Toughening modified compounds and their manufacturing methods
CN117004178BActive Publication Date: 2026-05-26ITEQ (JIANGXI) ELECTRONIC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ITEQ (JIANGXI) ELECTRONIC TECH CO LTD
- Filing Date
- 2022-04-29
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
Existing polybenzoxazine compounds exhibit brittle mechanical properties after thermal ring-opening polymerization, which affects their processability and application development.
Method used
Toughened and modified compounds are prepared by introducing anhydride-grafted olefin polymers and diisocyanate compounds to form bonds with polybenzoxazine compounds to enhance their toughness.
Benefits of technology
It improves the mechanical and heat resistance properties of polybenzoxazine compounds, reduces water absorption, and is suitable for composite materials and electronic circuit materials.
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Smart Images
Figure CN117004178B_ABST
Abstract
This invention provides a toughened modified compound and its manufacturing method. The toughened modified compound comprises: a polybenzoxazine compound; a toughening agent comprising an anhydride-grafted olefin polymer; and a modifier comprising a diisocyanate compound; wherein the diisocyanate of the modifier forms bonds with the polybenzoxazine compound and the anhydride of the toughening agent, respectively. This invention possesses high toughness and excellent mechanical properties, thus having a wide range of applications in electronics, aerospace, and other fields.
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