original plate piece

Abstract

The original sheet of the present application is an original sheet for cutting out at least one insulating heat dissipation sheet, and has: a laminated sheet in which an insulating layer is stacked on a base material layer, i.e., a first sheet; and a second sheet stacked on the insulating layer of the first sheet, the insulating layer being composed of a resin composition containing a resin and an inorganic filler, at least a portion of the first sheet extending outward from the second sheet, and an exposed portion being provided on the insulating layer and exposed outward from the outer periphery of the second sheet.

Description

Technical Field

[0001] This invention relates to raw slabs, and more specifically to raw slabs for cutting insulating heat sinks. Background Technology

[0002] In the past, in the field of electronics, it is known that insulating sheets are used to ensure the insulation of semiconductor modules and the like (for example, Patent Document 1 below).

[0003] As an insulating sheet, an insulating heat sink is known in the past, which has an insulating layer formed thereon, which has good thermal conductivity through a resin composition containing resin and inorganic filler.

[0004] As an insulating heat sink, a structure is known, for example, in which an insulating layer with excellent thermal conductivity and electrical insulation is sandwiched between two copper foils.

[0005] The insulating heat sink can be freely installed and detached between the semiconductor module and the heat sink. In addition, one or both copper foils can be peeled off from the insulating layer and the insulating layer can be bonded to the semiconductor module or heat sink for use.

[0006] Therefore, the insulating layer may be composed of a resin composition comprising an epoxy resin having excellent adhesion and an inorganic filler having excellent thermal conductivity.

[0007] In the case where an insulating heat sink is bonded to a substrate such as a semiconductor module or a heat sink, one or both of the copper foils in the insulating heat sink are replaced with a release liner or release film.

[0008] The aforementioned insulating heat sink is manufactured by cutting a larger original plate from the original plate using techniques such as stamping.

[0009] The original sheet is made, for example, using a laminated sheet, wherein the laminated sheet has, for example, a substrate layer made of copper foil or the like and an insulating layer made of a resin composition.

[0010] The original sheet is made by laminating the first sheet and another second sheet.

[0011] The second sheet can use the same laminated sheet or separator sheet as the first sheet.

[0012] That is, the original sheet is made by laminating two sheets containing laminated sheets.

[0013] Existing technical documents

[0014] Patent Document 1: Japanese Patent Application Publication No. 2010-094887

[0015] Because insulating heat sinks aim for excellent thermal conductivity, the inorganic filler content in the insulating layer is usually high.

[0016] During the fabrication of the original sheet, the original sheet is compressed in the thickness direction to make the resin composition constituting the insulating layer strong. In such cases, the resin composition constituting the insulating layer may overflow to the outside of the copper foil or separator, etc.

[0017] Resin compositions with a high content of inorganic fillers are generally more fragile than monomeric resins.

[0018] Therefore, compared to the resin composition supported in the substrate layer, the resin composition overflowing from the end edge of the original sheet is more likely to detach from the original sheet.

[0019] The detached resin composition becomes an impurity and can cause various problems.

[0020] Thus, the resin composition constituting the insulating layer has become a cause of impurities in this way, which has not received much attention, and there are no adequate countermeasures to prevent the resin composition constituting the insulating layer from peeling off.

[0021] Therefore, in existing original sheets, there is a problem of difficulty in preventing the resin composition that constitutes the insulating layer from peeling off. Summary of the Invention

[0022] The problem the invention aims to solve

[0023] Therefore, in order to solve the above-mentioned problems, the present invention aims to provide a base plate capable of suppressing the shedding of the resin composition constituting the insulating layer.

[0024] Methods for solving problems

[0025] The original plate of this invention is a plate used to cut out at least one insulating heat sink.

[0026] It has: a laminated sheet with an insulating layer stacked on a substrate layer, i.e., the first sheet;

[0027] The second sheet is stacked on top of the insulating layer of the first sheet.

[0028] The insulating layer is composed of a resin composition containing resin and inorganic fillers.

[0029] At least a portion of the first piece extends outward from the second piece, and the insulating layer has an exposed portion that protrudes outward from the outer periphery of the second piece. Attached Figure Description

[0030] Figure 1AThis is a perspective view showing the overall structure of the original plate according to the first embodiment of the present invention.

[0031] Figure 1B This is a side view of the original plate of the first embodiment of the present invention viewed from the y-axis direction.

[0032] Figure 2A This is a perspective view showing the overall structure of the original plate according to the second embodiment of the present invention.

[0033] Figure 2B This is a side view of the original plate of the second embodiment of the present invention, viewed from the y-axis direction.

[0034] Figure 2C This is a side view of the original plate of the second embodiment of the present invention viewed from the x-axis direction.

[0035] Figure 3 This is a side view showing the state in which the original plate of the first embodiment is compressed in the thickness direction when viewed from the y-axis direction.

[0036] Figure 4A This is a side view showing the state in which the original plate of the second embodiment is compressed in the thickness direction when viewed from the y-axis direction.

[0037] Figure 4B This is a side view showing the state of the original plate of the second embodiment being compressed in the thickness direction when viewed from the x-axis direction.

[0038] Figure 5 This is a perspective view showing another overall structure of the original plate according to the first embodiment of the present invention. Detailed Implementation

[0039] The original plate of the present invention will be described below.

[0040] The original plate of the present invention is used to cut at least one insulating heat sink.

[0041] The original sheet of the present invention comprises: a first sheet, wherein an insulating layer is laminated on a substrate layer; and a second sheet, which is laminated on the insulating layer of the first sheet.

[0042] In the original sheet of the present invention, the insulating layer is composed of a resin composition comprising resin and inorganic filler.

[0043] In the original sheet of the present invention, at least a portion of the first sheet extends outward from the second sheet, and the insulating layer has an exposed portion that protrudes outward from the outer periphery of the second sheet.

[0044] The top view of the original board is large enough to cut out an insulating heat sink.

[0045] In addition, the top view size of the original board can also be the size that allows multiple insulating heat sinks to be cut out.

[0046] The top view dimensions of the original plate are appropriate sizes suitable for the purpose.

[0047] In the original plate of the present invention, both the first plate and the second plate are preferably rectangular when viewed from above.

[0048] Furthermore, in the original sheet of the present invention, preferably, one side of the first sheet and one side of the second sheet are parallel to each other at a distance, and the first sheet and the second sheet are stacked in such a way that the side of the second sheet is located inside the side of the first sheet, and the exposed portion is provided between the two sides.

[0049] (First Implementation)

[0050] The following is a reference, firstly Figure 1A and Figure 1B As the original plate in the first embodiment of the present invention, the following description is given with the first plate and the second plate both being rectangular in plan view, and the second plate being a separator plate.

[0051] In addition, Figure 1A In this paper, the z-axis direction is taken as the height direction, the y-axis direction as the width direction, and the x-axis direction as the long side direction. The original plate 10 of the first embodiment of the present invention will be described.

[0052] like Figure 1A and Figure 1B As shown, the original plate 10 of the first embodiment has: a first plate 1, which has an insulating layer 1b stacked on a substrate layer 1a; and a second plate 2 stacked on the insulating layer 1b of the first plate 1.

[0053] Furthermore, as explained above, in the original plate 10 of the first embodiment, the second plate is a separator.

[0054] In the original plate 10 of the first embodiment, the first plate 1 and the second plate 2 are configured as rectangles of approximately the same size when viewed from above.

[0055] like Figure 1A As shown, the first piece 1 has: a first side E1a and a second side E1b arranged at a distance in the x-axis direction and extending parallel to the y-axis direction; and a third side E1c and a fourth side E1d arranged at a distance in the y-axis direction and extending parallel to the x-axis direction.

[0056] Furthermore, the first side E1a and the second side E1b, together with the third side E1c and the fourth side E1d, form a rectangle in the top view of the first piece 1.

[0057] The second piece 2, like the first piece 1, has: a first side E2a and a second side E2b arranged at a distance in the x-axis direction and extending parallel to the y-axis direction; and a third side E2c and a fourth side E2d arranged at a distance in the y-axis direction and extending parallel to the x-axis direction.

[0058] Furthermore, the 1' side E2a and the 2' side E2b are joined together at right angles to each other in the top view, thus forming the rectangle of the 2nd piece 2 in the top view.

[0059] Figure 1A and Figure 1B As shown, in the original plate 10 of the first embodiment, the second plate 2 is offset from the first plate 1 in the long side direction (x-axis direction) when its third side E2c and fourth side E2d, which are arranged at a distance in the width direction (y-axis direction), overlap with the third side E1c and fourth side E1d, which are arranged at a distance in the width direction (y-axis direction) of the first plate 1.

[0060] That is, in the original plate 10 of the first embodiment, on one side in the long side direction, the first side E1a of the first plate 1 and the first side E2a of the second plate 2 are parallel and spaced apart by a distance, such that the first side E2a is located inside the first side E1a, and an exposed portion Ex1 of the first plate 1 is provided between the first side E1a and the first side E2a.

[0061] Furthermore, in the original plate 10 of the first embodiment, since such an exposed portion Ex1 is provided, a portion of the insulating layer 1b of the first plate 1 is exposed on the surface.

[0062] Furthermore, in the original plate 10 of the first embodiment, on the other side in the long side direction, there is an exposed portion Ex2 of the second plate 2 between the second side E1b of the first plate 1 and the second side E2b of the second plate 2. Because of the exposed portion Ex2, a part of the surface of the second plate 2, that is, the side of the separator that is stacked with the first plate 1, is exposed on the surface.

[0063] The exposed portion Ex1 of the first piece 1 extends outward from the second piece 2 with a maximum length of 10 mm.

[0064] The length can also be less than 8mm, less than 7mm, or less than 6mm.

[0065] In addition, the length can be 2mm or more, or 3mm or more, or 4mm or more.

[0066] The substrate layer 1a of the first sheet 1 is composed of various known substrate sheets.

[0067] As the substrate sheet, resin films such as polyester resin film, polyolefin resin film, and polyimide film can be used; metal foils such as copper foil, aluminum foil, and nickel foil can also be used.

[0068] Metal foil can also be a coated material with multiple metal layers.

[0069] In addition, examples of resins constituting the polyester resin film include polyethylene terephthalate, and examples of resins constituting the polyolefin resin film include polyethylene resin, polypropylene resin, and ethylene-vinyl acetate copolymer resin.

[0070] Among these materials, based on the viewpoint of excellent processability and low cost, a resin film made of polyethylene terephthalate resin is preferred as the substrate sheet constituting the substrate layer 1a.

[0071] For the substrate sheet constituting the substrate layer 1a, surface roughening treatment (matte finish) or demolding treatment may be applied to the surface on the side of the insulating layer 1b.

[0072] Alternatively, the substrate sheet may be in an untreated state.

[0073] By performing a demolding process on the substrate sheet, the substrate layer 1a can be easily peeled off from the insulating layer 1b in the first sheet 1.

[0074] In addition, by performing a surface roughening treatment on the substrate sheet, the insulating layer 1b can be more fully retained on the substrate layer 1a in the first sheet 1.

[0075] Furthermore, the same resin film as described above can be used as the second sheet, i.e., the separator.

[0076] Furthermore, based on the viewpoint of having excellent thermal conductivity, the substrate layer 1a is preferably made of metal foil, and copper foil and aluminum foil are more preferably used among the metal foils.

[0077] The copper foil can also undergo oxidation treatments such as blackening, or matte treatments such as sandblasting (surface roughening treatment).

[0078] The aluminum foil can also undergo anodizing treatments such as phosphoric acid anodizing or sulfuric acid anodizing, or it can be sealed.

[0079] The thickness of the substrate layer 1a is not particularly limited.

[0080] The thickness of the substrate layer 1a can be, for example, 0.02 mm (20 μm) or more.

[0081] The thickness of the substrate layer 1a can also be 0.05 mm or more, or 0.1 mm or more, or 0.2 mm or more, or 0.3 mm or more, or 0.4 mm or more.

[0082] The thickness of the substrate layer 1a can be 0.5 mm or more, or 0.8 mm or more.

[0083] The thickness of the substrate layer 1a can be, for example, less than 10 mm.

[0084] The thickness of the substrate layer 1a can also be less than 8 mm, less than 6 mm, or less than 4 mm.

[0085] The thickness of the substrate layer 1a can be less than 3 mm or less than 2 mm.

[0086] The thickness of the substrate layer 1a can be measured using a micrometer or similar tool.

[0087] Specifically, using a micrometer or similar tool, the thickness of 10 randomly selected locations in the substrate layer 1a is measured, and the thickness can be calculated by arithmetically averaging these measurements.

[0088] As described above, in the original plate 10 of the first embodiment, the insulating layer 1b of the first plate 1 is composed of a resin composition containing resin and inorganic filler.

[0089] Examples of resins include thermoplastic resins and thermosetting resins.

[0090] Examples of thermoplastic resins include polyolefin resins, polyvinyl chloride resins, phenoxy resins, acrylic resins, polyamide resins, polyamide-imide resins, polyimide resins, polyetheramide-imide resins, polyetheramide resins, and polyetherimide resins.

[0091] In addition, examples of the polyolefin resin include polyethylene resin, polypropylene resin, and ethylene-vinyl acetate copolymer resin.

[0092] Examples of thermosetting resins include epoxy resins and phenolic resins.

[0093] Examples of epoxy resins include: bisphenol A epoxy resin, modified bisphenol A epoxy resin, bisphenol F epoxy resin, modified bisphenol F epoxy resin, triphenylmethane epoxy resin, cresol Norwalk epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, phenolic varnish epoxy resin, etc.

[0094] These various epoxy resins can be used individually or in combination of two or more.

[0095] Examples of phenolic resins include: dicyclopentadiene phenolic resin, phenolic varnish phenolic resin, cresol phenolic varnish resin, phenolic aromatic resin, triphenylmethane phenolic resin, etc.

[0096] Among these, triphenylmethane phenolic resin has excellent heat resistance, and phenolic aromatic resin exhibits good adhesion to the substrate when bonding insulating heat sinks to the substrate, so it is preferred to use it.

[0097] When epoxy resin is used as the thermosetting resin, the resin composition may also contain a curing agent or curing accelerator of the epoxy resin, based on the viewpoint of adjusting the thermosetting properties of the epoxy resin.

[0098] Examples of curing agents include amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, tetraglycidyldiaminodiphenylmethane, and triethylenetetramine, as well as acid anhydride curing agents.

[0099] In addition, phenolic varnish, phenolic resin, etc., can also be used as the curing agent.

[0100] As the curing accelerator, benzimidazoles or amines can be used. Examples of amines include thiamine pyrophosphate (TPP) and boron trifluoride monoethylamine.

[0101] When the phenolic resin is used as the thermosetting resin, from the viewpoint of adjusting the thermosetting properties of the phenolic resin, the resin composition may also contain a curing agent for the phenolic resin.

[0102] Examples of curing agents include: cyclohexamethylenetetramine, various bifunctional or higher epoxy compounds, isocyanates, trioxane, and cyclic methylal.

[0103] As for the inorganic filler, there are no particular limitations as long as its thermal conductivity is higher than that of the resin.

[0104] Examples of inorganic fillers include inorganic nitride fillers, inorganic oxide fillers, diamond, talc, clay, and calcium carbonate.

[0105] Examples of inorganic nitride fillers include boron nitride, aluminum nitride, and silicon nitride.

[0106] Examples of inorganic oxide fillers include silica, alumina, titanium dioxide, and zircon.

[0107] The inorganic filler is preferably selected from at least one of the group consisting of boron nitride, aluminum oxide, and silicon oxide.

[0108] In addition, the inorganic filler is preferably a mixture containing boron nitride and aluminum oxide, a mixture containing boron nitride and silicon oxide, or a mixture containing boron nitride, aluminum oxide, and silicon oxide.

[0109] In the mixture, the content of boron nitride is preferably 50% by mass or more and 95% by mass or less.

[0110] When the insulating layer 1b contains boron nitride as the inorganic filler, the boron nitride content in the insulating layer 1b is preferably 30% by volume or more, more preferably 40% by volume or more, and even more preferably 50% by volume or more.

[0111] Because the boron nitride content is more than 30% by volume, the insulating layer 1b has excellent thermal conductivity.

[0112] On the other hand, based on the viewpoint that the insulating layer 1b exhibits excellent adhesion, mechanical strength, and electrical insulation, the boron nitride content is preferably 75% by volume or less.

[0113] Furthermore, the boron nitride content in insulating layer 1b refers to the value at 20°C.

[0114] The resin composition used to form the insulating layer 1b may also contain various additives.

[0115] Examples of such additives include dispersants, viscosity modifiers, anti-aging agents, antioxidants, processing aids, stabilizers, defoamers, flame retardants, thickeners, pigments, etc., which are commonly used as additives in plastic compounding chemicals.

[0116] In the original plate 10 of the first embodiment, the thermal conductivity of the insulating layer 1b is preferably 5 W / m·K or more, more preferably 7 W / m·K or more, and even more preferably 10 W / m·K or more.

[0117] Furthermore, as explained above, the content of the inorganic filler in the insulating layer 1b is limited from the viewpoint of enabling the insulating layer 1b to exhibit excellent adhesion, mechanical strength, and electrical insulation.

[0118] Therefore, the upper limit of the thermal conductivity of the insulating layer 1b is usually 30 W / m·K.

[0119] In the original plate 10 of the first embodiment, the volume resistivity of the insulating layer 1b is preferably 1×10⁻⁶. 12 The volume resistivity is preferably 1×10 Ω·cm or higher. 13 Ω·cm or higher.

[0120] Since the volume resistivity is 1×10 12 With an electrical insulation strength of Ω·cm or higher, the insulating layer 1b can provide sufficient electrical insulation.

[0121] Furthermore, since the inorganic filler is highly packed in the insulating layer 1b, it is difficult to expect the insulating layer 1b to have excessive electrical insulation.

[0122] Therefore, in insulating layer 1b, the upper limit of volume resistivity is typically 1 × 10⁻⁶. 18 Ω·cm.

[0123] The thickness of the insulating layer 1b is not particularly limited.

[0124] The thickness of the insulating layer 1b can be, for example, 30 μm or more.

[0125] The thickness of the insulating layer 1b can be 50 μm or more, or 100 μm or more, or 150 μm or more, or 200 μm or more, or 250 μm or more.

[0126] The thickness of the insulating layer 1b can be, for example, less than 1000 μm.

[0127] The thickness of the insulating layer 1b can be less than 750 μm, less than 600 μm, or less than 450 μm.

[0128] The thickness of the insulating layer 1b can be measured in the same way as the thickness of the substrate layer 1a described above.

[0129] The second piece 2 is configured to be peelable from the insulating layer 1b.

[0130] In the original plate 10 of the first embodiment, the second plate 2, i.e. the separator, can be made of various known resin films.

[0131] Examples of resin films include polyester resin films, polyolefin resin films, and polyimide resin films.

[0132] From the viewpoint of improving the peelability from the insulating layer 1b, a demolding process can also be performed on the side of the resin film that is laminated to the insulating layer 1b.

[0133] In the original plate 10 of the first embodiment, the thickness of the second piece 2, i.e. the separator, is not particularly limited.

[0134] The thickness of the separator can be, for example, 25 μm or more.

[0135] The thickness of the separator can be 50 μm or more, or 75 μm or more.

[0136] The thickness of the separator can be, for example, less than 500 μm.

[0137] The thickness of the separator can be less than 250 μm or less than 200 μm.

[0138] The thickness of the separator can be measured in the same way as the thickness of the substrate layer 1a described above.

[0139] (Second Implementation)

[0140] Next, refer to Figure 2A and Figure 2B The following example illustrates the second embodiment of the present invention, in which the first sheet and the second sheet are both rectangular when viewed from above, and the second sheet and the first sheet are the same laminated sheet.

[0141] like Figure 2A and Figure 2B As shown, the original plate 10' of the second embodiment is the same as the original plate 10 of the first embodiment, having a first plate 1, which has an insulating layer 1b stacked on a substrate layer 1a, and a second plate 2 stacked on the insulating layer 1b of the first plate 1.

[0142] In the original plate 10' of the second embodiment, the substrate layer 1a, substrate layer 2a, insulating layer 1b, and insulating layer 2b have the same structure as those described for the original plate 10 in the first embodiment. Therefore, these descriptions will not be repeated.

[0143] As explained above, in the original sheet 10' of the second embodiment, the second sheet 2 is a laminated sheet identical to the first sheet 1, which is a laminated sheet with an insulating layer 2b stacked on a substrate layer 2a (see reference). Figure 2A and Figure 2B ).

[0144] like Figure 2A and Figure 2B As shown, in the original plate 10' of the second embodiment, the second plate 2 is stacked on the insulating layer 1b of the first plate 1 with its insulating layer 2b in contact with the insulating layer 1b of the first plate 1.

[0145] That is, in the second embodiment, the original plate 10' is configured such that two laminated sheets are overlapped while the insulating layers (insulating layer 1b and insulating layer 2b) are in contact with each other.

[0146] Therefore, in the original plate 10' of the second embodiment, an insulating layer (an insulating layer 1b and an insulating layer 2b laminate) is sandwiched between two substrate layers (substrate layer 1a and substrate layer 2a).

[0147] In the original plate 10' of the second embodiment, the first plate 1 and the second plate 2 are configured as rectangles of approximately the same size when viewed from above.

[0148] like Figure 2AAs shown, in the original plate 10' of the second embodiment, the first plate 1 and the second plate 2 are stacked together in a staggered manner in the diagonal direction Dd (the direction indicated by the arrow in the figure).

[0149] The original plate 10' of the second embodiment is constructed as described above. In addition to the insulating layer 1b of the first plate 1, the insulating layer 2b of the second plate 2 is also provided with an exposed portion Ex2' that is exposed on the outside of the first plate 1.

[0150] Specifically, in the original plate 10' of the second embodiment, as Figure 2B As shown, on one side along the long side (x-axis direction), an exposed portion Ex1 of the insulating layer 1b of the first piece 1 is provided between the first side E1a of the first piece 1 and the first' side E2a of the second piece 2. In addition, on the other side along the long side (x-axis direction), an exposed portion Ex2' of the insulating layer 2b of the second piece 2 is provided between the second side E1b of the first piece 1 and the second' side E2b of the second piece 2.

[0151] Additionally, in the original plate 10' of the second embodiment, such as Figure 2C As shown, on one side in the width direction (y-axis direction), there is an exposed portion Ex1 of the insulating layer 1b of the first piece 1 between the fourth side E1d of the first piece 1 and the fourth side E2d of the second piece 2. In addition, on the other side in the width direction (y-axis direction), there is an exposed portion Ex2' of the insulating layer 2b of the second piece between the third side E1c of the first piece 1 and the third side E2c of the second piece 2.

[0152] That is, in the original plate 10' of the second embodiment, the exposed portion Ex1 and the exposed portion Ex2' are L-shaped and are provided in a position that is symmetrical about the diagonal direction Dd.

[0153] Similar to the original plate 10 in the first embodiment, in the original plate 10' of the second embodiment, the exposed portion Ex1 of the first plate 1 extends outward from the second plate 2 by a maximum length of 10 mm.

[0154] The length can be less than 8mm, less than 7mm, or less than 6mm.

[0155] In addition, the length can be 2mm or more, or 3mm or more, or 4mm or more.

[0156] In the original plate 10' of the second embodiment, the exposed portion Ex2' of the second plate 2 extending outward from the first plate 1 is preferably at most 10 mm or less.

[0157] The length can also be less than 8mm, less than 7mm, or less than 6mm.

[0158] In addition, the length can be 2mm or more, or 3mm or more, or 4mm or more.

[0159] The original plate 10 of the first embodiment can be manufactured in, for example, the following manner.

[0160] First, the above-mentioned resin composition is mixed with an organic solvent to prepare a coating composition.

[0161] The organic solvent used is one capable of dissolving the resin contained in the resin composition. Examples of such organic solvents include methyl ethyl ketone (MEK) and toluene.

[0162] The preparation of the coating composition can be carried out by mixing the above-mentioned resin composition and organic solvent using a stirring device.

[0163] Examples of such mixing devices include ball mills, planetary mixers, homogenizers, and three-roll mills.

[0164] Next, the coating composition of the desired thickness is applied to one surface of the substrate layer 1a.

[0165] The coating of the coating composition can be carried out using a coating apparatus.

[0166] Examples of coating apparatus include gravure roller coating machines, reverse roller coating machines, kiss roller coating machines, scraper coating machines, comma coating machines, and direct coating machines.

[0167] Furthermore, when coating is performed using a coating apparatus as described above, the substrate layer 1a is typically mounted on the coating apparatus in a rolled state.

[0168] Next, the substrate layer 1a coated with the coating composition is introduced into a drying oven to remove the organic solvent contained in the coating composition, thereby obtaining a laminated sheet (first sheet 1) on which an insulating layer 1b is stacked.

[0169] The removal of the organic solvent can be carried out, for example, by subjecting the substrate layer 1a coated with the coating composition to a predetermined time in a conventional heating drying oven.

[0170] Next, the second piece 2, i.e. the separator, is stacked on the insulating layer 1b of the first piece 1 in such a way that a portion of the surface of the insulating layer 1b of the first piece 1 is exposed.

[0171] Specifically, such as Figure 1AAs shown, with the third edge E2c and the fourth edge E2d of the second piece 2, which are arranged at a distance along the width direction (y-axis direction), overlapping the third edge E1c and the fourth edge E1d of the first piece 1, which are arranged at a distance along the width direction (y-axis direction), the second piece 2, i.e. the separator, is stacked on the insulating layer 1b of the first piece 1 in a manner that is offset from the first piece 1 in the long side direction (x-axis direction).

[0172] Thus, a base plate 10 with an exposed portion Ex1 between the first side E1a of the first piece 1 and the first' side E2a of the second piece can be obtained.

[0173] Furthermore, various known sheet lamination devices can be used to laminate the second sheet 2, i.e. the separator sheet, onto the insulating layer 1b of the first sheet 1.

[0174] Furthermore, the original plate 10' of the second embodiment can be manufactured, for example, in the following manner.

[0175] First, similar to the case described in the manufacture of the original sheet 10 of the first embodiment, a set of laminated sheets with an insulating layer stacked on the substrate layer is obtained.

[0176] Specifically, a first piece 1 with an insulating layer 1b stacked on a substrate layer 1a and a second piece 2 with an insulating layer 2b stacked on a substrate layer 2a are obtained.

[0177] Next, as Figure 2A As shown, the second piece 2 is stacked on top of the first piece 1 in such a way that the first piece 1 and the second piece 2 are staggered in the diagonal direction Dd (in the direction indicated by the arrow in the figure).

[0178] The second piece 2 is stacked onto the first piece 1 in such a way that the insulating layer 2b of the second piece 2 abuts against the insulating layer 1b of the first piece 1.

[0179] Thus, a raw plate 10' is obtained, in which the exposed portion Ex1 of the insulating layer 1b of the first plate 1 in the L-shape and the exposed portion Ex2' of the insulating layer 2b of the second plate 2 in the L-shape are set in a symmetrical position with reference to the diagonal direction Dd.

[0180] Furthermore, the lamination of the insulating layer 2b of the second sheet 2 onto the insulating layer 1b of the first sheet 1 can be implemented using various known lamination devices.

[0181] The original plate 10 of the first embodiment described above and the original plate 10' of the second embodiment of the present invention are used to obtain an insulating heat sink.

[0182] The insulating heat sink can be obtained by cutting the original plate 10 and the original plate 10' into a specified shape and size using a punch and a die.

[0183] Here, based on the viewpoint of improving the thermal conductivity of the insulating heat sink when forming the insulating heat sink, inorganic fillers are generally highly filled in the resin composition constituting the insulating layer 1b of the original plate 10, the resin composition constituting the insulating layer 1b of the original plate 10', and the resin composition constituting the insulating layer 2b of the original plate 10'.

[0184] Therefore, the resin composition described above is very fragile. As a result, if the original sheet 10 and the original sheet 10' are cut in their original state by stamping or the like, the insulating layer 1b of the original sheet 10, the insulating layer 1b and the insulating layer 2b of the original sheet 10' will break during the cutting process, making it impossible to perform a good cut.

[0185] Therefore, before cutting the original sheet 10 and the original sheet 10' by stamping or the like, in order to make the resin composition constituting the insulating layer 1b of the original sheet 10, the resin composition constituting the insulating layer 1b of the original sheet 10', and the resin composition constituting the insulating layer 2b of the original sheet 10' have sufficient hardness, the original sheet 10 and the original sheet 10' are compressed in the thickness direction.

[0186] Here, in the original plate 10 of the first embodiment, as Figure 1A and Figure 1B As shown, an exposed portion Ex1 is provided between the first edge E1a of the first piece 1 and the first edge E2a of the second piece 2.

[0187] That is, in the original plate 10 of the first embodiment, the insulating layer 1b of the first plate 1 is provided such that the end edge of the second plate 2, i.e., the separator, is exposed outward in the x-axis direction (long side direction). Therefore, as Figure 3 As shown, when the original plate 10 is compressed along the thickness direction, a portion of the insulating layer 1b exposed on the x-axis direction of the second plate, i.e. the separator, can move along the thickness direction.

[0188] Therefore, it is possible to suppress the overflow of a portion of the insulating layer 1b from the edge of the substrate layer 1a in the x-axis direction, thereby suppressing the resin composition constituting the insulating layer 1b from falling off the original sheet 10.

[0189] Additionally, in the original plate 10' of the second embodiment, such as Figures 2A to 2C As shown, the exposed portion Ex1 of the insulating layer 1b of the first L-shaped piece 1 and the exposed portion Ex2' of the insulating layer 2b of the second L-shaped piece 2 are positioned symmetrically facing each other with reference to the diagonal direction Dd.

[0190] That is, in the original plate 10' of the second embodiment, the insulating layer 1b of the first plate 1 is provided to be exposed outward from one end edge of the second plate, i.e., the laminated plate, in the x-axis direction (long side direction) and y-axis direction (width direction), and the insulating layer 2b of the second plate 2 is provided to be exposed outward from the other end edge of the first plate 1, i.e., the laminated plate, in the x-axis direction (long side direction) and y-axis direction (width direction).

[0191] Therefore, as Figure 4A and 4B As shown, when the original plate 10' is compressed along the thickness direction, a portion of the insulating layer 1b exposed outward from one end edge in the x-axis direction (long side direction) and y-axis direction (width direction) can be moved in the thickness direction, and a portion of the insulating layer 2b exposed outward from the other end edge in the x-axis direction (long side direction) and y-axis direction (width direction) can be moved in the thickness direction.

[0192] Therefore, it is possible to suppress a portion of the insulating layer 1b from overflowing outward from one end edge of the substrate layer 1a in the x-axis and y-axis directions, and in addition, it is possible to suppress a portion of the insulating layer 2b from overflowing outward from the other end edge of the substrate layer 2a in the x-axis and y-axis directions. Thus, it is possible to suppress the resin composition constituting the insulating layer 1b and the resin composition constituting the insulating layer 2b from falling off the original plate 10'.

[0193] That is, it can prevent the resin composition constituting the laminate of insulating layer 1b and insulating layer 2b from falling off the original plate 10'.

[0194] Furthermore, in the original plate 10 of the first embodiment, the portion of the insulating layer 1b exposed outward from the end edge of the second piece 2, i.e. the separator, in the x-axis direction (long side direction) is not used to form an insulating heat sink, and is discarded after at least one insulating heat sink is cut from the original plate 10.

[0195] Furthermore, in the original plate 10' of the second embodiment, the portion of insulating layer 1b exposed outward from one end edge in the x-axis direction (long side direction) and y-axis direction (width direction) of the second plate (i.e., the laminated plate), and the portion of insulating layer 2b exposed outward from the other end edge in the x-axis direction (long side direction) and y-axis direction (width direction) of the first plate 1 (i.e., the laminated plate), are not used to form an insulating heat sink, and are discarded after at least one insulating heat sink is cut from the original plate 10'.

[0196] The matters disclosed in this specification include the following. (1)

[0198] The original plate, used to cut at least one insulating heat sink, has the following characteristics:

[0199] The first laminate is a stacked sheet on which an insulating layer is stacked on top of a substrate layer;

[0200] The second sheet, layered on top of the insulating layer of the first sheet,

[0201] The insulating layer is composed of a resin composition containing resin and inorganic fillers.

[0202] At least a portion of the first piece extends outward from the second piece, and an exposed portion is provided on the insulating layer that protrudes outward from the outer periphery of the second piece.

[0203] According to this structure, at least a portion of the first sheet extends outward from the second sheet, and the insulating layer has an exposed portion that protrudes outward from the outer periphery of the second sheet. Therefore, when the original sheet is manufactured, the exposed portion can be moved toward the part that does not overlap with the second sheet when the original sheet is compressed along the thickness direction.

[0204] Therefore, during the fabrication of the original sheet, it is possible to prevent the resin composition constituting the insulating layer from overflowing from the substrate layer to the outside.

[0205] As a result, it is possible to suppress the shedding of the resin composition that constitutes the insulating layer in the original board. (2)

[0207] As described in (1) above, both the first and second plates are rectangular when viewed from above.

[0208] The first piece and the second piece are parallel to each other by a distance, and the first and second pieces are stacked in such a way that the edge of the second piece is inside the edge of the first piece.

[0209] The exposed portion is provided between the two sides.

[0210] According to this structure, since the exposed portion is provided between two parallel sides, when the original plate is manufactured, the exposed portion can be easily and evenly moved toward the part that does not overlap with the second plate when the original plate is compressed along the thickness direction.

[0211] Therefore, during the fabrication of the original sheet, it is possible to further suppress the resin composition constituting the insulating layer from overflowing outward from the substrate layer.

[0212] As a result, it is possible to further suppress the shedding of the resin composition that constitutes the insulating layer in the original board. (3)

[0214] As described in (1) or (2) above, the second sheet is a separator that is arranged in a manner that allows it to be peeled off from the insulating layer.

[0215] According to this structure, the second piece is a separator. Since it does not have an insulating layer made of resin composition like a laminated sheet, when the original sheet is compressed along the thickness direction during its fabrication, deformation along the width direction due to its resin composition can be suppressed.

[0216] Therefore, when the original plate is manufactured, the exposed portion can be easily moved along the side edge of the second plate when the original plate is compressed along the thickness direction.

[0217] Therefore, when manufacturing the original sheet, it is possible to more effectively suppress the resin composition constituting the insulating layer from overflowing outward from the substrate layer.

[0218] As a result, the shedding of the resin composition that constitutes the insulating layer in the original board can be more effectively suppressed. (4)

[0220] As described in (2) above, the second sheet is the same as the first sheet in the laminated sheet.

[0221] The first piece and the second piece are stacked diagonally, offset from each other.

[0222] The second insulating layer also has an exposed portion that is exposed on the outside of the first layer.

[0223] According to this structure, when the original plate is compressed along the thickness direction during its fabrication, the exposed portion can be easily moved more evenly to the part that does not overlap with the second plate.

[0224] Therefore, during the fabrication of the original sheet, it is possible to further suppress the resin composition constituting the insulating layer from overflowing outward from the substrate layer.

[0225] As a result, the shedding of the resin composition that constitutes the insulating layer in the original board can be further suppressed. (5)

[0227] As described in (4) above, the exposed portion of the second piece extends outward from the first piece by a maximum length of 10 mm.

[0228] According to this structure, when the original plate is compressed along the thickness direction during its fabrication, the exposed portion can be easily moved more fully toward the part that does not overlap with the second plate.

[0229] Therefore, during the fabrication of the original sheet, it is possible to further suppress the resin composition constituting the insulating layer from overflowing outward from the substrate layer.

[0230] As a result, it is possible to further suppress the shedding of the resin composition that constitutes the insulating layer in the original board. (6)

[0232] In any of the original plates described in (1) to (5) above, the exposed portion of the first plate extends outward from the second plate by a maximum length of 10 mm.

[0233] The original plate of the present invention is not limited to the embodiments described above. Furthermore, the original plate of the present invention is not limited to the effects described above. Various modifications can be made to the original plate of the present invention without departing from the spirit of the invention.

[0234] In the original plate 10 of the first embodiment described above, the following example is used for explanation: the second plate 2 is composed of a partition plate, such as... Figure 1A As shown, when the third' side E2c and the fourth' side E2d of the second piece 2 are arranged at a distance in the width direction (y-axis direction) and overlap with the third side E1c and the fourth side E1d of the first piece 1, which are arranged at a distance in the width direction (y-axis direction), the second piece 2 is misaligned with the first piece 1 in the long side direction (x-axis direction). However, the misalignment state is not limited to this when the second piece 2 is composed of a partition piece.

[0235] For example, in the case where the second piece 2 is composed of partitions, such as Figure 2A As shown, in the original plate 10, the first piece 1 and the second piece 2 can also be in the diagonal direction ( Figure 2A They are stacked in a misaligned manner in the direction indicated by the middle arrow.

[0236] Alternatively, it can also be configured as follows: Figure 5 As shown, the second piece 2 is configured as a top-view rectangle with a smaller top-view size than the first piece 1, so that the insulating layer 1b is exposed from the four sides of the second piece 2 outwards, thus misaligning the first piece 1 and the second piece 2.

[0237] In the original sheet 10' of the second embodiment described above, the following example is used for explanation: the second sheet 2 is also composed of laminated sheets, just like the first sheet 1, such as Figure 2A As shown, the first piece 1 and the second piece 2 are in the diagonal direction ( Figure 2A The layers are stacked in a misaligned manner (as indicated by the middle arrow), but the misalignment is not limited to the case where the second layer is composed of laminated sheets.

[0238] For example, in the case where the second sheet 2 is composed of laminated sheets, such as Figure 1A and Figure 1B As shown, the second piece 2 can also be configured such that the third side E2c and the fourth side E2d, which are arranged at a distance in the width direction (y-axis direction), overlap with the third side E1c and the fourth side E1d, which are arranged at a distance in the width direction (y-axis direction), respectively, while being misaligned with the first piece 1 in the long side direction (x-axis direction).

[0239] Importantly, in the original plate 10 of the first embodiment, the first plate 1 and the second plate 2 can be stacked in such a way that at least a portion of the insulating layer 1b of the first plate 1 is exposed. In the original plate 10' of the second embodiment, the first plate 1 and the second plate can be stacked in such a way that at least a portion of the insulating layer 1b of the first plate 1 and at least a portion of the insulating layer 2b of the second plate 2 are exposed.

[0240] Furthermore, in the first embodiment and the second embodiment described above, the first piece 1 and the second piece 2 were described as having a rectangular shape when viewed from above, but the top view shape of the first piece 1 and the second piece 2 is not limited to a rectangle.

[0241] The top view shape of the first piece 1 and the second piece 2 can also be a polygon other than a rectangle (e.g., a pentagon, a hexagon, an octagon), or a circle or an ellipse.

[0242]

Example

[0243] Next, embodiments and comparative examples will be provided to further illustrate the present invention. Furthermore, the following embodiments are for the purpose of describing the present invention in more detail and are not intended to limit the scope of the present invention.

[0244] (Example 1)

[0245] [Part 1]

[0246] A varnish was prepared by dispersing boron nitride particles (median particle size: 24 μm), alumina particles (median particle size: 0.9 μm), and silica particles (primary particle size: 0.007 μm) in an organic solvent, with the total amount of boron nitride particles (median particle size: 24 μm), alumina particles (median particle size: 0.9 μm), and silica particles (primary particle size: 0.007 μm) accounting for 55% by volume of the solid matter.

[0247] In addition, the volume ratio (BN ratio) of boron nitride particles relative to the total amount of boron nitride particles, alumina particles, and silicon oxide particles is 50%.

[0248] The varnish is applied to a PET film (substrate layer, top view size 500mm × 500mm, thickness 100μm) that has been sandblasted to a matte finish and then dried to form a dry film composed of a thermosetting resin composition on the PET film.

[0249] In addition, the varnish is applied to the matte-treated side of the PET film, and the thickness of the dried film (insulating layer) is 100 μm.

[0250] Thus, the first piece of Example 1 is obtained.

[0251] [Part 2]

[0252] As the second piece in Example 1, a PET film (top view size 500mm × 500mm, thickness 100μm) was prepared to be sandblasted to achieve a matte finish.

[0253] [Original plate]

[0254] like Figure 1A and Figure 1B As shown, after overlapping the first sheet and the second sheet to obtain the first laminate, the first laminate is compressed in the thickness direction to obtain the original plate of Example 1.

[0255] The first piece and the second piece are overlapped such that the insulating layer of the first piece abuts against the matte-finished surface of the second piece.

[0256] Additionally, the exposed portion of the first piece ( Figure 1A and Figure 1B The length of Ex1 extending outward from the second piece is 5mm.

[0257] Furthermore, the compression of the first laminate in the thickness direction is carried out for 20 minutes at a temperature of 120°C and a pressure of 5 MPa.

[0258] (Example 2)

[0259] The exposed portion of the first piece ( Figure 1A and Figure 1B The length of the plate extending outward from the second piece (Ex1) is 10 mm. Otherwise, the original plate of Example 2 is obtained in the same way as in Example 1.

[0260] (Comparative Example 1)

[0261] The exposed portion of the first piece ( Figure 1A and Figure 1B The length of the first sheet extending outward from the second sheet (Ex1) is 0 mm. Otherwise, except that the first sheet and the second sheet overlap in a manner that does not form an exposed portion, the original sheet of Comparative Example 1 is obtained in the same manner as in Example 1.

[0262] (Example 3)

[0263] [Part 1]

[0264] Prepare the first piece in the same manner as in Example 1.

[0265] [Part 2]

[0266] As the second sheet of Example 3, a sheet with an insulating layer formed on the same PET film as the first sheet of Example 1 is prepared.

[0267] [Original plate]

[0268] like Figures 2A to 2C As shown, after overlapping the first' sheet with the second' sheet to obtain the second laminate, the second laminate is compressed in the thickness direction to obtain the original plate of Example 3.

[0269] The first and second pieces are overlapped such that the insulating layer of the first piece abuts against the insulating layer of the second piece.

[0270] Additionally, the exposed portion of the first piece ( Figures 2A to 2C The length of Ex1 extending outward from the 2' piece and the exposed portion of the 2' piece (where Ex1 is the length of the 2' piece extending outward from the 2' piece) Figures 2A to 2C The length of each piece (Ex2') extending outward from the first piece (1') is 5mm.

[0271] Furthermore, the compression of the second laminate in the thickness direction is carried out under the same conditions as in Example 1.

[0272] (Example 4)

[0273] In addition to exposing the first piece ( Figures 2A to 2C The length of Ex1 extending outward from the second piece and the exposed portion of the second piece (Ex1) Figures 2A to 2C The length of the original plate of Example 4 is more than 10mm from the first piece (Ex2').

[0274] (Comparative Example 2)

[0275] In addition to exposing the first piece ( Figures 2A to 2C The length of Ex1 extending outward from the second piece and the exposed portion of the second piece (Ex1) Figures 2A to 2C Except that the length of the first' piece extending outward from the second' piece is 0 mm, that is, except that the first' piece and the second' piece are overlapped in a manner that does not form an exposed portion, the original plate of Comparative Example 2 is obtained in the same way as in Example 3.

[0276] <Amount of insulation overflow from the edge of the original board>

[0277] For each example of the original board, the results of measuring the amount of insulation overflow from the edge of the original board are shown in Table 1 below.

[0278] The amount of insulation overflowing from the edge of the original board was measured at five random points using vernier calipers, and the arithmetic mean of these measurements was calculated.

[0279] Table 1

[0280] Example 1 Example 2 Comparative Example 1 Extension length (mm) 5 10 0 Overflow amount (mm) 0.1 or less 0.4 or less 20 Example 3 Example 4 Comparative Example 2 Extension length (mm) 5 10 0 Overflow amount (mm) 0.1 or less 0.4 or less 20

[0281] According to Table 1 above, due to the setting... Figure 1A and Figure 1B The exposed part Ex1 shown and Figures 2A to 2C As shown in the exposed portions Ex1 and Ex2', it was confirmed that the amount of insulation overflow was suppressed for the obtained original plates (the original plates of Examples 1 to 4).

[0282] Therefore, in the original plates of Examples 1 to 4, the shedding of the resin composition constituting the insulating layer can be suppressed.

[0283] Explanation of reference numerals in the attached figures

[0284] 1. First piece, 2. Second piece, 10. Original plate, 10'. Original plate, 1a. Substrate layer, 1b. Insulating layer, 2a. Substrate layer, 2b. Insulating layer, E1a. First side, E1b. Second side, E1c. Third side, E1d. Fourth side, E2a. First' side, E2b. Second' side, E2c. Third' side, E2d. Fourth' side, Ex1. Exposed part, Ex2. Exposed part, Ex2'. Exposed part, Dd. Diagonal direction.

Claims

1. A substrate plate, used for cutting at least one insulating heat sink fin, The original plate has the following characteristics: The first laminate, which has an insulating layer stacked on top of a substrate layer; and A second sheet is stacked on top of the insulating layer of the first sheet, and the second sheet is the same as the first sheet in the laminated sheet. The insulating layer is composed of a resin composition containing resin and inorganic fillers. Both the first piece and the second piece are rectangular when viewed from above. At least a portion of the first piece extends outward from the second piece, and the insulating layer has an exposed portion that protrudes outward from the outer periphery of the second piece. The first piece has one side parallel to the second piece at a distance from each other, and the first and second pieces are stacked diagonally in a staggered manner such that the side of the second piece is inside the side of the first piece. The exposed portion is provided between the two sides. The insulating layer of the second piece also has an exposed portion that is exposed on the outside of the first piece.

2. The original plate according to claim 1, The second piece is a separator that is configured to be peeled off from the insulating layer.

3. The original plate according to claim 1, The exposed portion of the second piece extends outward from the first piece by a maximum length of 10 mm.

4. The original plate according to claim 1 or 3, The maximum length of the exposed portion of the first piece extending outward from the second piece is 10mm.

5. The original plate according to claim 2, The maximum length of the exposed portion of the first piece extending outward from the second piece is 10mm.

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