Multilayer electrical assembly
By designing laterally offset capacitor layer gaps in multilayer capacitors, the electrostrictive force and piezoelectric force are distributed, solving the problem of stress fracture under high voltage and high frequency, and realizing a more robust multilayer capacitor design.
Patent Information
- Application Number
- CN202310385446.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-02
- Filing Date
- 2023-04-12
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2043-04-12
AI Technical Summary
Existing multilayer ceramic capacitors are susceptible to stress cracking in high-voltage and high-frequency applications, leading to a decline in robustness and performance.
By designing laterally offset capacitor layer gaps in multilayer electrical components, electrostrictive and piezoelectric forces are distributed, reducing stress concentration. Multiple capacitor layers are formed using dielectrics and multiple parallel plate electrodes to ensure that the total capacitance is equal or that some capacitor layers have different capacitances, thus reducing stress concentration.
It improves the robustness of multilayer electrical components, enabling stable operation at higher voltages and frequencies and reducing the risk of breakdown.
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Figure CN116994878B_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to multilayer electrical components, such as capacitors and rheostats, with improved robustness and performance. Background Technology
[0002] Multilayer ceramic capacitors (MLCCs) typically consist of multiple parallel-plate electrodes, also referred to here as "electrodes," embedded within a ceramic dielectric body. Multiple portions of the dielectric are separated by adjacent electrodes connected to conductive terminations of opposite polarity covering the end portions of the dielectric. MLCC capacitors can be surface-mounted onto printed circuit boards using reflow soldering or other surface mount techniques for a variety of applications, particularly high-voltage and high-frequency applications.
[0003] Existing technology Figure 1 An MLCC 100 is illustrated, comprising a plurality of parallel plate electrodes embedded in a dielectric 102 covered by conductive terminals 104, 106. Each electrode includes a plurality of electrically isolated plate portions 108, 110 located in a common plane. The last plate of the odd-numbered electrodes is connected to terminal 104, while the last plate of the even-numbered electrodes is connected to another terminal 106. The overlapping plate portions of adjacent electrodes form a series of capacitor arrangements (e.g., C1, C3, and C5) between the terminals, in parallel with another series of capacitor arrangements (e.g., C2, C4, and C6) between the terminals. Each series capacitor reduces a portion of the voltage applied across the conductive terminals. However, these and other MLCCs are susceptible to stress fracture due to piezoelectric or electrostrictive forces along the common boundary between adjacent series capacitors (e.g., the boundary between capacitors C1, C3, and C5 aligned with the boundary between capacitors C2, C4, and C6), which is associated with a gap 111 separating the plate portions of adjacent electrodes. In applications where MLCCs are subjected to high voltage and high frequency, stress cracking is exacerbated. Therefore, there is a need for multilayer capacitors with improved robustness and performance. Summary of the Invention
[0004] One aspect of this application relates to a multilayer electrical component, the multilayer electrical component comprising: a dielectric; a first conductive terminal and a second conductive terminal separated by the dielectric; a plurality of parallel plate electrodes embedded in the dielectric, the dielectric and the plurality of parallel plate electrodes forming: a first capacitor layer, the first capacitor layer including a first series of capacitors between the first conductive terminal and the second conductive terminal; a second capacitor layer, the second capacitor layer being parallel to and adjacent to the first capacitor layer, the second capacitor layer including a second series of capacitors between the first conductive terminal and the second conductive terminal, wherein one or more capacitors in the first capacitor layer have a different capacitance value than adjacent capacitors in the second capacitor layer, wherein the total capacitance of the first capacitor layer is equal to the total capacitance of the second capacitor layer.
[0005] Another aspect of this application relates to a multilayer electrical assembly comprising: a dielectric; a first conductive terminal and a second conductive terminal separated by the dielectric; a first series of capacitors located between the first conductive terminal and the second conductive terminal, the first series of capacitors including a first parallel plate electrode separated from a second parallel plate electrode by a portion of the dielectric, the first parallel plate electrode including two electrically isolated plate portions in a common plane, and the second parallel plate electrode including a plate portion overlapping the two plate portions of the first parallel plate electrode; and a second series of capacitors located between the first conductive terminal and the second conductive terminal, the second series of capacitors including a second parallel plate electrode separated from a third parallel plate electrode by a portion of the dielectric, the third parallel plate electrode including two electrically isolated plate portions in a common plane, the plate portion of the second parallel plate electrode overlapping the two plate portions of the third parallel plate electrode, and a gap separating the two plate portions of the first parallel plate electrode being laterally offset relative to a gap separating the two plate portions of the third parallel plate electrode.
[0006] Another aspect of this application relates to a multilayer electrical component, the multilayer electrical component comprising: a dielectric body; a first conductive terminal and a second conductive terminal, the first conductive terminal and the second conductive terminal being separated by the dielectric body; a plurality of parallel plate electrodes embedded in the dielectric body, the dielectric body and the plurality of parallel plate electrodes forming: a plurality of capacitor layers, each of the plurality of capacitor layers including a series of capacitors between the first conductive terminal and the second conductive terminal, each capacitor of the plurality of capacitor layers being partially defined by a gap in one of the plurality of parallel plate electrodes; wherein the gap of one of the plurality of capacitor layers is laterally offset relative to the gap of an adjacent capacitor layer, and the total capacitance of each of the plurality of capacitor layers is equal. Attached Figure Description
[0007] The objects, features, and advantages of this disclosure will become fully apparent from the following detailed description taken in conjunction with the accompanying drawings and the appended claims. The drawings depict only exemplary embodiments and are therefore not intended to limit the scope of this disclosure.
[0008] Figure 1 This is a schematic cross-sectional view of a multilayer ceramic capacitor in the prior art.
[0009] Figure 2 It is a schematic cross-sectional view of a multilayer electrical assembly including multiple capacitor layers, each having two capacitors in series.
[0010] Figure 3 It is a schematic cross-sectional view of a multilayer electrical assembly comprising multiple capacitor layers, each having four capacitors in series.
[0011] Figure 4 This is another schematic cross-sectional view of an alternative multilayer electrical assembly, which includes multiple capacitor layers, each having three series capacitors.
[0012] Those skilled in the art will recognize that the accompanying drawings are for simplicity and clarity and may therefore be drawn out of scale and may not include well-known features; unless otherwise specified, the order in which actions or steps occur may differ from the order described or the steps or actions may be performed simultaneously; and the terms and expressions used herein have the meanings understood by those skilled in the art, unless different meanings are attributed to them herein. Detailed Implementation
[0013] This disclosure generally relates to multilayer electrical components, particularly those like capacitors and rheostats, that offer improved robustness and performance. These multilayer electronic components typically include a dielectric separated by conductive terminals connected to a plurality of parallel-plate electrodes embedded within the dielectric. Typical implementations are further described herein.
[0014] The composition of dielectric materials is typically selected based on operating temperature range, temperature stability, energy density, loss factor, and relative permittivity, along with other requirements or specifications of multilayer electrical components. Suitable dielectric materials include ceramics and porcelains, along with other known and future materials. Typical ceramics include barium titanate and additives (such as glass and rare earth materials). Another typical ceramic includes bismuth ferrite, strontium titanate, and additives (such as barium titanate along with other elements and compounds). Other typical ceramics may include magnesium titanate, neodymium titanate, strontium titanate, or calcium zirconate, along with other compounds. Currently, ceramics are favored because they can be formed into powders by sintering during the manufacture of electrical components.
[0015] Electrodes can be formed of noble or base metals. Conductive terminals can be implemented as caps formed on opposite sides or end portions of the dielectric. Terminals can also comprise base or noble metals. Typical examples include: electroplated silver, copper, palladium / silver, along with other metals and alloys. Terminals can also comprise metallic and non-metallic materials. Multilayer electrical components (e.g., capacitors, rheostats, etc.) can be configured for surface mounting with or without leads, for through-hole mounting, or for some other known or future mounting techniques.
[0016] According to one aspect of this disclosure, a multilayer electrical assembly is provided, comprising: a first conductive terminal and a second conductive terminal separated by a dielectric, and a plurality of parallel plate electrodes embedded in the dielectric. The dielectric and the plurality of parallel plate electrodes form a plurality of capacitor layers, each capacitor layer including a series of capacitors between the first conductive terminal and the second conductive terminal. Each individual capacitor in a capacitor layer is at least partially defined by a gap in one of the electrodes, wherein the gap of at least one capacitor layer is laterally offset relative to the gaps of adjacent capacitor layers. The lateral offset of the gap distributes electrostrictive forces and piezoelectric forces that can apply stress to the multilayer electrical assembly, thereby reducing the likelihood of failure. With this configuration, the multilayer electrical assembly can also operate at higher applied voltages without breakdown.
[0017] In another implementation, the dielectric and the plurality of parallel plate electrodes form a plurality of capacitor layers disposed in parallel between a first conductive terminal and a second conductive terminal. Each capacitor layer includes a corresponding series of capacitors between the first and second conductive terminals. One or more capacitors in at least one capacitor layer have a different capacitance value than adjacent capacitors in adjacent capacitor layers. The total capacitance of each capacitor layer in the plurality of capacitor layers is equal. However, in some implementations, the lowest or highest capacitor layer may have a different total capacitance than the other capacitor layers to prevent or reduce surface flashover. The distribution of electrostrictive and piezoelectric forces among adjacent capacitor layers with different adjacent capacitances can exert stress on the multilayer electrical assembly, thereby reducing the likelihood of failure. With this configuration, the multilayer electrical assembly can also operate under higher applied voltages without breakdown.
[0018] exist Figure 2 In this multilayer electrical assembly 200, multiple electrodes are embedded in a dielectric 201, forming multiple capacitor layers. A first capacitor layer includes a first series of capacitors C1 and C2, a second capacitor layer includes a second series of capacitors C3 and C4, a third capacitor layer includes a third series of capacitors C5 and C6, and a fourth capacitor layer includes a fourth series of capacitors C7 and C8. More generally, the multilayer electrical assembly may include more or fewer capacitor layers. All capacitor layers are arranged parallel to each other between conductive terminals 202 and 204. In the first and second adjacent capacitor layers, adjacent capacitors C1 and C3 have different capacitance values, and adjacent capacitors C2 and C4 have different capacitance values. Similarly, in the third and fourth adjacent capacitor layers, adjacent capacitors C5 and C7 have different capacitance values, and adjacent capacitors C6 and C8 have different capacitance values. However, the total capacitance of the capacitor layers is equal (e.g., C1 + C2 = C3 + C4, ...). Some adjacent capacitors in adjacent capacitor layers may have the same capacitance value. Figure 2 For example, adjacent capacitors C3 and C5 have the same capacitance value, and capacitors C4 and C6 have the same capacitance value. Furthermore, as mentioned above, in some implementations, the lowest and highest side capacitor layers may have a different total capacitance than the other capacitor layers to prevent or reduce surface flashover.
[0019] exist Figure 2In this configuration, capacitors C1 and C4 have the same capacitance value, and capacitors C2 and C3 have the same capacitance value, but the arrangement order of these capacitors with common values in the corresponding series between terminals 202 and 204 is reversed. More generally, however, if the total capacitance of the capacitor layers is equal, then the individual series capacitors in adjacent capacitor layers can have different capacitance values. Furthermore, if at least some adjacent capacitors in adjacent capacitor layers have different capacitance values, then the arrangement order of the capacitors in that series can be mixed, rather than reversed. The individual series capacitors in each capacitor layer are separated by corresponding gaps. At least some of the gaps in adjacent capacitor layers are laterally offset due to the different capacitance values or different arrangements of the individual capacitors in adjacent capacitor layers.
[0020] exist Figure 2 In this capacitor layer, the first capacitor layer includes a first parallel plate electrode separated from the second parallel plate electrode by a portion of a dielectric material. The first parallel plate electrode includes two electrically isolated plate portions 211 and 213, and the second parallel plate electrode includes a floating plate portion 214. The floating plate portion 214 overlaps with the two plate portions 211 and 213, and the overlapping plate portion forms a first series of capacitors C1 and C2. Similarly, the second capacitor layer includes a second parallel plate electrode separated from the third parallel plate electrode by a portion of a dielectric material. The third parallel plate electrode includes two electrically isolated plate portions 215 and 217. The floating plate portion 214 overlaps with the two plate portions 215 and 217 of the third parallel plate electrode, and the overlapping plate portion forms a second series of capacitors C3 and C4. The gap 220 separating the two plate portions 211 and 213 of the first parallel plate electrode is laterally offset relative to the gap 222 separating the two plate portions 215 and 217 of the third parallel plate electrode. Laterally shifting the gap between series capacitors in adjacent capacitor layers distributes electrostrictive and piezoelectric forces over a larger volume of the multilayer electrical component, resulting in a more robust component that is less likely to fail and can operate at higher voltages and frequencies. Figure 2 In this implementation, the gap 224 between series capacitors C7 and C8 is aligned with the gap 220 between series capacitors C1 and C2. However, in other implementations, gaps 220 and 224 can also be offset.
[0021] exist Figure 3In the multilayer electrical assembly 300, the first capacitor layer includes a first parallel plate electrode separated from the second parallel plate electrode by a portion of a dielectric 310. The first parallel plate electrode includes three electrically isolated plate portions, and the second parallel plate electrode includes two electrically isolated plate portions. The first plate portion 302 of the second parallel plate electrode overlaps with the first plate portion 301 and the second plate portion 303 of the first parallel plate electrode. The second plate portion 304 of the second parallel plate electrode overlaps with the second plate portion 303 and the third plate portion 305 of the first parallel plate electrode, thereby forming a first series of capacitors O1, G1, B1, Y1 separated by gaps between the plate portions of the first parallel plate electrode and the plate portions of the second parallel plate electrode. The second capacitor layer includes a third parallel plate electrode separated from the second parallel plate electrode by a portion of a dielectric. The third parallel plate electrode includes three electrically isolated plate portions. The first plate portion 302 of the second parallel plate electrode overlaps with the first plate portion 307 and the second plate portion 309 of the third parallel plate electrode. The second plate portion 304 of the second parallel plate electrode overlaps with the second plate portion 309 and the third plate portion 311 of the third parallel plate electrode, and this overlapping plate portion forms a second series of capacitors O2, G2, B2, Y2 separated by the gap between the plate portions of the second and third parallel plate electrodes. The gap 320 separating the first and second plate portions of the first parallel plate electrode is laterally offset relative to the gap 321 separating the first and second plate portions of the third parallel plate electrode, and the gap 322 separating the second and third plate portions of the first parallel plate electrode is laterally offset relative to the gap 323 separating the second and third plate portions of the third parallel plate electrode.
[0022] More generally, Figure 3 The multilayer electrical assembly may include additional capacitor layers. For example, the third capacitor layer includes a fourth parallel plate electrode separated from the third parallel plate electrode by a portion of a dielectric. The fourth parallel plate electrode includes two electrically isolated plate portions. The first plate portion 326 of the fourth parallel plate electrode overlaps with the first plate portion 307 and the second plate portion 309 of the third parallel plate electrode, and the second plate portion 327 of the fourth parallel plate electrode overlaps with the second plate portion 309 and the third plate portion 311 of the third parallel plate electrode. The overlapping plate portions of the third and fourth parallel plate electrodes form a second series of capacitors O3, G3, B3, Y3 separated by a gap between the plate portions of the third and fourth parallel plate electrodes. The gap 329 separating the first and second plate portions of the fourth parallel plate electrode is laterally offset relative to the gap 330 separating the first and second plate portions of the second parallel plate electrode.
[0023] Typically, at least a portion of some of the parallel plate electrodes is electrically connected to one or more conductive terminals, specifically a first conductive terminal and a second conductive terminal. Figure 2 In this configuration, the outermost plate portions 211 and 213 of the first parallel plate electrode are connected to the first terminal and the second terminal, respectively, and the parallel electrode plates (i.e., the floating plate portion 214) are floating. Similarly, in... Figure 3 In this process, the last electrode of the first parallel plate electrode (first plate portion 301, third plate portion 305) is connected to the corresponding terminals 340, 342, and the plate portions of the second parallel electrode (i.e., first plate portion 302, second plate portion 304) are floating. Figure 2 and Figure 3 The remaining parallel plate electrodes follow the same pattern.
[0024] exist Figure 4 In this embodiment, the multilayer electrical assembly 400 includes a plurality of parallel plate electrodes embedded in a dielectric 401. The first parallel plate electrode includes an end portion 402 connected to a conductive terminal 404 and a floating plate portion 406. The second parallel plate electrode includes a first portion 408 connected to a terminal 410 and a floating plate portion 412. The overlapping portion of the end portion 402 and the floating plate portion 412 forms a first capacitor G1, the overlapping portion of the floating plate portion 406 and the floating plate portion 412 forms a second capacitor B1, and the overlapping portion of the floating plate portion 406 and the first portion 408 forms a third capacitor O1, wherein the series capacitors G1, B1, and O1 form a first capacitor layer. Figure 4 The remaining parallel plate electrodes each include a corresponding plate portion, wherein the overlapping plate portions of adjacent parallel plate electrodes form a series capacitor in a capacitor layer defined by the adjacent parallel plate electrodes. As described herein, one or more gap offsets will define at least two adjacent capacitor layer plate portions to improve the robustness of the multilayer electrical assembly.
[0025] In some implementations, sensitivity to stress fracture can be reduced by offsetting the gaps associated with adjacent sets of capacitor layers, where the gaps within adjacent sets of capacitor layers are aligned. For example, in the prior art... Figure 1 In this implementation, adjacent capacitor layers can be divided into two or more groups, each group comprising multiple adjacent capacitor layers with aligned gaps. According to this implementation, the aligned gaps of one group are offset relative to the aligned gaps of the adjacent groups. The total capacitance of the capacitor layers within each group is equal, and the total capacitance of the capacitor layers in adjacent groups is also equal.
[0026] The number of capacitor layers, their thickness, dielectric composition, overall dimensions, bulk layers, frequency of gap offsets in the capacitor layers, and other characteristics of multilayer electrical components depend in part on component specifications and application requirements, along with other considerations. Typical, non-limiting capacitor layer thicknesses can range from 10 μm to 200 μm, typically from 10 μm to 100 μm, and more typically from 20 μm to 70 μm. Typical ranges are between 20 and 100 electrodes. However, some multilayer devices may include fewer than 20 electrodes and up to 300 or more electrodes. If present, the thickness of the dielectric bulk layers above and below the electrode stack can range from 65 μm to 1 mm or greater, and more typically from 70 μm to 150 μm. Typical multilayer electrical components may have the following dimensions: a length of at least 1 mm and typically ranging from 3.2 mm to 20.5 mm or from 2 mm to 25 mm; a width of at least 0.5 mm and typically ranging from 1.6 mm to 15.5 mm or from 1 mm to 20 mm; and a depth of at least 0.5 mm, typically ranging from 1.6 mm to 4 mm, or up to a maximum of 5 mm. More specific dimensions of a typical multilayer electrical component are: a width of 5 mm; a length of 5.7 mm; and a thickness of 2.6 mm or 3.2 mm. The dimensions and electrode counts described herein are non-limiting typical examples.
[0027] While this disclosure and its content, which is now considered the best mode thereof, have been described in a manner that enables those skilled in the art to make and use them, it should be understood and appreciated that many equivalents exist for the typical embodiments described herein, and that various modifications and variations may be made to these embodiments without departing from the scope and spirit of the invention, and that such modifications and variations are not limited to the embodiments described, but rather to the appended claims and their equivalents.
Claims
1. A multilayer electrical assembly, the multilayer electrical assembly comprising: Dielectric; A first conductive terminal and a second conductive terminal, the first conductive terminal and the second conductive terminal being separated by the dielectric; Multiple parallel plate electrodes are embedded in the dielectric, and the dielectric and the multiple parallel plate electrodes form: A first capacitor layer, the first capacitor layer comprising a first series of capacitors between the first conductive terminal and the second conductive terminal; A second capacitor layer, parallel and adjacent to the first capacitor layer, includes a second series of capacitors between the first conductive terminal and the second conductive terminal. One or more capacitors in the first capacitor layer have a capacitance value different from that of adjacent capacitors in the second capacitor layer. Wherein, the total capacitance of the first capacitor layer is equal to the total capacitance of the second capacitor layer. Wherein, the first capacitor layer includes a first parallel plate electrode separated from the second parallel plate electrode by a portion of the dielectric, the first parallel plate electrode includes three electrically isolated plate portions, and the second parallel plate electrode includes two electrically isolated plate portions, the first plate portion of the second parallel plate electrode overlaps with the first plate portion and the second plate portion of the first parallel plate electrode, and the second plate portion of the second parallel plate electrode overlaps with the second plate portion and the third plate portion of the first parallel plate electrode. The second capacitor layer includes a third parallel plate electrode separated from the second parallel plate electrode by a portion of the dielectric. The third parallel plate electrode includes three electrically isolated plate portions. The first plate portion of the second parallel plate electrode overlaps with the first and second plate portions of the third parallel plate electrode, and the second plate portion of the second parallel plate electrode overlaps with the second and third plate portions of the third parallel plate electrode. Wherein, the gap separating the first plate portion and the second plate portion of the first parallel plate electrode is laterally offset relative to the gap separating the first plate portion and the second plate portion of the third parallel plate electrode, and wherein, the gap separating the second plate portion and the third plate portion of the first parallel plate electrode is laterally offset relative to the gap separating the second plate portion and the third plate portion of the third parallel plate electrode.
2. The multilayer electrical assembly according to claim 1, wherein, The dielectric and the plurality of parallel plate electrodes are formed as follows: A third capacitor layer, the third capacitor layer comprising a third series of capacitors between the first conductive terminal and the second conductive terminal; The second capacitor layer is parallel to the first capacitor layer and the third capacitor layer, and lies between the first capacitor layer and the third capacitor layer. One or more capacitors in the third capacitor layer have capacitance values different from those of their adjacent capacitors in the second capacitor layer. The total capacitance of each of the first, second, and third capacitor layers is equal.
3. The multilayer electrical assembly according to claim 1, wherein, The individual capacitors in the first capacitor layer have the same capacitance value as the individual capacitors in the second capacitor layer, wherein the arrangement order of the first series of capacitors between the first conductive terminal and the second conductive terminal is different from the arrangement order of the second series of capacitors between the first conductive terminal and the second conductive terminal.
4. The multilayer electrical assembly according to claim 3, wherein, The order of the first series of capacitors is reversed relative to the order of the second series of capacitors.
5. The multilayer electrical assembly according to claim 1, wherein, Individual capacitors in the first capacitor layer are separated by gaps, and individual capacitors in the second capacitor layer are separated by gaps, wherein one or more gaps in the first capacitor layer are laterally offset relative to one or more gaps in the second capacitor layer.
6. The multilayer electrical assembly according to claim 1, wherein, At least some of the parallel plate electrodes are electrically connected to the end plate portions of the first conductive terminal and the second conductive terminal.
7. The multilayer electrical assembly according to claim 1, further comprising: The third capacitor layer includes a fourth parallel plate electrode separated from the third parallel plate electrode by a portion of the dielectric. The fourth parallel plate electrode includes two electrically isolated plate portions. The first plate portion of the fourth parallel plate electrode overlaps with the first plate portion and the second plate portion of the third parallel plate electrode, and the second plate portion of the fourth parallel plate electrode overlaps with the second plate portion and the third plate portion of the third parallel plate electrode. The overlapping portion of the third parallel plate electrode and the fourth parallel plate electrode constitutes the third series of capacitors of the third capacitor layer. The gap separating the first plate portion and the second plate portion of the fourth parallel plate electrode is laterally offset relative to the gap separating the first plate portion and the second plate portion of the second parallel plate electrode.
8. The multilayer electrical assembly according to claim 1, wherein, The dielectric comprises a ceramic material, and the first conductive terminal and the second conductive terminal comprise base metals or noble metals.
9. The multilayer electrical assembly according to claim 8, wherein, The multilayer electrical component is a surface-mount capacitor.
10. A multilayer electrical assembly, the multilayer electrical assembly comprising: Dielectric; A first conductive terminal and a second conductive terminal, the first conductive terminal and the second conductive terminal being separated by the dielectric; The first series of capacitors is located between the first conductive terminal and the second conductive terminal, and the first series of capacitors includes a first parallel plate electrode separated from the second parallel plate electrode by a portion of the dielectric. A second series of capacitors, located between the first conductive terminal and the second conductive terminal, includes a third parallel plate electrode separated from the second parallel plate electrode by a portion of the dielectric. Wherein, the first parallel plate electrode includes three electrically isolated plate portions, and the second parallel plate electrode includes two electrically isolated plate portions, the first plate portion of the second parallel plate electrode overlaps with the first plate portion and the second plate portion of the first parallel plate electrode, and the second plate portion of the second parallel plate electrode overlaps with the second plate portion and the third plate portion of the first parallel plate electrode; The third parallel plate electrode comprises three electrically isolated plate portions. The first plate portion of the second parallel plate electrode overlaps with the first and second plate portions of the third parallel plate electrode, and the second plate portion of the second parallel plate electrode overlaps with the second and third plate portions of the third parallel plate electrode. Wherein, the gap separating the first plate portion and the second plate portion of the first parallel plate electrode is laterally offset relative to the gap separating the first plate portion and the second plate portion of the third parallel plate electrode, and wherein, the gap separating the second plate portion and the third plate portion of the first parallel plate electrode is laterally offset relative to the gap separating the second plate portion and the third plate portion of the third parallel plate electrode.
11. The multilayer electrical assembly according to claim 10, wherein, The total capacitance of the first series of capacitors is equal to the total capacitance of the second series of capacitors.
12. The multilayer electrical assembly according to claim 10, further comprising: A third series capacitor, located between the first conductive terminal and the second conductive terminal, includes a fourth parallel plate electrode separated from the third parallel plate electrode by a portion of the dielectric. The fourth parallel plate electrode comprises two electrically isolated plate portions. The first plate portion of the fourth parallel plate electrode overlaps with the first and second plate portions of the third parallel plate electrode, and the second plate portion of the fourth parallel plate electrode overlaps with both the second and third plate portions of the third parallel plate electrode. The gap separating the first plate portion and the second plate portion of the second parallel plate electrode is laterally offset relative to the gap separating the first plate portion and the second plate portion of the fourth parallel plate electrode. The total capacitance of each series of capacitors in the first series, the second series, and the third series is equal.
13. The multilayer electrical assembly according to claim 11, wherein, The dielectric comprises a ceramic material, and the first conductive terminal and the second conductive terminal comprise base metals or noble metals.
Citation Information
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