Silicon electrode polishing equipment

Abstract

The present invention discloses a silicon electrode polishing device, comprising a planetary gear set, wherein the planetary gear set comprises a ring gear, a sun gear and a planetary ring gear meshed with the ring gear and the sun gear at the same time; a carrier for carrying the silicon electrode is fixedly provided on the planetary ring gear, an upper polishing plate and a lower polishing plate for installing the polishing cloth are respectively provided on the upper and lower sides of the carrier; the upper and lower walls of the carrier are both provided with a receiving groove with a depth less than the thickness of the silicon electrode; a suction cup with air holes is installed on the bottom wall of the receiving groove; an air flow channel connected with the air holes of the suction cup is provided on the carrier, and an air valve is installed in the air flow channel; when the silicon electrode is installed in the receiving groove, the silicon electrode fits with the suction cup, and the air pressure in the air flow channel is lower than the external air pressure, which solves the problem of the silicon electrode falling off the planetary ring gear during installation, facilitates the installation of the silicon electrode, prevents the planetary ring gear from contacting the polishing cloth, and extends the service life of the polishing cloth.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a silicon electrode polishing device. Background Art

[0002] Silicon electrodes, also known as plasma diverter plates, are used to disperse plasma so that it strikes the wafer surface evenly. As integrated circuit board designs become increasingly sophisticated, the surface roughness requirements for silicon electrodes need to be improved.

[0003] When polishing silicon electrodes or wafers, in order to improve the polishing effect, in the prior art, the polishing equipment includes a ring gear and a sun gear located at the center of the ring gear, and a planetary ring gear is placed between the sun gear and the ring gear, wherein the planetary ring gear is meshed with the sun gear and the ring gear, driving the planetary ring gear to rotate while rotating circumferentially around the sun gear. A through hole is provided in the planetary ring gear for placing the workpiece to be polished, and an upper polishing plate and a lower polishing plate are respectively provided on the upper and lower sides of the workpiece to be polished for polishing.

[0004] The workpiece to be polished is placed in the through hole of the planetary gear ring, and there is no limiting mechanism between the workpiece to be polished and the planetary gear ring to limit the axial movement of the workpiece to be polished. At this time, the thickness of the planetary gear ring needs to be smaller than the thickness of the workpiece to be polished. When the planetary gear ring rotates between the gear ring and the sun gear, the planetary gear ring will abut against the polishing cloth on the lower polishing plate under the action of its own gravity, rubbing the polishing cloth, and reducing the service life of the lower polishing cloth; at the same time, since the workpiece to be polished and the planetary gear ring are relatively thin, it is inconvenient to install the workpiece to be polished on the planetary gear ring. During the installation of the planetary gear ring, the workpiece to be polished is easy to fall off from the planetary gear ring.

[0005] Therefore, how to design a polishing device that prevents the workpiece to be polished from detaching from the planetary gear ring has become a technical problem that needs to be solved urgently by people in this field. Summary of the Invention

[0006] In order to solve at least one of the technical problems mentioned in the background technology, the purpose of the present invention is to provide a silicon electrode polishing device to solve the problem of the polished workpiece being separated from the planetary gear ring.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A silicon electrode polishing device includes a planetary gear set, wherein the planetary gear set includes a ring gear, a sun gear and a planetary ring gear that meshes with the ring gear and the sun gear at the same time; a carrier for carrying the silicon electrode is fixedly provided on the planetary ring gear; an upper polishing plate and a lower polishing plate for installing a polishing cloth are respectively provided on the upper and lower sides of the carrier; the upper and lower walls of the carrier are provided with a receiving groove with a depth less than the thickness of the silicon electrode; a suction cup with air holes is installed on the bottom wall of the receiving groove; an air flow channel connected to the air holes of the suction cup is provided on the carrier; an air valve is installed in the air flow channel; when the silicon electrode is installed in the receiving groove, the silicon electrode fits the suction cup, and the air pressure in the air flow channel is lower than the external air pressure.

[0009] Furthermore, it includes at least two positioning holes opened on the inner wall of the planetary gear ring, and the supporting member is provided with a positioning rod connected along the radial sliding connection of the supporting member and a driving mechanism for driving the positioning rod to move. When the supporting member is fixed, the driving mechanism drives the positioning rod to be inserted into the positioning hole of the planetary gear ring.

[0010] Furthermore, the thickness of the carrier is greater than the thickness of the planetary gear ring. When the carrier is fixed on the planetary gear ring, the bottom wall of the carrier is lower than the bottom wall of the planetary gear ring, and the top wall of the carrier is higher than the top wall of the planetary gear ring.

[0011] Furthermore, the peripheral wall of the bearing member is provided with a plurality of mounting grooves arranged along the radial direction of the bearing member, and the positioning rods are installed in the mounting grooves.

[0012] Furthermore, the driving mechanism includes an adjustment slot connected to the installation slot, a gear and meshing teeth, the meshing teeth are arranged on the positioning rod and along the axial direction of the positioning rod, and the gear is installed in the adjustment slot and meshes with the meshing teeth.

[0013] Furthermore, the inner wall of the installation groove is connected to a limit groove arranged radially along the bearing member, and a limit rib is fixed on the positioning rod. When the positioning rod is installed in the installation groove, the limit rib is inserted into the limit groove, and the side wall of the limit rib abuts against the inner wall of the limit groove.

[0014] Furthermore, both the upper polishing plate and the lower polishing plate are provided with avoidance holes running through the upper and lower plates, and the sun gear is located in the avoidance hole of the lower polishing plate.

[0015] Furthermore, it also includes a body and a support frame installed on the body and extending vertically upward, a cylinder is fixedly installed on the support frame, a fourth motor is fixedly installed on the output end of the cylinder, and the output shaft of the fourth motor is fixedly connected to the upper polishing plate.

[0016] Furthermore, the upper polishing plate and / or the lower polishing plate are provided with a plurality of liquid leakage holes, and the polishing device is further provided with a liquid outlet nozzle for injecting polishing liquid into the liquid leakage holes.

[0017] Furthermore, a positioning plate is fixedly provided on the upper polishing disc, a number of upwardly extending connecting rods are fixedly provided on the positioning plate, a mounting plate is fixedly provided on the top of the connecting rod, and a liquid separation groove is provided on the mounting plate for receiving the polishing liquid sprayed out of the liquid outlet nozzle. The output shaft of the fourth motor is fixedly connected to the mounting plate, and a liquid separation hole is provided on the bottom wall of the liquid separation groove, and the liquid separation hole is connected to the leakage hole of the upper polishing disc through a shunt pipe.

[0018] Compared with the prior art, the present invention has the following advantages: the present invention installs the silicon electrode in the receiving groove of the carrier so that the surface to be polished of the silicon electrode is exposed from the carrier and contacts the polishing cloth, thereby facilitating the polishing of the silicon electrode; the sidewalls of the receiving groove are used to limit the movement range of the silicon electrode, thereby preventing the silicon electrode from escaping from the receiving groove during the polishing process; the end wall of the planetary gear ring is prevented from abutting against the polishing cloth, thereby reducing friction on the polishing cloth and extending the service life of the polishing cloth;

[0019] After the silicon electrode is placed in the holding tank, one side wall of the silicon electrode contacts the suction cup. At this time, the air flow channel is evacuated through the air valve, making the air pressure inside the air flow channel lower than the external air pressure. At this time, the silicon electrode is squeezed onto the suction cup, further fixing the silicon electrode and enhancing its stability.

[0020] At the same time, the silicon electrode can be fixed to the planetary gear ring on the outside of the polishing equipment, which is convenient for the installation of the silicon electrode. The silicon electrode is further fixed by the suction cup to strengthen the firmness of the silicon electrode on both sides of the carrier, and prevent the silicon electrode from falling off from the planetary gear ring when the planetary gear ring is placed between the sun gear and the gear ring.

[0021] Since a suction cup is provided inside the receiving groove to further fix the silicon electrode, a silicon electrode of any diameter smaller than the diameter of the receiving groove can be placed inside the receiving groove, which facilitates the installation of the silicon electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the first part of the present invention;

[0024] Figure 3 This is a schematic diagram of the driving structure of the upper polishing plate of the present invention;

[0025] Figure 4 for Figure 3 Schematic diagram of the expansion;

[0026] Figure 5 It is a partial cross-sectional view of the present invention;

[0027] Figure 6 This is a schematic diagram of the installation of the planetary ring gear and the bearing;

[0028] Figure 7 It is a schematic diagram of the local structure of the present invention;

[0029] Figure 8 for Figure 7 A first angle cross-sectional view of

[0030] Figure 9 for Figure 7 Schematic diagram of the expansion;

[0031] Figure 10 for Figure 7 A second angled sectional view of

[0032] Figure 11 This is a schematic diagram of the installation of the positioning mechanism of the present invention;

[0033] Figure 12 This is a schematic diagram of the installation of three planetary ring gears.

[0034] In the figure: 100, body; 101, support frame; 102, cylinder; 11, transmission sleeve; 12, first motor; 13, pulley assembly; 14, second motor; 15, third motor; 16, polishing liquid recovery cover; 161, polishing liquid recovery tank; 162, purification equipment; 163, liquid outlet nozzle; 171, positioning plate; 172, connecting rod; 173, mounting plate; 1731, liquid separation tank; 18, diverter pipe; 19, fourth motor; 191, transmission rod; 21, upper polishing plate; 211, Polishing cloth; 212, leakage hole; 213, avoidance hole; 22, lower polishing plate; 3, sun gear; 4, ring gear; 5, planetary ring gear; 51, positioning hole; 6, bearing member; 61, receiving groove; 62, bearing groove; 63, connecting pipe; 64, air flow channel; 65, mounting groove; 651, limiting groove; 66, adjusting groove; 7, positioning mechanism; 71, positioning rod; 711, meshing teeth; 712, limiting rib; 72, gear; 73, adjusting rod; 8, suction cup; 9, air valve; 10, silicon electrode. DETAILED DESCRIPTION

[0035] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0036] This embodiment provides a silicon electrode polishing device, which is mainly used for polishing silicon electrodes, solving the problem of friction between the planetary gear ring and the polishing cloth on the lower polishing plate, and preventing the silicon electrode from detaching from the through hole of the planetary gear ring, thereby reducing the defective rate during the silicon electrode polishing process.

[0037] like Figure 1 、 Figure 5 and Figure 6 As shown, the polishing equipment includes a ring gear 4, a sun gear 3, an upper polishing plate 21, a lower polishing plate 22 and a polishing cloth 211 wrapped around the upper side of the upper polishing plate 21 and the lower polishing plate 22, wherein the sun gear 3 is arranged at the center of the ring gear 4; the center positions of the upper polishing plate 21 and the lower polishing plate 22 are provided with avoidance holes 213 running through the upper and lower parts for the sun gear 3 to pass through; the equipment also includes a planetary ring gear 5 located between the ring gear 4 and the sun gear 3, the planetary ring gear 5 is meshed with the inner teeth of the ring gear 4 and the outer teeth of the sun gear 3 at the same time, a carrier 6 is placed in the through hole in the middle of the planetary ring gear 5, and silicon electrodes 10 are installed on the upper and lower surfaces of the carrier 6, and a positioning mechanism 7 for fixing the carrier 6 on the planetary ring gear 5 is also provided on the carrier 6.

[0038] Specifically, such as Figure 7 and Figure 8 As shown, the carrier 6 is thicker than the planetary gear ring 5. The planetary gear ring 5 is mounted on the outside of the carrier 6 and is located in the middle of the carrier 6 in its axial direction. The bottom wall of the carrier 6 is lower than the bottom wall of the planetary gear ring 5, and the top wall of the carrier 6 is higher than the top wall of the planetary gear ring 5. A positioning mechanism 7 is used to fix the carrier 6 and the planetary gear ring 5, elevating the planetary gear ring 5 to prevent contact between the planetary gear ring 5 and the polishing cloth 211 on the polishing disk, thereby reducing wear of the polishing cloth 211 by the planetary gear ring 5 and increasing the service life of the polishing cloth 211.

[0039] In order to achieve the fixation of the carrier 6 and the planetary ring gear 5, in this embodiment, as shown in FIG. Figure 8 、 Figure 9 and Figure 10 As shown, the inner wall of the planetary gear ring 5 is provided with a plurality of positioning holes 51, wherein the positioning mechanism 7 includes a positioning rod 71 and a driving mechanism for driving the positioning rod 71 to move. In this embodiment, the peripheral wall of the carrier 6 is provided with a plurality of mounting grooves 65 extending radially along the carrier 6, wherein the positioning rod 71 is slidably installed in the mounting groove 65. When it is necessary to fix the carrier 6 and the planetary gear ring 5, the mounting groove 65 is aligned with the positioning hole 51 on the planetary gear ring 5, and then the driving mechanism is used to drive the positioning rod 71 to move radially outward along the carrier 6, so that the positioning rod 71 is inserted into the positioning hole 51, thereby realizing the fixation of the carrier 6 and the planetary gear ring 5.

[0040] Specifically, in this embodiment, Figure 10 As shown, in order to improve the stability of the carrier 6 and the planetary ring gear 5, the positioning mechanism 7 is provided with four groups and evenly distributed along the circumference of the carrier 6. When the carrier 6 is installed, the four positioning rods 71 ​​are respectively inserted into the corresponding positioning holes 51.

[0041] In order to realize the movement of the positioning rod 71, in this embodiment, as shown in FIG. Figure 9 and Figure 11 As shown, the carrier 6 is provided with an adjustment groove 66 connected to the installation groove 65, wherein the driving mechanism includes meshing teeth 711 provided on the positioning rod 71, and the meshing teeth 711 are arranged along the axial direction of the positioning rod 71. A gear 72 meshing with the meshing teeth 711 is provided inside the adjustment groove 66, wherein an upwardly extending adjustment rod 73 is fixed on the gear 72, and the adjustment rod 73 is used to drive the gear 72 to rotate, and the positioning rod 71 is driven to move along the radial direction of the carrier 6 by the meshing teeth 711 that mesh with each other, thereby realizing the switching between the fixed and released states of the carrier 6 and the planetary ring gear 5.

[0042] Specifically, in this embodiment, in order to prevent the adjusting rod 73 from extending out of the carrier 6 and contacting the polishing cloth 211 on the polishing disk, the adjusting rod 73 is located inside the adjusting groove 66, and the end of the adjusting rod 73 is provided with an inwardly recessed hexagonal groove so that the hexagonal bolt drives the adjusting rod 73 to rotate.

[0043] In order to prevent the positioning rod 71 from rotating in the installation groove 65, in this embodiment, as shown in FIG. Figure 11 As shown, the inner wall of the mounting groove 65 is provided with a limiting groove 651 arranged radially along the supporting member 6, wherein the positioning rod 71 is provided with a limiting rib 712 arranged axially along the positioning rod 71. When the positioning rod 71 is installed in the mounting groove 65, the limiting rib 712 is inserted into the limiting groove 651, and the side wall of the limiting rib 712 is slidably connected to the side wall of the limiting groove 651, thereby limiting the circumferential rotation of the positioning rod 71 during its movement.

[0044] In order to fix the silicon electrode 10 on the carrier 6 and prevent the silicon electrode 10 and the planetary gear ring 5 from being separated from the carrier 6 during the installation process, it is inconvenient to install the planetary gear ring 5 and the silicon electrode 10 between the sun gear 3 and the ring gear 4. In this embodiment, as shown in FIG. Figure 8 and Figure 9 As shown, the upper and lower sides of the supporting member 6 are provided with an inwardly recessed receiving groove 61, the bottom wall of the receiving groove 61 is installed with a suction cup 8 with air holes, and the supporting member 6 is provided with an air flow channel 64 connected to the air holes of the suction cup 8, and an air valve 9 is installed at the end of the air flow channel 64.

[0045] With the above arrangement, when the silicon electrode 10 is installed, it is placed in the receiving groove 61 and one end surface of the silicon electrode 10 abuts against the suction cup 8. Figure 8 As shown, the thickness of the silicon electrode 10 is greater than the depth of the accommodating groove 61. At this time, the end face of the silicon electrode 10 exceeds the end face of the carrier 6. When the silicon electrode 10 is polishing, the end face of the carrier 6 is prevented from abutting against the polishing cloth 211, which can extend the service life of the polishing cloth.

[0046] After the silicon electrode 10 is placed inside the receiving groove 61, in order to strengthen the suction force of the suction cup 8 on the silicon electrode 10, air is pumped into the air flow channel 64 through the air valve 9. Since the air holes of the suction cup 8 are connected to the air flow channel 64, a pressure difference is formed on both sides of the silicon electrode 10, which squeezes the silicon electrode 10 onto the suction cup 8, thereby improving the stability of the silicon electrode 10.

[0047] During this process, when the silicon electrode 10 needs to be installed, the carrier 6 and the planetary ring gear 5 can be fixed first, and then the silicon electrodes 10 can be placed in the corresponding receiving grooves 61 respectively. By evacuating the air flow channel 64, the silicon electrode 10 is adsorbed by the suction cup 8. At this time, the fixation of the silicon electrode 10 and the carrier 6 is completed. At this time, the planetary ring gear 5 can be placed from top to bottom between the sun gear 3 and the ring gear 4, so that the planetary ring gear 5 is meshed with the sun gear 3 and the ring gear 4 respectively, thereby solving the problem of the silicon electrode 10 falling off from the carrier 6 during the installation of the planetary ring gear 5.

[0048] In order to install the suction cup 8, in this embodiment, as shown in FIG. Figure 8 and Figure 9 As shown, the bottom wall of the accommodating groove 61 is provided with an inwardly recessed supporting groove 62, and the supporting grooves 62 on the upper and lower sides are connected by a connecting pipe 63, wherein the air flow channel 64 is connected to the connecting pipe 63, and the suction cup 8 is installed in the supporting groove 62, and the tail of the suction cup 8 extends toward the inside of the connecting pipe 63.

[0049] When the silicon electrode 10 needs to be polished on the other side, air is inflated into the air flow channel 64 through the air valve 9, and the gas is discharged outward through the air holes of the suction cup 8, eliminating the air pressure difference on both sides of the silicon electrode 10. The silicon electrode 10 can then be removed from the suction cup 8 and the silicon electrode 10 can be changed to another side.

[0050] In order to realize the rotation of the upper polishing plate 21 and the lower polishing plate 22, in this embodiment, as shown in FIG. Figure 2 、 Figure 3 and Figure 5 As shown, a fourth motor 19 is provided above the upper polishing plate 21, and the fourth motor 19 is used to drive the upper polishing plate 21 to rotate. A first motor 12 is provided below the lower polishing plate 22 and is located in the inner cavity of the machine body 100, and the first motor 12 is used to drive the lower polishing plate 22 to rotate.

[0051] In order to realize the rotation of the planetary ring gear 5, in this embodiment, as shown in FIG. Figure 2 and Figure 5 As shown, a second motor 14 is provided in the inner cavity of the body 100 for driving the sun gear 3 to rotate, and a third motor 15 is provided for driving the ring gear 4 to rotate.

[0052] Since the sun gear 3 is located in the avoidance hole 213 of the lower polishing plate 22, and the sun gear 3 and the lower polishing plate 22 are coaxially arranged, in order to facilitate the driving of the sun gear 3 and the lower polishing plate 22, in this embodiment, as shown in FIG. Figure 2 and Figure 5 As shown, the bottom wall of the lower polishing disc 22 is fixedly connected to a downwardly extending transmission sleeve 11, and a pulley group 13 is provided between the transmission sleeve 11 and the first motor 12 for transmitting the power of the first motor 12 to the transmission sleeve 11, thereby driving the rotation of the lower polishing disc 22. At this time, the output shaft of the second motor 14 passes through the inner cavity of the transmission sleeve 11 and is fixedly connected to the sun gear 3. At this time, the output shaft of the second motor 14 is rotationally connected to the inner wall of the transmission sleeve 11.

[0053] Before polishing the silicon electrode 10, a gap should be reserved between the upper polishing plate 21 and the lower polishing plate 22 for the installation of the planetary gear ring 5, the carrier 6 and the silicon electrode 10. Figure 1 As shown, when the silicon electrode 10 is being polished, the upper polishing plate 21 needs to be lowered downward so that the polishing cloth 211 on the upper polishing plate 21 abuts against the silicon electrode 10 on the upper side of the carrier 6. Therefore, in this embodiment, as shown in FIG. Figure 1 、 Figure 3 and Figure 4 As shown, an upwardly extending support frame 101 is provided on the upper side of the machine body 100, wherein a cylinder 102 is fixedly mounted on the support frame 101, and a cylinder rod of the cylinder 102 is fixedly connected to the fourth motor 19 to realize the lifting and lowering of the fourth motor 19 and the upper polishing plate 21.

[0054] During the polishing process of the silicon electrode 10, polishing liquid needs to be supplied to the polishing cloth 211, so as to wash downward the particles caused by friction on the surface of the silicon electrode 10 and improve the roughness of the surface of the silicon electrode 10. Therefore, in this embodiment, the upper polishing plate 21 and the lower polishing plate 22 are provided with a plurality of leakage holes 212 running through the upper and lower parts. The polishing liquid is poured on the upper polishing plate 21, and then flows downward along the leakage holes 212 on the upper polishing plate 21, and then diverted to the polishing cloth 211. The polishing liquid is evenly dispersed on the surface of the silicon electrode 10 through the polishing cloth 211. The polishing liquid drips downward through the polishing cloth 211 on the upper polishing plate 21 to the polishing cloth 211 on the lower polishing plate 22, and then drips downward along the leakage holes 212 on the lower polishing plate 22.

[0055] During the polishing process of the silicon electrode 10, the upper polishing plate 21 is in a rotating state. In order to accurately drop the polishing liquid into the leakage hole 212 of the upper polishing plate 21, in this embodiment, Figure 3 and Figure 4As shown, a positioning plate 171 is fixedly provided on the upper wall of the upper polishing disc 21, and an upwardly extending connecting rod 172 is fixedly provided on the positioning plate 171, wherein a plurality of connecting rods 172 are provided and are evenly distributed along the circumference of the upper polishing disc 21, and the top of the connecting rod 172 is fixedly provided with the same mounting disc 173, wherein a liquid separation groove 1731 is provided on the mounting disc 173, and the liquid separation groove 1731 is used to receive the polishing liquid, and a liquid separation hole is provided on the bottom wall of the liquid separation groove 1731, wherein the liquid separation hole is connected to the leakage hole 212 on the upper polishing disc 21 through a diversion pipe 18, and then the polishing liquid in the liquid separation groove 1731 is injected into the polishing cloth 211 on the upper polishing disc 21.

[0056] In this embodiment, twelve diversion pipes 18 are provided.

[0057] Specifically, in order to achieve synchronous rotation of the mounting plate 173 and the upper polishing plate 21, in this embodiment, as shown in FIG. Figure 4 As shown, the output shaft of the fourth motor 19 is fixedly connected to the mounting plate 173 through a transmission rod 191, which transmits the power of the fourth motor 19 to the mounting plate 173 and drives the mounting plate 173 to rotate.

[0058] When the polishing liquid leaks downward from the leakage hole 212 of the lower polishing plate 22, in order to receive the polishing liquid, in this embodiment, as shown in FIG. Figure 2 and Figure 5 As shown, a polishing liquid recovery cover 16 is provided in the inner cavity of the machine body 100 and is located on the lower side of the lower polishing plate 22, wherein the polishing liquid recovery cover 16 is used to receive the polishing liquid and gather the polishing liquid into the polishing liquid recovery box 161. A purification device 162 is also provided in the inner cavity of the machine body 100 for purifying the polishing liquid in the polishing liquid recovery box 161. The purification device 162 returns the treated polishing liquid to the liquid separation tank 1731 through the pipeline and the liquid outlet nozzle 163, thereby realizing the recycling of the polishing liquid.

[0059] Among them, several planetary gear rings 5 ​​and bearings 6 can be placed between the gear ring 4 and the sun gear 3. Specifically, Figure 12 As shown, there are three planetary ring gears 5 in the ring gear 4. The number of planetary ring gears 5 is determined according to the size of the sun gear 3 and the ring gear 4 to achieve simultaneous polishing of multiple silicon electrodes 10, thereby improving the polishing efficiency of the silicon electrodes 10.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

Claims

1. A silicon electrode polishing device, comprising a planetary gear set, wherein the planetary gear set comprises a ring gear (4), a sun gear (3), and a planetary ring gear (5) meshing with the ring gear (4) and the sun gear (3), characterized in that: A carrier (6) for carrying a silicon electrode (10) is fixedly provided on the planetary gear ring (5), and an upper polishing disc (21) and a lower polishing disc (22) for installing a polishing cloth (211) are respectively provided on the upper and lower sides of the carrier (6), and a receiving groove (61) with a depth less than the thickness of the silicon electrode (10) is provided on the upper and lower walls of the carrier (6), and a suction cup (8) with air holes is installed on the bottom wall of the receiving groove (61), and an air flow channel (64) connected to the air holes of the suction cup (8) is provided on the carrier (6), and an air valve (9) is installed in the air flow channel (64). When the silicon electrode (10) is installed in the receiving groove (61), the silicon electrode (10) fits the suction cup (8), and the air pressure in the air flow channel (64) is less than the external air pressure; The invention comprises at least two positioning holes (51) provided on the inner side wall of the planetary gear ring (5); the carrier (6) is provided with a positioning rod (71) connected to the carrier (6) in a radially sliding manner; and a driving mechanism for driving the positioning rod (71) to move; when the carrier (6) is fixed, the driving mechanism drives the positioning rod (71) to be inserted into the positioning hole (51) of the planetary gear ring (5).

2. A silicon electrode polishing device according to claim 1, characterized in that: The thickness of the carrier (6) is greater than the thickness of the planetary gear ring (5); when the carrier (6) is fixed on the planetary gear ring (5), the bottom wall of the carrier (6) is lower than the bottom wall of the planetary gear ring (5), and the top wall of the carrier (6) is higher than the top wall of the planetary gear ring (5).

3. A silicon electrode polishing device according to claim 2, characterized in that: The peripheral wall of the carrier (6) is provided with a plurality of mounting grooves (65) arranged radially along the carrier (6), and the positioning rods (71) are installed in the mounting grooves (65).

4. The silicon electrode polishing device according to claim 3, characterized in that: The driving mechanism comprises an adjusting slot (66) communicating with the mounting slot (65), a gear (72) and meshing teeth (711); the meshing teeth (711) are arranged on the positioning rod (71) and along the axial direction of the positioning rod (71); the gear (72) is installed in the adjusting slot (66) and meshes with the meshing teeth (711).

5. The silicon electrode polishing device according to claim 4, characterized in that: The inner wall of the installation groove (65) is connected to a limiting groove (651) arranged radially along the bearing member (6), and a limiting rib (712) is fixed on the positioning rod (71). When the positioning rod (71) is installed in the installation groove (65), the limiting rib (712) is inserted into the limiting groove (651), and the side wall of the limiting rib (712) abuts against the inner wall of the limiting groove (651).

6. The silicon electrode polishing device according to claim 1, characterized in that: The upper polishing disc (21) and the lower polishing disc (22) are both provided with an avoidance hole (213) that penetrates from top to bottom, and the sun gear (3) is located in the avoidance hole (213) of the lower polishing disc (22).

7. The silicon electrode polishing device according to claim 1, characterized in that: The invention also comprises a machine body (100) and a support frame (101) mounted on the machine body (100) and extending vertically upwards, wherein a cylinder (102) is fixedly mounted on the support frame (101), a fourth motor (19) is fixedly mounted on the output end of the cylinder (102), and an output shaft of the fourth motor (19) is fixedly connected to the upper polishing disc (21).

8. The silicon electrode polishing device according to claim 7, characterized in that: A plurality of liquid leakage holes (212) are provided on the upper polishing disc (21) and / or the lower polishing disc (22), and the polishing device is further provided with a liquid outlet nozzle (163) for injecting polishing liquid into the liquid leakage holes (212).

9. The silicon electrode polishing device according to claim 8, characterized in that: A positioning plate (171) is fixedly provided on the upper polishing disc (21), and a plurality of upwardly extending connecting rods (172) are fixedly provided on the positioning plate (171). A mounting plate (173) is fixedly provided on the top of the connecting rod (172), and a liquid separation groove (1731) is provided on the mounting plate (173) for receiving the polishing liquid sprayed out by the liquid discharge nozzle (163). The output shaft of the fourth motor (19) is fixedly connected to the mounting plate (173), and a liquid separation hole is provided on the bottom wall of the liquid separation groove (1731), and the liquid separation hole is connected to the liquid leakage hole (212) of the upper polishing disc (21) through a shunt pipe (18).

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