Automated testing methods, equipment and storage media

Abstract

This application provides an automatic testing method, apparatus, and storage medium. The automatic testing method is applied to an automatic testing apparatus, which includes a test motherboard and a clamping device. The test motherboard has multiple slots, and the clamping device is used to insert components into the slots. The automatic testing method includes: acquiring a positioning image; analyzing the positions of multiple slots in the positioning image to generate route information; controlling the clamping device to insert multiple components into multiple slots according to the route information; controlling the test motherboard to test multiple components; determining whether there are faulty components; if it is determined that there are no faulty components, then controlling the clamping device to insert multiple components into other slots according to the route information, and re-controlling the test motherboard to test multiple components. Using the embodiments of this application, the movement route of the clamping device can be automatically planned based on the positioning image to control the clamping device to automatically insert multiple components into multiple slots, improving operational convenience.

Description

Technical Field

[0001] This application relates to the field of automation, and more specifically to an automated testing method, apparatus, and storage medium. Background Technology

[0002] Electronic devices are manufactured by assembling multiple components. Some components require electrical testing during production to ensure they can perform their basic functions. Testing a component involves moving it and connecting it to a test motherboard, then powering the motherboard to complete the electrical test. For example, in server manufacturing, a component might be a memory module used within the server. Operators would need to connect multiple memory modules to a test motherboard to perform electrical tests on them.

[0003] Currently, the actions of moving components to the test motherboard and plugging them into the test motherboard are done manually by the operator. When testing a batch of components, the operator needs to manually plug and unplug the components multiple times, which is inconvenient. Summary of the Invention

[0004] In view of the above, it is necessary to provide an automatic testing method, device and storage medium that can automatically perform electrical tests on multiple components, reduce the manual plugging and unplugging actions of operators and improve the convenience of operation.

[0005] In a first aspect, embodiments of this application provide an automatic testing method applied to an automatic testing device. The automatic testing device includes a test motherboard and a clamping device. The test motherboard has multiple slots, and the clamping device is used to insert components into the slots. The method includes: acquiring a positioning image; analyzing the positions of the multiple slots in the positioning image to generate route information, wherein the content of the positioning image includes the test motherboard; controlling the clamping device to insert multiple components into the multiple slots according to the route information; controlling the test motherboard to test the multiple components; determining whether there are faulty components; if it is determined that there are no faulty components, then controlling the clamping device to insert multiple components into other slots according to the route information, and re-controlling the test motherboard to test the multiple components.

[0006] Optionally, controlling the clamping device to insert multiple components into other slots according to the route information includes: removing a designated component from the slot to create an empty slot on the test motherboard; sequentially removing the remaining components from the original slots along a preset direction and inserting them into adjacent empty slots; and inserting the designated component into the empty slot.

[0007] Optionally, if it is determined that there are no faulty components, the method further includes: determining whether the number of times the plurality of components are tested on the test motherboard is greater than a preset first threshold; if it is determined that the number of tests is less than or equal to the first threshold, then according to the route information, controlling the clamping device to insert the plurality of components into another slot, and re-controlling the test motherboard to test the plurality of components.

[0008] Optionally, the method further includes: determining whether the number of times the component is moved to another test motherboard during the testing of the component is greater than a second threshold; if the number of times the test motherboard is replaced is less than or equal to the second threshold, then controlling the clamping device to move multiple components to another test motherboard, and controlling the other test motherboard to test multiple components.

[0009] Optionally, the method further includes: if the number of times the test motherboard is replaced exceeds the second threshold, then the test is stopped.

[0010] Optionally, the method further includes: if it is determined that the number of tests is greater than the first threshold, then determining whether the number of times the component is moved to another test motherboard during the testing of the component is less than a second threshold.

[0011] Optionally, the automatic testing equipment further includes a camera, and the method further includes: controlling the camera to capture the positioning image of the test motherboard.

[0012] Optionally, the method further includes: if a faulty component is found, outputting an alarm message.

[0013] Secondly, embodiments of this application provide an automatic testing device for testing multiple components. The automatic testing device includes: a test motherboard having multiple slots; a clamping device for inserting the components into the slots; a memory for storing a computer program; and a processor for executing the computer program stored in the memory. When the computer program is executed, the processor is used to execute the automatic testing method as described in any of the preceding claims.

[0014] Thirdly, embodiments of this application provide a storage medium including computer instructions that, when executed on a terminal device, cause the terminal device to perform the automatic testing method as described in any of the preceding claims.

[0015] The automatic testing method, equipment, and storage medium provided in this application can automatically plan the movement route of the clamping device through positioning images, so as to control the clamping device to automatically insert multiple parts into multiple slots, reduce the operator's manual insertion and removal of parts, and improve the convenience of operation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the automatic testing equipment in the embodiments of this application.

[0017] Figure 2 This is a system schematic diagram of the automatic testing equipment in the embodiments of this application.

[0018] Figure 3 This is another schematic diagram of the automatic testing device in the embodiments of this application.

[0019] Figure 4 This is a flowchart of the automatic testing method in the embodiments of this application.

[0020] Explanation of key component symbols:

[0021] 100. Automatic testing equipment; 200. Component; 10. Test motherboard; 11. Slot; 12. Lock; 13. First side; 14. Second side; 20. Clamping device; 30. Moving device; 40. Memory; 50. Processor; 60. Storage box; 61. Storage slot; 70. Rotating device; 80. Shooting device; 90. Unlocking device. Detailed Implementation

[0022] The technical solutions in the implementation of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described implementation is only a part of the implementation of this application, and not all of the implementations.

[0023] Please see Figure 1 , Figure 1 This is a schematic diagram of an automated testing apparatus provided according to one embodiment of this application. It will be understood that the automated testing apparatus is used to test multiple components 200. For example, component 200 may be a dual-inline-memory module (DIMM) used in a computer or service.

[0024] In this embodiment, the automatic testing equipment 100 may include a test motherboard 10, a clamping device 20, and a moving device 30. The test motherboard 10 has a plurality of slots 11 spaced apart. The clamping device 20 is used to clamp or release a component 200, inserting the component 200 into the slot 11 and then releasing it. The clamping device 20 is fixedly mounted on the moving device 30. The moving device 30 is used to drive the clamping device 20 to move in multiple directions. The movement of the clamping device 20 causes the component 200 to move synchronously.

[0025] After the clamping device 20 clamps the component 200, the moving device 30 drives the clamping device 20 to move to the position corresponding to the slot 11, and the component 200 is inserted into the slot 11. Then the clamping device 20 releases the component 200 and moves away from the component 200 under the drive of the moving device 30.

[0026] Please see Figure 1 and Figure 2 In this embodiment, the automatic testing device 100 may further include a memory 40 and a processor 50. The memory 40 is used to store computer programs. The processor 50 is communicatively connected to the test motherboard 10, the clamping device 20, the moving device 30, and the memory 40. The processor 50 is used to execute the computer program stored in the memory 40 to run an automatic testing method. When the processor 50 runs the automatic testing method, the processor 50 can control the moving device 30 to operate, thereby driving the clamping device 20 to move in the spacing direction of the plurality of slots 11 and in the direction opposite to the test motherboard 10. When the processor 50 runs the automatic testing method, the processor 50 can also control the clamping device 20 to clamp or release the component 200.

[0027] It is understood that the communication connection can be a wired communication connection achieved through a power line, data cable, etc., or a wireless communication connection achieved through a wireless network. The embodiments of this application do not limit this.

[0028] It is understood that processor 50 may be a general-purpose central processing unit (CPU), microprocessor, application-specific integrated circuit (ASIC), programmable logic controller (PLC), or one or more integrated circuits used to control the execution of the above scheme program.

[0029] The memory 40 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto.

[0030] It is understood that the memory 40 can exist independently and be connected to the processor 50. Alternatively, the memory 40 can be integrated with the processor 50. The embodiments of this application do not limit this. For example, the processor 50 can be a programmable logic controller, and the memory 40 and processor 50 are configured independently.

[0031] It is understandable that when component 200 is plugged into slot 11, the test motherboard 10 is electrically connected to component 200. When testing multiple components 200, they need to be plugged into multiple slots 11 on the test motherboard 10 before the test motherboard 10 is powered on to test whether the multiple components 200 operate normally at their rated power and whether they can perform their basic functions. For example, component 200 could be a memory card; testing component 200 could involve testing whether data can be stored or retrieved from it.

[0032] Please refer to the following: Figure 3 In this embodiment, multiple components 200 need to be tested multiple times on the test motherboard 10. Before each test, the position of the slot 11 into which the component 200 is inserted needs to be changed. That is, each test requires moving the component 200 from one slot 11 to another slot 11, which has not been previously used to insert the component 200.

[0033] In this embodiment, the moving device 30 can be assembled from multiple linear motion drive components. The linear drive components can be, but are not limited to, linear motors, rodless cylinders, etc. The moving device 30 can drive the gripping device 20 to move in a first direction and a second direction to align the gripping device 20 with the slot 11. The moving device 30 can also drive the gripping device to move upwards in a third direction to move the gripping device closer to or away from the slot 11. The first direction can be as follows: Figure 1 and Figure 3 The X direction and its opposite direction are shown. The second direction can be as follows: Figure 3 The Y-direction and its opposite direction are shown. The third direction can be as follows: Figure 1 The Z direction and its opposite direction are shown.

[0034] In this embodiment, the gripping device 20 can be a pneumatically driven or electrically driven gripper, and the gripping device 20 can be a pneumatic gripper or an electric gripper. The gripping device 20 can grip a component 200 and release the component 200 when the component 200 is inserted into the slot 11.

[0035] In another embodiment, multiple components 200 can be pre-installed in a storage box 60. The storage box 60 has multiple storage slots 61, each corresponding to a component 200. The processor 50 controls the gripping device 20 to move to a position corresponding to the storage box 60, and after gripping a component 200, it can control the gripping device 20 to move to a position corresponding to the test motherboard 10, and then control the gripping device 20 to insert the component 200 into a slot 11.

[0036] It is understandable that when it is necessary to change the slots 11 to which various components 200 are inserted on the test motherboard 10, the processor 50 can control the clamping device 20 to pull one component 200 out of the slot 11 and move the component 200 into the storage box 60. Then, the processor 50 can control the clamping device 20 to move multiple components 200 one by one and insert them into empty slots 11, so that multiple components 200 on the test motherboard 10 have their slots 11 changed. The processor 50 can then control the clamping device 20 to insert the component 200 in the storage box 60 into the only empty slot 11 on the test motherboard 10, completing the replacement of the slots 11 for multiple components 200.

[0037] In this embodiment, the storage box 60 can be disposed on the side of the test motherboard 10.

[0038] In some embodiments, a rotating device 70 is connected between the moving device 30 and the gripping device 20. The rotating device 70 is fixedly mounted on the side of the moving device 30 facing the test motherboard 10. The gripping device 20 is fixedly mounted on the rotating device 70. The rotating device 70 can drive the gripping device 20 to rotate, thereby adjusting the deflection angle of the component 200 gripped by the gripping device 20. The change in the deflection angle of the component 200 can prevent the component 200 from forming an angle with the slot 11, thus preventing the component 200 from being inserted into the slot 11.

[0039] It is understood that the rotating device 70 can be an electrically driven or pneumatically driven rotating component, and the rotating device 70 can be a motor or a rotating cylinder.

[0040] In the embodiments of this application, the fixing method of the rotating device 70, the moving device 30, and the clamping device 20 can be, but is not limited to, screw fixing, welding fixing, etc.

[0041] In some embodiments, a buffer (not shown) may also be provided between the moving device 30 and the clamping device 20. When the clamping device 20 inserts the component 200 into the slot 11, the buffer can buffer the pressure of the clamping device 20 on the test motherboard 10, and prevent the component 200 or the test motherboard 10 from being damaged due to excessive pressure when the component 200 is inserted into the slot 11.

[0042] In some embodiments, a pressure detection element (not shown) may also be provided between the moving device 30 and the clamping device 20. The pressure detection element is used to detect the relative pressure between the moving device 30 and the clamping device 20 when the clamping device 20 inserts the component 200 into the slot 11. The pressure detection element is communicatively connected to the processor 50, and can output detection information to the processor 50. After analyzing the detection information, the processor 50 can determine the relative pressure between the moving device 30 and the clamping device 20, and control the moving device 30 to stop working when the pressure is too high, thus preventing damage to the component 200 and the test motherboard 10.

[0043] It is understood that a pressure detection device can be an electronic device with pressure detection function, and a pressure detection device can be, but is not limited to, a pressure sensor.

[0044] It is understood that the embodiments of this application do not limit the installation position of the pressure detection element and the buffer element. For example, the pressure detection element and the buffer element can be installed between the rotating device 70 and the clamping device 20. As another example, the pressure detection element and the buffer element can also be installed between the rotating device 70 and the moving device 30.

[0045] In some embodiments, the automated testing equipment 100 further includes an imaging device 80. The imaging device 80 is communicatively connected to the processor 50. The imaging device 80 is positioned away from the mobile device 30 and the test motherboard 10. The imaging device 80 is used to capture images of the test motherboard 10 and generate positioning images. The processor 50 acquires the positioning images and can determine the positions of multiple slots 11.

[0046] For example, the imaging device 80 may be a charge-coupled device (CCD) camera.

[0047] It is understood that the content captured by the imaging device 80 may include the storage box 60 and the test motherboard 10. The positioning image includes the storage box 60 of the test motherboard 10. The processor 50 analyzes the positioning image and can plan the route for the gripping device 20 to grip the component 200 from the storage box 60, move it to the test motherboard 10, and then insert the component 200 into the slot 11.

[0048] It is understood that the automatic testing equipment 100 can be mounted on a workbench. The moving device 30, the storage box 60, and the test motherboard 10 can be fixedly mounted on the workbench respectively. The imaging device 80 can be fixedly mounted on a mounting bracket. The mounting bracket is fixedly mounted on the workbench. The imaging device 80 is suspended above the test motherboard 10. The fixing method can be, but is not limited to, screw fixing.

[0049] In some embodiments, multiple test motherboards 10 may be provided. After multiple tests are performed on one test motherboard 10, the processor 50 may control the clamping device 20 to clamp the multiple components 200 and move them to another test motherboard 10, and perform multiple tests again on the other test motherboard 10.

[0050] It is understandable that the testing of component 200 ends when multiple components 200 are tested on multiple test motherboards 10 and multiple tests are performed on each test motherboard 10.

[0051] It is understandable that multiple test motherboards 10 are equipped with multiple shooting devices 80 and multiple storage boxes 60.

[0052] It is understood that the embodiments of this application do not limit the number of moving devices 30 and clamping devices 20. For example, multiple test motherboards 10 may be correspondingly provided with multiple moving devices 30 and multiple clamping devices 20, with the multiple moving devices 30 arranged alternately, and each moving device 30 can only drive the clamping device 20 to move between two test motherboards 10. As another example, multiple test motherboards 10 may also be correspondingly provided with only one moving device 30 and one clamping device 20, with the moving device 30 driving the clamping device 20 to move between multiple test motherboards 10.

[0053] It is understood that the embodiments of this application do not limit the manner in which the component 200 is moved from one test motherboard 10 to another test motherboard 10. For example, the processor 50 can control the clamping device 20 to move multiple components 200 on one test motherboard 10 to a storage box 60 corresponding to another test motherboard 10. The processor 50 then plans a route according to the positioning image corresponding to the other test motherboard 10 and controls the clamping device 20 to remove the multiple components 200 one by one from the storage box 60 and insert them one by one into the slot 11 of the other test motherboard 10. As another example, the processor 50 can plan a route to move the component 200 from one test motherboard 10 to another test motherboard 10 according to the positioning image, and then control the clamping device 20 to remove the multiple components 200 one by one from the slot 11 of one test motherboard 10 and insert them into the slot 11 of the other test motherboard 10.

[0054] In some embodiments, the test motherboard 10 is provided with a latch 12 structure. When the component 200 is inserted into the slot 11, the component 200 pushes the latch 12 structure to rotate, and the latch 12 locks the component 200 into the slot 11. An unlocking device 90 is fixedly connected to the side of the clamping device 20. The unlocking device 90 is used to push the latch 12 to rotate in the opposite direction, thereby releasing the latch 12 from locking the component 200. The processor 50 is communicatively connected to the unlocking device 90. The processor 50 can control the unlocking device 90 to work, thereby unlocking the latch 12 when the component 200 is removed from the slot 11.

[0055] It is understood that the unlocking device 90 is a device that can move linearly by electric or pneumatic drive, and the unlocking device 90 can be a cylinder. When the processor 50 needs to control the gripping device 20 to remove the component 200 from the slot 11, the processor 50 first controls the moving device 30 to work, driving the gripping device 20 to approach the component 200. Then, the processor 50 controls the unlocking device 90 to work, and the unlocking device 90 pushes the latch 12 to rotate, releasing the latch 12 from locking the component 200. Then, the processor 50 can control the gripping device 20 to grip the component 200, and then control the moving device 30 to work, moving the gripping device 20 to the designated position.

[0056] It is understood that in the embodiments of this application, the processor 50 can control the shooting device 80, the gripping device 20, the moving device 30, the unlocking device 90 and the test motherboard 10 to work together to test the component 200 by running an automatic testing method.

[0057] Please see Figure 4 The automated testing method proposed in the embodiments of this application may include the following steps:

[0058] Step S41: Output a shooting signal to the shooting device 80 to control the shooting device 80 to capture a positioning image.

[0059] Understandably, once the operator has added the component 200 to the storage box 60 and confirmed that testing of component 200 can begin, the operator can output instructions to the processor 50. After receiving the instructions, the processor 50 can begin running the automatic testing method.

[0060] It is understood that the content captured by the positioning image may include the test motherboard 10, or it may include the test motherboard 10 and the storage box 60.

[0061] Step S42: Obtain the positioning image.

[0062] It is understandable that after the processor 50 acquires the positioning image, it can analyze the positioning image and thus plan the moving route of the gripping device 20.

[0063] Step S43: Analyze the positions of multiple slots 11 in the positioning image and generate route information.

[0064] In one implementation, the positioning coordinates of the multiple storage slots 61 are preset and input into the processor 50. The processor 50 can plan the route for the component 200 to move from the storage slots 61 to the slots 11 based on the positioning coordinates of the storage box 60 and the positions of the multiple slots 11, and generate route information.

[0065] In another implementation, when the processor 50 identifies the positioning image, it simultaneously determines the positions of multiple storage slots 61 and multiple slots 11 in the positioning image, and plans the route for the component 200 to move from the storage slots 61 to the slots 11, generating route information.

[0066] In some embodiments, when the processor 50 identifies the positions of multiple slots 11, or multiple slots 11 and multiple storage slots 61, it can generate a coordinate system based on the positioning image. The processor 50 determines the coordinates of each slot 11 and each storage slot 61 in the coordinate system, and plans a route on the coordinate system from the coordinate point of the storage slot 61 to the coordinate point of the slot 11, forming route information.

[0067] In some embodiments, the route information includes the movement path and rotation angle of the gripping device 20 as the component 200 moves from the storage box 60 to the slot 11. The processor 50 simultaneously plans the required rotation angle of the component 200 when planning its movement path.

[0068] It is understandable that the processor 50 can determine the length direction of the slot 11 by recognizing the positioning image. Then, based on the arrangement of the component 200 in the storage slot 61, the processor 50 can determine the angle that the gripping device 20 and the component 200 need to rotate after the gripping device 20 grips the component 200 in the storage slot 61.

[0069] like Figure 3 As shown in the example, when component 200 is placed in storage box 60, the length direction of component 200 is the same as the first direction. The length direction of slot 11 is the same as the third direction. The first direction and the third direction form a 90-degree angle. Therefore, after the gripping device 20 grips component 200 from storage slot 61, the processor 50 can control the rotating device 70 to rotate the gripping device 20 and component 200 by 90 degrees.

[0070] Step S44: Based on the route information, control the clamping device 20 to insert multiple components 200 into multiple slots 11.

[0071] It is understood that after determining the route information, the processor 50 controls the moving device 30, the rotating device 70, and the clamping device 20 to operate according to the route information, thereby moving multiple components 200 one by one from the storage slot 61 to the slot 11, and inserting the components 200 into the slot 11. After the component 200 is inserted into the slot 11, the processor 50 controls the clamping device 20 to release the component 200 and return to the storage box 60 to clamp another component 200.

[0072] Step S45: Control the test motherboard 10 to operate in order to test multiple components 200.

[0073] It is understandable that when multiple components 200 are plugged into slot 11, the processor 50 can control the test motherboard 10 to power on and work in order to test whether there are any faulty components 200 that cannot work properly.

[0074] Step S46: Determine if there is a faulty component 200. If there is no faulty component 200, proceed to step S48; if there is a faulty component 200, proceed to step S47.

[0075] It is understandable that when testing the motherboard 10 and testing the components 200, the processor 50 can obtain the operating parameters of each component 200 from the motherboard 10 and determine whether the component 200 is faulty based on the operating parameters. For example, the processor 50 can determine whether the operating parameters exceed the preset rated range. If the operating parameters exceed the rated range, the processor 50 can determine that the component 200 corresponding to the operating parameters is faulty.

[0076] Step S47: Stop the test and output alarm information.

[0077] It is understandable that when a faulty component 200 occurs, testing should be stopped immediately to avoid further powering on the component 200 for testing, which could cause more serious damage to the component 200 or cause the test motherboard 10 to malfunction.

[0078] In some embodiments, the processor 50 can communicate with a terminal device. When a faulty component 200 occurs, the processor 50 can output an alarm message to the terminal device to remind the operator to repair the faulty component 200.

[0079] In one implementation, the terminal device can be an electronic device with an alarm function, such as a warning light or a loudspeaker. When the terminal device receives alarm information output by the processor 50, it can issue an alarm. For example, the loudspeaker can play an alarm audio after receiving the alarm information.

[0080] In another implementation, the terminal device can also be a device with human-computer interaction capabilities, such as a personal computer, industrial computer, or smartphone. The alarm information output by the processor 50 can be visually displayed on the terminal device for operators to view. For example, the terminal device can be a smartphone, and the alarm information output by the processor 50 can be in the form of a text message with the content "component failure".

[0081] Step S48: Determine whether the number of times the multiple components 200 are tested on the current test motherboard 10 is greater than the first threshold. If it is less than or equal to the first threshold, proceed to step S49; if it is greater than the first threshold, proceed to step S410.

[0082] It can be understood that the first threshold corresponds to the number of times multiple components 200 need to be tested on a single test motherboard 10. The first threshold can be preset by the operator based on the model of the component 200 before testing it. The number of times component 200 is tested on the current motherboard can be calculated by the processor 50 each time it controls the test motherboard 10 to operate.

[0083] It is understandable that testing component 200 multiple times on a single test motherboard 10 can improve the accuracy of the test results.

[0084] Step S49: Based on the route information, control the clamping device 20 to insert multiple components 200 into other slots 11 on the same test motherboard 10, and return to step S45 to retest the multiple components 200.

[0085] It is understandable that when testing component 200 multiple times on the same test motherboard 10, component 200 can be plugged into different slots 11 each time to more accurately determine whether component 200 is faulty.

[0086] It is understood that the route information may also include the movement route and rotation angle of the clamping device 20 when moving multiple components 200 one by one to another slot 11. During step S43, the processor 50 can determine the route information based on the slot-changing rules and the positions of the multiple slots 11. During step S49, the processor 50 can control the moving device 30 and the rotating device 70 to operate based on the route information, so as to replace the multiple components 200 with other slots 11 for insertion.

[0087] Such as 1 and Figure 3 As shown, in this embodiment, the slot replacement rule may include: removing a specified component 200 from a specified slot 11; replacing the slots 11 of the remaining components 200 one by one along a preset direction; and inserting the removed component 200 into the only remaining empty slot 11 on the test motherboard 10.

[0088] It is understood that after the processor 50 controls the clamping device 20 to remove the specified component 200 from the specified slot 11, the component 200 can be placed in the storage box 60 according to the route information.

[0089] After the clamping device 20 places the removed component 200 into the storage box 60, an empty slot 11 is created on the test motherboard 10. The processor 50 can control the clamping device 20 to replace the component 200 adjacent to the empty slot 11 in a preset direction. In this way, another empty slot 11 can appear on the test motherboard 10. The processor 50 then controls the clamping device 20 to replace the next component 200 adjacent to the currently empty slot 11 in a preset direction. And so on, until finally one empty slot 11 remains on the test motherboard 10. The processor 50 can then control the clamping device 20 to move the component 200 in the storage box 60 into the empty slot 11, completing the replacement of multiple components 200 in the slot 11.

[0090] For example, the test motherboard 10 may include a first side 13 and a second side 14. The first side 13 and the second side 14 are positioned opposite each other. Multiple slots 11 are spaced apart along the relative direction of the first side 13 and the second side 14 on the test motherboard 10. In the slot-swapping rule, the specified slot 11 is the slot 11 closest to the first side 13, and the default direction is the direction from the second side 14 towards the first side 13. Figure 3 The opposite direction of the Y direction shown. After component 200 is removed from the designated slot 11, processor 50 controls clamping device 20 to move the remaining components 200 one by one along a preset direction, eventually leaving the slot 11 closest to the second side 14 empty. Processor 50 then controls clamping device 20 to insert the previously removed component 200 into the slot 11 closest to the second side 14, thereby completing the replacement of slots 11 for multiple components 200.

[0091] It is understood that when removing multiple components 200 one by one from the slot 11, the processor 50 first controls the moving device 30 to drive the clamping device 20 closer to the slot 11, and then controls the unlocking device 90 to push the latch 12 to release the lock on the component 200. Subsequently, the processor 50 controls the clamping device 20 to clamp the component 200, and controls the moving device 30 to move the component 200 clamped by the clamping device 20.

[0092] It is understandable that after multiple components 200 are replaced with slots 11, the processor 50 will rerun steps S45 to S48 to test the components 200 again.

[0093] Step S410: Determine whether the number of times component 200 is moved to another test motherboard 10 during the test of component 200 is greater than the second threshold. If it is less than or equal to the second threshold, proceed to step S411; if it is greater than the second threshold, proceed to step S412.

[0094] It is understood that component 200 needs to be tested multiple times on multiple test motherboards 10. The second threshold corresponds to the number of times the test motherboard 10 needs to be replaced during the testing of component 200. The second threshold can be preset by the operator based on the model of component 200 before testing. The number of times the test motherboard 10 needs to be replaced during the testing of component 200 can be counted by the processor 50 after each time it controls the moving device 30 to move component 200 to another test motherboard 10.

[0095] It is understandable that testing component 200 multiple times on a single test motherboard 10, and performing multiple tests on multiple test motherboards 10, can improve the accuracy of the test results.

[0096] Step S411: Control the clamping device 20 to move multiple components 200 one by one to another test motherboard 10, and return to step S41 to test multiple components 200 on the replaced test motherboard 10.

[0097] It is understood that multiple test motherboards 10 can be evenly distributed on the workbench, and the test motherboards 10 are fixedly connected to the workbench. When replacing the test motherboards 10 for multiple components 200, the original positions of the test motherboards 10 are different. The processor 50 controls the moving device 30, the rotating device 70, and the clamping device 20 to work, so as to remove the multiple components 200 one by one from the original test motherboards 10 and place them on another adjacent test motherboard 10.

[0098] In this embodiment, the processor 50 controls the clamping device 20 to move multiple components 200 on a test motherboard 10 into a storage box 60 corresponding to another test motherboard 10. The processor 50 then identifies the positioning image corresponding to the other test motherboard 10, generates route information, and controls the clamping device 20 to remove the multiple components 200 from the storage box 60 one by one and insert them into the slot 11 one by one.

[0099] Step S412: End the test and output the test data.

[0100] It is understood that the test data can be obtained by the processor 50 from summarizing and calculating the operating parameters of component 200 during each test. The processor 50 can acquire the operating parameters of component 200 and store them in memory 40 during each test. After the test is completed, the processor 50 can summarize and calculate multiple operating parameters again to generate and output the test data.

[0101] It is understood that the embodiments of this application do not limit the output target of the test data. For example, the processor 50 can output the test data to a user terminal for easy viewing by the operator. Alternatively, the processor 50 can output the test data to a cloud server, which then stores the test data in a database or sends it to other local servers. The operator can then download the test data stored in the database from the local server when needed.

[0102] Based on the same concept, embodiments of this application also provide a storage medium, the storage medium including computer instructions, which, when executed on a terminal device 300, cause the terminal device 300 to execute the automatic testing method provided in embodiments of this application.

[0103] In the embodiments of this application, the automatic testing equipment 100 is controlled by an automatic testing method, which can automatically realize the movement of multiple components 200 on multiple test motherboards 10, the insertion and removal of multiple components 200 on multiple slots 11, and the testing of multiple components 200 on multiple test motherboards 10. This reduces the manual operation process of operators, reduces manpower consumption, and improves the convenience of operation.

[0104] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments described above should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application.

Claims

1. An automatic testing method applied to an automatic testing device, the automatic testing device comprising a test motherboard and a clamping device, wherein the test motherboard has multiple slots, and the clamping device is used to insert components into the slots, characterized in that... The method includes: Acquire the location image; Analyze the positions of multiple slots in the positioning image to generate route information, wherein the content of the positioning image includes the test motherboard; Based on the route information, the clamping device is controlled to insert multiple components into multiple slots; Control the test motherboard to test multiple of the components; Determine if any faulty components are present; If it is determined that there are no faulty components, then according to the route information, the clamping device is controlled to insert multiple components into other slots, and the test motherboard is controlled again to test multiple components. If the number of times the test motherboard is replaced is less than or equal to the second threshold, the clamping device is controlled to move multiple components to another test motherboard, and the other test motherboard is controlled to test multiple components.

2. The automatic testing method as described in claim 1, characterized in that, The step of controlling the clamping device to insert multiple components into another slot based on the route information includes: Remove a designated component from the slot, creating an empty slot on the test motherboard; The remaining components are sequentially removed from the original slots along a preset direction and inserted into adjacent and empty slots; Insert the specified component into the empty slot.

3. The automatic testing method as described in claim 1, characterized in that, If it is determined that there is no faulty component, the method further includes: Determine whether the number of times the multiple components are tested on the test motherboard exceeds a preset first threshold; If it is determined that the number of tests is less than or equal to the first threshold, then according to the route information, the clamping device is controlled to insert multiple components into other slots, and the test motherboard is re-controlled to test multiple components.

4. The automatic testing method as described in claim 1, characterized in that, The method further includes: Determine whether the number of times the component is moved to another test motherboard during the testing of the component exceeds the second threshold.

5. The automatic testing method as described in claim 4, characterized in that, The method further includes: If the number of times the test motherboard is replaced exceeds the second threshold, the test is stopped.

6. The automatic testing method as described in claim 3, characterized in that, The method further includes: If it is determined that the number of tests is greater than the first threshold, then it is determined whether the number of times the component is moved to another test motherboard during the testing of the component is less than the second threshold.

7. The automatic testing method as described in claim 1, characterized in that, The automated testing equipment further includes a camera, and the method further includes: The camera is controlled to capture the positioning image of the test motherboard.

8. The automatic testing method as described in claim 1, characterized in that, The method further includes: If a faulty component is found, an alarm message will be output.

9. An automatic testing device for testing multiple components, characterized in that, The automated testing equipment includes: A test motherboard, which has multiple slots; A clamping device for inserting the component into the slot; Memory, used to store computer programs; A processor is configured to execute the computer program stored in the memory, wherein when the computer program is executed, the processor is configured to perform the automatic testing method as described in any one of claims 1 to 8.

10. A storage medium, characterized in that, The storage medium includes computer instructions that, when executed on a terminal device, cause the terminal device to perform the automatic testing method as described in any one of claims 1 to 8.

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