A method and apparatus for laser polishing of diamond surfaces

Abstract

The application discloses a kind of cultivating diamond surface laser polishing method and device, it belongs to diamond polishing field.It includes: laser;Focusing optical element is used to focus light beam and form a laser spot;Optical scanning mechanism is used to control the spatial scanning position and trajectory of light beam, to make laser spot form laser line;Moving carrier is used to make the polished diamond material along preset trajectory movement, to make the movement range of laser line on the polished surface of the polished diamond material cover polishing surface.The beneficial effects of the application are to provide a kind of processing technology and device for polishing diamond surface using ultrafast laser, solve the problem of carbonization layer produced by traditional cultivating diamond growth surface ripple surface and cutting surface.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of diamond polishing, in particular, to a method and device for laser polishing of a diamond surface. BACKGROUND

[0002] Diamond material is the hardest natural material known, and effective material removal is limited to a few inefficient and expensive methods. Current industrial diamond polishing methods use polyester diamond abrasive polishing discs, which slowly and highly tool-abrasively polish the diamond surface by rotating contact, which is prone to heat build-up on the diamond surface, causing micro-cracks and edge chipping. Moreover, this polishing method is limited to the sample surface topography, and surface undulations of tens of microns or more will bring the unpolished surface into contact with the polishing wheel, forming an unprocessed area. SUMMARY

[0003] The summary part of the present application is used to introduce the concept in a brief form, which will be described in detail in the specific embodiment part. The summary part of the present application is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0004] In order to solve the technical problems mentioned in the background part, some embodiments of the present application provide a laser polishing device for diamond surface, comprising: a laser for outputting a light beam; a focusing optical element for focusing the light beam to form a laser spot; an optical scanning mechanism for controlling the spatial scanning position and trajectory of the light beam, so that the laser spot forms a laser line; a moving carrier for moving the diamond material to be polished along a predetermined trajectory, so that the movement range of the laser line on the polishing surface of the diamond material to be polished covers the polishing surface; wherein the moving carrier is provided with a plurality of clamping mechanisms for clamping the diamond material to be polished and a supporting mechanism for supporting the plurality of clamping mechanisms; the clamping mechanism forms a clamping position; the supporting mechanism forms a supporting position; the supporting position and the plurality of clamping positions are used to fix the diamond material to be polished.

[0005] Further, the laser is an ultrafast laser.

[0006] Further, an expander is arranged at the laser; the expander is used to expand the diameter of the light beam.

[0007] Further, a mirror is arranged at the expander; the mirror is used to change the direction of the light beam output by the laser, so that the light beam reaches the focusing optical element.

[0008] Further, the polishing depth is 5-15 microns.

[0009] Further, a plurality of clamping mechanisms for clamping the diamond material to be polished and a supporting mechanism for supporting the plurality of clamping mechanisms are arranged on the moving carrier; the clamping mechanism is formed with a clamping position; the supporting mechanism is formed with a supporting position; the supporting position and the plurality of clamping positions are used to fix the diamond material to be polished.

[0010] Further, the supporting mechanism comprises a supporting rod and a supporting block; the supporting block is used to mount the clamping mechanism; the supporting rod is used to mount the supporting block on the moving carrier; a vacuum suction piece is arranged on the supporting rod; the vacuum suction piece is used to adsorb the diamond material to be polished.

[0011] Further, the clamping mechanism comprises a transmission piece, a clamping piece and a driving piece; one end of the transmission piece is connected with the clamping piece, and the other end is hinged with the supporting block; the driving piece is used to rotate the transmission piece around a fixed axis, so that the transmission pieces of the plurality of clamping mechanisms rotate towards each other and away from each other; the clamping pieces can be brought close to each other and away from each other.

[0012] Further, the driving piece comprises an elastic rope, a bracket, a driving motor, a driving rotating shaft and a winding wheel; the transmission piece is formed with a limiting hole; the elastic rope extends downward to the winding wheel after passing through a plurality of limiting holes, and is fixed with the winding wheel; the bracket is fixedly connected with the supporting block; the driving rotating shaft is rotatably connected with the bracket; the driving motor is used to rotate the driving rotating shaft to realize the winding of the elastic rope by the winding wheel, and the transmission pieces are brought close to each other by the external force of the elastic rope to clamp the diamond material to be polished.

[0013] A method for cultivating diamond surface laser polishing, which adopts a device for cultivating diamond surface laser polishing, and the method comprises the following steps:

[0014] By means of the optical scanning device and the focusing optical element, the laser spot formed by focusing the laser through the focusing optical element is located on the surface of the diamond to be polished;

[0015] By means of the optical scanning device, the spatial scanning position and the track of the light beam are controlled, so that the laser spot forms a laser line on the polishing surface;

[0016] By means of the movement of the moving carrier along the preset track, the movement range of the laser line on the polishing surface covers the polishing surface.

[0017] The application has the beneficial effects that a processing technology and device for polishing the surface of diamond by means of ultrafast laser are provided, and the problem of carbonized layer generated on the traditional corrugated surface and cutting surface of the cultivated diamond growth surface is solved. The surface protrusion or carbonized layer is removed by reciprocating scanning on the sample surface by means of ultrafast laser, and a sub-micron to nanometer bright surface is obtained, and the removal depth is controlled within tens of microns. Compared with mechanical polishing, the speed is fast, the thermal influence is small, the loss is small, and there is no pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of this application are used to provide a further understanding of this application and make other features, purposes and advantages of this application more apparent. The drawings and descriptions of the exemplary embodiments of this application are used to explain this application and do not constitute an improper limitation on this application.

[0019] In addition, throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the elements and components are not necessarily drawn to scale.

[0020] In the attached figure:

[0021] Figure 1 is an overall schematic diagram according to an embodiment of the present application;

[0022] Figure 2 It is a structural schematic diagram of a part of the embodiment, mainly showing the structure of the clamping mechanism;

[0023] Figure 3 It is a structural diagram of a part of the embodiment, mainly showing the structure of the transmission member;

[0024] Figure 4 It is a structural schematic diagram of a part of the embodiment, mainly showing the structure of the driving member;

[0025] Figure 5 It is a structural schematic diagram of a part of the embodiment, mainly showing the structure of the clamping member.

[0026] Reference numerals:

[0027] 1. Laser; 2. Focusing optical element; 3. Optical scanning mechanism; 4. Moving carrier; 5. Clamping mechanism; 51. Transmission member; 511. First connecting rod; 512. Second connecting rod; 513. Third connecting rod; 514. Fixed structure; 515. Fourth connecting rod; 52. Clamping member; 521. Connecting rod; 522. Abutting rod; 523. Elastic member; 53. Driving member; 531. Elastic rope; 532. Bracket; 533. Driving motor; 534. Driving shaft; 535. Winding wheel; 6. Support mechanism; 61. Support rod; 62. Vacuum suction member; 63. Support block; 7. Beam expander; 8. Reflector. DETAILED DESCRIPTION

[0028] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as being limited to the embodiments described herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of protection of the present disclosure.

[0029] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0030] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0031] It should be noted that the modifications of "one" and "multiple" mentioned in the present disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, they should be understood as "one or more".

[0032] The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0033] Reference Figures 1-5 ,

[0034] A laser polishing device for cultivating diamond surface comprises: a laser 1, a focusing optical element 2, an optical scanning mechanism 3, a movable carrier 4, a clamping mechanism 5 and a supporting mechanism 6.

[0035] Laser 1 is used to output a light beam. Focusing optical element 2 is used to focus the light beam to form a laser spot. Optical scanning mechanism 3 is used to control the spatial scanning position and trajectory of the light beam so that the laser spot forms a laser line. Mobile carrier 4 is used to move the diamond material to be polished along a preset trajectory so that the range of movement of the laser line on the polishing surface of the diamond material to be polished covers the polishing surface. A clamping mechanism 5 and a supporting mechanism 6 are both provided on mobile carrier 4 and are configured to move with the mobile carrier 4. Multiple clamping mechanisms 5 are provided, each for clamping the diamond material to be polished. Multiple supporting mechanisms 6 are provided, each for supporting multiple clamping mechanisms 5. Clamping positions are formed on the clamping mechanism 5; supporting positions are formed on the supporting mechanism 6; the supporting positions and multiple clamping positions are used to secure the diamond material to be polished. The preset trajectory is a linear motion, a motion mode designed to ensure that the range of movement of the laser line on the polishing surface of the diamond material to be polished covers the polishing surface. In this embodiment, mobile carrier 4 is preferably a three-axis movable slide.

[0036] Specifically, the laser 1 is an ultrafast laser 1. The beam expander 7 is arranged at the laser 1; the beam expander 7 is used to expand the beam diameter. The reflector 8 is arranged at the beam expander 7; the reflector 8 is used to change the direction of the output beam of the laser 1, so that the beam reaches the focusing optical element 2.

[0037] Specifically, the polishing depth is 5-15 microns. The polishing depth refers to the thickness removed by polishing. The preferred embodiment is 10 microns.

[0038] Specifically, the support mechanism 6 comprises a support rod 61, a vacuum suction piece 62, and a support block 63; the support block 63 is used to install the clamping mechanism 5; the support rod 61 is used to install the support block 63 on the moving carrier 4; the vacuum suction piece 62 is arranged on the support rod 61; the vacuum suction piece 62 is used to adsorb one side of the diamond material to be polished. The vacuum suction piece 62 is preferably a vacuum suction disc in the preferred embodiment.

[0039] Specifically, the clamping mechanism 5 comprises a transmission member 51, a clamping member 52, and a driving member 53. The driving member 53 comprises an elastic rope 531, a support 532, a driving motor 533, a driving shaft 534, and a winding wheel 535. The clamping member 52 comprises a connecting rod 521, an abutting rod 522, and an elastic member 523. The transmission member 51 comprises a first connecting rod 511, a second connecting rod 512, a third connecting rod 513, a fixing structure 514, and a fourth connecting rod 515. The fixing structure 514 comprises a limiting portion and two mounting portions. The limiting portion forms a limiting hole with the third connecting rod 513.

[0040] The first connecting rod 511 and the second connecting rod 512 are arranged in parallel; the third connecting rod 513 and the fourth connecting rod 515 are arranged in parallel; the first connecting rod 511 is fixedly connected with the support block 63; the second connecting rod 512 is used to install the connecting rod 521. The first connecting rod 511, the second connecting rod 512, the third connecting rod 513, and the fourth connecting rod 515 are sequentially hinged to form a parallel four-bar mechanism. The first connecting rod 511 is fixedly connected with the support block 63, so that the position of the first support rod 61 is fixed.

[0041] A plurality of threaded holes are formed in the third connecting rod 513; the fixing structure 514 is arranged on the third connecting rod 513; the fixing structure 514 comprises a limiting portion and two mounting portions; the two mounting portions are located at both ends of the limiting portion and are fixed with the limiting portion; the mounting portions are fixedly installed on the third connecting rod 513 through bolts and threaded holes; the limiting portion is an arc-shaped plate structure, and the mounting portions are flat plate structures. One end of the elastic rope 531 sequentially passes through a plurality of limiting holes and reaches the other end of the elastic rope 531, and then both ends of the elastic rope 531 extend downward to the winding wheel 535. Two winding rollers are arranged, one end of the elastic rope 531 is fixed with one of the winding wheels 535, and the other end of the elastic rope 531 is fixed with the other winding wheel 535.

[0042] The support 532 is fixedly connected with the supporting block 63; the driving shaft 534 is rotationally connected with the support 532; and the driving motor 533 is used to rotate the driving shaft 534, so that the winding wheel 535 winds the elastic rope 531.

[0043] The connecting rod 521 is used for being connected with the transmission member 51, and the connecting rod 521 is provided with an accommodating chamber; the abutting rod 522 is inserted into the accommodating chamber and is in sliding connection with the accommodating chamber; the elastic member 523 is arranged in the accommodating chamber and is used for enabling the abutting rod 522 to be subjected to an external force close to the diamond material to be polished; and the abutting rod 522 is provided with a flexible pad at an end close to the diamond material to be polished.

[0044] The connecting rod 521 is further provided with a through hole in communication with the accommodating chamber; the through hole is provided with a gas pump; the abutting rod 522 is provided with a through hole; the through hole is in communication with the accommodating chamber; and the gas pump is used to enable the accommodating chamber to be in a negative pressure state; and the flexible pad is of an annular structure.

[0045] A kind of method for cultivating diamond surface laser polishing, it is characterized in that: using the above-mentioned one kind of cultivating diamond surface laser polishing device, method includes: by optical scanning device and focusing optical element 2, laser is focused to form laser spot by focusing optical element 2, and it is located on the surface of diamond to be polished;By optical scanning device control the spatial scanning position and trajectory of light beam, laser spot forms laser line on polishing surface;By moving carrier 4 along preset trajectory movement, the movement range of laser line on polishing surface covers polishing surface.

[0046] Work flow:

[0047] By focusing optical element, laser is focused to form laser line by focusing optical element, and it is located on the polishing surface of diamond to be polished;By optical scanning mechanism control the spatial scanning position and trajectory of light beam, laser line moves to form polishing range on polishing surface;By optical scanning mechanism control the spatial scanning position and trajectory of light beam, after laser line moves along preset trajectory to form polishing range, laser line gradually moves downward, laser line continues to move along preset trajectory to form polishing range, two polishing ranges are plane, and two polishing ranges do not overlap;Two polishing ranges intersect in the direction of polishing depth;After repeating operation multiple times, multiple polishing ranges are formed, multiple polishing ranges form polishing space, until polishing space completely wraps polishing surface, polishing is completed.

[0048] When installing, the diamond material to be polished is placed on the vacuum chuck, and then the vacuum chuck supports the diamond material to be polished, and then the driving motor 533 drives the driving shaft 534 to rotate, the driving shaft 534 drives the winding wheel 535 to rotate, the winding wheel 535 is wound on the winding wheel 535 through the elastic rope 531, and then the two ends of the elastic rope 531 are subjected to tension, the elastic rope 531 transmits the force to the third connecting rod 513, and then the plurality of third connecting rods 513 are close to each other until the flexible pad on the abutting rod 522 abuts against the outer surface of the diamond material to be polished.

[0049] Then the driving motor 533 continues to drive the winding wheel 535 to rotate through the driving shaft 534, so that the third connecting rod 513 and the fourth connecting rod 515 are subjected to external force close to the diamond material to be polished, and the abutting rod 522 tightly presses the diamond material to be polished. Then the abutting rod 522 slides in the accommodating cavity, so that the elastic member 523 is compressed, and then the gas pump pumps the accommodating cavity to negative pressure, so that the abutting rod 522 tightly sucks the diamond material to be cut, thereby further increasing the clamping effect on the diamond material to be cut.

[0050] The flexible pad is used to abut against the diamond material to be polished, so that flexible abutment with the diamond material to be polished can be achieved, and the diamond material to be polished can be better protected. Meanwhile, the flexible pad is annular, and the through hole can be sealed with the diamond material to be polished, so that negative pressure adsorption can be better achieved, and the clamping effect on the diamond material to be polished is increased.

[0051] Since the plurality of third connecting rods 513 are close to each other by the contraction of the elastic rope 531, the elastic rope 531 is flexible and elastic, so the elastic rope 531 can form a ring of any shape, so that the plurality of third connecting rods 513 can be close to each other in different ways, so that the abutting rod 522 at the plurality of third connecting rods 513 abuts against the outer surface of the diamond material to be polished, and the force of the abutting rod 522 pressing the outer surface of the diamond material to be polished is the same, thereby better clamping the diamond material to be polished.

[0052] The above description is only some of the preferred embodiments of the present disclosure and the explanation of the technical principles applied. Those skilled in the art should understand that the inventive scope involved in the embodiments of the present disclosure is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the above features are replaced with the technical features disclosed in the embodiments of the present disclosure (but not limited to) having similar functions to form technical solutions.

Claims

1. A device for growing a diamond surface laser-polished, characterized by, The application relates to a laser polishing device for polishing diamond surface, which comprises the following parts: a laser for outputting a light beam; a focusing optical element for focusing the light beam to form a laser spot; an optical scanning mechanism for controlling the spatial scanning position and track of the light beam so that the laser spot forms a laser line; a moving carrier for moving the diamond material to be polished along a preset track so that the moving range of the laser line on the polishing surface of the diamond material to be polished covers the polishing surface; a plurality of clamping mechanisms for clamping the diamond material to be polished and a supporting mechanism for supporting the plurality of clamping mechanisms are arranged on the moving carrier; a clamping position is formed on the clamping mechanism; a supporting position is formed on the supporting mechanism; the supporting position and the plurality of clamping positions are used for fixing the diamond material to be polished; the supporting mechanism comprises a supporting rod and a supporting block; the supporting block is used for mounting the clamping mechanism; the supporting rod is used for mounting the supporting block on the moving carrier; a vacuum suction piece is arranged on the supporting rod; the vacuum suction piece is used for adsorbing the diamond material to be polished; the clamping mechanism comprises a transmission piece, a clamping piece and a driving piece; one end of the transmission piece is connected with the clamping piece, and the other end is hinged with the supporting block; the driving piece is used for rotating the transmission piece around a fixed axis so that the transmission pieces of the plurality of clamping mechanisms rotate towards each other and rotate away from each other; the clamping pieces can rotate towards each other and rotate away from each other; the driving piece comprises an elastic rope, a support, a driving motor, a driving rotating shaft and a winding wheel; a limiting hole is formed on the transmission piece; the elastic rope extends downwards to the winding wheel after passing through the plurality of limiting holes and is fixed with the winding wheel; the support is fixedly connected with the supporting block; the driving rotating shaft is rotationally connected with the support; the driving motor is used for rotating the driving rotating shaft to realize that the winding wheel winds the elastic rope; the transmission pieces are forced to move towards each other by the elastic rope so that the clamping pieces clamp the diamond material to be polished; the clamping piece comprises a connecting rod and an abutting rod; the connecting rod is connected with the transmission piece; a containing chamber is formed in the connecting rod; the abutting rod is inserted into the containing chamber and is slidably connected with the containing chamber; a through hole is formed in the connecting rod and is communicated with the containing chamber; a gas pump is arranged at the through hole; a through hole is formed in the abutting rod and is communicated with the containing chamber; the gas pump is used for keeping the containing chamber in a negative pressure state; the laser is an ultrafast laser; an expander is arranged at the laser; the expander is used for expanding the diameter of the light beam; a reflector is arranged at the expander; the reflector is used for changing the direction of the light beam outputted by the laser so that the light beam reaches the focusing optical element; the polishing depth is 5-15 microns; the device is used for polishing the surface of the diamond; the method comprises the following steps: the laser spot formed by focusing the light beam by the focusing optical element is located on the surface of the diamond to be polished by the optical scanning device and the focusing optical element; the laser spot forms a laser line on the polishing surface by controlling the spatial scanning position and track of the light beam by the optical scanning device; the moving range of the laser line on the polishing surface covers the polishing surface by moving the moving carrier along the preset track. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2. The apparatus for laser polishing of a diamond surface according to claim 1, wherein: ​ 3. The apparatus for laser polishing of a diamond surface according to claim 1, wherein: ​ 4. The apparatus for laser polishing of a diamond surface according to claim 3, wherein: ​ 5. The apparatus for laser polishing of diamond surfaces according to claim 1, wherein: ​ 6. A method of growing a laser-polished diamond surface, the method comprising: ​ ​ ​ ​

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