An ultrasonic linear array probe, a sensor, and a flaw detection device

Abstract

The present application relates to the field of non-destructive testing, and discloses an ultrasonic array probe, a sensor and a flaw detector. The ultrasonic array probe includes a piezoelectric wafer layer and a signal regulation layer. The signal regulation layer is provided with a plurality of transmission ports and signal pins. The transmission ports are used to be connected to an ultrasonic array flaw detector through cable cores. There are a plurality of piezoelectric array elements on the piezoelectric wafer layer. The signal pins correspond to the piezoelectric array elements one by one, and the corresponding signal pins are electrically connected to the piezoelectric array elements. The number of transmission ports is less than the number of piezoelectric array elements. The signal regulation layer conducts the ultrasonic array flaw detector and the piezoelectric array elements in a time sequence to orderly receive excitation signals and trigger the piezoelectric array elements, and the transmission ports orderly transmit the pulse signals of the plurality of piezoelectric array elements. The present application can effectively reduce the number of cable cores in the ultrasonic array flaw detection device, reduce the volume and weight of the ultrasonic array flaw detection device, and improve the portability and detection efficiency of the ultrasonic array flaw detection device.

Description

Technical Field

[0001] The present application relates to the field of non-destructive testing, and more particularly to an ultrasonic array probe, a sensor, and a flaw detection device. Background Art

[0002] Non-destructive testing (NDT) is a method of detecting internal and surface defects of an object without damaging it. Common non-destructive tests include: Radiographic Testing (RT): Using rays to penetrate the object and then obtaining an image on the back. Defects inside the object will be shown in the image; Ultrasonic Testing (UT): Utilizing ultrasonic waves to penetrate the object and reflect back when encountering defects. By analyzing the characteristics of the reflected waves, the location and size of the defects can be determined; Magnetic Particle Testing (MT): By magnetizing the object and sprinkling magnetic powder on its surface, surface or near-surface defects are detected. The magnetic field changes at the defects, causing the magnetic powder to accumulate at the defects; Liquid Penetrant Testing (PT): By applying special fluorescent or pigment penetrants to find defects that open to the surface. The penetrant will seep into these defects, and then the defects are revealed through cleaning and developing steps.

[0003] An ultrasonic probe is a key component in ultrasonic inspection. Among them, an array probe is a core component in a real-time three-dimensional ultrasonic imaging system. Specifically, the wafer of the array ultrasonic probe is cut both horizontally and vertically, so that the sound beam is focused in the longitudinal, transverse, and thickness directions, thus effectively reducing the noise caused by the sound beam thickness and being able to provide higher contrast and high-resolution image quality.

[0004] The wafer is composed of multiple independent piezoelectric array elements, and each piezoelectric array element requires an independent wire connection to generate an independent pulse signal. Since the number of array elements in a planar array ultrasonic probe is more than that in a general ultrasonic probe, more cable lead-out ports need to be arranged on the limited circuit board, which greatly increases the difficulty of circuit board wiring. Moreover, the number of piezoelectric array elements is proportional to the quality of the generated image. The more piezoelectric array elements there are in a unit space, the higher the resolution and contrast of the generated image. Therefore, in order to improve the detection accuracy of the probe, more array elements need to be arranged in a limited space. However, as the number of array elements increases, the size of a single piezoelectric array element will also decrease accordingly, further increasing the wiring difficulty of the wafer. And it will also lead to an increase in the number of cable leads, requiring a cable with more core wires and a larger outer diameter for data transmission. This not only increases the production difficulty and production cost of the probe, but also increases the volume and weight of the ultrasonic planar array flaw detection equipment, reducing the portability and detection efficiency of the ultrasonic planar array flaw detection equipment. Summary of the Invention

[0005] In order to improve the above problems, the present application provides an ultrasonic planar array probe, a sensor, and a flaw detection device.

[0006] In a first aspect, an ultrasonic planar array probe provided by the present application adopts the following technical solutions:

[0007] An ultrasonic planar array probe for connecting with an ultrasonic planar array flaw detector includes: a piezoelectric wafer layer and a signal regulation layer;

[0008] The signal regulation layer is provided with a plurality of transmission ports, and the transmission ports are used to connect with the ultrasonic planar array flaw detector through cable core wires to receive excitation signals, and the excitation signals are used to trigger the piezoelectric wafer layer to generate pulse signals;

[0009] The signal regulation layer is provided with a plurality of signal pins, and a plurality of piezoelectric array elements are cut on the piezoelectric wafer layer. The signal pins correspond to the piezoelectric array elements one by one, and the corresponding signal pins are electrically connected to the piezoelectric array elements. The signal pins are used to send excitation signals to the piezoelectric array elements and receive the pulse signals generated by the corresponding piezoelectric array elements;

[0010] The number of the transmission ports is less than the number of the piezoelectric array elements. The signal regulation layer is used to conduct the ultrasonic planar array flaw detector and the piezoelectric wafer layer in a time sequence to orderly receive the excitation signals and orderly trigger a plurality of the piezoelectric array elements, and the transmission ports are used to orderly transmit the pulse signals of the plurality of piezoelectric array elements.

[0011] By adopting the above technical solutions, the signal regulation layer is provided with signal pins connected to the piezoelectric array elements, which is convenient for interface docking, reduces the wiring difficulty, and reduces the production difficulty and production cost.

[0012] The signal regulation layer turns on the ultrasonic array flaw detector and the piezoelectric wafer layer according to a time series. Without setting transmission ports equal in number to the piezoelectric elements, all excitation signals for triggering the piezoelectric elements can still be received, so that each piezoelectric element can be triggered. Moreover, when the signal regulation layer turns on the ultrasonic array flaw detector and the piezoelectric wafer layer according to a time series, it can also control the pulse signals of each element to orderly pass on the limited cable cores according to a time series, achieving the purpose of transmitting the pulse signals of multiple elements on the same cable core in different time periods.

[0013] In summary, with such a setting, connecting and combining the above ultrasonic array probe with the ultrasonic array flaw detector to form an ultrasonic array flaw detection device can effectively reduce the number of cable cores, reduce the volume and weight of the ultrasonic array flaw detection device, and improve the portability and detection efficiency of the ultrasonic array flaw detection device.

[0014] Exemplarily, the signal pin is bonded to the piezoelectric element lead.

[0015] By adopting the above technical solution, the arrangement of the piezoelectric elements can be made more compact, and more piezoelectric elements can be cut in a limited space. The more the number of piezoelectric elements per unit space, the higher the resolution and contrast of the generated image. Therefore, such a setting can improve the detection accuracy of the ultrasonic array probe.

[0016] Exemplarily, the piezoelectric wafer layer and the signal regulation layer are arranged opposite to each other, and an ultrasonic backing layer is filled between the piezoelectric wafer layer and the signal regulation layer. The ultrasonic backing layer is used to support the piezoelectric wafer layer and the signal regulation layer.

[0017] By adopting the above technical solution, the ultrasonic backing layer can provide physical support for the piezoelectric wafer layer and the signal regulation layer, and at the same time avoid the deformation of the bonding metal wires caused by the action of external forces and damage to the electrical connection. Further, it can also effectively prevent substances such as dust and moisture from invading and damaging the stability of the electrical connection.

[0018] Moreover, in ultrasonic detection, when a piezoelectric wafer is excited to generate ultrasonic waves, the piezoelectric wafer will not immediately stop vibrating but will continue to generate some oscillations. The ultrasonic waves generated by these oscillations will also be received, thus generating some "echoes" or "noises" in the received signal. This phenomenon may affect the accuracy of ultrasonic detection. The ultrasonic backing layer can absorb the reflected sound waves to a certain extent, reduce the ineffective sound wave reflection and the loss of sound wave energy, thereby improving the detection performance of the device.

[0019] Exemplarily, an impedance matching layer is attached to the side of the piezoelectric wafer layer away from the signal regulation layer. The impedance matching layer is used to be attached to the object to be measured for ultrasonic wave transmission.

[0020] By adopting the above technical solution, the impedance matching layer can improve the transmission of ultrasonic waves between the piezoelectric wafer and the object to be measured, reduce the ultrasonic wave reflection and diffraction caused by impedance mismatch, and improve the transmission efficiency of ultrasonic waves.

[0021] Specifically, during the actual detection process, after the piezoelectric element is triggered and vibrates to generate ultrasonic waves, the ultrasonic waves are transmitted from the piezoelectric element into the object to be measured. Both the piezoelectric element and the object to be measured belong to the transmission media of ultrasonic waves, but there may be a large difference in the acoustic impedance (the product of the sound velocity and density) between the piezoelectric element and the object to be measured, resulting in part of the ultrasonic waves being reflected back to the piezoelectric element and reducing the transmission efficiency of ultrasonic waves. By setting an impedance matching layer between the piezoelectric wafer and the object to be measured and selecting a material with an acoustic impedance that is the geometric mean of the acoustic impedances of the piezoelectric wafer and the object to be measured as the impedance matching layer, when the ultrasonic waves pass through the impedance matching layer, the sudden change in acoustic impedance can be reduced, and the reflected ultrasonic waves can be reduced to improve the transmission efficiency of ultrasonic waves.

[0022] Exemplarily, the piezoelectric wafer layer and the signal regulation layer are arranged opposite to each other, and an impedance matching layer is attached to the side of the piezoelectric wafer layer away from the signal regulation layer for attachment to the object to be measured to allow ultrasonic wave transmission.

[0023] By adopting the above technical solution, the impedance matching layer can improve the transmission of ultrasonic waves between the piezoelectric wafer and the object to be measured, reduce the ultrasonic wave reflection and diffraction caused by impedance mismatch, and improve the transmission efficiency of ultrasonic waves.

[0024] Exemplarily, it further includes a probe housing. The piezoelectric wafer layer, the signal regulation layer, and the impedance matching layer are integrally encapsulated and located in the probe housing. The probe housing is provided with a cable connector for the cable core wire to pass through.

[0025] By adopting the above technical solution, the probe housing provides a kind of protection for the piezoelectric wafer layer, the signal regulation layer, and the impedance matching layer, which can prevent these sensitive components from being affected by physical damage, pollution, or environmental conditions (such as humidity, temperature), thereby enhancing the durability and reliability of the device. The integrally encapsulated design makes the entire system more compact and stable, which helps to improve the performance and long-term stability of the ultrasonic array probe.

[0026] Exemplarily, the piezoelectric wafer is a ceramic piezoelectric wafer, and the piezoelectric wafer is a polygonal planar array wafer or a circular planar array wafer.

[0027] By adopting the above technical solutions, ceramic piezoelectric wafers usually have relatively high piezoelectric coefficients, which means that under the same electric field intensity, they can generate a stronger piezoelectric effect. This enables the ultrasonic array probe to have higher performance and can detect ultrasonic signals more accurately and effectively. Moreover, ceramic materials usually have relatively high mechanical strength and heat resistance. Using a ceramic piezoelectric wafer ultrasonic array probe can stably operate in various harsh environments and has a long service life.

[0028] Designing the piezoelectric wafer as a polygonal array wafer or a circular array wafer allows users to choose according to their specific application requirements. For example, a polygonal array wafer may be more suitable for scanning in a vast area, while a circular array wafer may be more suitable for point-to-point precise detection.

[0029] In a second aspect, an ultrasonic array sensor provided by the present application adopts the following technical solutions:

[0030] An ultrasonic array sensor includes the above ultrasonic array probe and an ultrasonic connector. The ultrasonic connector includes a cable wire group. The cable wire group includes a first connector and a second connector. The first connector is connected to the transmission port, and the second connector is used to connect to an ultrasonic array flaw detector.

[0031] By adopting the above technical solutions, the second connector is used to connect to an ultrasonic array flaw detector, which can not only be used in conjunction with equipment of a specific brand or model, but may also have a certain degree of versatility and be compatible with a variety of ultrasonic array flaw detectors.

[0032] Exemplarily, the cable wire group includes a plurality of cable core wires. The cable core wires correspond to the transmission ports one by one to form a plurality of signal transmission channels for conducting the ultrasonic array probe and the ultrasonic array flaw detector. The cable core wires include a first connection end and a second connection end. A plurality of the first connection ends gather to form the first connector, and a plurality of the second connection ends gather to form the second connector.

[0033] By adopting the above technical solutions, each cable core wire corresponds to a transmission port to construct a plurality of independent signal transmission channels for connecting the ultrasonic array probe and the ultrasonic array flaw detector, which can trigger the piezoelectric elements in an orderly manner and also enable the signals to pass through orderly, achieving the purpose of transmitting pulse signals of multiple elements on the same cable core wire at different time periods.

[0034] A plurality of connection ends gather to form a connector. This design makes the structure of the cable wire group more compact, occupies less space, and is more convenient for installation and use.

[0035] In a third aspect, an ultrasonic array flaw detection device provided by the present application adopts the following technical solutions:

[0036] An ultrasonic planar array flaw detection device includes the above-mentioned ultrasonic planar array sensor and an ultrasonic planar array flaw detector. The ultrasonic planar array flaw detector includes a signal processor and an imaging display. The signal processor is used to send out the excitation signal, receive and process the pulse signal, and transmit the pulse signal to the imaging display in the form of an imaging signal. The imaging display is used to receive and display the imaging signal.

[0037] By adopting the above technical solution, connecting the above ultrasonic planar array sensor and the ultrasonic planar array flaw detector to form an ultrasonic planar array flaw detection device can provide an ultrasonic planar array flaw detection device with a smaller volume and lower mass, improving the portability and detection efficiency of the ultrasonic planar array flaw detection device.

[0038] In summary, the present application includes at least one of the following beneficial technical effects:

[0039] 1. By setting signal pins on the signal regulation layer to connect the signal regulation layer with the piezoelectric array elements, the wiring difficulty is reduced, and the production difficulty and production cost are also reduced.

[0040] 2. By the signal regulation layer conducting the ultrasonic planar array flaw detector and the piezoelectric wafer layer according to the time sequence, all the excitation signals for triggering the piezoelectric array elements can be received without setting transmission ports with the same number as the piezoelectric array elements, so as to achieve that each piezoelectric array element can be triggered. Moreover, the signal regulation layer conducting the ultrasonic planar array flaw detector and the piezoelectric wafer layer according to the time sequence can also control the pulse signals of each element to pass orderly on the limited cable cores according to the time sequence, achieving the purpose of transmitting the pulse signals of multiple elements on the same cable core in different time periods. Description of the Drawings

[0041] Figure 1 It is a structural schematic diagram of an ultrasonic planar array probe Figure 1 。

[0042] Figure 2 It is a structural schematic diagram of an ultrasonic planar array probe Figure 2 。

[0043] Figure 3 It is a shape schematic diagram of the piezoelectric wafer layer.

[0044] Figure 4 It is a structural schematic diagram of an ultrasonic planar array sensor.

[0045] Figure 5 It is a structural schematic diagram of an ultrasonic planar array flaw detection device.

[0046] Description of the Reference Numerals:

[0047] 1. Piezoelectric wafer layer; 11. Piezoelectric element; 2. Signal regulation layer; 21. Signal pin; 22. Transmission port; 3. Wire bonding; 4. Ultrasonic backing layer; 5. Impedance matching layer; 6. Probe housing; 7. Cable connector; 8. Ultrasonic connector; 81. Cable group; 811. First connector; 812. Second connector; 813. Cable core wire; 8131. First connection end; 8132. Second connection end; 9. Ultrasonic linear array flaw detector; 91. Signal processor; 92. Imaging display. Detailed implementation mode

[0048] The following further elaborates on this application in conjunction with the attached drawings. It should be understood that the specific embodiments described herein are merely used to explain this application and are not used to limit this application.

[0049] Embodiment 1 of this application discloses an ultrasonic linear array probe. Refer to Figure 1 , an ultrasonic linear array probe for connecting to an ultrasonic linear array flaw detector 9, comprising: a piezoelectric wafer layer 1 and a signal regulation layer 2, and the piezoelectric wafer layer 1 and the signal regulation layer 2 are arranged opposite to each other.

[0050] Refer to Figure 1 and Figure 2 , the signal regulation layer 2 is provided with a plurality of signal pins 21, and a plurality of piezoelectric elements 11 are cut on the piezoelectric wafer layer 1. The signal pins 21 and the piezoelectric elements 11 correspond one by one, and the corresponding signal pins 21 and piezoelectric elements 11 are electrically connected. In different embodiments, the signal pins 21 can be electrically connected to the piezoelectric elements 11 in different ways. This application embodiment specifically but not restrictively proposes an electrical connection method, and the signal pins 21 and the piezoelectric elements 11 are connected by wire bonding 3. The wire bonding 3 uses a fine metal wire to tightly weld the metal lead wire to the piezoelectric element 11 and the signal pin 21 by using heat or pressure or ultrasonic energy. Specifically, a metal wire can be melted to form a small ball, and then this small ball is pressed on the piezoelectric element 11. Then, the wire bonding 3 machine straightens the metal lead wire and makes the metal lead wire connected to the signal pin 21. Using the wire bonding 3 to connect the signal pin 21 and the piezoelectric element 11 can provide a stable electrical connection for the ultrasonic linear array probe, and the contact area of the wire bonding 3 connection is small, and more piezoelectric elements 11 can be connected in a limited space. The more the number of piezoelectric elements 11 per unit space, the higher the resolution and contrast of the generated image.

[0051] The signal regulation layer 2 is provided with a plurality of transmission ports 22. The transmission ports 22 are used to connect to the ultrasonic linear array flaw detector 9 through the cable core wire 813 to receive the excitation signal. The excitation signal is used to trigger the piezoelectric wafer layer 1 to generate a pulse signal, and the signal pins 21 are used to send the excitation signal to the piezoelectric elements 11 and receive the pulse signal generated by the corresponding piezoelectric elements 11.

[0052] Specifically, during detection, the transmission port 22 receives an excitation signal from the ultrasonic array flaw detector 9, and transmits the excitation signal to the corresponding piezoelectric element 11 through the signal pin 21, so that the piezoelectric element 11 generates mechanical vibration, thereby emitting ultrasonic waves towards the object to be detected. When the piezoelectric element 11 receives the ultrasonic waves returned from the object to be detected, a pulse signal is generated, and the pulse signal is transmitted towards the ultrasonic array flaw detector 9 through the corresponding signal pin 21 and transmission port 22.

[0053] When the piezoelectric crystal emits ultrasonic waves to detect an object, each piezoelectric element 11 is regarded as an independent ultrasonic emission and reception unit. Each piezoelectric element 11 needs to receive the excitation signal and transmit the pulse signal through the signal transmission channel. The cable core wire 813 is the signal transmission channel between the ultrasonic array probe and the ultrasonic array flaw detector 9. In order to effectively reduce the number of cable core wires 813, reduce the volume and weight of the ultrasonic array flaw detection device, and improve the portability and detection efficiency of the ultrasonic array flaw detection device, in the embodiment of the present application, the number of transmission ports 22 is less than the number of piezoelectric elements 11. The signal regulation layer 2 conducts the ultrasonic array flaw detector 9 and the piezoelectric wafer layer 1 in time series to orderly receive the excitation signal and orderly trigger a plurality of piezoelectric elements 11. The transmission port 22 is used to orderly transmit the pulse signals of a plurality of piezoelectric elements 11. With such a setting, it is not necessary to set the transmission ports 22 with the same number as the piezoelectric elements 11 to receive all the excitation signals for triggering the piezoelectric elements 11, so as to achieve that each piezoelectric element 11 can be triggered. Moreover, the signal regulation layer 2 conducts the ultrasonic array flaw detector 9 and the piezoelectric wafer layer 1 in time series and can also control the pulse signals of each element to orderly pass on the limited cable core wire 813 in time series, achieving the purpose of transmitting the pulse signals of multiple elements on the same cable core wire 813 at different time periods.

[0054] Specifically but not limitedly, an embodiment of the present application provides an ultrasonic planar array probe. The piezoelectric wafer layer 1 of the ultrasonic planar probe is a rectangular planar array crystal, including one hundred and sixty piezoelectric array elements 11. Generally, one hundred and sixty piezoelectric array elements 11 need to be connected one by one with one hundred and sixty cable core wires 813. In the embodiment of the present application, the signal regulation layer 2 is provided with ten transmission ports 22. The ten transmission ports 22 are all arranged on the side of the signal regulation layer 2 away from the piezoelectric wafer layer 1. Each transmission port 22 is used to connect a cable core wire 813. Therefore, when the ultrasonic planar array probe is connected to the ultrasonic planar array flaw detector 9, only ten cable core wires 813 are needed. During actual detection, the signal regulation layer 2 orderly conducts the ultrasonic planar array flaw detector 9 and the piezoelectric array elements 11 according to a time series. Specifically, at 0.1 microsecond, ten excitation signals pass through the ten cable core wires 813 to conduct the ultrasonic planar array flaw detector 9 and the first to tenth piezoelectric array elements 11 of the piezoelectric wafer layer 1, so as to trigger the first to tenth piezoelectric array elements 11 to generate mechanical vibrations, enabling the ultrasonic planar array flaw detector 9 to receive the pulse signals emitted by the first to tenth piezoelectric array elements 11; at 0.2 microsecond, ten excitation signals pass through the ten cable core wires 813 to conduct the ultrasonic planar array flaw detector 9 and the eleventh to twentieth piezoelectric array elements 11 of the piezoelectric wafer layer 1, so as to trigger the eleventh to twentieth piezoelectric array elements 11 of the piezoelectric wafer layer 1 to generate mechanical vibrations, enabling the ultrasonic planar array flaw detector 9 to receive the pulse signals emitted by the eleventh to twentieth piezoelectric array elements 11; at 0.3 microsecond, ten excitation signals pass through the ten cable core wires 813 to conduct the ultrasonic planar array flaw detector 9 and the twenty-first to thirtieth piezoelectric array elements 11 of the piezoelectric wafer layer 1, so as to trigger the twenty-first to thirtieth piezoelectric array elements 11 of the piezoelectric wafer layer 1 to generate mechanical vibrations, enabling the ultrasonic planar array flaw detector 9 to receive the pulse signals emitted by the twenty-first to thirtieth piezoelectric array elements 11... And so on, in such a cycle, each piezoelectric array element 11 can be excited orderly. Further, the excitation sequence can also be changed according to the actual situation. For example, at 0.1 microsecond, ten excitation signals conduct the ultrasonic planar array flaw detector 9 and the first to tenth piezoelectric array elements 11 of the piezoelectric wafer layer 1, and at 0.2 microsecond, ten excitation signals conduct the ultrasonic planar array flaw detector 9 and the second to eleventh piezoelectric array elements 11 of the piezoelectric wafer layer 1, etc.

[0055] To improve the stability of the connection between the piezoelectric wafer layer 1 and the signal regulation layer 2 and avoid the deformation of the bonding metal wire caused by the action of external forces, which may damage the electrical connection, a specific but non-limiting structure is provided. An ultrasonic backing material is filled between the piezoelectric wafer layer 1 and the signal regulation layer 2 to form an ultrasonic backing layer 4 for supporting the piezoelectric wafer layer 1 and the signal regulation layer 2. The ultrasonic backing material is usually selected as a low acoustic impedance material, such as rubber or epoxy resin. Using a low acoustic impedance material to make the ultrasonic backing layer 4 can not only provide physical support for the piezoelectric wafer layer 1 and the signal regulation layer 2 and prevent substances such as dust and moisture from invading and damaging the stability of the electrical connection, but also absorb the ultrasonic waves reflected by the object to be measured, reduce the ineffective acoustic wave reflection and the loss of acoustic wave energy, thereby improving the detection resolution and accuracy.

[0056] Further, during the actual detection process, after the piezoelectric element 11 is triggered to vibrate and generate ultrasonic waves, the ultrasonic waves are transmitted from the piezoelectric element 11 into the object to be measured. Both the piezoelectric element 11 and the object to be measured are ultrasonic transmission media, but there may be a large difference in the acoustic impedance (the product of the sound velocity and density) between the piezoelectric element 11 and the object to be measured, resulting in part of the ultrasonic waves being reflected back to the piezoelectric element 11 and reducing the transmission efficiency of the ultrasonic waves. To improve the transmission efficiency of the ultrasonic waves, a specific but non-limiting structure is proposed. An impedance matching layer 5 is adhesively provided on the side of the piezoelectric wafer layer 1 away from the signal regulation layer 2. The impedance matching layer 5 is used to be adhesively attached to the object to be measured for ultrasonic wave transmission, reduce the sudden change in acoustic impedance, and improve the transmission efficiency of the ultrasonic waves. The impedance matching layer 5 is usually made of a material with a medium acoustic impedance, such as epoxy resin, alumina or titanium oxide with a medium acoustic impedance. Further, in practical applications, to further enhance the impedance matching effect, the impedance matching layer 5 is usually precisely controlled to be one-fourth of the ultrasonic wavelength.

[0057] It is worth mentioning that in different embodiments, the piezoelectric wafer layer 1 can be made of different materials, as long as it has sufficient piezoelectric properties. Piezoelectric properties refer to that piezoelectric materials can generate charges when subjected to mechanical pressure or undergo physical deformation under the action of an electric field. As an example, in the embodiments of the present application, the piezoelectric wafer layer 1 is made of ceramic, and the ceramic has sufficient piezoelectric properties. Specifically, lead titanate (PZT) ceramic can be used. In the crystal structure of the ceramic, the centers of positive and negative charges do not coincide, which can form an electric dipole moment. Under the action of an external electric field, the electric dipole moment will be oriented, resulting in a slight change in the volume of the ceramic and generating the inverse piezoelectric effect. On the contrary, under the action of mechanical pressure, the orientation of the electric dipole moment will change, thereby generating charges, that is, its piezoelectric effect. Further, lead titanate ceramic can also be doped with different dopants to change its crystal structure and electrical properties, thereby obtaining various materials with different piezoelectric properties, providing a wide range of choices for the application of the ultrasonic planar array probe.

[0058] ReferenceFigure 3 In addition to the rectangular planar array wafers, the piezoelectric wafer layer 1 can also have different shapes. In practical applications, the shape of the piezoelectric wafer layer 1 is designed according to the application scenarios of the ultrasonic planar array probe. It can also be a circular planar array wafer or a special-shaped planar array wafer.

[0059] To avoid physical damage to the piezoelectric wafer layer 1, the signal regulation layer 2, the ultrasonic backing layer 4, and the impedance matching layer 5, a structure is specifically but not limitedly proposed. The ultrasonic planar array probe further includes a probe housing 6, and the piezoelectric wafer layer 1, the signal regulation layer 2, the ultrasonic backing layer 4, and the impedance matching layer 5 are integrally encapsulated and then fixed in the probe housing 6. The probe housing 6 is provided with a cable connector 7. When the ultrasonic planar array probe is connected to the ultrasonic planar array flaw detector 9, the cable core wire 813 can penetrate into the probe housing 6 to be connected to the transmission port 22. The cable connector 7 can also protect the cable core wire 813. The probe housing 6 can play a role in dust and waterproofing. Specifically, since the ultrasonic planar array probe may be applied in some harsh environments, the probe housing 6 needs to have sufficient corrosion resistance. In the embodiment of the present application, the probe housing 6 is made of stainless steel, which can be stainless steel 316 or stainless steel 304.

[0060] Referring to Figure 4 In the second embodiment of the present application, an ultrasonic planar array sensor is disclosed. An ultrasonic planar array sensor includes the above-mentioned ultrasonic planar array probe and an ultrasonic connector 8. The ultrasonic connector 8 includes a cable wire group 81. The cable wire group 81 includes a first connector 811 and a second connector 812. The first connector 811 is connected to the transmission port 22, and the second connector 812 is used to connect to the ultrasonic planar array flaw detector 9. Specifically, the cable wire group 81 includes multiple cable core wires 813. The cable core wires 813 correspond to the transmission port 22 one by one to form multiple signal transmission channels for conducting the ultrasonic planar array probe and the ultrasonic planar array flaw detector 9. The cable core wire 813 includes a first connection end 8131 and a second connection end 8132. Multiple first connection ends 8131 gather to form the first connector 811, and multiple second connection ends 8132 gather to form the second connector 812.

[0061] Referring to Figure 5 In the third embodiment of the present application, an ultrasonic planar array flaw detection device is disclosed. An ultrasonic planar array flaw detection device includes the above-mentioned ultrasonic planar array sensor and an ultrasonic planar array flaw detector 9. The ultrasonic planar array flaw detector 9 includes a signal processor 91 and an imaging display 92. The signal processor 91 is used to send out excitation signals, receive and process pulse signals, and transfer the pulse signals to the imaging display 92 in the form of imaging signals. The imaging display 92 is used to receive and display the imaging signals. Specifically, the signal processor 91 amplifies, filters, and other processes the pulse signals and then converts the pulse signals into imaging signals.

[0062] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. An ultrasonic linear array probe, characterized in that, For connection with an ultrasonic linear array flaw detector (9), comprising: a piezoelectric wafer layer (1) and a signal regulation layer (2); The signal regulation layer (2) is provided with a plurality of transmission ports (22), and the transmission ports (22) are used to connect with the ultrasonic linear array flaw detector (9) through cable cores (813) to receive excitation signals, and the excitation signals are used to trigger the piezoelectric wafer layer (1) to generate pulse signals; The signal regulation layer (2) is provided with a plurality of signal pins (21), a plurality of piezoelectric array elements (11) are cut on the piezoelectric wafer layer (1), the signal pins (21) correspond to the piezoelectric array elements (11) one by one, and the corresponding signal pins (21) are electrically connected to the piezoelectric array elements (11), and the signal pins (21) are used to send excitation signals to the piezoelectric array elements (11) and receive the pulse signals generated by the corresponding piezoelectric array elements (11); The number of the transmission ports (22) is less than the number of the piezoelectric array elements (11), and the signal regulation layer (2) is used to conduct the ultrasonic linear array flaw detector (9) and the piezoelectric wafer layer (1) in a time sequence to orderly receive the excitation signals and orderly trigger a plurality of the piezoelectric array elements (11), and the transmission ports (22) are used to orderly transmit the pulse signals of the plurality of piezoelectric array elements (11).

2. The ultrasonic linear array probe according to claim 1, characterized in that The signal pins (21) and the piezoelectric array elements (11) are connected by wire bonding (3).

3. The ultrasonic linear array probe according to claim 2, wherein The piezoelectric wafer layer (1) and the signal regulation layer (2) are arranged oppositely, and an ultrasonic backing layer (4) is filled between the piezoelectric wafer layer (1) and the signal regulation layer (2), and the ultrasonic backing layer (4) is used to support the piezoelectric wafer layer (1) and the signal regulation layer (2).

4. The ultrasonic matrix probe according to claim 3, characterized in that An impedance matching layer (5) is attached to the side of the piezoelectric wafer layer (1) away from the signal regulation layer (2), and the impedance matching layer (5) is used to be attached to a test object for ultrasonic wave transmission.

5. The ultrasonic linear array probe according to claim 1, wherein The piezoelectric wafer layer (1) and the signal regulation layer (2) are arranged oppositely, and an impedance matching layer (5) is attached to the side of the piezoelectric wafer layer (1) away from the signal regulation layer (2), and the impedance matching layer (5) is used to be attached to a test object for ultrasonic wave transmission.

6. The ultrasonic linear array probe according to claim 4, wherein It further includes a probe housing (6), the piezoelectric wafer layer (1), the signal regulation layer (2) and the impedance matching layer (5) are integrally encapsulated and located in the probe housing (6), and the probe housing (6) is provided with a cable connector (7) for the cable cores (813) to penetrate.

7. The ultrasonic linear array probe according to any one of claims 1-6, wherein The piezoelectric wafer layer (1) is a ceramic piezoelectric wafer, and the ceramic piezoelectric wafer is a polygonal linear array wafer or a circular linear array wafer.

8. An ultrasonic matrix sensor, characterized in that, It includes the ultrasonic linear array probe according to any one of claims 1-6 and an ultrasonic connector (8), the ultrasonic connector (8) includes a cable group (81), the cable group (81) includes a first connector (811) and a second connector (812), the first connector (811) is connected to the transmission port (22), and the second connector (812) is used to connect with the ultrasonic linear array flaw detector (9).

9. The ultrasonic matrix sensor according to claim 8, characterized in that, The cable group (81) includes a plurality of the cable core wires (813) to form a plurality of signal transmission channels. The cable core wires (813) correspond to the transmission ports (22) one by one and are used to conduct the ultrasonic array probe and the ultrasonic array flaw detector (9). The cable core wire (813) includes a first connection end (8131) and a second connection end (8132). A plurality of the first connection ends (8131) gather to form the first joint (811), and a plurality of the second connection ends (8132) gather to form the second joint (812).

10. An ultrasonic planar array flaw detection device, characterized in that, Comprising the ultrasonic array sensor according to any one of claims 8-9 and the ultrasonic array flaw detector (9). The ultrasonic array flaw detector (9) includes a signal processor (91) and an imaging display (92). The signal processor (91) is used to emit the excitation signal, receive and process the pulse signal, and transmit the pulse signal to the imaging display (92) in the form of an imaging signal. The imaging display (92) is used to receive and display the imaging signal.

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