A low-stress triple-laser forging additive and subtractive manufacturing device and manufacturing method

Abstract

The present invention discloses a low-stress three-laser forging additive and subtractive manufacturing device and manufacturing method, which relates to the field of additive and subtractive manufacturing technology. The device includes a computer, a multi-laser master control system, a semiconductor seed light source, a beam splitter, a MOPA-configured fiber laser, a Q-switched pulse fiber laser, a mode-locked pulse fiber laser, a laser cladding system, a laser forging system, a laser subtractive system, a visual monitoring system, and a temperature sensor. The present invention uses ultrashort pulse lasers for laser subtractive processing, which is suitable for processing various complex internal structural parts such as chambers and pipelines. The device is monitored in real time by an online visual monitoring system, and the laser subtractive system is used to accurately control the size of the slice layer to achieve the purpose of precise shape control. The manufacturing method of the present invention cooperates with the computer and various systems to improve the performance of the parts while eliminating the need for subsequent heat treatment and finishing processes, greatly improving production efficiency and reducing costs.

Description

Technical Field

[0001] The present invention relates to the technical field of additive and subtractive manufacturing, and in particular to a laser forging additive and subtractive manufacturing device and a manufacturing method. Background Art

[0002] Laser cladding is a widely used 3D printing technology. While it can produce a variety of complex structures and nearly directly mold metal parts compared to traditional manufacturing processes, the 3D printing process can cause molten powder to adhere to slag, reducing the surface roughness and dimensional accuracy of the molded parts. Furthermore, laser cladding uses a high-energy laser to melt and then combine the cladding material and the base material in an extremely short period of time. This bonding process creates a temperature difference, resulting in defects such as pores, cracks, and slag inclusions in the material, reducing the lifespan and performance of the molded parts. In particular, there is a problem of insufficient precise shape control capabilities.

[0003] For example, Chinese patent document CN104493492A discloses a laser selective melting and milling composite processing device and method. This method involves scanning several layers of powder and then using a milling process to high-speed cut the contour of the formed part. Although this method can improve the forming quality, it has the following problems: (1) it is difficult to process large-sized parts and complex structural parts; (2) it is difficult to solve the problem of pores, cracks, and shrinkage in the cladding layer; and (3) tool wear and cumbersome tool changes.

[0004] According to statistics, only 20% of final products are produced by 3D printing. The key problem is low printing efficiency and long subsequent processing cycles. Especially for items with complex curved surfaces and internal cavities, there are the following problems: (1) The printing quality and accuracy are not high; (2) The finishing process requires multiple tool changes, resulting in high tool wear; (3) It is difficult to eliminate internal defects such as holes, microcracks, and slag inclusions in the molded parts during subsequent processing; (4) The rapid prototyping process easily generates extremely high internal stress within the parts, which can easily cause deformation and cracking of the parts. Summary of the Invention

[0005] The purpose of the present invention is to provide a low-stress three-laser forging additive and subtractive manufacturing device with precise shape control capability.

[0006] Another object of the present invention is to provide a low-stress three-laser synchronous forging additive and subtractive manufacturing method.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A low-stress three-laser forging additive and subtractive manufacturing device, including a computer, a multi-laser master control system, a semiconductor seed light source, a beam splitter, a MOPA configuration fiber laser, a Q-switched pulse fiber laser, a mode-locked pulse fiber laser, a laser cladding system, a laser forging system, a laser subtractive system, a visual monitoring system, and a temperature sensor.

[0009] The beam splitter transmits the seed light from the semiconductor seed light source to the MOPA configuration fiber laser, the Q-switched pulse fiber laser and the mode-locked pulse fiber laser respectively;

[0010] The MOPA fiber laser is used to provide continuous laser light to the laser cladding system.

[0011] The Q-switched pulsed fiber laser is used to provide pulsed laser to the laser forging system;

[0012] The mode-locked pulse fiber laser is used to provide ultrashort pulse laser to the laser subtractive system;

[0013] The laser cladding system is used to use the continuous laser of the cladding laser head to melt the powder material delivered by the coaxial powder feeding device and cover the surface of the workpiece to form a cladding layer on the workpiece;

[0014] The laser forging system is used to laser forge the cladding layer formed by the laser cladding system, and cooperates with the laser cladding system to achieve cladding while;

[0015] The laser subtractive system is used to perform laser subtractive micro-milling on the workpiece formed by the laser forging system to improve the surface quality;

[0016] The temperature sensor is used to record the real-time temperature of the cladding layer formed by the laser cladding system on the surface of the workpiece, and transmit the real-time temperature of the cladding layer to the computer. The computer is used to analyze and compare the real-time temperature data collected by the temperature sensor with the originally stored laser forging temperature range. When the real-time temperature data is within the originally stored laser forging temperature range, the laser forging instruction is transmitted to the multi-laser master control system;

[0017] The visual monitoring system is used to collect the internal structure and shape dimensions of the workpiece formed by the laser forging system, and transmit the collected data to the computer. The computer is used to analyze and calculate the dimensional data collected by the visual monitoring system, generate a removal dimension within an allowable error range, and transmit the removal dimension information to the multi-laser master control system;

[0018] The multi-laser master control system is used to control the cladding operation path and start-stop working status of the laser cladding system, and to adjust and control the cladding laser and coaxial powder feeding of the laser cladding system so that the coaxial powder feeding device and the cladding laser head work synchronously; it is also used to control the working operation path and start-stop working status of the laser forging system and the laser subtractive system; it is also used to adjust and control the semiconductor seed light source.

[0019] Furthermore, the MOPA configuration fiber laser includes a continuous wave oscillator, a gain fiber, and a solid amplifier connected in sequence.

[0020] Furthermore, the Q-switched pulse fiber laser includes a Q-switched oscillator, a gain fiber, and a solid-state amplifier connected in sequence, and the Q-switched oscillator adopts an electro-optical modulator to control and compress the pulse width.

[0021] Furthermore, the mode-locked pulse fiber laser includes a mode-locked oscillator, a gain fiber, and a solid amplifier connected in sequence. The mode-locked oscillator uses saturable absorber (SESAM) technology to further compress the pulse width.

[0022] Furthermore, the laser cladding system includes a coaxial powder feeding device and a cladding laser head, the coaxial powder feeding device is connected to the cladding laser head, and the cladding laser head is connected to a MOPA configuration fiber laser.

[0023] Furthermore, the laser forging system includes a forging laser head, which is connected to a Q-switched pulse fiber laser.

[0024] Furthermore, the laser subtractive system includes a subtractive laser head, which is connected to a mode-locked pulsed fiber laser.

[0025] Furthermore, the cladding laser head, forging laser head and subtractive laser head move on the workbench according to a preset running path.

[0026] A low-stress three-laser forging additive and subtractive manufacturing method uses a multi-laser master control system to control the cladding laser and forging laser to work together. After the formed slices are formed, visual monitoring is carried out. If the formed slices do not meet the requirements, laser micro-milling is performed using a subtractive laser. If the formed slices meet the requirements, a second layer of forming slices is stacked on the above-mentioned forming slices until the final formed workpiece is completed.

[0027] Furthermore, the method specifically includes the following steps:

[0028] Step S1: The computer performs three-dimensional modeling, layered slicing, and path planning of the part to be processed, performs parameter optimization, analyzes and determines the temperature range of laser forging, and generates and saves raw data.

[0029] Step S2: The multi-laser master control system starts the semiconductor seed light source, which splits the seed light into a first seed light, a second seed light, and a third seed light through a beam splitter. The first seed light is generated into a continuous laser by a MOPA-configured fiber laser, and the continuous laser is transmitted to the cladding laser head of the laser cladding system; the second seed light is generated into a pulsed laser by a Q-switched pulsed fiber laser, and the pulsed laser is transmitted to the forging laser head of the laser forging system; the third seed light is generated into an ultrashort pulse laser by a mode-locked pulsed fiber laser, and the ultrashort pulse laser is transmitted to the subtractive laser head of the laser subtractive system;

[0030] Step S3: The multi-laser master control system regulates and controls the cladding laser and coaxial powder feeding of the laser cladding system, so that the coaxial powder feeding device and the cladding laser head work synchronously. Then, the cladding laser head in the laser cladding system is started to start cladding along a preset running path, gradually forming a slice cladding layer of the workpiece to be processed on the surface of the workbench. The temperature sensor detects the temperature of the forging initial point of the slice cladding layer in real time.

[0031] Step S4: When the temperature of the initial forging point of the slice cladding layer drops to the originally stored laser forging temperature range, the multi-laser master control system starts the forging laser head of the laser forging system to start laser forging along the trajectory of the slice cladding layer until the slice cladding layer is completely forged to form a formed slice;

[0032] Step S5: The multi-laser master control system turns off the laser cladding system and the laser forging system, so that the cladding laser head and the forging laser head stop working;

[0033] Step S6: Using a visual monitoring system to visually inspect the formed slice, collect the internal structure and shape dimensions of the formed slice, and computer analyze whether the surface of the formed slice meets the requirements. If so, jump to step S9; if not, within the allowable error range, the computer generates information data on the size of the removed surface and inputs it into the multi-laser master control system;

[0034] Step S7: The multi-laser master control system starts the laser subtractive system and controls the running path of the subtractive laser head in the laser subtractive system according to the information data of the removal size, so that the subtractive laser head performs laser micro-milling on the formed slice according to the removal size;

[0035] Step S8: After the laser micro-milling is completed, jump to step S6;

[0036] Step S9: The multi-laser master control system adjusts the laser parameters and direction, and starts to manufacture the next layer of formed slices on the above-mentioned formed slices; repeat the above steps until the final formed workpiece is obtained.

[0037] The beneficial effects of the present invention are as follows: the present invention adopts ultrashort pulse laser for laser material reduction, which is suitable for the processing of various types of complex internal structural parts such as chambers and pipelines, and monitors the surface quality and shape size of each layer in the forming process in real time through an online monitoring system, thereby improving the surface quality of the final formed part while ensuring dimensional accuracy and achieving the purpose of precise shape control. The method of the present invention combines forging laser and cladding laser, and while cladding forming, forging laser is used to forge the forging temperature zone of the cladding layer to eliminate pores and cracks, improve the forming density, and eliminate tensile stress and generate compressive stress during the forging process, thereby improving the fatigue performance of the parts. In addition, through the mutual cooperation of computers and various systems, the three laser beams work together, while improving the performance of the parts, there is no need for subsequent heat treatment and finishing processes, which greatly improves production efficiency and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention is further described with reference to the accompanying drawings. However, the embodiments in the accompanying drawings do not limit the present invention in any way. A person skilled in the art can derive other drawings based on the following drawings without inventive effort.

[0039] Figure 1 It is a structural schematic diagram of the present invention.

[0040] In the figure: 1. Computer; 2. Multi-laser master control system; 3. Semiconductor seed light source; 4. Beam splitter; 5. MOPA-configured fiber laser; 6. Q-switched pulsed fiber laser; 7. Mode-locked pulsed fiber laser; 8. Laser cladding system; 9. Laser forging system; 10. Laser subtractive system; 11. Visual monitoring system; 12. Coaxial powder feeding device; 13. Cladding laser head; 14. Forging laser head; 15. Subtractive laser head; 16. Workbench. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other unless there is a conflict.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper surface", "lower surface", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "forward", "reverse", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] like Figure 1 As shown, a low-stress three-laser forging additive and subtractive manufacturing device includes a computer 1, a multi-laser master control system 2, a semiconductor seed light source 3, a beam splitter 4, a MOPA configuration fiber laser 5, a Q-switched pulse fiber laser 6, a mode-locked pulse fiber laser 7, a laser cladding system 8, a laser forging system 9, a laser subtractive system 10, a visual monitoring system 11 and a temperature sensor.

[0044] The beam splitter 4 transmits the seed light from the semiconductor seed light source to the MOPA configuration fiber laser 5, the Q-switched pulse fiber laser 6 and the mode-locked pulse fiber laser 7 respectively;

[0045] The MOPA fiber laser 5 is used to provide continuous laser light to the laser cladding system. The MOPA fiber laser includes a continuous oscillator, a gain fiber, and a solid amplifier connected in sequence.

[0046] A Q-switched pulse fiber laser 6 is used to provide pulsed laser light to the laser forging system. The Q-switched pulse fiber laser 6 includes a Q-switched oscillator, a gain fiber, and a solid-state amplifier connected in sequence. The Q-switched oscillator uses an electro-optical modulator to control and compress the pulse width.

[0047] A mode-locked pulse fiber laser 7 is used to provide ultrashort pulse laser light to the laser subtractive system. The mode-locked pulse fiber laser includes a mode-locked oscillator, a gain fiber, and a solid-state amplifier connected in sequence. The mode-locked oscillator uses saturable absorber (SESAM) technology to further compress the pulse width.

[0048] The laser cladding system 8 is used to use the continuous laser of the cladding laser head to melt the powder material delivered by the coaxial powder feeding device and cover the surface of the workpiece to form a cladding layer of the workpiece; the laser cladding system includes a coaxial powder feeding device 12 and a cladding laser head 13, the coaxial powder feeding device 12 is connected to the cladding laser head 13, and the cladding laser head 13 is connected to the MOPA configuration fiber laser 5.

[0049] The laser forging system 9 is used to laser forge the cladding layer formed by the laser cladding system, and cooperate with the laser cladding system to achieve cladding while forging; the laser forging system 9 includes a forging laser head 14, which is connected to the Q-switched pulse fiber laser 6.

[0050] The laser subtractive system 10 is used to perform laser subtractive micro-milling on the workpiece formed by the laser forging system to improve the surface quality; the laser subtractive system 10 includes a subtractive laser head 15, which is connected to the mode-locked pulse fiber laser 7.

[0051] The cladding laser head 13 , the forging laser head 14 , and the subtractive laser head 15 move on the workbench 16 according to a preset movement path.

[0052] a temperature sensor for recording the real-time temperature of a cladding layer formed on the surface of a workpiece by the laser cladding system and transmitting the real-time temperature of the cladding layer to a computer; the computer for analyzing and comparing the real-time temperature data collected by the temperature sensor with an originally stored laser forging temperature range; and transmitting a laser forging instruction to a multi-laser master control system when the real-time temperature data is within the originally stored laser forging temperature range;

[0053] The visual monitoring system 11 is used to collect the internal structure and shape dimensions of the workpiece formed by the laser forging system and transmit the collected data to the computer. The computer is used to analyze and calculate the dimensional data collected by the visual monitoring system, generate the removal dimension within the allowable error range, and transmit the removal dimension information to the multi-laser master control system;

[0054] The multi-laser master control system 2 is used to control the cladding operation path and start-stop working status of the laser cladding system, and to adjust and control the cladding laser and coaxial powder feeding of the laser cladding system so that the coaxial powder feeding device and the cladding laser head work synchronously; it is also used to control the working operation path and start-stop working status of the laser forging system and the laser subtractive system; it is also used to adjust and control the semiconductor seed light source.

[0055] The present invention uses ultrashort pulse laser for laser material reduction, which is suitable for the processing of various complex internal structural parts such as chambers and pipelines. It also uses an online monitoring system to monitor the surface quality and shape size of each layer in the forming process in real time, thereby improving the surface quality of the final formed part while ensuring dimensional accuracy and achieving the purpose of precise shape control.

[0056] A low-stress triple-laser forging additive and subtractive manufacturing method utilizes a multi-laser master control system to control the simultaneous operation of the cladding laser and the forging laser. After the formed slice is formed, visual monitoring is performed. If the formed slice does not meet the requirements, laser micro-milling is performed using a subtractive laser. If the formed slice meets the requirements, a second layer of forming slice is stacked on the formed slice until the final formed workpiece is completed. The specific steps include:

[0057] Step S1: The computer performs three-dimensional modeling, layered slicing, and path planning of the part to be processed, performs parameter optimization, analyzes and determines the temperature range of laser forging, and generates and saves raw data.

[0058] Step S2: The multi-laser master control system starts the semiconductor seed light source, which splits the seed light into a first seed light, a second seed light, and a third seed light through a beam splitter. The first seed light is generated into a continuous laser by a MOPA-configured fiber laser, and the continuous laser is transmitted to the cladding laser head of the laser cladding system; the second seed light is generated into a pulsed laser by a Q-switched pulsed fiber laser, and the pulsed laser is transmitted to the forging laser head of the laser forging system; the third seed light is generated into an ultrashort pulse laser by a mode-locked pulsed fiber laser, and the ultrashort pulse laser is transmitted to the subtractive laser head of the laser subtractive system;

[0059] Step S3: The multi-laser master control system regulates and controls the cladding laser and coaxial powder feeding of the laser cladding system, so that the coaxial powder feeding device and the cladding laser head work synchronously. Then, the cladding laser head in the laser cladding system is started to start cladding along a preset running path, gradually forming a slice cladding layer of the workpiece to be processed on the surface of the workbench. The temperature sensor detects the temperature of the forging initial point of the slice cladding layer in real time.

[0060] Step S4: When the temperature of the initial forging point of the slice cladding layer drops to the originally stored laser forging temperature range, the multi-laser master control system starts the forging laser head of the laser forging system to start laser forging along the trajectory of the slice cladding layer until the slice cladding layer is completely forged to form a formed slice;

[0061] Step S5: The multi-laser master control system turns off the laser cladding system and the laser forging system, so that the cladding laser head and the forging laser head stop working;

[0062] Step S6: Using a visual monitoring system to visually inspect the formed slice, collect the internal structure and shape dimensions of the formed slice, and computer analyze whether the surface of the formed slice meets the requirements. If so, jump to step S9; if not, within the allowable error range, the computer generates information data on the size of the removed surface and inputs it into the multi-laser master control system;

[0063] Step S7: The multi-laser master control system starts the laser subtractive system and controls the running path of the subtractive laser head in the laser subtractive system according to the information data of the removal size, so that the subtractive laser head performs laser micro-milling on the formed slice according to the removal size;

[0064] Step S8: After the laser micro-milling is completed, jump to step S6;

[0065] Step S9: The multi-laser master control system adjusts the laser parameters and direction, and starts to manufacture the next layer of formed slices on the above-mentioned formed slices; repeat the above steps until the final formed workpiece is obtained.

[0066] The method of the present invention combines forging lasers with cladding lasers. While cladding is being performed, the forging laser is used to forge the forging temperature zone of the cladding layer, eliminating pores and cracks and increasing the forming density. During the forging process, tensile stress is eliminated and compressive stress is generated, improving the fatigue performance of the part. Furthermore, through the interaction of a computer and various systems, the three laser beams work in synergy, significantly improving part performance while eliminating the need for subsequent heat treatment and finishing processes, greatly increasing production efficiency and reducing costs.

[0067] In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are mutually inconsistent. Although the embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art may make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A low-stress triple-laser forging additive and subtractive manufacturing device, characterized by: Including computers, multi-laser master control systems, semiconductor seed light sources, beam splitters, MOPA-configured fiber lasers, Q-switched pulsed fiber lasers, mode-locked pulsed fiber lasers, laser cladding systems, laser forging systems, laser subtractive systems, visual monitoring systems, and temperature sensors; The beam splitter transmits the seed light from the semiconductor seed light source to the MOPA configuration fiber laser, the Q-switched pulse fiber laser and the mode-locked pulse fiber laser respectively; The MOPA fiber laser is used to provide continuous laser light to the laser cladding system. The Q-switched pulsed fiber laser is used to provide pulsed laser to the laser forging system; The mode-locked pulse fiber laser is used to provide ultrashort pulse laser to the laser subtractive system; The laser cladding system is used to use the continuous laser of the cladding laser head to melt the powder material delivered by the coaxial powder feeding device and cover the surface of the workpiece to form a cladding layer on the workpiece; The laser forging system is used to laser forge the cladding layer formed by the laser cladding system, and cooperates with the laser cladding system to achieve cladding while; The laser subtractive system is used to perform laser subtractive micro-milling on the workpiece formed by the laser forging system to improve the surface quality; The temperature sensor is used to record the real-time temperature of the cladding layer formed by the laser cladding system on the surface of the workpiece, and transmit the real-time temperature of the cladding layer to the computer. The computer is used to analyze and compare the real-time temperature data collected by the temperature sensor with the originally stored laser forging temperature range. When the real-time temperature data is within the originally stored laser forging temperature range, the laser forging instruction is transmitted to the multi-laser master control system; The visual monitoring system is used to collect the internal structure and shape dimensions of the workpiece formed by the laser forging system, and transmit the collected data to the computer. The computer is used to analyze and calculate the dimensional data collected by the visual monitoring system, generate a removal dimension within an allowable error range, and transmit the removal dimension information to the multi-laser master control system; The multi-laser master control system is used to control the cladding operation path and start-stop working status of the laser cladding system, and to adjust and control the cladding laser and coaxial powder feeding of the laser cladding system so that the coaxial powder feeding device and the cladding laser head work synchronously; it is also used to control the working operation path and start-stop working status of the laser forging system and the laser subtractive system; it is also used to adjust and control the semiconductor seed light source.

2. The low-stress triple-laser forging additive and subtractive manufacturing device according to claim 1, characterized in that: The MOPA configuration fiber laser comprises a continuous oscillator, a gain fiber, and a solid amplifier connected in sequence.

3. The low-stress triple laser forging additive and subtractive manufacturing device according to claim 1, characterized in that: The Q-switched pulse fiber laser comprises a Q-switched oscillator, a gain fiber and a solid amplifier connected in sequence. The Q-switched oscillator adopts an electro-optical modulator to control and compress the pulse width.

4. The low-stress triple laser forging additive and subtractive manufacturing device according to claim 1, characterized in that: The mode-locked pulse fiber laser comprises a mode-locked oscillator, a gain fiber, and a solid amplifier connected in sequence. The mode-locked oscillator uses saturable absorber (SESAM) technology to further compress the pulse width.

5. The low-stress triple laser forging additive and subtractive manufacturing device according to claim 1, characterized in that: The laser cladding system comprises a coaxial powder feeding device and a cladding laser head, wherein the coaxial powder feeding device is connected to the cladding laser head, and the cladding laser head is connected to a MOPA configuration optical fiber laser.

6. The low-stress triple laser forging additive and subtractive manufacturing device according to claim 5, characterized in that: The laser forging system comprises a forging laser head, which is connected to a Q-switched pulse fiber laser.

7. The low-stress triple-laser forging additive and subtractive manufacturing device according to claim 6, characterized in that: The laser subtractive system comprises a subtractive laser head connected to a mode-locked pulsed fiber laser.

8. The low-stress triple-laser forging additive and subtractive manufacturing device according to claim 7, characterized in that: The cladding laser head, forging laser head and subtractive laser head move on the workbench according to a preset running path.

9. A low-stress triple-laser forging additive and subtractive manufacturing method, utilizing the low-stress triple-laser forging additive and subtractive manufacturing device of claim 8, characterized in that: A multi-laser master control system is used to control the cladding laser and forging laser to work together. After the formed slices are made, visual monitoring is carried out. If the formed slices do not meet the requirements, laser micro-milling is performed using a subtractive laser. If the formed slices meet the requirements, a second layer of forming slices is stacked on the above-mentioned forming slices until the final formed workpiece is completed.

10. A low stress triple laser forging additive and subtractive manufacturing method according to claim 9, characterized in that: The specific steps include: Step S1: The computer performs three-dimensional modeling, layered slicing, and path planning of the part to be processed, performs parameter optimization, analyzes and determines the temperature range of laser forging, and generates and saves raw data. Step S2: The multi-laser master control system starts the semiconductor seed light source, which splits the seed light into a first seed light, a second seed light, and a third seed light through a beam splitter. The first seed light is generated into a continuous laser by a MOPA-configured fiber laser, and the continuous laser is transmitted to the cladding laser head of the laser cladding system; the second seed light is generated into a pulsed laser by a Q-switched pulsed fiber laser, and the pulsed laser is transmitted to the forging laser head of the laser forging system; the third seed light is generated into an ultrashort pulse laser by a mode-locked pulsed fiber laser, and the ultrashort pulse laser is transmitted to the subtractive laser head of the laser subtractive system; Step S3: The multi-laser master control system regulates and controls the cladding laser and coaxial powder feeding of the laser cladding system, so that the coaxial powder feeding device and the cladding laser head work synchronously. Then, the cladding laser head in the laser cladding system is started to start cladding along a preset running path, gradually forming a slice cladding layer of the workpiece to be processed on the surface of the workbench. The temperature sensor detects the temperature of the forging initial point of the slice cladding layer in real time. Step S4: When the temperature of the initial forging point of the slice cladding layer drops to the originally stored laser forging temperature range, the multi-laser master control system starts the forging laser head of the laser forging system to start laser forging along the trajectory of the slice cladding layer until the slice cladding layer is completely forged to form a formed slice; Step S5: The multi-laser master control system turns off the laser cladding system and the laser forging system, so that the cladding laser head and the forging laser head stop working; Step S6: Using a visual monitoring system to visually inspect the formed slice, collect the internal structure and shape dimensions of the formed slice, and computer analyze whether the surface of the formed slice meets the requirements. If so, jump to step S9; if not, within the allowable error range, the computer generates information data on the size of the removed surface and inputs it into the multi-laser master control system; Step S7: The multi-laser master control system starts the laser subtractive system and controls the running path of the subtractive laser head in the laser subtractive system according to the information data of the removal size, so that the subtractive laser head performs laser micro-milling on the formed slice according to the removal size; Step S8: After the laser micro-milling is completed, jump to step S6; Step S9: The multi-laser master control system adjusts the laser parameters and direction, and starts to manufacture the next layer of formed slices on the above-mentioned formed slices; repeat the above steps until the final formed workpiece is obtained.

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