Camera module and electronic device

Abstract

The embodiment of the application discloses a camera module, which comprises a shell and a base, the shell and the base are combined to form a containing cavity, and the containing cavity contains: a flexible spring circuit board piece, a PCB board piece, a support, an image sensor chip, a frame-shaped FPC board piece, a magnet coil assembly and a position sensor group. The embodiment of the application also provides an electronic device comprising the camera module. In this way, the image sensor chip is connected to the PCB board piece, the frame-shaped FPC board piece and the coil are arranged on the support, and the coil and the PCB board piece are electrically connected through the frame-shaped FPC board piece, so that the coil mounting area is not required to be arranged on the PCB board piece, and then the improvement of the structure of the PCB board piece to solve the problem of the contact interference between the PCB board piece and the elastic arm of the flexible spring circuit board piece is not required to be considered, the PCB board piece is more quick to process, and in addition, the components of the whole camera module are quick to connect and compact to arrange, and the miniaturization requirement is met.

Description

Technical Field

[0001] This application belongs to the field of camera device technology, and in particular relates to a camera module and electronic device. Background Technology

[0002] Currently, all existing handheld or portable shooting devices require image stabilization to prevent image quality issues caused by camera shake. Existing image stabilization methods typically involve moving the lens to reduce or eliminate camera shake during optical signal capture, thus improving image quality. However, current camera modules are complex in internal structure and difficult to manufacture. Therefore, this application provides a camera module and electronic device. Summary of the Invention

[0003] This application aims to address, at least to some extent, the complex internal structure and high manufacturing difficulty of traditional camera modules. Therefore, this application provides a camera module and electronic device.

[0004] This application provides a camera module, which includes a housing and a base, the housing and the base together forming a receiving cavity, the receiving cavity accommodating:

[0005] A flexible spring circuit board includes a frame-shaped flexible circuit board, a rigid circuit board located in the center of the frame-shaped flexible circuit board, and an elastic arm connecting the frame-shaped flexible circuit board and the rigid circuit board; the frame-shaped flexible circuit board is fixed on the base.

[0006] PCB board, connected to the rigid circuit board;

[0007] A support is fixedly mounted on the PCB board; the support and the PCB board together form a chip receiving cavity;

[0008] An image sensor chip is located within the chip housing cavity and connected to the PCB board.

[0009] A frame-shaped FPC board is fixed on the support and electrically connected to the PCB board;

[0010] A magnet coil assembly is used to control the translational movement of the image sensor chip in the X-axis and Y-axis directions and the rotational movement around the Z-axis. It includes a magnetic element and a coil disposed opposite to the magnetic element. The magnetic element is fixed on the housing. The coil is connected to the magnet coil assembly on the frame-shaped FPC board.

[0011] In this embodiment of the application, the focusing motor also includes a lens, and the focusing motor is fixed on the housing; the focusing motor is connected to the lens and is used to control the movement of the lens on the Z-axis.

[0012] In this embodiment, the support includes a frame-shaped support plate and a housing portion disposed at the center of the frame-shaped support plate; the chip receiving cavity is formed by the housing portion and the PCB board together, the frame-shaped support plate is provided with a mounting groove, the frame-shaped FPC board is fixed in the mounting groove and fitted outside the housing portion.

[0013] In this embodiment of the application, the support is provided with a through hole at the corner of the PCB board; the frame-shaped FPC board is electrically connected to the PCB board through the through hole.

[0014] In this embodiment of the application, the coil is a PCB coil.

[0015] In this embodiment of the application, the frame-shaped support plate is provided with a first positioning block and a second positioning block for limiting the installation of the PCB coil. The first positioning block is symmetrically arranged on both sides of the groove opening of the mounting groove along the X-axis direction, and the second positioning block is symmetrically arranged on both sides of the groove opening of the mounting groove along the Y-axis direction.

[0016] In this embodiment, both the first positioning block and the second positioning block include guide ramps, and the PCB coil is positioned at the opening of the mounting groove via the guide ramps.

[0017] In the embodiments of this application, the magnetic component is a unipolar magnet or a multipolar magnet.

[0018] In this embodiment of the application, the support is provided with a position sensor group for real-time feedback on the position change of the image sensor chip caused by camera module jitter. The position sensor group is located below the magnetic component and is electrically connected to the frame-shaped FPC board.

[0019] This application also provides an electronic device, including a camera module.

[0020] This application discloses a camera module, comprising: a housing and a base, the housing and the base forming a receiving cavity, the receiving cavity housing: a flexible spring circuit board, including a frame-shaped flexible circuit board, a rigid circuit board located at the center of the frame-shaped flexible circuit board, and an elastic arm connecting the frame-shaped flexible circuit board and the rigid circuit board; the frame-shaped flexible circuit board is fixed on the base; a PCB board connected to the rigid circuit board; a support fixed to the PCB board; the support and the PCB board together forming a chip receiving cavity; an image sensor chip located in the chip receiving cavity and connected to the PCB board; a frame-shaped FPC board fixed to the support and electrically connected to the PCB board; and a magnet coil assembly, including a magnetic element and a coil disposed opposite to the magnetic element, the magnetic element being fixed to the housing; the coil being connected to the frame-shaped FPC board; the magnet coil assembly is used to control the translational movement of the image sensor chip in the X-axis and Y-axis directions and its rotational movement around the Z-axis.

[0021] Since the image sensor chip is connected to the PCB board, and the frame-shaped FPC board and coil are set on the support, and the coil is electrically connected to the PCB board through the frame-shaped FPC board, there is no need to set up a coil mounting area on the PCB board. Therefore, there is no need to consider improving the PCB board structure to solve the problem of contact interference between the PCB board and the flexible spring circuit board, which makes the PCB board processing faster. In addition, the components of the entire camera module are quickly connected and compactly arranged, meeting the miniaturization requirements. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 An exploded view of the structure of the camera module in an embodiment of this application is shown;

[0024] Figure 2 A schematic cross-sectional view of the imaging module in an embodiment of this application is shown;

[0025] Figure 3 It shows Figure 1 Schematic diagram of the structure of the medium magnet coil assembly;

[0026] Figure 4 It shows Figure 1 A schematic diagram of the structure of the active carrier;

[0027] Figure 5 It shows Figure 1 Schematic diagram of the structure of a flexible spring circuit board;

[0028] Figure 6 It shows Figure 1 A schematic diagram of the structure of the PCB board. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0030] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this application. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this application provides examples of various specific processes and materials; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0031] The applicant discovered that in existing camera modules that use motion-driven image sensor chips for image stabilization, to simplify the electrical connection between the coil and the PCB board, the image sensor chip and the coil are connected together on the PCB board. The PCB board is then connected to the rigid circuit board 220 of the flexible spring circuit board 200. Considering the small size of the camera module, the PCB board is often larger than the rigid circuit board 220. Since the rigid circuit board 220 and the frame-shaped flexible circuit board 210 are connected by an elastic arm 230, the portion of the PCB board larger than the rigid circuit board 220 will contact the elastic arm 230, thus affecting it. The existing solution is to create a gap between the PCB board and the elastic arm 230, i.e., to machine a stepped surface on the side of the PCB board facing the elastic arm 230 to avoid it. However, this increases the difficulty of the PCB board manufacturing process.

[0032] Therefore, in order to solve the above problems, this application provides a camera module and an electronic device.

[0033] This application is described below with reference to the accompanying drawings and specific embodiments:

[0034] like Figures 1-6As shown, this application embodiment provides a camera module, which includes a housing 110, a base 120, a flexible spring circuit board 200, a PCB board 300, a support 400, an image sensor chip 500, a frame-shaped FPC board 600, a magnet coil assembly 700, a position sensor group 800, a lens 920, and a focusing motor 910.

[0035] See Figure 1 and Figure 2 The lens 920 is mounted on the housing 110 via the focusing motor 91. Specifically, the focusing motor 910 is fixed to the housing 110, and the lens 920 is connected to the focusing motor 910. The working of the focusing motor 910 can drive the lens 920 to move along the Z-axis. In order to make the installation of the focusing motor 910 faster, the top surface of the housing 110 is provided with a positioning groove and a wiring groove communicating with the positioning groove. During installation, the bottom of the focusing motor 910 is fixed in the positioning groove with glue to achieve quick positioning and fixation. It is required that the terminal pins on the bottom side of the focusing motor 910 are aligned with the wiring groove so that they can be electrically connected to the terminal pins on the bottom side of the focusing motor 910 through the wiring groove.

[0036] Continued Figure 1 and Figure 2 The outer shell 110 and the base 120 together form a receiving cavity 100. Specifically, the base 120 is a plate-shaped structure, and positioning blocks are formed at the four corners of the base 120. The positioning blocks at the four corners of the base 120 are inserted into the outer shell 110 for positioning, and the outer shell 110 and the base 120 are fixed by adhesive. At this time, the internal space of the outer shell 110 and the base 120 together form a receiving cavity 100. The receiving cavity 100 is provided with a flexible spring circuit board 200, a PCB board 300 (Printed Circuit Board), a support 400, an image sensor chip 500, a frame-shaped FPC board 600 (Flexible Printed Circuit), a magnet coil assembly 700 and a position sensor group 800.

[0037] See next. Figure 1 and Figure 5The flexible spring circuit board 200 is used to support the PCB board 300, image sensor chip 500, support 400 and coil 720 for anti-shake movement. The flexible spring circuit board 200 includes a frame-shaped flexible circuit board 210, a rigid circuit board 220 and an elastic arm 230. The frame-shaped flexible circuit board 210 is fixed on the base 120. Specifically, the frame-shaped flexible circuit board 210 is limited between the positioning blocks formed at the four corners of the base 120, and the edge of the frame-shaped flexible circuit board 210 is fixed by clamping between the base and the bottom edge of the housing. The terminal pins of the frame-shaped flexible circuit board 210 extend out of the receiving cavity 100 and are electrically connected to the flexible circuit board, and are electrically connected to the connector in the electronic device through the connector on the flexible circuit board.

[0038] A rigid circuit board 220 is connected to the central cutout of the frame-shaped flexible circuit board 210 via an elastic arm 230. This means the rigid circuit board 220 can move within the central cutout of the frame-shaped flexible circuit board 210 via the elastic arm 230. The elastic arm 230 can be a spring wire or other elastic connecting wire. Taking a spring wire as an example, it is electrically connected to the rigid circuit board 220 and serves to suspend and support the rigid circuit board 220, thereby supporting translation in the X and Y axes and rotation around the Z axis to achieve multi-axis anti-shake and provide cushioning. Unless otherwise specified, the structure consisting of the frame-shaped flexible circuit board 210, the rigid circuit board 220, and the spring wire is the flexible spring circuit board 200 in this embodiment.

[0039] Continued Figure 1 and Figure 2 The PCB board 300 is located above the rigid circuit board 220 and is connected to the rigid circuit board 220. The support 400 is located above the PCB board 300 and is fixed to the PCB board 300. The support 400 and the PCB board 300 together form a chip receiving cavity 410. An image sensor chip 500 is disposed within the chip receiving cavity 410 and is connected to the PCB board 300. A frame-shaped FPC board 600 is located above the support 400 and is fixed to the support 400. C-board 600 is electrically connected to PCB board 300; magnet coil assembly 700 is located above frame-shaped FPC board 600. Magnet coil assembly 700 includes magnetic component 710 and coil 720 disposed opposite to magnetic component 710. Magnetic component 710 is fixed on housing 110. Specifically, magnetic component 710 is installed and positioned in a slot on the inner wall of housing 110 and glued in place; coil 720 is connected to frame-shaped FPC board 600. Magnet coil assembly 700 is used to control the translational movement of image sensor chip 500 in the X-axis and Y-axis directions and the rotational movement around the Z-axis.

[0040] Since the image sensor chip 500 is connected to the PCB board 300, and the frame-shaped FPC board 600 and coil 720 are set on the support 400, and the coil 720 is electrically connected to the PCB board 300 through the frame-shaped FPC board 600, there is no need to set a coil mounting area on the PCB board 300. As long as the size of the processed PCB board 300 is equal to or smaller than the size of the rigid circuit board 220, and can support the image sensor chip 500 and the support 400, it is sufficient. Since the size of the PCB board 300 is equal to or smaller than the size of the rigid circuit board 220, there is no need to improve the PCB board structure to solve the problem of contact interference between the PCB board and the elastic arm 230, making the PCB board processing faster. In this embodiment, the size of the rigid circuit board 220 of the flexible spring circuit board 200 is equal to the size of the PCB board 300.

[0041] In some embodiments, regarding the support 400, the PCB board 330, and the structural connection of the PCB board 300, see [reference needed]. Figure 2 The support 400 is an integrally molded structure, including a frame-shaped support plate 420 and a cover 430 disposed in the center of the frame-shaped support plate 420. The cover 430 is the main body of the support 400. The chip accommodating cavity 410 is formed by the cover 430 and the PCB board 330. The cover 430 has a light-transmitting hole 431 that communicates with the chip accommodating cavity 410. Specifically, the axis of the light-transmitting hole 431 is coaxial with the axis of the lens 920. A filter 432 for covering the light-transmitting hole 431 is fixed on the upper part of the cover 430. Specifically, in order to facilitate the installation and positioning of the filter 432, the upper surface of the cover 430 has a filter mounting groove that communicates with the light-transmitting hole 431 and is used to install the filter 432.

[0042] Further, see Figure 2 To facilitate faster installation and positioning of the PCB board 330, a PCB board positioning groove is formed in the recessed area at the bottom of the cover portion 430. The PCB board 330 is snapped into the PCB board positioning groove and fixed by adhesive. To avoid interference between the frame-shaped support plate portion 420 and the elastic arm 230 of the flexible spring circuit board 200, a gap can be made between the lower surface of the frame-shaped support plate portion 420 and the lower surface of the cover portion 430 to avoid the elastic arm 230. Alternatively, when the lower surface of the frame-shaped support plate portion 420 is flush with the lower surface of the cover portion 430, the depth of the PCB board positioning groove can be less than the thickness of the PCB board 330.

[0043] Further, see Figure 4In order to make the frame-shaped FPC panel 600 easier to install and position, the upper surface of the frame-shaped support plate 420 is recessed to form an installation groove 421. The frame-shaped FPC panel 600 is sleeved on the outside of the cover 430, and the frame-shaped support plate 420 is installed and fixed in the installation groove 421.

[0044] In some embodiments, see Figure 1 Regarding the electrical connection between the frame-shaped FPC board 600 and the PCB board 300, the frame-shaped FPC board 600 and the PCB board 300 can be electrically connected via a flexible board. That is, one end of the flexible board is electrically connected to the PCB board 300, and the other end of the flexible board is folded over and bypasses the support 400 to be electrically connected to the frame-shaped FPC board 600. Alternatively, the frame-shaped FPC board 600 and the PCB board 300 can be directly connected via soldering. That is, a through hole 440 is opened on the support 400. One end of the through hole 440 is close to the rigid board connection position on the frame-shaped FPC board 600 used for electrical connection with the PCB board 300, and the other end of the through hole 440 is close to the flexible board connection position on the PCB board 300 used for electrical connection with the frame-shaped FPC board 600. In this way, when connecting, it is only necessary to inject solder into the through hole 440 to connect the flexible board connection position and the rigid board connection position.

[0045] Furthermore, considering the miniaturization of the camera module and the requirement for minimizing the PCB board 300, the frame-shaped FPC board 600 and the PCB board 300 are directly connected by soldering, which requires through holes 440 to be opened on the support; specifically, see Figure 6 The upper surface of the PCB board 300 is provided with a chip and electronic component soldering area and an annular adhesive area located around the chip and electronic component soldering area. In order to minimize the PCB board 300, the flexible board connection position can be set at the outer edge of the annular adhesive area. In order to facilitate the electrical connection between the frame-shaped FPC board 600 and the PCB board 300, the rigid board connection position on the frame-shaped FPC board 600 is set to correspond to the flexible board connection position on the PCB board 300, that is, the rigid board connection position is set at the inner edge of the frame-shaped FPC board 600.

[0046] Specifically, see Figure 4 The support 400 is provided with a through hole 440 at the corner of the corresponding PCB board 300. The frame-shaped FPC board 600 is electrically connected to the PCB board 300 through the through hole 440. That is to say, the flexible board connection position is set at the outer corner of the annular adhesive area, that is, at the corner of the PCB board 300, and the rigid board connection position is set at the inner corner of the frame-shaped FPC board 600.

[0047] Furthermore, the PCB board 330 is fixed in the PCB board positioning groove, and the through hole 440 is set at the corner of the PCB board positioning groove.

[0048] Furthermore, four through holes 440 are provided, located at the four corners of the positioning groove on the PCB board.

[0049] In some embodiments, the specific distribution of the magnetic element 710 and the coil 720 is described, see [reference needed]. Figure 3 The magnetic component 710 includes a first magnetic component, a second magnetic component, a third magnetic component, and a fourth magnetic component. The first and second magnetic components are symmetrically distributed on both sides of the cover portion 430 of the support 400 along the X-axis direction, and the third and fourth magnetic components are symmetrically distributed on both sides of the cover portion 430 of the support 400 along the Y-axis direction.

[0050] Coil 720 includes a first coil, a second coil, a third coil, a fourth coil, a fifth coil, a sixth coil, a seventh coil, and an eighth coil. The first and second coils are arranged side by side below the first magnetic component along the length of the first magnetic component. The third and fourth coils are arranged side by side below the second magnetic component along the length of the second magnetic component. The fifth and sixth coils are arranged side by side below the third magnetic component along the length of the third magnetic component. The seventh and eighth coils are arranged side by side below the fourth magnetic component. The first and third coils are symmetrically arranged, as are the second and fourth coils, the fifth and seventh coils, and the sixth and eighth coils. During image stabilization, the energization of coil 720 is sufficient to generate a force with magnetic component 710 that controls the translational movement of image sensor chip 500 in the X and Y axes and its rotational movement around the Z axis.

[0051] Furthermore, the magnetic component 710 can be a unipolar magnet or a multipolar magnet. Specifically, in this embodiment, when the magnetic component 710 is a multipolar magnet, in order to improve the performance of the magnetic component 710 and the coil 720, each magnetic component 710 can be composed of two parallel first magnets 711 and second magnets 712. The magnetic poles of the first magnet 711 and the second magnet 712 are opposite. In this way, during use, the positive and negative poles of the first magnet 711 and the second magnet 712 can be used to better control the Ampere force generated by the coil 720 in different directions.

[0052] Furthermore, coil 720 is a PCB coil, which makes the soldering connection between the PCB coil and the frame-shaped FPC board 600 faster. Specifically, coil 720 is a PCB coil made using MEMS (Micro-Electro-Mechanical System) technology. Since the PCB itself is a multi-layer structure composed of copper foil and insulating layers, each layer of copper foil can be etched with multiple coils. The coils of the upper and lower layers are connected through vias, and finally a PCB coil integrated with the PCB is formed.

[0053] Furthermore, in order to make the soldering of the PCB coil to the frame-shaped FPC board 600 more precise and faster, the frame-shaped support plate 420 is provided with a first positioning block 422 and a second positioning block 423 for limiting the installation of the PCB coil. The first positioning block 422 is symmetrically arranged on both sides of the slot opening of the mounting groove 421 along the X-axis direction, and the second positioning block 423 is symmetrically arranged on both sides of the slot opening of the mounting groove 421 along the Y-axis direction. In this way, the installation and positioning of the PCB coil can be completed by limiting the PCB coil within the area enclosed by the two first positioning blocks 422 and the two second positioning blocks 423. That is to say, the PCB coil can be directly soldered to the frame-shaped FPC board 600.

[0054] Furthermore, guide ramps 450 are provided on both the first positioning block 422 and the second positioning block 423. When the PCB coil is installed, it can be quickly positioned at the opening of the mounting slot 421 through the guide ramps 450. In other words, under the guidance of the guide ramps 450, the PCB coil can enter the area enclosed by the two first positioning blocks 422 and the two second positioning blocks 423 more smoothly.

[0055] In some embodiments, see Figure 1 In order to provide real-time feedback on the positional changes of the image sensor chip 500 caused by camera module jitter, a position sensor group 800 is provided on the support 400. Specifically, the position sensor group 800 may include a Hall sensor, a magnetic sensor (TMR), an integrated position sensor of Hall sensor and driver IC, etc. The position sensor group 800 is located below the magnetic component 710 and is electrically connected to the frame-shaped FPC board 600.

[0056] Furthermore, in order to more accurately detect changes in the position of the image sensor chip 500 during image stabilization, a position sensor group 800 can be set directly below or diagonally below the magnetic component 710. When in use, the position sensor group 800 can determine the positional changes of the image sensor chip 500 caused by camera module shaking by detecting changes in the overall magnetic angle of the magnetic component 710.

[0057] Furthermore, to better detect the positional changes of the image sensor chip 500 along the X-axis and Y-axis, the position sensor group 800 includes a first position sensor group 810 and a second position sensor assembly 820. The first position sensor assembly 810 is disposed below a first or second magnetic element disposed along the X-axis to acquire the positional change signal of the image sensor chip 500 in the X-axis direction. The second position sensor assembly 820 is disposed below a third or fourth magnetic element disposed along the Y-axis to acquire the positional change signal of the image sensor chip 500 in the Y-axis direction. By configuring the first position sensor assembly 810 and the second position sensor assembly 820, the positional changes of the image sensor chip 500 can be monitored in real time, thus facilitating image stabilization. More specifically, the first position sensor assembly 810 and the second position sensor assembly 820 can be directly connected to the frame-shaped FPC board 600.

[0058] This application provides an electronic device that includes the camera module described in the above embodiments. In some embodiments, the electronic device may be a mobile phone or a laptop computer.

[0059] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0061] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0062] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0065] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0066] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that, The enclosure includes a housing (110) and a base (120), which together form a receiving cavity (100), the receiving cavity (100) containing: The flexible spring circuit board (200) includes a frame-shaped flexible circuit board (210), a rigid circuit board (220) located in the center of the frame-shaped flexible circuit board (210), and an elastic arm (230) connecting the frame-shaped flexible circuit board (210) and the rigid circuit board (220); the frame-shaped flexible circuit board (210) is fixed on the base (120); A PCB board (300) is connected to the rigid circuit board (220); A support (400) is fixed on the PCB board (300); the support (400) and the PCB board (300) together form a chip receiving cavity (410). An image sensor chip (500) is located within the chip accommodating cavity (410) and connected to the PCB board (300). A frame-shaped FPC board (600) is fixed on the support (400) and electrically connected to the PCB board (300); A magnet coil assembly (700) is used to control the translational movement of the image sensor chip (500) in the X-axis and Y-axis directions and the rotational movement around the Z-axis. It includes a magnetic element (710) and a coil (720) disposed opposite to the magnetic element (710). The magnetic element (710) is fixed on the housing (110). The coil (720) is connected to the frame-shaped FPC board (600).

2. The camera module according to claim 1, characterized in that, It also includes a focusing motor (910) and a lens (920), the focusing motor (910) being fixed on the housing (110); the focusing motor (910) is connected to the lens (920) and is used to control the movement of the lens (920) on the Z-axis.

3. The camera module according to claim 1, characterized in that, The support (400) includes a frame-shaped support plate (420) and a cover (430) disposed at the center of the frame-shaped support plate (420); the chip receiving cavity (410) is formed by the cover (430) and the PCB board (300) together. The frame-shaped support plate (420) is provided with a mounting groove (421). The frame-shaped FPC board (600) is fixed in the mounting groove (421) and fitted outside the cover (430).

4. The camera module according to claim 3, characterized in that, The support (400) is provided with a through hole (440) at the corner of the PCB board (300); the frame-shaped FPC board (600) is electrically connected to the PCB board (300) through the through hole (440).

5. The camera module according to claim 4, characterized in that, The coil (720) is a PCB coil.

6. The camera module according to claim 5, characterized in that, The frame-shaped support plate (420) is provided with a first positioning block (422) and a second positioning block (423) for limiting the installation of the PCB coil. The first positioning block (422) is symmetrically arranged on both sides of the groove opening of the mounting groove (421) along the X-axis direction, and the second positioning block (423) is symmetrically arranged on both sides of the groove opening of the mounting groove (421) along the Y-axis direction.

7. The camera module according to claim 6, characterized in that, Both the first positioning block (422) and the second positioning block (423) include a guide slope (450), and the PCB coil is positioned at the opening of the mounting groove (421) by the guide slope (450).

8. The camera module according to claim 1, characterized in that, The magnetic component (710) is a unipolar magnet or a multipolar magnet.

9. The camera module according to claim 1, characterized in that, The support (400) is provided with a position sensor group (800) for real-time feedback on the position change of the image sensor chip (500) caused by camera module jitter. The position sensor group (800) is located below the magnetic component (710) and is electrically connected to the frame-shaped FPC board (600).

10. An electronic device, characterized in that, Includes any one of the camera modules according to any one of claims 1 to 9.

Images