Camera modules and electronic equipment

Abstract

The present application discloses a camera module and an electronic device, wherein the camera module includes: a housing, a temperature sensor, a temperature adjustment device and an infrared detector. The temperature sensor, the temperature adjustment device and the infrared detector are arranged in the housing. The temperature sensor is used to sense a first temperature in the housing. The temperature adjustment device is used to adjust the first temperature in the housing to a target temperature when the first temperature is not equal to the target temperature, wherein a preset ratio exists between the target temperature and the second temperature outside the housing. The infrared detector is used to detect infrared rays radiated by a measured target when the first temperature reaches the target temperature. The present application arranges a temperature adjustment device in the housing, and adjusts the first temperature in the housing to the target temperature through the temperature adjustment device, which can accelerate the preset ratio when the first temperature in the housing of the camera module and the second temperature outside the housing reach a balanced state.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a camera module and electronic equipment. Background Art

[0002] The infrared camera includes a camera module, and an infrared detector is arranged in the housing of the camera module. The temperature change of the environment outside the housing of the camera module or the operation of the camera module inside the housing causes the temperature around the infrared detector to change, which will affect the infrared detector's reception of infrared rays from the measured target.

[0003] In order to improve the detection accuracy of the infrared detector for the target, the infrared camera stores the ratio of the temperature inside and outside the shell when they are in a balanced state. When the inside and outside of the camera module shell reach a balanced state, the infrared camera can identify the temperature generated by the infrared rays of the target obtained by the infrared detector according to the relevant algorithm. That is, the infrared camera can obtain the accurate temperature of the target, so that the thermal image generated according to the accurate temperature is more accurate.

[0004] At present, the camera module mainly relies on the temperature conduction of the device itself or air convection to keep the temperature outside the shell and the temperature inside the shell in a balanced state. This process takes about 15 to 20 minutes, which takes a lot of time and affects the user experience. Summary of the invention

[0005] In view of this, the present application provides a camera module and an electronic device, so that the second temperature outside the shell of the camera module and the first temperature inside the shell can reach a preset ratio in a balanced state more quickly.

[0006] The first aspect of the present application provides a camera module, which includes: a housing, a temperature sensor, a temperature adjustment device and an infrared detector. The temperature sensor, the temperature adjustment device and the infrared detector are arranged in the housing. The temperature sensor is used to sense a first temperature in the housing. The temperature adjustment device is used to adjust the first temperature in the housing to a target temperature when the first temperature is not equal to the target temperature, wherein there is a preset ratio between the target temperature and the second temperature outside the housing. The infrared detector is used to detect infrared rays radiated by the measured target when the first temperature reaches the target temperature.

[0007] It can be understood that the first temperature inside the shell can be detected by the temperature sensor arranged in the shell, and the temperature adjustment device arranged in the shell adjusts the first temperature inside the shell to reach the target temperature, which can accelerate the first temperature inside the shell of the camera module and the second temperature outside the shell to reach a preset ratio when the temperature reaches a balanced state.

[0008] In some embodiments of the first aspect, the temperature adjustment device includes a heater, which is disposed in the housing, and the heater is used to increase the first temperature when the first temperature is lower than the target temperature.

[0009] In some embodiments of the first aspect, the temperature regulating device also includes a refrigeration chip, which is arranged between the bottom plate of the infrared detector and the bottom wall of the shell, and the refrigeration chip is used to lower the first temperature when the first temperature is greater than the target temperature so that the first temperature reaches the target temperature.

[0010] In some embodiments of the first aspect, the camera module also includes a circuit board, which is located between the shell bottom plate of the infrared detector and the bottom wall of the shell, and the circuit board has a receiving portion for receiving a cooling chip.

[0011] A second aspect of the present application provides an electronic device, which includes a processor and the above-mentioned camera module, and the processor is used to: control a temperature sensor in a shell to sense a first temperature in the shell; if the first temperature in the shell is not equal to a target temperature, control a temperature adjustment device to adjust the first temperature to the target temperature.

[0012] In some embodiments of the second aspect, the processor is also used to: if the first temperature in the shell is equal to the preset temperature, control the temperature control device to stop adjusting the first temperature; after a preset time, confirm the change slope of the first temperature in the shell; if the change slope is less than the preset value, confirm that the first temperature at this time is the target temperature.

[0013] In some embodiments of the second aspect, the processor is further used to: if the change slope is greater than a preset value, control the temperature adjustment device to adjust the first temperature until the change slope is less than the preset value.

[0014] In some embodiments of the second aspect, the temperature regulating device includes a heater, and the processor is further used to: if the first temperature in the shell is lower than the target temperature, control the heater to increase the first temperature so that the first temperature reaches the target temperature.

[0015] In some embodiments of the second aspect, the temperature regulating device also includes a refrigeration chip, and the processor is further used to: if the first temperature in the shell is greater than the target temperature, control the refrigeration chip to lower the first temperature so that the first temperature reaches the target temperature.

[0016] In some embodiments of the second aspect, the processor is also used to: when the first temperature inside the shell reaches the target temperature, control the infrared detector to detect the infrared rays radiated by the target to be measured; determine the temperature information corresponding to the infrared rays of the target to be measured, and generate a thermal imaging image of the target to be measured based on the temperature information. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the spectrum of infrared radiation from different objects.

[0018] Figure 2 A schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0019] Figure 3 Another structural schematic diagram of an electronic device according to an embodiment of the present application.

[0020] Figure 4 for Figure 3 A detailed structural schematic diagram of an electronic device is shown.

[0021] Figure 5 This is a schematic diagram of the first temperature change inside the shell of the camera module of an embodiment of the present application.

[0022] Figure 6 for Figure 3 An application scenario diagram of the electronic device shown. DETAILED DESCRIPTION

[0023] In the present application, the term "plurality" refers to two or more. In addition, it should be understood that in the description of the present application, the terms "first", "second", etc. are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0024] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0025] Below, some terms used in this application are explained.

[0026] Absolute zero is -273℃. When the temperature of an object exceeds absolute zero, the molecules and atoms of the object will move irregularly, and its surface will continuously radiate infrared rays. The higher the temperature, the more intense the irregular movement, and the higher the energy of the infrared rays radiated by the object. For example, Figure 1 The spectral curves of infrared radiation of different objects shown in the figure, the horizontal axis represents the infrared wavelength (unit: μm), and the vertical axis represents the infrared spectral emissivity (unit: kJ / μm). It can be seen from the figure that the wavelength and spectral emissivity of infrared radiation radiated by the surfaces of different objects at different temperatures are different, and the energy corresponding to the peak wave of the figure can be calculated by Wien's displacement law. For example, the peak wave and spectral emissivity of infrared wavelength radiated by water at 0°C and 100°C are different. The peak wave of water at 0°C is about 10μm, and the spectral emissivity corresponding to the peak wave is about 0.2kJ / μm, and the energy is about 0.2kJ. The peak wave of water at 100°C is about 8μm, and the spectral emissivity corresponding to the peak wave is about 0.98kJ / μm, and the energy is about 7.8kJ.

[0027] The following is a brief description of the relevant technology.

[0028] The infrared camera includes a camera module and a processor. The camera module is equipped with an infrared detector in its housing. The working principle of the camera module is that after the infrared detector receives the infrared radiation from the target, its sensitive element, such as a temperature resistor, will generate an electrical signal according to the change in infrared energy. The camera module sends the electrical signal to the processor, which collects the electrical signal and processes it in combination with relevant algorithms to generate a thermal imaging image of the target.

[0029] Ambient temperature changes or camera module operation will cause the temperature around the infrared detector to change. The temperature change around the infrared detector will cause the infrared energy around the infrared detector to change, affecting the infrared detector's reception of infrared rays from the target. For example, after the camera module is started, components such as the substrate of the camera module generate energy to radiate infrared rays. After the infrared detector receives the infrared rays radiated by the components and the target, it cannot identify the infrared rays of the target, and the generated thermal image of the target is inaccurate.

[0030] At present, in order to improve the detection accuracy of the infrared detector for the target to be measured, the processor stores a temperature lookup table and related algorithms. The temperature lookup table includes the ratio between the two parameters of the external temperature and the internal temperature of the shell of the camera module when they are in a balanced state. When the inside and outside of the shell of the camera module reach a balanced state, the processor can identify the temperature generated by the infrared rays of the target to be measured obtained by the infrared detector according to the related algorithm. That is, when the inside and outside of the shell of the camera module reach a balanced state, the processor can obtain the accurate temperature of the target to be measured, so that the thermal imaging image generated according to the accurate temperature is more accurate.

[0031] At present, the camera module mainly relies on the temperature conduction of the device itself or air convection to keep the temperature outside the shell and the temperature inside the shell in a balanced state. This process takes about 15 to 20 minutes, which is a long process.

[0032] In view of this, the present application provides a camera module and an electronic device, so that the temperature outside the shell of the camera module and the temperature inside the shell can reach a ratio of a balanced state more quickly.

[0033] See also Figure 2 , Figure 2 The electronic device 100 is a schematic diagram of a structure of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 includes a camera module 10 and a processor 20. The camera module 10 is connected to the processor 20 for communication. Figure 3The infrared ray radiated by the measured target 1 enters the camera module 10, and the camera module 10 is used to obtain the infrared ray radiated by the measured target 1, and after generating an electrical signal according to the infrared ray, the electrical signal is sent to the processor 20. The processor 20 is used to generate a thermal imaging image of the measured target 1 according to the electrical signal.

[0034] The electronic device 100 may be, but is not limited to, an infrared camera, a personal computer (PC), a personal digital assistant (PDA), a mobile phone, etc. The processor 20 may be, but is not limited to, a microcontroller unit (MCU) or a central processing unit (CPU), which is not limited here. The processor 20 may also be a cloud server, a desktop computer, a network server, a service cluster, a wireless terminal device, an embedded device, or other devices with data processing functions.

[0035] See also Figure 4 , Figure 4 1 is a schematic diagram of the structure of a camera module 10 according to an embodiment of the present application. The camera module 10 includes a housing 11, a lens 12, an infrared detector 13, a temperature sensor 14, and a temperature adjustment device 15. The housing 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other, and a plurality of side walls. The number of side walls is not limited, and the angles formed between the side walls may be equal or unequal.

[0036] Optionally, the top wall 111 and the bottom wall 112 may be arranged in parallel. For example, the top wall 111 and the bottom wall 112 are arranged along a first direction (eg Figure 4 In an optional embodiment, the plurality of side walls include a first side wall 113, a second side wall 114, a third side wall and a fourth side wall (the third side wall and the fourth side wall are not shown). The first side wall 113 and the second side wall 114 are arranged opposite to each other, and the third side wall and the fourth side wall are arranged opposite to each other. For example, the first side wall 113, the second side wall 114, the third side wall and the fourth side wall are all arranged along the second direction (such as Figure 4 The third side wall and the fourth side wall are connected to the first side wall 113 on one side and the second side wall 114 on the other side. The first side wall 113 and the second side wall 114 are connected to the bottom wall 112 on one end and the top wall 111 on the other end to form a receiving space G1. The receiving space G1 is used to receive various components of the camera module 10, such as the lens 12, the infrared detector 13, the temperature sensor 14 and the temperature adjustment device 15.

[0037] The lens 12 is disposed on the top wall 111 . For example, the lens 12 can be disposed in the middle of the top wall 111 . The lens 12 is used to transmit infrared rays of the target 1 to be measured into the housing 11 .

[0038] The infrared detector 13 is arranged opposite to the lens 12 . The infrared detector 13 is used to detect the infrared rays radiated by the measured object 1 when the first temperature reaches the target temperature, and to generate an electrical signal according to the energy change of the infrared rays of the measured object 1 .

[0039] The infrared detector 13 includes a packaging shell 131, an optical window 132, a micro-electro-mechanical system (MEMS) component 133 and a substrate 134. The optical window 132 is disposed on the packaging shell 131 and is arranged opposite to the lens 12. The optical window 132 is arranged parallel to the lens 12 so that the infrared rays in the housing 11 are transmitted into the packaging shell 131 of the infrared detector 13. The MEMS component 133 and the substrate 134 are accommodated in the packaging shell 131.

[0040] The packaging shell 131 includes a shell cover 1311 and a shell bottom plate 1312 that are arranged opposite to each other, and a plurality of side shell plates. The optical window 132 is arranged on the shell cover 1311. The number of side shell plates is not limited. The angles formed between the side shell plates can be equal or unequal. The shell cover 1311 and the shell bottom plate 1312 are arranged in parallel. For example, the shell cover 1311 and the shell bottom plate 1312 are both oriented in a first direction (such as Figure 4 X-axis direction) setting.

[0041] It can be understood that the top wall 111, the bottom wall 112, the shell cover 1311 and the shell bottom plate 1312 are arranged in parallel, and the lens 12 arranged on the top wall 111 and the optical window 132 arranged on the shell cover 1311 are arranged opposite to each other, so that the infrared rays can be accurately transmitted from the lens 12 and the optical window 132 into the packaging shell 131 in sequence.

[0042] The cross-sectional length of the shell bottom plate 1312 may be longer than the cross-sectional length of the shell cover 1311. In one embodiment, the side shell plate includes a first side shell plate 1313, a second side shell plate 1314, a third side shell plate and a fourth side shell plate (the third side shell plate and the fourth side shell plate are not shown). The first side shell plate 1313 and the second side shell plate 1314 are arranged opposite to each other, and the third side shell plate and the fourth side shell plate are arranged opposite to each other. For example, the first side shell plate 1313, the second side shell plate 1314, the third side shell plate and the fourth side shell plate are all oriented in the second direction (such as Figure 4 The Z-axis direction) is set vertically, and optionally, it may not be set vertically.

[0043] One side of the third side shell plate and the fourth side shell plate are connected to the first side shell plate 1313, and the other side are connected to the second side shell plate 1314. One end of the first side shell plate 1313 and the second side shell plate 1314 are connected to the shell bottom plate 1312, and the other end is connected to the shell cover 1311 to form a receiving space G2, which is used to receive the micro-electromechanical system components 133 and the substrate 134.

[0044] The substrate 134 is disposed on the shell bottom plate 1312 and is disposed opposite to the optical window 132. The MEMS component 133 is disposed on the substrate 134 and is disposed opposite to the optical window 132 so that the infrared rays transmitted into the packaging shell 131 can accurately be incident on the sensitive elements of the MEMS component 133.

[0045] The MEMS components 133 include components such as sensitive elements and preamplifiers made based on MEMS technology. The sensitive elements generate electrical signals according to the energy changes generated by infrared rays. For example, the number of sensitive elements can be 70,000 to 2,100,000. The MEMS components 133 can be integrated onto the substrate 134 using integrated circuit (ASIC, Application Specific Integrated Circuit) chip technology to form a chip of the infrared detector 13.

[0046] The temperature sensor 14 is disposed on the inner wall of the housing 11, and is used to sense the first temperature in the housing 11. Specifically, the temperature sensor 14 can be disposed on one side of any one of the top wall 111, the bottom wall 112, the first side wall 113, the second side wall 114, the third side wall or the fourth side wall. As an example, Figure 4 As shown, the temperature sensor 14 can be disposed on a side of the first side wall 113 close to the infrared detector 13. In an practicable manner, the temperature sensor 14 can be disposed on a side wall closest to the infrared detector 13 to improve the sensing sensitivity to the ambient temperature of the infrared detector 13.

[0047] The temperature adjustment device 15 is used to adjust the first temperature in the housing 11 to the target temperature if the first temperature is not equal to the target temperature.

[0048] The processor 20 is also used to control the temperature sensor 14 in the housing 11 to sense the first temperature in the housing 11. If the first temperature in the housing 11 is not equal to the target temperature, the temperature adjustment device 15 is controlled to adjust the first temperature to the target temperature. If the first temperature in the housing 11 is equal to the target temperature, the processor 20 controls the temperature adjustment device 15 not to adjust the first temperature.

[0049] The temperature sensor 14 detects a first temperature inside the shell 11 , and a second temperature outside the shell 11 can be detected by the temperature sensor outside the shell 11 .

[0050] It can be understood that when the first temperature in the housing 11 is adjusted to the target temperature, that is, when the target temperature has a preset ratio with the second temperature outside the housing, a balance state can be reached between the first temperature in the housing 11 and the second temperature outside the housing 11. At this time, the camera module 10 can identify the temperature generated by the infrared rays of the target 1 obtained by the infrared detector 13 according to the relevant algorithm. That is, the camera module 10 can obtain the accurate temperature of the target 1 to make the thermal image generated according to the accurate temperature more accurate.

[0051] Specifically, the target temperature is the first temperature inside the housing 11 when the temperature reaches a preset ratio with the second temperature outside the housing 11. The target temperature can be set according to the mapping relationship between the temperature outside the housing 11 and the temperature inside the housing 11 in the temperature lookup table. The target temperature of the camera module 10 is different in different application scenarios. For example, refer to Figure 5 , the ordinate represents the temperature inside the shell 11 (℃), and the abscissa represents the sensing time (min) of the temperature sensor 14. The different curves in the figure represent the time and temperature required for the first temperature inside the shell 11 to reach the target temperature in different application scenarios, where the curve area that tends to be flat is the first temperature in the equilibrium state, that is, the target temperature. For example, curve ① indicates that in the first application scenario, when the first temperature inside the shell 11 rises from 0℃ to the target temperature in the equilibrium state, the time required is about 20 minutes, and the target temperature is about 10℃. Curve ② indicates that in the second application scenario, when the temperature inside the shell 11 rises from 10℃ to the target temperature in the equilibrium state, the time required is about 20 minutes, and the target temperature is about 15℃.

[0052] Understandably, Figure 5 The temperature change curve diagram exemplarily shows the time and temperature required for the first temperature inside the housing 11 to reach the equilibrium state when the second temperature outside the housing 11 rises. Similarly, there is also a curve of the time and temperature required for the first temperature inside the housing 11 to reach the equilibrium state when the second temperature outside the housing 11 drops.

[0053] In some embodiments, the processor 20 is further configured to control the temperature regulating device 15 to stop regulating the first temperature if the first temperature in the housing 11 is equal to a preset temperature.

[0054] The preset temperature can be obtained according to experimental data. Specifically, when the processor 20 controls the temperature adjustment device 15 to adjust the first temperature in the housing 11 and receives that the first temperature detected by the temperature sensor 14 is the preset temperature, the processor 20 controls the temperature adjustment device 15 to stop adjusting the first temperature in the housing 11.

[0055] The processor 20 is further configured to confirm a change slope of the first temperature in the housing 11 after a preset time.

[0056] The preset time can be obtained based on experimental data. The slope of the first temperature change is as follows: Figure 5 The slope of the curve shown, that is, the change slope of the first temperature can be obtained according to a certain time period and the first temperature difference of the certain time period. For example, the slope of curve ① from 0 to 20 minutes is 10÷20=0.5. It can be understood that since the first temperature in the housing 11 has just been adjusted, the change slope of the first temperature is unstable. Therefore, the change slope of the first temperature in the housing 11 can be confirmed after the stop time reaches a preset time.

[0057] Specifically, the processor 20 may control the temperature sensor 14 to detect the first temperature in the housing 11 after stopping adjusting the first temperature for a preset time. Then, the processor 20 determines the change slope according to the time detected by the temperature sensor 14 and the detected first temperature.

[0058] The processor 20 is further configured to confirm that the first temperature at this time is the target temperature if the change slope is less than a preset value.

[0059] The preset value is the slope of the first temperature when the internal and external temperatures of the housing 11 of the camera module 10 reach a balanced state. After the internal and external temperatures of the housing 11 of the camera module 10 reach a balanced state, the first temperature inside the housing 11 of the camera module 10 is less affected by the second temperature outside the housing 11, and the first temperature change inside the housing 11 of the camera module 10 tends to be stable. Therefore, the slope in the balanced state will also be less than a certain value. Figure 5 As shown, it was in an unbalanced state 20 minutes ago and in a balanced state 20 minutes later. The slope before 20 minutes was greater than the slope after 20 minutes.

[0060] Specifically, when the change slope is less than a preset value, the processor 20 may confirm that the first temperature at this time is the target temperature. At this time, the processor 20 may control the temperature adjustment device 15 to stop adjusting the first temperature in the shell 11 .

[0061] It can be understood that the entire process of adjusting the first temperature to the target temperature is performed in multiple times, which can avoid adjusting the temperature to a temperature far exceeding the target temperature after one adjustment.

[0062] In some embodiments, the processor 20 is further configured to control the temperature adjustment device 15 to adjust the first temperature if the change slope is greater than a preset value, until the change slope is less than a preset value.

[0063] It can be understood that if the change slope is greater than the preset value, it means that the first temperature in the housing 11 has changed greatly, and the first temperature has not yet stably reached the target temperature corresponding to the equilibrium state, so the first temperature needs to be adjusted. Specifically, the processor 20 can control the temperature adjustment device 15 to continue to adjust the first temperature in the housing 11 until the processor 20 confirms that the change slope is less than the preset value based on the time detected by the temperature sensor 14 and the detected first temperature, and the processor 20 can control the temperature adjustment device 15 to stop adjusting the first temperature in the housing 11.

[0064] In a specific implementation process, the temperature adjustment device 15 may include a heater 151 and a cooling chip 152. The heater 151 is used to increase the first temperature when the first temperature is lower than the target temperature. The cooling chip 152 is used to reduce the first temperature when the first temperature is higher than the target temperature.

[0065] The heater 151 may be disposed on the inner wall of the housing 11, specifically, the heater 151 may be disposed on the inner wall of the top wall 111, the bottom wall 112, the first side wall 113, the second side wall 114, the third side wall or the fourth side wall. For example, the heater 151 may be disposed on the inner wall of the side wall closest to the infrared detector 13 to accelerate the temperature rise rate of the surrounding environment of the infrared detector 13. Exemplarily, the heater 151 is disposed on the side of the second side wall 114 close to the infrared detector 13.

[0066] The cooling chip 152 may be disposed between the bottom wall 112 of the housing 11 and the bottom plate 1312 of the infrared detector 13 to accelerate the cooling speed of the surrounding environment of the infrared detector 13 .

[0067] A circuit board 16 may be provided between the bottom wall 112 of the housing 11 and the bottom plate 1312 of the infrared detector 13. The circuit board 16 has a receiving portion 161, and the receiving portion 161 is used to receive the cooling chip 152. The circuit board 16 may be a printed circuit board (PCB). The electrical signal generated by the infrared detector 13 is sent to the processor 20 through the circuit board 16.

[0068] In some embodiments, the processor 20 is further configured to control the heater 151 to increase the first temperature in the shell 11 when the first temperature in the shell 11 is lower than the target temperature, so that the first temperature reaches the target temperature.

[0069] It can be understood that the temperature adjustment device 15 includes a heater 151. After the processor 20 detects the first temperature in the housing 11 through the temperature sensor 14 and determines that the first temperature is lower than the target temperature, the heater 151 is controlled to increase the first temperature in the housing 11 to the target temperature to achieve a balanced state.

[0070] In one example, the camera module 10 is started, and the processor 20 controls the heater 151 to increase the first temperature in the housing 11 while receiving the first temperature detected by the temperature sensor 14. When the first temperature is a preset temperature, the processor 20 controls the heater 151 to stop increasing the first temperature in the housing 11. After the processor 20 stops increasing the temperature for a preset time, it controls the temperature sensor 14 to detect the first temperature in the housing 11. The processor 20 confirms the change slope according to the time detected by the temperature sensor 14 and the detected first temperature. When the change slope is less than the preset value, the processor 20 can confirm that the first temperature is the target temperature. When the change slope is greater than the preset value, the processor 20 controls the heater 151 to continue to increase the first temperature in the housing 11. And so on, until the change slope is less than the preset value, the processor 20 controls the heater 151 to stop increasing the first temperature in the housing 11.

[0071] It is understandable that the components of the camera module 10 will heat up due to the startup work, causing the first temperature in the housing 11 to also rise, but the temperature rise is too slow to reach the first temperature in the housing 11 required when the temperature inside and outside the housing 11 reaches a balanced state when the camera module 10 works normally. Therefore, the processor 20 can control the heater 151 to raise the first temperature in the housing 11 to the target temperature to accelerate the reaching of the balanced state.

[0072] In another example, the camera module 10 works normally, and the temperature outside the housing 11 of the camera module 10 rises rapidly from 0° C. to 25° C. The processor 20 repeats the action of the previous example until the change slope is less than the preset value, and the processor 20 controls the heater 151 to stop raising the first temperature inside the housing 11.

[0073] It is understandable that when the camera module 10 is working normally, the second temperature outside the housing 11 of the camera module 10 rises rapidly, which will break the balance inside and outside the housing 11 of the camera module 10. Therefore, the processor 20 needs to control the heater 151 to increase the first temperature inside the housing 11 to the target temperature to accelerate the reaching of the equilibrium state.

[0074] In some embodiments, the processor 20 is further configured to control the cooling crystal 152 to lower the first temperature if the first temperature in the housing 11 of the camera module 10 is greater than the target temperature, so that the first temperature reaches the target temperature.

[0075] Specifically, after the processor 20 detects the first temperature in the housing 11 through the temperature sensor 14 and determines that the first temperature is greater than the target temperature, the processor 20 controls the cooling chip 152 to lower the first temperature in the housing 11 to the target temperature to achieve a balanced state.

[0076] In one example, the camera module 10 works normally, and the second temperature outside the housing 11 of the camera module 10 is rapidly cooled from 25°C to 0°C. The processor 20 controls the refrigeration chip 152 to reduce the first temperature in the housing 11 while receiving the first temperature detected by the temperature sensor 14. When the first temperature is the preset temperature, the processor 20 controls the refrigeration chip 152 to stop reducing the first temperature in the housing 11. After the processor 20 stops reducing the temperature for a preset time, it controls the temperature sensor 14 to detect the first temperature in the housing 11. The processor 20 confirms the change slope according to the time detected by the temperature sensor 14 and the detected first temperature. When the change slope is less than the preset value, the processor 20 can confirm that the temperature is the target temperature. When the change slope is greater than the preset value, the processor 20 controls the refrigeration chip 152 to continue to reduce the first temperature in the housing 11. By analogy, until the change slope is less than the preset value, the processor 20 controls the refrigeration chip 152 to stop reducing the first temperature in the housing 11.

[0077] It is understandable that when the camera module 10 is working normally, the second temperature outside the housing 11 of the camera module 10 drops rapidly, which will break the balance inside and outside the housing 11 of the camera module 10. Therefore, the processor 20 needs to control the cooling chip 152 to lower the first temperature inside the housing 11 to the target temperature to accelerate the reaching of the equilibrium state.

[0078] The processor 20 is further configured to control the infrared detector 13 to detect infrared rays radiated by the target object 1 when the first temperature in the housing 11 reaches the target temperature.

[0079] The processor 20 is further configured to determine temperature information corresponding to the infrared rays of the target 1 to be measured, and generate a thermal imaging image of the target 1 to be measured according to the temperature information.

[0080] It can be understood that when the first temperature inside the shell 11 of the camera module 10 is not equal to the target temperature, the first temperature inside the shell 11 is adjusted to the target temperature so that the temperatures inside and outside the shell 11 can reach a balanced state. When the first temperature is the target temperature, the infrared rays radiated by the target to be measured are detected, and accurate temperature information corresponding to the infrared rays of the target to be measured can be obtained. Based on the accurate temperature information, an accurate thermal imaging image of the target to be measured can be generated.

[0081] Specifically, after acquiring the electrical signal generated by the infrared detector 13 according to the infrared ray, the processor 20 determines the temperature information of the target object according to the electrical signal combined with a relevant algorithm, and generates a thermal imaging image of the measured target 1 according to the temperature information.

[0082] It can be understood that when the first temperature in the housing 11 of the camera module 10 is equal to the target temperature, it means that the temperature inside and outside the housing 11 of the camera module 10 has reached a balanced state. At this time, the processor 20 can obtain the accurate temperature of the measured target.

[0083] It can be understood that, since the processor 20 can obtain the first temperature in the housing 11 through the temperature sensor 14 and adjust the first temperature according to the temperature adjustment device 15, the temperature inside and outside the housing 11 of the camera module 10 can quickly reach a balanced state. Therefore, the infrared detector 13 can be started more quickly to detect the infrared radiation of the target object 1, calculate more accurate temperature information, and generate a thermal imaging image of the target 1 according to the more accurate temperature information, and the thermal imaging image is displayed more accurately.

[0084] It is understandable that in order to speed up the heat conduction of the camera module 10, a large material such as a heat conducting sheet is added, making the camera module 10 larger in size. The embodiment of the present application utilizes the cooperation between the temperature sensor 14 and the temperature adjustment device 15 to quickly adjust the second temperature inside and outside the housing 11 to a balanced state, which can reduce the increase of large materials such as a heat conducting sheet and reduce the overall volume of the camera module 10.

[0085] An application process of an electronic device in an embodiment of the present application is explained through the following application scenario.

[0086] The electronic device 100 includes a camera module 10 and a processor 20. The camera module 10 works normally, and the temperature inside and outside the housing 11 reaches a balanced state. The cup is the target 1 to be measured, and the cup radiates infrared rays. The infrared rays are projected from the lens of the camera module 10 into the housing 11 and are transmitted into the micro-electromechanical system components 133 of the infrared detector 13 set corresponding to the lens. The sensitive element of the micro-electromechanical system component 133 generates an electrical signal according to the energy change of the infrared rays, and the electrical signal is sent to the processor 20 through the circuit board 16. At this time, the temperature outside the housing 11 of the camera module 10 changes suddenly, and the temperature inside and outside the housing 11 is not in a balanced state, and the thermal imaging image of the cup is not accurate. The processor 20 controls the infrared detector 13 to stop detecting the infrared rays emitted by the cup. The processor 20 receives the first temperature inside the housing 11 through the temperature sensor 14, and controls the temperature adjustment device 15 to adjust the first temperature to the target temperature. At this time, the temperature inside and outside the housing 11 is in a balanced state. Next, the processor 20 controls the infrared detector 13 to detect the infrared rays emitted by the cup, determines the temperature information generated by the infrared rays of the cup according to the relevant algorithm, processes the temperature information, and generates a thermal imaging image of the cup. The thermal imaging image of the cup is shown in FIG. Figure 6 shown.

[0087] In this application scenario, the relevant parameters of the camera module 10 include: the infrared detector 13 is an uncooled infrared focal plane detector, the material of the camera module 10 is a ferroelectric vanadium oxide mixture (F-VOx), the response infrared band is 8 to 14μm, the resolution is 320x240, the detection diameter is 4.8m, the pixel pitch is 12μm, the temperature sensitivity is NETD<70mK, the lens aperture is F1.2, the effective focal length is 6.8mm, and the field of view angle is (H*V)=(34.8°*26°).

[0088] Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present application, all of which belong to the protection scope of the present application.

Claims

1. A camera module, characterized in that: The camera module comprises: case; A temperature sensor is disposed in the housing, and is used to sense a first temperature in the housing; a temperature regulating device, arranged in the shell, and used for regulating the first temperature in the shell to the target temperature when the first temperature is not equal to the target temperature, wherein the target temperature and the second temperature outside the shell have a preset ratio, and when the first temperature is equal to the preset temperature, the first temperature is stopped from being regulated, and after a preset time of stopping regulating the first temperature, the temperature sensor is controlled to detect the first temperature in the shell, and a change slope is confirmed according to the detection time of the temperature sensor and the detected first temperature, and if the change slope is less than a preset value, it is confirmed that the first temperature at this time is the target temperature, and the preset value is the slope of the first temperature when the temperature inside and outside the shell of the camera module reaches equilibrium; The temperature regulating device comprises a heater, which is disposed in the housing and is used to increase the first temperature when the first temperature is lower than the target temperature; The temperature regulating device further comprises a refrigeration chip, the refrigeration chip is arranged between the shell bottom plate of the infrared detector and the bottom wall of the shell, and the refrigeration chip is used to reduce the first temperature when the first temperature is greater than the target temperature; The infrared detector is arranged in the housing, and is used for detecting infrared rays radiated by the target when the first temperature reaches the target temperature.

2. The camera module according to claim 1, characterized in that: The camera module also includes a circuit board, which is located between the shell bottom plate of the infrared detector and the bottom wall of the shell. The circuit board is provided with a receiving portion, which is used to receive the cooling chip.

3. An electronic device, characterized in that: The electronic device comprises a processor and the camera module according to claim 1, wherein the processor is used for: Controlling the temperature sensor in the housing to sense the first temperature in the housing; If the first temperature in the housing is not equal to the target temperature, controlling the temperature adjustment device to adjust the first temperature to the target temperature; The processor is further configured to: If the first temperature in the housing is equal to a preset temperature, controlling the temperature adjustment device to stop adjusting the first temperature; After stopping adjusting the first temperature for a preset time, controlling the temperature sensor to detect the first temperature in the housing, and confirming a change slope according to the time detected by the temperature sensor and the detected first temperature; If the change slope is less than a preset value, it is confirmed that the first temperature at this time is the target temperature, and the preset value is the slope of the first temperature when the internal and external temperatures of the housing of the camera module reach equilibrium; The temperature regulating device comprises a heater, which is disposed in the housing and is used to increase the first temperature when the first temperature is lower than the target temperature; The temperature regulating device further comprises a refrigeration chip, which is arranged between the shell bottom plate of the infrared detector and the bottom wall of the shell, and is used for lowering the first temperature when the first temperature is greater than the target temperature.

4. The electronic device according to claim 3, characterized in that: The processor is further configured to: If the change slope is greater than the preset value, the temperature adjustment device is controlled to adjust the first temperature until the change slope is less than the preset value.

5. The electronic device according to claim 4, characterized in that: The temperature regulating device includes a heater, and the processor is further configured to: If the first temperature in the housing is lower than the target temperature, the heater is controlled to increase the first temperature so that the first temperature reaches the target temperature.

6. The electronic device according to claim 4, characterized in that: The temperature regulating device further comprises a refrigeration chip, and the processor is further used for: If the first temperature in the housing is greater than the target temperature, the cooling chip is controlled to lower the first temperature so that the first temperature reaches the target temperature.

7. The electronic device according to claim 4, characterized in that: The processor is further configured to: When the first temperature in the housing reaches the target temperature, controlling the infrared detector to detect infrared rays radiated by the target; Determine temperature information corresponding to the infrared rays of the measured target, and generate a thermal imaging image of the measured target according to the temperature information.

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