Lens frame pasting process and frame pasting structure

Abstract

This application provides a lens frame bonding process and its frame bonding structure. The lens frame bonding process includes: a first bonding platform and / or a second bonding platform moving relative to each other under the action of an external force, causing a first lens layer and a second lens layer to gradually approach each other; the first lens layer and the second lens layer are connected by an adhesive, and the first lens layer is subjected to pressure from the first bonding platform, a first elastic pad, and a first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, a second elastic pad, and a second bonding wafer; as the first lens layer and the second lens layer bend, when the air gap between the first lens layer and the second lens layer exceeds a preset air gap, the movement of the first bonding platform and the second bonding platform stops, and the first lens layer and the second lens layer remain bent to ensure that the air gap between the first lens layer and the second lens layer is greater than the preset air gap, thereby improving the display effect of the lens.

Description

Technical Field

[0001] This application relates to the field of lens mounting technology, and more specifically, to a lens mounting process and its mounting structure. Background Technology

[0002] With the development of technology, wearable devices are gradually being applied to people's lives. Wearable devices are also a type of device, including smart glasses, head-mounted displays, or audio devices. Smart glasses include lenses, which consist of a first lens layer and a second lens layer. The first lens layer and the second lens layer need to be connected and framed. At this time, the air gap between the first lens layer and the second lens layer is smaller than the preset air gap, resulting in poor display effect of the existing lenses. Summary of the Invention

[0003] The embodiments of this application provide a lens frame bonding process and its frame bonding structure, thereby ensuring, to a certain extent, that the air gap between the first lens layer and the second lens layer is greater than a preset air gap, avoiding lens interference and improving the display effect of the lens. At the same time, the first lens layer and the second lens layer are kept in a curved state, so that the first lens layer and the second lens layer remain in a curved state after bonding, ensuring the air gap between the first lens layer and the second lens layer.

[0004] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0005] According to one aspect of the embodiments of this application, a lens frame bonding process is provided, including:

[0006] The first lens layer and the second lens layer are respectively connected to the first bonding platform and the second bonding platform;

[0007] The first bonding platform and / or the second bonding platform move relative to each other under the action of external force, and the first lens layer and the second lens layer gradually move closer together;

[0008] The first lens layer and the second lens layer are connected by adhesive, and the first lens layer is subjected to pressure from the first bonding platform, the first elastic pad and the first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, the second elastic pad and the second bonding wafer.

[0009] As the first lens layer and the second lens layer bend, when the air gap between the first lens layer and the second lens layer becomes larger than a preset air gap, the movement of the first bonding platform and the second bonding platform stops, and the first lens layer and the second lens layer remain in a bent state.

[0010] In some embodiments of this application, the first lens layer and the second lens layer are respectively connected to the first bonding platform and the second bonding platform, including:

[0011] The first lens layer is connected to the first bonding platform via the first bonding wafer and the first elastic pad;

[0012] One side of the first bonding wafer is connected to the first elastic pad and is subjected to the elastic force of the first elastic pad;

[0013] The first lens layer is connected to the other side of the first bonding wafer and can be subjected to the bonding force of the first bonding wafer;

[0014] Alternatively, the second lens layer is connected to the second bonding platform via the second bonding wafer and the second elastic pad;

[0015] One side of the second bonding wafer is connected to the second elastic pad and is subjected to the elastic force of the second elastic pad;

[0016] The second lens layer is connected to the other side of the second bonding wafer and can be subjected to the bonding force of the second bonding wafer.

[0017] In some embodiments of this application, the first bonding platform and / or the second bonding platform move relative to each other under the action of an external force, and the first lens layer and the second lens layer gradually approach each other, including:

[0018] The first bonding platform is subjected to a downward external force and / or the second bonding platform is subjected to an upward external force;

[0019] The first lens layer and the second lens layer gradually move closer together as the first bonding platform and / or the second bonding platform move;

[0020] Monitor the distance between the first lens layer and the second lens layer.

[0021] In some embodiments of this application, the first lens layer and the second lens layer are connected by an adhesive, and the first lens layer is subjected to pressure from the first bonding platform, the first elastic pad, and the first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, the second elastic pad, and the second bonding wafer, including:

[0022] One side of the adhesive is attached to one of the first lens layer and the second lens layer;

[0023] As the first bonding platform and the second bonding platform move, the other side of the bonding adhesive is connected to another of the first lens layer and the second lens layer;

[0024] When the bonding adhesive is bonded to the first lens layer and the second lens layer, the first bonding platform and / or the second bonding platform move further, and the first bonding wafer and the second bonding wafer are deformed by pressure;

[0025] The first lens layer is subjected to pressure from the first bonding platform, the first elastic pad, and the first bonding wafer, and deforms with the deformation of the first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, the second elastic pad, and the second bonding wafer, and deforms with the deformation of the second bonding wafer.

[0026] In some embodiments of this application, when the air gap between the first lens layer and the second lens layer becomes larger than a preset air gap due to the bending of the first lens layer and the second lens layer, the movement of the first bonding platform and the second bonding platform is stopped, and the first lens layer and the second lens layer remain in a bent state, including:

[0027] The first lens layer is bent based on deformation, and the bending height of the first lens layer is measured by the first measuring instrument;

[0028] The second lens layer bends based on deformation, and the bending height of the second lens layer is measured by the second measuring device;

[0029] The air gap between the first lens layer and the second lens layer is determined based on the bending height of the first lens layer, the bending height of the second lens layer, and the thickness of the adhesive after being compressed.

[0030] In some embodiments of this application, the step of stopping the movement of the first bonding platform and the second bonding platform when the air gap between the first lens layer and the second lens layer is greater than a preset air gap due to the bending of the first lens layer and the second lens layer, and maintaining the bending state of the first lens layer and the second lens layer, further includes:

[0031] The air gap between the first lens layer and the second lens layer is compared with the preset air gap;

[0032] When the air gap between the first lens layer and the second lens layer is greater than the preset air gap, the movement of the first bonding platform and the second bonding platform is stopped, and the first lens layer maintains its current bending state and the second lens layer maintains its current bending state.

[0033] In some embodiments of this application, the lens mounting process further includes:

[0034] The air gap between the first and second lens layers is measured using a third measuring instrument.

[0035] In some embodiments of this application, the frame bonding process further includes:

[0036] Obtain the bending height of the first bonded wafer;

[0037] The bending radius of the first bonding wafer 213 is determined based on the bending height of the first bonding wafer;

[0038] Alternatively, obtain the bending height of the second bonding wafer;

[0039] The bending radius of the second bonding wafer 223 is determined based on the bending height of the second bonding wafer.

[0040] In some embodiments of this application, the frame bonding process further includes:

[0041] Adjust the bonding pressure or bonding parameters to adjust the bending height of the first bonding wafer.

[0042] According to one aspect of the embodiments of this application, a lens frame bonding structure includes:

[0043] The first frame bonding assembly includes a first bonding platform, a first elastic pad, a first bonding wafer, and a first lens layer; the first bonding platform, the first elastic pad, the first bonding wafer, and the first lens layer are connected in sequence.

[0044] The second frame bonding assembly is disposed on one side of the first frame bonding assembly, and the height between the second frame bonding assembly and the first frame bonding assembly is adjustable; the second frame bonding assembly includes a second bonding platform, a second elastic pad, a second bonding wafer, and a second lens layer; the second bonding platform, the second elastic pad, the second bonding wafer, and the second lens layer are connected in sequence;

[0045] An adhesive is disposed on one side of the first lens layer and the second lens layer, and is capable of connecting the first lens layer and the second lens layer.

[0046] In some embodiments of this application, the first lens layer and the second lens layer are respectively connected to the first bonding platform and the second bonding platform; the first bonding platform and / or the second bonding platform move relative to each other under the action of external force, and the first lens layer and the second lens layer gradually approach each other; the first lens layer and the second lens layer are connected by bonding adhesive, and the first lens layer is subjected to pressure from the first bonding platform, the first elastic pad and the first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, the second elastic pad and the second bonding wafer; as the first lens layer and the second lens layer bend, when the air gap between the first lens layer and the second lens layer is greater than a preset air gap, the movement of the first bonding platform and the second bonding platform stops, and the first lens layer and the second lens layer remain bent, so as to ensure that the air gap between the first lens layer and the second lens layer is greater than the preset air gap, avoid lens interference, improve the display effect of the lens, and at the same time, the first lens layer and the second lens layer remain bent, so that the first lens layer and the second lens layer remain bent after bonding, ensuring the air gap between the first lens layer and the second lens layer.

[0047] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0048] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0049] Figure 1 A schematic flowchart of a lens frame mounting process according to an embodiment of this application is shown;

[0050] Figure 2 It shows Figure 1 A flowchart of the S120 process;

[0051] Figure 3 It shows Figure 1 A flowchart of the S130 process;

[0052] Figure 4 It shows Figure 1 A flowchart of the S140 process;

[0053] Figure 5 A schematic diagram of a lens frame structure according to an embodiment of this application is shown;

[0054] Figure 6A schematic diagram of the first and second lens layers in a lens frame structure according to an embodiment of this application after being compressed is shown; Detailed Implementation

[0055] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0056] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0057] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0058] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0059] Figure 1 A schematic flowchart of a lens frame bonding process according to an embodiment of this application is shown. This method can be applied to electronic devices, including but not limited to wearable devices such as AR (Augmented Reality), VR (Virtual Reality), and MR (Mixed Reality) electronic devices.

[0060] Please refer to Figure 1 The lens mounting process includes at least steps S110 to S140, which are described in detail below (the following explanation uses the application of this method to wearable devices as an example):

[0061] In step S110, the first lens layer 214 and the second lens layer 224 are respectively connected to the first bonding platform 211 and the second bonding platform 221.

[0062] In the embodiments of this application, the first lens layer 214 and the second lens layer 224 are workpieces to be processed. The first lens layer 214 and the second lens layer 224 are planar in the incoming material state. The first lens layer 214 and the second lens layer 224 are respectively connected to the first bonding platform 211 and the second bonding platform 221, and move with the movement of the first bonding platform 211 and the second bonding platform 221. At this time, the first bonding platform 211 and the second bonding platform 221 are force-bearing ends and receive external forces so that the first bonding platform 211 and the second bonding platform 221 can move under the external forces, thereby gradually approaching each other, and thus completing the bending of the first lens layer 214 and the second lens layer 224, so that the first lens layer 214 and the second lens layer 224 can maintain a certain deformation.

[0063] Regarding the first lens layer 214, the first lens layer 214 is connected to the first bonding platform 211 through the first bonding wafer 213 and the first elastic pad 212; one side of the first bonding wafer 213 is connected to the first elastic pad 212 and is subjected to the elastic force of the first elastic pad 212; the first lens layer 214 is connected to the other side of the first bonding wafer 213 and can be subjected to the bonding force of the first bonding wafer 213.

[0064] At this time, the external force acting on the first bonding platform 211 is sequentially transmitted from the first bonding platform 211, the first elastic pad 212, and the first bonding wafer 213 to the first lens layer 214. The first elastic pad 212 enables the elastic movement of the first bonding wafer 213 relative to the first bonding platform 211, so that the first bonding wafer 213 can deform under the external force adjusted by the first elastic pad, thereby achieving the bending of the first lens layer 214. At the same time, the first bonding wafer 213 has a certain degree of elasticity and good flatness, and the first bonding wafer 213 will not undergo tensile or compressive deformation during bonding. The first bonding platform 211, the first elastic pad 212, the first bonding wafer 213, and the first lens layer 214 are arranged sequentially from top to bottom.

[0065] The second lens layer 224 is connected to the second bonding platform 221 via the second bonding wafer 223 and the second elastic pad 222. One side of the second bonding wafer 223 is connected to the second elastic pad 222 and is subjected to the elastic force of the second elastic pad 222. The second lens layer 224 is connected to the other side of the second bonding wafer 223 and is subjected to the bonding force of the second bonding wafer 223. The second bonding platform 221, the second elastic pad 222, the second bonding wafer 223 and the second lens layer 224 are arranged sequentially from bottom to top.

[0066] At this time, the external force acting on the second bonding platform 221 is sequentially transmitted from the second bonding platform 221, the second elastic pad 222, and the second bonding wafer 223 to the second lens layer 224. The second elastic pad 222 enables the elastic movement of the second bonding wafer 223 relative to the second bonding platform 221, so that the second bonding wafer 223 can deform under the external force adjusted by the second elastic pad, thereby achieving the bending of the second lens layer 224. At the same time, the second bonding wafer 223 has a certain elasticity and good flatness, and the second bonding wafer 223 will not undergo stretching or compression deformation during bonding.

[0067] In one embodiment, the optical module of the augmented reality (AR) near-eye display device includes an optical engine (or light engine) and a light combiner. The light combiner can directionally transmit the signal light emitted from the optical engine to the human eye to form an image to be displayed on the retina. The light combiner includes a first lens layer 214 and a second lens layer 224. The first lens layer 214 and the second lens layer 224 are waveguide layers or protective layers. The waveguide layer is used for light conduction, and the protective layer is used to prevent steam or dust from entering and to block the influence of external light.

[0068] refer to Figure 2 In step S120, the first bonding platform 211 and / or the second bonding platform 221 move relative to each other under the action of external force, and the first lens layer 214 and the second lens layer 224 gradually approach each other.

[0069] In the embodiments of this application, the first bonding platform 211 and / or the second bonding platform 221 move relative to each other under the action of an external force. At this time, the external force can act on the first bonding platform 211 or the second bonding platform 221 alone, or it can act on the first bonding platform 211 and the second bonding platform 221 simultaneously.

[0070] The specific steps are as follows:

[0071] Step S121: The downward external force of the first bonding platform 211 and / or the upward external force of the second bonding platform 221;

[0072] In the embodiments of this application, when external forces act simultaneously on the first bonding platform 211 and the second bonding platform 221, the first bonding platform 211 is subjected to a uniformly applied, vertically downward external force, and the second bonding platform 221 is subjected to a uniformly applied, vertically upward external force. At this time, the two external forces are opposite forces, so as to drive the first bonding platform 211 and the second bonding platform 221 to gradually approach each other, thereby realizing the gradual approach of the first lens layer 214 and the second lens layer 224, and thus completing the bonding of the first lens layer 214 and the second lens layer 224 through the adhesive 230 and the bending under pressure. The adhesive 230 serves as a connector between the first lens layer 214 and the second lens layer 224, connecting the first lens layer 214 and the second lens layer 224. Simultaneously, the adhesive 230 is located between the first lens layer 214 and the second lens layer 224, supporting the first lens layer 214 and the second lens layer 224 to ensure an air gap between the first lens layer 214 and the second lens layer 224. This ensures that the air gap between the first lens layer 214 and the second lens layer 224 is greater than a preset air gap. Optionally, the preset air gap is adjusted based on past experience.

[0073] Optionally, the external force can be applied by an external device. In this case, the external device applies an external force to the first bonding platform 211 or the second bonding platform 221 in the working state, and drives the first bonding platform 211 or the second bonding platform 221 to move. The external device can be a pressure device or a power device.

[0074] In step S122, the first lens layer 214 and the second lens layer 224 gradually move closer together as the first bonding platform 211 and / or the second bonding platform 221 move.

[0075] In this embodiment, the first lens layer 214 is connected to the first bonding platform 211 via the first bonding wafer 213 and the first elastic pad 212; the second lens layer 224 is connected to the second bonding platform 221 via the second bonding wafer 223 and the second elastic pad 222. At this time, the first lens layer 214 and the second lens layer 224 gradually approach each other as the first bonding platform 211 and / or the second bonding platform 221 moves, thereby facilitating the connection of the first lens layer 214 and the second lens layer 224 via the bonding adhesive 230. This allows pressure to be applied to the first lens layer 214 and the second lens layer 224 in the connected state, so as to facilitate the bending deformation of the first lens layer 214 and the second lens layer 224.

[0076] Optionally, the first bonding platform 211 and the second bonding platform 221 can withstand different pressures under the pressure of external equipment at different stages, so that the first lens layer 214 and the second lens layer 224 can be further compressed in the connected state, ensuring the bending deformation of the first lens layer 214 and the second lens layer 224, while improving the bending quality of the first lens layer 214 and the second lens layer 224, and ensuring that the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d.

[0077] Step S123: Monitor the distance between the first lens layer 214 and the second lens layer 224.

[0078] In this embodiment, the first lens layer 214 and the second lens layer 224 gradually approach each other as the first bonding platform 211 and the second bonding platform 221 move, and the distance between the first lens layer 214 and the second lens layer 224 gradually decreases. Monitoring the distance between the first lens layer 214 and the second lens layer 224 allows for the determination of the connection state or pressure state between them. Optionally, the distance between the first lens layer 214 and the second lens layer 224 can be determined using a measuring instrument.

[0079] refer to Figure 3 In step S130, the first lens layer 214 and the second lens layer 224 are connected by adhesive 230, and the first lens layer 214 is subjected to pressure from the first bonding platform 211, the first elastic pad 212 and the first bonding wafer 213; the second lens layer 224 is subjected to pressure from the second bonding platform 221, the second elastic pad 222 and the second bonding wafer 223.

[0080] In the embodiments of this application, an adhesive 230 is provided between the first lens layer 214 and the second lens layer 224. The two sides of the adhesive 230 are respectively connected to the first lens layer 214 and the second lens layer 224, so that the first lens layer 214 and the second lens layer 224 are connected through the adhesive 230. The first lens layer 214 is subjected to the pressure of the first bonding platform 211, the first elastic pad 212 and the first bonding wafer 213, so that the first lens layer 214 bends and deforms. The second lens layer 224 is subjected to the pressure of the second bonding platform 221, the second elastic pad 222 and the second bonding wafer 223, so that the second lens layer 224 bends and deforms.

[0081] The specific steps are as follows:

[0082] Step S131: One side of the adhesive 230 is connected to one of the first lens layer 214 and the second lens layer 224;

[0083] In the embodiments of this application, one side of the adhesive 230 is connected to one of the first lens layer 214 and the second lens layer 224. In this case, one side of the adhesive 230 is connected to the first lens layer 214 or the second lens layer 224. Specifically, one side of the adhesive 230 is connected to the first lens layer 214.

[0084] Step S132: As the first bonding platform 211 and / or the second bonding platform 221 move, the other side of the bonding adhesive 230 is connected to another of the first lens layer 214 and the second lens layer 224;

[0085] In the embodiments of this application, as the first bonding platform 211 and / or the second bonding platform 221 move, the other side of the adhesive 230 is connected to the other of the first lens layer 214 and the second lens layer 224. At this time, the other side of the adhesive 230 is connected to the second lens layer 224. Therefore, the adhesive 230 serves as a support between the first lens layer 214 and the second lens layer 224, and both sides of the adhesive 230 are connected to the first lens layer 214 and the second lens layer 224 respectively, so as to support the first lens layer 214 and the second lens layer 224, thereby defining the distance between the first lens layer 214 and the second lens layer 224 and ensuring the air gap c between the first lens layer 214 and the second lens layer 224.

[0086] Step S133: When the adhesive 230 is connected to the first lens layer 214 and the second lens layer 224, the first bonding platform 211 and / or the second bonding platform 221 move further, and the first bonding wafer 213 and the second bonding wafer 223 are deformed by pressure.

[0087] In the embodiments of this application, the adhesive 230 is connected to the first lens layer 214 and the second lens layer 224 and supports the first lens layer 214 and the second lens layer 224. In order for the first bonding wafer 213 and the second bonding wafer 223 to bend and deform, when the adhesive 230 is connected to the first lens layer 214 and the second lens layer 224, the external device further applies pressure to the first bonding platform 211 and the second bonding platform 221, so that the first bonding platform 211 and / or the second bonding platform 221 can move further, thereby facilitating the first bonding wafer 213 and the second bonding wafer 223 to be further subjected to pressure, so that the first bonding wafer 213 and the second bonding wafer 223 bend and deform after being pressed, thereby facilitating the complete deformation of the first lens layer 214 and the second lens layer 224.

[0088] In step S134, the first lens layer 214 is subjected to pressure from the first bonding platform 211, the first elastic pad 212, and the first bonding wafer 213, and the first lens layer 214 deforms with the deformation of the first bonding wafer 213; the second lens layer 224 is subjected to pressure from the second bonding platform 221, the second elastic pad 222, and the second bonding wafer 223, and the second lens layer 224 deforms with the deformation of the second bonding wafer 223.

[0089] In the embodiments of this application, the first lens layer 214 is subjected to pressure from the first bonding platform 211, the first elastic pad 212, and the first bonding wafer 213. The first lens layer 214 deforms with the deformation of the first bonding wafer 213. At this time, the first lens layer 214 is bonded to the first bonding wafer 213 and deforms synchronously with the deformation of the first bonding wafer 213. The first elastic pad 212 acts as an elastic element and softens the pressure applied by the external device so as to ensure that the first bonding wafer 213 is subjected to uniform force.

[0090] The second lens layer 224 is subjected to pressure from the second bonding platform 221, the second elastic pad 222, and the second bonding wafer 223. The second lens layer 224 deforms along with the deformation of the second bonding wafer 223. At this time, the second lens layer 224 is bonded to the second bonding wafer 223 and deforms synchronously with the deformation of the second bonding wafer 223. The second elastic pad 222 acts as an elastic element and softens the pressure applied by the external device so as to ensure that the second bonding wafer 223 is subjected to uniform force.

[0091] refer to Figures 4 to 6 In step S140, as the first lens layer 214 and the second lens layer 224 bend, when the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the movement of the first bonding platform 211 and the second bonding platform 221 stops, and the first lens layer 214 and the second lens layer 224 remain in a bent state.

[0092] In the embodiments of this application, as the first lens layer 214 and the second lens layer 224 bend, the first lens layer 214 and the second lens layer 224 have a certain elasticity in the bent state.

[0093] When the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the movement of the first bonding platform 211 and the second bonding platform 221 stops, and the first lens layer 214 and the second lens layer 224 remain in a bent state. At this time, the first lens layer 214 maintains its current bent state and is subjected to its own elastic force; the second lens layer 224 maintains its current bent state and is subjected to its own elastic force.

[0094] The specific steps are as follows:

[0095] Step S141: The first lens layer 214 bends due to deformation, and the bending height of the first lens layer 214 is measured by the first measuring device;

[0096] In the embodiments of this application, the first lens layer 214 is bent based on deformation, and the bending height of the first lens layer 214 is measured by a first measuring device to directly measure the bending height of the first lens layer 214, thereby estimating the air gap c between the first lens layer 214 and the second lens layer 224, so as to adjust the pressure of the external device.

[0097] Step S142: The second lens layer 224 bends based on deformation, and the bending height of the second lens layer 224 is measured by the second measuring device;

[0098] In an embodiment of this application, the second lens layer 224 is bent based on deformation, and the bending height of the second lens layer 224 is measured by a second measuring device to directly calculate the bending height of the second lens layer 224, thereby estimating the air gap c between the first lens layer 214 and the second lens layer 224, so as to adjust the pressure of the external device. Optionally, the first measuring device and the second measuring device are bending measuring devices or angle measuring devices.

[0099] Furthermore, the air gap between the first lens layer 214 and the second lens layer 224 is measured using a third measuring device, which facilitates direct measurement of the air gap between the first lens layer 214 and the second lens layer 224, improving the convenience of measuring the air gap between the first lens layer 214 and the second lens layer 224. Optionally, the third measuring device is a measuring device specifically for air gaps. Step S143: Determine the air gap c between the first lens layer 214 and the second lens layer 224 based on the bending height of the first lens layer 214, the bending height of the second lens layer 224, and the thickness of the adhesive 230 after compression;

[0100] In the embodiments of this application, the bending height of the first lens layer 214, the bending height of the second lens layer 224, and the thickness of the adhesive 230 after being compressed are used as parameters for the air gap c between the first lens layer 214 and the second lens layer 224. The air gap c between the first lens layer 214 and the second lens layer 224 is determined based on the bending height of the first lens layer 214, the bending height of the second lens layer 224, and the thickness of the adhesive 230 after being compressed, so as to ensure the accuracy of the air gap c between the first lens layer 214 and the second lens layer 224, thereby comparing the air gap c between the first lens layer 214 and the second lens layer 224 with the preset air gap d.

[0101] Step S144: Compare the air gap c between the first lens layer 214 and the second lens layer 224 with the preset air gap d;

[0102] In the embodiments of this application, the air gap c between the first lens layer 214 and the second lens layer 224 is compared with a preset air gap d, and the difference between the air gap c between the first lens layer 214 and the second lens layer 224 and the preset air gap d is calculated so as to evaluate the difference between the air gap c between the first lens layer 214 and the second lens layer 224 and the preset air gap d.

[0103] Step S145: When the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the movement of the first bonding platform 211 and the second bonding platform 221 is stopped, and the first lens layer 214 and the second lens layer 224 maintain their current bending state.

[0104] In the embodiments of this application, when the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the first lens layer 214 and the second lens layer 224 meet the requirements after being compressed, thereby the lens meets the usage requirements and improves the display effect of the lens.

[0105] Therefore, when the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the movement of the first bonding platform 211 and the second bonding platform 221 is stopped, and the first lens layer 214 and the second lens layer 224 maintain their current bending state, thus ensuring the air gap c between the first lens layer 214 and the second lens layer 224.

[0106] Furthermore, the frame bonding process also includes: obtaining the bending height of the first bonding wafer 213; and determining the bending radius of the first bonding wafer 213 based on the bending height of the first bonding wafer 213.

[0107] At this point, the degree of bending of the first bonding wafer 213 should be related to the bending height. Assuming the bending height is 'a', which can be measured by a bending measuring instrument, and the length of the horizontal reference plane is 'b', the bending radius of the first bonding wafer 213 can be calculated as follows:

[0108]

[0109] According to the above formula, by selecting appropriate bonding pressure, Young's modulus of the bonding wafer, and other parameters, the bending height of the first bonding wafer 213 can be further adjusted, thereby adjusting the bonding pressure or bonding parameters to adjust the bending height of the first bonding wafer 213. This improves the display effect while avoiding excessive bending deformation of the first lens layer 214 and the second lens layer 224, thus preventing any impact on the display effect of the first lens layer 214 and the second lens layer 224. Optionally, the first lens layer 214 is bonded to the first bonding wafer 213, and the first lens layer 214 bends synchronously with the bending of the first bonding wafer 213, and the above formula applies.

[0110] Similarly, the bending height of the second bonding wafer 223 can be obtained; the bending radius of the second bonding wafer 223 can be determined based on the bending height of the second bonding wafer 223.

[0111] The actual steps are as follows:

[0112] In addition, the bonding adhesive 230 is first pre-bonded to one of the first lens layer 214 and the second lens layer 224 using a bonding device. During bonding, the bonding adhesive 230 is subjected to pressure from the first bonding wafer and the second bonding wafer 223 to tightly bond the first lens layer 214 and the second lens layer 224 together.

[0113] Due to the pressure, the first bonding wafer 213 and the second bonding wafer 223 experience resistance in the parts that contact the first lens layer 214 and the second lens layer 224, while the remaining parts are not subject to resistance. Therefore, the first bonding wafer 213 and the second bonding wafer 223 will undergo bending deformation.

[0114] The bending deformation causes the centers of the first bonding wafer 213 and the second bonding wafer 223 to bulge to both sides respectively. Therefore, during bonding, the first lens layer 214 and the second lens layer 224 will undergo slight deformation along the first bonding wafer 213 and the second bonding wafer 223. As a result, the first lens layer 214 and the second lens layer 224 will continue to maintain slight deformation after bonding, thereby increasing the air gap c between the first lens layer 214 and the second lens layer 224. This ensures that the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, avoiding lens interference and improving the display effect of the lens. At the same time, the first lens layer 214 and the second lens layer 224 maintain a bent state, ensuring that the air gap c between the first lens layer 214 and the second lens layer 224 remains bent after bonding.

[0115] In some embodiments of this application, the first lens layer 214 and the second lens layer 224 are respectively connected to the first bonding platform 211 and the second bonding platform 221; the first bonding platform 211 and / or the second bonding platform 221 move relative to each other under the action of external force, and the first lens layer 214 and the second lens layer 224 gradually approach each other; the first lens layer 214 and the second lens layer 224 are connected by bonding adhesive 230, and the first lens layer 214 is subjected to the pressure of the first bonding platform 211, the first elastic pad 212 and the first bonding wafer 213; the second lens layer 224 is subjected to the pressure of the second bonding platform 221, the second elastic pad 222 and the second bonding wafer 223; as the first lens layer 214... 4. When the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, the movement of the first bonding platform 211 and the second bonding platform 221 is stopped, and the first lens layer 214 and the second lens layer 224 remain in a bent state to ensure that the air gap c between the first lens layer 214 and the second lens layer 224 is greater than the preset air gap d, thereby avoiding lens interference and improving the display effect of the lens. At the same time, the first lens layer 214 and the second lens layer 224 remain in a bent state so that the bonded first lens layer 214 and the second lens layer 224 remain in a bent state, ensuring the air gap c between the first lens layer 214 and the second lens layer 224.

[0116] refer to Figures 1 to 6 According to one aspect of the embodiments of this application, a lens frame bonding structure 200 includes a first frame bonding assembly 210, a second frame bonding assembly 220 and an adhesive 230. The adhesive 230 is disposed on one side of the first lens layer 214 of the first frame bonding assembly 210 and the second lens layer 224 of the second frame bonding assembly 220, and is capable of connecting the first lens layer 214 and the second lens layer 224.

[0117] The first bonding assembly 210 includes a first bonding platform 211, a first elastic pad 212, a first bonding wafer 213, and a first lens layer 214; the first bonding platform 211, the first elastic pad 212, the first bonding wafer 213, and the first lens layer 214 are connected in sequence.

[0118] The second frame bonding assembly 220 is disposed on one side of the first frame bonding assembly 210, and the height between the second frame bonding assembly 220 and the first frame bonding assembly 210 is adjustable. The second frame bonding assembly 220 includes a second bonding platform 221, a second elastic pad 222, a second bonding wafer 223, and a second lens layer 224. The second bonding platform 221, the second elastic pad 222, the second bonding wafer 223, and the second lens layer 224 are connected in sequence.

[0119] Optionally, the first lens layer 214 and the second lens layer 224 are connected in multiple layers to improve the display effect of the lens.

[0120] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0121] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A lens frame bonding process, characterized in that, include: The first lens layer and the second lens layer are respectively connected to the first bonding platform and the second bonding platform; The first bonding platform and / or the second bonding platform move relative to each other under the action of external force, and the first lens layer and the second lens layer gradually move closer together; The first lens layer and the second lens layer are connected by adhesive, and the first lens layer is subjected to pressure from the first bonding platform, the first elastic pad and the first bonding wafer; The second lens layer is subjected to pressure from the second bonding platform, the second elastic pad, and the second bonding wafer, including: one side of the adhesive is connected to one of the first and second lens layers; as the first and / or second bonding platform moves, the other side of the adhesive is connected to the other of the first and second lens layers; when the adhesive is connected to the first and second lens layers, the first and / or second bonding platform moves further, and the first and second bonding wafers are deformed by pressure; the first lens layer is subjected to pressure from the first bonding platform, the first elastic pad, and the first bonding wafer, and the first lens layer deforms with the deformation of the first bonding wafer; the second lens layer is subjected to pressure from the second bonding platform, the second elastic pad, and the second bonding wafer, and the second lens layer deforms with the deformation of the second bonding wafer; As the first and second lens layers bend, when the air gap between the first and second lens layers exceeds a preset air gap, the movement of the first and second bonding platforms stops, and the first and second lens layers remain bent. This includes: the first lens layer bends based on deformation, and the bending height of the first lens layer is measured by a first measuring device; the second lens layer bends based on deformation, and the bending height of the second lens layer is measured by a second measuring device; the air gap between the first and second lens layers is determined based on the bending height of the first lens layer, the bending height of the second lens layer, and the thickness of the adhesive after compression; the air gap between the first and second lens layers is compared with a preset air gap; when the air gap between the first and second lens layers exceeds the preset air gap, the movement of the first and second bonding platforms stops, and the first and second lens layers maintain their current bent state.

2. The lens frame bonding process according to claim 1, characterized in that, The first lens layer and the second lens layer are respectively connected to the first bonding platform and the second bonding platform, including: The first lens layer is connected to the first bonding platform via the first bonding wafer and the first elastic pad; One side of the first bonding wafer is connected to the first elastic pad and is subjected to the elastic force of the first elastic pad; The first lens layer is connected to the other side of the first bonding wafer and can be subjected to the bonding force of the first bonding wafer; Alternatively, the second lens layer is connected to the second bonding platform via the second bonding wafer and the second elastic pad; One side of the second bonding wafer is connected to the second elastic pad and is subjected to the elastic force of the second elastic pad; The second lens layer is connected to the other side of the second bonding wafer and can be subjected to the bonding force of the second bonding wafer.

3. The lens frame bonding process according to claim 1, characterized in that, The first bonding platform and / or the second bonding platform move relative to each other under the action of an external force, and the first lens layer and the second lens layer gradually approach each other, including: The first bonding platform is subjected to a downward external force and / or the second bonding platform is subjected to an upward external force; The first lens layer and the second lens layer gradually approach each other as the first bonding platform and / or the second bonding platform move; the distance between the first lens layer and the second lens layer is monitored.

4. The lens frame bonding process according to claim 1, characterized in that, The lens mounting process also includes: The air gap between the first and second lens layers is measured using a third measuring instrument.

5. The lens frame bonding process according to claim 1, characterized in that, The frame bonding process also includes: Obtain the bending height of the first bonded wafer; The bending radius of the first bonded wafer is determined based on the bending height of the first bonded wafer; Alternatively, obtain the bending height of the second bonding wafer; The bending radius of the second bonding wafer is determined based on the bending height of the second bonding wafer.

6. The lens frame bonding process according to claim 5, characterized in that, The frame bonding process also includes: Adjust the bonding pressure to adjust the bending height of the first bonded wafer.

7. A lens frame structure, characterized in that, The lens mounting process applicable to any one of claims 1 to 6, wherein the lens mounting structure comprises: The first frame bonding assembly includes a first bonding platform, a first elastic pad, a first bonding wafer, and a first lens layer; the first bonding platform, the first elastic pad, the first bonding wafer, and the first lens layer are connected in sequence. The second frame bonding assembly is disposed on one side of the first frame bonding assembly, and the height between the second frame bonding assembly and the first frame bonding assembly is adjustable; the second frame bonding assembly includes a second bonding platform, a second elastic pad, a second bonding wafer, and a second lens layer; the second bonding platform, the second elastic pad, the second bonding wafer, and the second lens layer are connected in sequence; An adhesive is disposed on one side of the first lens layer and the second lens layer, and is capable of connecting the first lens layer and the second lens layer.

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