Cooling system for data centers

Abstract

Embodiments of the present disclosure provide a cooling system for a data center, including a heat exchanger and an adsorption refrigeration assembly. The heat exchanger is configured to cool a first secondary side cooling liquid and provide the cooled first secondary side cooling liquid to a device to be cooled. The adsorption refrigeration assembly is connected to the heat exchanger and configured to receive a heated first secondary side cooling liquid from the device to be cooled, use the heated first secondary side cooling liquid as a heat source to desorb at least one adsorption refrigeration module in the adsorption refrigeration assembly, return the first secondary side cooling liquid to the heat exchanger, condense water vapor desorbed from the at least one adsorption refrigeration module into condensed water, and cool a second secondary side cooling liquid with the condensed water and provide the cooled second secondary side cooling liquid to an air conditioning device.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to the field of data center cooling technology, and more particularly, to a cooling system for a data center. BACKGROUND

[0002] In recent years, increasing the supply water temperature of the cold source of a data center has become an important means of energy saving and consumption reduction. The higher the supply water temperature of the cold source, the more energy and water consumption can be greatly reduced. The liquid cooling solution of the data center can directly use a high-temperature heat source to supply water, which can bring energy saving and consumption reduction benefits to the data center. However, a considerable proportion of heat of the liquid cooling server is usually dissipated by the air cooling solution, i.e., dissipated by the server fan. Depending on the air conditioning system of the data center, the supply water temperature of the air cooling solution usually needs to use a low-temperature heat source, which leads to higher energy consumption and water consumption.

[0003] In addition, the data center usually needs to be planned and designed several months or even years in advance, while the actual business demand for computing power and network is a gradual iterative and clear process. Therefore, when the data center is planned in the early stage, it often encounters the contradiction between the layout and planning of the power density of the data center and the power density of the server package that will be actually put into operation in the future, especially when the product form of electronic equipment such as IT equipment is coupled with the establishment of the data center infrastructure. If the planned power density of the data center is too low, it cannot carry the future high-power-density server package, so that only a small amount of high-power-density servers can be installed in each cabinet, which will cause a great waste of rack positions. If the planned power density of the data center is too high, a large amount of heating and ventilation capacity will be wasted, which is a great waste of initial investment.

[0004] In addition, when the high-power-density server package is still in the development process, the server heat dissipation architecture may be an air cooling solution, or a cold plate liquid cooling solution, or even a case where air cooling and cold plate liquid cooling coexist in a certain period of time for the same model, which will increase the uncertainty of the early planning and design of the data center.

[0005] Therefore, how to reduce the energy consumption and water consumption of the data center and how to design a highly adaptive data center infrastructure solution are very important for the data center. SUMMARY

[0006] In one aspect of the present disclosure, a cooling system for a data center is provided, including a heat exchanger and an adsorption refrigeration assembly. The heat exchanger is configured to cool a first secondary side cooling liquid and provide the cooled first secondary side cooling liquid to a device to be cooled. The adsorption refrigeration assembly is connected to the heat exchanger and configured to receive a heated first secondary side cooling liquid from the device to be cooled, use the heated first secondary side cooling liquid as a heat source to desorb at least one adsorption refrigeration module in the adsorption refrigeration assembly, return the first secondary side cooling liquid to the heat exchanger, condense water vapor desorbed from the at least one adsorption refrigeration module into condensed water, and cool a second secondary side cooling liquid using the condensed water and provide the cooled second secondary side cooling liquid to an air conditioning device.

[0007] It should be understood that the contents described in this section are not intended to limit the key features or important features of the embodiments of the present disclosure, nor are they used to limit the scope of the present disclosure. Other features of the present disclosure will become apparent through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0008] The above-mentioned and other features and advantages of various embodiments of the present disclosure will become more apparent by reference to the following detailed description taken in conjunction with the accompanying drawings. In the drawings, like reference numerals denote like elements, wherein:

[0009] Figure 1 A structural schematic diagram of a cooling system for a data center is shown according to some embodiments of the present disclosure;

[0010] Figure 2 A structural schematic diagram of an adsorption refrigeration assembly is shown according to some embodiments of the present disclosure;

[0011] Figure 3 A structural schematic diagram of a cooling system for a data center is shown according to some embodiments of the present disclosure;

[0012] Figure 4 A structural schematic diagram of a cooling system for a data center is shown according to some embodiments of the present disclosure; and

[0013] Figure 5 A structural schematic diagram of a cooling system for a data center is shown according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0014] Preferred embodiments of the present disclosure will be described in more detail with reference to the drawings. Although preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure is more thoroughly and completely conveyed to those skilled in the art.

[0015] The term "includes" and its variants are meant to cover a non-exclusive inclusion, i.e. "including, but not limited to". The term "or" means "and / or" unless otherwise indicated. The term "based on" means "based, at least in part, on". The terms "one example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. can refer to different or same objects.

[0016] As described above, how to reduce the energy consumption and water consumption of the data center and how to design a highly adaptive data center infrastructure solution are very important for the data center.

[0017] The water supply temperature of the liquid cooling side of the liquid cooling data center is usually high, but still a considerable proportion of heat needs to be dissipated by the air conditioning system of the data center. In other words, the cooling system of the liquid cooling data center usually includes a liquid cooling side part and an air cooling side part, which work together to cool the electronic equipment in the machine room of the data center. Since the heat exchange efficiency of the air cooling side is much lower than that of the liquid cooling side, the water supply temperature required by the air cooling side is generally low, and how to reduce the water supply temperature of the air cooling side of the liquid cooling data center becomes the key to further energy saving and consumption reduction.

[0018] Since the water supply temperatures of the air conditioning system and the liquid cooling system are different, the liquid cooling data center often uses two sets of external cold sources to meet their cooling needs, or uses the same set of external cold sources to achieve flexible allocation of liquid cooling and air cooling by series or parallel connection of the air cooling side and the liquid cooling side and adding cold supplement to the air cooling side. The cooling scheme using two sets of external cold sources does not have the function of flexible allocation of liquid cooling and air cooling, and often needs to be designed in advance with fixed cooling capacity ratio or over-provisioning of cooling capacity on one side. The scheme of sharing the same set of external cold sources by series or parallel connection can achieve flexible allocation, but it is often difficult in terms of pipeline design, flow distribution and control, and the system complexity is high.

[0019] Embodiments of the present disclosure propose a cooling system for a data center, starting from wind-liquid compatibility, using medium and high temperature cold sources to integrate adsorption refrigeration technology to provide high and low gradient cooling for the data center, while meeting the high temperature cooling demand of the liquid cooling system and the low temperature cooling demand of the air cooling system, to realize wind-liquid compatible dual-temperature heat exchange of medium and high temperature cold sources with low system complexity, energy consumption and water consumption. The following will be combined with Figures 1 to 5 The principles of the present disclosure will be described in detail.

[0020] First, reference is made to Figure 1 , Figure 1A structural schematic of a cooling system for a data center according to some embodiments of the present disclosure is shown. As shown in Figure 1 The cooling system 100 described herein generally includes a heat exchanger 2 and an adsorption refrigeration assembly 3. The heat exchanger 2 is configured to provide a first secondary side cooling fluid to devices to be cooled (not shown) in a data center, which can flow directly through the devices to be cooled to take away heat generated by the devices to be cooled to cool the devices. The devices to be cooled can be IT devices such as servers, switches, etc. or other types of heat generating devices, which are not limited by embodiments of the present disclosure. The adsorption refrigeration assembly 3 is configured to provide a second secondary side cooling fluid to air conditioning devices (not shown) configured to provide air cooling to the devices to be cooled using the cold provided by the second secondary side cooling fluid. The adsorption refrigeration assembly 3 can include a plurality of adsorption refrigeration modules that can absorb heat when absorbing water to cool down, and the adsorption refrigeration modules can desorb water to restore the initial state when heated to be used for absorbing water to cool down again. In embodiments of the present disclosure, desorbing water can also be referred to as desorption, which refers to separating water absorbed by the adsorption refrigeration modules from the adsorption refrigeration modules by heating. Since the first secondary side cooling fluid directly cools the devices by liquid cooling and the second secondary side cooling fluid provides air cooling through the air conditioning devices, the temperature of the first secondary side cooling fluid can be higher, and the second secondary side cooling fluid needs to be at a lower temperature.

[0021] In one embodiment, as Figure 1As shown, the heat exchanger 2 includes a first cold source side liquid supply port 201, a first cold source side liquid return port 202, a first secondary side liquid supply port 211, and a first secondary side liquid return port 212. The first cold source side liquid supply port 201 and the first cold source side liquid return port 202 can be connected to a high-temperature external cold source (not shown) serving as a liquid cooling side cold source via conduits 401 and 402 to circulate the first cold source side coolant between the cold source side of the heat exchanger 2 and the high-temperature external cold source. The first cold source side liquid supply port 201 can receive the first cold source side coolant from the high-temperature external cold source via the conduit 401. The first cold source side liquid return port 202 can return the first cold source side coolant to the high-temperature external cold source via the conduit 402. The first secondary side liquid supply port 211 can be connected to the device to be cooled to provide the first secondary side coolant to the device to be cooled to carry away heat generated by the device to be cooled when in operation. The heat exchanger 2 can exchange heat between the first cold source side coolant and the first secondary side coolant to cool down the first secondary side coolant. As an example, the first cold source side coolant provided to the heat exchanger 2 from the high-temperature external cold source can be at a temperature of, for example, 38°C. The first cold source side coolant can be at an increased temperature after exchanging heat with the first secondary side coolant. For example, the first cold source side coolant returned to the high-temperature external cold source from the heat exchanger 2 can be at a temperature of 48°C. As an example, the first secondary side coolant returned to the heat exchanger 2 via the first secondary side liquid return port 212 can be at a temperature of 50°C, and the first secondary side coolant provided to the device to be cooled via the conduit 403 after being cooled down by the heat exchanger 2 can be at a temperature of 45°C. Since the water temperature required for the liquid cooling solution is high enough to meet the heat dissipation requirement, the high-temperature external cold source after being subjected to the first heat exchange by the heat exchanger 2 can be directly used to cool the electronic device.

[0022] It should be noted that the numbers, values, etc. mentioned above and elsewhere in the present disclosure are exemplary and are not intended to limit the scope of the present disclosure in any way. Any other suitable numbers, values, etc. are possible.

[0023] In some embodiments, the heat exchanger 2 can include a plate heat exchanger. In other embodiments, the heat exchanger 2 can include other types of heat exchangers, all within the scope of the present disclosure.

[0024] As Figure 1As shown, the adsorption refrigeration assembly 3 is connected to the heat exchanger 2 via a pipe 405. The adsorption refrigeration assembly 3 can receive the first secondary side coolant, which is warmed up, from the device to be cooled via the pipe 404, and the temperature of the received first secondary side coolant is, for example, 55°C. The adsorption refrigeration assembly 3 can use the warmed first secondary side coolant as a heat source to desorb at least one adsorption refrigeration module in the adsorption refrigeration assembly 3, while other adsorption refrigeration modules in the adsorption refrigeration assembly 3 can be in a state of water absorption and cooling. After flowing through the adsorption refrigeration assembly 3, the temperature of the first secondary side coolant is reduced, for example, to 50°C. The adsorption refrigeration assembly 3 can return the first secondary side coolant to the heat exchanger 2 via the pipe 405, and then exchange heat with the first cold source side coolant in the heat exchanger 2, so as to achieve cooling of the first secondary side coolant for recycling to the device to be cooled.

[0025] In addition, the adsorption refrigeration assembly 3 can condense the water vapor desorbed from the at least one adsorption refrigeration module into condensed water. Subsequently, the adsorption refrigeration assembly 3 can use the condensed water to cool the second secondary side coolant and provide the cooled second secondary side coolant to the air conditioning device via a pipe 408. As an example, the temperature of the second secondary side coolant provided by the adsorption refrigeration assembly 3 to the air conditioning device via the pipe 408 is 18°C, and the temperature of the second secondary side coolant returned from the air conditioning device to the adsorption refrigeration assembly 3 is 21°C.

[0026] The adsorption refrigeration assembly 3 can be connected to a medium-temperature external cold source (not shown) via pipes 406 and 407, to receive the second cold source side coolant from the medium-temperature external cold source via the pipe 406 and return the second cold source side coolant to the medium-temperature external cold source via the pipe 407. The medium-temperature external cold source has a lower water supply temperature than the high-temperature external cold source. Since the second cold source side coolant has a lower temperature, it can be used to condense the water vapor desorbed from the at least one adsorption refrigeration module into condensed water. In this process, the second cold source side coolant is raised. As an example, the temperature of the second cold source side coolant received from the medium-temperature external cold source via the pipe 406 is 27°C, and the temperature of the second cold source side coolant returned to the medium-temperature external cold source via the pipe 407 can be 32°C. For ease of description, in the embodiments of the present disclosure, the medium-temperature external cold source can also be referred to as the first external cold source, and the high-temperature external cold source can be referred to as the second external cold source.

[0027] In some embodiments, the second cold source side coolant can be further cooled in the adsorption refrigeration assembly 3 before being used to condense the water vapor desorbed from the at least one adsorption refrigeration module into condensed water, so as to more efficiently achieve condensation, which will be described in detail below. Figure 2

[0028] In some embodiments, as​Figure 1 As shown, the adsorption refrigeration assembly 3 comprises a second cold source side liquid supply port 301, a second cold source side liquid return port 302, a second secondary side liquid supply port 311, a second secondary side liquid return port 312, a first desorption connection port 321 and a second desorption connection port 322.

[0029] The second cold source side liquid supply port 301 and the second cold source side liquid return port 302 can be connected to the medium temperature external cold source via pipes 406 and 407 to circulate the second cold source side cooling liquid between the adsorption refrigeration assembly 3 and the medium temperature external cold source. The second cold source side liquid supply port 301 can receive the second cold source side cooling liquid from the medium temperature external cold source via the pipe 406, and the received second cold source side cooling liquid has a temperature of, for example, 27°C. The second cold source side liquid return port 302 can output the warmed second cold source side cooling liquid to the medium temperature external cold source via the pipe 407, and the output second cold source side cooling liquid has a temperature of, for example, 32°C. Since the second cold source side cooling liquid entering the adsorption refrigeration assembly 3 has a low temperature, the water vapor desorbed from the at least one adsorption refrigeration module can be condensed into condensed water via a suitable cooling unit.

[0030] The second secondary side liquid supply port 311 and the second secondary side liquid return port 312 can be connected to the air conditioning equipment via pipes 408 and 409. The second secondary side liquid supply port 311 can provide the cooled second secondary side cooling liquid to the air conditioning equipment via the pipe 408, and the provided second secondary side cooling liquid has a temperature of, for example, 18°C. The second secondary side liquid return port 312 can receive the warmed second secondary side cooling liquid from the air conditioning equipment via the pipe 409, and the received second secondary side cooling liquid has a temperature of, for example, 21°C. The warmed second secondary side cooling liquid received from the air conditioning equipment via the pipe 409 can be cooled again in the adsorption refrigeration assembly 3.

[0031] The first desorption connection port 321 can receive the warmed first secondary side cooling liquid from the equipment to be cooled via the pipe 404 and provide the first secondary side cooling liquid to the at least one adsorption refrigeration module, so that the at least one adsorption refrigeration module desorbs. The second desorption connection port 322 can be connected to the first secondary side liquid return port 212 of the heat exchanger 2 via the pipe 405 to return the first secondary side cooling liquid to the heat exchanger 2.

[0032] By using two different external cold sources, through device-level processing, the different gradients of the required water supply temperature of the liquid cooling side and the air cooling side can be fully utilized. In addition, by using adsorption refrigeration, the temperature of the external cold source required by the air conditioning equipment can be raised to the level of the medium-temperature cold source, without the need to use a low-temperature cold source, significantly reducing the energy consumption of the external cold source, and natural cooling can be achieved in most areas. In addition, since the internal system uses a direct temperature gradient utilization on the liquid cooling side, the use of a primary heat exchanger and a pump is reduced, which can improve the heat dissipation efficiency and reduce the energy consumption. In addition, by using such a cooling system, the data center can be deployed flexibly, improving the flexibility of the early planning of the data center, and adapting to a very wide range of regions.

[0033] Figure 2 A structural diagram of an adsorption refrigeration assembly according to some embodiments of the present disclosure is shown. In some embodiments, as shown in Figure 1 and Figure 2 , the adsorption refrigeration assembly 3 includes a first adsorption refrigeration module 331 and a second adsorption refrigeration module 332, which can be alternately connected to the first desorption connection port 321 and the second desorption connection port 322 through a valve, to desorb and return the first secondary side cooling liquid to the heat exchanger 2 via the pipeline 405 in the case of receiving the warmed first secondary side cooling liquid via the pipeline 404. The first adsorption refrigeration module 331 and the second adsorption refrigeration module 332 can each be provided with a coil (not shown) surrounded or coated by an adsorption refrigerant. The adsorption refrigerant can absorb heat when adsorbing water, thereby cooling the cooling liquid in the coil. When the temperature of the cooling liquid in the coil is high, the adsorption refrigerant can be desorbed to be used for water adsorption and cooling again.

[0034] In the case where the first adsorption refrigeration module 331 is connected to the first desorption connection port 321 and the second desorption connection port 322, the warmed first secondary side cooling liquid can be used as a heat source to desorb the first adsorption refrigeration module 331. At this time, the second adsorption refrigeration module 332 can be connected to the second cold source side liquid supply port 301, and adsorb water vapor to further cool the second cold source side cooling liquid. The further cooled second cold source side cooling liquid can be used to condense the water vapor desorbed from the first adsorption refrigeration module 331 into condensed water.

[0035] When the second adsorption-cooling module 332 is connected to the first desorption connection port 321 and the second desorption connection port 322, the heated first-stage side coolant can act as a heat source to cause the second adsorption-cooling module 332 to desorb. At this time, the first adsorption-cooling module 331 can be connected to the second cold source side liquid supply port 301 and adsorb water vapor to cool it down, thereby further cooling the second cold source side coolant. The further cooled second cold source side coolant can be used to condense the water vapor desorbed from the second adsorption-cooling module 332 into condensate.

[0036] In some embodiments, such as Figure 2 As shown, the adsorption refrigeration assembly 3 also includes a vapor condensation module 333, an evaporative refrigeration module 334, and a guide pipe 335. The vapor condensation module 333 can receive a second cold source-side coolant that has been further cooled by the adsorption module, for use in condensing water vapor desorbed from the first adsorption refrigeration module 331 or the second adsorption refrigeration module 332 into condensate. For example, when the first adsorption refrigeration module 331 is connected to the first desorption connection port 321 and the second desorption connection port 322, the vapor condensation module 333 can be connected to the second adsorption refrigeration module 332 to receive the second cold source-side coolant. When the second adsorption refrigeration module 332 is connected to the first desorption connection port 321 and the second desorption connection port 322, the vapor condensation module 333 can be connected to the first adsorption refrigeration module 331 to receive the second cold source-side coolant. A coil (not shown) may be provided in the vapor condensation module 333 for receiving the second-stage side coolant and guiding it to the second cold source-side return port 302. Water vapor desorbed from the first adsorption refrigeration module 331 or the second adsorption refrigeration module 332 will condense into condensate when it encounters the coil of the steam condensation module 333. A guide pipe 335 is used to guide the condensate to the evaporative refrigeration module 334. The evaporative refrigeration module 334 is used to cool the secondary-stage side coolant using the condensate and to supply the cooled secondary-stage side coolant to the air conditioning equipment. The evaporative refrigeration module 334 may be equipped with a coil (not shown) connected to the secondary-stage side supply port 311 and the secondary-stage side return port 312 to guide the secondary-stage side coolant. When the condensate generated by the steam condensation module 333 encounters the coil of the evaporative refrigeration module 334, it can cool the secondary-stage side coolant in the coil, and some of the condensate will evaporate to form steam, which can then be re-adsorbed by the first adsorption refrigeration module 331 or the second adsorption refrigeration module 332.

[0037] In embodiments according to the present disclosure, in addition to the first adsorption refrigeration module 331 and the second adsorption refrigeration module 332, the adsorption refrigeration assembly 3 can include more adsorption refrigeration modules, which can desorb and adsorb water alternately in a similar manner as the first adsorption refrigeration module 331 and the second adsorption refrigeration module 332. For example, at least one of the plurality of adsorption refrigeration modules can be connected to the first desorption connection port 321 and the second desorption connection port 322 to desorb and return the first secondary side coolant to the heat exchanger 2 upon receiving the warmed first secondary side coolant. At this time, the remaining adsorption refrigeration modules can be in a water adsorption cooling state to cool the second cold source side coolant. Subsequently, by controlling the connection state of the plurality of adsorption refrigeration modules to the first desorption connection port 321 and the second desorption connection port 322 and the connection state to the second cold source side liquid supply port 301, at least one of the adsorption refrigeration modules originally in the desorption state can be changed to the water adsorption cooling state, and the remaining adsorption refrigeration modules can be changed to the desorption state. In this way, the plurality of adsorption refrigeration modules can be alternately desorbed and adsorbed.

[0038] In the following, other example embodiments of the cooling system 100 will be described in connection with Figures 3 to 5 . Figures 3 to 5 The structure of the cooling system 100 shown is similar to the structure of the cooling system shown in Figure 1 . In the following, only the differences between them will be described, and the same parts will not be described again.

[0039] In some embodiments, as shown in Figure 3 , the heat exchanger 2 and the adsorption refrigeration assembly 3 are connected to a common medium-temperature external cold source. At this time, the second cold source side coolant in the adsorption refrigeration assembly 3 and the first cold source side coolant in the heat exchanger 2 are the same coolant, which is provided by the medium-temperature external cold source, and can be collectively referred to herein as a cold source side coolant. Specifically, the second cold source side liquid supply port 301 can receive the cold source side coolant from the medium-temperature external cold source via the pipeline 406, which can be used to condense the water vapor desorbed from at least one of the adsorption refrigeration modules into condensed water due to the low temperature (e.g., 27°C). The process of condensing the water vapor desorbed from at least one of the adsorption refrigeration modules is similar to the embodiments described above in connection with Figure 1 and Figure 2 , which will not be described again here. The cold source side coolant flowing out of the adsorption refrigeration assembly 3 via the second cold source side liquid return port 302 can flow to the first cold source side liquid supply port 201 via the pipeline 410, and enter the heat exchanger 2 via the first cold source side liquid supply port 201. The cold source side coolant can exchange heat with the first secondary side coolant in the heat exchanger 2 to cool the first secondary side coolant. Subsequently, the cold source side coolant can be returned to the medium-temperature external cold source via the pipeline 402.

[0040] exist Figure 3 In the illustrated embodiment, a single external cold source can provide the necessary coolant to both the adsorption refrigeration module 3 and the heat exchanger 2, simplifying the piping system structure on the cold source side. This facilitates unified design on the cold source side, offering greater design flexibility and significantly reducing the initial investment in the data center. Furthermore, this embodiment fully utilizes the temperature gradient between the medium-temperature cold source required by the adsorption refrigeration module 3 and the cold source side of the heat exchanger 2, effectively connecting them in series to achieve comprehensive utilization of the cold source. Moreover, this embodiment is well-suited for regions where medium-temperature cold sources (typically around 27°C) are readily available. The return liquid temperature of the medium-temperature cold source becomes high-temperature water after passing through the heat exchanger 2, allowing the outdoor cold source to operate in a highly energy-efficient manner year-round.

[0041] In some embodiments, such as Figure 3 As shown, the cooling system 100 also includes a bypass valve 5. The bypass valve 5 is disposed in pipe 411, which connects the second cold source side return port 302 to pipe 402. Pipe 402 connects the first cold source side return port 202 to the medium-temperature external cold source. In this embodiment, by providing the bypass valve 5, the appropriate distribution of coolant flow and cooling capacity on the cold source side can be ensured.

[0042] Figure 3 The other structures of the cooling system 100 shown are similar to those of the cooling system 100 shown. Figure 1 The structure of the cooling system 100 shown is similar and will not be described again here.

[0043] Common forms of medium-temperature external cold sources include dry coolers with or without spray systems, open or closed cooling towers, and evaporative cooling units. These types of cold sources generally do not require mechanical refrigeration, so the minimum outlet water temperature often depends on the ambient wet-bulb temperature. In this case, the availability of medium-temperature cold sources may be significantly challenged during extreme weather conditions, and may even affect the feasibility of a single external cold source solution in areas with high wet-bulb temperatures. Therefore, in some embodiments, such as... Figure 4 As shown, the cooling system 100 also includes a first supplementary cooling unit 61, which is connected between the medium-temperature external cold source and the second cold source side liquid supply port 301 to supplement the coolant on the cold source side. This is to address situations where the external cold source cannot reach the temperature required by the medium-temperature cold source under extreme weather conditions, thereby improving the adaptability of the solution in different regions. As an example, the temperature of the coolant on the cold source side provided by the medium-temperature external cold source can be 29°C, and the temperature of the coolant on the cold source side after supplementary cooling can be 27°C.

[0044] Figure 4 The other structures of the cooling system 100 shown are similar to those of the cooling system 100 shown. Figure 3 The structure of the cooling system 100 shown is similar and will not be described again here.

[0045] The liquid cooling ratio of the cooling system 100 varies due to server types, load changes, etc. If the cooling system 100 cannot provide sufficient cooling capacity for the air conditioning equipment, the cooling capacity provided by the medium-temperature external cold source can be fully utilized, and the air conditioning equipment is provided with cooling capacity in a series compensation mode, so that the system has certain design flexibility and improves the adaptability of the scheme to different types of liquid cooling parts. To this end, in some embodiments, as shown in Figure 5

[0046] Figure 5 The other structures of the cooling system 100 shown in FIG. 13 are similar to those of the cooling system 100 shown in FIG. 1, and will not be described here. Figure 4

[0047] The embodiments of the present disclosure make full use of the temperature gradient required for cooling by the cooling system 100, maximize the waste heat of the liquid cooling system, combine the adsorption refrigeration technology, greatly increase the temperature of the external cold source to a medium-high temperature cold source, reduce the energy consumption of the data center, and can obtain a lower power usage effectiveness (PUE) and water usage effectiveness (WUE). In addition, the cooling capacity generated by the adsorption refrigeration is very considerable, and in some working conditions it can even exceed the cooling capacity required by the air cooling side of the cooling system 100, which can provide cooling for other areas, thereby obtaining an extremely low PUE. In extreme cases, the PUE can even be less than 1, thereby transitioning from PUE to energy recovery efficiency (ERE). In addition, the liquid cooling side and the air cooling side are integrated to a certain extent, reducing the uncertainty of the data center in the early planning process, and at the same time, due to the effective use of the temperature gradient and the pooling of the external cold source, this highly adaptive scheme makes the data center have excellent performance in energy saving and water saving in various forms.

[0048] The embodiments of the present disclosure are also embodied in the following examples.

[0049] Example 1. A cooling system for a data center, comprising:

[0050] a heat exchanger configured to cool the first secondary side cooling liquid and provide the cooled first secondary side cooling liquid to the equipment to be cooled; and ​​

[0051] an adsorption refrigeration assembly connected to the heat exchanger and configured to receive the first secondary side coolant liquid that is warmed from the device to be cooled, use the first secondary side coolant liquid that is warmed as a heat source to desorb at least one adsorption refrigeration module in the adsorption refrigeration assembly, return the first secondary side coolant liquid to the heat exchanger, condense water vapor desorbed from the at least one adsorption refrigeration module into condensed water, and use the condensed water to cool a second secondary side coolant liquid and provide the air conditioning device with the second secondary side coolant liquid that is cooled.

[0052] Example 2. The cooling system of example 1, wherein the heat exchanger includes a first cold source side coolant liquid supply port for receiving a first cold source side coolant liquid, a first cold source side coolant liquid return port for outputting the first cold source side coolant liquid, a first secondary side coolant liquid supply port for connecting to the device to be cooled to provide the device to be cooled with the first secondary side coolant liquid that is cooled, and

[0053] the adsorption refrigeration assembly includes a second cold source side coolant liquid supply port for receiving a second cold source side coolant liquid, a second cold source side coolant liquid return port for outputting the second cold source side coolant liquid, a second secondary side coolant liquid supply port for providing the air conditioning device with the second secondary side coolant liquid that is cooled, a second secondary side coolant liquid return port for receiving the second secondary side coolant liquid that is warmed from the air conditioning device, a first desorption connection port for receiving the first secondary side coolant liquid that is warmed from the device to be cooled and providing the first secondary side coolant liquid to the at least one adsorption refrigeration module, and a second desorption connection port connected to the first secondary side coolant liquid return port of the heat exchanger to return the first secondary side coolant liquid to the heat exchanger.

[0054] Example 3. The cooling system of example 2, wherein the second cold source side coolant liquid supply port and the second cold source side coolant liquid return port are connected to a first external cold source to circulate the second cold source side coolant liquid between the adsorption refrigeration assembly and the first external cold source, and

[0055] wherein the first cold source side coolant liquid supply port and first cold source side coolant liquid return port are connected to a second external cold source to circulate the first cold source side coolant liquid between the heat exchanger and the second external cold source, the first external cold source having a lower water supply temperature than the second external cold source.

[0056] Example 4. The cooling system of example 2, wherein the second cold source side liquid supply port and the first cold source side liquid return port are connected to a first external cold source, the second cold source side liquid return port is connected to the first cold source side liquid supply port, the second cold source side liquid supply port receives the second cold source side cooling liquid from the first external cold source, the second cold source side liquid return port provides the second cold source side cooling liquid as the first cold source side cooling liquid to the first cold source side liquid supply port, and the first cold source side liquid return port returns the second cold source side cooling liquid to the first external cold source.

[0057] Example 5. The cooling system of example 4, further comprising a first subcooling unit connected between the first external cold source and the second cold source side liquid supply port to subcool the second cold source side cooling liquid.

[0058] Example 6. The cooling system of example 4, further comprising a bypass valve connected between the second cold source side liquid return port and a first conduit connected between the first cold source side liquid return port and the first external cold source.

[0059] Example 7. The cooling system of example 6, wherein the first conduit is further connected to the air conditioning device, and the cooling system further comprises a second subcooling unit connected between a second conduit and the air conditioning device, the second conduit being connected between the second cold source side liquid supply port and the first external cold source.

[0060] Example 8. The cooling system of any one of examples 2 to 7, wherein the adsorption refrigeration assembly comprises a first adsorption refrigeration module and a second adsorption refrigeration module, the first adsorption refrigeration module and the second adsorption refrigeration module being alternately connected to the first desorption connection port and the second desorption connection port to desorb and return the first secondary side cooling liquid to the heat exchanger upon receiving the warmed first secondary side cooling liquid.

[0061] Example 9. The cooling system of example 8, wherein the adsorption refrigeration assembly further comprises a vapor condensing module to condense water vapor desorbed from the at least one adsorption refrigeration module into condensed water, a guide tube to guide the condensed water to an evaporative refrigeration module, and the evaporative refrigeration module to cool a second secondary side cooling liquid with the condensed water and provide the cooled second secondary side cooling liquid to an air conditioning device.

[0062] Example 10. The cooling system of Example 9, wherein the first and second adsorption refrigeration modules alternately adsorb water refrigeration to cool a second cold sink side coolant, and provide the cooled second cold sink side coolant to the vapor condensation module to condense water vapor desorbed from the at least one adsorption refrigeration module, and wherein the vapor condensation module outputs the second cold sink side coolant via the second cold sink side coolant return port.

[0063] Embodiments of the present disclosure have been described above, with examples. The above description is intended to be illustrative, and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art, without departing from the scope and spirit of the described embodiments. The choice of words in this document is intended to best explain the principles of the embodiments, practical application, or technical improvement in the art, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A cooling system (100) for a data center, comprising: The heat exchanger (2) is configured to cool the primary stage side coolant and provide the cooled primary stage side coolant to the equipment to be cooled. as well as An adsorption refrigeration assembly (3) is connected to the heat exchanger (2) and is configured to receive the heated first-stage side coolant from the device to be cooled, use the heated first-stage side coolant as a heat source to desorb at least one adsorption refrigeration module in the adsorption refrigeration assembly (3) for reuse in water absorption and cooling, return the first-stage side coolant to the heat exchanger (2), condense the water vapor desorbed from the at least one adsorption refrigeration module into condensate, and use the condensate to cool the second-stage side coolant and provide the cooled second-stage side coolant to the air conditioning equipment.

2. The cooling system (100) according to claim 1, wherein the heat exchanger (2) includes a first cold source side liquid supply port (201), a first cold source side liquid return port (202), a first stage side liquid supply port (211), and a first stage side liquid return port (212), the first cold source side liquid supply port (201) is used to receive first cold source side coolant, the first cold source side liquid return port (202) is used to output the first cold source side coolant, and the first stage side liquid supply port (211) is used to connect to the device to be cooled to provide the device to be cooled with the cooled first stage side coolant, and The adsorption-type refrigeration component (3) includes a second cold source side liquid supply port (301), a second cold source side liquid return port (302), a second stage side liquid supply port (311), a second stage side liquid return port (312), a first desorption connection port (321), and a second desorption connection port (322). The second cold source side liquid supply port (301) is used to receive the second cold source side coolant, the second cold source side liquid return port (302) is used to output the second cold source side coolant, and the second stage side liquid supply port (311) is used to provide the air conditioning equipment with cooled coolant. The second-stage side coolant, the second-stage side return port (312) is used to receive the heated second-stage side coolant from the air conditioning equipment, the first desorption connection port (321) is used to receive the heated first-stage side coolant from the equipment to be cooled and to provide the first-stage side coolant to the at least one adsorption refrigeration module, and the second desorption connection port (322) is connected to the first-stage side return port (212) of the heat exchanger (2) to return the first-stage side coolant to the heat exchanger (2).

3. The cooling system (100) according to claim 2, wherein the second cold source side liquid supply port (301) and the second cold source side liquid return port (302) are connected to a first external cold source so that the second cold source side coolant circulates between the adsorption refrigeration assembly (3) and the first external cold source, and The first cold source side liquid supply port (201) and the first cold source side liquid return port (202) are connected to the second external cold source so that the first cold source side coolant circulates between the heat exchanger (2) and the second external cold source, and the water supply temperature of the first external cold source is lower than the water supply temperature of the second external cold source.

4. The cooling system (100) according to claim 2, wherein the second cold source side liquid supply port (301) and the first cold source side liquid return port (202) are connected to a first external cold source, the second cold source side liquid return port (302) is connected to the first cold source side liquid supply port (201), the second cold source side liquid supply port (301) receives the second cold source side coolant from the first external cold source, the second cold source side liquid return port (302) supplies the second cold source side coolant as the first cold source side coolant to the first cold source side liquid supply port (201), and the first cold source side liquid return port (202) returns the second cold source side coolant to the first external cold source.

5. The cooling system (100) according to claim 4 further includes a first cooling replenishment unit (61), which is connected between the first external cold source and the liquid supply port (301) on the second cold source side to replenish the coolant on the second cold source side.

6. The cooling system (100) according to claim 4 further includes a bypass valve (5), the bypass valve (5) being connected between the second cold source side return port (302) and the first pipeline, the first pipeline being connected between the first cold source side return port (202) and the first external cold source.

7. The cooling system (100) according to claim 6, wherein the first pipeline is further connected to the air conditioning equipment, and the cooling system (100) further includes a second supplementary cooling unit (62) connected between the second pipeline and the air conditioning equipment, the second pipeline being connected between the liquid supply port (301) on the second cold source side and the first external cold source.

8. The cooling system (100) according to any one of claims 2 to 7, wherein the adsorption refrigeration component (3) comprises a first adsorption refrigeration module (331) and a second adsorption refrigeration module (332), the first adsorption refrigeration module (331) and the second adsorption refrigeration module (332) being alternately connected to the first desorption connection port (321) and the second desorption connection port (322) to desorb upon receiving the heated first-stage side coolant and return the first-stage side coolant to the heat exchanger (2).

9. The cooling system (100) according to claim 8, wherein the adsorption refrigeration component (3) further comprises a vapor condensation module (333), an evaporative refrigeration module (334), and a guide pipe (335), wherein the vapor condensation module (333) is used to condense water vapor desorbed from the at least one adsorption refrigeration module into condensate, the guide pipe (335) is used to guide the condensate to the evaporative refrigeration module (334), and the evaporative refrigeration module (334) is used to cool the secondary-stage side coolant using the condensate and to provide the cooled secondary-stage side coolant to the air conditioning equipment.

10. The cooling system (100) according to claim 9, wherein the first adsorption refrigeration module (331) and the second adsorption refrigeration module (332) alternately adsorb water for cooling to cool the second cold source side coolant, and provide the cooled second cold source side coolant to the steam condensation module (333) to condense the water vapor desorbed from the at least one adsorption refrigeration module, and wherein the steam condensation module (333) outputs the second cold source side coolant via the second cold source side return port (302).

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