Sample table control method and device for coating machine and magnetron sputtering coating machine

Abstract

The application provides a coating machine sample table control method and device and a magnetron sputtering coating machine, and relates to the technical field of coating machines. The coating machine sample table control method comprises the following steps: determining a current coating sample; acquiring a coating target material sequence and corresponding coating time of the current coating sample; determining a coating rotation process based on the coating target material sequence and the corresponding coating time; and controlling the sample table to rotate according to the coating rotation process to complete the coating of the current coating sample. The application can realize full-automatic start-stop control of the sample table during sample coating.

Description

Technical Field

[0001] This invention relates to the field of coating machine technology, and more specifically, to a sample stage control method and device for a coating machine, and a magnetron sputtering coating machine. Background Technology

[0002] Magnetron sputtering, as a vacuum coating technology for producing specific films, is widely used in the coating of various materials such as metals, semiconductors, and insulators. The improvement of its automation control level has greatly improved the efficiency of magnetron sputtering.

[0003] In the coating process, when multiple layers of different types of films need to be coated, the operator needs to manually control the sample stage to start and stop multiple times on the operating interface to rotate the sample stage so that the sample faces different targets. This process requires the operator to simultaneously observe the position of the sample stage and control the start and stop of the sample stage, which makes it difficult for the sample stage to stay in the ideal position, thus having an adverse effect on the coating. Summary of the Invention

[0004] The problem addressed by this invention is how to improve the accuracy of the sample stage's dwell position.

[0005] To address the above problems, this invention provides a sample stage control method for a coating machine, comprising the following steps:

[0006] Identify the current coating sample;

[0007] Obtain the order of the coating targets and the corresponding coating time for the current coating sample;

[0008] The coating rotation process is determined based on the order of the coating target and the corresponding coating time.

[0009] The sample stage is controlled to rotate according to the coating rotation process to complete the coating of the current sample.

[0010] Optionally, determining the coating rotation process based on the coating target sequence and the corresponding coating time includes the following steps:

[0011] Obtain the sequence of coating rotation angles corresponding to the order of the coating target;

[0012] The coating rotation process is generated based on the coating rotation angle sequence and the corresponding coating time.

[0013] Optionally, after determining the current coating sample, the sample stage is rotated according to the coating rotation process. Before completing the coating of the current coating sample, the following steps are further included:

[0014] Control the sample stage to maintain or rotate it until the current coated sample is directly facing the preset target.

[0015] Optionally, controlling the sample stage to maintain or rotate until the current coated sample is directly opposite the preset target includes:

[0016] Obtain the target position that the current coated sample is facing;

[0017] The difference angle of the current coating sample is determined based on the difference between the target position facing the current coating sample and the preset target.

[0018] When the difference angle is zero, the sample stage is controlled to stop moving.

[0019] When the difference angle is not zero, control the sample stage to rotate to the position where the current coated sample is facing the preset target.

[0020] Optionally, the following steps are also included:

[0021] Upon receiving the first position calibration signal, start the counter;

[0022] Upon receiving the second position calibration signal, the counter value is acquired, and it is determined whether the counter value is equal to the first preset value.

[0023] If not, an operational malfunction is determined, and the sample stage is controlled to rotate to the preset position.

[0024] Optionally, after determining whether the counter value is equal to the first preset value, the method further includes:

[0025] If so, the position calibration is deemed successful. When the first position calibration signal is received again, the counter value is obtained, and it is determined whether the counter value is equal to the second preset value. At the same time, the counter is cleared to zero and starts counting from zero.

[0026] If the counter value is not equal to the second preset value, an operational malfunction is determined, and the sample stage is controlled to rotate to the preset position.

[0027] Optionally, after the sample stage is rotated according to the coating rotation process and the coating of the current sample is completed, the following steps are also included:

[0028] Based on the coating order among multiple samples, update the current coating sample, and return to the step of obtaining the coating target order and corresponding coating time of the current coating sample, until the coating of all samples is completed.

[0029] The present invention also proposes a sample stage control device for a magnetron sputtering coating machine, comprising a computer-readable storage medium storing a computer program and a processor, wherein the computer program is read and executed by the processor to realize the sample stage control method for the coating machine as described above.

[0030] The present invention also proposes a magnetron sputtering coating machine, including the sample stage control device for the magnetron sputtering coating machine as described above.

[0031] Optionally, the magnetron sputtering coating machine further includes: a vacuum chamber, a sample stage, a connecting rod, a code disk, a light source, and a photosensitive element; the sample stage is placed inside the vacuum chamber; part of the connecting rod is inserted into the vacuum chamber and rigidly connected to the sample stage, while another part extends out of the vacuum chamber, and the connecting rod rotates synchronously with the sample stage; the code disk is sleeved on the part of the connecting rod extending out of the vacuum chamber, and the light source and the photosensitive element are respectively disposed on both sides of the code disk; the sample stage control device of the magnetron sputtering coating machine is used to receive the photoelectric signal output by the photosensitive element.

[0032] Compared with the prior art, the present invention has at least the following beneficial effects:

[0033] By determining the current coating sample, obtaining the coating target sequence and corresponding coating time, and then determining the coating rotation process based on the coating target sequence and corresponding coating time, the sample stage is finally controlled to rotate according to the coating rotation process to complete the coating of the current coating sample. This achieves fully automatic start and stop control of the sample stage during sample coating, so that the sample automatically stops at the position facing the specific target, without the need for manual start and stop control by the operator, ensuring that the sample can automatically stop at the ideal position and guaranteeing a good coating effect. Attached Figure Description

[0034] Figure 1 This is a physical image of the magnetron sputtering coating machine involved in an embodiment of the present invention;

[0035] Figure 2 This is a physical image of the vacuum chamber of the magnetron sputtering coating machine according to an embodiment of the present invention;

[0036] Figure 3 This is a top view of the sample stage tray according to an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of an embodiment of the sample stage control method for a coating machine according to the present invention;

[0038] Figure 5 This is a partial structural schematic diagram of the magnetron sputtering coating machine according to an embodiment of the present invention;

[0039] Figure 6 A schematic diagram of the state machine for a sample coating is shown.

[0040] Figure 7 A schematic diagram of the state machine for coating three samples is shown.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1. Vacuum chamber; 2. Sample stage; 3. Connecting rod; 4. Encoder disk; 5. Light source; 6. Photosensitive element; 7. Sputtering target; 8. Controller; 9. Motor driver; 10. Motor. Detailed Implementation

[0043] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0044] To facilitate understanding of the various embodiments of the present invention, Figure 1 A physical diagram of a magnetron sputtering coating machine is shown, which includes an operating table (main panel) on the right and a vacuum chamber on the left. Figure 2 A physical diagram of a vacuum chamber for a magnetron sputtering coating machine is shown, which includes three targets fixed at the bottom of the vacuum chamber.

[0045] See Figure 4 The sample stage control method for the coating machine disclosed in this embodiment of the invention includes the following steps:

[0046] Step S100: Determine the current coating sample.

[0047] Step S200: Obtain the target sequence and corresponding coating time of the current coating sample.

[0048] Step S300: Determine the coating rotation process based on the coating target sequence and the corresponding coating time.

[0049] Step S400: Control the sample stage to rotate according to the coating rotation process to complete the coating of the current sample.

[0050] The specific explanation is as follows:

[0051] Step S100: Determine the current coating sample.

[0052] The sample stage of a magnetron sputtering coating machine can hold one or multiple samples simultaneously, such as... Figure 3 A top view of a sample stage tray is shown, in which three trays are arranged on the sample stage, each tray holding one sample. When only one sample is placed on the sample stage, that sample is the current coating sample. When multiple samples are placed on the sample stage, the current coating sample is determined according to a preset rule, such as obtaining the coating sample order input by the operator and determining the current coating sample based on the coating sample order.

[0053] Since the position of the sample is fixed after it is placed on the sample stage, the position of the sample on the sample stage can be used to refer to the corresponding sample. For example, if sample A is placed on sample stage tray 1 and sample B is placed on sample stage tray 2, then sample stage tray 1 can refer to sample A and sample stage tray 2 can refer to sample B.

[0054] Step S200: Obtain the target sequence and corresponding coating time of the current coating sample.

[0055] The target deposition sequence can be manually entered, for example, when there are multiple samples, the operator can enter the target deposition sequence for each sample separately. Alternatively, different target deposition sequences can be preset for different types of samples. After determining the current sample to be coated, the corresponding target deposition sequence can be directly retrieved. For example, the target deposition sequence for sample A is (1, 2, 3), meaning target 1 is deposited first, then target 2, and finally target 3.

[0056] The coating time can also be manually input, meaning the operator manually enters the coating time for each target material for each sample. Optionally, for each sample, the corresponding target material sequence and coating time can be pre-stored. After determining the current coating sample, the corresponding target material sequence and coating time can be directly retrieved. For example, the pre-stored sample A can be coated with target material #2 for 60 seconds, then target material #3 for 120 seconds, and finally target material #1 for 30 seconds.

[0057] Step S300: Determine the coating rotation process based on the coating target sequence and the corresponding coating time.

[0058] After determining the target sequence and corresponding coating time for the current coating sample, the coating rotation process for the current coating sample can be determined accordingly.

[0059] Step S300 may include: obtaining the coating rotation angle sequence corresponding to the coating target sequence; generating a coating rotation process based on the coating rotation angle sequence and the corresponding coating time.

[0060] By rotating the sample stage, the coating target material is switched. The order of the coating targets corresponds to the coating rotation angle sequence. For example, if the direction of target material 1->2->3 is defined as forward rotation, and the current coating sample is facing target material 1, if the coating target material order is (target material 1, target material 2, target material 3), then the coating rotation angle sequence corresponding to the coating target material order is: 0°, +120°, +120°. If the coating target material order is (target material 1, target material 3, target material 2), then the coating rotation angle sequence corresponding to the coating target material order is: 0°, -120°, -120°.

[0061] The sequence of coating rotation angles corresponding to each coating target sequence can be pre-stored. After the coating target sequence is determined, the corresponding coating rotation angle sequence can be found.

[0062] The coating rotation process is generated based on the coating rotation angle sequence and the corresponding coating time. In one example, the current coating sample A is first coated with target material 2 for 60 seconds, then target material 3 for 120 seconds, and finally target material 1 for 30 seconds. At this time, the current coating sample A is facing the position of target material 1. The coating rotation angle sequence corresponding to the coating target order (target material 2, target material 3, target material 1) can be obtained as: +120°, +120°, +120°. The coating rotation process includes: first, rotate 120° clockwise to reach the position of the first target material to be coated - target material 2, keep it still, after coating for 60 seconds, rotate 120° clockwise to reach the position of the second target material to be coated - target material 3, keep it still, after coating for 120 seconds, rotate 120° clockwise again to reach the position of the third target material to be coated - target material 1, and end this process after coating for 30 seconds.

[0063] In one embodiment, after step S100 and before step S400, the method further includes: controlling the sample stage to maintain or rotate until the current coating sample is facing the preset target.

[0064] That is, after determining the current coating sample, before controlling the sample stage to rotate according to the coating rotation process, it is determined whether the current coating sample is directly facing the preset target. If so, the current coating sample is kept in the position of facing the preset target; otherwise, the sample stage is controlled to rotate until the current coating sample is directly facing the preset target. For example, if the preset target is target No. 1, the sample stage is controlled to rotate until the current coating sample A is directly facing target No. 1.

[0065] Specifically, controlling the sample stage to remain or rotate to the position where the current coated sample is facing the preset target includes: obtaining the position of the target facing the current coated sample; determining the difference angle between the current coated sample and the preset target based on the difference between the current coated sample and the target position; controlling the sample stage to stop when the difference angle is zero; and controlling the sample stage to rotate to the position where the current coated sample is facing the preset target when the difference angle is not zero.

[0066] For identifying the target position currently facing the current coating sample, specifically, when there is only one sample on the sample stage, the current coating sample can only be that sample. When the operator places the sample into the vacuum chamber, the target position it faces is known and can be input by the operator, or it can be a default position, which the operator places the sample according to. When there are multiple samples on the sample stage, in the initial state, the positions of the multiple samples are fixed and known. Therefore, the target position of the first coating sample can be input by the operator or set to a default position (the operator places the sample according to the default position). After the first coating sample rotates according to the coating rotation process and the coating is completed, the angle difference between the current position of the sample stage and the initial position (i.e., the position of the sample stage in the initial state) can be recorded. Based on this angle difference, the position of the second coating sample, that is, the target position facing the second coating sample, is updated. For example, there are samples A, B, and C on the sample stage. The direction of target 1->2->3 is defined as clockwise rotation, and the rotation angle between adjacent targets is 120°. Initially, the operator positions sample A facing target 1, sample B facing target 2, and sample C facing target 3. When sample A is the current coating sample, the position of the target facing sample A can be directly obtained. Subsequently, when the coating of sample A is completed, the current position of the sample stage is equivalent to a 120° clockwise rotation from the initial position. The positions of the samples are then updated: sample A facing target 2, sample B facing target 3, and sample C facing target 1. After determining that sample B is the current coating sample, the position of the target facing sample B, i.e., target 3, is directly obtained.

[0067] Regardless of the type of sample being coated, before the sample stage is rotated for coating according to the coating rotation process, the sample is positioned directly opposite the preset target. This ensures that all samples are at the same starting position when the coating process begins, eliminating the need to obtain the actual target position of the sample for the coating rotation process calculation. This simplifies the computational complexity of the coating rotation process.

[0068] Step S400: Control the sample stage to rotate according to the coating rotation process to complete the coating of the current sample.

[0069] Optionally, after step S400, the method further includes: updating the current coated sample according to the coating order among multiple samples, returning to execute step S200, until the coating of all samples is completed.

[0070] Suppose there are three samples A, B, and C, and the coating order of these three samples is A->B->C. Then, these three samples are used as the current coating samples in this order, and the above steps are performed to complete the coating of all samples.

[0071] Optionally, after all samples have been coated, the coating process can be completed by turning an indicator light on or off, reminding the operator to break the vacuum and remove the samples.

[0072] When depositing multilayer films on samples, the sample stage needs to be repeatedly stopped and started. Existing magnetron sputtering coating machines require operators to manually click to start / stop the sample stage. However, this invention determines the current sample to be coated, obtains the target sequence and corresponding coating time, and then determines the coating rotation process based on the target sequence and corresponding coating time. Finally, it controls the sample stage to rotate according to the coating rotation process to complete the coating of the current sample. This achieves fully automatic start and stop control of the sample stage during sample coating, allowing the sample to automatically stop in the position facing the specific target without the need for manual start and stop control by the operator. This ensures that the sample can automatically stop in the ideal position and guarantee a good coating effect.

[0073] To facilitate understanding, an example is given. In this example, there are targets 1, 2, and 3, and samples A, B, and C. The direction of target 1->2->3 is defined as forward rotation, the direction of sample A->B->C is defined as forward rotation, and the rotation angle between adjacent targets is 120°.

[0074] Before coating each sample, the sample stage is rotated to the position where the sample to be coated is directly facing the target material No. 1.

[0075] When the target deposition sequence is (target 1, target 2, target 3), first keep the sample stage stationary to complete the deposition of target 1, then rotate 120° clockwise to complete the deposition of target 2, then rotate 120° clockwise again to complete the deposition of target 3, then rotate 120° clockwise again to return to the original position, ending the deposition process for the current sample. When the target deposition sequence is (target 1, target 3, target 2), the above process is reversed.

[0076] When the target deposition sequence is (target 2, target 3, target 1), the sample stage is first rotated 120° clockwise to reach the position of the first target to be deposited – target 2. It remains stationary to complete the deposition of target 2. Then, it rotates 120° clockwise to reach target 3 and completes the deposition of target 3. Finally, it rotates 120° clockwise to reach target 1 and completes the deposition of target 1, ending the deposition process for the current sample. When the target deposition sequence is (target 2, target 1, target 3), the process is reversed after reaching the position of the first target to be deposited.

[0077] When the target deposition sequence is (target 3, target 1, target 2), the sample stage is first reversed 120° to reach the position of the first target to be deposited—target 3. It remains stationary to complete the deposition of target 3. Then, it rotates 120° clockwise to reach target 1 and completes the deposition of target 1. After that, it rotates 120° clockwise again to complete the deposition of target 2, ending the deposition process for the current sample. When the target deposition sequence is (target 3, target 2, target 1), the process reverses after reaching the position of the first target to be deposited.

[0078] After completing the coating process for one sample, switch to the coating process for the next sample. Assume that when the sample is initially loaded, sample A should be facing the target 1.

[0079] When the sample sequence is (Sample A, Sample B, Sample C), keep the sample stage stationary when starting the coating process for Sample A, and complete the above target material coating process. Each time a sample is switched for coating, rotate the stage 120° clockwise until all samples are coated. When the sample sequence is (Sample A, Sample C, Sample B), after completing the coating process for Sample A, rotate the stage 120° counterclockwise each time a sample is switched for coating, until all samples are coated. When the sample sequence is (Sample B, Sample C, Sample A), first control the sample stage to rotate 120° clockwise so that Sample B is facing target 1. After completing the above target material coating process, rotate the stage 120° clockwise each time a sample is switched for coating, until all samples are coated. When the sample sequence is (Sample B, Sample C, Sample A), first control the sample stage to rotate 120° clockwise so that Sample B is facing target 1. After completing the above target material coating process, rotate the stage 120° clockwise each time a sample is switched for coating, until all samples are coated. When the sample order is (sample A, sample C), first control the sample stage to rotate 120° clockwise so that sample B is facing target 1. After completing the above target plating process, rotate the stage 120° clockwise each time the sample is switched for coating, until all samples are coated. When the sample order is (sample C, sample A, sample B), first control the sample stage to rotate 120° clockwise so that sample C is facing target 1. After completing the above target plating process, rotate the stage 120° clockwise each time the sample is switched for coating, until all samples are coated. When the sample order is (sample C, sample B, sample A), first control the sample stage to rotate 120° clockwise so that sample C is facing target 1. After completing the above target plating process, rotate the stage 120° clockwise each time the sample is switched for coating, until all samples are coated.

[0080] This invention can be implemented using an FPGA. The FPGA defines the following input variables: three 2-bit sample signals, [1:0]sample_1, sample_2, sample_3 representing the 1st to 3rd samples to be coated, with 2'b00 indicating no next sample to be coated, 2'b01 representing sample A, 2'b10 representing sample B, and 2'b11 representing sample C; three 2-bit target material signals, [1:0]metal_1, metal_2, metal_3 representing the 1st to 3rd targets to be coated, with 2'b00 indicating no next target to be coated, 2'b01 representing target 1, 2'b10 representing target 2, and 2'b11 representing target 3; and three 8-bit time signals, [7:0]time_1, time_2, time_3 representing the 1st to 3rd coating times, with 1 bit corresponding to 1 second, and a maximum coating time of 511 seconds.

[0081] Example of coating input: Suppose sample A needs to be coated with target material #2 for 60 seconds, then target material #3 for 120 seconds, and finally target material #1 for 30 seconds. The FPGA input would be: sample_1 = 2'b01, metal_1 = 2'b10, time_1 = 8'd60, metal_2 = 2'b11, time_2 = 8'd120, metal_3 = 2'b01, time_3 = 8'd30. When 2'b00 is encountered, the sample stage rotation for coating is immediately initiated. When multiple samples need coating, the 2-bit signal corresponding to each sample can be sequentially input into the FPGA. After the 2-bit signal corresponding to the first sample is input, the state machine will jump and sequentially execute the next signal input state.

[0082] For ease of understanding, give as Figure 6 and Figure 7 The diagram shows a state machine.

[0083] Figure 6 A state machine diagram for sample coating is shown. In the initial state, when sample signal 1 is detected, the system jumps from the initial state to the input sample 1 state. When target signal 1 is detected, the system jumps from the input sample 1 state to the input target 1 state. When time signal 1 is detected, the system jumps from the input target 1 state to the input time 1 state. When 2'b00 signal is detected, the system jumps to the drive state, the drive motor rotates the sample stage, and after rotation is complete, a drive enable signal of 0 is output, the drive motor stops rotating, the output indicator light illuminates, the counter is full, and the system jumps back to the initial state from the drive state.

[0084] Figure 7 A state machine diagram of the coating on three samples is shown. Figure 6 The difference is that when sample signal 2 is detected in the state of input time 1, it jumps to the state of input sample 2; when target signal 2 is detected, it jumps to the state of input target 2; when time signal 2 is detected, it jumps to the state of input time 2. In the state of input time 2, if 2'b00 signal is detected, it directly jumps to the drive state, and the drive motor drives the sample stage to rotate to start the coating. If sample signal 3 is detected, it jumps to the state of input sample 3, and then sequentially jumps to the state of input target 3, the state of input time 3, and then directly jumps to the drive state from the state of input time 3, and the drive motor drives the sample stage to rotate to start the coating.

[0085] Optionally, the sample stage control method for the coating machine further includes the following steps:

[0086] Upon receiving the first position calibration signal, start the counter;

[0087] Upon receiving the second position calibration signal, the counter value is obtained, and it is determined whether the counter value is equal to the first preset value.

[0088] If not, the operation is deemed abnormal, and the sample stage is controlled to rotate to the preset position.

[0089] Position calibration points can be set on the sample stage or on a structure rigidly connected to the sample stage. The position calibration points are detected by sensors to generate position calibration signals.

[0090] In one embodiment, the sample stage is rigidly connected to a connecting rod. A code disk is fitted onto the connecting rod, and physical calibration points are set on the code disk. After the sensor detects the physical calibration points, it generates a first position calibration signal or a second position calibration signal to perform position calibration. In another embodiment, physical calibration points are set on the sample stage. After the sensor detects the physical calibration points, it generates a first position calibration signal or a second position calibration signal to perform position calibration.

[0091] Two position calibration points can be set. The first position calibration point can be set at the initial zeroing point of the sample stage rotation, and the second position calibration point can be set at the midpoint of the sample stage rotation. When the sample stage passes the initial zeroing point, a first position calibration signal is generated, the counter is reset to zero, and counting starts from zero again. When the sample stage passes the midpoint, a second position calibration signal is generated, the counter value is obtained, and it is determined whether the counter value is equal to a first preset value. If not, it indicates an operational malfunction, and the sample stage is controlled to rotate to the preset position. For example, in normal operation, when the sample stage rotates one revolution, the counter value is 359. When the sample stage rotates to the midpoint, the counter value is 179. When the sample stage passes the initial zeroing point, the counter is reset to zero and counts from zero again. The counter is reset to zero after one revolution. If the counter value is not equal to 179 when the second position calibration signal is received, it indicates an operational malfunction.

[0092] After determining an operational malfunction, the sample stage is controlled to rotate to a preset position, which can be the preset starting position of the sample stage. Simultaneously, an indicator light illuminates to indicate the malfunction.

[0093] Optionally, after determining whether the counter value is equal to the first preset value, the method further includes:

[0094] If yes, the position calibration is considered successful. When the first position calibration signal is received again, the counter value is obtained, and it is determined whether the counter value is equal to the second preset value. At the same time, the counter is cleared and counted from zero. If the counter value is not equal to the second preset value, the operation is considered abnormal, and the sample stage is controlled to rotate to the preset position. If the counter value is equal to the second preset value, the position calibration is considered successful.

[0095] By setting position calibration points, the rotation cycle can be prevented from failing to end when the position signal is not received at the corresponding position due to reasons such as sensor damage, signal transmission failure, or motor driver damage, or when the motor cannot be driven to stop the sample stage due to other faults, thus preventing the system from running away.

[0096] The sample stage control device for a magnetron sputtering coating machine proposed in this embodiment of the invention includes a computer-readable storage medium storing a computer program and a processor. The computer program is read and executed by the processor to realize the sample stage control method for the coating machine as described above.

[0097] Among them, the sample stage control device of the magnetron sputtering coating machine can be implemented as an FPGA. Since the input is a high-low voltage level as a switching quantity, the switching frequency is relatively high. The high-speed GPIO of the FPGA can accurately read the number of switching pulses. In addition, the FPGA can perform parallel signal processing, which is suitable for the hardware implementation of motor control algorithms (such as field-oriented control, FOC field-oriented control algorithm). Furthermore, the FPGA has rich interfaces, which is beneficial for subsequent development.

[0098] The sample stage control device for a magnetron sputtering coating machine can be a control device independent of the magnetron sputtering coating machine, such as an external sensor, FPGA, and its wiring attached to the magnetron sputtering coating machine; the sample stage control device can also be integrated into the controller of the magnetron sputtering coating machine, by adding an additional control part to the original driver software of the magnetron sputtering coating machine, adding corresponding buttons and displays as interaction methods on the magnetron sputtering coating machine, or designing an independent software control program, which, when executed by the controller of the magnetron sputtering coating machine, realizes the sample stage control method of the coating machine as described above.

[0099] The beneficial effects of the sample stage control device for magnetron sputtering coating machine in this embodiment of the invention compared to the prior art are the same as those of the above-described sample stage control method for coating machine, and will not be repeated here.

[0100] The magnetron sputtering coating machine proposed in this embodiment includes the sample stage control device for magnetron sputtering coating machine as described above. In this embodiment, the sample stage control device for magnetron sputtering coating machine is integrated into the magnetron sputtering coating machine.

[0101] Optionally, such as Figure 5The magnetron sputtering coating machine further includes: a vacuum chamber 1, a sample stage 2, a connecting rod 3, a code disk 4, a light source 5, and a photosensitive element 6; the sample stage 2 is placed inside the vacuum chamber 1; part of the connecting rod 3 is inserted into the vacuum chamber 1 and rigidly connected to the sample stage 2, while the other part extends out of the vacuum chamber 1, and the connecting rod 3 rotates synchronously with the sample stage 2; the code disk 4 is sleeved on the part of the connecting rod 3 that extends out of the vacuum chamber 1, and the light source 5 and the photosensitive element 6 are respectively arranged on both sides of the code disk 4; the sample stage control device 8 of the magnetron sputtering coating machine is used to receive the photoelectric signal output by the photosensitive element 6.

[0102] The sample stage control device 8 of the magnetron sputtering coating machine is also connected to the motor drive 9. The motor drive 9 drives the motor 10 to rotate, and the motor 10 drives the connecting rod 3 to rotate, thereby driving the sample stage 2 to rotate. The sputtering target 7, i.e., the target material, is fixed at the bottom of the vacuum chamber.

[0103] The connecting rod 3 is rigidly connected to the code disk 4 and the sample stage 2. When the connecting rod 3 rotates, it drives the code disk 4 and the sample stage 2 to rotate synchronously. Multiple rectangular holes or slits can be evenly spaced on the code disk 4. A light source 5 and a photosensitive element 6 are respectively installed on both sides of the code disk 4. The light source 5 can be a laser lamp, and the photosensitive element 6 can be a photoresistor. During operation, the light source 5 is always on. The rotation of the code disk 4 causes the photosensitive element 6 to receive a flashing light signal and output a changing voltage signal (a sinusoidal analog signal). Figure 5 The dashed line in the image represents the flashing light signal received by the photosensitive element 6. The greater the light intensity, the greater the voltage. After passing through the amplification circuit, a pulsed square wave signal can be input to the sample stage control device 8 of the magnetron sputtering coating machine via the ADC module.

[0104] In one embodiment, 360 slits are evenly distributed on the code disk 4. Each time the sample stage control device 8 of the magnetron sputtering coating machine receives a set of pulses, it indicates that the rotation has been 1°. The counter cnt, which has an initial value of zero, is incremented by 1. If the rotation is reversed, cnt is decremented by 1. When cnt is incremented to 359 or decremented to 0, all signals are reset to zero, indicating that the code disk 4 has rotated a full circle and returned to its original position.

[0105] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A method for controlling a sample stage of a coating machine, characterized in that, Includes the following steps: Identify the current coating sample; Obtain the order of the coating targets and the corresponding coating time for the current coating sample; The coating rotation process is determined based on the order of the coating target and the corresponding coating time. The sample stage is controlled to rotate according to the coating rotation process to complete the coating of the current coating sample; The process of determining the coating rotation based on the coating target sequence and the corresponding coating time includes the following steps: Obtain the sequence of coating rotation angles corresponding to the order of the coating target; The coating rotation process is generated based on the coating rotation angle sequence and the corresponding coating time. After determining the current coating sample, the sample stage is controlled to rotate according to the coating rotation process. Before completing the coating of the current coating sample, the following steps are also included: Control the sample stage to maintain or rotate it until the current coated sample is directly facing the preset target material; The step of controlling the sample stage to maintain or rotate until the current coated sample is directly facing the preset target includes: Obtain the target position that the current coated sample is facing; The difference angle of the current coating sample is determined based on the difference between the target position facing the current coating sample and the preset target. When the difference angle is zero, the sample stage is controlled to stop moving. When the difference angle is not zero, control the sample stage to rotate to the position where the current coated sample is facing the preset target.

2. The sample stage control method for a coating machine as described in claim 1, characterized in that, It also includes the following steps: Upon receiving the first position calibration signal, start the counter; Upon receiving the second position calibration signal, the counter value is acquired, and it is determined whether the counter value is equal to the first preset value. If not, an operational malfunction is determined, and the sample stage is controlled to rotate to the preset position.

3. The sample stage control method for a coating machine as described in claim 2, characterized in that, After determining whether the counter value is equal to the first preset value, the method further includes: If so, the position calibration is deemed successful. When the first position calibration signal is received again, the counter value is obtained, and it is determined whether the counter value is equal to the second preset value. At the same time, the counter is cleared to zero and starts counting from zero. If the counter value is not equal to the second preset value, an operational malfunction is determined, and the sample stage is controlled to rotate to the preset position.

4. The sample stage control method for a coating machine as described in claim 1, characterized in that, The control sample stage rotates according to the coating rotation process. After the coating of the current sample is completed, the following steps are also included: Based on the coating order among multiple samples, update the current coating sample, and return to the step of obtaining the coating target order and corresponding coating time of the current coating sample, until the coating of all samples is completed.

5. A sample stage control device for a magnetron sputtering coating machine, characterized in that, The method includes a computer-readable storage medium storing a computer program and a processor, the computer program being read and executed by the processor to implement the sample stage control method for a coating machine as described in any one of claims 1 to 4.

6. A magnetron sputtering coating machine, characterized in that, Includes the sample stage control device for a magnetron sputtering coating machine as described in claim 5.

7. The magnetron sputtering coating machine as described in claim 6, characterized in that, Also includes: The system includes a vacuum chamber, a sample stage, a connecting rod, a code disk, a light source, and a photosensitive element; the sample stage is placed inside the vacuum chamber. Part of the connecting rod is inserted into the vacuum cavity and rigidly connected to the sample stage, while the other part extends out of the vacuum cavity. The connecting rod rotates synchronously with the sample stage. The code disk is sleeved on the part of the connecting rod that extends out of the vacuum cavity. The light source and the photosensitive element are respectively disposed on both sides of the code disk. The sample stage control device of the magnetron sputtering coating machine is used to receive the photoelectric signal output by the photosensitive element.

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