Method, device, electronic device and storage medium for detecting abnormality in evaporation

Abstract

The present invention discloses a method, device, electronic device and storage medium for detecting evaporation anomalies, including: when there is an evaporation anomaly, determining whether there is an evaporation source with abnormal process parameters; if so, controlling a single evaporation source with abnormal process parameters to shut down, detecting whether the evaporation equipment has an evaporation anomaly, so as to determine the evaporation source with the evaporation anomaly; if not, sequentially controlling a single evaporation source among multiple evaporation sources to shut down, detecting whether the evaporation equipment has an evaporation anomaly, so as to determine the evaporation source with the evaporation anomaly. When there is an evaporation anomaly, first consider whether the process parameters of the evaporation source are abnormal. When the process parameters are normal, the evaporation source with the evaporation anomaly is screened out by shutting down a single evaporation source. The entire evaporation anomaly detection process is automated, and can detect evaporation anomalies and evaporation sources with evaporation anomalies in a timely manner, avoiding cost waste due to delayed detection, and improving the yield rate of panel production.

Description

Technical Field

[0001] The present invention relates to the field of OLED evaporation technology, and in particular to a evaporation abnormality detection method, device, electronic equipment and storage medium. Background Art

[0002] The OLED evaporation process is a process that uses the principle of evaporation to encapsulate OLED devices. During the OLED device evaporation process, after the organic thin film is fixed to the conductive substrate, electrodes need to be established on the substrate to conduct current in the OLED device.

[0003] When producing OLED panels, the cathode is generally formed by inorganic evaporation (such as Al) film formation. However, foreign matter defects often occur due to abnormalities in the evaporation source or exhaustion of its life. The film is thinner and the resistance is smaller at the location where the foreign matter is present. The current will tend to flow to the location with lower resistance, resulting in a larger leakage current at that location and higher brightness. Other locations with thicker films have no current flowing through them and do not emit light, which in turn affects the uniformity of the panel's light emission.

[0004] In the existing technology, panel quality inspection is often carried out after product production is completed. Other processes after the evaporation process may take 6-8 hours. By the time product production is completed, a large number of defective products may have been produced, which will seriously affect the panel production yield and manufacturing costs. Summary of the Invention

[0005] The present invention provides a method for detecting evaporation anomalies to solve the problem that delayed detection of evaporation anomalies will seriously affect the panel production yield and manufacturing cost.

[0006] In a first aspect, the present invention provides a method for detecting an evaporation anomaly, which is applied to an evaporation system. The evaporation system includes an evaporation device and a detection device. The evaporation device includes multiple evaporation sources. The detection device is provided with a current detector. The evaporation anomaly detection method includes:

[0007] When the detection device receives a panel processed by the evaporation device, it detects whether the evaporation device has an evaporation abnormality, specifically: judging whether the evaporation device has an evaporation abnormality according to leakage current data of the panel detected by the current detector;

[0008] When there is an abnormal evaporation, determine whether there is an evaporation source with abnormal process parameters;

[0009] If so, the evaporation source with the abnormal process parameter is controlled to shut down, and the evaporation equipment is detected to determine whether there is an evaporation abnormality, so as to determine the evaporation source with the abnormal evaporation;

[0010] If not, a single evaporation source among the plurality of evaporation sources is sequentially controlled to shut down, and the evaporation equipment is detected to determine whether there is evaporation abnormality, so as to determine the evaporation source with the evaporation abnormality.

[0011] In a second aspect, the present invention provides a device for detecting an abnormality in evaporation, comprising:

[0012] a first abnormality determination module, configured to detect whether the evaporation device has an abnormality in evaporation when the detection device receives a panel that has been evaporated by the evaporation device, specifically by determining whether the evaporation device has an abnormality in evaporation based on leakage current data of the panel detected by the current detector;

[0013] An evaporation source abnormality judgment module is used to determine whether there is an evaporation source with abnormal process parameters when there is an evaporation abnormality; if so, the content of the first evaporation source determination module is executed; if not, the content of the second evaporation source determination module is executed;

[0014] A first evaporation source determination module is used to control the shutdown of a single evaporation source with abnormal process parameters, detect whether the evaporation equipment has evaporation abnormalities, and determine the evaporation source with evaporation abnormalities;

[0015] The second evaporation source determination module is used to sequentially control a single evaporation source among the multiple evaporation sources to shut down, detect whether the evaporation equipment has evaporation abnormality, and determine the evaporation source with the evaporation abnormality.

[0016] In a third aspect, the present invention provides an electronic device, comprising:

[0017] at least one processor; and

[0018] a memory communicatively connected to the at least one processor; wherein,

[0019] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the evaporation abnormality detection method described in the first aspect of the present invention.

[0020] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a processor to implement the evaporation abnormality detection method described in the first aspect of the present invention when executed.

[0021] An embodiment of the present invention provides a method for detecting evaporation anomalies, which is applied to an evaporation system. The evaporation system includes an evaporation device and a detection device. The evaporation device includes multiple evaporation sources, and the detection device is provided with a current detector. The evaporation anomaly detection method includes: upon receiving a panel processed by the evaporation device, the detection device detects whether the evaporation device has an evaporation anomaly. Specifically, the method determines whether the evaporation device has an evaporation anomaly based on leakage current data of the panel detected by the current detector. The leakage current is used to determine film uniformity, and thus whether the evaporation anomaly exists.

[0022] When there is an evaporation abnormality, determine whether there is an evaporation source with abnormal process parameters; if so, control the shutdown of a single evaporation source with abnormal process parameters, and detect whether the evaporation equipment has evaporation abnormalities to determine the evaporation source with evaporation abnormalities; if not, control the shutdown of a single evaporation source among multiple evaporation sources in turn, and detect whether the evaporation equipment has evaporation abnormalities to determine the evaporation source with evaporation abnormalities. When there is an evaporation abnormality, first consider whether the process parameters of the evaporation source are abnormal. If the process parameters are normal, then screen out the evaporation source with evaporation abnormalities by shutting down a single evaporation source. The entire evaporation abnormality detection process is automated, eliminating the need for manual inspection, saving human resources, and since the inspection is performed immediately after the evaporation process, the evaporation abnormality and the evaporation source with evaporation abnormalities can be detected in a timely manner, avoiding cost waste due to delayed detection and improving the yield rate of panel production.

[0023] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 This is a flow chart of a method for detecting an abnormality in evaporation provided in the first embodiment of the present invention;

[0026] Figure 2 This is a schematic structural diagram of an evaporation system provided in Example 1 of the present invention;

[0027] Figure 3 This is a schematic structural diagram of an OLED provided by the first embodiment of the present invention when evaporation is abnormal;

[0028] Figure 4This is a flow chart of a method for detecting anomaly in evaporation provided by the second embodiment of the present invention;

[0029] Figure 5 This is a schematic structural diagram of a vapor deposition anomaly detection device provided in a third embodiment of the present invention;

[0030] Figure 6 It is a structural diagram of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0032] Example 1

[0033] Figure 1 This is a flow chart of a method for detecting an evaporation anomaly provided in Example 1 of the present invention. This embodiment is applicable to the situation where an evaporation anomaly is detected during an evaporation process. The method can be performed by an evaporation anomaly detection device. The evaporation anomaly detection device can be implemented in the form of hardware and / or software. The evaporation anomaly detection device can be configured in an electronic device.

[0034] like Figure 2 As shown, the evaporation system includes an evaporation device 10 and a detection device 20. The evaporation device 10 includes multiple evaporation sources 11, and the detection device 20 is provided with a current detector 21. The outlet of the evaporation device 10 can be connected to the inlet of the detection device 20, for example, by a transmission device. During the evaporation and detection process, the panel to be evaporated enters from the inlet of the evaporation device 10, moves above the evaporation source 11, and starts the evaporation source 11 to evaporate the panel. After the evaporation process, the panel is output from the outlet of the evaporation device 10 and then sent to the detection device 20 through the inlet of the detection device 20 for leakage current detection.

[0035] like Figure 1 As shown, the evaporation abnormality detection method includes:

[0036] S101 , when a detection device receives a panel that has been vapor-deposited by a vapor deposition device, the detection device detects whether there is any vapor deposition abnormality in the vapor deposition device.

[0037] Detecting whether the evaporation device has evaporation abnormality, specifically: judging whether the evaporation device has evaporation abnormality according to leakage current data of the panel detected by the current detector.

[0038] A panel includes multiple pixels, and a pixel can contain an OLED lamp bead. The leakage current data of the panel refers to the leakage current data of each pixel in the panel. The leakage current data of the pixel is related to the film uniformity of the electrode formed by evaporation, and the film uniformity of the electrode is related to the evaporation of the evaporation source. The specific principle is: evaporation is a method of heating the material in a vacuum environment to vaporize it and deposit it on the substrate to obtain a thin film material. Taking the evaporation source material Al (aluminum) as an example, when the evaporation source is abnormal, such as the heating time of the material is not enough or the evaporation temperature is not enough, the degree of Al vaporization is insufficient and small particles of some Al are formed. Figure 3 As shown, Figure 3 This is a structural diagram of an OLED when evaporation is abnormal. During the evaporation process, small Al particles evaporate upward and hit the substrate to form foreign matter. The Al film is thinner at the location where the foreign matter is present, and the resistance is smaller, such as Figure 3 The location corresponding to the current transmission path S2 in the middle. Since current has the characteristic of flowing toward the direction of smaller resistance, the current in other locations cannot flow through. The current through the current transmission path S2 is larger, while the current transmission path S1 has no current flowing, resulting in a larger leakage current of the OLED.

[0039] Therefore, the panel's leakage current data, as detected by the current detector, can be used to determine whether the evaporation equipment is experiencing an evaporation anomaly. Specifically, a leakage current threshold can be pre-set; when the panel's leakage current data exceeds the threshold, an evaporation anomaly is considered present. The leakage current threshold can be set based on the type and structure of the OLEDs in the panel, as well as historical quality inspection data, and is not limited in this regard by the present invention.

[0040] It should be noted that the pixels in the panel are generally arranged in a matrix form, and each pixel is externally connected to a test pin. When detecting leakage current of the pixels in the panel, the leakage current of all pixels can be detected.

[0041] S102: When there is an abnormal evaporation, determine whether there is an evaporation source with abnormal process parameters.

[0042] The process parameters of the evaporation source may include evaporation rate, evaporation temperature, nozzle size and nozzle height, etc. These process parameters can affect the evaporation effect. When there are abnormal process parameters, it may cause evaporation abnormality. For example, when the nozzle height is too high or the substrate material is thick, the distance between the nozzle and the substrate may be close, and the transmission distance of the vaporized material is short, making it difficult for the vaporized material to disperse and hit the substrate, resulting in uneven film thickness. Therefore, when there is an evaporation abnormality, it can be determined whether there is an evaporation source with abnormal process parameters. If so, execute S103, otherwise execute S104.

[0043] The specific process parameters required can be obtained through machine detection or manual measurement. For vapor deposition processing, a standard file of process parameters is generally pre-set. After the process parameters are obtained, the standard file can be used to determine whether the process parameters are abnormal.

[0044] S103 , controlling the evaporation source with a single abnormal process parameter to shut down, detecting whether the evaporation equipment has evaporation abnormality, and determining the evaporation source with the evaporation abnormality.

[0045] When there is an evaporation source with abnormal process parameters, and there is at least one such source, it is possible to first verify whether the abnormal evaporation source is the cause of the evaporation abnormality and then shut down the single abnormal evaporation source. This is done by employing a control variable method to determine the evaporation source with the abnormal evaporation parameter. Specifically, assuming there are multiple evaporation sources with abnormal process parameters, only the first one with the abnormal process parameter is shut down, and the evaporation equipment is checked for abnormal evaporation. If no abnormality is detected, only the second one with the abnormal process parameter is shut down. In other words, only one abnormal evaporation source is shut down at a time, and this cycle continues. If no abnormality is detected in the evaporation equipment, the currently shut down evaporation source is the one with the abnormal evaporation parameter.

[0046] S104 , sequentially controlling individual evaporation sources among the plurality of evaporation sources to shut down, detecting whether the evaporation equipment has evaporation abnormality, and determining the evaporation source with the evaporation abnormality.

[0047] When there is no evaporation source with abnormal process parameters, it can be considered that any of the evaporation sources may be abnormal. That is, the control variable method can also be used to determine the evaporation source with abnormal evaporation. The specific method is the same as the method for screening out evaporation sources with abnormal evaporation in S103 above, and reference can be made to S103.

[0048] In S103 and S104 , detecting whether the evaporation equipment has evaporation abnormality to determine the evaporation source with evaporation abnormality includes: detecting whether the evaporation equipment has evaporation abnormality, and if not, determining that the currently stopped evaporation source has evaporation abnormality.

[0049] It should be noted that evaporation sources with abnormal process parameters are generally a minority, and at this time, the evaporation sources with abnormal process parameters are most likely to have abnormal evaporation. When screening a small number of evaporation sources with abnormal process parameters, it is purposeful and the efficiency of fault screening is higher than the efficiency of blindly screening all evaporation sources for faults.

[0050] An embodiment of the present invention provides a method for detecting evaporation anomalies, which is applied to an evaporation system. The evaporation system includes an evaporation device and a detection device. The evaporation device includes multiple evaporation sources, and the detection device is provided with a current detector. The evaporation anomaly detection method includes: upon receiving a panel processed by the evaporation device, the detection device detects whether the evaporation device has an evaporation anomaly. Specifically, the method determines whether the evaporation device has an evaporation anomaly based on leakage current data of the panel detected by the current detector. The leakage current is used to determine film uniformity, and thus whether the evaporation anomaly exists.

[0051] When there is an evaporation abnormality, determine whether there is an evaporation source with abnormal process parameters; if so, control the shutdown of a single evaporation source with abnormal process parameters, and detect whether the evaporation equipment has evaporation abnormalities to determine the evaporation source with evaporation abnormalities; if not, control the shutdown of a single evaporation source among multiple evaporation sources in turn, and detect whether the evaporation equipment has evaporation abnormalities to determine the evaporation source with evaporation abnormalities. When there is an evaporation abnormality, first consider whether the process parameters of the evaporation source are abnormal. If the process parameters are normal, then screen out the evaporation source with evaporation abnormalities by shutting down a single evaporation source. The entire evaporation abnormality detection process is automated, eliminating the need for manual inspection, saving human resources, and since the inspection is performed immediately after the evaporation process, the evaporation abnormality and the evaporation source with evaporation abnormalities can be detected in a timely manner, avoiding cost waste due to delayed detection and improving the yield rate of panel production.

[0052] Example 2

[0053] Figure 4 This is a flow chart of a method for detecting abnormal evaporation provided in the second embodiment of the present invention. The embodiment of the present invention is optimized based on the above-mentioned first embodiment. Figure 4 As shown, the evaporation abnormality detection method includes:

[0054] S401 , when a detection device receives a panel that has been vapor-deposited by a vapor deposition device, the detection device detects whether there is any vapor deposition abnormality in the vapor deposition device.

[0055] Among them, at least two current detectors are provided on the detection device. There are two situations in which at least two current detectors are provided on the detection device. One is that the detection device includes at least two detection lines (sharing one evaporation device), and each detection line is equipped with a current detector; the other is that one detection device is equipped with at least two current detectors, and the panel entering the detection device can be tested multiple times. Judging whether there is an evaporation abnormality in the evaporation device based on the leakage current data of the panel detected by the current detector includes: judging whether there is an abnormality in leakage current data based on the leakage current data of the panel detected by the current detector; when there is an abnormality in leakage current data, judging whether the number of current detectors that detect the abnormal leakage current data is 1; if so, determining that the current detector is abnormal, and controlling the current detector that detects the abnormal current data to shut down; if not, determining that there is an abnormality in the evaporation device. When the current detector is shut down, the current detector can be inspected to see if the power supply, sensor, etc. of the current detector have been replaced. After the current detector is shut down, the evaporation device can be re-detected for an abnormality in evaporation.

[0056] In one optional example, determining whether leakage current data abnormality exists based on leakage current data of the panel detected by a current detector includes: determining leakage current data greater than a preset leakage current threshold in the leakage current data of the panel detected by the current detector as bad data; and determining that leakage current data abnormality exists when M bad data exist among N consecutive leakage current data; wherein N and M are positive integers and M < N. It should be noted that this method can also be used for detection in other detection methods, which are not described here one by one.

[0057] Pixels in a panel are typically arranged in a matrix. Pixel leakage current is typically detected in row or column order. If leakage currents exceed a preset threshold for M pixels out of N consecutive pixels, the panel or equipment is experiencing an evaporation anomaly.

[0058] In an optional example, N is equal to 4 and M is equal to 3.

[0059] In another optional example, the leakage current threshold is 100 mA.

[0060] S402: When an evaporation abnormality occurs, determine whether the evaporation source has been replaced within a preset time period.

[0061] The replacement of the evaporation source includes the following situations: one is that the material in the evaporation source has been used up and new material needs to be added or the material package needs to be replaced; the other is that there is an abnormality in the evaporation source and it is directly replaced with another evaporation source. After the evaporation source is replaced, the evaporation source can also be heated and pre-treated separately to make the conditions of the replaced evaporation source similar to those of other evaporation sources, thereby achieving the same evaporation effect. The heating pretreatment process of the evaporation source requires a certain amount of time. Only when the heating time is sufficient can the material reach the vaporization level. If the heating time is not enough, the material may not be completely vaporized. Therefore, when an evaporation abnormality occurs, it can be considered whether the evaporation source has been replaced in the recent period, that is, whether the evaporation abnormality is caused by insufficient heating after the evaporation source is replaced. If so, execute S403-S405. If not, execute S406.

[0062] The preset time period may be the time required for the material to vaporize at a normal heating temperature, or the time required for pre-processing the evaporation source after replacement. In an optional example, the preset time period is 1 hour.

[0063] S403: Perform a delayed heating process on the replaced evaporation source.

[0064] If a deposition anomaly occurs and the evaporation source has been replaced within a preset timeframe, it can be prioritized as insufficient heating leading to incomplete material vaporization. Therefore, a delayed heating process is performed on the replaced evaporation source, further heating it to improve the degree of material vaporization. Specifically, the delayed heating process can last 30 minutes.

[0065] S404: Detect whether there is any abnormality in the evaporation equipment.

[0066] It should be noted that the detection of whether the evaporation equipment has evaporation abnormalities refers to the detection of a new panel when it is put into the evaporation equipment and then output to the detection equipment. If yes, proceed to S405, if not, proceed to S406.

[0067] It should be noted that when detecting whether there is evaporation abnormality in the evaporation equipment, a certain number of panels can usually be put into use for verification instead of just one panel. In an optional example, in addition to the initial detection of whether there is evaporation abnormality in the evaporation equipment, in the subsequent process of detecting whether there is evaporation abnormality in the evaporation equipment, 9 panels are put into use each time to detect whether there is evaporation abnormality in the evaporation equipment.

[0068] S405: Determine whether the execution times of the delayed heating process are less than a preset number.

[0069] In this embodiment, considering that the degree of material vaporization may vary between replaced evaporation sources, a preset number of delayed heating steps are implemented to improve the degree of material vaporization in the evaporation source. If the delayed heating step is executed less than the preset number of times, it is assumed that heating is still insufficient, and the process returns to S403. If the delayed heating step is executed more than or equal to the preset number of times, other factors are considered and the process proceeds to S406.

[0070] The total duration of executing the delayed heating process for a preset number of times can be the maximum time required for the material to vaporize at normal heating temperature. In an optional example, the maximum time required for the material to vaporize at normal heating temperature is 90 minutes, the preset number of times is 3 times, and the single delayed heating process is 30 minutes.

[0071] S406: Determine whether there is an evaporation source with abnormal process parameters.

[0072] If yes, execute S407, if no, execute S408.

[0073] S407 , controlling the evaporation source with a single abnormal process parameter to shut down, detecting whether the evaporation equipment has an abnormal evaporation, and determining the evaporation source with the abnormal evaporation.

[0074] S408 , sequentially controlling individual evaporation sources among the plurality of evaporation sources to shut down, detecting whether the evaporation equipment has evaporation abnormality, and determining the evaporation source with the evaporation abnormality.

[0075] S406-S408 are the same as S102-S104 in the first embodiment. For details, please refer to S102-S104 and will not be described here.

[0076] S409. After determining that there is an evaporation source with abnormal evaporation, the panel that has been subjected to evaporation processing after the evaporation source is shut down is sent back to the evaporation equipment for evaporation thickness correction. In the above steps, if the evaporation source is shut down, the evaporation thickness of the panel may be insufficient. Therefore, the panel that has been subjected to evaporation processing after the evaporation source is shut down needs to be returned for processing, that is, it is sent back to the evaporation equipment for evaporation thickness correction. During the evaporation thickness correction stage, the nozzle height, nozzle size, etc. can be specifically controlled to meet the standard requirements for evaporation thickness correction. For example, the standard requirement for thickness correction is: in the corrected panel, the proportion of pixels whose leakage current is greater than the preset leakage current threshold should be less than 1%.

[0077] S410: Put a preset verification batch of panels into the evaporation equipment in sequence for evaporation processing.

[0078] If an evaporation source is confirmed to be abnormally depositing, it can be replaced with a new one or a replacement material package to restore normal deposition. To confirm that the evaporation equipment is functioning properly, a predetermined number of panels are sequentially placed into the evaporation equipment for verification. In one example, the predetermined number of panels is 100.

[0079] S411, detecting whether there is any abnormality in the evaporation equipment.

[0080] If yes, execute S413; if no, execute S412.

[0081] S412, controlling the evaporation equipment to continue working.

[0082] S413, controlling the evaporation equipment to stop.

[0083] If no deposition anomalies are detected in the pre-determined number of panels in the validation batch, the deposition anomaly issue with the deposition equipment has been resolved, and the panel deposition process can proceed. After the panel deposition process continues, the order of each step can be adjusted to optimize the efficiency of deposition anomaly detection.

[0084] If evaporation abnormalities appear in the panels of the preset verification batch number, it means that there are other problems with the evaporation equipment. For example, the failure may be in a location other than the evaporation source. At this time, the evaporation equipment will be shut down and further repaired.

[0085] Example 3

[0086] Figure 5 This is a schematic diagram of the structure of a vapor deposition abnormality detection device provided in the third embodiment of the present invention. Figure 5 As shown, the evaporation abnormality detection device includes:

[0087] The first abnormality determination module 501 is configured to detect whether the evaporation device has an abnormality in evaporation when the detection device receives a panel that has been evaporated by the evaporation device. Specifically, the module determines whether the evaporation device has an abnormality in evaporation based on leakage current data of the panel detected by the current detector.

[0088] The evaporation source abnormality determination module 502 is used to determine whether there is an evaporation source with abnormal process parameters when there is an evaporation abnormality; if so, the content of the first evaporation source determination module is executed; if not, the content of the second evaporation source determination module is executed;

[0089] A first evaporation source determination module 503 is configured to control a single evaporation source with abnormal process parameters to shut down, detect whether the evaporation equipment has evaporation abnormalities, and determine the evaporation source with the abnormal evaporation;

[0090] The second evaporation source determination module 504 is configured to sequentially control a single evaporation source among the plurality of evaporation sources to shut down, detect whether the evaporation equipment has an evaporation abnormality, and determine the evaporation source with the evaporation abnormality.

[0091] In an optional embodiment, the detection device is provided with at least three current detectors, and the first abnormality determination module 501 includes:

[0092] a leakage current judging submodule, for judging whether there is leakage current data anomaly based on leakage current data of the panel detected by the current detector;

[0093] The quantity determination submodule is used to determine whether the number of the current detectors that detect the leakage current data abnormality is 1 when there is leakage current data abnormality; if so, the contents of the current detector shutdown submodule are executed, and if not, the contents of the first evaporation abnormality submodule are executed;

[0094] A current detector shutdown submodule, configured to control the current detector to shut down when abnormal leakage current data is detected;

[0095] The first evaporation abnormality submodule is used to determine whether the evaporation equipment has an evaporation abnormality.

[0096] In an optional embodiment, the leakage current judgment submodule includes:

[0097] a bad data determining unit, configured to take leakage current data of the panel detected by the current detector that is greater than a preset leakage current threshold as bad data;

[0098] a leakage current determining unit, configured to determine that leakage current data is abnormal when M bad data exist in N consecutive leakage current data;

[0099] Wherein, N and M are positive integers, and M<N.

[0100] In an optional embodiment, the evaporation abnormality detection device further includes:

[0101] The evaporation source replacement judgment module is used to judge whether the evaporation source has been replaced within the past preset time period; if so, the content of the delayed heating module is executed; if not, the content of the second abnormality judgment module is executed.

[0102] A delayed heating module is used to perform a delayed heating process on the replaced evaporation source;

[0103] The second abnormality determination module is used to detect whether the evaporation device has an evaporation abnormality; if so, the content of the number determination module is executed; if not, the content of the evaporation source abnormality determination module 502 is executed;

[0104] The number determination module is used to determine whether the number of executions of the delayed heating process is less than a preset number.

[0105] In an optional embodiment, the first evaporation source determination module 503 and the second evaporation source determination module 503 both include:

[0106] An abnormality detection submodule is used to detect whether there is an abnormality in the evaporation equipment, and if not, the content of the second submodule;

[0107] The second evaporation abnormality submodule is used to determine whether the evaporation source currently shut down has an evaporation abnormality.

[0108] In an optional embodiment, the evaporation abnormality detection device further includes:

[0109] The thickness correction module is used to send the panel that has been subjected to evaporation processing after a single evaporation source is shut down back into the evaporation equipment for evaporation thickness correction.

[0110] In an optional embodiment, the evaporation abnormality detection device further includes:

[0111] A verification module, used to sequentially place a preset verification batch of panels into the evaporation equipment for evaporation processing;

[0112] The third abnormality judgment module is used to detect whether the evaporation equipment has an evaporation abnormality. If so, the content of the evaporation processing module is executed; if not, the content of the equipment shutdown module is executed;

[0113] an evaporation processing module, used for controlling the evaporation equipment to continue working;

[0114] The equipment shutdown module is used to control the evaporation equipment to shut down.

[0115] The evaporation anomaly detection device provided in the embodiment of the present invention can execute the evaporation anomaly detection method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0116] Example 4

[0117] Figure 6A schematic block diagram of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are provided as examples only and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0118] like Figure 6 As shown, the electronic device 40 includes at least one processor 41 and a memory, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., which is communicatively connected to the at least one processor 41. The memory stores a computer program that can be executed by the at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 into the random access memory (RAM) 43. Various programs and data required for the operation of the electronic device 40 can also be stored in the RAM 43. The processor 41, ROM 42, and RAM 43 are connected to each other via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0119] Multiple components in the electronic device 40 are connected to the I / O interface 45, including an input unit 46, such as a keyboard, a mouse, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a magnetic disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0120] The processor 41 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any other suitable processor, controller, microcontroller, etc. The processor 41 executes the various methods and processes described above, such as the evaporation anomaly detection method.

[0121] In some embodiments, the evaporation anomaly detection method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the evaporation anomaly detection method described above can be performed. Alternatively, in other embodiments, the processor 41 can be configured to execute the evaporation anomaly detection method by any other appropriate means (e.g., by means of firmware).

[0122] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0123] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0124] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0125] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0126] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0127] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0128] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0129] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for detecting anomaly in evaporation, characterized in that: Applied to an evaporation system, the evaporation system includes an evaporation device and a detection device, the evaporation device includes multiple evaporation sources, and the detection device is provided with a current detector. The evaporation abnormality detection method includes: When the detection device receives a panel processed by the evaporation device, it detects whether the evaporation device has an evaporation abnormality, specifically: judging whether the evaporation device has an evaporation abnormality according to leakage current data of the panel detected by the current detector; When there is an abnormal evaporation, determine whether there is an evaporation source with abnormal process parameters; If so, the evaporation source with the abnormal process parameter is controlled to shut down, and the evaporation equipment is detected to determine whether there is an evaporation abnormality, so as to determine the evaporation source with the abnormal evaporation; If not, a single evaporation source among the plurality of evaporation sources is sequentially controlled to shut down, and the evaporation equipment is detected to determine whether there is evaporation abnormality, so as to determine the evaporation source with the evaporation abnormality.

2. The vapor deposition abnormality detection method according to claim 1, wherein: The detection device is provided with at least two current detectors, and the method of judging whether the evaporation device has evaporation abnormality according to the leakage current data of the panel detected by the current detectors includes: determining whether there is leakage current data abnormality according to leakage current data of the panel detected by the current detector; When the leakage current data is abnormal, determining whether the number of the current detectors that detect the leakage current data abnormality is one; If so, controlling the current detector that detects abnormal leakage current data to shut down; If not, it is determined that the evaporation equipment has evaporation abnormality.

3. The vapor deposition abnormality detection method according to claim 2, wherein: The determining whether there is leakage current data abnormality according to the leakage current data of the panel detected by the current detector includes: taking leakage current data of the panel detected by the current detector that is greater than a preset leakage current threshold as bad data; When there are M bad data among N consecutive leakage current data, it is determined that there is leakage current data abnormality; Wherein, N and M are positive integers, and M<N.

4. The vapor deposition abnormality detection method according to claim 1, wherein: Before the step of determining whether there is an evaporation source with abnormal process parameters, the method further includes: Determine whether there has been an evaporation source replacement within the past preset time period; If so, perform a delayed heating process on the replaced evaporation source; Detecting whether there is evaporation abnormality in the evaporation equipment; If there is an abnormal evaporation, determining whether the number of executions of the delayed heating process is less than a preset number; If yes, return to the step of performing a delayed heating process on the replaced evaporation source; If not, the step of determining whether there is an evaporation source with abnormal process parameters is performed.

5. The vapor deposition abnormality detection method according to claim 1, wherein: The detecting whether the evaporation device has evaporation abnormality to determine the evaporation source having the evaporation abnormality includes: Detecting whether the evaporation equipment has evaporation abnormalities, If not, it is determined that the currently stopped evaporation source has an evaporation abnormality.

6. The vapor deposition abnormality detection method according to any one of claims 1 to 5, characterized in that: After determining the evaporation source with abnormal evaporation, the following steps are also included: The panel that has been subjected to evaporation processing after the evaporation source is shut down is sent back into the evaporation equipment to correct the evaporation thickness.

7. The vapor deposition abnormality detection method according to claim 6, wherein: After the panel that has been subjected to evaporation processing after the single evaporation source is shut down is re-sent into the evaporation equipment to correct the evaporation thickness, the method further includes: Putting a preset verification batch of panels into the evaporation equipment in sequence for evaporation processing; Detecting whether the evaporation equipment has evaporation abnormalities, If yes, controlling the evaporation equipment to continue working; If not, the evaporation equipment is controlled to stop.

8. A vapor deposition abnormality detection device, characterized in that: include: The first abnormality determination module is configured to detect whether the evaporation device has an abnormality in evaporation when the detection device receives a panel that has been evaporated by the evaporation device. Specifically, the module determines whether the evaporation device has an abnormality in evaporation based on leakage current data of the panel from a current detector. An evaporation source abnormality judgment module is used to judge whether there is an evaporation source with abnormal process parameters when there is an evaporation abnormality; If yes, execute the content of the first evaporation source determination module; if no, execute the content of the second evaporation source determination module; A first evaporation source determination module is used to control the shutdown of a single evaporation source with abnormal process parameters, detect whether the evaporation equipment has evaporation abnormalities, and determine the evaporation source with evaporation abnormalities; The second evaporation source determination module is used to sequentially control a single evaporation source among the multiple evaporation sources to shut down, detect whether the evaporation equipment has evaporation abnormality, and determine the evaporation source with the evaporation abnormality.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the vapor deposition abnormality detection method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the vapor deposition abnormality detection method according to any one of claims 1 to 7 when executed.

Images