is multiplexed as the first initialization signal pad area 4", and the second pad area 5' is multiplexed as the second initialization signal pad area 5". That is, by moving the GOA pad areas (GOA1 and GOA2) to the two ends of the input signal pad area 3, and moving the first initialization signal pad area 4" and the second initialization signal pad area 5" to the first pad area 4' and the second pad area 5' on both sides of the ground signal pad area 1, the production space of the data signal pad area 21 can also be increased, and the number of data signal pads can be further increased, thereby improving the resolution of the folding product driven by a single driver IC, thereby designing a single driver IC for folding products that can support higher resolution and low cost.

[0076] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 9 and Figure 10 As shown, the first initialization signal pad area 4" and the second initialization signal pad area 5" each include multiple second pad groups A2, each second pad group A2 includes at least two adjacent second pads 20, and each second pad 20 of each second pad group A2 is electrically connected. Figure 9 and Figure 10 The structures of the first initialization signal pad area 4" and the second initialization signal pad area 5" can be seen in FIG. Figure 3 The structure shown.

[0077] In specific implementation, in the above-mentioned driver IC provided in the embodiment of the present disclosure, if Figure 11 As shown, two GOA pad areas (GOA1 and GOA2) are located at both ends of the data signal pad area 21, and the driver IC further includes a first initialization signal pad area 4" and a second initialization signal pad area 5". The first initialization signal pad area 4" and the second initialization signal pad area 5" are located at both ends of the input signal pad area 3. Specifically, Figure 11 The structure of the GOA pad area (GOA1 and GOA2) is similar to Figure 2 The same structure as in Figure 11 The first initialization signal pad area 4" and the second initialization signal pad area 5" are moved to the two ends of the input signal pad area 3, which can also increase the space of the data signal pad area 21 and increase the number of data signal pads in the data signal pad area 21, thereby improving the resolution.

[0078] It should be noted that the embodiments of the present disclosure only illustrate Figure 3 The structure shown corresponds to three ways of leading out the lead L. Figure 2 、 Figure 8-11 The lead wire L can be drawn out in a similar way to Figure 3 The corresponding lead-out method is laid out according to the space gap during actual production.

[0079] Based on the same inventive concept, the present disclosure also provides a display device, such as Figure 12 As shown, the display panel 100 and the driver IC 200 provided in the embodiment of the present disclosure are included. The display panel 100 includes a display area AA and a peripheral area BB arranged around the display area AA. The driver IC 200 is bound to the peripheral area BB. The display area AA includes data lines, initialization signal lines, etc. The peripheral area also includes a GOA circuit. The data signal pads in the data signal pad area of ​​the driver IC are used to transmit data signals to the data lines. The first pad groups in the GOA pad area are used to transmit signals to the initial trigger signal line, clock signal line, etc. of the GOA circuit. The second pad groups in the first initialization signal pad area and the second initialization signal pad area are used to transmit initialization signals to the corresponding initialization signal lines.

[0080] Because the display device solves the problem based on similar principles as the aforementioned driver IC, the implementation of the display device can be referenced to the aforementioned driver IC implementation, and any repetitive details will be omitted. The display device can be any product or component with display or touch functions, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0081] In a specific implementation, the display panel may be a liquid crystal display panel (LCD), or an organic light emitting diode display panel (OLED), or other display panels, which are not limited here.

[0082] In specific implementation, the display device provided by the embodiment of the present disclosure may further include other film layers well known to those skilled in the art, which will not be described in detail here.

[0083] The embodiments of the present disclosure provide a driver IC and a display device. By reducing the number of first pads corresponding to each GOA pad area, the occupied space of the GOA pad area can be reduced. This can increase the space for making data signal pads (when the driver IC is integrated with a folding product, the data signal pads are used to electrically connect to the data lines of the folding product), thereby increasing the number of data signal pads. When the driver IC is integrated with a large-size folding product, a high-resolution folding product can be achieved based on the use of a single driver IC.

[0084] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0085] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such changes and modifications of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such changes and modifications.

Claims

1. A driver IC, wherein: comprising at least one GOA pad area, each of the GOA pad areas comprising multiple rows and columns of first pads, each column of the first pads being divided into at least two mutually independent first pad groups, each of the first pad groups comprising at least two adjacent first pads, and each of the first pad groups being electrically connected; The device further includes a plurality of leads electrically connected to the first pad groups, and each first pad group is electrically connected to a different lead.

2. The driver IC according to claim 1, wherein: include: a ground signal pad area, an output signal pad area and an input signal pad area located outside and opposite to the ground signal pad area, and a first pad area and a second pad area located outside and opposite to the ground signal pad area; The driver IC includes a first side and a second side that are opposite to each other, and a third side and a fourth side that are opposite to each other, wherein the third side and the fourth side are adjacent to the first side and the second side respectively; The output signal pad area corresponds to the first side, the input signal pad area corresponds to the second side, the first pad area corresponds to the third side, and the second pad area corresponds to the fourth side; wherein, The GOA pad area is located at an edge region of the output signal pad area.

3. The driver IC according to claim 2, wherein: The output signal pad area also includes a data signal pad area, and the number of the GOA pad areas is two; The two GOA pad areas are respectively located at two ends of the data signal pad area.

4. The driver IC according to claim 3, wherein: The two GOA pad areas are symmetrically arranged with respect to the data signal pad area.

5. The driver IC according to any one of claims 2 to 4, wherein: Leads electrically connected to the first pad groups that are away from the input signal pad area are directly led out from the top of the first pad groups.

6. The driver IC according to claim 5, wherein: Leads electrically connected to the first pad groups near the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads.

7. The driver IC according to claim 5, wherein: For the GOA pad area close to the first pad area, the leads electrically connected to each of the first pad groups close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the first pad area; For the GOA pad area close to the second pad area, the leads electrically connected to each of the first pad groups close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the second pad area.

8. The driver IC according to claim 5, wherein: For the GOA pad area close to the first pad area, the leads electrically connected to a portion of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads, and the leads electrically connected to another portion of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the first pad area; For the GOA pad area close to the second pad area, the leads electrically connected to a part of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap between two adjacent columns of the first pads, and the leads electrically connected to another part of the first pad group close to the input signal pad area are led out from the bottom end of the first pad group along the gap in the second pad area.

9. The driver IC according to claim 1, wherein: include: a ground signal pad area, an output signal pad area and an input signal pad area located outside and opposite to the ground signal pad area, and a first pad area and a second pad area located outside and opposite to the ground signal pad area; The driver IC includes a first side and a second side that are opposite to each other, and a third side and a fourth side that are opposite to each other, wherein the third side and the fourth side are adjacent to the first side and the second side respectively; The output signal pad area corresponds to the first side, the input signal pad area corresponds to the second side, the first pad area corresponds to the third side, and the second pad area corresponds to the fourth side; wherein, The GOA pad area is located on one side of an edge of the input signal pad area.

10. The driver IC according to claim 9, wherein: The number of the GOA pad areas is two, and the two GOA pad areas are respectively located at two ends of the input signal pad area.

11. The driver IC according to claim 10, wherein: The two GOA pad areas are symmetrically arranged with respect to the input signal pad area.

12. The driver IC according to any one of claims 9 to 11, wherein: It also includes a first initialization signal pad area and a second initialization signal pad area, the first initialization signal pad area is located between the input signal pad area and the GOA pad area close to the first pad area, and the second initialization signal pad area is located between the input signal pad area and the GOA pad area close to the second pad area.

13. The driver IC according to any one of claims 2 to 4 and 6 to 11, wherein: It also includes a first initialization signal pad area and a second initialization signal pad area, the first pad area is multiplexed as the first initialization signal pad area, and the second pad area is multiplexed as the second initialization signal pad area.

14. The driver IC according to claim 13, wherein: The first initialization signal pad region and the second initialization signal pad region each include a plurality of second pad groups, each second pad group includes at least two adjacent second pads, and the second pads of each second pad group are electrically connected.

15. The driver IC according to any one of claims 2 to 4 and 6 to 8, wherein: The first initialization signal pad area and the second initialization signal pad area are respectively located at two ends of the input signal pad area.

16. A display device, wherein: The device comprises a display panel and a driver IC as claimed in any one of claims 1 to 15, wherein the display panel comprises a display area and a peripheral area arranged around the display area, and the driver IC is bound to the peripheral area.

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