Probe pressure detection device and method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
- Filing Date
- 2022-04-14
- Publication Date
- 2026-06-30
AI Technical Summary
In existing technologies, it is impossible to determine whether the probe pressure is appropriate when testing interlayer metals, which leads to inaccurate test results or damage to devices. Furthermore, determining contact quality by testing resistance requires multiple tests, which is inefficient.
Design a probe pressure detection device, including a bridge, a transverse drive shaft, a longitudinal drive shaft, a slider, a detection device probe, a detection instrument, a drive unit, and a control module. The detection module and the detection instrument detect the contact between the probe and the solder pad, and calculate the pressure of the probe used for actual testing.
It enables rapid and accurate detection of probe pressure, reduces damage to solder pads and probes, and improves testing efficiency.
Smart Images
Figure CN116952429B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a probe pressure detection device and method. Background Technology
[0002] During chip manufacturing, multiple electrical tests are typically performed to verify chip performance. In these tests, the pads on the wafer act as pins for the test circuit, contacting probes. A probe card establishes a stable and reliable connection between the pads and the testing equipment. These probes then transmit electrical signals to test the device's performance. Currently, the main objective factors affecting the accuracy of electrical test results include: the precision of the testing equipment, the precision of the probe station, the quality of the probe card, and the quality of the contact between the probes and the pads. During electrical testing, it is generally required that the probe be inserted into the center of the pad, with the probe mark less than one-third of the pad area. When testing interlayer metals, the copper pads are not visible under the probe station camera, making it impossible to determine if the overdrive (OD) is appropriate. If the OD is too small, it will cause poor contact during testing, leading to inaccurate results; if the OD is too large, it will damage the device and accelerate probe wear.
[0003] To address the issue of OD calculation, existing technologies use resistance testing to determine whether the probe and pad are making good contact. This approach requires communication between the testing machine and the probe station, and is completed through actual testing. Moreover, it requires multiple tests to complete, resulting in decreased testing efficiency. Summary of the Invention
[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a probe pressure detection device and method to solve the problems in the prior art, such as the inability to determine whether the probe pressure is appropriate when testing interlayer metals because the probe marks are not visible, the accuracy of the test data cannot be guaranteed, and damage to the probe and wafer is easily caused. The method of using resistance testing to determine whether the probe and the pad are in good contact requires communication between the test machine and the probe station and is completed through multiple actual tests, which leads to a decrease in testing efficiency.
[0005] To achieve the above and other related objectives, the present invention provides a probe pressure detection device, comprising a bridge, a transverse drive shaft, a longitudinal drive shaft, a longitudinal slide rail, a slider, two detection probes, a detection instrument, a first drive unit, a second drive unit, a detection module, and a control module; the transverse drive shaft, the first drive unit, and the detection instrument are fixed on the bridge, the longitudinal drive shaft and the longitudinal slide rail are located below the bridge, the first drive unit is connected to the transverse drive shaft and is used to drive the first transverse drive shaft to move; the longitudinal drive shaft and the longitudinal slide rail are arranged in parallel, and the second drive unit is connected to the longitudinal drive shaft to drive the transverse drive shaft to move. The system is connected to the drive shaft to drive the longitudinal drive shaft; the slider is located on the transverse drive shaft, and two detection probes are connected to the slider with adjustable spacing between them. A detection instrument is electrically connected to the two detection probes to detect whether they are in contact with the solder pad under test. The control module is electrically connected to the first drive unit and the second drive unit. The detection module is used to detect the height difference between the actual test probe and the detection probes, and to calculate the initial needle pressure of the actual test probe based on this height difference.
[0006] Optionally, the probe of the detection device is made of tungsten and / or beryllium copper, with a diameter of 10-30 μm and a length of 200-300 μm.
[0007] In one alternative embodiment, the slider is provided with a scale groove, and two detection device probes are located in the scale groove and can move within the scale groove.
[0008] In another alternative, there are two sliders, with two detection probes positioned one-to-one on each slider, and the distance between the two sliders is adjustable.
[0009] Optionally, the detection module includes a camera, and the detection instrument includes a multimeter.
[0010] Optionally, the longitudinal and lateral movement distances of the two detection device probes are 0 to 500 mm; the spacing between the two detection device probes is 50 μm to 200 μm.
[0011] Optionally, the control module includes a PLC controller and / or a host computer, which is electrically connected to the detection module.
[0012] Optionally, the needle pressure detection device includes a fixed platform, and the bridge, transverse drive shaft, longitudinal drive shaft and longitudinal slide rail are all located on the fixed platform.
[0013] Optionally, the first drive unit and the second drive unit include servo motors.
[0014] This invention also provides a probe pressure detection method, which is based on the probe pressure detection device described in any of the above-mentioned schemes. The probe pressure detection method includes adjusting the spacing of two detection device probes according to the pad spacing of the wafer under test, and setting the longitudinal and lateral movement distances of the two detection device probes according to the position of the pads. The detection module detects the position of the detection device probe and the pad under test, and then adjusts the pressure. The initial pressure value when the detection device probe just contacts the pad is detected by a detection instrument. Then, the detection module detects the height of the actual test probe and the detection device probe again, and calculates the initial pressure of the actual test probe based on the height difference between the actual test probe and the detection device probe, thereby obtaining the initial pressure of the actual test probe.
[0015] As described above, the probe pressure detection device and method of the present invention have the following beneficial effects: The improved structural design of the present invention can detect probe pressure, and the probe of the detection device can be flexibly adjusted according to the position and spacing of the solder pads to be tested, meeting different detection requirements. The entire device has a simple structure and is very convenient to operate, which can greatly improve testing efficiency. Attached Figure Description
[0016] Figure 1 The diagram shown is a schematic representation of the probe needle pressure detection device provided by the present invention.
[0017] Figure 2 The diagram shows a probe needle pressure detection device provided by the present invention for detecting needle pressure.
[0018] Component designation explanation
[0019] 11 Cable trays
[0020] 12 Lateral drive shafts
[0021] 13 Longitudinal drive shaft
[0022] 14 Longitudinal slide rails
[0023] 15 sliders
[0024] 16 Detection device probes
[0025] 17. Testing Instruments
[0026] 18 First Drive Unit
[0027] 19 Second drive unit
[0028] 20 Control Module
[0029] 21 Carrier Disk
[0030] 22 wafers Detailed Implementation
[0031] The following specific examples illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. For ease of explanation, when detailing the embodiments of the present invention, the cross-sectional views showing the device structure are partially enlarged, not according to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.
[0032] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.
[0033] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
[0034] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show components related to the present invention and are not drawn according to the actual number, shape, and size of the components in the actual implementation. In the actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex. To keep the illustrations as concise as possible, not all structures are shown in the figures.
[0035] Please see Figure 1 and Figure 2 .
[0036] Over-driver pressure (OD) refers to the distance the wafer moves upward (towards the probe) when the solder pad on the wafer just makes contact with the probe. Its unit is usually μm, and it is an important parameter in electrical testing of wafers. If the OD is too small, it will cause poor contact during testing, leading to inaccurate test results; if the OD is too large, it will damage the device and accelerate probe wear. Existing methods that use resistance testing to determine the good contact between the probe and the solder pad are complex and inefficient. Therefore, the inventors of this application, after long-term research, have proposed an improved solution.
[0037] Specifically, such as Figure 1 As shown, this invention provides a probe pressure detection device, including a bridge frame 11, a transverse drive shaft 12, a longitudinal drive shaft 13, a longitudinal slide rail 14, a slider 15, two detection probes 16, a detection instrument 17, a first drive unit 18, a second drive unit 19, a detection module (not shown), and a control module 20. The transverse drive shaft 12, the first drive unit 18, and the detection instrument 17 are fixed on the bridge frame 11. The longitudinal drive shaft 13 and the longitudinal slide rail 14 are arranged parallel to each other below the bridge frame 11. The first drive unit 18 is connected to the transverse drive shaft 12 and is used to drive the first transverse drive shaft 12 to move. For example, the first drive unit 18 is mounted on one end of the transverse drive shaft 12. Under the drive of the first drive unit 18, the transverse drive shaft 12 rotates, thereby causing the slider 15 located on the transverse drive shaft 12 to move laterally. The drive shaft 13 and the longitudinal slide rail 14 are arranged parallel to each other. The second drive unit 19 is connected to the longitudinal drive shaft 13 and is used to drive the longitudinal drive shaft 13 to move. For example, the second drive unit 19 is installed at one end of the longitudinal drive shaft 13. Under the drive of the second drive unit 19, the longitudinal drive shaft 13 rotates, so that the bridge 11 can move on the longitudinal slide rail 14, thereby enabling the transverse drive shaft 12 and the slider 15 located on the bridge 11 to move longitudinally. Two detection probes 16 are connected to the slider 15, and the distance between the two detection probes 16 is adjustable, so that the distance between the detection probes 16 can be adjusted according to the distance between the pads to be tested. The detection instrument 17 is electrically connected to the two detection probes 16 and is used to detect whether the two detection probes 16 are in contact with the pads to be tested. For example, when the detection probes 16 are in contact with the detection unit (test) When all the solder pads (key) are in contact, a circuit path is formed, which is then detected by the detection instrument 17. The control module 20 is electrically connected to the first drive unit 18 and the second drive unit 19. The control module 20 can store relevant parameters in advance to control the operation of the first drive unit 18 and the second drive unit 19. The detection module is used to detect the position of the detection device probe 16 and the solder pad under test, and to obtain the actual test probe pressure based on the height difference between the actual test probe and the device probe 16. (Reference) Figure 1 and Figure 2 As shown, the working principle of the probe pressure detection device provided in this embodiment is as follows: the wafer 22 to be tested is loaded onto the carrier 21, for example, onto a chuck. The spacing of the two detection device probes 16 is adjusted according to the spacing / pitch of the pads to be tested on the wafer. Based on the coordinates of the pads, the first drive unit 18 and the second drive unit 19 drive the rotation of the transverse drive shaft 12 and the longitudinal drive shaft 13, thereby setting the longitudinal and transverse movement distance of the detection device probes 16. Then, the detection module is aligned with the position of the detection device probes 16 and the pads to be tested, and the initial pressure value of the detection device probes is adjusted until the detection instrument 17 detects a path, indicating that the detection device probes 16 have just made contact with the pads. This initial pressure value is recorded as OD1. The detection module is then used to align the detection device probes 16 and the actual test probes, and the height difference H between the two is calculated. Then, the pressure OD when the actual test probe contacts the pads is obtained as OD = OD1 + H. The improved structural design of this invention can detect probe pressure and allows for flexible adjustment of the detection probe based on the position and spacing of the solder pads to be tested, meeting diverse detection needs. It effectively reduces damage to the solder pads and probes during the testing process. The entire device has a simple structure, is very easy to operate, and can greatly improve testing efficiency.
[0038] The detection probe 16 is preferably made of tungsten and / or beryllium copper. These two materials offer advantages such as good conductivity and ductility, which help improve detection sensitivity and prevent wear during contact with the solder pad. The detection probe 16 is typically cylindrical. Extensive experiments have shown that the diameter of the detection probe 16 is preferably 10–30 μm. This ensures good contact with the solder pad during detection while avoiding unnecessary contact with structures adjacent to the solder pad due to an excessively large probe, which could affect detection accuracy. The length of the detection probe 16 is preferably 200–300 μm.
[0039] In one example, the slider 15 has a graduated groove, and two detection probes 16 are located within the graduated groove and can move within it. In this example, there is only one slider 15, and the spacing between the two detection probes 16 can be flexibly adjusted according to the spacing of the solder pads to be tested. In another example, there are two sliders 15, with two detection probes 16 corresponding to each other on the slider 15. The spacing between the two sliders 15 is adjustable. In this example, a scale can be set on the transverse drive shaft 12, and adjusting the spacing between the two sliders 15 can achieve the same effect as adjusting the spacing of the detection probes 16. Comparatively, using a single slider 15 with a graduated groove not only simplifies the device structure but also makes adjustment operations more convenient.
[0040] The detection module can be equipped with any suitable detection unit for detecting the position of the detection device probe 16 and the solder pads. For example, a sensor can be used. However, in a preferred example, the detection module includes a camera, such as a CCD camera, which can not only acquire the position information of the detection device probe 16 and the solder pads, but also archive the images acquired by the camera for other analyses. The detection instrument 17 can be any instrument that can detect the continuity of a circuit, such as a voltmeter or an ammeter. However, in this embodiment, a multimeter is preferred to fully meet different detection needs. When a continuity is detected, the multimeter emits a beep to remind relevant personnel to proceed to the next step.
[0041] The inventors conducted extensive analysis of the industry's testing needs and set the longitudinal and lateral movement distances of the two detection device probes 16 to be 0-500 mm, while the spacing between the two detection device probes 16 was 50 μm-200 μm. By selecting appropriate lengths for the lateral drive shaft 12 and the longitudinal drive shaft 13 based on the above parameters, most of the testing needs in the semiconductor industry can be met.
[0042] The control module 20 can be any controller that can store relevant programs and control the operation of the drive unit according to the stored programs. For example, it can be a PLC controller and / or a host computer. The control module 20 is also electrically connected to the detection module. The aforementioned calculation process of obtaining the needle pressure when the actual test probe contacts the solder pad based on the height difference between the detection device probe 16 and the actual test probe can be completely performed by the control module 20. In other words, the detection module and the control module 20 are only a general functional distinction, not a strict physical distinction.
[0043] For ease of operation, the needle pressure detection device may also include a fixed platform, on which the bridge 11, the transverse drive shaft 12, the longitudinal drive shaft 13 and the longitudinal slide rail 14 are all located. The aforementioned camera may be fixed at an appropriate position on the fixed platform.
[0044] The first drive unit 18 and the second drive unit 19 may be servo motors to achieve precise control over the movement of the corresponding structures.
[0045] This invention also provides a probe pressure detection method, which is based on the probe pressure detection device described in any of the above-mentioned solutions; therefore, the foregoing content can be quoted in its entirety here. The probe pressure detection method includes adjusting the spacing of two detection device probes according to the pad spacing of the wafer under test, and setting the longitudinal and lateral movement distances of the two detection device probes according to the position of the pads. The detection module detects the position of the detection device probes and the pads under test, then adjusts the pressure, and uses a detection instrument to detect the initial pressure value when the detection device probes just make contact with the pads. Afterwards, the detection module again detects the position of the detection device probes and the actual test probe to obtain the height difference between the two, and finally obtains the actual test probe pressure. For a more detailed description of the probe pressure detection method, please refer to the foregoing content; for the sake of brevity, it will not be repeated here.
[0046] In summary, the present invention provides a probe needle pressure detection device and method. The device includes a cable tray, a transverse drive shaft, a longitudinal drive shaft, a longitudinal slide rail, a slider, two detection probes, a detection instrument, a first drive unit, a second drive unit, a detection module, and a control module. The transverse drive shaft, the first drive unit, and the detection instrument are fixed to the cable tray. The longitudinal drive shaft and the longitudinal slide rail are located below the cable tray. The first drive unit is connected to the transverse drive shaft and drives its movement. The longitudinal drive shaft and the longitudinal slide rail are arranged parallel to each other. The second drive unit is connected to the longitudinal drive shaft and drives its movement. The slider is located on the transverse drive shaft. The two detection probes are connected to the slider, and the distance between the two detection probes is adjustable. The detection instrument is electrically connected to the two detection probes and detects whether the two detection probes are in contact with the solder pads to be tested. The control module is electrically connected to the first drive unit and the second drive unit. The detection module detects the positions of the detection probes and the solder pads to be tested, and obtains the actual test probe pressure based on the height difference between the detection probes and the actual test probe. The improved structural design of this invention can detect the pressure of the probe used in actual testing, and the probe of the detection device can be flexibly adjusted according to the position and spacing of the solder pads to be tested, meeting different detection needs. The entire device has a simple structure and is very convenient to operate, which can greatly improve testing efficiency. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.
[0047] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.
Claims
1. A probe needle pressure detection device, characterized in that, It includes a cable tray, a transverse drive shaft, a longitudinal drive shaft, a longitudinal slide rail, a slider, two detection probes, a detection instrument, a first drive unit, a second drive unit, a detection module, and a control module; the transverse drive shaft, the first drive unit, and the detection instrument are fixed on the cable tray, the longitudinal drive shaft and the longitudinal slide rail are located below the cable tray, and the first drive unit is connected to the transverse drive shaft to drive the transverse drive shaft to move; The longitudinal drive shaft and longitudinal slide rail are arranged in parallel. The second drive unit is connected to the longitudinal drive shaft and is used to drive the longitudinal drive shaft to move. The slider is located on the transverse drive shaft. Two detection probes are connected to the slider, and the distance between the two detection probes is adjustable. The detection instrument is electrically connected to the two detection probes and is used to detect whether the two detection probes are in contact with the solder pad to be tested. The control module is electrically connected to the first drive unit and the second drive unit. The detection module is used to detect the height of the actual test probe and the detection probe, and calculate the initial needle pressure of the actual test probe based on the height difference between the actual test probe and the detection probe.
2. The probe needle pressure detection device according to claim 1, characterized in that, The probe of the detection device is made of tungsten and / or beryllium copper, with a diameter of 10~30um and a length of 200~300um.
3. The probe needle pressure detection device according to claim 1, characterized in that, The slider is provided with a scale groove, and two detection device probes are located in the scale groove and move within the scale groove.
4. The probe needle pressure detection device according to claim 1, characterized in that, There are two sliders, and two detection device probes are set on the sliders one-to-one. The distance between the two sliders is adjustable.
5. The probe needle pressure detection device according to claim 1, characterized in that, The detection module includes a camera, and the detection instrument includes a multimeter.
6. The probe needle pressure detection device according to claim 1, characterized in that, The longitudinal and lateral movement distances of the two detection probes are 0–500 mm; the spacing between the two detection probes is 50 μm–200 μm.
7. The probe needle pressure detection device according to claim 1, characterized in that, The control module includes a PLC controller and / or a host computer, which is electrically connected to the detection module.
8. The probe needle pressure detection device according to claim 1, characterized in that, The needle pressure detection device includes a fixed platform, and the bridge, transverse drive shaft, longitudinal drive shaft and longitudinal slide rail are all located on the fixed platform.
9. The probe needle pressure detection device according to claim 1, characterized in that, The first drive unit and the second drive unit include servo motors.
10. A method for detecting probe needle pressure, characterized in that, The probe pressure detection method is based on the probe pressure detection device according to any one of claims 1-9. The probe pressure detection method includes adjusting the spacing of two detection device probes according to the pad spacing of the wafer under test, and setting the longitudinal and lateral movement distances of the two detection device probes according to the position of the pad. The detection module detects the position of the detection device probe and the pad under test, and then adjusts the pressure. The detection instrument detects the initial pressure value when the detection device probe just contacts the pad. Then, the detection module detects the height of the actual test probe and the detection device probe again, and calculates the initial pressure of the actual test probe based on the height difference between the actual test probe and the detection device probe, thereby obtaining the initial pressure of the actual test probe.