Wafer conveying method and wafer conveying device based on wafer laser marking machine
By adjusting the spacing between the chuck and the support column and controlling the movement speed of the transmission device, the problems of wafer position shift and wafer drop in the traditional wafer laser marking machine have been solved, thus improving reliability and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUA HONG SEMICON WUXI LTD
- Filing Date
- 2023-08-29
- Publication Date
- 2026-05-29
AI Technical Summary
Traditional wafer laser marking machines often fail to place back-sealed wafers correctly on the chuck when transporting them, which can easily lead to positional deviations and wafer drops, resulting in damage.
Adjust the height of the chuck and support post so that the distance between them is greater than 0.2 inches. Use the transfer device to move the wafer vertically downward at a first speed until it contacts the chuck surface. Then continue to move vertically downward at a second speed until the transfer device separates from the wafer. The second speed is less than the first speed to ensure that the support post is not touched.
This effectively avoids the problems of wafers not being placed correctly on the chuck and wafers falling off, improving the reliability and safety of the transfer and increasing product yield.
Smart Images
Figure CN117020432B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a wafer transfer method and wafer transfer device based on a wafer laser marking machine. Background Technology
[0002] With the development of semiconductor specialty processes, some products will use wafer back-sealing technology, which makes the film on the back of the wafer more dense.
[0003] In traditional wafer laser marking machines (such as Innola machines), the transfer process involves a robotic arm adsorbing the wafer through a process vacuum before performing the transfer action. The robotic arm maintains negative pressure while holding the wafer in place until it is released. When the robotic arm places the wafer on the chuck, a valve disconnects the robotic arm from the vacuum, allowing the wafer to be released naturally due to the loose contact between the wafer and the robotic arm's surfaces.
[0004] However, when the back-sealed wafer is attracted by the robotic arm, the wafer contact surface with the robotic arm is in close contact, which delays the time for the wafer to be released naturally. As a result, for a long period of time after the vacuum attraction is disconnected, the back of the wafer is still in contact with the robotic arm, but the robotic arm is still moving downwards. This can easily cause the wafer to shift in position on the chuck, making it impossible to place the wafer in the correct position, or even causing the wafer to fall off and break. Summary of the Invention
[0005] This application provides a wafer transfer method and wafer transfer device based on a wafer laser marking machine, which can solve at least one of the following problems when transferring back-sealed wafers: the wafer cannot be placed in the correct position on the chuck, or the wafer falls off the chuck.
[0006] On one hand, embodiments of this application provide a wafer transfer method based on a wafer laser marking machine, including:
[0007] Adjust the height of the chuck on the calibrator and the height of the plurality of support posts surrounding the chuck so that the distance between the surface of the chuck and the top of the support posts is greater than 0.2 inches;
[0008] The wafer to be laser-marked is taken out from the wafer cassette using a transmission device. At this time, the back side of the wafer is in contact with the wafer contact surface of the transmission device.
[0009] The wafer is transferred to a predetermined position above the chuck using the transfer device.
[0010] The wafer is moved vertically downwards at a first speed using the transmission device until it contacts the chuck surface; and
[0011] The transmission device is controlled to continue moving vertically downward at a second speed until it separates from the wafer, wherein the transmission device does not touch the support column during the transfer of the wafer; the second speed is less than the first speed.
[0012] Optionally, in the wafer transfer method based on a wafer laser marking machine, during the process of controlling the transfer device to continue moving vertically downward until the transfer device separates from the wafer, the second movement speed of the transfer device does not exceed 0.8 inch / s.
[0013] Optionally, in the wafer transfer method based on a wafer laser marking machine, the transfer device includes: a robotic arm and a fork connected to the robotic arm, the fork being used to carry the wafer, and during the transfer of the wafer, the back side of the wafer is in contact with the surface of the fork.
[0014] Optionally, in the wafer transfer method based on the wafer laser marking machine, during the process of adjusting the height of the chuck on the calibrator and the height of the multiple support columns, the height of the multiple support columns is adjusted to be the same.
[0015] Optionally, in the wafer transfer method based on the wafer laser marking machine, after controlling the transfer device to continue moving vertically downward until the transfer device separates from the wafer, the wafer transfer method based on the wafer laser marking machine further includes: controlling the transfer device to return to a preset waiting task position.
[0016] Optionally, in the wafer transfer method based on a wafer laser marking machine, after controlling the transfer device to continue moving vertically downwards until the transfer device separates from the wafer, the wafer transfer method based on a wafer laser marking machine further includes:
[0017] Control the rise of multiple support columns to lift the wafer placed on the chuck;
[0018] Adjust the position of the chuck within the calibrator plane so that the center of the chuck and the center of the wafer are aligned; and
[0019] The multiple support pillars are controlled to descend in order to reposition the wafer onto the chuck.
[0020] On the other hand, this application embodiment also provides a wafer transfer device, including: a calibrator, a plurality of support pillars, a transfer device and a chuck, wherein the chuck and the support pillars are both disposed on the calibrator, the plurality of support pillars are arranged around the chuck and maintain a certain distance from the chuck, and the transfer device is movably disposed on the calibrator and the transfer device does not touch the support pillars;
[0021] The wafer transfer device is configured as follows:
[0022] The height of the chuck and the height of the plurality of support pillars are adjusted so that the distance between the surface of the chuck and the top of the support pillars is greater than 0.2 inches; the wafer to be laser-marked is taken out from the wafer cassette using a transfer device, at which point the back side of the wafer is in contact with the wafer contact surface of the transfer device; the wafer is transferred to a predetermined position above the chuck using the transfer device; the wafer is moved vertically downward using the transfer device at a first speed until the wafer contacts the surface of the chuck; the transfer device is controlled to continue moving vertically downward at a second speed until the transfer device separates from the wafer, wherein the second speed is less than the first speed.
[0023] Optionally, in the wafer transfer device, during the process of controlling the transfer device to continue moving vertically downward until the transfer device separates from the wafer, the second movement speed of the transfer device does not exceed 0.8 inch / s.
[0024] Optionally, in the wafer transfer device, the transfer device includes: a robotic arm and a fork connected to the robotic arm, the fork being used to carry the wafer, and during the transfer of the wafer, the back side of the wafer is in contact with the surface of the fork.
[0025] The technical solution of this application has at least the following advantages:
[0026] This application adjusts the distance between the chuck surface and the top of the support post to be greater than 0.2 inches, and uses a transmission device to move the wafer vertically downward at a first speed until the wafer contacts the chuck surface; and controls the transmission device to continue moving vertically downward at a second speed until the transmission device separates from the wafer. That is, by increasing the distance between the top of the support post and the chuck surface, and slowing down the speed of the transmission device's continued vertical downward movement after the wafer contacts the chuck surface, this application provides the transmission device with a certain buffer time to fully and naturally release the wafer after contact with the chuck surface. This avoids the problems of wafers not being placed in the correct position on the chuck and wafers falling off the chuck in traditional back-sealed wafer transfer methods, ensuring the reliability and safety of wafer transfer and improving product yield. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0028] Figure 1 This is a schematic diagram of the structure of a wafer transfer device according to an embodiment of the present invention;
[0029] Figure 2 This is a top view of the chuck and support column according to an embodiment of the present invention;
[0030] Figure 3 This is a top view schematic diagram of a transmission device used to transfer a wafer to a chuck according to an embodiment of the present invention.
[0031] Figure 4 This is a flowchart of a wafer transfer method according to an embodiment of the present invention;
[0032] The reference numerals in the attached figures are explained as follows:
[0033] 10-calibrator, 20-support column, 30-transfer device, 31-fork, 32-robotic arm, 40-chuck, 50-wafer. Detailed Implementation
[0034] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0038] This application provides a wafer transfer device, referencing... Figures 1-3 , Figure 1 This is a schematic diagram of the structure of a wafer transfer device according to an embodiment of the present invention. Figure 2 This is a top view of the chuck and support column according to an embodiment of the present invention; Figure 3 This is a top view schematic diagram of a wafer being transferred to a chuck using a transfer device according to an embodiment of the present invention. The wafer transfer device includes: an calibrator 10, a plurality of support pillars 20, a transfer device 30, and a chuck 40. The chuck 40 and the support pillars 20 are both disposed on the calibrator 10. The plurality of support pillars 20 are arranged around the chuck 40 and maintain a certain distance from the chuck 40. The transfer device 30 is movably disposed on the calibrator 10 and does not touch the support pillars 20.
[0039] Furthermore, the transmission device 30 includes a robotic arm 32 and a fork 31 connected to the robotic arm 32. The fork 31 is used to carry the wafer 50. During the transmission of the wafer 50, the back side of the wafer 50 is in contact with the surface of the fork 31.
[0040] In this embodiment, there are three support columns 20, which are evenly arranged around the chuck 40 and distributed at the vertices of an equilateral triangle.
[0041] Based on the same inventive concept, this application also provides a wafer transfer method based on a wafer laser marking machine, see reference. Figure 4 , Figure 4 This is a flowchart of a wafer transfer method according to an embodiment of the present invention. The wafer transfer method based on a wafer laser marking machine includes:
[0042] Step S10: Adjust the height of the chuck on the calibrator and the height of the plurality of support posts surrounding the chuck so that the distance a between the surface of the chuck and the top of the support posts is greater than 0.2 inches;
[0043] Step S20: The wafer to be laser-marked is taken out from the wafer box using a transfer device. At this time, the transfer device holds the wafer in place by process vacuum, and the back side of the wafer is in contact with the wafer contact surface of the transfer device.
[0044] Step S30: Use the transmission device to transfer the wafer to a predetermined position above the chuck;
[0045] Step S40: Using the transmission device, the wafer is moved vertically downwards at a first speed until it contacts the chuck surface; and
[0046] Step S50: Control the transmission device to continue moving vertically downward at a second speed until the transmission device separates from the wafer, wherein the transmission device does not touch the support post during the transmission of the wafer; the second speed is less than the first speed.
[0047] Furthermore, during the process of using the transmission device 30 to move the wafer 50 vertically downward at a first speed until the wafer 50 contacts the surface of the chuck 40, the first speed of the transmission device 30 is 1.2 inch / s to 1.5 inch / s, for example, 1.45 inch / s.
[0048] Furthermore, during the process of controlling the transmission device 30 to continue moving vertically downward until the transmission device 30 separates from the wafer 50, the second movement speed of the transmission device 30 does not exceed 0.8 inch / s, for example 0.7 inch / s.
[0049] Preferably, the transmission device 30 includes a robotic arm 32 and a fork 31 connected to the robotic arm 32. The fork 31 is used to carry the wafer 50. During the transmission of the wafer 50, the back side of the wafer 50 is in contact with the surface of the fork 31.
[0050] Preferably, during the process of adjusting the height of the chuck 40 on the calibrator 10 and the height of the plurality of support columns 20, the heights of the plurality of support columns 20 are adjusted to be the same.
[0051] Preferably, in step S10, only the height of the multiple support columns 20 on the calibrator 10 can be adjusted so that the distance a between the surface of the chuck and the top of the support column is greater than 0.2 inches, for example, 0.25 inches.
[0052] In this application, the distance between the surface of the chuck 40 and the top of the support post 20 is adjusted to be greater than 0.2 inches. The transfer device 30 is used to move the wafer 50 vertically downwards at a first speed until the wafer 50 contacts the surface of the chuck 40. The transfer device 30 is then controlled to continue moving vertically downwards at a second speed until it separates from the wafer 50. That is, by increasing the distance between the top of the support post 20 and the surface of the chuck 40, and slowing down the downward movement of the transfer device 30 after the wafer 50 contacts the surface of the chuck 40, this provides the transfer device 30 with a buffer time to fully and naturally release the wafer 50 after contact. This avoids the problems of wafers not being placed correctly on the chuck and wafers falling off the chuck, which are common in traditional back-sealed wafer transfer methods. This ensures the reliability and safety of wafer transfer and improves product yield.
[0053] In another embodiment, the wafer transfer method based on a wafer laser marking machine includes:
[0054] First, perform step S10: adjust the height of the chuck 40 on the calibrator 10 and the height of the plurality of support posts 20 arranged around the chuck 40 so that the distance a between the surface of the chuck 40 and the top of the support post 20 is greater than 0.2 inches;
[0055] Then, step S20 is performed: the robotic arm 32 drives the fork to take out the wafer to be laser marked from the wafer box. At this time, the fork 31 adsorbs the wafer 50 through the process vacuum in its internal pipeline, and the back of the wafer 50 is attached to the surface of the fork 31.
[0056] Next, step S30 is executed: the robotic arm 32 is used to move the wafer 50 on the fork 31 to a predetermined position above the chuck 40;
[0057] Further, step S40 is performed: the robotic arm 32 drives the fork 31 to move vertically downward at a first speed until the wafer 50 contacts the surface of the chuck 40, so as to place the wafer 50 on the chuck 40.
[0058] Finally, step S50 is executed: the robotic arm 32 drives the fork 31 to continue moving vertically downward at a second speed until the fork 31 separates from the wafer 50. During the transfer of the wafer 50, the transfer device 30 does not touch the support column, and the second speed is less than the first speed.
[0059] Preferably, before and after the wafer 50 is placed on the chuck 40, during the movement of the fork 31 driven by the robotic arm 32, the fork 31 does not touch the top of the support column 20.
[0060] In this application, the distance between the surface of the chuck 40 and the top of the support post 20 is adjusted to be greater than 0.2 inches. The transfer device 30 is used to move the wafer 50 vertically downwards at a first speed until the wafer 50 contacts the surface of the chuck 40. The transfer device 30 is then controlled to continue moving vertically downwards at a second speed until the fork 31 separates from the wafer 50. That is, by increasing the distance between the top of the support post 20 and the surface of the chuck 40, and slowing down the downward movement of the transfer device 30 after the wafer 50 contacts the surface of the chuck 40, this provides the fork 31 with sufficient buffer time to naturally release the wafer 50 after contact. This avoids the problems of wafers not being placed correctly on the chuck and wafers falling off the chuck, which are common in traditional back-sealed wafer transfer methods. This ensures the reliability and safety of wafer transfer and improves product yield.
[0061] Furthermore, after controlling the transmission device 30 to continue moving vertically downward until the fork 31 separates from the wafer 50, the wafer transfer method based on the wafer laser marking machine may also include step S60: controlling the transmission device to return to a preset waiting task position and wait for the next transfer task.
[0062] Furthermore, after controlling the transmission device 30 to continue moving vertically downwards until the fork 31 separates from the wafer 50, the wafer transfer method based on the wafer laser marking machine may further include step S70, which may specifically include:
[0063] Step S70.1: Control the multiple support pillars 20 to rise, so as to lift the wafer 50 placed on the chuck 40. The support pillars 20 hold the wafer 50 in place by process vacuum in their internal pipelines.
[0064] Step S70.2: Adjust the position of the chuck 40 in the plane of the calibrator 10 so that the center of the chuck 40 and the center of the wafer 50 are on a vertical straight line, and the chuck 40 can move in the horizontal plane;
[0065] Step S70.3: Control the plurality of support pillars 20 to descend so as to reposition the wafer 50 on the chuck 40.
[0066] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.
Claims
1. A wafer transfer method based on a wafer laser marking machine, characterized in that, include: Adjust the height of the chuck on the calibrator and the height of the plurality of support posts surrounding the chuck so that the distance between the surface of the chuck and the top of the support posts is greater than 0.2 inches; The wafer to be laser-marked is taken out from the wafer cassette using a transmission device. At this time, the back side of the wafer is in contact with the wafer contact surface of the transmission device. The wafer is transferred to a predetermined position above the chuck using the transfer device. The wafer is moved vertically downward at a first speed using the transmission device until it contacts the surface of the chuck. as well as The transmission device is controlled to continue moving vertically downward at a second speed until it separates from the wafer, wherein the transmission device does not touch the support post during the wafer transfer; the second speed is less than the first speed. During the process of controlling the transmission device to continue moving vertically downward until the transmission device separates from the wafer, the second movement speed of the transmission device does not exceed 0.8 inch / s.
2. The wafer transfer method based on a wafer laser marking machine according to claim 1, characterized in that, The transfer device includes a robotic arm and a fork connected to the robotic arm. The fork is used to carry the wafer, and during the transfer of the wafer, the back side of the wafer is in contact with the surface of the fork.
3. The wafer transfer method based on a wafer laser marking machine according to claim 1, characterized in that, During the process of adjusting the height of the chuck on the calibrator and the height of the multiple support columns, the height of the multiple support columns is adjusted to be the same.
4. The wafer transfer method based on a wafer laser marking machine according to claim 1, characterized in that, After controlling the transmission device to continue moving vertically downward until the transmission device separates from the wafer, the wafer transfer method based on the wafer laser marking machine further includes: controlling the transmission device to return to a preset waiting task position.
5. The wafer transfer method based on a wafer laser marking machine according to claim 1, characterized in that, After controlling the transmission device to continue moving vertically downwards until the transmission device separates from the wafer, the wafer transfer method based on the wafer laser marking machine further includes: Control the rise of multiple support columns to lift the wafer placed on the chuck; Adjust the position of the chuck within the calibrator plane so that the center of the chuck and the center of the wafer are aligned; and The multiple support pillars are controlled to descend in order to reposition the wafer onto the chuck.
6. A wafer transfer device, characterized in that, include: The calibrator comprises a calibrator, multiple support columns, a transmission device, and a chuck. The chuck and the support columns are both disposed on the calibrator. The multiple support columns are arranged around the chuck and maintain a certain distance from the chuck. The transmission device is movably disposed on the calibrator and does not contact the support columns. The wafer transfer device is configured as follows: The height of the chuck and the height of the plurality of support pillars are adjusted so that the distance between the surface of the chuck and the top of the support pillars is greater than 0.2 inches; the wafer to be laser-marked is taken out from the wafer cassette using a transfer device, at which point the back side of the wafer is in contact with the wafer contact surface of the transfer device; the wafer is transferred to a predetermined position above the chuck using the transfer device; the wafer is moved vertically downward using the transfer device at a first speed until the wafer contacts the surface of the chuck; the transfer device is controlled to continue moving vertically downward at a second speed until the transfer device separates from the wafer, wherein the second speed is less than the first speed; During the process of controlling the transmission device to continue moving vertically downward until the transmission device separates from the wafer, the second movement speed of the transmission device does not exceed 0.8 inch / s.
7. The wafer transfer apparatus according to claim 6, characterized in that, The transfer device includes a robotic arm and a fork connected to the robotic arm. The fork is used to carry the wafer, and during the transfer of the wafer, the back side of the wafer is in contact with the surface of the fork.