Laser soldering apparatus and nozzle cleaning method

Abstract

The application discloses a laser tin spraying welding device and a nozzle cleaning method thereof. The nozzle cleaning method of the laser tin spraying welding device comprises the following steps: adjusting a laser into a cleaning mode; the laser generates laser light, and the focal point of the laser light is controlled to reciprocate between a first position and a spraying outlet so that the laser light melts tin ball residues on the cavity wall of the containing cavity; wherein the first position is arranged close to the spraying outlet; and air is sprayed into the containing cavity to spray the melted tin ball residues out of the spraying outlet. The nozzle cleaning method of the laser tin spraying welding device utilizes the laser and the air spraying device in the laser tin spraying welding device to clean the tin ball residues, does not need to disassemble the nozzle from the laser tin spraying welding device, and improves the cleaning efficiency. The laser tin spraying welding device utilizes the laser and the air spraying device to clean the tin ball residues in the nozzle, improves the cleaning efficiency of the nozzle, and avoids the blockage of the nozzle.

Description

Technical Field

[0001] This invention relates to the field of laser soldering, and more specifically to a laser soldering equipment and a nozzle cleaning method thereof. Background Technology

[0002] Currently, laser-sprayed solder ball soldering is an important method of laser soldering. It utilizes mechanical motion to transport individual solder balls to a designated nozzle, where a laser melts the solder ball, and then the molten solder ball is sprayed onto a designated location under pressure. However, during laser-sprayed soldering, solder ball residue can remain on the inner wall of the nozzle, causing nozzle blockage. This results in inaccurate placement of the molten solder ball on the pad, ultimately leading to unstable solder ball formation on the pad and affecting the efficiency of laser-sprayed soldering. Existing technologies mostly involve removing the nozzle from the equipment and performing ultrasonic cleaning, which is inefficient. Summary of the Invention

[0003] The main objective of this invention is to provide a laser soldering equipment and a nozzle cleaning method thereof, so as to solve the problem of low cleaning efficiency caused by disassembling the nozzle for cleaning.

[0004] To achieve the above objectives, the present invention proposes a nozzle cleaning method for a laser soldering equipment, wherein the nozzle is installed on the laser soldering equipment, and the nozzle has a receiving cavity and a spray outlet communicating with the receiving cavity; the nozzle cleaning method for the laser soldering equipment includes the following steps:

[0005] Adjust the laser to enter cleaning mode;

[0006] The laser generates a laser beam, and the focus of the laser beam is controlled to reciprocate between a first position and the nozzle to melt the solder ball residue on the cavity wall of the receiving cavity; wherein, the first position is located close to the nozzle.

[0007] Air is injected into the containment cavity to eject molten solder ball residue from the ejector outlet.

[0008] Preferably, the step of the laser generating laser light and controlling the focal point of the laser to reciprocate between a first position and the nozzle to melt the solder ball residue on the cavity wall of the receiving cavity includes:

[0009] The laser is turned on to generate laser light, and the laser is moved from the starting position to the ending position to control the focus of the laser to move from the first position to the nozzle, thereby melting the solder ball residue on the cavity wall of the receiving cavity once.

[0010] The laser is turned off and moved from the endpoint position to the starting position, thereby controlling the focus of the laser to move from the nozzle to the first position.

[0011] Return to the execution of the steps of turning on the laser to generate laser light and moving the laser from the starting position to the ending position to control the focus of the laser from the first position to the nozzle, until the solder ball residue on the cavity wall of the receiving cavity is melted multiple times until the solder ball residue is completely melted.

[0012] Preferably, before the step of adjusting the laser to enter the cleaning mode, the method further includes:

[0013] Adjust the laser to enter the operating mode;

[0014] The laser generates a laser beam with its focal point located at a second position, and the laser melts a solder ball; wherein, during the melting process, solder ball residue is generated on the cavity wall of the receiving cavity, and the second position is closer to the nozzle than the first position.

[0015] Preferably, after the laser generates a laser and the focal point of the laser is located at the second position, and the laser melts the solder ball, producing solder ball residue on the cavity wall of the receiving cavity, the method further includes:

[0016] Calculate the cumulative number of solder balls melted by the laser;

[0017] When the cumulative number of solder balls melted by the laser reaches a preset number, the laser is adjusted to enter the cleaning mode.

[0018] Preferably, the step of injecting air into the receiving cavity to eject molten solder ball residue from the ejector outlet includes:

[0019] A jetting device is provided, the jetting device being connected to the receiving cavity;

[0020] The jetting device sprays inert gas into the receiving cavity to eject the molten solder ball residue from the nozzle through the inert gas.

[0021] Preferably, after the step of injecting air into the receiving cavity to eject the molten solder ball residue from the ejector outlet, the method further includes:

[0022] A solder ball is placed into the receiving cavity to block the ejection outlet;

[0023] Obtain the actual air pressure inside the nozzle;

[0024] The actual air pressure is compared with the preset air pressure;

[0025] The comparison results will determine whether the nozzle needs to be cleaned again.

[0026] Preferably, the step of determining whether the nozzle needs to be cleaned again based on the comparison results includes:

[0027] If the difference between the actual air pressure and the preset air pressure is outside the preset difference range, it is determined that the nozzle needs to be cleaned again.

[0028] Return to the step of adjusting the laser to enter the cleaning mode until the difference between the actual air pressure and the preset air pressure is within the preset difference range.

[0029] In addition, the present invention also provides a laser soldering apparatus, which is used to perform the nozzle cleaning method of the laser soldering apparatus described above, and the laser soldering apparatus includes:

[0030] frame;

[0031] A nozzle, connected to the frame, having a receiving cavity and an outlet communicating with the receiving cavity.

[0032] A laser, located above the nozzle, is used to generate laser light directed into the receiving cavity;

[0033] A lifting device is connected to the frame, and its output end is connected to the laser. The lifting device is used to drive the laser to move up and down so that the focal point of the laser moves back and forth between a first position and the nozzle; wherein the first position is located close to the nozzle.

[0034] A jetting device for injecting air into the receiving cavity.

[0035] Preferably, the receiving cavity is tapered along the direction close to the nozzle.

[0036] Preferably, the lifting device includes a drive component and a bracket. The output end of the drive component is connected to the bracket, and the bracket is connected to the laser. The drive component drives the bracket and the laser to lift. A sensing plate is provided on the bracket, and a position sensor is provided on the frame. The position sensor is used to sense the position of the sensing plate.

[0037] In this invention, a laser is generated and directed into a cavity, where it generates heat to melt the solder ball residue. The laser's focus is moved to melt solder ball residue at different locations on the cavity wall. Furthermore, the laser's focus moves repeatedly between a first position and the nozzle, melting the residue multiple times and ensuring thorough cleaning. A pressurized gas is injected into the cavity, generating a downward force that moves the molten solder ball residue downwards, allowing it to exit through the nozzle and be removed from the cavity. By injecting air into the cavity, the molten solder ball residue is expelled from the nozzle, improving cleaning efficiency. This invention's nozzle cleaning method for laser soldering equipment utilizes the laser and air jet device to clean solder ball residue without removing the nozzle from the equipment, thus increasing cleaning efficiency. The laser soldering equipment of this invention uses a laser and an air jet device to clean the solder ball residue inside the nozzle, thereby improving the cleaning efficiency of the nozzle and avoiding clogging inside the nozzle. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0039] Figure 1 This is a schematic flowchart of the first embodiment of the nozzle cleaning method for the laser soldering equipment of the present invention;

[0040] Figure 2 This is a schematic flowchart of the second embodiment of the nozzle cleaning method for the laser soldering equipment of the present invention;

[0041] Figure 3 This is a schematic flowchart of the third embodiment of the nozzle cleaning method for the laser soldering equipment of the present invention;

[0042] Figure 4 This is a schematic diagram showing the state in which the laser focus is located in the first position during the nozzle cleaning method of a laser soldering equipment according to an embodiment of the present invention.

[0043] Figure 5 This is a schematic diagram showing the state in which the laser focus is located in the second position during the nozzle cleaning method of a laser soldering equipment according to an embodiment of the present invention.

[0044] Figure 6 This is a schematic diagram of the structure of a laser soldering equipment according to an embodiment of the present invention.

[0045] Explanation of icon numbers:

[0046]

[0047]

[0048] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0050] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0051] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0053] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0054] In this invention, the descriptions of directions such as "up," "down," "front," "back," "left," and "right" are as follows: Figure 6 The directions shown are for reference only and are used to interpret the location. Figure 6 The relative positional relationship between the components in the shown posture is such that if the specific posture changes, the directional indication will also change accordingly.

[0055] This invention provides a laser soldering equipment and a nozzle cleaning method thereof.

[0056] Reference Figure 1 and Figure 4 This is a schematic flowchart of the first embodiment of the nozzle cleaning method of the laser soldering equipment of the present invention. The nozzle 20 is installed on the laser soldering equipment 100. The nozzle 20 has a receiving cavity 21 and a spray outlet 22 connected to the receiving cavity 21.

[0057] The nozzle 20 is installed and fixed by mounting it on the laser soldering equipment 100. The nozzle 20 has a receiving cavity 21 and an outlet 22. The receiving cavity 21 extends in the vertical direction and is used to receive solder balls 300. The outlet 22 is connected to the lower end of the receiving cavity 21, and the solder balls 300 are ejected from the outlet 22.

[0058] The nozzle 20 cleaning method of the laser soldering equipment 100 includes the following steps:

[0059] Step S10: Adjust the laser to enter cleaning mode;

[0060] Once the laser 30 enters the cleaning mode, it can perform the nozzle 20 cleaning method of the laser soldering equipment 100.

[0061] Step S20: The laser generates a laser beam, and the focus of the laser beam is controlled to reciprocate between a first position and the nozzle to melt the solder ball residue on the cavity wall of the receiving cavity; wherein, the first position is located close to the nozzle.

[0062] Laser 30 generates laser 31, which is directed into the receiving cavity 21. The laser 31 generates heat to melt the solder ball residue 200. The focal point 311 of laser 31 is controlled to reciprocate between a first position and an outlet 22, with the first position higher than the outlet 22. By moving the focal point 311, laser 31 can melt the solder ball residue 200 at different locations on the cavity wall of the receiving cavity 21, improving cleaning efficiency. Furthermore, the multiple reciprocating movements of the focal point 311 between the first position and the outlet 22 ensure multiple and thorough meltings of the solder ball residue 200 on the cavity wall of the receiving cavity 21, preventing some solder ball residue 200 from remaining in the receiving cavity 21 due to a single movement of the laser 31.

[0063] Step S30: Air is injected into the receiving cavity to eject the molten solder ball residue from the ejector outlet.

[0064] Gas at a certain pressure is injected into the receiving cavity 21. The gas at a certain pressure generates a downward force, causing the molten solder ball residue 200 to move downward and be ejected from the nozzle 22, thereby cleaning the solder ball residue 200 out of the receiving cavity 21. By injecting gas into the receiving cavity 21, the molten solder ball residue 200 can be ejected from the nozzle 22, improving the cleaning efficiency of the solder ball residue 200.

[0065] This invention generates a laser 31 via a laser 30, which is directed into a receiving cavity 21. The laser 31 generates heat to melt the solder ball residue 200. The focal point 311 of the laser 31 is moved, allowing it to melt the solder ball residue 200 at different locations on the cavity wall of the receiving cavity 21. Furthermore, the focal point 311 of the laser 31 moves back and forth multiple times between a first position and the nozzle 22, repeatedly melting the solder ball residue 200 on the cavity wall of the receiving cavity 21, ensuring thorough cleaning. Gas at a certain pressure is injected into the receiving cavity 21. This pressure generates a downward force, causing the molten solder ball residue 200 to move downwards and exit from the nozzle 22, thus cleaning it away from the receiving cavity 21. By injecting gas into the receiving cavity 21, the molten solder ball residue 200 is ejected from the nozzle 22, improving the cleaning efficiency of the solder ball residue 200.

[0066] The nozzle 20 cleaning method of the laser soldering equipment 100 in this invention uses the laser 30 and the air jet device 50 in the laser soldering equipment 100 to clean the solder ball residue 200, without having to remove the nozzle 20 from the laser soldering equipment 100, thus improving cleaning efficiency.

[0067] Reference Figure 4 Step S20 includes:

[0068] Step S21: Turn on the laser to generate laser light, and move the laser from the starting position to the ending position to control the focus of the laser to move from the first position to the nozzle, thereby melting the solder ball residue on the cavity wall of the receiving cavity once.

[0069] The focal point 311 of laser 31 is positioned at the first position, corresponding to the laser 30 at the starting position. The focal point 311 at the nozzle 22 corresponds to the laser 30 at the ending position. Moving the laser focal point 311 corresponds to moving the laser 30 vertically, facilitating control of the focal point 311 and improving cleaning efficiency. When the laser 30 moves from the starting position to the ending position, it activates, generating laser 31. The focal point 311 of laser 31 moves in the same direction as the airflow, downwards, further enhancing cleaning efficiency.

[0070] Step S22: Turn off the laser and move the laser from the end position to the starting position, so as to control the focus of the laser to move from the nozzle to the first position.

[0071] When the laser 30 moves from the endpoint position to the starting position, the laser 30 is turned off and no laser 31 is generated, thus saving the energy of the laser 30.

[0072] Step S23: Return to the step of turning on the laser to generate laser light and moving the laser from the starting position to the ending position to control the focus of the laser from the first position to the nozzle, until the solder ball residue on the cavity wall of the receiving cavity is melted multiple times until the solder ball residue is completely melted.

[0073] After the laser moves back to the starting position, it returns to the execution of turning on the laser to generate laser light, so that the focus 311 of the laser 31 moves back and forth between the first position and the nozzle 22 until the solder ball residue on the cavity wall of the receiving cavity is melted multiple times, so that the solder ball residue on the cavity wall of the receiving cavity is completely melted, thereby cleaning away all the solder ball residue on the cavity wall of the receiving cavity.

[0074] Reference Figure 2 and Figure 5 This is a schematic flowchart of the second embodiment of the nozzle cleaning method for the laser soldering equipment of the present invention. Based on the first embodiment described above, before step S10, the method further includes:

[0075] Step S01: Adjust the laser to enter the operating mode;

[0076] When the laser 30 enters the operating mode, the ball-distributing disk of the laser soldering equipment 100 rotates, and the solder ball 300 is placed into the nozzle 20. The nozzle 22 is smaller than the solder ball 300, and the solder ball 300 blocks the nozzle 22. Air is injected into the receiving cavity 21, causing the air pressure inside the receiving cavity 21 to rise. The laser 30 generates a laser 31, which melts the solder ball 300. Under the action of the airflow, the solder ball 300 is ejected from the nozzle 22 to the designated position.

[0077] In step S02, the laser generates a laser beam with the focal point of the laser located at a second position, and the laser melts the solder ball; wherein, during the melting process, solder ball residue is generated on the cavity wall of the receiving cavity, and the second position is closer to the nozzle than the first position.

[0078] In operating mode, the focus 311 of laser 31 is located in the second position. Laser 31 melts solder balls 300, and a portion of the solder balls 300 remains on the cavity wall of the receiving cavity 21, producing solder ball residue 200. The second position is closer to the nozzle than the first position, meaning the first position is higher than the second position. During the melting process of the solder balls 200, splashing occurs, resulting in the solder ball residue 200 covering a larger area than the solder balls 300. In cleaning mode, the focus 311 of laser 31 is located in the first position, which is higher than the second position. This increases the coverage area of ​​the laser spot, expands the cleaning range of laser 31, and improves cleaning efficiency.

[0079] Specifically, compared to the operation mode, the laser 31 has higher energy in the cleaning mode, which can improve the melting efficiency of the solder ball residue 200, thereby improving the cleaning efficiency of the solder ball residue 200.

[0080] Reference Figure 2 After step S02, the following steps are also included:

[0081] Step S03: Calculate the cumulative number of solder balls melted by the laser;

[0082] Step S04: When the cumulative number of solder balls melted by the laser reaches a preset number, adjust the laser to enter the cleaning mode.

[0083] The laser soldering equipment 100 calculates the cumulative number of solder balls 300 melted by the laser 30. When the cumulative number of solder balls 300 melted by the laser 30 reaches the preset number, the laser soldering equipment 100 automatically adjusts the laser 30 to enter the cleaning mode. After cleaning is completed, the laser soldering equipment 100 automatically adjusts the laser 30 to enter the operation mode, realizing programmed control and improving the working efficiency of the laser soldering equipment 100.

[0084] Reference Figure 6 Step S30 includes:

[0085] Step S31: Provide a jetting device, which is connected to the receiving cavity;

[0086] In step S32, the jetting device sprays inert gas into the receiving cavity to eject the molten solder ball residue from the nozzle through the inert gas.

[0087] The jetting device 50 provides inert gas at a certain pressure. The jetting device 50 is connected to the receiving cavity 21, allowing the pressurized inert gas to enter the cavity 21. The inert gas protects the molten solder balls 300 and solder ball residue 200, preventing oxidation during the ejection process. The jetting device 50 ejects inert gas into the receiving cavity 21, generating a downward force that ejects the molten solder ball residue 200 from the nozzle 22, thus cleaning the solder ball residue 200.

[0088] Specifically, an inert gas can be nitrogen. Nitrogen is a colorless, odorless, and non-toxic gas. It is a stable molecule at room temperature and does not react with other substances. This inertness makes nitrogen an ideal protective gas, effectively protecting items from the effects of oxygen. Nitrogen has high stability. As a stable molecule at room temperature, nitrogen does not decompose or react due to changes in temperature or pressure. This stability allows nitrogen to maintain its protective effect for a long time, without losing its effectiveness over time.

[0089] In other embodiments, other inert gases can be flexibly adjusted according to actual needs. The present invention does not impose specific limitations on the inert gas.

[0090] Reference Figure 3 This is a flowchart illustrating the third embodiment of the nozzle cleaning method for the laser soldering equipment of the present invention. Based on the first embodiment described above, after step S30, the method further includes:

[0091] Step S40: Place a solder ball into the receiving cavity to block the ejection outlet;

[0092] The ball-distributing disk of the laser soldering equipment 100 rotates, placing a solder ball 300 into the nozzle 20. The size of the nozzle 22 is smaller than that of the solder ball 300, and the solder ball 300 blocks the nozzle 22.

[0093] Step S50: Obtain the actual air pressure inside the nozzle;

[0094] The actual air pressure inside nozzle 20 is obtained by a pressure sensor or other instruments.

[0095] Step S60: Compare the actual air pressure with the preset air pressure;

[0096] Step S70: Determine whether the nozzle needs to be cleaned again based on the comparison results.

[0097] The actual air pressure is compared with the preset air pressure. If there is still solder ball residue 200 on the wall of the receiving cavity 21, a gap will be formed between the solder ball 300 and the wall of the receiving cavity 21, causing the actual air pressure to be lower than the preset air pressure. If the difference between the actual air pressure and the preset air pressure is too large, it is determined that the nozzle 20 needs to be cleaned again. If there is no solder ball residue 200 on the wall of the receiving cavity 21, no gap will be formed between the solder ball 300 and the wall of the receiving cavity 21, and the difference between the actual air pressure and the preset air pressure is small. In this case, it is determined that the nozzle 20 does not need to be cleaned again.

[0098] By comparing the actual air pressure with the preset air pressure, it can be determined whether there are still solder ball residues 200 on the cavity wall of the receiving cavity 21, and the cleaning results can be checked to improve the reliability of the nozzle 20 cleaning method of the laser soldering equipment 100.

[0099] Step S70 includes:

[0100] Step S71: If the difference between the actual air pressure and the preset air pressure is outside the preset difference range, it is determined that the nozzle needs to be cleaned again.

[0101] If there are still solder ball residues 200 on the cavity wall of the receiving cavity 21, a gap will be generated between the solder ball 300 and the cavity wall of the receiving cavity 21, resulting in the actual air pressure being lower than the preset air pressure. If the difference between the actual air pressure and the preset air pressure is outside the preset difference range, it is determined that the nozzle 20 needs to be cleaned again.

[0102] Step S71: Return to the step of adjusting the laser to enter the cleaning mode until the difference between the actual air pressure and the preset air pressure is within the preset difference range.

[0103] Return to the step of adjusting the laser 30 to enter the cleaning mode, so that the laser 30 cleans the nozzle 20 again. After the second cleaning is completed, a solder ball 300 is placed into the receiving cavity 21 again to block the nozzle outlet 22. The actual air pressure in the nozzle 20 is obtained and compared with the preset air pressure until the difference between the actual air pressure and the preset air pressure is within the preset difference range. This ensures the cleaning effect of the nozzle 20 cleaning method of the laser soldering equipment 100 and avoids the presence of solder ball residue 200 in the cavity wall of the receiving cavity 21.

[0104] Additionally, please refer to the following: Figure 6The present invention also provides a laser soldering equipment 100, which is used to perform the nozzle cleaning method of the laser soldering equipment as described above. The specific steps of the nozzle cleaning method of the laser soldering equipment are as described in the above embodiments. Since the laser soldering equipment 100 can perform all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0105] The laser soldering equipment 100 includes a frame 10, a nozzle 20, a laser 30, a lifting device 40, and a jetting device 50. The nozzle 20 is connected to the frame 10 and has a receiving cavity 21 and a jetting outlet 22 communicating with the receiving cavity 21. The laser 30 is located above the nozzle 20 and is used to generate a laser 31 directed into the receiving cavity 21. The lifting device 40 is connected to the frame 10 and its output end is connected to the laser 30. The lifting device 40 is used to drive the laser 30 up and down so that the focal point 311 of the laser 31 reciprocates between a first position and the jetting outlet 22. The first position is located close to the jetting outlet 22. The jetting device 50 is used to jet air into the receiving cavity 21.

[0106] The nozzle 20 is installed and fixed by connecting to the frame 10. The nozzle 20 has a receiving cavity 21 and an outlet 22. The receiving cavity 21 extends vertically and is used to receive solder balls 300. The outlet 22 communicates with the lower end of the receiving cavity 21, and the solder balls 300 are ejected from the outlet 22. The laser 30 is located above the nozzle 20 and is used to generate a laser 31 directed into the receiving cavity 21. The lifting device 40 is installed and fixed by connecting to the frame 10. The lifting device 40 serves as a power source, and its output end is connected to the laser 30. The lifting device 40 is used to drive the laser 30 to move up and down, thereby enabling the focal point 311 of the laser 31 to move back and forth between a first position and the outlet 22. This allows the laser 31 to melt solder ball residue 200 at different positions on the cavity wall of the receiving cavity 21, improving cleaning efficiency. The jetting device 50 injects gas at a certain pressure into the receiving cavity 21. The gas at a certain pressure generates a downward force, causing the molten solder ball residue 200 to move downward and be ejected from the nozzle 22, thereby cleaning the solder ball residue 200 from the receiving cavity 21. By jetting gas into the receiving cavity 21, the molten solder ball residue 200 can be ejected from the nozzle 22, improving the cleaning efficiency of the solder ball residue 200.

[0107] The laser soldering equipment of this invention uses a laser and an air jet device to clean the solder ball residue inside the nozzle, thereby improving the cleaning efficiency of the nozzle and avoiding clogging inside the nozzle.

[0108] In one embodiment, please refer to Figure 4 and Figure 5The receiving cavity 21 is tapered along the direction close to the nozzle 22, which facilitates the solder ball 300 falling into the receiving cavity 21, and at the same time can pressurize the airflow so that the solder ball 300 can be accurately ejected to the designated position.

[0109] In one embodiment, please refer to Figure 6 The lifting device 40 includes a drive unit 41 and a bracket 42. The output end of the drive unit 41 is connected to the bracket 42, and the bracket 42 is connected to the laser 30. The drive unit 41 drives the bracket 42 and the laser 30 to lift. A sensing plate 421 is provided on the bracket 42, and a position sensor 11 is provided on the frame 10. The position sensor 11 is used to sense the position of the sensing plate 421.

[0110] The driving component 41 serves as a power source; specifically, the driving component 41 can be a motor, cylinder, or other driving structure. The output end of the driving component 41 is connected to the bracket 42, and the laser 30 is mounted and fixed by connecting to the bracket 42. The driving component 41 drives the bracket 42 to rise and fall, causing the laser 30 to reciprocate between the starting and ending positions, corresponding the movement of the laser 31's focal point 311 to the vertical movement of the laser 30, facilitating control. A sensing plate 421 is mounted on the bracket 42, and moves synchronously with the bracket 42 and the laser 30. A position sensor 11 is mounted on the frame 10, and is used to sense the position of the sensing plate 421, thereby sensing the position of the laser 30. When the sensing plate 421 is within the sensing area of ​​the position sensor 11, the laser 30 is at its ending position.

[0111] Specifically, the position sensor 11 can refer to the structure of existing optocouplers.

[0112] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for cleaning the nozzle of a laser soldering equipment, characterized in that, The nozzle is mounted on the laser soldering equipment, and the nozzle has a receiving cavity and an outlet communicating with the receiving cavity; The nozzle cleaning method for the laser soldering equipment includes the following steps: Adjust the laser to enter cleaning mode; The laser generates a laser beam, and the focus of the laser beam is controlled to reciprocate between a first position and the nozzle to melt the solder ball residue on the cavity wall of the receiving cavity; wherein, the first position is located close to the nozzle. Air is injected into the receiving cavity to eject molten solder ball residue from the ejector outlet; Before the step of adjusting the laser to enter the cleaning mode, the method further includes: Adjust the laser to enter the operating mode; The laser generates a laser beam with its focal point located at a second position, and the laser melts a solder ball; wherein, during the melting process, solder ball residue is generated on the cavity wall of the receiving cavity, and the second position is closer to the nozzle than the first position; The movement of the laser's focal point corresponds to the vertical movement of the laser's position.

2. The nozzle cleaning method for laser soldering equipment as described in claim 1, characterized in that, The step of the laser generating laser light and controlling the focus of the laser to reciprocate between a first position and the nozzle to melt the solder ball residue on the cavity wall of the receiving cavity includes: The laser is turned on to generate laser light, and the laser is moved from the starting position to the ending position to control the focus of the laser to move from the first position to the nozzle, thereby melting the solder ball residue on the cavity wall of the receiving cavity once. The laser is turned off and moved from the endpoint position to the starting position, thereby controlling the focus of the laser to move from the nozzle to the first position. Return to the execution of the steps of turning on the laser to generate laser light and moving the laser from the starting position to the ending position to control the focus of the laser from the first position to the nozzle, until the solder ball residue on the cavity wall of the receiving cavity is melted multiple times until the solder ball residue is completely melted.

3. The nozzle cleaning method for laser soldering equipment as described in claim 1, characterized in that, After the laser generates a laser beam with its focal point located at a second position, and the laser melts the solder ball, producing solder ball residue on the cavity wall of the receiving cavity, the method further includes: Calculate the cumulative number of solder balls melted by the laser; When the cumulative number of solder balls melted by the laser reaches a preset number, the laser is adjusted to enter the cleaning mode.

4. The nozzle cleaning method for laser soldering equipment as described in any one of claims 1 to 3, characterized in that, The step of injecting air into the receiving cavity to eject molten solder ball residue from the ejector outlet includes: A jetting device is provided, the jetting device being connected to the receiving cavity; The jetting device sprays inert gas into the receiving cavity to eject the molten solder ball residue from the nozzle through the inert gas.

5. The nozzle cleaning method for laser soldering equipment as described in any one of claims 1 to 3, characterized in that, After the step of injecting air into the receiving cavity to eject molten solder ball residue from the ejector outlet, the method further includes: A solder ball is placed into the receiving cavity to block the ejection outlet; Obtain the actual air pressure inside the nozzle; The actual air pressure is compared with the preset air pressure; The comparison results will determine whether the nozzle needs to be cleaned again.

6. The nozzle cleaning method for laser soldering equipment as described in claim 5, characterized in that, The step of determining whether the nozzle needs to be cleaned again based on the comparison results includes: If the difference between the actual air pressure and the preset air pressure is outside the preset difference range, it is determined that the nozzle needs to be cleaned again. Return to the step of adjusting the laser to enter the cleaning mode until the difference between the actual air pressure and the preset air pressure is within the preset difference range.

7. A laser soldering equipment, characterized in that, The laser soldering equipment is used to perform the nozzle cleaning method of the laser soldering equipment according to any one of claims 1 to 6, and the laser soldering equipment includes: frame; A nozzle, connected to the frame, having a receiving cavity and an outlet communicating with the receiving cavity. A laser, located above the nozzle, is used to generate laser light directed into the receiving cavity; A lifting device is connected to the frame, and its output end is connected to the laser. The lifting device is used to drive the laser to move up and down so that the focal point of the laser moves back and forth between a first position and the nozzle; wherein the first position is located close to the nozzle. A jetting device for injecting air into the receiving cavity.

8. The laser soldering equipment as described in claim 7, characterized in that, The receiving cavity is tapered towards the nozzle.

9. The laser soldering equipment as described in claim 7, characterized in that, The lifting device includes a drive unit and a bracket. The output end of the drive unit is connected to the bracket, and the bracket is connected to the laser. The drive unit drives the bracket and the laser to rise and fall. A sensing plate is provided on the bracket, and a position sensor is provided on the frame. The position sensor is used to sense the position of the sensing plate.

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