Touch display panel, touch display device, touch display motherboard

Abstract

A touch display panel, a touch display device, and a touch display motherboard. The touch display panel comprises: a base substrate (1), comprising a display area (2) and a peripheral area (3); a display function layer (6), comprising: at least one organic insulating layer (7), and an encapsulation layer (8); the encapsulation layer (8) covers the display area (2) and part of the peripheral area (3) in the orthographic projection of the base substrate (1); a touch function layer (9), located on the side of the encapsulation layer (8) facing away from the base substrate (1), comprising: a touch conductive layer (10), an inorganic insulating layer (11), and a protective layer (16); the touch function layer (9) comprises: a first touch conductive layer (12), and a position A second touch conductive layer (13) is provided on the side of the first touch conductive layer (12) facing away from the display function layer (1); the inorganic insulating layer (11) at least comprises: a first inorganic insulating layer (14) located between the first touch conductive layer (12) and the second touch conductive layer (13); a protective layer (16) is provided on the side of the second touch conductive layer (13) facing away from the first inorganic insulating layer (14); and the organic insulating layer (7) is in direct contact with the touch conductive layer (10) or the protective layer (16) in at least a portion of the peripheral area (3) not covered by the orthographic projection of the encapsulation layer (8) on the base substrate (1).

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a touch display panel, a touch display device, and a touch display motherboard. Background Art

[0002] Display panels made with Organic Light-Emitting Display (OLED) technology have become the mainstream development direction in the field of display technology due to their advantages such as self-luminescence, high brightness, good image quality, and low energy consumption. For this newly developed technology, more designs can be made to meet people's needs. Among them, Flexible Multi-Layer On Cell (FMLOC) technology has become the development direction of the industry. However, the use of FMLOC has the problem of film peeling. If a large amount of peeling occurs during the production process, it will contaminate the equipment. At the same time, the detached film layer will fall into other areas and cause pollution and defects, which will cause the entire motherboard to be scrapped. In addition, if the film layer peels off in the display product, it will cause the signal to be disconnected, resulting in defects. Summary of the Invention

[0003] An embodiment of the present disclosure provides a touch display panel, the touch display panel comprising:

[0004] The base substrate comprises: a display area and a peripheral area surrounding the display area;

[0005] The display function layer is located on one side of the base substrate and includes: at least one organic insulating layer, and an encapsulation layer located on the side of the organic insulating layer facing away from the base substrate; the orthographic projection of the encapsulation layer on the base substrate covers the display area and part of the peripheral area;

[0006] The touch function layer is located on the side of the encapsulation layer facing away from the base substrate, and includes: a touch conductive layer, an inorganic insulating layer in contact with the touch conductive layer, and a protective layer; the touch function layer includes: a first touch conductive layer, and a second touch conductive layer located on the side of the first touch conductive layer facing away from the display function layer; the inorganic insulating layer includes at least: a first inorganic insulating layer located between the first touch conductive layer and the second touch conductive layer; the protective layer is located on the side of the second touch conductive layer facing away from the first inorganic insulating layer; in at least a portion of the peripheral area not covered by the orthographic projection of the encapsulation layer on the base substrate, the organic insulating layer is in direct contact with the touch conductive layer or the protective layer.

[0007] In some embodiments, the peripheral region includes: at least one fan-out region; the fan-out region includes: a bending region;

[0008] The touch function layer includes at least one inorganic insulating layer removed area;

[0009] The orthographic projection of the inorganic insulating layer removed area on the base substrate covers the bending area.

[0010] In some embodiments, the organic insulating layer has at least one groove extending through the thickness thereof; the groove is located at least between the bending region and the display region;

[0011] Between the bending area and the display area, an orthographic projection of the inorganic insulating layer removed area on the base substrate covers the groove.

[0012] In some embodiments, between the bending region and the display region, an orthographic projection of the inorganic insulating layer removed region on the base substrate covers an area between the groove and the bending region.

[0013] In some embodiments, the groove is further located on a side of the bending region away from the display region;

[0014] On the side of the bending area away from the display area, the orthographic projection of the inorganic insulating layer on the base substrate covers the groove.

[0015] In some embodiments, the groove is further located on a side of the bending region away from the display region;

[0016] On the side of the bending area away from the display area, the orthographic projection of the inorganic insulating layer removed area on the base substrate covers the groove.

[0017] In some embodiments, the touch conductive layer further includes:

[0018] A plurality of first touch signal lines extending from the display area to a side of the bending area close to the display area;

[0019] The display function layer further includes: a first conductive layer located between the base substrate and the encapsulation layer, and a second conductive layer located between the first conductive layer and the encapsulation layer;

[0020] The first conductive layer or the second conductive layer includes:

[0021] A plurality of first connecting leads extend from between the bending area and the display area, through the bending area, and to a side of the bending area away from the display area; one end of the first connecting lead is electrically connected to the first touch signal line between the bending area and the display area;

[0022] An orthographic projection of the groove on the base substrate and an orthographic projection of the first touch signal line on the base substrate do not overlap with each other.

[0023] In some embodiments, an orthographic projection of the inorganic insulating layer removed area on the base substrate and an orthographic projection of the first touch signal line on the base substrate do not overlap with each other.

[0024] In some embodiments, an orthographic projection of the first connecting lead on the base substrate passes through the inorganic insulating layer removed area.

[0025] In some embodiments, the display function layer further includes:

[0026] a planarization layer, located between the second conductive layer and the encapsulation layer;

[0027] The pixel definition layer is located between the encapsulation layer and the planarization layer;

[0028] The pixel definition layer and / or the planarization layer has at least one groove extending through the thickness thereof.

[0029] In some embodiments, between the display area and the bending area, a distance between an edge of the inorganic insulating layer and the groove is greater than or equal to 5 micrometers and less than or equal to 40 micrometers.

[0030] In some embodiments, the distance between the groove and the bending region is greater than or equal to 100 micrometers and less than or equal to 300 micrometers.

[0031] In some embodiments, the peripheral region includes: at least one fan-out region; the fan-out region includes a bonding region;

[0032] The touch function layer includes at least one inorganic insulating layer removed area;

[0033] The orthographic projection of the inorganic insulating layer removal area on the base substrate covers the binding area.

[0034] In some embodiments, in the binding area, the second touch conductive layer includes: a plurality of first binding electrodes;

[0035] The organic insulating layer includes a planarization layer; the first binding electrode contacts the planarization layer.

[0036] In some embodiments, the display function layer further includes: a first conductive layer located between the planarization layer and the base substrate, a first insulating layer located between the first conductive layer and the planarization layer, and a second conductive layer located between the first insulating layer and the planarization layer;

[0037] In the binding area, the first conductive layer includes a second binding electrode corresponding one-to-one to the first binding electrode, and the second conductive layer includes a third binding electrode corresponding one-to-one to the second binding electrode; the third binding electrode is connected to the second binding electrode through a via hole penetrating the first insulating layer; and the first binding electrode is connected to the third binding electrode through a via hole penetrating the planarization layer.

[0038] In some embodiments, the touch function layer includes at least one inorganic insulating layer removed area and at least one first protective layer removed area;

[0039] The orthographic projection of the first protective layer removal area on the base substrate falls within the orthographic projection of the inorganic insulating layer removal area on the base substrate.

[0040] In some embodiments, the inorganic insulating layer includes only a first inorganic insulating layer;

[0041] The first touch conductive layer contacts the packaging layer.

[0042] In some embodiments, the inorganic insulating layer further includes a second inorganic insulating layer located between the first touch conductive layer and the encapsulation layer.

[0043] An embodiment of the present disclosure provides a touch display device, which includes the touch display panel provided by the embodiment of the present disclosure.

[0044] An embodiment of the present disclosure provides a touch display motherboard, which includes a plurality of touch display panel areas and a removal area surrounding the touch display panel areas;

[0045] The touch display panel area includes: the touch display panel provided by the embodiment of the present disclosure;

[0046] The encapsulation layer of the touch display panel does not overlap with the removal area in the orthographic projection of the base substrate; the organic insulating layer of the touch display panel and the touch function layer of the touch display panel extend to the removal area;

[0047] In the at least partially removed area, the film layer on the side of the inorganic insulating layer facing away from the base substrate is in direct contact with the organic insulating layer.

[0048] In some embodiments, the removal area includes: a first cutting area located between adjacent touch display panel areas, a plurality of second cutting areas surrounding the touch display panel area and adjacent to the touch display panel area, and a sub-removal area located between the first cutting area and the second cutting area;

[0049] The touch conductive layer includes an alignment mark located in the sub-removal area, and the alignment mark contacts the organic insulating layer.

[0050] In some embodiments, the organic insulating layer includes: a pixel definition layer;

[0051] The second touch conductive layer includes a first alignment mark located in the sub-removal area; the first alignment mark contacts the pixel definition layer.

[0052] In some embodiments, an orthographic projection of the inorganic insulating layer on the base substrate at least partially does not overlap with the removed area. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0054] Figure 1 A schematic structural diagram of a touch display panel provided in an embodiment of the present disclosure;

[0055] Figure 2 A cross-sectional view of a display area of ​​a touch display panel provided in an embodiment of the present disclosure;

[0056] Figure 3 The embodiment of the present disclosure provides Figure 1 Cross-sectional view of AA';

[0057] Figure 4 A schematic structural diagram of another touch display panel provided in an embodiment of the present disclosure;

[0058] Figure 5 A schematic structural diagram of another touch display panel provided in an embodiment of the present disclosure;

[0059] Figure 6 A schematic diagram of binding a driver chip and a touch display panel in the related art provided by an embodiment of the present disclosure;

[0060] Figure 7 A schematic structural diagram of a fan-out area of ​​a touch display panel provided in an embodiment of the present disclosure;

[0061] Figure 8 A schematic structural diagram of a fan-out area of ​​another touch display panel provided in an embodiment of the present disclosure;

[0062] Figure 9 The embodiment of the present disclosure provides Figure 7 Cross-sectional view of DD';

[0063] Figure 10 A schematic structural diagram of a fan-out area of ​​another touch display panel provided in an embodiment of the present disclosure;

[0064] Figure 11 A schematic structural diagram of a fan-out area of ​​another touch display panel provided in an embodiment of the present disclosure;

[0065] Figure 12 A schematic structural diagram of a touch display motherboard provided in an embodiment of the present disclosure;

[0066] Figure 13 Provided for the embodiments of the present disclosure Figure 12 Schematic diagram of area B in the middle;

[0067] Figure 14 The embodiment of the present disclosure provides Figure 13 Cross-sectional view of CC';

[0068] Figure 15 A schematic diagram of a second alignment mark of a touch display motherboard provided by an embodiment of the present disclosure;

[0069] Figure 16A schematic structural diagram of an alignment mark provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. And in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Based on the described embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0071] Unless otherwise defined, the technical or scientific terms used in this application should have the usual meaning understood by people with ordinary skills in the field to which this application belongs. The words "first", "second" and similar terms used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0072] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the contents of this application. The same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0073] In the related art, the touch function layer includes a buffer layer, a first touch conductive layer, an inorganic film layer, and a second touch conductive layer. Among them, the buffer layer is also an inorganic film layer. For touch display products, the display function layer structure is relatively flat in the display area, and the inorganic film layer of the touch function layer is not prone to film peeling; while in the peripheral area, due to the removal or retention of part of the film layer, it is easy to cause the structure of the display function layer to have a step difference, that is, in the peripheral area, the display function layer structure has poor flatness. Due to the poor bonding strength between the inorganic film layer and the organic film layer, in the peripheral area with poor flatness, the inorganic film layer of the touch function layer contacts the organic film layer of the display function layer, which easily leads to warping and wrinkling of the film layer. When the warping and wrinkling of the film layer cause large cracks to occur, water vapor will invade the interface between the touch function layer and the display function layer through the cracks, resulting in large-scale shedding between the two film layers. At the same time, because the inorganic film layer is relatively brittle, it is easy to break when subjected to external force, forming a water and oxygen intrusion channel. At the same time, since the inorganic film layer is relatively brittle, the inorganic film layer of the touch functional layer is prone to cracks at the cutting and bending positions, forming water and oxygen intrusion channels, affecting product yield.

[0074] Based on the above problems existing in the related art, the embodiment of the present disclosure provides a touch display panel, such as Figure 1 、 Figure 2 、 Figure 3 As shown, the touch display panel includes:

[0075] The base substrate 1 includes a display area 2 and a peripheral area 3 surrounding the display area 2;

[0076] The display function layer 6 is located on one side of the base substrate 1 and includes: at least one organic insulating layer 7, and an encapsulation layer 8 located on the side of the organic insulating layer 7 facing away from the base substrate 1; the orthographic projection of the encapsulation layer 8 on the base substrate 1 covers the display area 2 and part of the peripheral area 3;

[0077] The touch function layer 9 is located on the side of the encapsulation layer 8 facing away from the base substrate 1, and includes: a touch conductive layer 10, an inorganic insulating layer 11 in contact with the touch conductive layer 10, and a protective layer 16; the touch conductive layer 10 includes: a first touch conductive layer 12, and a second touch conductive layer 13 located on the side of the first touch conductive layer 12 facing away from the display function layer 6; the inorganic insulating layer 11 includes at least: a first inorganic insulating layer 14 located between the first touch conductive layer 12 and the second touch conductive layer 13; the protective layer 16 is located on the side of the second touch conductive layer 13 facing away from the first inorganic insulating layer 14; in at least a portion of the peripheral area 3 not covered by the orthographic projection of the encapsulation layer 8 on the base substrate 1, the organic insulating layer 7 is in direct contact with the touch conductive layer 10 or the protective layer 16.

[0078] In the touch display panel provided by the embodiments of the present disclosure, in at least a portion of the peripheral area not covered by the encapsulation layer, the inorganic insulating layer on the side facing away from the base substrate is in direct contact with the organic insulating layer. This means that the inorganic insulating layer in at least a portion of the peripheral area is removed, so that the inorganic insulating layer of the touch function layer and the organic insulating layer of the display function layer in at least a portion of the peripheral area are not in contact. This prevents the formation of weak contact areas between the organic insulating layer and the inorganic insulating layer in the peripheral area with poor flatness, prevents warping and wrinkling of the film layer, and prevents large-scale shedding. It also prevents the formation of cracks that form channels for water and oxygen intrusion, thereby improving product yield.

[0079] It should be noted that Figure 2 is a cross-sectional view of a touch display substrate in the display area, Figure 3 for Figure 1 Cross-sectional view along line AA'.

[0080] It should be noted that in areas where the encapsulation layer does not cover at least a portion of the peripheral region, the first touch conductive layer is in direct contact with the organic insulating layer or the second touch conductive layer in that region. When the organic insulating layer needs to be in contact with the touch functional layer, it is in direct contact with one of the first touch conductive layer, the second touch conductive layer, and the protective layer. That is, when the organic insulating layer needs to be in contact with the touch functional layer, the organic insulating layer is in direct contact with the first touch conductive layer in areas where the first touch conductive layer is provided; the organic insulating layer is in direct contact with the second touch conductive layer in areas where the second touch conductive layer is provided; and the organic insulating layer is in direct contact with the protective layer in areas where neither the first touch conductive layer nor the second touch conductive layer is provided.

[0081] In specific implementation, the embodiment of the present disclosure adopts flexible multi-layer integrated touch technology (Flexible Multi Layer On Cell, FMLOC) to form a touch function layer on the packaging layer.

[0082] In some embodiments, as Figure 2 As shown, the inorganic insulating layer 11 further includes a second inorganic insulating layer 15 located between the first touch conductive layer 12 and the encapsulation layer 8 .

[0083] In specific implementation, when the inorganic insulating layer of the touch function layer includes a first inorganic insulating layer and a second inorganic insulating layer, the first inorganic insulating layer and the second inorganic insulating layer need to be removed in at least part of the peripheral area where the flatness is poor, and in areas where the film is prone to warping, wrinkling, and large-scale peeling.

[0084] Alternatively, in some embodiments, Figure 4 As shown, the inorganic insulating layer 11 only includes the first inorganic insulating layer 14 ; the first touch conductive layer 12 is in contact with the encapsulation layer 8 .

[0085] Specifically, the touch display panel provided by the embodiments of the present disclosure removes the second inorganic insulating layer between the first touch conductive layer and the encapsulation layer, and forms the first touch conductive layer directly on the encapsulation layer. This prevents the second inorganic insulating layer from contacting the organic insulating layer of the display functional layer, thereby creating weak areas of contact between the organic insulating layer and the inorganic insulating layer in the peripheral area with poor flatness. This prevents film warping, wrinkling, and large-scale shedding, and also prevents cracks from forming channels for water and oxygen intrusion, thereby improving product yield. Furthermore, this can simplify the manufacturing process of the touch display panel, improve touch display panel manufacturing efficiency, and save costs.

[0086] In some embodiments, as Figure 2 、 Figure 3 As shown, the encapsulation layer 8 includes: a first inorganic encapsulation layer 17, an organic encapsulation layer 18, and a second inorganic encapsulation layer 19. The touch function layer 9 is arranged on the side of the second inorganic encapsulation layer 19 away from the base substrate 1.

[0087] In some embodiments, the display function layer includes a plurality of sub-pixel units arranged in an array; the sub-pixel unit includes a light-emitting device and a pixel driving circuit electrically connected to the light-emitting device; the pixel driving circuit is used to drive the light-emitting device to emit light, and the pixel driving circuit, for example, includes a thin film transistor and a storage capacitor.

[0088] In some embodiments, as Figure 2 As shown, the display function layer 6 specifically also includes: an active layer 20 located between the base substrate 1 and the encapsulation layer 8, a first gate insulating layer 23 located between the active layer 20 and the encapsulation layer 8, a first conductive layer 21 located between the first gate insulating layer 23 and the encapsulation layer 8, a second gate insulating layer 32 located between the first conductive layer 21 and the encapsulation layer 8, a third conductive layer (not shown) located between the second gate insulating layer 32 and the encapsulation layer 8, an interlayer insulating layer 24 located between the third conductive layer and the encapsulation layer 8, a second conductive layer 22 located between the interlayer insulating layer 24 and the encapsulation layer 8, a passivation layer 25 located between the second conductive layer 22 and the encapsulation layer 8, a planarization layer 26 located between the passivation layer 25 and the encapsulation layer 8, a pixel definition layer 27 located between the planarization layer 26 and the encapsulation layer 8, and a light-emitting device 31. The active layer 20 includes an active layer of a thin film transistor; the first conductive layer 21 includes: a gate G of the thin film transistor and a first electrode of the storage capacitor, the third conductive layer includes a second electrode of the storage capacitor, and the second conductive layer 22 includes a source S and a drain D of the thin film transistor; the light-emitting device layer 31 includes an anode 28, a light-emitting functional layer 29, and a cathode 30 stacked on the planarization layer 26.

[0089] In a specific implementation, the light-emitting device is, for example, an organic light-emitting diode device or a quantum dot light-emitting diode device.

[0090] In a specific implementation, the organic insulating layer 7 of the display function layer 6 includes a planarization layer 26 and a pixel definition layer 27 .

[0091] It should be noted that Figure 2 The anode is directly in contact with the second conductive layer through a via hole penetrating the planarization layer and the passivation layer. Of course, the anode and the second conductive layer can also be electrically connected through a connecting electrode. In some embodiments, such as Figure 5 As shown, the planarization layer 26 includes a first planarization layer 61 and a second planarization layer 62. The display function layer 6 also includes a fourth conductive layer 60. The first planarization layer 61 is located between the passivation layer 25 and the fourth conductive layer 60, and the second planarization layer 62 is located between the fourth conductive layer 60 and the anode 28. In a specific implementation, the fourth conductive layer includes a connecting electrode electrically connected to the second electrode layer through a via hole penetrating the first planarization layer and the passivation layer; the anode is electrically connected to the connecting electrode through a via hole penetrating the second planarization layer.

[0092] In some embodiments, as Figure 1 As shown, the peripheral area 3 includes: at least one fan-out area 4; the fan-out area 4 includes a bonding area 5.

[0093] In some embodiments, as Figure 1 、 Figure 7 As shown, the peripheral area 3 includes: at least one fan-out area 4; the fan-out area 4 includes a bonding area 5.

[0094] In some embodiments, as Figure 1 、 Figure 7 As shown, the touch display panel further includes: a touch signal line 44 and a binding electrode 45 electrically connected to the touch signal line 44. The binding electrode 45 is located in the binding area 3.

[0095] In some embodiments, as Figure 3 As shown, each binding electrode includes: a first binding electrode 36 , a third binding electrode 35 and a second binding electrode 34 ; the first binding electrode 36 is electrically connected to the third binding electrode 35 , and the third binding electrode 35 is electrically connected to the second binding electrode 34 .

[0096] In some embodiments, as Figure 3 As shown, in the binding area, the second touch conductive layer 13 includes a plurality of first binding electrodes 36 .

[0097] In some embodiments, the touch function layer includes at least one inorganic insulating layer removal area. It should be noted that the inorganic insulating layer removal area is the area in the touch function layer where the inorganic insulating layer is removed. When the inorganic insulating layer includes a first inorganic insulating layer and a second inorganic insulating layer, the inorganic insulating layer removal area requires the removal of the first and second inorganic insulating layers. When the inorganic insulating layer includes only the first inorganic insulating layer, the inorganic insulating layer removal area requires the removal of the first inorganic insulating layer.

[0098] In some embodiments, as Figure 7 As shown, the fan-out area 4 further includes: a bending area 46 located between the binding area 5 and the display area;

[0099] The orthographic projection of the inorganic insulating layer removed region 47 on the base substrate covers the bending region 46 .

[0100] That is, the inorganic insulating layer in the bending area is removed, and the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the bending area.

[0101] It should be noted that the touch display panel provided in the embodiments of the present disclosure can, for example, utilize a process for bonding the touch display panel's bonding electrodes to an integrated circuit (IC), known as a COP (Chip On Pi) process. In the COP process, the fan-out region is bent along a bending axis so that the bonding region bends toward the back of the substrate. This reduces the size of the peripheral region, facilitating a narrow bezel. Figure 7 Only part of the fan-out area is shown, and the fan-out area is in an unbent state.

[0102] It should be noted that inorganic insulating layers are prone to cracking under external forces. In the touch display panel provided by the disclosed embodiments, the inorganic insulating layer removal area overlaps the bend area on the base substrate, i.e., the inorganic insulating layer is removed from the touch functional layer in the bend area. This prevents stress generated by the bending in the bend area from causing cracks in the inorganic insulating layer, thus preventing the formation of water vapor intrusion channels and thus preventing film peeling and shedding caused by water vapor intrusion, thereby improving product yield.

[0103] It should be noted that if the inorganic insulating layer includes a first inorganic insulating layer and a second inorganic insulating layer, both the first and second inorganic insulating layers need to be removed in the bending region. If the inorganic insulating layer includes only the first inorganic insulating layer, the first inorganic insulating layer is removed in the bending region.

[0104] In a specific implementation, for a touch display panel using a COP process, the base substrate is a flexible base substrate, and the material of the flexible base substrate is, for example, polyimide (PI).

[0105] In some embodiments, as Figure 7As shown, the organic insulating layer has at least one groove 48 extending through the thickness thereof; the groove 48 is at least located between the bending region 46 and the display region;

[0106] Between the bending region 46 and the display region, the inorganic insulating layer removed region 47 covers the groove 48 in the orthographic projection of the base substrate.

[0107] That is, the inorganic insulating layer is removed from the area where the groove is provided between the bending area and the display area. Between the bending area and the display area, the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the groove.

[0108] The touch display panel provided by the embodiment of the present disclosure is provided with a groove penetrating the thickness of the organic insulating layer at least on the side of the bending area close to the display area, so that when the bending area is bent, the bending stress can be released in the groove area, thereby preventing cracks in the organic insulating layer caused by bending. In addition, the inorganic insulating layer is removed from the area where the groove is provided between the bending area and the display area, thereby avoiding a large film step difference below the inorganic insulating layer in the area where the groove is provided between the bending area and the display area, which would cause the inorganic insulating layer to warp, wrinkle, and crack, and thus prevent water vapor from entering the organic insulating layer along the cracks, and prevent wrinkles and cracks from continuing to extend to the area of ​​the adjacent touch signal line, causing the touch signal line to break.

[0109] In some embodiments, when the organic insulating layer of the display function layer includes a pixel definition layer and a planarization layer, the pixel definition layer and / or the planarization layer has at least one groove extending through the thickness thereof.

[0110] In some embodiments, between the bending region and the display region, an orthographic projection of the inorganic insulating layer removed region on the base substrate covers an area between the groove and the bending region.

[0111] That is, the orthographic projection of the inorganic insulating layer removed area on the base substrate covers the bending area, the groove between the bending area and the display area, and the area between the groove and the bending area.

[0112] The touch display panel provided by the embodiment of the present disclosure removes the inorganic insulating layer of the touch function layer in the bending area, the groove between the bending area and the display area, and the area between the groove and the bending area, thereby avoiding a large film layer step difference below the inorganic insulating layer that will cause the inorganic insulating layer to warp, wrinkle, and crack, avoiding water vapor from entering the organic insulating layer along the cracks, and avoiding wrinkles and cracks from continuing to extend to the area next to the touch signal line, causing the touch signal line to break.

[0113] It should be noted that, if the inorganic insulating layer includes a first inorganic insulating layer and a second inorganic insulating layer, both the first and second inorganic insulating layers need to be removed in the bending region, the groove between the bending region and the display region, and the region between the groove and the bending region. If the inorganic insulating layer includes only the first inorganic insulating layer, the first inorganic insulating layer is removed in the bending region, the groove between the bending region and the display region, and the region between the groove and the bending region.

[0114] In some embodiments, as Figure 7 As shown, between the display area and the bending area 46, the distance h1 between the edge of the inorganic insulating layer and the groove 48 is greater than or equal to 5 microns and less than or equal to 40 microns. That is, the distance between the edge of the inorganic insulating layer and the groove is greater than zero. This prevents a large step difference below the inorganic insulating layer, which could cause the inorganic insulating layer to warp, wrinkle, or crack, and thus prevent the formation of a channel for water vapor intrusion, thereby preventing film peeling and shedding caused by water vapor intrusion, thereby improving product yield.

[0115] In some embodiments, the distance h2 between the groove 48 and the bending region 46 is greater than or equal to 100 microns and less than or equal to 300 microns. This prevents the groove from being too far away from the bending region, preventing bending stress from being released, and also prevents the groove from being too far away from the bending region, causing cracks to form as the groove bends.

[0116] In some embodiments, as Figure 7 、 Figure 8 As shown, the groove 48 is also located on the side of the bending region 46 away from the display region. Therefore, when the bending region bends, the bending stress can be released in the groove area on the side of the bending region away from the display region, further preventing cracks caused by bending in the organic insulating layer.

[0117] In some embodiments, on the side of the bending area away from the display area, the distance between the groove and the bending area may also be greater than or equal to 100 micrometers and less than or equal to 300 micrometers.

[0118] In some embodiments, as Figure 7 As shown, on the side of the bending region 46 facing away from the display area, the orthographic projection of the inorganic insulating layer removed region 47 on the base substrate does not overlap with the orthographic projection of the groove 48 on the base substrate. That is, on the side of the bending region facing away from the display area, the orthographic projection of the inorganic insulating layer on the base substrate covers the groove.

[0119] It should be noted that the film structure on the side of the bend region closest to the display area is more complex than the film structure on the side of the bend region facing away from the display area. Consequently, the film flatness on the side of the bend region closest to the display area is less than that on the side of the bend region facing away from the display area. When the inorganic insulating layer covers the groove on the side of the bend region closest to the display area, it is more likely to cause the inorganic insulating layer to warp, wrinkle, and crack. Therefore, it is possible to consider removing the inorganic insulating layer only in the groove area on the side of the bend region closest to the display area to simplify the design of the touch display panel.

[0120] Alternatively, in some embodiments, Figure 8 As shown, on the side of the bending area 46 away from the display area, the orthographic projection of the inorganic insulating layer removed area 47 on the base substrate covers the groove 48 .

[0121] That is, in the touch display panel provided by the embodiment of the present disclosure, the inorganic insulating layer is removed from the areas where grooves are set on both sides of the bending area, so as to avoid a large film layer step difference under the inorganic insulating layer in any groove area, which will cause the inorganic insulating layer to warp, wrinkle, and crack, and to avoid water vapor from entering the organic insulating layer along the cracks, and to avoid wrinkles and cracks from continuing to extend to the area of ​​the adjacent touch signal line, causing the touch signal line to be broken.

[0122] In some embodiments, as Figure 8 As shown, on the side of the bending region 46 away from the display region, the orthographic projection of the inorganic insulating layer removed region 47 on the base substrate also covers the area between the groove 48 and the bending region 46 .

[0123] In some embodiments, on a side of the bending region facing away from the display region, a distance between an edge of the inorganic insulating layer and the groove is greater than or equal to 5 micrometers and less than or equal to 40 micrometers.

[0124] In some embodiments, as Figure 7 、 Figure 9 As shown, each touch signal line 44 includes a first touch signal line 49 and a first connection lead 50 electrically connected to the first touch signal line 49 .

[0125] It should be noted that Figure 9 For the Figure 7 Cross-sectional view of DD'.

[0126] In a specific implementation, the touch conductive layer includes a plurality of first touch signal lines, and the first conductive layer or the second conductive layer includes a plurality of first connecting leads. Figure 7 、 Figure 9 In the embodiment, the second touch conductive layer 13 includes the first touch signal line 49 and the second conductive layer 22 includes the first connecting lead 50 .

[0127] In the touch display panel provided by the embodiment of the present disclosure, the touch signal lines in the bending area are located in the first conductive layer or the second conductive layer, so that the touch signal lines in the bending area are closer to the base substrate, that is, the touch signal lines in the bending area are closer to the bending neutral plane. In this way, when the bending area is bent, the touch signal lines can be prevented from generating large bending stress and the risk of breakage, thereby improving the yield of the touch display panel.

[0128] In some embodiments, as Figure 7 、 Figure 9 As shown, the first touch signal line 49 extends from the display area to the side of the bending area 46 close to the display area; the first connecting lead 50 extends from the side of the bending area 46 close to the display area through the bending area 46 to between the binding area 5 and the bending area 46; one end of the first connecting lead 50 is electrically connected to the first touch signal line 49, and the other end of the first connecting lead 50 is electrically connected to the first binding electrode 36. In a specific implementation, as shown in FIG. Figure 9 As shown, the first touch signal line 49 is electrically connected to the first connection lead 50 through a via hole penetrating the pixel definition layer 27 and the planarization layer 26 , and the first binding electrode 36 is electrically connected to the first connection lead 50 through a via hole penetrating the pixel definition layer 27 and the planarization layer 26 .

[0129] In some embodiments, as Figure 7 、 Figure 8 As shown, the orthographic projection of the groove 48 on the base substrate and the orthographic projection of the first touch signal line 49 on the base substrate do not overlap with each other.

[0130] That is, the touch display panel provided by the embodiment of the present disclosure has grooves provided in the area outside the touch signal lines, thereby avoiding the risk of disconnection of the touch signal lines due to step differences in the area through which the touch signal lines pass.

[0131] In some embodiments, as Figure 7 、 Figure 8 As shown, the orthographic projection of the inorganic insulating layer removed area 47 on the base substrate does not overlap with the orthographic projection of the first touch signal line 49 on the base substrate.

[0132] That is, in the area where the first touch signal line is provided, the first touch signal line is insulated from other conductive layers by the inorganic insulating layer.

[0133] In some embodiments, as Figure 7 、 Figure 8 As shown, the orthographic projection of the first connecting lead 50 on the base substrate passes through the inorganic insulating layer removed area 47 .

[0134] In some embodiments, the touch function layer further includes a protection layer removal area.

[0135] In some embodiments, as Figure 7 、 Figure 8As shown, the protective layer removal area includes at least one first protective layer removal area 63;

[0136] The orthographic projection of the first protective layer removed area 63 on the base substrate falls within the orthographic projection of the inorganic insulating layer removed area 47 on the base substrate.

[0137] In some embodiments, as Figure 7 、 Figure 8 As shown, the orthographic projection of the first protection layer removed area 63 on the substrate falls within the bending area 46 .

[0138] That is, in the area where the inorganic insulating layer is removed, the protective layer covers the edge of the inorganic insulating layer, thereby preventing the edge of the inorganic insulating layer from being damaged.

[0139] In some embodiments, as Figure 7 、 Figure 8 As shown, the protective layer removal area further includes a second protective layer removal area 64; the orthographic projection of the second protective layer removal area 64 on the base substrate covers the orthographic projection of the inorganic insulating layer on the base substrate.

[0140] In some embodiments, as Figure 7 、 Figure 8 As shown, the orthographic projection of the second protective layer removal area 64 on the substrate falls within the bonding area, that is, in the bonding area, the protective layer needs to be removed to expose the first bonding electrode.

[0141] In some embodiments, as Figure 7 、 Figure 8 As shown, the second touch conductive layer further includes a plurality of dummy touch signal lines 59. The dummy touch signal lines can be used as shielding lines.

[0142] It should be noted that Figure 7 、 Figure 8 An example is given in which the inorganic insulating layer removal area does not cover the binding area.

[0143] Of course, in some embodiments, for COP processes, such as Figure 10 As shown, the inorganic insulating layer removed area 47 covers the binding area 5 on the orthographic projection of the base substrate.

[0144] It should be noted that Figures 7 to 10 The COP process is used as an example for illustration. Of course, in specific implementation, the touch display panel may also adopt a Chip On Film (COF) process.

[0145] Specifically, in the COF process, the driver chip (Integrated Circuit, IC) is fixed to a flexible printed circuit (FPC). The FPC is bonded to the bonding electrodes in the bonding area, allowing signal transmission between the IC and the touch display panel through the FPC. It should be noted that the COF process does not require a bending area between the bonding area and the display area.

[0146] For COF process, such as Figure 11 As shown, the orthographic projection of the inorganic insulating layer removed area 47 on the base substrate covers the binding area 5 .

[0147] In specific implementation, no matter what process the touch display panel is made of, the inorganic insulating layer in the touch function layer can be removed in the binding area.

[0148] In specific implementation, Figure 3 As shown, the orthographic projection of the inorganic insulating layer on the base substrate 1 does not overlap with the binding area 5 .

[0149] It should be noted that if the inorganic insulating layer includes a first inorganic insulating layer and a second inorganic insulating layer, both the first inorganic insulating layer and the second inorganic insulating layer need to be removed in the binding area. If the inorganic insulating layer includes only the first inorganic insulating layer, the first inorganic insulating layer is removed in the binding area.

[0150] Next, we will take the binding of touch display panel and driver chip as an example to explain. Figure 6 As shown, the driver chip 37 needs to be bonded via anisotropic conductive film (ACF) 38 containing conductive particles 39. The first bonding electrode 36 in the bonding area is electrically connected to the driver chip 37 via the conductive particles 39. When the first inorganic insulating layer 14 in the touch function layer extends to the bonding area, the bonding of the driver chip 37 to the first bonding electrode may cause cracks in the first inorganic insulating layer 14, forming a channel for water and oxygen intrusion. Similarly, for the COF process, when the inorganic insulating layer in the touch function layer extends to the bonding area, the bonding of the FPC to the first bonding electrode may cause cracks in the inorganic insulating layer, forming a channel for water and oxygen intrusion.

[0151] In the touch display panel provided by the embodiment of the present disclosure, the orthographic projection of the inorganic insulating layer on the base substrate and the binding area do not overlap with each other, that is, the inorganic insulating layer of the touch function layer is removed in the binding area, thereby avoiding cracks in the inorganic insulating layer caused by the binding of the touch display panel with the driver chip or the flexible circuit board, avoiding the formation of water vapor intrusion channels, thereby avoiding water vapor intrusion causing film peeling and falling off, and improving product yield.

[0152] In some embodiments, as Figure 3As shown, the organic insulating layer 7 includes a planarization layer 26 ; the first bonding electrode 36 is in contact with the planarization layer 26 .

[0153] That is, no inorganic insulating layer is provided between the first binding electrode and the planarization layer, thereby preventing cracks in the inorganic insulating layer caused by binding the touch display panel to the driver chip or the flexible circuit board, and preventing the formation of a water vapor intrusion channel.

[0154] It should be noted that, for the COP process, the first binding electrode is the binding electrode bound to the driver chip. For the COF process, the first binding electrode is the binding electrode bound to the FPC.

[0155] In some embodiments, as Figure 3 As shown, the second conductive layer 22 includes a third binding electrode 35 corresponding to the first binding electrode 36, and the first conductive layer 21 includes a second binding electrode 34 corresponding to the third binding electrode 35. In the binding area, a first insulating layer 33 is included between the first conductive layer 21 and the second conductive layer 22. For example, the first insulating layer 33 includes: an interlayer insulating layer 24 and a second gate insulating layer 32.

[0156] The first binding electrode 36 is electrically connected to the third binding electrode 35 through a via hole penetrating the planarization layer 26 , and the third binding electrode 35 is electrically connected to the second binding electrode 34 through a via hole penetrating the first insulating layer 33 .

[0157] In some embodiments, when the orthographic projection of the inorganic insulating layer removed area on the base substrate covers the bonding area:

[0158] In some embodiments, as Figure 10 As shown, for the COP process, when the orthographic projection of the inorganic insulating layer removal area 47 on the substrate covers the binding area 5, the protective layer removal area also includes a first protective layer removal area 63 corresponding to the binding area; in the area corresponding to the binding area, the orthographic projection of the first protective layer removal area 63 on the substrate falls into the orthographic projection of the inorganic insulating layer removal area 47 on the substrate.

[0159] In some embodiments, as Figure 11 As shown, for the COF process, when the orthographic projection of the inorganic insulating layer removal area 47 on the substrate covers the binding area 5, the protective layer removal area includes a first protective layer removal area 63 corresponding to the binding area; in the area corresponding to the binding area, the orthographic projection of the first protective layer removal area 63 on the substrate falls into the orthographic projection of the inorganic insulating layer removal area 47 on the substrate.

[0160] In some embodiments, as Figure 10 、 Figure 11 As shown, the orthographic projection of the first protective layer removal area 63 on the substrate falls within the binding area 5 .

[0161] In some embodiments, as Figure 1 As shown, the touch conductive layer 10 includes a plurality of intersecting touch sensing electrodes RX and a plurality of touch driving electrodes TX. Each touch sensing electrode RX includes a plurality of touch sensing sub-electrodes 43 and a connecting portion 42 connecting adjacent touch sensing sub-electrodes 43. Each touch driving electrode TX includes a plurality of touch driving sub-electrodes 41 and a bridging electrode 40 connecting adjacent touch driving sub-electrodes 41. In a specific implementation, the touch sensing sub-electrodes 43 and the connecting portion 42 are integrally connected, and the touch sensing sub-electrodes 43, the connecting portion 42, and the touch driving sub-electrodes 41 are disposed on the same layer. For example, one layer of the first touch conductive layer or the second touch conductive layer includes touch sensing sub-electrodes, connecting portions, and touch driving sub-electrodes, while another layer of the first touch conductive layer or the second touch conductive layer includes the bridging electrode. Figure 1 In the embodiment, the touch sensing electrodes RX extend along a first direction X, and the touch driving electrodes TX extend along a second direction Y. The first direction X intersects the second direction Y. For example, the first direction X is perpendicular to the second direction Y. Of course, in a specific implementation, the positions of the touch sensing electrodes RX and the touch driving electrodes TX can be interchanged.

[0162] In specific implementation, Figure 1 As shown, both the touch sensing electrodes RX and the touch driving electrodes TX need to be electrically connected to the touch signal lines 44 .

[0163] In a specific implementation, the touch signal lines are used to provide drive signals to corresponding touch electrodes or receive sensing signals from corresponding touch electrodes. That is, the touch signal lines electrically connected to the touch sensing electrodes RX receive sensing signals from the corresponding touch sensing electrodes RX, and the touch signal lines electrically connected to the touch driving electrodes TX provide drive signals to the corresponding touch driving electrodes TX.

[0164] It should be noted that Figure 1 In the description, the touch sensing sub-electrodes and the touch driving sub-electrodes are taken as diamond block electrodes as an example.

[0165] In a specific implementation, the touch sensing electrodes and touch drive electrodes may be, for example, grid-shaped electrodes. The grid-shaped electrode includes multiple holes. The orthographic projections of the holes on the substrate correspond one-to-one with the orthographic projections of the sub-pixels on the substrate. Alternatively, the orthographic projections of the holes on the substrate correspond to the orthographic projections of multiple sub-pixels on the substrate. In some embodiments, the orthographic projections of the sub-pixel's light-emitting area on the substrate fall within the orthographic projections of the holes on the substrate. This prevents the touch drive electrodes and touch sensing electrodes from affecting the light output of the sub-pixels, thereby preventing the normal display of the touch display panel from being affected.

[0166] In some embodiments, the first touch conductive layer and the second touch conductive layer are made of titanium / aluminum / titanium stacked layers or indium tin oxide / silver / indium tin oxide stacked layers; the inorganic insulating layer includes silicon nitride; and the protective layer includes PI.

[0167] An embodiment of the present disclosure provides a touch display device, which includes the touch display panel provided by the embodiment of the present disclosure.

[0168] The touch display device provided in the embodiments of the present disclosure is any product or component with a touch display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The other essential components of the touch display device are well understood by those skilled in the art and are not described here in detail, nor should they be construed as limitations of the present disclosure. The implementation of the touch display device can be referenced to the aforementioned embodiments of the touch display panel, and any repetitive details will not be repeated.

[0169] In some embodiments, the touch display device further includes a driver chip; the driver chip is bound to the binding electrode in the binding area.

[0170] Alternatively, in some embodiments, the touch display device further includes a driving chip and an FPC; the driving chip is bound to the FPC, and the FPC is bound to the binding electrode in the binding area.

[0171] The embodiment of the present disclosure provides a touch display motherboard, such as Figure 12 As shown, the touch display motherboard includes a plurality of touch display panel areas 51 and a removal area 52 surrounding the touch display panel areas 51;

[0172] The touch display panel area 51 includes: the touch display panel provided by the embodiment of the present disclosure;

[0173] The encapsulation layer of the touch display panel does not overlap with the removal area 52 on the orthographic projection of the base substrate; the organic insulating layer of the touch display panel and the touch function layer of the touch display panel extend to the removal area 52;

[0174] In the at least partially removed area 52 , the film layer on the side of the inorganic insulating layer facing away from the base substrate is in direct contact with the organic insulating layer.

[0175] In the touch-screen display motherboard provided by the disclosed embodiments, the film layer on the side of the inorganic insulating layer facing away from the base substrate in at least a partially removed area is in direct contact with the organic insulating layer. Specifically, the inorganic insulating layer in at least a partially removed area is removed, so that the inorganic insulating layer of the touch function layer and the organic insulating layer of the display function layer in at least a partially removed area are not in contact. This prevents the formation of weak contact areas between the organic insulating layer and the inorganic insulating layer in the removed area with poor flatness, prevents warping and wrinkling of the film layer, and prevents large-scale shedding. It also prevents the formation of cracks that form channels for water and oxygen intrusion, thereby improving product yield.

[0176] In some embodiments, as Figure 12 As shown, the removal area 52 includes: a first cutting area 55 located between adjacent touch display panel areas 51, multiple second cutting areas 53 surrounding the touch display panel area 51 and adjacent to the touch display panel area 51, and a sub-removal area 54 located between the first cutting area 55 and the second cutting area 53.

[0177] In a specific implementation, the touch display motherboard is first roughly cut along the cutting line located in the first cutting area to cut the touch display motherboard into multiple pieces, and then each piece is cut along the cutting line located in the second cutting area to obtain a touch display panel.

[0178] In some embodiments, as Figure 13 、 Figure 14 As shown, the touch conductive layer includes an alignment mark 56 located in the sub-removal area 54 , and the alignment mark 56 contacts the organic insulating layer 7 . The alignment mark 56 includes a first alignment mark 57 .

[0179] It should be noted that Figure 13 for Figure 12 A magnified schematic diagram of area B in the middle. Figure 14 for Figure 13 Cross-sectional view of CC'.

[0180] In specific implementation, Figure 14 As shown, the second touch conductive layer 13 includes a first alignment mark 57 located in the sub-removal area;

[0181] The first alignment mark 57 contacts the pixel definition layer 27 .

[0182] It should be noted that, during the manufacturing process of the display motherboard provided by the embodiments of the present disclosure, the alignment marks formed on the touch function layer are in direct contact with the organic insulating layer.

[0183] It should be noted that the production of FMLOC touch display products requires patterning processes such as exposure, development, etching, and photoresist removal. This patterning process requires alignment using alignment marks. The alignment marks for the patterning of the first touch conductive layer are located on the display function layer, typically the second conductive layer or anode layer. The other layers in the touch function layer are aligned using the first touch conductive layer as the base layer.

[0184] In related art, the first touch conductive layer includes a second alignment mark located on the second inorganic insulating layer. Because the alignment mark is located in the sub-cutting area between the first and second cutting areas, and because there is typically a step difference between the first and second cutting areas and the sub-cutting area, the inorganic insulating layer can easily fall off. If the second inorganic insulating layer falls off, the second alignment mark will also fall off, making subsequent alignment impossible and rendering the entire display motherboard useless.

[0185] In the touch display motherboard provided by the embodiment of the present disclosure, a second alignment mark is formed on the film layer after the first touch conductive layer is patterned. Figure 15 As shown, the second alignment mark 58 contacts the pixel definition layer 27. This prevents the second inorganic insulating layer from falling off during the display motherboard fabrication process, thereby preventing the second alignment mark from falling off. This ensures smooth subsequent alignment and improves the fabrication yield of the touch display motherboard. It should be noted that the second alignment mark will also be etched during the patterning process of the second touch conductive layer. Therefore, it is necessary to form a first alignment mark on the second touch conductive layer as an alignment mark for the protective layer patterning process.

[0186] In the touch display motherboard provided by the embodiment of the present disclosure, the first alignment mark is in contact with the pixel definition layer, which can prevent the inorganic insulating layer from falling off, thereby preventing the first alignment mark from falling off, ensuring that subsequent alignment is carried out smoothly, and improving the production yield of the touch display motherboard.

[0187] It should be noted that Figure 13 The above is only a schematic diagram of one of the patterns that can be set for the alignment mark. In specific implementation, the pattern of the alignment mark can be set according to actual needs. For example, the pattern of the alignment mark 56 can also be as follows: Figure 16 As shown. The alignment mark 56 includes a stripe pattern extending along the second direction Y and a stripe pattern extending along the first direction X. The stripe pattern extending along the second direction Y has a length in the second direction Y of, for example, 170 micrometers (μm) to 210 μm, and the stripe pattern extending along the second direction Y has a length in the first direction X of, for example, 20 μm to 30 μm. The stripe pattern extending along the first direction X has a length in the first direction X of, for example, 130 μm, and the stripe pattern extending along the first direction X has a length in the second direction Y of, for example, 20 μm to 30 μm.

[0188] In some embodiments, an orthographic projection of the inorganic insulating layer on the base substrate at least partially does not overlap with the removed area.

[0189] In some embodiments, the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the removal area, that is, the removal area does not include the inorganic insulating layer of the touch function layer.

[0190] The touch display motherboard provided by the present disclosure can remove the inorganic insulating layer of the touch function layer in the first cutting area, the second cutting area, and the sub-removal area, thereby avoiding the problem of film peeling caused by cutting. It can also prevent cracks in the inorganic insulating layer during cutting in the first and second cutting areas, thereby improving product yield.

[0191] In some embodiments, the touch-sensitive functional layer includes a first protective layer removal area that also corresponds to the removal area. When the orthographic projection of the inorganic insulating layer on the base substrate and the removal area do not overlap, the orthographic projection of the first protective layer removal area corresponding to the removal area on the base substrate falls within the removal area. That is, the orthographic projection of the protective layer on the base substrate overlaps the removal area, allowing the protective layer to cover the edge of the inorganic insulating layer, preventing damage to the inorganic insulating layer.

[0192] In summary, the touch display panel, touch display device, and touch display motherboard provided by the embodiments of the present disclosure are such that, in at least a portion of the area not covered by the encapsulation layer, the film layer of the inorganic insulating layer on the side facing away from the base substrate is in direct contact with the organic insulating layer. This means that the inorganic insulating layer in at least a portion of the area is removed, so that the inorganic insulating layer of the touch function layer and the organic insulating layer of the display function layer are not in contact with each other in at least a portion of the area. This prevents the formation of weak areas of contact between the organic insulating layer and the inorganic insulating layer in areas with poor flatness, prevents warping and wrinkling of the film layer, and prevents large-scale shedding. It also prevents the formation of cracks that could form channels for water and oxygen intrusion, thereby improving product yield.

[0193] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0194] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such changes and modifications of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A touch display panel, wherein: The touch display panel includes: The base substrate comprises: a display area and a peripheral area surrounding the display area; A display function layer is located on one side of the base substrate, comprising: at least one organic insulating layer, and an encapsulation layer located on a side of the organic insulating layer facing away from the base substrate; the encapsulation layer covers the display area and part of the peripheral area when projected onto the base substrate; A touch function layer is located on a side of the encapsulation layer facing away from the base substrate, and includes: a touch conductive layer, an inorganic insulating layer in contact with the touch conductive layer, and a protective layer; the touch function layer includes: a first touch conductive layer, and a second touch conductive layer located on a side of the first touch conductive layer facing away from the display function layer; the inorganic insulating layer includes at least: a first inorganic insulating layer located between the first touch conductive layer and the second touch conductive layer; the protective layer is located on a side of the second touch conductive layer facing away from the first inorganic insulating layer; and in at least a portion of the peripheral area not covered by the orthographic projection of the encapsulation layer on the base substrate, the organic insulating layer is in direct contact with the touch conductive layer or the protective layer. The peripheral area includes: at least one fan-out area; the fan-out area includes: a bending area; The touch function layer includes at least one inorganic insulating layer removed area; The orthographic projection of the inorganic insulating layer removal area on the base substrate covers the bending area.

2. The touch display panel according to claim 1, wherein: The organic insulating layer has at least one groove extending through the thickness thereof; the groove is at least located between the bending area and the display area; Between the bending area and the display area, the inorganic insulating layer removal area covers the groove in an orthographic projection of the base substrate.

3. The touch display panel according to claim 2, wherein: Between the bending area and the display area, the inorganic insulating layer removal area covers the area between the groove and the bending area when projected on the base substrate.

4. The touch display panel according to claim 2 or 3, wherein: The groove is also located on a side of the bending area away from the display area; On a side of the bending area away from the display area, the inorganic insulating layer covers the groove on an orthographic projection of the base substrate.

5. The touch display panel according to claim 2 or 3, wherein: The groove is also located on a side of the bending area away from the display area; On a side of the bending area away from the display area, the inorganic insulating layer removed area covers the groove on an orthographic projection of the base substrate.

6. The touch display panel according to any one of claims 2 to 3, wherein: The touch conductive layer further includes: A plurality of first touch signal lines extending from the display area to a side of the bending area close to the display area; The display function layer further includes: a first conductive layer located between the base substrate and the encapsulation layer, and a second conductive layer located between the first conductive layer and the encapsulation layer; The first conductive layer or the second conductive layer includes: a plurality of first connecting leads extending from between the bending area and the display area, through the bending area, to a side of the bending area away from the display area; one end of the first connecting lead being electrically connected to the first touch signal line between the bending area and the display area; An orthographic projection of the groove on the base substrate and an orthographic projection of the first touch signal line on the base substrate do not overlap with each other.

7. The touch display panel according to claim 6, wherein: An orthographic projection of the inorganic insulating layer removed area on the base substrate and an orthographic projection of the first touch signal line on the base substrate do not overlap with each other.

8. The touch display panel according to claim 6, wherein: The orthographic projection of the first connecting lead on the base substrate passes through the inorganic insulating layer removed area.

9. The touch display panel according to claim 6, wherein: The display function layer further includes: a planarization layer, located between the second conductive layer and the encapsulation layer; a pixel definition layer, located between the encapsulation layer and the planarization layer; The pixel definition layer and / or the planarization layer has at least one groove extending through the thickness thereof.

10. The touch display panel according to any one of claims 2 to 3, wherein: Between the display area and the bending area, a distance between an edge of the inorganic insulating layer and the groove is greater than or equal to 5 micrometers and less than or equal to 40 micrometers.

11. The touch display panel according to any one of claims 2 to 3, wherein: The distance between the groove and the bending area is greater than or equal to 100 micrometers and less than or equal to 300 micrometers.

12. The touch display panel according to claim 1, wherein: The peripheral area includes: at least one fan-out area; the fan-out area includes: a binding area; The touch function layer includes at least one inorganic insulating layer removed area; The orthographic projection of the inorganic insulating layer removal area on the base substrate covers the binding area.

13. The touch display panel according to claim 12, wherein: In the binding area, the second touch conductive layer includes: a plurality of first binding electrodes; The organic insulating layer includes a planarization layer; the first binding electrode contacts the planarization layer.

14. The touch display panel according to claim 13, wherein: The display function layer further includes: a first conductive layer located between the planarization layer and the base substrate, a first insulating layer located between the first conductive layer and the planarization layer, and a second conductive layer located between the first insulating layer and the planarization layer; In the binding area, the first conductive layer includes a second binding electrode corresponding one-to-one to the first binding electrode, and the second conductive layer includes a third binding electrode corresponding one-to-one to the second binding electrode; the third binding electrode is connected to the second binding electrode through a via hole penetrating the first insulating layer; and the first binding electrode is connected to the third binding electrode through a via hole penetrating the planarization layer.

15. The touch display panel according to any one of claims 1 to 3, 7 to 9, and 12 to 14, wherein: The touch function layer includes at least one inorganic insulating layer removed area and at least one first protective layer removed area; The orthographic projection of the first protective layer removal area on the base substrate falls within the orthographic projection of the inorganic insulating layer removal area on the base substrate.

16. The touch display panel according to any one of claims 1 to 3, 7 to 9, and 12 to 14, wherein: The inorganic insulating layer only includes the first inorganic insulating layer; The first touch conductive layer contacts the encapsulation layer.

17. The touch display panel according to any one of claims 1 to 3, 7 to 9, and 12 to 14, wherein: The inorganic insulating layer further includes a second inorganic insulating layer located between the first touch conductive layer and the encapsulation layer.

18. A touch display device, wherein: The touch display device comprises the touch display panel according to any one of claims 1 to 17.

19. A touch display motherboard, wherein: The touch display motherboard includes a plurality of touch display panel areas and a removal area surrounding the touch display panel areas; The touch display panel area comprises: a touch display panel according to any one of claims 1 to 17; The orthographic projection of the encapsulation layer of the touch display panel on the base substrate does not overlap with the removal area; the organic insulating layer of the touch display panel and the touch function layer of the touch display panel extend to the removal area; In at least a portion of the removed area, the film layer on the side of the inorganic insulating layer facing away from the base substrate is in direct contact with the organic insulating layer.

20. The touch display motherboard according to claim 19, wherein: The removal area includes: a first cutting area located between adjacent touch display panel areas, a plurality of second cutting areas surrounding the touch display panel areas and adjacent to the touch display panel areas, and a sub-removal area located between the first cutting area and the second cutting area; The touch conductive layer includes an alignment mark located in the sub-removal area, and the alignment mark is in contact with the organic insulating layer.

21. The touch display motherboard according to claim 20, wherein: The organic insulating layer includes: a pixel definition layer; The second touch conductive layer includes a first alignment mark located in the sub-removal area; the first alignment mark contacts the pixel definition layer.

22. The touch display motherboard according to any one of claims 19 to 21, wherein: The orthographic projection of the inorganic insulating layer on the base substrate at least partially does not overlap with the removal area.

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