Display panel and display device

By stretching the winding and shrinking the connection on the flexible substrate, the display uneven problem caused by the attenuation of the output signal of the driver chip is solved, and uniform display of the display panel is achieved and the preparation difficulty is reduced.

CN116844415BActive Publication Date: 2025-08-19MIANYANG HKC OPTOELECTRONICS TECH CO LTD +1
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Patent Information

Application Number
CN202310799157.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-30
Publication Date
2025-08-19
Estimated Expiration
2043-06-30

AI Technical Summary

Technical Problem

Since the data signal voltage output by the driver chip causes different degrees of signal attenuation in different sector areas, the display panel screen is uneven.

Method used

The second connecting line is arranged in the stretched state by using a flexible substrate and connected to the first connecting line in the contracted state to form an ultra-fine line and adjust the trace length to ensure impedance consistency.

Benefits of technology

It realizes that without increasing the wiring area, the display uniformity of the display panel is improved, and the manufacturing difficulty and accuracy requirements of ultra-fine lines are reduced.

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Abstract

The present application relates to a display panel and a display device. The display panel includes a driver chip, signal lines, traces, and a substrate. The traces connect the driver chip and the signal lines, and the traces include a first connecting line and a second connecting line connected to each other. The substrate includes a rigid substrate and a flexible substrate. The first connecting line is provided on the rigid substrate. When the flexible substrate is stretched, the second connecting line is formed on the flexible substrate. When the flexible substrate is contracted, the second connecting line is connected to the first connecting line. The display panel solves the problem of uneven display on the display panel caused by varying degrees of signal attenuation of the data signal voltage output by the driver chip.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In a display panel, scan lines, signal lines, and common electrodes typically work together to display different images. The signal lines control the grayscale voltage data required for the display. Generally, each pixel consists of three sub-pixels, and each sub-pixel's corresponding grayscale requires a signal line to control it. The voltage required for each signal line to complete the display is typically output to the panel in a point-to-point manner by a driver chip. Because the width of the driver chip is smaller than the width of all the signal lines in the corresponding area on the panel, the traces connecting the signal lines and the driver chip typically form a fan-shaped area.

[0003] With the development of the display industry, consumers are demanding higher and higher display resolutions, often requiring multiple integrated driver chips to meet display load requirements. Because different chips correspond to different positions of signal lines on the panel, the fan-out traces within each sector area vary in length, with the outer fan-out traces within each sector area being longer than the inner fan-out traces. This difference in fan-out trace length leads to differences in resistance between the fan-out traces, causing varying degrees of signal attenuation in the data signal voltage output from the driver chip, ultimately resulting in uneven display on the display panel. Summary of the Invention

[0004] The present application provides a display panel and a display device to solve the problem that a data signal voltage output by a driver chip generates different degrees of signal attenuation, resulting in uneven display of a display panel image.

[0005] In a first aspect, the present application provides a display panel, including a driver chip and a signal line, wherein the display panel further includes:

[0006] a wiring connecting the driver chip and the signal line, the wiring comprising a first connecting line and a second connecting line connected to each other; and

[0007] The substrate includes a hard substrate and a flexible substrate, the first connecting line is arranged on the hard substrate, the second connecting line is formed on the flexible substrate when the flexible substrate is stretched, and the second connecting line is connected to the first connecting line when the flexible substrate is contracted.

[0008] In a possible implementation manner, the second connecting line is connected to an end portion of the first connecting line.

[0009] In a possible implementation manner, the first connecting line and the second connecting line are bonded and connected by a conductive fluid.

[0010] In a possible implementation, the flexible substrate has a transverse and / or longitudinal stretching space on a horizontal plane.

[0011] In a possible implementation, when the flexible substrate is in a stretched state, the thickness of the second connecting line is smaller than that of the first connecting line; and when the flexible substrate is in a contracted state, the thickness of the second connecting line is the same as that of the first connecting line.

[0012] In a possible implementation, a receiving groove is formed on the hard substrate, and the flexible substrate is embedded in the receiving groove.

[0013] In a possible implementation, the flexible substrate includes a flexible printed surface, the second connecting line is provided on the flexible printed surface, and a thickness direction of the rigid substrate is parallel to the flexible printed surface.

[0014] In one possible implementation, the hard substrate includes a hard printed surface, the first connecting line is arranged on the hard printed surface, and the flexible substrate also includes a first side surface and a second side surface that are parallel to the hard printed surface, the first side surface and the second side surface are both perpendicular to the flexible printed surface, and the first side surface is arranged above the second side surface, and both ends of the second connecting line are arranged on the first side surface.

[0015] In one possible implementation, there is a fan-shaped area between the signal line and the driver chip, the routing line is arranged in the fan-shaped area, and the fan-shaped area includes two outer areas and an inner area located between the two outer areas; the length of the first connecting line in the outer area is greater than the length of the first connecting line in the inner area, and the length of the second connecting line in the outer area is less than the length of the second connecting line in the inner area.

[0016] In a second aspect, the present application provides a display device, comprising: the display panel as described in the first aspect.

[0017] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0018] The display panel provided in this embodiment has second connecting wires wound around the flexible substrate when the flexible substrate is stretched. When the flexible substrate is contracted, the second connecting wires on the flexible substrate also contract and become thinner, thereby forming ultrafine wires on the flexible substrate. This increases the wire length within the same area. The second connecting wires are then connected to the first connecting wires, thereby adjusting multiple wires to have the same length, ensuring impedance consistency across the multiple wires and guaranteeing display uniformity. Furthermore, by forming the second connecting wires on the flexible substrate while it is stretched, ultrafine wires are obtained after the flexible substrate contracts. Compared to prior art processes for directly producing ultrafine wires, this application reduces the manufacturing difficulty and precision of ultrafine wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0022] Figure 1 It is a wiring structure of a fan-out area of a display panel in the prior art;

[0023] Figure 2 The improved fan-out area wiring structure of the display panel in the prior art;

[0024] Figure 3 A schematic diagram of the overall structure of a display panel provided in an embodiment of the present application;

[0025] Figure 4(a) is a schematic structural diagram of a flexible substrate;

[0026] Figure 4(b) is a schematic diagram of the structure of the flexible substrate after transverse stretching;

[0027] FIG4( c ) is a schematic structural diagram of the arrangement of the second connecting line in FIG4( b );

[0028] Figure 4(d) is a schematic diagram of the structure of Figure 4(c) after contraction;

[0029] FIG4(e) is a schematic diagram of the structure of FIG4(a) after being stretched in both the transverse and longitudinal directions;

[0030] FIG4( f ) is a schematic structural diagram of the arrangement of the second connecting line in FIG4( c );

[0031] Figure 4(g) is a schematic diagram of the structure after contraction of Figure 4(f);

[0032] Figure 5 To reflect the top view of the hard substrate;

[0033] Figure 6 for Figure 5 side view.

[0034] Description of reference numerals:

[0035] 1. Driver chip; 2. Signal line;

[0036] 3. Routing; 31. First connecting line; 32. Second connecting line;

[0037] 4. Hard substrate; 5. Flexible substrate. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0039] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0040] For ease of description, spatially relative terms may be used herein to describe the relative position or movement of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," "above," "front," "back," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figures undergoes a positional flip or a change in posture or a change in motion, then these directional indications will also change accordingly. For example, an element described as "below" or "below" another element or feature will subsequently be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein will be interpreted accordingly.

[0041] In order to solve the problem in the prior art that the fan-out traces of each fan-shaped area are of different lengths due to the different positions of signal lines on the panel corresponding to different chips, and the fan-out traces on the outside of each fan-shaped area are longer than the fan-out traces on the inside. The difference in fan-out trace lengths will lead to differences in resistance between fan-out traces, thereby affecting display uniformity; the present application provides a display panel that can solve the problem of different degrees of signal attenuation of the data signal voltage output by the driver chip, which ultimately causes uneven display on the display panel.

[0042] Example 1

[0043] Reference Figure 3-Figure 5 , an embodiment of the present application provides a display panel, including a driver chip 1 and a signal line 2, the display panel further comprising:

[0044] a wiring 3, wherein the wiring 3 connects the driver chip 1 and the signal line 2, and the wiring 3 includes a first connecting line 31 and a second connecting line 32 connected to each other; and

[0045] The substrate includes a hard substrate 4 and a flexible substrate 5, wherein the first connecting line 31 is arranged on the hard substrate 4, and when the flexible substrate 5 is in a stretched state, the second connecting line 32 is formed on the flexible substrate 5, and when the flexible substrate 5 is in a contracted state, the second connecting line 32 is connected to the first connecting line 31.

[0046] When the flexible substrate 5 is stretched, the second connecting wire 32 is wound and arranged on the flexible substrate 5. When the flexible substrate 5 is contracted, the second connecting wire 32 on the flexible substrate 5 also contracts and becomes thinner, thereby forming an ultra-fine wire on the flexible substrate 5, increasing the wire length within the same area. The second connecting wire 32 is then connected to the first connecting wire 31, thereby adjusting the multiple traces 3 to traces 3 of the same length, ensuring impedance consistency across the multiple traces 3 and guaranteeing display uniformity. In addition, by forming the second connecting wire 32 on the flexible substrate 5 while it is stretched, an ultra-fine wire is obtained after the flexible substrate 5 contracts. Compared to the prior art process of directly preparing ultra-fine wires, the present application reduces the manufacturing difficulty and preparation precision of the ultra-fine wire.

[0047] Reference Figure 1 In the field of panel design, since the width of the driver chip 1 is smaller than the width of all signal lines 2 in the corresponding area on the panel, the traces 3 connecting the signal lines 2 and the driver chip 1 will form a fan-out area. The inconsistent length of the traces 3 in the fan-out area will lead to inconsistent impedance of the traces 3, thus affecting the display uniformity. Figure 2 To address this issue, conventional techniques employ a winding routing method for multiple traces 3 of varying lengths, thereby aligning the lengths of traces 3 at different locations and ensuring impedance consistency across the multiple traces 3. However, the traces 3 using the winding routing method occupy a large area, making it difficult to adapt to the trend toward narrow bezels in display devices.

[0048] Reference Figure 3 , there is a fan-shaped area between the signal line 2 and the driver chip 1, and the routing line 3 is arranged in the fan-shaped area, and the fan-shaped area includes two outer areas and an inner area located between the two outer areas; the length of the first connecting line 31 in the outer area is greater than the length of the first connecting line 31 in the inner area, and the length of the second connecting line 32 in the outer area is less than the length of the second connecting line 32 in the inner area; thereby making the overall length of each routing line 3 in the fan-shaped area the same, and the impedance of each routing line 3 is consistent, thereby ensuring the display effect. Of course, the routing line in the outer area can also only include the first connecting line 31, and the two ends of the first connecting line 31 are respectively connected to the signal line 2 and the driver chip 1. The routing line 3 does not include the second connecting line 32, so there is no need to set the flexible substrate 5 in the area corresponding to the routing line 3. Only a hard substrate 4 is required in this area, thereby simplifying the preparation process flow. The length of the first connecting line 31 located in the inner area is less than the length of the first connecting line 31 located in the outer area. The length of the second connecting line 32 located in the inner area is compensated according to the difference between the length of the first connecting line 31 connected to it and the length of the first connecting line 31 located in the outer area, so that the lengths of the traces 3 in the fan-shaped area are the same.

[0049] Reference Figure 3 As shown in Figure 4 , in this application, the wiring and connection of the second connecting wire 32 are achieved by stretching and contracting the flexible substrate 5. When the flexible substrate 5 is stretched, the length of the second connecting wire 32 is increased by winding the wire around the flexible substrate 5. Since the flexible substrate 5 is connected in a contracted state, the cross-sectional area of the second connecting wire 32 can be reduced after the flexible substrate 5 contracts, so that the second connecting wire 32 does not increase the layout area of the fan-out area after connection. In addition, the winding length of the multiple traces 3 gradually decreases from the trace 3 located in the middle to the second connecting wire 32 located in the traces 3 on both sides. This allows the lengths of multiple traces 3 to be adjusted to be the same without changing the area occupied by the traces 3, thereby ensuring consistent impedance across the multiple traces 3 and ensuring a good display effect.

[0050] The flexible substrate 5 has a horizontal and / or vertical stretching space on the horizontal plane. When the flexible substrate 5 has a horizontal stretching space on the horizontal plane, that is, referring to Figure 4(a)-Figure 4(d) In the embodiment, the flexible substrate 5 can be stretched and contracted in the left and right directions. When the flexible substrate 5 is stretched, the second connecting wire 32 is printed on it. After the flexible substrate 5 is contracted, the second connecting wire 32 forms an ultra-fine winding structure. Of course, the flexible substrate 5 can also have a longitudinal stretching space in the horizontal plane, that is, the flexible substrate 5 can be stretched and contracted in the vertical direction. Optionally, refer to Figure 4(e)-Figure 4(g) The flexible substrate 5 has both horizontal and vertical stretching space on the horizontal plane. When stretched, its surface area can be proportionally expanded, significantly increasing the length of the wires wound on the flexible substrate 5. It also allows for more complex wiring structures. When the flexible substrate 5 contracts, its area returns to its minimum, enabling complex wiring arrangements. For the middle trace 3 among the multiple traces 3, since it is the shortest of the multiple traces 3, its second connecting line 32 is the longest. In this case, a flexible substrate 5 with both horizontal and vertical stretching space can be used to prepare and connect the longest second connecting line 32.

[0051] Reference Figure 3 The second connecting wire 32 is connected to the end of the first connecting wire 31. After the second connecting wire 32 is connected to the first connecting wire 31, the other end of the second connecting wire 32 can be connected to the signal wire 2 or the driver chip 1. Correspondingly, when the other end of the second connecting wire 32 is connected to the signal wire 2, the other end of the first connecting wire 31 is connected to the driver chip 1; when the other end of the second connecting wire 32 is connected to the driver chip 1, the other end of the second connecting wire 32 is connected to the signal wire 2, thereby electrically connecting the driver chip 1 and the signal wire 2 in the display panel.

[0052] Of course, the second connecting line 32 can also be connected to the middle position of the first connecting line 31. That is, the first connecting line 31 includes a first connecting section and a second connecting section, one end of the second connecting line 32 is connected to the first connecting section, the other end of the second connecting line 32 is connected to the second connecting section, the other end of the first connecting section is connected to the signal line 2, and the other end of the second connecting section is connected to the driver chip 1; thereby achieving an electrical connection between the driver chip 1 and the signal line 2. However, this connection method requires connecting four connection points, which requires more preparation steps and increases the difficulty of preparation.

[0053] Similarly, the first connecting line 31 can also be connected to the middle position of the second connecting line 32, that is, the second connecting line 32 includes a third connecting section and a fourth connecting section. The specific connection method is the same as above and will not be described in detail in this embodiment.

[0054] When the flexible substrate 5 is in a stretched state, the thickness of the second connecting line 32 is less than the thickness of the first connecting line 31; when the flexible substrate 5 is in a contracted state, the thickness of the second connecting line 32 is the same as the thickness of the first connecting line 31; when the flexible substrate 5 is in a stretched state, the second connecting line 32 is deposited on the flexible substrate 5, and the thickness of the second connecting line 32 on the flexible substrate 5 is thinner than the thickness of the first connecting line 31 on the hard substrate 4. When the flexible substrate 5 is in a contracted state, the contraction of the flexible substrate 5 increases the thickness of the second connecting line 32 thereon, so that after the second connecting line 32 is connected to the first connecting line 31, the thickness of the second connecting line 32 on the flexible substrate 5 is the same as the thickness of the first connecting line 31 on the hard substrate 4.

[0055] Since the first connecting wire 31 is provided on the rigid substrate 4 and the second connecting wire 32 is provided on the flexible substrate 5, wherein the rigid substrate 4 comprises a glass substrate, to ensure the stability of the connection between the first connecting wire 31 and the second connecting wire 32, the first connecting wire 31 and the second connecting wire 32 are bonded together using a conductive fluid. The connection between the first connecting wire 31 and the second connecting wire 32 is electrically connected using an adhesive conductive fluid. The conductive fluid is fluid before solidification, and after solidification, it forms an adhesive structure, thereby ensuring a stable connection between the first connecting wire 31 and the second connecting wire 32. Of course, the flexible substrate 5 and the rigid substrate 4 can also be connected by fluid bonding to achieve a stable connection between the flexible substrate 5 and the rigid substrate 4.

[0056] Reference Figure 5 and Figure 6 The rigid substrate 4 is provided with a receiving groove, into which the flexible substrate 5 is embedded. The provision of the receiving groove provides a connection location for the flexible substrate 5 on the rigid substrate 4, and the structural arrangement of the receiving groove also ensures the stability of the flexible substrate 5 after connection.

[0057] The depth of the receiving groove is the same as the thickness of the flexible substrate 5. After the flexible substrate 5 is placed in the receiving groove, the upper surface of the flexible substrate 5 is flush with the upper surface of the rigid substrate 4, ensuring the flatness of the display panel surface after connection and facilitating subsequent work. In addition, the second connecting line 32 is provided on the upper surface of the flexible substrate 5, and the first connecting line 31 is provided on the upper surface of the rigid substrate 4. This allows the first connecting line 31 and the second connecting line 32 to be connected at the same height, facilitating the connection of the first connecting line 31 and the second connecting line 32. It also ensures the stability of the first connecting line 31 and the second connecting line 32 after connection, and reduces the possibility of the first connecting line 31 and the second connecting line 32 being disconnected at the connection point.

[0058] The flexible substrate 5 includes a flexible printed surface, and the second connecting line 32 is arranged on the flexible printed surface. The thickness direction of the rigid substrate 4 is parallel to the flexible printed surface. The thickness direction of the rigid substrate 4 is parallel to the flexible printed surface. In this case, the width or thickness of the flexible substrate 5 is located on the surface of the rigid substrate 4 used for arranging the first connecting line 31. The width and thickness of the flexible substrate 5 are both smaller than the length of the flexible substrate 5, thereby reducing the space occupied by the flexible substrate 5 on the rigid substrate 4.

[0059] Optionally, since the thickness of the flexible substrate 5 is smaller than the width and length of the flexible substrate 5, when the thickness direction of the hard substrate 4 is parallel to the flexible printed surface, the thickness of the flexible substrate 5 is located on the surface of the hard substrate 4 for arranging the first connecting line 31, thereby embedding the flexible substrate 5 in the hard substrate 4, reducing the space occupied by the flexible substrate 5 on the horizontal plane of the hard substrate 4.

[0060] Reference Figure 5 and Figure 6 The rigid substrate 4 includes a rigid printed surface, and the first connecting line 31 is disposed on the rigid printed surface. The flexible substrate 5 also includes a first side surface and a second side surface that are both parallel to the rigid printed surface. The first side surface and the second side surface are both perpendicular to the flexible printed surface, and the first side surface is disposed above the second side surface. Both ends of the second connecting line 32 are disposed on the first side surface. The first side surface is disposed above the second side surface, and the first side surface is parallel to the rigid printed surface, including the first side surface and the rigid printed surface being coplanar, or having a height difference between the first side surface and the rigid printed surface. Optionally, the first side surface of the flexible substrate 5 and the rigid printed surface of the rigid substrate 4 are coplanar, and both ends of the second connecting line 32 are disposed on the first side surface. This allows the second connecting line 32 and the first connecting line 31 to be coplanar, facilitating connection between the first connecting line 31 and the second connecting line 32, and ensuring stability after the first connecting line 31 and the second connecting line 32 are connected.

[0061] Of course, the two ends of the second connecting line 32 can also be located on the first side surface and the second side surface, respectively. The end of the second connecting line 32 located on the first side surface can be directly connected. Since the end of the second connecting line 32 located on the second side surface is inside the rigid substrate 4, a corresponding slot is required in the rigid substrate 4. By injecting a liquid connector into the slot, the component located on the rigid printed surface of the rigid substrate 4 and the end of the second connecting line 32 are connected.

[0062] To sum up, the display panel provided by the present application arranges the second connecting line 32 on a stretchable flexible substrate 5, first stretches the flexible substrate 5 significantly, and then performs wiring deposition preparation for the second connecting line 32. After the wiring is completed, the flexible substrate 5 will shrink and recover, thereby driving the second connecting line 32 to shrink and become thinner, thereby obtaining an ultra-fine second connecting line 32; the overall length of the trace 3 is increased by winding and the cross-sectional area of the trace 3 can be reduced. From the trace 3 in the middle to the trace 3 on both sides, the winding degree of the second connecting line 32 gradually decreases to ensure that the impedance of the trace 3 is consistent. The winding method of the present application will not increase the area occupied by the trace 3, and can ensure that the impedance of multiple traces 3 is consistent without increasing the layout area of the fan-out area.

[0063] Example 2

[0064] Reference Figures 1-6 The present application also provides a display device, which includes the display panel described in the aforementioned embodiment. The technical features of the display panel can be found in the previous description and will not be elaborated on here. Since the display device disclosed in the present application includes the display panel provided in the aforementioned embodiment, the display device including the display panel also has all the aforementioned technical effects, which will not be elaborated on here.

[0065] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0066] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0067] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features of the present application.

Claims

1. A display panel comprising a driver chip and a signal line, characterized in that: The display panel further includes: a wiring connecting the driver chip and the signal line, the wiring comprising a first connecting line and a second connecting line connected to each other; and The substrate includes a hard substrate and a flexible substrate, wherein the first connecting line is arranged on the hard substrate, and when the flexible substrate is in a stretched state, the second connecting line is formed on the flexible substrate, and when the flexible substrate is in a contracted state, the second connecting line is connected to the first connecting line; wherein the end of the second connecting line is connected to the end of the first connecting line.

2. The display panel according to claim 1, wherein: The first connecting line and the second connecting line are bonded and connected by a conductive fluid.

3. The display panel according to claim 1, wherein: The flexible substrate has a transverse and / or longitudinal stretching space on a horizontal plane.

4. The display panel according to claim 1, wherein: When the flexible substrate is in a stretched state, the thickness of the second connecting line is smaller than that of the first connecting line; and when the flexible substrate is in a contracted state, the thickness of the second connecting line is the same as that of the first connecting line.

5. The display panel according to any one of claims 1 to 4, characterized in that: The hard substrate is provided with a receiving groove, and the flexible substrate is embedded in the receiving groove.

6. The display panel according to claim 5, wherein: The flexible substrate includes a flexible printed surface, the second connecting line is arranged on the flexible printed surface, and the thickness direction of the hard substrate is parallel to the flexible printed surface.

7. The display panel according to claim 6, wherein: The hard substrate includes a hard printed surface, the first connecting line is arranged on the hard printed surface, the flexible substrate also includes a first side surface and a second side surface both parallel to the hard printed surface, the first side surface and the second side surface are both perpendicular to the flexible printed surface, and the first side surface is arranged above the second side surface, and both ends of the second connecting line are arranged on the first side surface.

8. The display panel according to claim 1, wherein: There is a fan-shaped area between the signal line and the driver chip, and the routing line is arranged in the fan-shaped area, and the fan-shaped area includes two outer areas and an inner area located between the two outer areas; the length of the first connecting line in the outer area is greater than the length of the first connecting line in the inner area, and the length of the second connecting line in the outer area is less than the length of the second connecting line in the inner area.

9. A display device, characterized in that: include: The display panel according to any one of claims 1 to 8.

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