A miniature loudspeaker

Abstract

This invention discloses a miniature loudspeaker, comprising a frame, a first vibration assembly, a second vibration assembly, a magnetic circuit assembly, and a driving voice coil. A spider is mounted on the frame. The first vibration assembly includes a first diaphragm assembly and a first voice coil connected together, with the first diaphragm assembly connected to the top of the frame. The second vibration assembly includes a second diaphragm assembly and a second voice coil connected together, with the second diaphragm assembly connected to the bottom of the frame. The magnetic circuit assembly is connected to the spider. The driving voice coil is disposed within the frame and is used to drive the magnetic circuit assembly to vibrate. This miniature loudspeaker has a novel structure. The magnetic circuit assembly is movably mounted in the frame via the spider, and the driving voice coil applies an Ampere force to the magnetic circuit assembly, causing it to vibrate. The phase of this vibration is the same as that of the first / second voice coil, thus preventing the first / second voice coil from jumping out of the first / second magnetic gap due to excessive amplitude, which would cause distortion in the miniature loudspeaker.

Description

Technical Field

[0001] This invention relates to the field of electroacoustic converter technology, and in particular to a miniature loudspeaker. Background Technology

[0002] Currently, mobile devices such as smartphones and tablets enrich people's lives, and electroacoustic transducers play an indispensable role as audio devices. At the same time, consumers' demands for sound loudness are increasing, and correspondingly, designers are placing higher demands on the performance of electroacoustic transducers such as miniature speakers. Miniature speakers capable of bifacial vibration have emerged as a result. However, when bifacial speakers vibrate at low frequencies and large amplitudes, the voice coil is prone to jumping out of the magnetic gap in the magnetic circuit assembly. In other words, existing bifacial miniature speakers have a significant risk of distortion under low-frequency, large-amplitude operating conditions. Summary of the Invention

[0003] The technical problem solved by this invention is to provide a miniature loudspeaker with low distortion risk.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a miniature loudspeaker, comprising:

[0005] The basin stand is equipped with a spring.

[0006] A first vibration assembly, comprising a first diaphragm assembly and a first voice coil connected together, the first diaphragm assembly being connected to the top of the frame;

[0007] The second vibration assembly includes a connected second diaphragm assembly and a second voice coil, the second diaphragm assembly being connected to the bottom of the frame;

[0008] A magnetic circuit assembly connected to the spider, the top of the magnetic circuit assembly having a first magnetic gap for the first voice coil to move, and the bottom of the magnetic circuit assembly having a second magnetic gap for the second voice coil to move;

[0009] A driving voice coil is disposed within the frame and is used to drive the magnetic circuit assembly to vibrate.

[0010] The beneficial effects of this invention are as follows: This miniature loudspeaker has a novel structure. The magnetic circuit assembly is movably mounted in the frame via a spring, and an Ampere force is applied to the magnetic circuit assembly by driving the voice coil, causing the magnetic circuit assembly to vibrate. The phase of the vibration generated is the same as that of the first voice coil / second voice coil, thereby preventing the first voice coil / second voice coil from jumping out of the first magnetic gap / second magnetic gap due to excessive amplitude, which would cause distortion in the miniature loudspeaker. At the same time, since the vibration phase of the first voice coil / second voice coil is the same as that of the magnetic circuit assembly, the amplitude of the first voice coil / second voice coil will increase due to the action of the magnetic circuit assembly, thereby increasing the loudness of the miniature loudspeaker and improving its acoustic performance. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 This is a cross-sectional view of the miniature loudspeaker according to Embodiment 1 of the present invention;

[0013] Figure 2 This is a schematic diagram of the magnetic circuit assembly in the miniature loudspeaker according to Embodiment 1 of the present invention;

[0014] Figure 3 This is a schematic diagram of the structure of the spider in the miniature loudspeaker according to Embodiment 1 of the present invention.

[0015] Explanation of icon numbers:

[0016] 11. First support; 12. Second support;

[0017] 21. First diaphragm assembly; 22. First voice coil;

[0018] 31. Second diaphragm assembly; 32. Second voice coil;

[0019] 41. Yoke; 411. First flange; 42. First center magnet; 43. First side magnet; 44. First center washer; 45. First side washer; 46. Second center magnet; 47. Second side magnet; 48. Second center washer; 49. Second side washer;

[0020] 5. Drive the voice coil;

[0021] 6. Spindle; 61. Cantilever; 62. First mounting part; 63. Second mounting part; 64. Solder pad. Detailed Implementation

[0022] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0026] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Example 1

[0029] Please refer to Figures 1 to 3 One embodiment of the present invention is a miniature speaker that can be used in electronic devices such as mobile phones, smartwatches, tablets, and laptops.

[0030] The miniature loudspeaker includes a frame, a first vibration assembly, a second vibration assembly, a magnetic circuit assembly, and a driving voice coil 5. A spider 6 is mounted on the frame. The first vibration assembly includes a first diaphragm assembly 21 and a first voice coil 22 connected together, with the first diaphragm assembly 21 connected to the top of the frame. The second vibration assembly includes a second diaphragm assembly 31 and a second voice coil 32 connected together, with the second diaphragm assembly 31 connected to the bottom of the frame. The magnetic circuit assembly is connected to the spider 6. The top of the magnetic circuit assembly has a first magnetic gap for the first voice coil 22 to move, and the bottom of the magnetic circuit assembly has a second magnetic gap for the second voice coil 32 to move. The driving voice coil 5 is disposed within the frame and is used to drive the magnetic circuit assembly to vibrate.

[0031] In some embodiments, the material of the spider 6 can be plastic, flexible circuit board, etc., but to ensure the structural stability of the miniature speaker, the material of the spider 6 is preferably metal. Specifically, the spider 6 includes a cantilever 61 and a first mounting portion 62 and a second mounting portion 63 respectively connecting the cantilever 61. The first mounting portion 62 is connected to the magnetic circuit assembly, and the second mounting portion 63 is connected to the frame. At least a portion of the second mounting portion 63 is connected to a solder pad 64, and the solder pad 64 is at least partially exposed on the frame to form a soldering surface. The first voice coil 22 is electrically connected to the spider 6.

[0032] In this embodiment, the speaker frame includes a first support 11 and a second support 12 connected to each other. The first support 11 and the second support 12 are each in the shape of a ring frame. The first diaphragm assembly 21 is connected to the top of the first support 11, and the second diaphragm assembly 31 is connected to the bottom of the second support 12. The spring wave 6 is connected to the first support 11, and the welding surface is formed at the interface between the first support 11 and the second support 12. Optionally, the corner of the first support 11 protrudes relative to the corner of the second support 12 to form a protrusion, and the welding surface is located on the outer surface of the protrusion. This arrangement can effectively reduce the space occupied by the speaker frame, thereby ensuring that the miniature speaker can maintain its miniaturization.

[0033] The spring wave 6 is L-shaped and connects to both adjacent sides of the magnetic circuit assembly. This allows for a more balanced force distribution on the magnetic circuit assembly, resulting in a more stable vibration process. In this embodiment, there are two spring waves 6, each with two pads 64. The suspended end of the cantilever 61 and the two pads 64 are fixed to the first bracket 11, with the two pads 64 corresponding to the two corners of the first bracket 11.

[0034] Optionally, the connection between the spring wave 6 and the magnetic circuit assembly is located on the top surface of the magnetic circuit assembly, that is, the first mounting part 62 is located on the top surface of the magnetic circuit assembly. Of course, the connection between the spring wave 6 and the magnetic circuit assembly can also be located on the outer peripheral wall of the magnetic circuit assembly, which can be set according to actual needs.

[0035] In detail, the magnetic circuit assembly includes a yoke 41, a first central magnetic structure, a first side magnetic structure, a second central magnetic structure, and a second side magnetic structure. The first central magnetic structure and the first side magnetic structure are respectively disposed on the top surface of the yoke 41. The first side magnetic structure is arranged around the first central magnetic structure, and a first magnetic gap is formed between the first central magnetic structure and the first side magnetic structure. The spring wave 6 connects to the first side magnetic structure. The second central magnetic structure and the second side magnetic structure are respectively disposed on the bottom surface of the yoke 41. The second side magnetic structure is arranged around the second central magnetic structure, and a second magnetic gap is formed between the second central magnetic structure and the second side magnetic structure. The first central magnetic structure includes a first central magnet 42, the first side magnetic structure includes a first side magnet 43, the second central magnetic structure includes a second central magnet 46, and the second side magnetic structure includes a second side magnet 47.

[0036] To improve the performance of the miniature loudspeaker, the first central magnetic structure further includes a first central washer 44, with the top surface of the first central magnet 42 connected to the first central washer 44; the first side magnetic structure further includes a first side washer 45, with the top surface of the first side magnet 43 connected to the first side washer 45, preferably the first side washer 45 is in the shape of a ring frame, and the spring 6 is connected to the first side washer 45, more specifically, the bottom surface of the first mounting part 62 is connected to the top surface of the first side washer 45; the second central magnetic structure further includes a second central washer 48, with the bottom surface of the second central magnet 46 connected to the top surface of the second central washer 48; the second side magnetic structure further includes a second side washer 49, with the bottom surface of the second side magnet 47 connected to the top surface of the second side washer 49.

[0037] The driving voice coil 5 is disposed inside the second bracket 12, and the driving voice coil 5 is located below the yoke 41. The second side magnetic structure is disposed corresponding to the hollow area of ​​the driving voice coil 5.

[0038] To improve the structural stability of the magnetic circuit assembly, optionally, the yoke 41 is connected to the first side washer 45. In this embodiment, the yoke 41 has a first flange 411, which is formed by bending a portion of the yoke 41 upwards. There are multiple first flanges 411. The first flanges 411 are welded, bonded, or snapped to the first side washer 45. Specifically, the four corners of the yoke 41 are respectively provided with the first flange 411. Similarly, the yoke 41 may also have a second flange for connecting the second side washer 49. In this case, the yoke 41 has a window, and the second flange connects to one side wall of the window.

[0039] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A micro speaker, characterized by: The application relates to a loudspeaker. A pot frame is provided with a spring; A first vibration assembly comprises a first diaphragm assembly and a first voice coil connected to each other, and the first diaphragm assembly is connected to the top of the pot frame; A second vibration assembly comprises a second diaphragm assembly and a second voice coil connected to each other, and the second diaphragm assembly is connected to the bottom of the pot frame; A magnetic circuit assembly is connected to the spring, and the top of the magnetic circuit assembly is provided with a first magnetic gap for the first voice coil to move in, and the bottom of the magnetic circuit assembly is provided with a second magnetic gap for the second voice coil to move in; A drive voice coil is arranged in the pot frame, and the drive voice coil is used to drive the magnetic circuit assembly to vibrate; The first voice coil, the second voice coil and the magnetic circuit assembly have the same vibration phase.

2. The microspeaker of claim 1, wherein: The spring is made of metal.

3. The microspeaker of claim 2, wherein: The spring comprises a cantilever and a first mounting portion and a second mounting portion connected to the cantilever respectively, the first mounting portion is connected to the magnetic circuit assembly, the second mounting portion is connected to the pot frame, at least part of the second mounting portion is connected to a soldering pad, the soldering pad is at least partially exposed to the pot frame to form a soldering surface, and the first voice coil is electrically connected to the spring.

4. The microspeaker of claim 3, wherein: The pot frame comprises a first support and a second support connected to each other, the first support and the second support are in the form of ring frames respectively, the first diaphragm assembly is connected to the top of the first support, the second diaphragm assembly is connected to the bottom of the second support, and the soldering surface is formed at the interface between the first support and the second support.

5. The microspeaker of claim 1, wherein: The spring is in the form of L as a whole, and the spring is connected to two adjacent sides of the magnetic circuit assembly.

6. The microspeaker of claim 5, wherein: The connection between the spring and the magnetic circuit assembly is located on the top surface of the magnetic circuit assembly.

7. The microspeaker of claim 1, wherein: The magnetic circuit assembly comprises a yoke, a first central magnetic structure, a first side magnetic structure, a second central magnetic structure and a second side magnetic structure, the first central magnetic structure and the first side magnetic structure are arranged on the top surface of the yoke respectively, the first side magnetic structure surrounds the first central magnetic structure, the first central magnetic structure and the first side magnetic structure form the first magnetic gap, and the spring is connected to the first side magnetic structure; the second central magnetic structure and the second side magnetic structure are arranged on the bottom surface of the yoke respectively, the second side magnetic structure surrounds the second central magnetic structure, the second central magnetic structure and the second side magnetic structure form the second magnetic gap; the first central magnetic structure comprises a first central magnetic steel, the first side magnetic structure comprises a first side magnetic steel, the second central magnetic structure comprises a second central magnetic steel, and the second side magnetic structure comprises a second side magnetic steel.

8. The microspeaker of claim 7, wherein: The first central magnetic structure further comprises a first central Hua Si, and the top surface of the first central magnetic steel is connected to the first central Hua Si.

9. The microspeaker of claim 7, wherein: The first side magnetic structure further comprises a first side Hua Si, the top surface of the first side magnetic steel is connected to the first side Hua Si, and the spring is connected to the first side Hua Si.

10. The microspeaker of claim 7, wherein: The drive voice coil is located below the yoke, and the second side magnetic structure is arranged corresponding to the hollow area of the drive voice coil.

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