A small optical module with built-in optical amplification device

Abstract

This invention discloses a miniature optical module with a built-in optical amplification device. It includes an integrated housing, a COSA modulator, and an integrated optical amplification unit. The integrated optical amplification unit includes an optical amplification device and a laser emitting device. Specifically, the optical amplification device and the laser emitting device are encapsulated within the integrated housing at predetermined positions, and the integrated housing is disposed within the optical module. The output end of the optical amplification device is provided with an input / output optical port coupled to a transceiver port, and the input end of the optical amplification device is coupled to the COSA modulator via an optical fiber. The emitting end of the laser emitting device is coupled to the COSA modulator, used to provide a local oscillator light source and output an optical signal. This invention integrates the optical amplification device and the laser emitting device within the integrated housing of the optical module, making the structure more compact and more suitable for miniaturized optical modules. Furthermore, the SOA chip of this invention is located near the optical signal transmission port for easy heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to a small optical module with a built-in optical amplification device. Background Technology

[0002] With the advancement of 5G infrastructure and the digital transformation of the economy and society, new applications such as AR, VR, and cloud computing are emerging, placing increasingly higher demands on bandwidth and data latency. As carrier rates increase from 100G to higher speeds such as 400G / 800G, miniaturized module standards are also being further refined. Standardized and miniaturized optical modules are particularly important for adapting to standard rack unit designs. Optical modules such as CFP8, OSFP, QSFPDD, and COBO have small sizes and are widely used in 400G Ethernet. While considering module heat dissipation, a single unit (1RU) can support up to 36 QSFPDD or OSFP standard modules and up to 32 COBO standard modules, enabling high-speed, high-density module spatial layouts. Increased speeds and module miniaturization further improve bandwidth per unit space density.

[0003] Due to the demands of certain application scenarios, some optical modules require a larger optical power budget. To meet these output power requirements, an integrated optical amplification unit needs to be built into the module. Therefore, an integrated optical amplification unit that can adapt to miniaturized and standardized optical modules becomes extremely important. Furthermore, the overall layout design of such a unit is very challenging. In addition, embedding an integrated optical amplification unit within a miniaturized and standardized optical module makes heat dissipation difficult, severely impacting the module's performance.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by this invention is how to design a built-in optical amplification integrated unit while ensuring the small size of the optical module, so as to meet the market requirements for the output optical power of the optical module and ensure smooth heat dissipation inside the optical module.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, the present invention proposes a small optical module with a built-in optical amplification device, comprising an integrated housing, a COSA modulator, and an optical amplification integrated unit; wherein the optical amplification integrated unit includes an optical amplification device and a laser emitting device, specifically:

[0008] The optical amplification device and the laser emitting device are encapsulated in an integrated housing at preset positions, and the integrated housing is disposed inside the optical module;

[0009] The input and output optical ports of the optical amplifier are coupled to the transceiver port on the integrated housing, and the transceiver port is used to couple with the external adapter port of the optical module; the input end of the optical amplifier is coupled to the COSA modulator through an optical fiber.

[0010] The emitting end of the laser emitting device is coupled to a COSA modulator to provide a local oscillator light source and output optical signal;

[0011] The external power interfaces of the optical amplification device and the laser emission device are both located on one side of the integrated housing.

[0012] Preferably, the optical amplification device specifically includes: an input / output optical port, a first lens, an SOA chip, a second lens, and a first isolator;

[0013] The optical port, the first lens, the SOA chip, the second lens, and the first isolator are connected in sequence to form the optical amplification device.

[0014] Preferably, the laser emitting device specifically includes: a laser chip, a third lens, a second isolator, and a first beam splitter;

[0015] The laser chip, the third lens, the second isolator, and the first beam splitter are connected in sequence to form the laser emitting device.

[0016] Preferably, the optical amplification integrated unit further includes a first detector, a second detector, a reflecting prism, and a standard etalon;

[0017] The reflecting prism and the beam splitter are respectively arranged, and the reflecting prism, the etalon and the first detector are coupled and connected in sequence.

[0018] The light signal reflected by the first beam splitter passes through the reflecting prism, the etalon, and the first detector in sequence to detect the intensity of the reflected light signal;

[0019] The second detector is placed in the optical path from the laser emitter to the COSA modulator receiver to detect the intensity of the emitted light from the laser emitter.

[0020] Preferably, the optical amplification device further includes a second beam splitter and a third detector, specifically:

[0021] The second beam splitter is positioned in the optical path between the second lens and the first isolator;

[0022] The third detector is located on the side of the laser emitting device, positioned after the first detector, with its detection surface facing the optical amplification integration unit. It is used to receive the optical signal to be amplified by the SOA chip, which is split off by the second beam splitter.

[0023] Preferably, it also includes an optical signal processor and a cooler;

[0024] The optical signal processor is mounted on the circuit board of the optical module and connected to the RF port of the COSA modulator for processing RF received signals and modulated signals.

[0025] The cooler is housed within the integrated housing and is used to cool the optical amplification device and the laser emitting device.

[0026] Preferably, it also includes a control circuit board, which is electrically connected to the SOA chip and the laser chip, and is used to control the amplification gain of the optical signal and set the wavelength power of the optical signal generated by the laser emitting device.

[0027] Secondly, in contrast to the first aspect, the present invention also proposes a small optical module with a built-in optical amplification device, comprising an integrated housing, a COSA modulator, an optical amplification integrated unit, and a receiving port; wherein the optical amplification integrated unit includes an optical amplification device and a laser emitting device, specifically:

[0028] The optical amplification device and the laser emitting device are encapsulated in an integrated housing at preset positions, and the integrated housing is disposed inside the optical module;

[0029] The output optical port of the optical amplifier is coupled to the transmit port on the integrated housing, and the transmit port is used to couple with the external adapter port of the optical module; the input end of the optical amplifier is coupled to the COSA modulator via optical fiber.

[0030] The emitting end of the laser emitting device is coupled to a COSA modulator to provide a local oscillator light source and output optical signal;

[0031] The receiving port is coupled to the COSA modulator. Part of the optical signal emitted by the laser emitting device is phase demodulated together with the optical signal received by the receiving port through the transmitting port, which is used to detect the optical signal received by the receiving port.

[0032] The external power interfaces of the optical amplification device and the laser emission device are both located on one side of the integrated housing.

[0033] Preferably, the optical amplification device specifically includes: a first lens, an SOA chip, a second lens, a first isolator, and an output optical port;

[0034] The output optical port, the first lens, the SOA chip, the second lens, and the first isolator are connected in sequence to form the optical amplification device.

[0035] Preferably, the laser emitting device specifically includes: a laser chip, a third lens, a second isolator, and a first beam splitter;

[0036] The laser chip, the third lens, the second isolator, and the first beam splitter are connected in sequence to form the laser emitting device.

[0037] This invention integrates the optical amplification device and the laser emission device within the optical module, placing them in the same integrated housing. This results in a more compact structure, smaller size, and greater suitability for miniaturized optical modules. Furthermore, the laser emission device generates a portion of the optical signal, which is modulated by a COSA modulator before being transmitted to the optical amplification device for amplification, increasing the output power of the light. This makes the invention suitable for link designs with high loss budgets. Additionally, the SOA chip of the optical amplification device is positioned near the optical signal emission port for easier heat dissipation. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0039] Figure 1 This is a schematic diagram of the overall structure of a small optical module with a built-in optical amplification device provided in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the optical amplification integrated unit structure of a small optical module with a built-in optical amplification device provided in an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of a laser emitting device structure of a small optical module with a built-in optical amplification device provided in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the optical amplification device structure of a small optical module with a built-in optical amplification device provided in an embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of other device structures of a small optical module with a built-in optical amplification device provided in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of the arrangement of various devices in a small optical module with a built-in optical amplification device for monitoring the optical signal intensity of an SOA chip, provided in an embodiment of the present invention.

[0045] Figure 7 This is a schematic diagram of the overall structure of a small optical module with a built-in optical amplification device provided in another embodiment of the present invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0047] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0048] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0049] Example 1:

[0050] Embodiment 1 of the present invention provides a small optical module with a built-in optical amplification device, including an integrated housing 1, a COSA modulator 2, and an optical amplification integrated unit 3; wherein, the optical amplification integrated unit 3 includes an optical amplification device 31 and a laser emitting device 32, specifically:

[0051] The optical amplification device 31 and the laser emitting device 32 are encapsulated in the integrated housing 1 according to a preset position, and the integrated housing 1 is disposed inside the optical module;

[0052] The input / output optical ports 311 of the optical amplifier 31 are coupled to the transceiver port 11 on the integrated housing 1, and the transceiver port 11 is used to couple with the external adapter port of the optical module; the input end of the optical amplifier 31 is coupled to the COSA modulator 2 through an optical fiber.

[0053] The emitting end of the laser emitting device 32 is coupled to the COSA modulator 2 to provide a local oscillator light source and output optical signal;

[0054] The external power interfaces of the optical amplification device 31 and the laser emitting device 32 are both located on one side of the integrated housing 1.

[0055] like Figure 1 and Figure 2 As shown, where, Figure 2This diagram illustrates the internal structure of the optical amplification unit. In this embodiment, the amplification device and laser emitting device 32 are integrated within an integrated housing 1, and the transceiver port 11 is mounted on the integrated housing 1. The integrated housing 1 is then placed within the optical module. This makes the structure of the optical amplification integrated unit 3 more compact and smaller, thus adapting to miniaturized and standardized optical module structures. Furthermore, the output end of the optical amplification device 31 is provided with an input / output optical port 311, which penetrates the integrated housing 1 and couples with the transceiver port 11. This allows the heat generated by the optical amplification integrated unit 3 to be dissipated through the input / output optical port 311 from the integrated housing 1 and the outside of the optical module, further facilitating heat dissipation. It is worth noting that the preset position packaging of the optical amplification device 31 and the laser emitting device 32 can be parallel packaging, cross-staggered packaging, or other packaging methods. In the actual production process, the packaging method of the optical amplification device 31 and the laser emitting device 32 is determined according to the actual needs. In this embodiment of the invention, the optical amplification device 31 and the laser emitting device 32 are packaged in parallel. Furthermore, by placing each component of the optical amplification device 31 on the optical path, the design of the fiber optic cable outlet inside the optical module can be eliminated, reducing the internal space of the module and making the structure more compact.

[0056] To illustrate the complete solution of the embodiments of the present invention, the details of the present invention will be explained in detail below. Further, the laser emitting device 32 specifically includes: a laser chip 321, a third lens 322, a second isolator 323, and a first beam splitter 324; the laser chip 321, the third lens 322, the second isolator 323, and the first beam splitter 324 are sequentially connected to form the laser emitting device 32.

[0057] like Figure 3As shown, the laser emitting device 32 of this embodiment is composed of a laser chip 321, a third lens 322, a second isolator 323, and a beam splitter 324 connected in sequence. The laser chip 321 is connected to the control circuit board of the optical module. Under the control of the control circuit board, the laser chip 321 forms a circuit path and is energized, emitting a laser signal. The laser in this embodiment can be a tunable laser. The emitted optical signal can be divided into two parts. The first part, as the local oscillator signal, is combined with the external optical signal received by the transceiver port 11 of the optical module and undergoes phase demodulation within the coherent demodulation unit of the COSA modulator 2. This demodulation is used to analyze and monitor the external optical signal received by the optical module. Through the demodulation unit inside the COSA modulator 2, the relevant content of the external output signal received by the optical module can be determined. The other part of the optical signal is modulated by the COSA modulator 2, then amplified by the SOA chip 313 of the optical amplification device 31 before being output to the outside of the optical module. To better understand this invention, the functions of each component within the laser emitting device 32 will be further explained below. The laser chip 321 in this embodiment primarily provides the local oscillator light signal and the output light signal. The lens within the laser emitting device 32 optimizes the light signal emitted by the laser chip 321. The isolator functions similarly to a diode, exhibiting unidirectional conduction. After passing through the second isolator 323, the light signal emitted by the laser emitting device 32 propagates only towards the COSA modulator 2, preventing some of the light signal from being reflected back into the laser chip 321 and damaging the laser. The second isolator 323 primarily protects the laser chip 321. The beam splitter prism 324 primarily splits the local oscillator light signal and the output light signal of different wavelengths.

[0058] Furthermore, the optical amplification device 31 specifically includes: an input / output optical port 311, a first lens 312, an SOA chip 313, a second lens 314, and a first isolator 315; the input / output optical port 311, the first lens 312, the SOA chip 313, the second lens 314, and the first isolator 315 are sequentially connected to form the optical amplification device 31.

[0059] like Figure 4As shown, the optical amplification device 31 and the COSA modulator 2 of this invention are coupled by optical fiber. The COSA modulator 2 transmits the modulated optical signal to the input end of the optical amplification device 31 through the optical fiber. Then, through the amplification effect of the optical amplification device 31, the optical power of the optical signal is increased, making this invention suitable for link designs with higher loss pre-processing. The lens in the optical amplification device 31 of this invention has a similar function to the lens in the laser amplification device 31, both of which are used to optimize the corresponding parameters of the optical signal during transmission. The first isolator 315 prevents the output optical signal in the optical amplification device 31 from backflowing and interfering with the optical signal during transmission. The SOA chip 313 mainly amplifies the optical signal and increases the optical signal power. It is worth noting that this embodiment of the invention employs a transceiver port 11. On one hand, a portion of the optical signal emitted by the laser chip 321 is amplified by the COSA modulator 2 and then output outside the optical module. On the other hand, another portion of the optical signal emitted by the laser chip 321 enters the COSA as a local oscillator signal. Simultaneously, the optical signal outside the optical device enters the integrated housing 1 through the transceiver port 11 and is then transmitted to the COSA modulator 2 via optical fiber to phase-couple with the local oscillator signal emitted by the laser chip 321. Demodulation: The coherent demodulation unit inside the COSA modulator 2 acquires the content of the external input optical signal. It is easy to see that the transceiver port 11 is coupled to the COSA demodulator using optical fiber, lens and isolator. Through the transmission of the external optical signal through the optical fiber, the optimization effect of the lens, and the unidirectional transmission effect of the isolator, the optical signal from outside the optical module can smoothly enter the COSA modulator 2 and merge with the local oscillator optical signal for phase demodulation. Furthermore, the isolator ensures that the transmission process of the optical signal from outside the optical module is not interfered with by other optical signals.

[0060] Furthermore, the optical amplification integrated unit 3 also includes a first detector 33, a second detector 34, a reflecting prism 35, and a standard etalon 36; the reflecting prism 35 is correspondingly arranged with the beam splitter 324, and the reflecting prism 35, the standard etalon 36, and the first detector 33 are sequentially coupled and connected; the light signal reflected by the first beam splitter 324 passes through the reflecting prism 35, the standard etalon 36, and the first detector 33 successively to detect the intensity of the reflected light signal; the second detector 34 is arranged in the optical path from the laser emitting device 32 to the receiving end of the COSA modulator 2 to detect the intensity of the emitted light from the laser emitting device.

[0061] like Figure 5As shown, in order to better monitor the various parameters and contents of the optical signal transmitted inside the optical module, the optical amplification integrated unit 3 of this invention also includes a corresponding detector, a reflecting prism 35, and a standard etalon 36. Part of the optical signal emitted by the laser emitting device 32 of this invention is transmitted to the COSA modulator 2 through the beam splitter prism 324, and another part is transmitted to the reflecting prism 35 through the reflection of the prism. By setting the angle of the reflecting prism 35, the optical signal is transmitted sequentially to the standard etalon 36 and the first detector 33, thereby achieving the purpose of monitoring the parameter parameters of the optical signal of the laser emitting device 32.

[0062] The following section uses a specific type of laser to illustrate the process of monitoring the wavelength of the optical signal in this invention. Taking a tunable laser based on the principles of DS-DBR (the digital super-mode distributed bragg reflector) or SG-DBR (the sample grating distributed bragg reflector) as an example, the wavelength within a period is locked and adjusted by changing the phase current in real time. A tunable laser combined with an etalon can achieve wavelength locking or tuning. The etalon has an FSR spectrum; by locking the wavelength points at the peaks, troughs, or waists of the spectrum, the laser's wavelength locking function can be achieved. Specifically: Let the current received by monitoring PD1 be P1, which is a constant value and does not change with the wavelength of the tunable laser; let the current received by monitoring PD2 be P2, which changes with the wavelength. When the laser wavelength is stable, P2 / P1 = D is a constant value; when the laser wavelength changes, the optical power transmitted through the etalon will change, that is, the value of P2 will change, resulting in P2 / P1 ≠ D. At this time, the laser phase current is adjusted so that P2 / P1 = D is true again, that is, the laser wavelength is locked. Here, monitoring PD1 corresponds to the second detector 34 of the present invention, and monitoring PD2 corresponds to the first detector 33 of the present invention.

[0063] To cool down the optical amplification device 31 and the laser emitting device 32, this embodiment of the invention also includes an optical signal processor and a cooler; the optical signal processor is disposed on the circuit board of the optical module and connected to the radio frequency port of the COSA modulator 2, and is used for processing radio frequency received signals and modulated signals; the cooler is disposed inside the integrated housing 1.

[0064] In this invention, the optical amplification device 31 and the laser emission device 32 are housed within the integrated housing 1. During operation, the SOA chip 313 and the laser chip 321 generate significant heat, causing the temperature within the integrated housing 1 to rise. This can negatively impact the performance of the SOA chip 313 and the laser chip 321, and may even lead to chip burnout. This invention incorporates a cooler within the integrated housing 1 to lower the temperature and ensure the normal operation of the SOA chip 313 and the laser chip 321. When the optical signal requires analysis after transmission, this invention utilizes an optical signal processor connected to the RF port of the COSA modulator 2. The optical signal processor can process the RF optical signal and modulation signal received by the RF port of the COSA modulator 2.

[0065] In this embodiment of the invention, a preferred implementation is also proposed, such as... Figure 6 As shown, the optical amplification device 31 also includes a second beam splitter 316 and a third detector 317. Figure 6 This diagram only illustrates the positional relationship between the second beam splitter 316 and the third detector 317. To clearly show the specific positional relationship between the second beam splitter 316 and the third detector 317, the corresponding first detector 33, second lens 314, first isolator 315, and laser chip 321 are also shown. Figure 6 The following is annotated:

[0066] The second beam splitter 316 is disposed in the optical path between the second lens 314 and the first isolator 315;

[0067] The third detector 317 is located on the side of the laser emitting device 32, behind the first detector 33, and its detection surface faces the optical amplification integrated unit 3. It is used to receive the optical signal to be amplified by the SOA chip 313 split by the second beam splitter 316.

[0068] The above-mentioned, such as Figure 6 In the preferred embodiment shown, the optical power of the optical signal before amplification by the SOA chip 313 is further proposed. A series of possible insertion losses, transmission losses, modulation losses, etc. before the optical signal is emitted are all calculated here. Based on the optical signal strength detected by the third detector 317, the working drive electrical signal strength of the SOA chip 313 is finally determined, which affects whether the final output optical signal power meets the preset requirements.

[0069] Compared to existing conventional methods, in this embodiment of the invention, because the optical amplification device 31 and the laser emitting device 32 are integrated into a single module housing, and correspondingly, under the condition of providing TEC temperature, the stability of the operation of the corresponding third detector 317 and SOA chip 313 can be guaranteed, ensuring that the detected optical power value and the final amplified optical power result are consistent with the research and development testing stage. Unlike the prior art, where the optical amplification device 31 and the laser emitting device 32 are set up independently, causing abnormal effects of temperature on the optical amplification device 31 under certain harsh working environments.

[0070] Furthermore, it also includes a control circuit board 6, which is electrically connected to the SOA chip 313 and the laser chip 321, and is used to control the amplification gain of the optical signal and set the wavelength power of the optical signal generated by the laser emitting device 32.

[0071] In this embodiment of the invention, the optical module includes a control circuit. This control circuit adjusts the SOA chip 313 and the laser chip 321, thereby achieving the purpose of adjusting the wavelength of the optical signal generated by the laser emitting device 32 and controlling the power gain of the optical signal. Furthermore, it is worth noting that the connection between the integrated housing 1 and the interior of the optical module can be one or more of adhesive bonding, screw riveting, and laser welding.

[0072] This invention integrates the amplification device, laser emitting device 32, and transceiver port 11 into an integrated housing 1, and places the integrated housing 1 inside the optical module. This makes the structure of the optical amplification integrated unit 3 more compact and smaller, thus adapting to miniaturized and standardized optical module structures. In addition, the output end of the optical amplification device 31 of this invention is provided with an input / output optical port 311, and the input / output optical port 311 penetrates the integrated housing 1 and couples with the transceiver port 11, so that the heat generated by the optical amplification integrated unit 3 of this invention can be discharged from the integrated housing 1 and the outside of the optical module through the input / output optical port 311, which is more conducive to heat dissipation. Furthermore, by amplifying the optical signal through the built-in optical amplification device 31 of this invention, the optical power of the optical signal is improved, making this invention suitable for link designs with higher loss budgets.

[0073] Example 2:

[0074] Compared to Embodiment 1 of the present invention, the present invention also proposes a small optical module with a built-in optical amplification device, including an integrated housing 1, a COSA modulator 2, an optical amplification integrated unit 3, and a receiving port 7; wherein, the optical amplification integrated unit 3 includes an optical amplification device 31 and a laser emitting device 32, specifically:

[0075] The optical amplification device 31 and the laser emitting device 32 are encapsulated in the integrated housing 1 according to a preset position, and the integrated housing 1 is disposed inside the optical module;

[0076] The output optical port 318 of the optical amplifier 31 is coupled to the transmission port 12 on the integrated housing 1, and the transmission port 12 is used to couple with the external adapter port of the optical module; the input end of the optical amplifier 31 is coupled to the COSA modulator 2 through an optical fiber.

[0077] The emitting end of the laser emitting device 32 is coupled to the COSA modulator 2 to provide a local oscillator light source and output optical signal;

[0078] The receiving port 7 is coupled to the COSA modulator 2. Part of the optical signal emitted by the laser emitting device 32 is phase demodulated together with the optical signal received by the receiving port 7 through the transmitting port 12, which is used to detect the optical signal received by the receiving port 7.

[0079] The external power interfaces of the optical amplification device 31 and the laser emitting device 32 are both located on one side of the integrated housing 1.

[0080] Furthermore, the optical amplification device 31 specifically includes: a first lens 312, an SOA chip 313, a second lens 314, a first isolator 315, and an output optical port 318;

[0081] The output optical port 318, the first lens 312, the SOA chip 313, the second lens 314 and the first isolator 315 are connected in sequence to form the optical amplification device 31.

[0082] Furthermore, the laser emitting device 32 specifically includes: a laser chip 321, a third lens 322, a second isolator 323, and a first beam splitter 324;

[0083] The laser chip 321, the third lens 322, the second isolator 323 and the first beam splitter 324 are connected in sequence to form the laser emitting device 32.

[0084] like Figure 7 As shown, where, Figure 7 Only the structure different from Embodiment 1 is marked. In this invention, the transceiver port 11 in Embodiment 1 is designed as a separate receiving port 7 and transmitting port 12. The optical signal outside the optical module is transmitted through the receiving port 7 and the optical fiber coupled to the COSA modulator 2 through the receiving port 7. The COSA modulator 2 receives the optical signal transmitted through the receiving port 7 and performs phase demodulation together with the local oscillator optical signal emitted by the laser emitting device 32. Then, it is processed by the optical signal processor to realize the monitoring of the optical signal of this invention.

[0085] In this embodiment of the invention, a preferred implementation is also proposed, such as... Figure 6 As shown, the optical amplification device 31 also includes a second beam splitter 316 and a third detector 317. Figure 6 This diagram only illustrates the positional relationship between the second beam splitter 316 and the third detector 317. To clearly show the specific positional relationship between the second beam splitter 316 and the third detector 317, the corresponding first detector 33, second lens 314, first isolator 315, and laser chip 321 are also shown. Figure 6 The following is annotated:

[0086] The second beam splitter 316 is disposed in the optical path between the second lens 314 and the first isolator 315;

[0087] The third detector 317 is located on the side of the laser emitting device 32, behind the first detector 33, and its detection surface faces the optical amplification integrated unit 3. It is used to receive the optical signal to be amplified by the SOA chip 313 split by the second beam splitter 316.

[0088] The above-mentioned, such as Figure 6 In the preferred embodiment shown, the optical power of the optical signal before amplification by the SOA chip 313 is further proposed. A series of possible insertion losses, transmission losses, modulation losses, etc. before the optical signal is emitted are all calculated here. Based on the optical signal strength detected by the third detector 317, the working drive electrical signal strength of the SOA chip 313 is finally determined, which affects whether the final output optical signal power meets the preset requirements.

[0089] Compared to existing conventional methods, in this embodiment of the invention, because the optical amplification device 31 and the laser emitting device 32 are integrated into a single module housing, and correspondingly, under the condition of providing TEC temperature, the stability of the operation of the corresponding third detector 317 and SOA chip 313 can be guaranteed, ensuring that the detected optical power value and the final amplified optical power result are consistent with the research and development testing stage. Unlike the prior art, where the optical amplification device 31 and the laser emitting device 32 are set up independently, causing abnormal effects of temperature on the optical amplification device 31 under certain harsh working environments.

[0090] It is worth noting that, apart from the receiving port 7 and transmitting port 12, the other structures in this embodiment of the invention are the same as those in Embodiment 1, and their functions are also completely identical, so they will not be described in detail here.

[0091] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A small-sized optical module having a built-in optical amplifying device, characterized by comprising: The application relates to an integrated optical amplifier module, which comprises an integrated shell (1), a COSA modulator (2) and an optical amplifier integrated unit (3); wherein the optical amplifier integrated unit (3) comprises an optical amplifier device (31) and a laser emission device (32), and specifically, the optical amplifier device (31) and the laser emission device (32) are packaged in the integrated shell (1) according to preset positions, and the integrated shell (1) is arranged in an optical module; an input-output optical port (311) of the optical amplifier device (31) is coupled with a transceiving integrated port (11) on the integrated shell (1), and the transceiving integrated port (11) is used for being coupled with an external adaptation port of the optical module; an input end of the optical amplifier device (31) is coupled with the COSA modulator (2) through an optical fiber; an emission end of the laser emission device (32) is coupled with the COSA modulator (2) and is used for providing a local oscillation light source and outputting an optical signal; the output optical signal enters the optical amplifier device after being affected by the COSA modulator (2) and is amplified, and then the amplified optical signal is output to the outside of the optical module; the transceiving integrated port (11) is coupled with the COSA modulator (2) internally, so that an optical signal transmitted from the outside of the optical module can enter the COSA modulator (2) internally and be combined with the local oscillation light signal to perform phase demodulation, and the content of the optical signal input from the outside of the optical device is acquired; wherein external electrical interfaces of the optical amplifier device (31) and the laser emission device (32) are arranged on one side of the integrated shell (1).

2. The compact optical module of claim 1, wherein The optical amplifier device (31) specifically comprises an input-output optical port (311), a first lens (312), an SOA chip (313), a second lens (314) and a first isolator (315). The input-output optical port (311), the first lens (312), the SOA chip (313), the second lens (314) and the first isolator (315) are sequentially connected to form the optical amplifier device (31).

3. The compact optical module of claim 1, wherein The laser emission device (32) specifically comprises a laser chip (321), a third lens (322), a second isolator (323) and a first light splitting prism (324). The laser chip (321), the third lens (322), the second isolator (323) and the first light splitting prism (324) are sequentially connected to form the laser emission device (32).

4. The compact optical module of claim 3, wherein The optical amplifier integrated unit (3) further comprises a first detector (33), a second detector (34), a reflecting prism (35) and an etalon (36), and specifically, the reflecting prism (35) is arranged correspondingly to the light splitting prism (324), and the reflecting prism (35), the etalon (36) and the first detector (33) are sequentially coupled; the light signal reflected by the first light splitting prism (324) passes through the reflecting prism (35), the etalon (36) and the first detector (33) in sequence, and is used for detecting the intensity of the reflected light signal; the second detector (34) is arranged on an optical path from the laser emission device (32) to a receiving end of the COSA modulator (2) and is used for detecting the emission intensity of the laser emission device (32).

5. The compact optical module of claim 4, wherein The optical amplification device (31) further comprises a second light splitting prism (316) and a third detector (317), specifically: The second light splitting prism (316) is arranged on the light path between the second lens (314) and the first isolator (315); The third detector (317) is arranged on the side of the laser emission device (32), is arranged after the first detector (33), and has a detection surface facing the optical amplification integrated unit (3), and is used for receiving the optical signal amplified by the SOA chip (313) split by the second light splitting prism (316).

6. The compact optical module of claim 1, wherein Further comprising an optical signal processor (4) and a refrigerator (5); The optical signal processor (4) is arranged on the circuit board of the optical module, and is connected with the radio frequency port of the COSA modulator (2), and is used for processing the radio frequency receiving signal and the modulation signal; The refrigerator (5) is arranged in the integrated shell (1), and is used for cooling the optical amplification device (31) and the laser emission device (32).

7. The compact optical module of claim 1, wherein Further comprising a control circuit board (6), the control circuit board (6) is electrically connected with the SOA chip (313) and the laser chip (321), and is used for realizing control of the optical signal amplification gain and wavelength power setting of the optical signal generated by the laser emission device (32).

8. A small-sized optical module having a built-in optical amplifying device, characterized by comprising: The integrated shell (1), the COSA modulator (2), the optical amplification integrated unit (3) and the receiving port (7) are included; wherein the optical amplification integrated unit (3) comprises an optical amplification device (31) and a laser emission device (32), specifically: The optical amplification device (31) and the laser emission device (32) are packaged in the integrated shell (1) according to a preset position, and the integrated shell (1) is arranged in the optical module; The output optical port (318) of the optical amplification device (31) is coupled with the emission port (12) on the integrated shell (1), and the emission port (12) is used for coupling with the external adaptation port of the optical module; the input end of the optical amplification device (31) is coupled with the COSA modulator (2) through an optical fiber The emission end of the laser emission device (32) is coupled with the COSA modulator (2), which is used for providing a local oscillator light source and an output optical signal; the output optical signal enters the amplification device after being affected by the COSA modulator (2), and then the amplified optical signal is output to the outside of the optical module; The receiving port (7) is coupled with the COSA modulator (2), and part of the optical signal emitted by the laser emission device (32) is received by the receiving port (7) together with the optical signal received by the receiving port (7) for phase demodulation, which is used for detecting the optical signal received by the receiving port (7); Wherein, the external electrical interfaces of the optical amplification device (31) and the laser emission device (32) are arranged on one side of the integrated shell (1).

9. The compact optical module of claim 8, wherein The optical amplification device (31) specifically comprises: a first lens (312), an SOA chip (313), a second lens (314), a first isolator (315) and an output optical port (318); The output light port (318), the first lens (312), the SOA chip (313), the second lens (314) and the first isolator (315) are sequentially connected to constitute the optical amplification device (31).

10. The compact optical module of claim 8, wherein The laser emission device (32) specifically comprises a laser chip (321), a third lens (322), a second isolator (323) and a first light splitting prism (324). The laser chip (321), the third lens (322), the second isolator (323) and the first light splitting prism (324) are sequentially connected to constitute the laser emission device (32).

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