Glue filling device between CT detector module scintillator and photodiode and glue filling method

Abstract

The embodiment of the application discloses a kind of CT detector module scintillator and photo diode interval glue pouring device and glue pouring method, wherein glue pouring device includes: bottom plate, and glue pouring block and support block being set on the bottom plate;Wherein, glue pouring block is provided with glue cell and glue pouring groove on the side away from bottom plate, one end of glue pouring groove is communicated with glue cell, and the other end of glue pouring groove extends in the direction away from glue cell;Support block has two, and the side away from bottom plate of support block is provided with the protruding block higher than the surface of the side away from bottom plate of glue pouring block, support groove is opened in the protruding block, and the support groove of two support blocks is oppositely arranged, and support groove is used to accommodate detector module;When detector module is placed in support groove, the scintillator of detector module is towards glue cell direction, the gap between scintillator and photo diode is located above glue pouring groove, part of glue pouring groove is located directly below the gap, and the edge of scintillator and photo diode on the both sides of gap is contacted with the surface on the both sides of glue pouring groove.

Description

Technical Field

[0001] This application relates to the field of potting technology, specifically to a potting device and method for potting between a scintillator and a photodiode in a CT detector module. Background Technology

[0002] In modern mainstream CT systems, the detector module plays a crucial role as the device for acquiring CT image data. The X-ray tube emits X-rays that cover a specific part of the human body to be scanned. The detector module acquires the X-rays, converts them into electrical signals, and then converts them into digital information through a data acquisition and conversion unit. This digital information is then stored in the image processing system, which uses a series of correction and image reconstruction algorithms to generate an image that is displayed on the monitor.

[0003] In the detector module, the scintillator (a functional crystal material that converts X-rays into visible light) receives X-rays and emits visible light. The photodiode (PD) converts the visible light into a photocurrent through photoelectric conversion, and the photocurrent is transmitted as an electrical signal through external circuitry and a load, which is then output by the readout circuit. During the production of the detector module, the scintillator and PD need to maintain a parallelism of ±10μm. A UV adhesive mixed with plastic beads is used for pre-curing during machine mounting, and optical underfill is applied after mounting to ensure no gaps or air bubbles inside.

[0004] Therefore, a method for potting adhesive between the scintillator and photodiode in a CT detector module is needed to solve the problem that the internal gap between the scintillator and photodiode is not filled with adhesive after they are bonded together. Summary of the Invention

[0005] The purpose of this application is to provide a glue-filling device and a glue-filling apparatus between the scintillator and the photodiode of a CT detector module, so as to solve the problem in the prior art that the internal gap between the scintillator and the photodiode is not filled with glue after they are bonded together.

[0006] To achieve the above objectives, this application provides a potting device between the scintillator and photodiode of a CT detector module, comprising: a base plate, and a potting block and a support block disposed on the base plate; wherein,

[0007] The glue-filling block is provided with a glue pool and a glue-filling trough on the side away from the base plate. One end of the glue-filling trough is connected to the glue pool, and the other end of the glue-filling trough extends away from the glue pool.

[0008] There are two support blocks. On the side of the support block away from the base plate, there is a protrusion that is higher than the surface of the glue block away from the base plate. The protrusion has a support groove. The support grooves of the two support blocks are arranged opposite to each other. The support groove is used to accommodate the detector module.

[0009] When the detector module is placed in the support groove, the scintillator of the detector module faces the glue pool direction, the gap between the scintillator and the photodiode is located above the glue pool, a part of the glue pool is located directly below the gap, and the edges of the scintillator and the photodiode on both sides of the gap are in contact with the surfaces of the glue blocks on both sides of the glue pool directly below.

[0010] Optionally, the base plate is made of 304 stainless steel, the potting block is made of Teflon, and the support block is made of acetal resin.

[0011] Optionally, the support slots of the two support blocks are asymmetrically designed, making it impossible to place the detector module in reverse.

[0012] Optionally, the inner edges of the glue pool and the glue dispensing groove are rounded.

[0013] Optionally, the end of the glue-filling block away from the glue pool is provided with a positioning hole, and a positioning pin is provided at the corresponding position on the base plate;

[0014] The glue block is fixedly mounted on the base plate by means of the coupling between the positioning hole and the positioning pin.

[0015] Optionally, there are at least two positioning pins of at least two different sizes, and correspondingly, there are at least two positioning holes of at least two different sizes, to prevent the glue block from being placed backwards.

[0016] Optionally, the glue-filling block is located between the two support blocks, and the glue-filling block is separated from the support blocks.

[0017] Optionally, the support block is provided with a first fixing hole penetrating the support block, and a second fixing hole is provided at a corresponding position on the base plate. A fixing member passes through the first fixing hole and extends into the second fixing hole to fix the support block on the base plate.

[0018] Optionally, the support block has a positioning hole at one end near the base plate, and a positioning pin is provided at the corresponding position on the base plate;

[0019] The support block is fixedly mounted on the base plate by means of the coupling between the positioning hole and the positioning pin.

[0020] To achieve the above objectives, this application also provides a method for potting adhesive between the scintillator and the photodiode of a CT detector module, comprising: placing the potting block on the base plate according to the positioning hole position;

[0021] Place the detector module into the support slot of the support block with the scintillator facing the glue pool;

[0022] Drip glue into the glue pool until the liquid surface contacts the detector module;

[0023] Open the vacuum equipment chamber, place the dispensing device into the vacuum equipment and evacuate the vacuum;

[0024] After a preset time, the vacuum equipment is broken, and the potting device and the detector module are removed from the vacuum equipment cavity.

[0025] The embodiments of this application have the following advantages:

[0026] This application provides a potting device between a scintillator and a photodiode in a CT detector module, comprising: a base plate, and a potting block and a support block disposed on the base plate; wherein, a glue pool and a potting groove are disposed on the side of the potting block away from the base plate, one end of the potting groove is connected to the glue pool, and the other end of the potting groove extends away from the glue pool; there are two support blocks, and a protrusion is disposed on the side of the support block away from the base plate that is higher than the surface of the side of the potting block away from the base plate, and a support groove is formed on the protrusion. The support grooves of the two support blocks are disposed opposite to each other, and the support groove is used to accommodate the detector module; when the detector module is placed in the support groove, the scintillator of the detector module faces the direction of the glue pool, the gap between the scintillator and the photodiode is located above the potting groove, a part of the potting groove is located directly below the gap, and the edges of the scintillator and the photodiode on both sides of the gap are in contact with the surfaces of the potting blocks on both sides of the potting groove directly below.

[0027] The above-mentioned device uses a vacuum device to quickly extract the gas in the gap. Under the action of capillary action, the glue can quickly fill the gap between the PD and the scintillator. The vacuum environment can also eliminate defects such as air bubbles, thus improving the speed and quality of glue application. Attached Figure Description

[0028] To more clearly illustrate the embodiments of this application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0029] Figure 1 A schematic diagram of a potting device between a scintillator and a photodiode in a CT detector module provided in this application embodiment;

[0030] Figure 2 This is a schematic diagram of the base plate and the glue-filling block of a glue-filling device between a scintillator and a photodiode in a CT detector module, provided in an embodiment of this application. Detailed Implementation

[0031] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0035] One embodiment of this application provides a potting device between the scintillator and photodiode of a CT detector module, referenced... Figure 1 and Figure 2 It should be understood that the device may also include additional boxes not shown and / or the boxes shown may be omitted, and the scope of this application is not limited in this respect.

[0036] refer to Figure 1The glue-dispensing device includes: a base plate 10, and a glue-dispensing block 20 and a support block 30 disposed on the base plate 10; wherein,

[0037] The glue-filling block 20 has a glue pool 21 and a glue-filling groove 22 on the side away from the base plate 10. One end of the glue-filling groove 22 is connected to the glue pool 21, and the other end of the glue-filling groove 22 extends away from the glue pool 21. The glue-filling groove 22 needs to be located below the installed detector module 40.

[0038] In some embodiments, the glue pool 21 and the glue dispensing groove 22 are 2mm deep, and all inner edges are rounded so that the edges of the inner edges are all arc surfaces.

[0039] This makes cleaning easier: the glue can only come into contact with the middle glue block 20, the glue pool 21 is only 2mm deep, and all the inner edges of the glue pool 22 are rounded, making it easier to clean the glue.

[0040] In some embodiments, reference Figure 2 The glue-filling block 20 has a positioning hole 23 at one end away from the glue pool 21, and a positioning pin 11 is provided at the corresponding position on the base plate 10. The glue-filling block 20 is matched and fixedly set on the base plate 10 by the coupling between the positioning hole 23 and the positioning pin 11. The shapes of the positioning hole 23 and the positioning pin 11 can be coupled to each other, and there are no restrictions on the shape. They can be cylindrical or prismatic.

[0041] In some embodiments, there are at least two (e.g., four) positioning pins 11 and at least two (e.g., two) different sizes of positioning pins 11. Correspondingly, there are also at least two (e.g., four) positioning holes 23 and at least two (e.g., two) different sizes of positioning holes 23, to prevent the glue block 20 from being placed backwards.

[0042] This allows the glue block 20 to be quickly removed: the glue block 20 is positioned and fixed to the stainless steel base plate 10 by the hole at the bottom, which facilitates disassembly and cleaning after use. The positioning pins 11 on the base plate 10 that fix the glue block 20 have at least two specifications and are designed to prevent incorrect placement.

[0043] refer to Figure 1 In this glue-pouring device, there are two support blocks 30. The side of the support block 30 away from the base plate 10 is provided with a protrusion that is higher than the surface of the glue-pouring block 20 away from the base plate 10. The protrusion is provided with a support groove. The support grooves of the two support blocks 30 are arranged opposite to each other. The support groove is used to accommodate the detector module 40.

[0044] When the detector module 40 is placed in the support groove, the scintillator 41 of the detector module 40 faces the glue pool 21, and the gap between the scintillator 41 and the photodiode 42 is located above the glue pool 22. Figure 2 The glue-filling groove 22 can be T-shaped, with a portion of the glue-filling groove 22 located directly below the gap, and the edges of the scintillator 41 and the photodiode 42 on both sides of the gap contacting the surfaces of the glue-filling blocks 20 on both sides of the glue-filling groove 22 directly below.

[0045] Specifically, the protrusion can be the part of the support block 30 used to create the support groove. On the side away from the base plate 10, the protrusion needs to be higher than the potting block 20 so that the detector module 40 can be fixed in a position higher than the potting block 20, and the bottom end of the detector module 40 can contact the surface of the potting block 20 away from the base plate 10. The protrusion can also be a part of the support block 30 that protrudes above the potting block 20. As long as the above purpose can be achieved, this application does not limit it.

[0046] This allows for the clever utilization of capillary action: after glue is dripped into the glue tank 21, when the bottom surface of the product comes into contact with the glue, it will fill the gap between the scintillator 41 and the PD under the influence of capillary action. Furthermore, when using vacuum equipment for glue dispensing, the vacuum environment can accelerate the dispensing speed and help improve the quality of the dispensing, eliminating defects such as air bubbles.

[0047] In some embodiments, the support slots of the two support blocks 30 are asymmetrically designed, making it impossible to place the detector module 40 in reverse.

[0048] This allows for a foolproof design for product placement: the potting area is the gap between the PD and the scintillator 41, so there is a directional restriction when placing the product. The two sides of the support groove are asymmetrical, and when placed in the opposite direction, it cannot be placed all the way down due to interference from the components on the board.

[0049] In some embodiments, reference Figure 1 and Figure 2 The support block 30 is provided with a first fixing hole 31 that penetrates the support block 30, and the base plate 10 is provided with a second fixing hole 12 at the corresponding position. The support block 30 is fixedly mounted on the base plate 10 by passing through the first fixing hole 31 and extending into the second fixing hole 12 through a fixing member.

[0050] Specifically, the shapes of the first fixing hole 31 and the second fixing hole 12 are not limited, and the fasteners can be fixing screws or pins.

[0051] This allows for the fixed design of the support block 30: the support block 30 will not come into contact with the glue, and considering the stability of the product placement, it is fixed to the base plate 10 using fasteners.

[0052] In some embodiments, reference Figure 2 The support block 30 is provided with a positioning hole 23 at one end near the base plate 10, and a positioning pin 11 is provided at the corresponding position on the base plate 10; the support block 30 is matched and fixedly set on the base plate 10 by means of the coupling between the positioning hole 23 and the positioning pin 11.

[0053] In some embodiments, the glue-filling block 20 is located between the two support blocks 30, and the glue-filling block 20 is separated from the support blocks 30.

[0054] This allows for a three-section design: the glue-pouring block 20 and the support block 30 are separated in the middle, blocking capillary action, reducing the flow area of ​​the glue, and facilitating cleaning after use.

[0055] In some embodiments, the base plate 10 is made of 304 stainless steel, the potting block 20 is made of Teflon, and the support block 30 is made of acetal resin.

[0056] Specifically, the glue-filling block 20 is made of non-stick Teflon (PTFE) to facilitate glue cleaning, the support blocks 30 on both sides are made of high-strength acetal resin (POM) to ensure cost and support, and the base plate 10 is made of 304 stainless steel to ensure fixation and support.

[0057] In some embodiments, the glue-dispensing device has an overall width of 54mm, allowing for easy handling and placement of any support block 30 with one hand.

[0058] This design allows for convenient handling: the 54mm width allows for easy gripping with the thumb and forefinger, and the side support blocks 30 are fixed to the base plate 10, eliminating concerns about it falling off. (Reference) Figure 2 The base plate 10 is also provided with reinforcing ribs 13.

[0059] This application embodiment also provides a method for potting adhesive between the scintillator 41 and the photodiode 42 of a CT detector module 40. The method involves using the potting device provided in the aforementioned embodiment to pot adhesive between the scintillator 41 and the photodiode 42 of the CT detector module 40, specifically including:

[0060] 1) Place the glue block 20 on the base plate 10 according to the position of the positioning hole 23.

[0061] 2) Place the detector module 40 into the support groove of the support block 30 with the scintillator 41 facing the glue pool 21.

[0062] 3) Drip glue into glue pool 21 until the liquid surface contacts the detector module 40.

[0063] 4) Open the vacuum equipment chamber, put the dispensing device into the equipment and evacuate.

[0064] 5) After a preset time (e.g., 20 minutes), break the vacuum in the vacuum equipment and remove the dispensing device and product from the cavity.

[0065] 6) Remove the detector module 40 from the dispensing device and place it in an oven to heat and cure the adhesive.

[0066] 7) Remove the glue-filling block 20 and clean and wipe to remove any remaining glue residue from the surface.

[0067] For specific implementation methods, please refer to the above device embodiments, which will not be repeated here.

[0068] The apparatus and method provided in this application utilize vacuum equipment to rapidly extract gas from the gap. Under the action of capillary action, the adhesive can quickly fill the gap between the PD and the scintillator 41. Furthermore, the vacuum environment can eliminate defects such as air bubbles, improving the speed and quality of adhesive application. The specific beneficial effects include:

[0069] 1) This glue-filling device can use vacuum equipment to quickly extract the gas in the gap. Under the action of capillary effect, the glue can quickly fill the gap between PD and scintillator 41. In addition, the vacuum environment can eliminate defects such as air bubbles and improve the quality of glue filling.

[0070] 2) It is easy to handle, ergonomic, and uses a variety of materials to give full play to the advantages of each material. It is easy to clean after use, takes into account the stability of the structure, and saves costs.

[0071] 3) Numerous detailed designs facilitate cleaning after use.

[0072] Note that, unless otherwise explicitly stated, all features disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by alternative features for achieving the same, equivalent, or similar purpose. Therefore, unless explicitly stated otherwise, each disclosed feature is merely one example of a set of equivalent or similar features. Where used, "further," "preferably," "even further," and "more preferably" are simple starting points for describing another embodiment based on the foregoing embodiments, the combination of which with the foregoing embodiments constitutes the complete configuration of another embodiment. Any combination of several "further," "preferably," "even further," or "more preferably" settings following the same embodiment constitutes yet another embodiment.

[0073] Although this application has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of this application fall within the scope of protection claimed in this application.

Claims

1. A potting apparatus between a scintillator (41) and a photodiode (42) in a CT detector module (40), characterized in that, include: A base plate (10), and an adhesive block (20) and a support block (30) disposed on the base plate (10); wherein, The glue-filling block (20) has a glue pool (21) and a glue-filling groove (22) on the side away from the base plate (10). One end of the glue-filling groove (22) is connected to the glue pool (21), and the other end of the glue-filling groove (22) extends away from the glue pool (21). The glue-filling block (20) has a positioning hole (23) on the side away from the glue pool (21), and a positioning pin (11) is provided at the corresponding position on the base plate (10). The glue-filling block (20) is matched and fixedly set on the base plate (10) by means of the coupling between the positioning hole (23) and the positioning pin (11). There are two support blocks (30). On the side of the support block (30) away from the base plate (10), there is a protrusion that is higher than the surface of the glue block (20) away from the base plate (10). The protrusion has a support groove. The support grooves of the two support blocks (30) are arranged opposite to each other. The support grooves are used to accommodate the detector module (40). The support grooves of the two support blocks (30) are asymmetrically designed, so that the detector module (40) cannot be placed in reverse. When the detector module (40) is placed in the support groove, the scintillator (41) of the detector module (40) faces the glue pool (21), the gap between the scintillator (41) and the photodiode (42) is located above the glue potting groove (22), a part of the glue potting groove (22) is located directly below the gap, and the edges of the scintillator (41) and the photodiode (42) on both sides of the gap are in contact with the surface of the glue potting block (20) on both sides of the glue potting groove (22) directly below; The glue-filling device uses a vacuum device to quickly extract the gas in the gap. Under the action of capillary action, the glue can quickly fill the gap between the PD and the scintillator (41).

2. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 1, characterized in that, The base plate (10) is made of 304 stainless steel, the potting block (20) is made of Teflon, and the support block (30) is made of acetal resin.

3. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 1, characterized in that, The inner edges of the glue pool (21) and the glue filling tank (22) are both rounded.

4. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 3, characterized in that, There are at least two positioning pins (11) and at least two different sizes, and correspondingly there are at least two positioning holes (23) and at least two different sizes, to prevent the glue block (20) from being placed backwards.

5. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 1, characterized in that, The glue-filling block (20) is located between the two support blocks (30), and the glue-filling block (20) is separated from the support blocks (30).

6. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 1, characterized in that, The support block (30) is provided with a first fixing hole (31) that penetrates the support block (30), and the base plate (10) is provided with a second fixing hole (12) at the corresponding position. The support block (30) is fixedly installed on the base plate (10) by passing through the first fixing hole (31) and extending into the second fixing hole (12) through a fastener.

7. The potting apparatus between the scintillator (41) and photodiode (42) of the CT detector module (40) according to claim 6, characterized in that, The support block (30) has a positioning hole (23) at one end near the base plate (10), and a positioning pin (11) is provided at the corresponding position on the base plate (10). The support block (30) is fixedly mounted on the base plate (10) by means of the coupling between the positioning hole (23) and the positioning pin (11).

8. A method for potting adhesive between the scintillator (41) and photodiode (42) of a CT detector module (40) using the potting device between the scintillator (41) and photodiode (42) according to any one of claims 1 to 7, characterized in that, include: Place the glue block (20) on the base plate (10) according to the position of the positioning hole (23); Place the detector module (40) into the support groove of the support block (30) with the scintillator (41) facing the glue pool (21); Add glue to the glue pool (21) until the liquid surface contacts the detector module (40); Open the vacuum equipment chamber, place the dispensing device into the vacuum equipment and evacuate the vacuum; After a preset time, the vacuum equipment is broken, and the potting device and the detector module (40) are taken out from the cavity of the vacuum equipment.

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