Wafer pick-and-place machine

Abstract

This invention provides a wafer mounter, including a chassis, and mounted on the chassis a first packaging robot loading system, a first adhesive dispensing robot, an adhesive removal and dispensing box, an adhesive dispensing mechanism, a first material robot feeding system, an intelligent height measurement system, a second adhesive dispensing robot, a material pressing and supporting positioning mechanism, a third turret robot, a second material robot feeding system, a second packaging robot loading system, a third packaging robot unloading system, and an adhesive bonding fixture system. The advantages of this invention are: its structure is scientifically sound and reasonable, it is safe and convenient to use, and compared with traditional die bonders and mounters, it greatly improves accuracy and allows for material diversification. It features data traceability, allowing for real-time monitoring and accuracy correction of various data throughout the product manufacturing process. It facilitates problem tracking, is easy to operate, and operators only require simple training to be competent.

Description

Technical Field

[0001] This invention relates to the field of electronic industrial packaging, and more particularly to a wafer placement machine. Background Technology

[0002] The electronics industry developed on the basis of the advancement and application of electronic science and technology. Since the 20th century, the electronics industry has developed rapidly. Due to improvements in production technology and processing techniques, integrated circuits are updated approximately every three years. The mass production and use of large-scale integrated circuits and computers, along with the rise of fiber optic communication, digital communication, satellite communication technologies, smart wearables, and medical aesthetic electronics, have made the electronics industry a rapidly emerging high-tech industry. The development of the electronics industry and the widespread application of its products have had a profound impact on the military field.

[0003] However, current wafer mounters on the market are not only complex in structure but also have limited functionality. Existing wafer mounters primarily rely on manual labor combined with fixtures for dispensing, resulting in high labor intensity, low dispensing accuracy, limited adhesive options, low production capacity, lack of product data traceability, large footprint, high labor requirements, and inability to integrate processes. Component bonding typically involves only one type of adhesive; when multiple types are used, multiple machines or multiple processes are required, significantly lengthening the process time and making precision control difficult. Summary of the Invention

[0004] The purpose of this invention is to provide a high-precision wafer mounter to solve the problems mentioned in the background art.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A wafer mounter includes a chassis, and mounted on the chassis a first packaging robot loading system, a first adhesive dispensing robot, an adhesive removal and discharging box, an adhesive dispensing mechanism, a first material robot feeding system, an intelligent height measurement system, a second adhesive dispensing robot, a material pressing and supporting positioning mechanism, a third turret robot, a second material robot feeding system, a second packaging robot loading system, a third packaging robot unloading system, and an adhesive fixture system.

[0007] The first packaging robot feeding system is equipped with a material storage box for storing multiple boxes of materials. The first packaging robot feeding system can replace the material storage box as needed and send the material to the first material robot feeding system. The material is then transferred to the material pressing support positioning mechanism through the first material robot feeding system (17). After the material pressing support positioning mechanism fixes the material, the height is measured by the intelligent height measurement system and accurately positioned by the first intelligent imaging system.

[0008] The first and second robotic arms for applying the dotting adhesive are connected to the dotting adhesive mechanism. The first and second robotic arms drive the dotting adhesive mechanism to process the material dotting adhesive on the material pressing and supporting positioning mechanism. The material pressing and supporting positioning mechanism puts the processed material back into the first material robot feeding system. The material is then transferred to the second material robot feeding system through the first material robot feeding system. The material is then transferred to the bonding fixture system through the second material robot feeding system. The bonding fixture system fixes the material and precisely positions it through the second intelligent imaging system.

[0009] The second robotic feeding system transfers the material to be bonded from the storage box to the nozzle of the third turret robot, and the third intelligent imaging system precisely positions it.

[0010] The third turret robot picks up the material and moves it to the fourth intelligent imaging system for precise positioning. The third turret robot then moves to the top of the material fixed by the adhesive fixture system and adhesives the material onto it.

[0011] The second material robot feeding system transfers the bonded materials to the third packaging robot unloading system. The third packaging robot unloading system stores the materials into material boxes and then sends the material boxes to the unloading platform of the third robot unloading system.

[0012] As a further improvement of the present invention, the first robot feeding system includes a lifting component, a forward and backward moving component, a pushing component, a gripping component, a material storage box, a discharge platform, a feeding platform, and a feeding conveying component. The lifting component is mounted on the forward and backward moving component, the pushing component is mounted on the feeding platform, and the gripping component is mounted on the lifting component. The material storage box is placed on the feeding platform and conveyed to the material storage box retrieval position by the feeding conveying component. Then, the lifting component, the forward and backward moving component, and the gripping component convey the material storage box to the feeding position of the material feeding system of the first material robot. The pushing component delivers the material from the material storage box to the first material robot feeding system. When the material in the material storage box is completely delivered, the lifting component, the forward and backward moving component, and the gripping component convey the material storage box to the discharge box placement position of the discharge platform.

[0013] As a further improvement of the present invention, the first material robot feeding system includes a track adjustment component, and a conveying component, a waiting component, a material cover component, a material positioning component, and a discharge waiting component installed on the track adjustment component. When the material is transferred from the first robot loading system into the conveying component, it is conveyed to the waiting position of the waiting component by the conveying component, and then conveyed to the fine positioning of the material positioning component by the conveying component. The material cover component presses down the material dotting adhesive. After the dotting adhesive is completed, it is conveyed to the waiting position of the discharge waiting component by the conveying component to wait for delivery to the second material robot feeding system.

[0014] As a further improvement of the present invention, the material pressing support positioning mechanism includes an adjustable fixing plate, a precision cylinder slide, and a three-layer adjustable material support plate. The three-layer adjustable material support plate is installed on the precision cylinder slide, and the precision cylinder slide is installed on the adjustable fixing plate. The material is pressed and fixed to the material cover assembly fixing position by the up and down movement of the precision cylinder slide.

[0015] As a further improvement of the present invention, the first manipulator for applying adhesive includes a first left-right linear platform, a first front-back linear platform, and a first up-down linear module. The first up-down linear module is mounted on the first front-back linear platform, and the first front-back linear platform is mounted on the first left-right linear platform. The first left-right linear platform, the first front-back linear platform, and the first up-down linear module can perform linear movements to complete the function of applying adhesive in three-dimensional space. The second manipulator for applying adhesive includes a second left-right linear platform, a second front-back linear platform, and a second up-down linear module. The second up-down linear module is mounted on the second front-back linear platform, and the second front-back linear platform is mounted on the second left-right linear platform. The second left-right linear platform, the second front-back linear platform, and the second up-down linear module can perform linear movements to complete the function of applying adhesive in three-dimensional space.

[0016] As a further improvement of the present invention, the dotting adhesive mechanism includes a left and right linear platform and an upper and lower linear platform. The left and right linear platforms and the upper and lower linear platforms are installed on the second upper and lower linear module. The relative positions of the two dotting adhesive heads in the X and Z directions are determined by corresponding linear adjustment.

[0017] As a further improvement of the present invention, the second material robot feeding system includes left and right linear platforms, front and rear linear platforms, and a discharge conveying component. The front and rear linear platforms and the discharge conveying component are installed on the left and right linear platforms. The material is conveyed to the second material robot feeding system by the first material robot feeding system. The material is then conveyed to the positioning position of the bonding fixture system by the discharge conveying component in the second material robot feeding system. The bonding fixture system fixes the material. The bonded material is then conveyed to the discharge position of the packaging third robot discharge system by the discharge conveying component.

[0018] As a further improvement of the present invention, the third turret manipulator includes a high-precision ZR assembly with a fixed suction nozzle, a turntable assembly, a high-precision DD motor, and a pneumatic-electric slip ring assembly. The high-precision ZR assembly is mounted on the turntable assembly, the turntable assembly is mounted on the high-precision DD motor, and the pneumatic-electric slip ring assembly is mounted on the high-precision DD motor to provide electricity and pneumatic power to the high-precision ZR assembly with the fixed suction nozzle.

[0019] As a further improvement of the present invention, the packaging second robot loading system includes a wafer stage lifting assembly, a wafer storage box, a wafer gripping and conveying assembly, a wafer gripper assembly, a forward and backward moving assembly, a left and right moving assembly, a film expansion and rotation correction assembly, and a vertical moving assembly. The wafer storage box is stored on the wafer stage lifting assembly. The wafer gripper assembly is mounted on the wafer gripping and conveying assembly. The film expansion and rotation correction assembly is mounted on the left and right moving assembly. The left and right moving assembly is mounted on the forward and backward moving assembly. The vertical moving assembly is fixed on the forward and backward moving assembly. The wafer stage lifting assembly raises the wafer storage box to the wafer gripping position. The wafer gripping and conveying assembly moves the wafer gripper assembly to grip the wafer. The wafer is then conveyed to the film expansion and rotation correction assembly for film expansion and fixation. The wafer is then moved by the left and right moving assembly and the forward and backward moving assembly to be delivered below the nozzle and precisely positioned and corrected by a third intelligent imaging system. Finally, the vertical moving assembly delivers the wafer directly below the nozzle.

[0020] As a further improvement of the present invention, the packaging third robot unloading system includes an unloading platform, a lifting component, a forward and backward moving component, a blocking component, a feeding conveyor component, a feeding platform, a material storage box, and a gripping component. The lifting component is mounted on the forward and backward moving component, the blocking component is mounted on the feeding platform, and the gripping component is mounted on the lifting component. The material storage box is filled with material and placed on the feeding platform. It is then conveyed to the material storage box retrieval position by the feeding conveyor component, and then conveyed to the unloading position in the packaging third robot unloading system by the lifting component, the forward and backward moving component, and the gripping component. When the material storage box is empty, it is conveyed to the unloading box placement position on the unloading platform by the lifting component, the forward and backward moving component, and the gripping component. The material is then removed by the next process robot or manually.

[0021] The beneficial effects of this invention are: The invention has a scientifically sound and reasonable structure, is safe and convenient to use, and significantly improves precision and allows for material diversification compared to traditional die bonders and chip mounters. It features data traceability, enabling real-time monitoring and precision correction of various data throughout the product manufacturing process. It facilitates problem tracking, is easy to operate, and requires only simple training for operators to become proficient. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is an overall internal top view of the present invention;

[0024] Figure 3 This is a schematic diagram of the overall internal structure of the present invention;

[0025] Figure 4This is a schematic diagram of the packaging first robot loading system of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the first material robot feeding system of the present invention;

[0027] Figure 6 This is a schematic diagram of the material pressing support and positioning mechanism of the present invention;

[0028] Figure 7 This is a schematic diagram of the dot-painting adhesive first robotic arm, the dot-painting adhesive first robotic arm, and the dot-painting adhesive mechanism of the present invention.

[0029] Figure 8 This is a schematic diagram of the adhesive fixture system and the second material robot feeding system of the present invention.

[0030] Figure 9 This is a schematic diagram of the third turret manipulator structure of the present invention;

[0031] Figure 10 This is a schematic diagram of the packaging second robot loading system of the present invention;

[0032] Figure 11 This is a schematic diagram of the packaging third robot unloading system of the present invention. Detailed Implementation

[0033] like Figures 1 to 11 As shown, the present invention discloses a wafer mounter, including a chassis 1, and a packaging first robot loading system 2, a dotting adhesive first robot arm 6, an adhesive removal and dispensing box 19, a dotting adhesive mechanism 5, a first material robot feeding system 17, an intelligent height measurement system 18, a dotting adhesive second robot arm 7, a material pressing support and positioning mechanism 20, a third turret robot arm 16, a second material robot feeding system 21, a packaging second robot loading system 3, a packaging third robot unloading system 4, and an adhesive fixture system 10 mounted on the chassis 1.

[0034] The function of the glue removal box 19 is to use vacuum to suck away excess glue from the dispensing head, and to remove glue when changing glue, thus expelling the glue that initially contained air.

[0035] The packaging first robot feeding system 2 is equipped with a material storage box 2-5 for storing multiple boxes of materials. The packaging first robot feeding system 2 can replace the material storage box 2-5 as needed and send the materials to the first material robot feeding system 17. The materials are then conveyed to the material pressing support and positioning mechanism 20 by the first material robot feeding system 17. After the material pressing support and positioning mechanism 20 fixes the materials, the height is measured by the intelligent height measurement system 18 and accurately positioned by the first intelligent imaging system 22.

[0036] The first and second robotic arms 6 and 7 are connected to the dotting adhesive mechanism 5. The first and second robotic arms 6 and 7 drive the dotting adhesive mechanism 5 to process the material dotting adhesive on the material pressing and supporting positioning mechanism 20. After the material pressing and supporting positioning mechanism 20 puts the processed material back into the first material robot feeding system 17, the material is transferred to the second material robot feeding system 21 through the first material robot feeding system 17. The material is then transferred to the bonding fixture system 10 through the second material robot feeding system 21. The bonding fixture system 10 fixes the material and accurately positions it through the second intelligent imaging system 9.

[0037] The second robot loading system 3 for packaging transfers the material to be bonded from the storage box to the suction nozzle of the third turret robot 16 and is precisely positioned by the third intelligent imaging system 12.

[0038] The material picked up by the third turret robot 16 is precisely positioned by the fourth intelligent imaging system 8, and then the third turret robot 16 moves to directly above the material fixed by the adhesive fixture system 10 to adhere the material.

[0039] The second material robot feeding system 21 transfers the bonded materials to the third packaging robot unloading system 4. The third packaging robot unloading system 4 stores the materials into material boxes and then sends the material boxes to the unloading platform of the third robot unloading system 4. The materials are then removed by the next process robot or by manual labor.

[0040] The first robot loading system 2 for packaging includes a lifting assembly 2-1, a forward and backward moving assembly 2-2, a pushing assembly 2-3, a gripping assembly 2-4, a material storage box 2-5, a discharge platform 2-6, a feeding platform 2-7, and a feeding conveyor assembly 2-8. The lifting assembly 2-1 is mounted on the forward and backward moving assembly 2-2, the pushing assembly 2-3 is mounted on the feeding platform 2-7, the gripping assembly 2-4 is mounted on the lifting assembly 2-1, and the material storage box 2-5 is filled with material and placed on the feeding platform 2-7, which is then fed by the feeding conveyor assembly 2-8. -8 is conveyed to the material storage box 2-5 retrieval position, and then conveyed to the material feeding position of the first material robot feeding system 17 by the lifting component 2-1, the forward and backward moving component 2-2, and the gripping component 2-4. The material is then conveyed from the material storage box 2-5 to the first material robot feeding system 17 by the pushing component 2-3. After the material in the material storage box 2-5 is completely conveyed, the material storage box 2-5 is conveyed to the discharge box placement position of the discharge table 2-6 by the lifting component 2-1, the forward and backward moving component 2-2, and the gripping component 2-4.

[0041] The first material robot feeding system 17 includes a track adjustment component 17-6, and a conveying component 17-1, a waiting component 17-2, a material cover component 17-3, a material positioning component 17-4, and a discharge waiting component 17-5 installed on the track adjustment component 17-6. When material is transferred from the first robot loading system 2 into the conveying component 17-1, it is conveyed by the conveying component 17-1 to the waiting position of the waiting component 17-2 to wait, and then conveyed by the conveying component 17-1 to the precise positioning of the material positioning component 17-4. The material cover component 17-3 presses down the material dotting adhesive. After the dotting adhesive is completed, it is conveyed by the conveying component 17-1 to the waiting position of the discharge waiting component 17-5 to wait for delivery to the second material robot feeding system 21. During operation, the material width is adjusted by the conveying component 17-1 and the guide rail adjustment component 17-6, and then the material is conveyed to the waiting component 17-2. The material is then transferred to the material positioning component 17-4 for positioning and to the material pressing support positioning mechanism 20. After the material pressing support positioning mechanism 20 fixes the material, the material cover component 17-3 covers it, and the height is measured by the intelligent height measurement system 18. The first intelligent imaging system 22 provides precise positioning.

[0042] The material pressing and supporting positioning mechanism 20 includes an adjustable fixing plate 20-1, a precision cylinder slide 20-2, and a three-layer adjustable material support plate 20-3. The three-layer adjustable material support plate 20-3 is mounted on the precision cylinder slide 20-2, which is mounted on the adjustable fixing plate 20-1. The material is pressed and fixed to the material cover assembly 17-3 at the fixed position by the up and down movement of the precision cylinder slide 20-2.

[0043] The first robotic arm 6 for applying adhesive includes a first left-right linear platform 6-1, a first front-back linear platform 6-2, and a first up-down linear module 6-3. The first up-down linear module 6-3 is mounted on the first front-back linear platform 6-2, and the first front-back linear platform 6-2 is mounted on the first left-right linear platform 6-1. The first left-right linear platform 6-1, the first front-back linear platform 6-2, and the first up-down linear module 6-3 can perform linear movements to complete the three-dimensional adhesive application function. The second robotic arm 7 for applying adhesive includes a second left-right linear platform 7-1, a second front-back linear platform 7-2, and a second up-down linear module 7-3. The second up-down linear module 7-3 is mounted on the second front-back linear platform 7-2, and the second front-back linear platform 7-2 is mounted on the second left-right linear platform 7-1. The second left-right linear platform 7-1, the second front-back linear platform 7-2, and the second up-down linear module 7-3 can perform linear movements to complete the three-dimensional adhesive application function.

[0044] The dotting adhesive mechanism 5 includes a left and right linear platform 5-1 and an upper and lower linear platform 5-2. The left and right linear platform 5-1 and the upper and lower linear platform 5-2 are installed on the second upper and lower linear module 7-3. The relative positions of the two dotting adhesive heads in the X and Z directions are determined by corresponding linear adjustments.

[0045] The second material robot feeding system 21 includes a left and right linear platform 21-1, a front and rear linear platform 21-2, and a discharge conveying component 21-3. The front and rear linear platforms 21-2 and the discharge conveying component 21-3 are installed on the left and right linear platforms 21-1. The material is conveyed to the second material robot feeding system 21 by the first material robot feeding system 17. The material is then conveyed to the positioning position in the bonding fixture system 10 by the discharge conveying component 21-3 in the second material robot feeding system 21. The bonding fixture system 10 fixes the material. The bonded material is then conveyed to the discharge position in the third packaging robot discharge system 4 by the discharge conveying component 21-3.

[0046] The third turret manipulator 16 includes a high-precision ZR assembly 16-1 with a fixed suction nozzle, a turntable assembly 16-2, a high-precision DD motor 16-3, and a pneumatic-electric slip ring assembly 16-4. The high-precision ZR assembly 16-1 is mounted on the turntable assembly 16-2, the turntable assembly 16-2 is mounted on the high-precision DD motor 16-3, and the pneumatic-electric slip ring assembly 16-4 is mounted on the high-precision DD motor 16-3 to provide electricity and pneumatic power to the high-precision ZR assembly 16-1 with the fixed suction nozzle.

[0047] The second robot loading system 3 for packaging includes a wafer stage lifting assembly 3-1, a wafer storage box 3-2, a wafer gripping and conveying assembly 3-3, a wafer gripper assembly 3-4, a forward and backward moving assembly 3-5, a left and right moving assembly 3-6, a film expansion and rotation correction assembly 3-7, and a vertical moving assembly 3-8. The wafer storage box 3-2 is stored on the wafer stage lifting assembly 3-1. The wafer gripper assembly 3-4 is mounted on the wafer gripping and conveying assembly 3-3. The film expansion and rotation correction assembly 3-7 is mounted on the left and right moving assembly 3-6. The left and right moving assembly 3-8 is mounted on the wafer stage lifting assembly 3-1. The wafer storage box 3-2 is raised to the wafer gripping position by the wafer stage lifting assembly 3-1, and then the wafer gripper assembly 3-4 is moved by the wafer gripping and conveying assembly 3-3 to grip the wafer. The wafer is then conveyed to the film expansion and rotation correction assembly 3-7 for film expansion and fixation. The wafer is then moved by the left and right moving assembly 3-6 and the front and back moving assembly 3-5 to be sent to the bottom of the nozzle and precisely positioned and corrected by the third intelligent imaging system 12. Finally, the wafer is sent to the bottom of the nozzle by the up and down moving assembly 3-8.

[0048] The third robot unloading system 4 includes an unloading platform 4-1, a lifting assembly 4-2, a forward and backward moving assembly 4-3, a material blocking assembly 4-4, a feeding conveyor assembly 4-5, a feeding platform 4-6, a material storage box 4-7, and a gripping assembly 4-8. The lifting assembly 4-2 is mounted on the forward and backward moving assembly 4-3, the material blocking assembly 4-4 is mounted on the feeding platform 4-6, the gripping assembly 4-8 is mounted on the lifting assembly 4-2, and the material storage box 4-7 is used to load materials. The material is placed on the feeding platform 4-6 and conveyed to the material storage box 4-7 retrieval position through the feeding conveyor component 4-5. Then, the material storage box 4-7 is conveyed to the discharge position in the packaging third robot discharge system 4 through the lifting component 4-2, the forward and backward moving component 4-3, and the gripping component 4-8. When the material storage box 4-7 is full, the material storage box 4-7 is conveyed to the discharge box placement position on the discharge platform 4-1 through the lifting component 4-2, the forward and backward moving component 4-3, and the gripping component 4-8.

[0049] The working principle of this invention is as follows: The first encapsulation robot feeding system 2, as needed, uses a lifting assembly 2-1, a forward / backward moving assembly 2-2, a gripping assembly 2-4, a discharge platform 2-6, a feeding platform 2-7, and a feeding conveyor assembly 2-8 to change the material storage box 2-5. The material is then fed from the material storage box 2-5 to the first material robot feeding system 17 via a pushing assembly 2-3. The second encapsulation robot feeding system 3 conveys various materials to be bonded (up to six types can be stored) from the storage box to below the suction nozzle of the third turret robot 16, where it is precisely positioned using an intelligent imaging system 12. The third turret robot 16 then rotates to the positioning point to pick up the material.

[0050] This invention features a scientifically sound and reasonable structure, ensuring safe and convenient use. Compared to traditional die bonders and chip mounters, it significantly improves precision and supports a wider range of materials. Its data traceability function allows for real-time monitoring and precision correction of various data points throughout the product manufacturing process. It facilitates problem tracking, is easy to operate, and requires only simple training for operators to become proficient.

[0051] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A wafer placement machine, characterized in that: The system includes a chassis (1), and mounted on the chassis (1) a first packaging robot loading system (2), a first dotting glue robot (6), a glue removal and discharge box (19), a dotting glue mechanism (5), a first material robot feeding system (17), an intelligent height measurement system (18), a second dotting glue robot (7), a material pressing support and positioning mechanism (20), a third turret robot (16), a second material robot feeding system (21), a second packaging robot loading system (3), a third packaging robot unloading system (4), and an adhesive fixture system (10). The packaging first robot feeding system (2) is equipped with a material storage box (2-5) for storing multiple boxes of materials. The packaging first robot feeding system (2) can replace the material storage box (2-5) as needed and send the material to the first material robot feeding system (17). The material is then transferred to the material pressing support positioning mechanism (20) through the first material robot feeding system (17). After the material pressing support positioning mechanism (20) fixes the material, the height is measured by the intelligent height measurement system (18) and accurately positioned by the first intelligent imaging system (22). The first manipulator (6) and the second manipulator (7) are connected to the dotting glue mechanism (5). The first manipulator (6) and the second manipulator (7) drive the dotting glue mechanism (5) to process the material dotting glue on the material pressing support positioning mechanism (20). The material pressing support positioning mechanism (20) puts the processed material back into the first material robot feeding system (17). The material is then transferred to the second material robot feeding system (21) through the first material robot feeding system (17). The material is then transferred to the bonding fixture system (10) through the second material robot feeding system (21). The bonding fixture system (10) fixes the material and positions it precisely through the second intelligent imaging system (9). The second robot loading system (3) for packaging transfers the material to be bonded from the storage box to the nozzle of the third turret robot (16) and is precisely positioned by the third intelligent imaging system (12); The material picked up by the third turret manipulator (16) is precisely positioned by the fourth intelligent imaging system (8), and then the third turret manipulator (16) moves to the top of the material fixed by the adhesive fixture system (10) to adhere the material. The second material robot feeding system (21) delivers the bonded material to the packaging third robot discharging system (4). The packaging third robot discharging system (4) stores the material into the material box and then sends the material box to the discharging station of the packaging third robot discharging system (4).

2. The wafer mounter according to claim 1, characterized in that: The first robot loading system (2) includes a lifting assembly (2-1), a forward and backward moving assembly (2-2), a pushing assembly (2-3), a gripping assembly (2-4), a material storage box (2-5), a discharge platform (2-6), a feeding platform (2-7), and a feeding conveyor assembly (2-8). The lifting assembly (2-1) is mounted on the forward and backward moving assembly (2-2), the pushing assembly (2-3) is mounted on the feeding platform (2-7), the gripping assembly (2-4) is mounted on the lifting assembly (2-1), and the material storage box (2-5) is placed on the feeding platform (2-7) and fed through the feeding conveyor assembly (2-8). 2-8) The material is transferred to the material storage box (2-5) retrieval position, and then the material storage box (2-5) is transferred to the feeding position of the material input first material robot feeding system (17) through the lifting component (2-1), the forward and backward moving component (2-2), and the gripping component (2-4). The material is then sent from the material storage box (2-5) to the first material robot feeding system (17) through the pushing component (2-3). After the material in the material storage box (2-5) is completely transferred, the material storage box (2-5) is transferred to the discharge box placement position of the discharge platform (2-6) through the lifting component (2-1), the forward and backward moving component (2-2), and the gripping component (2-4).

3. The wafer mounter according to claim 1, characterized in that: The first material robot feeding system (17) includes a track adjustment component (17-6), and a conveying component (17-1), a waiting component (17-2), a material cover component (17-3), a material positioning component (17-4), and a material discharge waiting component (17-5) installed on the track adjustment component (17-6). When the material is transferred from the first robot loading system (2) into the conveying component (17-1), it is conveyed by the conveying component (17-1) to the waiting position of the waiting component (17-2) to wait, and then conveyed by the conveying component (17-1) to the material positioning component (17-4) for precise positioning. The material cover component (17-3) presses down the material dotting glue. After the dotting glue is completed, it is conveyed by the conveying component (17-1) to the waiting position of the material discharge waiting component (17-5) to wait for delivery to the second material robot feeding system (21).

4. The wafer mounter according to claim 3, characterized in that: The material pressing and supporting positioning mechanism (20) includes an adjustable fixing plate (20-1), a precision cylinder slide (20-2), and a three-layer adjustable material support plate (20-3). The three-layer adjustable material support plate (20-3) is installed on the precision cylinder slide (20-2), and the precision cylinder slide (20-2) is installed on the adjustable fixing plate (20-1). The material is pressed and fixed to the material cover assembly (17-3) fixing position by the up and down movement of the precision cylinder slide (20-2).

5. The wafer mounter according to claim 1, characterized in that: The first robotic arm (6) for applying adhesive dots includes a first left-right linear platform (6-1), a first front-back linear platform (6-2), and a first up-down linear module (6-3). The first up-down linear module (6-3) is mounted on the first front-back linear platform (6-2), and the first front-back linear platform (6-2) is mounted on the first left-right linear platform (6-1). The first left-right linear platform (6-1), the first front-back linear platform (6-2), and the first up-down linear module (6-3) can perform linear movements to complete the three-dimensional adhesive dotting function. The second robotic arm (7) for applying adhesive dots... It includes a second left and right linear platform (7-1), a second front and rear linear platform (7-2), and a second up and down linear module (7-3). The second up and down linear module (7-3) is installed on the second front and rear linear platform (7-2), and the second front and rear linear platform (7-2) is installed on the second left and right linear platform (7-1). The second left and right linear platform (7-1), the second front and rear linear platform (7-2), and the second up and down linear module (7-3) can perform linear motion to complete the dot-painting function in three-dimensional space.

6. The wafer placement machine according to claim 5, characterized in that: The dotting glue mechanism (5) includes a left and right straight platform (5-1) and an upper and lower straight platform (5-2). The left and right straight platforms (5-1) and the upper and lower straight platforms (5-2) are installed on the second upper and lower straight module (7-3). The relative positions of the two dotting glue heads in the X and Z directions are determined by corresponding straight adjustment.

7. The wafer mounter according to claim 1, characterized in that: The second material robot feeding system (21) includes a left and right linear platform (21-1), a front and rear linear platform (21-2), and a discharge conveying component (21-3). The front and rear linear platforms (21-2) and the discharge conveying component (21-3) are installed on the left and right linear platforms (21-1). The material is conveyed to the second material robot feeding system (21) by the first material robot feeding system (17). The material is conveyed to the positioning position in the adhesive fixture system (10) by the discharge conveying component (21-3) in the second material robot feeding system (21). The adhesive fixture system (10) fixes the material. The material to be bonded is then conveyed to the discharge position in the third packaging robot discharge system (4) by the discharge conveying component (21-3).

8. The wafer placement machine according to claim 1, characterized in that: The third turret manipulator (16) includes a high-precision ZR assembly (16-1) with a fixed suction nozzle, a turntable assembly (16-2), a high-precision DD motor (16-3), and a pneumatic-electric slip ring assembly (16-4). The high-precision ZR assembly (16-1) is mounted on the turntable assembly (16-2), the turntable assembly (16-2) is mounted on the high-precision DD motor (16-3), and the pneumatic-electric slip ring assembly (16-4) is mounted on the high-precision DD motor (16-3) to provide electricity and air to the high-precision ZR assembly (16-1) with the fixed suction nozzle.

9. The wafer mounter according to claim 1, characterized in that: The second robot loading system (3) includes a wafer stage lifting assembly (3-1), a wafer storage box (3-2), a wafer gripping and conveying assembly (3-3), a wafer gripper assembly (3-4), a forward and backward moving assembly (3-5), a left and right moving assembly (3-6), a film expansion and rotation correction assembly (3-7), and a vertical moving assembly (3-8). The wafer storage box (3-2) is stored on the wafer stage lifting assembly (3-1). The wafer gripper assembly (3-4) is mounted on the wafer gripping and conveying assembly (3-3). The film expansion and rotation correction assembly (3-7) is mounted on the left and right moving assembly (3-6). The left and right moving assembly (3-8) is mounted on the wafer stage lifting assembly (3-1). The wafer is mounted on the front and rear moving assembly (3-5), and the up and down moving assembly (3-8) is fixed on the front and rear moving assembly (3-5). The wafer storage box (3-2) is raised to the wafer gripping position by the wafer stage lifting assembly (3-1). The wafer gripping and conveying assembly (3-3) moves the wafer gripper assembly (3-4) to grip the wafer. The wafer is then conveyed to the film expansion and rotation correction assembly (3-7) for film expansion and fixation. The wafer is then moved to the nozzle by the left and right moving assembly (3-6) and the front and rear moving assembly (3-5) and accurately positioned and corrected by the third intelligent imaging system (12). Finally, the wafer is moved to the nozzle directly below by the up and down moving assembly (3-8).

10. The wafer mounter according to claim 1, characterized in that: The packaging third robot unloading system (4) includes an unloading platform (4-1), a lifting assembly (4-2), a forward and backward moving assembly (4-3), a blocking assembly (4-4), a feeding conveyor assembly (4-5), a feeding platform (4-6), a material storage box (4-7), and a gripping assembly (4-8). The lifting assembly (4-2) is mounted on the forward and backward moving assembly (4-3), the blocking assembly (4-4) is mounted on the feeding platform (4-6), the gripping assembly (4-8) is mounted on the lifting assembly (4-2), and the material storage box (4-7) is mounted on the feeding platform (4-5). The material is placed on the feeding platform (4-6) and conveyed to the material storage box (4-7) retrieval position through the feeding conveyor component (4-5). Then, the material storage box (4-7) is conveyed to the discharge position in the packaging third robot discharge system (4) through the lifting component (4-2), the forward and backward moving component (4-3), and the gripping component (4-8). When the material storage box (4-7) is full, the material storage box (4-7) is conveyed to the discharge box placement position of the discharge platform (4-1) through the lifting component (4-2), the forward and backward moving component (4-3), and the gripping component (4-8).

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