Wafer chuck mark plate fixing method

Abstract

The application provides a wafer chuck mark plate fixing method, and relates to the technical field of semiconductors. The wafer chuck mark plate fixing device mainly comprises a suction cup, a wafer chuck, a pair of precision gaskets, a pair of mark plates, two mark plate supports, two pressing blocks, a three-dimensional linear module, a dispensing device, a height sensor and a shooting device, so as to realize the wafer chuck mark plate fixing function, guarantee a high position precision, be relatively convenient and simple to disassemble, improve work efficiency, and avoid wafer chuck damage.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a wafer chuck mark plate fixing method. BACKGROUND

[0002] The wafer chuck, as the most common wafer fixing tool in the semiconductor field, has a pattern of circular vacuum grooves or micro suction holes, which can fix the wafer in a proper position. The reference mark of the wafer is aligned with the relative position of the mark on the wafer chuck through alignment technology, and the accuracy directly determines the processing precision of the wafer. The measurement of the relative position is generally realized through the alignment device / technology, and the working depth of field of the high-precision measuring device is very small, usually less than 0.02mm. Correspondingly, the alignment mark needs to be fixed in the wafer chuck, and the installation accuracy meets the working depth of field of the measuring device.

[0003] At present, the embedding method of the alignment mark plate on the wafer chuck is mainly through the artificial gluing method, which has the disadvantages of difficult to guarantee the position accuracy and low efficiency. If the gluing is unqualified, it is also more cumbersome to remove the mark plate, and the operation process is easy to damage the mark plate and the wafer chuck. SUMMARY

[0004] Therefore, the wafer chuck mark plate fixing method provided by the embodiments of the present application can guarantee high position precision, is relatively convenient and simple to disassemble, improves the work efficiency, and can avoid damage to the wafer chuck.

[0005] The embodiments of the present application provide the following technical solutions:

[0006] In one aspect, the wafer chuck mark plate fixing method provided by the embodiments of the present application comprises:

[0007] S1: a pair of precision gaskets are adsorbed by a suction cup, and the pair of precision gaskets are symmetric with respect to the center of the suction cup;

[0008] S2: a wafer chuck with two through openings is adsorbed on the suction cup, wherein the through openings can accommodate the pair of precision gaskets, and the front surface of the wafer chuck is opposite to the adsorption surface of the suction cup;

[0009] S3: a pair of mark plates are respectively placed on the pair of precision gaskets with the front surfaces opposite to each other through the two through openings, and then two mark plate supports are respectively placed outside the pair of mark plates and fixed on the wafer chuck;

[0010] S4: measuring whether the surface height of the two mark plate supports is lower than the back surface height of the wafer chuck by adjusting the three-dimensional linear module, if yes, continue to measure the Z-axis coordinates of the glue injection holes on the two mark plate supports, if no, repeat the step S3 until the condition is met, and then calculate the X-axis coordinates and Y-axis coordinates of the glue injection holes by using the shooting device;

[0011] S5: placing two pressing blocks on the pair of mark plates respectively, so that the pair of mark plates are tightly attached to the pair of precision pads respectively;

[0012] S6: according to the X-axis coordinates, Y-axis coordinates and Z-axis coordinates of the glue injection holes, driving the glue dispensing device to dispense glue to the glue injection holes by the three-dimensional linear module until the glue solidifies;

[0013] S7: removing the two pressing blocks, lifting the wafer chuck and removing the pair of precision pads, and then turning over the wafer chuck so that the back surface of the wafer chuck is adsorbed on the suction plate relative to the ground;

[0014] S8: measuring whether the height difference between the pair of mark plates and the wafer chuck is less than a preset value by the three-dimensional linear module driving the height sensor to measure the height difference between the pair of mark plates and the wafer chuck respectively, if yes, the fixing of the pair of mark plates is completed, if no, remove the two mark plate supports together with the pair of mark plates and re-fix them.

[0015] In some embodiments, the adsorption is achieved by inserting a negative pressure air pipe into the air pipe joint arranged on the wafer chuck.

[0016] In some embodiments, the pair of precision pads are adsorbed on the adsorption holes of the wafer chuck.

[0017] In some embodiments, the method further comprises adjusting and fixing the position of the wafer chuck by the top block and push rod cylinder arranged on the periphery of the wafer chuck.

[0018] In some embodiments, the position of the wafer chuck is adjusted to be on the same straight line with the center of the wafer chuck and the center of the suction plate.

[0019] In some embodiments, the two mark plate supports are fixed on the wafer chuck by screws.

[0020] In some embodiments, the thickness of the pair of precision pads is 0.005mm.

[0021] In some embodiments, the preset value is 3mm.

[0022] In another aspect, a wafer chuck mark plate fixing device is provided, which comprises the suction cup, the wafer chuck, the pair of precision pads, the pair of mark plates, the two mark plate supports, the two pressing blocks, the three-dimensional linear module, the dispensing device, the height sensor and the shooting device according to any one of the above embodiments, so as to realize the wafer chuck mark plate fixing function.

[0023] In another aspect, a wafer chuck device is provided, which comprises the wafer chuck mark plate fixing device according to claim 9.

[0024] Compared with the prior art, the above-mentioned at least one technical scheme adopted by the embodiments of the present application can achieve the beneficial effects at least including:

[0025] 1. Since the precision pads are mainly vacuum adsorbed by the suction cup, the precision pads can be fixed flat on the suction cup. The wafer chuck is vacuum adsorbed on the suction cup, so that the wafer chuck can be tightly attached to the upper surface of the suction cup. The height difference between the upper surface of the mark plate and the adsorption surface of the wafer chuck is equivalent to the thickness of the precision pad. The height difference between the mark plate and the mark plate support and the adsorption surface of the wafer chuck is measured by the height sensor, so that whether the mark plate fixing meets the requirements can be accurately judged. Therefore, the above-mentioned configuration can guarantee high positional precision.

[0026] 2. In addition, the mark plate is fixed by the mark plate support and the mark plate, and then the dispensing is performed at individual positions. The above-mentioned configuration can realize high alignment accuracy, and is relatively convenient and simple to disassemble. Therefore, the time for disassembling the mark plate can be reduced, and the work efficiency can be improved. In addition, the same set of mark plate supports can be adapted to different wafer chucks with different mark patterns, so that the reusability is high, and the wafer chuck can be prevented from being damaged. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0028] Figure 1 is a wafer chuck mark plate fixing method flowchart provided by the embodiments of the present application;

[0029] Figure 2 is a wafer chuck mark plate fixing device schematic diagram provided by the embodiments of the present application;

[0030] Figure 3 is a wafer chuck mark plate fixing device schematic diagram provided by the embodiments of the present application;

[0031] Figure 4 A schematic diagram of a partial structure of a wafer chuck mark plate fixing device is provided in the embodiments of the present application.

[0032] Figure 5 is Figure 4 A side view of a partial structure of a wafer chuck mark plate fixing device.

[0033] Explanation of reference signs:

[0034] 1 - base, 2 - suction cup, 3 - X-axis module, 4 - Y-axis module, 5 - Z-axis, 6 - shooting device, 7 - height sensor, 8 - dispensing device, 9 - top block, 10 - push rod cylinder, 11 - wafer chuck, 12 - mark plate, 13 - mark plate support, 14 - pressing block, 15 - precision gasket, 16 - air pipe joint, 17 - adsorption hole, 18 - glue injection hole, 19 - vacuum adsorption groove, 20 - air hole DETAILED DESCRIPTION

[0035] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0036] The embodiments of the present application are described below by way of specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. The present application can also be implemented or applied by other different specific embodiments, and the details in the specification can be modified or changed based on different views and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0037] It should be noted that the various aspects of the embodiments described below are within the scope of the appended claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms and that any specific structure and / or function described herein is merely illustrative. Based on the teachings herein one skilled in the art should appreciate that an aspect described herein can be implemented independently of any other aspects and that two or more of these aspects can be combined in various ways. For example, an apparatus can be implemented or a method can be practiced using any number of the aspects described herein. In addition, such an apparatus can be implemented or such a method can be practiced using other structure and / or functionality in addition to or other than one or more of the aspects described herein.

[0038] It is also need to be explained that the figures provided in the following embodiments only illustrate the basic concept of the present application in a schematic way, and only the components related to the present application are shown in the figures, not the number, shape and size of the components when actually implemented, the shape, number and ratio of the components when actually implemented can be a random change, and the component layout pattern can also be more complex.

[0039] In addition, in the following description, specific details are provided in order to facilitate a thorough understanding of the examples. However, one skilled in the art will understand that the examples can be practiced without these specific details.

[0040] The wafer chuck mark plate fixing device and wafer chuck device provided by the embodiments of the present application mainly include a suction cup 2, a wafer chuck 11, a pair of precision gaskets 15, a pair of mark plates 12, two mark plate supports 13, two pressing blocks 14, a three-dimensional linear module, a dispensing device 8, a height sensor 7 and a shooting device 6, to realize the following wafer chuck mark plate fixing functions. In some embodiments, the wafer chuck mark plate fixing device and wafer chuck device further include a base 1, and other components such as the suction cup 2 can be reasonably arranged on the base 1. In some embodiments, the shooting device 6 can adopt a camera, such as a CCD camera. In some embodiments, the dispensing device 8 can adopt a dispensing machine. In some embodiments, the three-dimensional linear module can include an X-axis module 3, a Y-axis module 4 and a Z-axis module 5, which together realize the position adjustment in three-dimensional space. In some embodiments, the three-dimensional linear module can be linked with components such as the dispensing device 8, the height sensor 7 and the shooting device 6 according to the scene needs. In some embodiments, the wafer chuck 11 is further provided with a plurality of vacuum adsorption grooves 19 and air holes 20 for adsorbing and adapting wafers of different sizes.

[0041] As shown in Figures 1 to 5 By implementing the following wafer chuck mark plate fixing method, the improved wafer chuck mark plate fixing function can be realized, mainly including the following steps:

[0042] S1: The suction cup 2 adsorbs a pair of precision gaskets 15, and the pair of precision gaskets 15 is symmetrically arranged with respect to the center of the suction cup 2. In some embodiments, the position of the wafer chuck 11 is adjusted and fixed by the top block 9 and the push rod cylinder 10 arranged on the periphery of the wafer chuck 11. In some embodiments, the position of the wafer chuck 11 is adjusted to be on the same straight line with the center of the wafer chuck 11 and the center of the suction cup 2. In some embodiments, the specific adsorption arrangement can be realized by inserting the air pipe joint 16 arranged on the wafer chuck 11 into the negative pressure air pipe (not shown in the figure). In some embodiments, a plurality of adsorption holes 17 are arranged on the wafer chuck 11, and the pair of precision gaskets 15 can be adsorbed and arranged on the wafer chuck 11 by connecting the adsorption holes 17 to negative pressure.

[0043] S2: The wafer chuck 11 with two middle through openings, which can accommodate a pair of precision pads 15, is adsorbed on the suction plate 2, with the front surface of the wafer chuck 11 opposite the adsorption surface of the suction plate 2 (i.e. the upper surface of the suction plate 2 shown). Figure 1 In some embodiments, the negative pressure pipe can be inserted through the air pipe joint 16, the position of the wafer chuck 11 can be adjusted horizontally so that the precision pads 15 are in the middle of the middle through openings, and the pipe is connected to the vacuum to adsorb the wafer chuck 11 on the suction plate 2.

[0044] S3: A pair of marking plates 12 are placed on a pair of precision pads 15 respectively through the two middle through openings, with the front surface opposite, and then two marking plate supports 13 are placed on the periphery of the pair of marking plates 12 respectively, and the two marking plate supports 13 are fixed on the wafer chuck 11. In some embodiments, the two marking plate supports 13 are fixed on the wafer chuck 11 by screws. In some embodiments, the two marking plate supports 13 can be made of the same material as the peripheral wafer chuck 11, such as stainless steel, so that they can meet the requirements of precise and good fit after being fixed.

[0045] S4: The height sensor 7 is used to measure whether the surface height of the two marking plate supports 13 meets the condition of being lower than the back surface height of the wafer chuck 11, and if so, the Z-axis coordinates of the glue injection holes 18 on the two marking plate supports 13 are measured, and if not, the step S3 is repeated until the condition is met, and then the X-axis and Y-axis coordinates of the glue injection holes 18 are calculated by the shooting device 6. In some embodiments, before height measurement, the height sensor 7 can be adjusted to a suitable position for measuring the two marking plate supports 13 by the three-dimensional linear module, so as to obtain accurate coordinate values of the glue injection holes 18.

[0046] S5: Two pressing blocks 14 are placed on a pair of marking plates 12 respectively, so that a pair of marking plates 12 are tightly attached to a pair of precision pads 15.

[0047] S6: According to the X-axis, Y-axis and Z-axis coordinates of the glue injection holes, the glue injection device 8 is driven by the three-dimensional linear module (i.e. the glue injection device 8 can be adjusted by the three-dimensional linear module) to inject glue into each glue injection hole 18 to a certain depth until the glue solidifies.

[0048] S7: The two pressing blocks 14 are removed, the wafer chuck 11 is lifted and a pair of precision pads 15 are removed, and then the wafer chuck 11 is flipped (e.g. 180°) so that the back surface of the wafer chuck 11 is adsorbed on the suction plate 2. In some embodiments, the wafer chuck 11 can be fixed by connecting the vacuum to the adsorption groove of the suction plate 2.

[0049] S8: The height sensor 7 is driven by the three-dimensional linear module to measure whether the height difference between the pair of mark plates 12 and the wafer chuck 11 is less than a preset value, if yes, the pair of mark plates 12 is fixed, if not, the two mark plate supports 13 together with the pair of mark plates 12 are removed and then refixed. In some embodiments, the two mark plate supports 13 together with the pair of mark plates 12 can be removed and put into a sol to separate the two, and then refixed by performing the above steps S1 to S8.

[0050] In some embodiments, the thickness of the pair of precision pads 15 is 0.005mm, and the standard preset value for judging whether the height difference between the pair of mark plates 12 and the wafer chuck 11 meets the requirement is 3mm.

[0051] In summary, the wafer chuck mark plate fixing method, wafer chuck mark plate fixing device and wafer chuck device provided by the embodiments of the present application have at least the following beneficial effects compared with the prior art:

[0052] 1. Since the precision pad is mainly vacuum adsorbed by the suction cup, it can be ensured that the precision pad is flatly fixed on the suction cup; the wafer chuck is vacuum adsorbed on the suction cup, which can ensure that it is tightly attached to the upper surface of the suction cup, so that the height difference between the upper surface of the mark plate and the adsorption surface of the wafer chuck is equivalent to the thickness of the precision pad, and the height difference between the mark plate and the mark plate support and the adsorption surface of the wafer chuck is measured by using the height sensor, which can accurately judge whether the mark plate meets the requirements, so this configuration can ensure high precision.

[0053] 2. Moreover, the mark plate is fixed by the mark plate support and the mark plate, and then the individual places are glued, which can realize high alignment accuracy, and is relatively convenient and simple to disassemble, so as to reduce the time of disassembling the mark plate, improve the work efficiency, and in addition, the same set of mark plate supports can be adapted to different wafer chucks with different mark patterns, the reusability is high, and the wafer chuck damage can be avoided.

[0054] In the present specification, the same and similar parts among various embodiments can be referred to each other, and each embodiment focuses on the difference from other embodiments. Especially, for the product embodiment described later, since it corresponds to the method, the description is relatively simple, and the related parts can be referred to the part of the system embodiment.

[0055] Also, the use of "a" or "an" to describe elements of the specification is merely for convenience and is not intended in a limiting sense unless specifically so stated. Furthermore, some of the features of the one or more embodiments of the disclosure can be used to advantage without the corresponding use of other features. As such, the foregoing description shall not be construed to require or imply the performance of all of the understanding or optional steps or options outlined no the disclosure. No structure, act or combination of acts described herein is meant to be a step of a method or process unless specifically recited as such.

[0056] In addition, the order of processing elements or sequences described in this specification is not intended to be construed as a limitation, unless specifically stated. Furthermore, some of the features of the one or more embodiments of the disclosure can be used to advantage without the corresponding use of other features. As such, the foregoing description shall not be construed to require or imply the performance of all of the understanding or optional steps or options outlined no the disclosure. No structure, act or combination of acts described herein is meant to be a step of a method or process unless specifically recited as such.

[0057] Having now described some embodiments of the application, it should be apparent to those skilled in the art that numerous modifications, substitutions, and alterations can be made herein without departing from the spirit and scope of the application. Accordingly, it is intended that all such modifications, alterations, and permutations be considered as various embodiments of the application according to the disclosure. Although exemplary of implementations of the application, it is the intent of the inventors that limitations as used in the following claims be construed based on the language of the claims themselves, and not based on the details of the above description.

Claims

1. A wafer chuck reticle fixing method characterized by, The application relates to a method for fixing a pair of mark plates on a wafer chuck, comprising the following steps: S1: a pair of precision pads are symmetrically arranged on a suction disc; S2: a wafer chuck with two through openings is arranged on the suction disc, wherein the two through openings can accommodate the pair of precision pads, and the front surface of the wafer chuck is opposite to the suction surface of the suction disc; S3: a pair of mark plates are respectively arranged on the pair of precision pads with the front surfaces opposite to each other through the two through openings, then two mark plate supports are respectively arranged on the peripheries of the pair of mark plates, and the two mark plate supports are fixed on the wafer chuck; S4: the surface heights of the two mark plate supports are measured by a height sensor through a three-dimensional linear module, and if the surface heights are lower than the height of the back surface of the wafer chuck, the Z-axis coordinates of glue injection holes on the two mark plate supports are measured, if not, the step S3 is repeated until the condition is met, then the X-axis coordinates and Y-axis coordinates of the glue injection holes are calculated by a shooting device; S5: two pressing blocks are respectively arranged on the pair of mark plates, so that the pair of mark plates are tightly attached to the pair of precision pads; S6: glue is injected into the glue injection holes by a glue injection device driven by the three-dimensional linear module according to the X-axis coordinates, Y-axis coordinates and Z-axis coordinates of the glue injection holes until the glue solidifies; S7: the two pressing blocks are removed, the wafer chuck is lifted and the pair of precision pads are removed, then the wafer chuck is turned over and the back surface of the wafer chuck is adsorbed on the suction disc; S8: the height differences between the pair of mark plates and the wafer chuck are measured by the height sensor driven by the three-dimensional linear module, if the height differences are less than a preset value, the fixing of the pair of mark plates is completed, if not, the two mark plate supports and the pair of mark plates are removed and then fixed again.

2. The method of claim 1, wherein, The adsorption is realized by inserting a negative pressure air pipe into an air pipe joint arranged on the wafer chuck.

3. The method of claim 2, wherein, The pair of precision pads are adsorbed on adsorption holes of the wafer chuck.

4. The method of claim 1, wherein, Further comprising: A top block and a push rod cylinder arranged on the periphery of the wafer chuck are used to adjust and fix the position of the wafer chuck.

5. The method of claim 4, wherein, The position of the wafer chuck is adjusted so that the center of the wafer chuck is located on the same straight line as the center of the suction disc.

6. The method of claim 1, wherein, The two mark plate supports are fixed on the wafer chuck by screws.

7. The method of claim 1, wherein, The thickness of the pair of precision pads is 0.005 mm.

8. The method of claim 1, wherein, The preset value is 3 mm.

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