A new type of special processing tool for silicon products and its usage method

Abstract

The present invention discloses a new type of special processing tool for silicon products, comprising: a tool body; a protrusion extending from the center of the tool body to the side wall of the tool body; a tool rod fixedly connected to the middle of the top surface of the tool body; a bottom grinding edge fixedly connected to the bottom surface of the protrusion; wherein the distance from the protrusion away from the tool body to the tool rod axis is greater than the minimum distance from the undercut structure to the silicon ring axis and is not greater than the minimum distance from the base to the silicon ring axis. The present application can be used in an ordinary three-axis machining center to realize machining at the undercut structure of brittle materials, with simple process and low cost.

Description

Technical Field

[0001] The present invention relates to a brittle material processing technology, specifically a novel special processing tool for silicon products and its usage method. Background Art

[0002] For some circular ring-shaped and flange-shaped silicon material products with special-shaped undercut structures (such as Figure 1 and Figure 3 , the silicon material products include silicon rings, and a plurality of undercut structures are arranged on the silicon rings in a circumferential array with respect to the axis of the silicon rings. The undercut structure includes a base portion and a claw portion located on the top surface of the base portion. The undercut structure is integrally in an inverted L shape, and the undercut structure is bent towards the center of the product); when grooving the projection area of the claw portion on the silicon ring (in combination with Figures 1 - 4 ), due to the hard and brittle characteristics of the silicon material, using conventional cutting methods is likely to cause material fragmentation, thereby resulting in product scrapping. However, silicon is a relatively expensive material and excessive scrapping is not allowed. Therefore, grinding or milling is preferably used. However, since the claw portion will affect the tool feed of a conventional three-axis machining center, the current three-axis machining center in combination with existing grinding tools cannot process this feature, and thus a high-cost four-axis or five-axis device is required. The four-axis or five-axis device not only has complex processing technologies and numerous process steps, but also has high costs. Summary of the Invention

[0003] In order to solve at least one technical problem mentioned in the background art, the purpose of the present invention is to provide a novel special processing tool for silicon products, enabling grooving processing in the projection area where the claw portion projects onto the silicon ring for brittle material products of flange type or disc type with undercut structures by using a three-axis machining center, with simple technology and low cost.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A novel special processing tool for silicon products, where the silicon products include silicon rings and a plurality of undercut structures arranged on the top surface of the silicon rings. The plurality of undercut structures are distributed in a circular array with respect to the axis of the silicon rings. The undercut structure includes a base portion and a claw portion located on the top surface of the base portion, and includes:

[0006] A tool body;

[0007] A protrusion extending from the center of the tool body towards the side wall of the tool body;

[0008] A tool shank fixedly connected to the middle of the top surface of the tool body;

[0009] A bottom grinding edge fixedly connected to the bottom surface of the protrusion;

[0010] Wherein, the distance from the side of the protrusion away from the cutter body to the axis of the cutter rod is greater than the minimum distance from the undercut structure to the axis of the silicon ring and is not greater than the minimum distance from the base to the axis of the silicon ring.

[0011] Optionally, the blade body is in a disc shape, the protrusion extends from the peripheral wall of the blade body in the radial direction of the blade body, and the radius of the blade body is not greater than the minimum distance between the undercut structure and the axis of the silicon ring.

[0012] Optionally, there are at least two protrusions and they are distributed in a circular array about the axis of the blade body.

[0013] Optionally, the angles between the two side surfaces of the protrusion and the axis of the blade body are not greater than the minimum angle between two adjacent undercut structures and the axis of the silicon ring.

[0014] Optionally, a through hole is formed on the top surface of the blade body.

[0015] Optionally, there are multiple through holes, and the multiple through holes are distributed in a circular array about the axis of the blade body.

[0016] Optionally, a side grinding edge is fixedly connected to the side surface of the protrusion.

[0017] Optionally, a side surface of the protrusion away from the blade body is a curved surface.

[0018] Optionally, two edges of the side surface of the protrusion away from the tool rod and parallel to the tool rod axis are rounded.

[0019] A method for using a new type of special processing tool for silicon products based on any one of the above items, the specific steps of which are:

[0020] a: Set the tool, control the tool bar to be coaxial with the product to be processed, adjust the raised part to between the two undercut structures of the product to be processed, and control the tool body to move down until the top surface of the raised part is lower than the hook part of the undercut structure;

[0021] b: Processing, first control the tool to rotate, then control the tool downward along the axis of the tool bar to grind the product to be processed using the bottom grinding edge until the grinding of the feature to be processed is completed;

[0022] c: Retract the tool, control the tool to stop rotating, adjust the raised part to between the two undercut structures of the processed product, and lift the tool to a safe position.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The machining tool proposed in the embodiments of the present application can be directly applied to ordinary three-axis machining equipment. The ordinary three-axis machining equipment drives the tool body to rotate, and then drives the protrusion and the bottom grinding edge below the protrusion to rotate as a whole, so as to achieve the purpose of grooving the projection area of the claw part projected onto the silicon ring of flange-like or disc-like brittle material products with an undercut structure. Not only is the machining process simpler than that of four-axis or five-axis equipment, but also the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. is a schematic diagram of the overall structure of the product to be machined;

[0026] Figure 2 FIG. is a schematic diagram of the overall structure of the machined product;

[0027] Figure 3 FIG. is a schematic cross-sectional view of the product to be machined;

[0028] Figure 4 FIG. is a schematic cross-sectional view of the machined product;

[0029] Figure 5 FIG. is a top view of the product to be machined;

[0030] Figure 6 FIG. is a schematic diagram of the overall structure of the present invention;

[0031] Figure 7 is Figure 5 a schematic enlarged view of the structure at A in

[0032] In the figure: 1. Tool body; 2. Protrusion; 3. Tool shank; 4. Bottom grinding edge; 5. Through hole; 6. Side grinding edge; 10. Product to be machined; 11. Machined product; 111. Feature to be machined; 12. Silicon ring; 13. Undercut structure; 131. Matrix part; 132. Claw part. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] For better understanding, the machining of existing flange-like or disc-like brittle material products with an undercut structure will be introduced below:

[0035] Refer to Figure 1 and Figure 3; First, introduce the shape of the silicon product. This type of silicon product includes a silicon ring 12, on which there are multiple reverse buckling structures 13, and these reverse buckling structures 13 are circumferentially arrayed about the axis of the silicon ring. The reverse buckling structure 13 includes a base part 131 connected to the silicon ring 12 and a claw part 132 located on the top surface of the base part 131.

[0036] Refer to Figures 1 - 4 ; If you want to slot the projection area of the claw part 132 of the flange product or disc product of the reverse buckling structure 13 on the surface of the silicon ring 12 to obtain the to-be-machined feature 111. When the material of the to-be-machined product 10 is a metal material, an L-shaped cutter or a T-shaped cutter can be fully utilized to control the rotation of the cutter or the to-be-machined product 10, and then cut the to-be-machined part of the to-be-machined product 10 to obtain the required feature, and its machining process is relatively convenient. However, due to the hard and brittle characteristics of the silicon material, the use of conventional cutting methods is likely to cause the material to break and crumble, and then cause the product to be scrapped. In addition, silicon is a relatively expensive material and does not allow too much scrapping. Therefore, grinding or milling is appropriate.

[0037] However, since the claw part 132 will affect the tool feed of a conventional three-axis machining center, the current three-axis machining center cooperating with the existing grinding tools cannot machine this feature. Although the existing four-axis or five-axis machining centers can meet the machining requirements, the prices of the four-axis and five-axis machining centers are too high, resulting in a greatly increased cost investment.

[0038] Therefore, it is very necessary to design a suitable tool so that a three-axis machining center can be used to slot and machine the projection area of the claw part of the flange-like or disc-like brittle material product with a reverse buckling structure on the silicon ring, which can greatly reduce the cost.

[0039] Please refer to Figure 5 and Figure 6 , a novel special machining tool for a silicon product provided in this embodiment, includes a tool body 1, which extends from the center of the tool body 1 towards the side wall of the tool body 1. A tool rod 3 is fixedly connected to the middle of the top surface of the tool body 1, and a bottom grinding edge 4 is fixedly connected to the bottom surface of the protrusion 2.

[0040] Furthermore, the tool body 1 is in a disc shape, the protrusion 2 extends from the circumferential wall of the tool body 1 along the radial direction of the tool body 1, and the radius of the tool body 1 is not greater than the minimum distance between the reverse buckling structure 13 and the axis of the silicon ring 12.

[0041] In combination with specific usage scenarios, the blade body 1 is designed to be disc-shaped because the disc-shaped blade body 1 has a relatively high coaxiality when rotating. For example, if the blade body 1 is rectangular, directly fixing the grinding blade at a suitable position on the bottom surface of the blade body 1 can also meet the processing requirements of the product 10 to be processed. However, after long-term use, the rectangular blade body 1 is prone to a decrease in the coaxiality of the blade body 1 rotating around the blade rod 3, causing uneven wear of the grinding blade and easily causing the grinding blade to break. If a disc-shaped blade body 1 is used, the overall quality of the blade body 1 will be relatively uniform, and the coaxiality of the rotation will be relatively high, thereby increasing the service life of the tool.

[0042] What needs further explanation here is that Figure 3 , assuming that the shortest distance from the hook portion 132 of the undercut structure 13 of the product to the center of the product 10 to be processed is a, the shortest distance from the base portion 131 to the center of the product 10 to be processed is b, and the height of the base portion 131 is c. The requirements for the tool are: the radius of the tool body 1 should not be greater than a, the distance from the side of the protrusion 2 away from the tool body to the axis of the tool body 1 is greater than a and not greater than b, and the sum of the thicknesses of the tool body 1 and the bottom grinding edge 4 should be less than c. This is to ensure that the tool body 1 can be lowered under the hook portion 132 and to ensure that the overall strength of the tool body 1 and the protrusion 2 is the highest. If the radius of the tool body 1 is too small, the protrusion 2 needs to be lengthened, and the strength of the entire tool will be reduced during rotation grinding.

[0043] Furthermore, the tool rod 3 is fixedly connected to the top surface of the tool body 1, specifically at the center of the tool body 1, so as to ensure that no eccentric rotation occurs. The top of the tool rod 3 is fixedly connected to the rotating structure of a common three-axis machining device by a shaft sleeve.

[0044] Furthermore, during processing, the cutter body 1 is controlled to rotate and gradually controlled to feed toward each other, and the bottom grinding edge 4 fixed to the bottom surface of the protrusion 2 is used to groove the product 10 to be processed at the undercut structure 13.

[0045] On the whole, the embodiments of the present application can be directly applied to ordinary three-axis processing equipment to achieve the purpose of grooving the projection area of ​​the hook portion 132 onto the silicon ring 12 for brittle material products such as flanges or discs with special-shaped undercut features 13. Not only is the processing technology simpler than that of four-axis or five-axis equipment, but it is also low-cost.

[0046] Reference Figure 6 As a specific implementation of the embodiment of the present application, there are at least two protrusions 2 and they are distributed in a circular array about the axis of the blade body 1.

[0047] In combination with specific usage scenarios, by using at least two protrusions 2 and distributing the protrusions 2 in a circular array about the axis of the tool body 1, not only the grinding efficiency can be improved, but also the uniformity of the overall mass distribution of the tool is ensured, and further the stability of the tool during rotation is ensured.

[0048] Reference Figure 5 As a specific implementation of the embodiment of the present application, it is assumed that the minimum angle between two adjacent undercut structures 13 and the axis of the silicon ring 12 is θ, and the angle between the two side surfaces of the protrusion 2 and the axis of the blade body 1 is less than θ.

[0049] In combination with specific usage scenarios, the angles from both sides of the protrusion 2 to the axis of the tool body 1 are designed to be smaller than the minimum angle θ between the axes of two adjacent undercut structures 13 and the silicon ring 12. In this way, when aligning the tool, the tool can easily enter between the silicon ring 12 and the hook portion 132, thereby ensuring the convenience of tool alignment.

[0050] Reference Figure 6 As a specific implementation of the embodiment of the present application, a through hole 5 is opened on the top surface of the blade body 1.

[0051] In combination with specific usage scenarios, by opening a through hole 5 on the top surface of the tool body 1, not only can the overall weight of the tool be reduced and the rotation stability be increased, but it is also convenient for the injection of cutting fluid during the processing, which is beneficial to the cooling of the tool.

[0052] Reference Figure 6 As a specific implementation of the embodiment of the present application, there are multiple through holes 5, and the multiple through holes 5 are distributed in a circular array about the axis of the blade body 1.

[0053] In combination with specific usage scenarios, by opening a plurality of through holes 5, and these through holes 5 are distributed in a circular array about the axis of the tool body 1, this not only further reduces the overall weight of the tool, but also ensures the uniformity of the mass distribution of the tool body 1, thereby improving the coaxiality and stability of the tool rotation; in addition, the opening of a plurality of through holes 5 also further facilitates the injection of cutting fluid.

[0054] Reference Figure 7 As a specific implementation of the embodiment of the present application, a side grinding edge 6 is fixedly connected to the side of the protrusion 2 away from the tool rod 3.

[0055] In combination with specific usage scenarios, by fixing the side grinding edge 6 on the side of the protrusion 2 away from the arbor 3, the base portion 131 of the undercut structure 13 can be further processed while the surface to be processed of the product 10 is grooved, ensuring that the surface of the base portion 131 after the product is processed is an arc surface coaxial with the product, which makes the assembly and use of the product more reasonable.

[0056] Reference Figure 7As a specific implementation of the embodiment of the present application, the side surface of the side grinding edge 6 away from the tool body 1 is an arc surface coaxial with the tool rod 3.

[0057] Combined with the specific usage scenario, when the side of the side grinding blade 6 away from the blade body 1 is a plane, the stress on the corners of the side grinding blade 6 will be more concentrated, and the use of a curved surface can reduce the stress problem on the corners to a certain extent; in addition, if the side grinding blade 6 is a plane, then during processing, if the two ends of the side grinding blade 6 can just grind the undercut structure, the middle of the side grinding blade 6 will not touch the side grinding blade 6, and if the middle of the side grinding blade can touch the undercut structure, it means that the two ends of the side grinding blade will extend out of the base of the undercut structure to the side of the center of the silicon ring, and processing cannot be carried out. Therefore, in order to ensure the normal processing, grinding efficiency and service life of the side grinding blade 6, the side of the side grinding blade 6 away from the protrusion 2 cannot be a plane.

[0058] Reference Figure 7 As a specific implementation of the embodiment of the present application, rounded corners are transitioned on two edges parallel to the axis of the tool rod 3 on the side of the protrusion 2 away from the tool rod 3.

[0059] In combination with specific usage scenarios, by rounding the two edges of the protrusion 2 that are parallel to the axis of the tool rod 3 on the side away from the tool rod 3, the stress concentration problem at the edge of the protrusion 2 can be reduced, further improving the stability and reliability of the tool.

[0060] Reference Figures 1 - 7 The method for using a new type of special processing tool for silicon products proposed by the present invention comprises the following specific steps:

[0061] First, install the tool. Fix the tool bar to the tool handle of the common three-axis machining center through a clamp. At this time, the spindle of the three-axis machining center is locked (cannot rotate) to facilitate tool installation.

[0062] a: Tool setting: control the tool bar 3 to be coaxial with the product 10 to be processed, adjust the protrusion 2 to between the two undercut structures 13 of the product 10 to be processed, and control the tool body 1 to move downward until the top surface of the protrusion 2 is lower than the bottom surface of the hook part 132 of the undercut structure 13; in actual processing, it is also necessary to release the spindle lock of the three-axis machine tool after tool setting, and then manually rotate the tool to see if it interferes with the product;

[0063] b: Processing, first control the tool to rotate, then control the tool to feed downward along the axis direction of the tool bar 1 to grind the product 10 to be processed using the bottom grinding blade 4, and the specific processing parts are: the claw part is ground on the projection area of ​​the top surface of the silicon ring until the feature 111 to be processed is completed;

[0064] c: Retract the tool, control the tool to stop rotating, and adjust the protrusion 2 to between the two undercut structures 13 of the processed product 11, lift the tool to a safe position, and then remove the product.

[0065] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A new type of special processing tool for silicon products, the silicon product comprising a silicon ring (12) and a plurality of undercut structures (13) arranged on the top surface of the silicon ring (12), the plurality of undercut structures (13) being distributed in a ring array relative to the axis of the silicon ring (12), the undercut structure (13) comprising a base portion (131) and a hook portion (132) located on the top surface of the base portion (131), characterized in that: include: Blade body (1); A protrusion (2) extends from the center of the blade body (1) toward the side wall of the blade body (1); A knife rod (3) is fixedly connected to the middle part of the knife body (1); A bottom grinding blade (4) fixedly connected to the bottom surface of the protrusion (2); The distance between the side of the protrusion (2) away from the blade body (1) and the axis of the blade rod (3) is greater than the minimum distance between the undercut structure (13) and the axis of the silicon ring (12) and is not greater than the minimum distance between the base portion (131) and the axis of the silicon ring (12); The blade body (1) is in the shape of a disc, the protrusion extends from the peripheral wall of the blade body (1) along the radial direction of the blade body (1), and the radius of the blade body (1) is not greater than the minimum distance between the undercut structure (13) and the axis of the silicon ring (12); There are at least two protrusions (2) which are distributed in a circular array about the axis of the blade body (1); The included angle between the two side surfaces of the protrusion (2) and the axis of the blade body (1) is no greater than the minimum included angle between the axis of two adjacent undercut structures (13) and the silicon ring (12).

2. A novel special processing tool for silicon products according to claim 1, characterized in that: A through hole (5) is provided on the top surface of the knife body (1).

3. A novel special processing tool for silicon products according to claim 2, characterized in that There are a plurality of through holes (5), and the plurality of through holes (5) are distributed in a circular array about the axis of the blade body (1).

4. A novel special processing tool for silicon products according to claim 1, characterized in that, A side grinding edge (6) is fixedly connected to the side surface of the protrusion (2).

5. A novel special processing tool for silicon products according to claim 4, characterized in that, The side surface of the side grinding edge (6) away from the knife body (1) is an arc surface coaxial with the knife rod (3).

6. A novel special processing tool for silicon products according to claim 5, characterized in that, The two edges of the side surface of the protrusion (2) away from the knife rod (3) and parallel to the axis of the knife rod (3) are rounded.

7. A method for using a new type of special processing tool for silicon products according to any one of claims 1 to 6, the specific steps of which are: a: aligning the tool, controlling the tool bar (3) to be coaxial with the product (10) to be processed, adjusting the protrusion (2) to between two undercut structures (13) of the product (10) to be processed, and controlling the tool body (1) to move downward until the top surface of the protrusion (2) is lower than the hook portion (132) of the undercut structure (13); b: Processing, first controlling the tool to rotate, then controlling the tool to feed downward along the axis direction of the tool bar (3), and using the bottom grinding edge (4) to grind the product to be processed (10) until the grinding of the feature to be processed (111) is completed; c: Retract the tool, control the tool to stop, and adjust the raised part (2) to between the two undercut structures (13) of the processed product (11), and lift the tool to a safe position.

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