Display panel, manufacturing method thereof, display device and spliced display device

Abstract

A display panel (10) comprises a backplane (1), a plurality of light emitting devices (2), a plurality of connection leads (4), a first protective layer (7) and a reflective layer (8), the backplane (1) comprises a first main surface (1a) and a second main surface (1b) opposite to each other, and a plurality of side surfaces (1c) connecting the first main surface (1a) and the second main surface (1b), at least one side surface (1c) of the plurality of side surfaces (1c) is a selected side surface (1cc), the plurality of light emitting devices (2) are disposed on the second main surface (1b) of the backplane (1), the plurality of connection leads (4) are disposed on the first main surface (1a), the selected side surface (1cc) and the second main surface (1b), each connection lead (4) of the plurality of connection leads (4) passes through the selected side surface (1cc) and the second main surface (1b) in sequence from the first main surface (1a), the first protective layer (7) covers the plurality of connection leads (4), the reflective layer (8) at least comprises a first part (81), the first part (81) covers a part of the first protective layer (7) located on the selected side surface (1cc), and a material of the reflective layer (8) comprises metal.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel and its manufacturing method, a display device and a splicing display device. Background Technology

[0002] Miniature light-emitting diode (LED) chips, including Micro LED chips and Mini LED chips, are a new generation of display technology and are widely used in display devices that achieve seamless splicing. Mini / Micro LED display devices feature high contrast, long lifespan, and low power consumption.

[0003] Currently, there is a strong commercial demand for using a certain number of small-sized Mini / Micro LED display devices to display images on ultra-large Mini / Micro LED displays, particularly in high-end large screens. The size of the seam between the panels in a splicing display device is a crucial factor affecting its display effect; therefore, narrow-bezel display devices are becoming a development trend. Summary of the Invention

[0004] On one hand, a flexible circuit board is provided. The display panel includes: a back plate, a plurality of light-emitting devices, a plurality of connecting leads, a first protective layer, and a reflective layer. The back plate includes a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface; at least one of the plurality of side surfaces is a selected side surface. The plurality of light-emitting devices are disposed on the second main surface of the back plate. The plurality of connecting leads are disposed on the first main surface, the selected side surface, and the second main surface. Each of the plurality of connecting leads passes sequentially from the first main surface through the selected side surface and the second main surface. The first protective layer covers the plurality of connecting leads. The reflective layer includes at least a first portion that covers the portion of the first protective layer located on the selected side surface. The material of the reflective layer includes metal.

[0005] In some embodiments, the material of the reflective layer is a metal or metal alloy with a reflectivity greater than 80%.

[0006] In some embodiments, the material of the reflective layer includes any one of copper, molybdenum, titanium, silver, and gold.

[0007] In some embodiments, the thickness of the reflective layer ranges from 80 nm to 200 nm.

[0008] In some embodiments, the reflective layer further includes a second portion. The second portion is disposed on the side of the first protective layer located on the second main surface away from the backplate.

[0009] In some embodiments, the reflective layer further includes a third portion. The third portion is disposed on the side of the first protective layer located on the first main surface away from the backplate.

[0010] In some embodiments, the display panel further includes a second protective layer disposed on a second main surface of the back panel. The second protective layer covers the plurality of light-emitting devices and fills the gaps between the plurality of light-emitting devices. The second protective layer covers the portion of the first protective layer located on the second main surface.

[0011] In some embodiments, the boundary of the second protective layer on the side closest to the selected side surface is flush with or substantially flush with the plane of the reflective layer. If the reflective layer further includes a second portion, the second protective layer covers the portion of the reflective layer located on the second main surface.

[0012] In some embodiments, the selected side surface includes a first transition sub-surface, a second transition sub-surface, and a side surface. The side surface is perpendicular or substantially perpendicular to the first main surface and the second main surface, the first transition sub-surface connects the first main surface and the side surface, and the second transition sub-surface connects the second main surface and the side surface.

[0013] The reflective layer includes portions located on the first transition sub-surface, the side sub-surface, and the second transition sub-surface. The second protective layer covers the portion of the reflective layer located on the second transition sub-surface. The boundary of the second protective layer near the selected side surface is flush or substantially flush with the plane containing the portion of the reflective layer located on the side sub-surface.

[0014] In some embodiments, where the reflective layer further includes a second portion, the second protective layer is disposed on the side of the second portion of the reflective layer away from the backplate, and the boundary of the second protective layer on the side near the selected side surface is located on the second portion of the reflective layer.

[0015] In some embodiments, the distance between the boundary of the second protective layer on the side closest to the selected side surface and the plane containing the first portion of the reflective layer ranges from 20 μm to 30 μm.

[0016] In some embodiments, the surface of the second protective layer that is away from the second main surface is substantially parallel to the second main surface.

[0017] In some embodiments, the display panel further includes a third protective layer. The third protective layer at least covers a first portion of the reflective layer.

[0018] If the reflective layer further includes a second portion and / or a third portion, the third protective layer also covers the second portion and / or the third portion. The third protective layer also covers the portion of the first protective layer located on the first main surface.

[0019] In some embodiments, where the display panel further includes a second protective layer, the third protective layer also covers the surface of the second protective layer near one end of the selected side surface.

[0020] In some embodiments, the material of the third protective layer includes a fluorinated agent.

[0021] In some embodiments, the thickness of the third protective layer ranges from 3 μm to 5 μm.

[0022] On the other hand, a display device is provided. The display device includes a display panel and a driving circuit board as described in any of the above embodiments. The driving circuit board is disposed on a first main surface of the back panel of the display panel, and the driving circuit board is electrically connected to a plurality of light-emitting devices of the display panel via a plurality of connecting leads of the display panel.

[0023] In another aspect, a splicing display device is provided. The splicing display device includes multiple display devices as described above. The multiple display devices are spliced ​​and assembled.

[0024] Furthermore, a method for manufacturing a display panel is provided. The method for manufacturing the display panel includes:

[0025] A backplate is provided; the backplate includes opposing first and second main surfaces, and a plurality of side surfaces connecting the first and second main surfaces. At least one of the plurality of side surfaces is a selected side surface.

[0026] Multiple connecting leads are formed on the first main surface, the selected side surface, and the second main surface; each of the multiple connecting leads passes sequentially from the first main surface through the selected side surface and the second main surface.

[0027] A first protective layer is formed, which covers the plurality of connecting leads.

[0028] A reflective layer is formed, the reflective layer comprising at least a first portion that covers a portion of the first protective layer located on the selected side surface.

[0029] Multiple light-emitting devices are disposed on the second main surface.

[0030] In some embodiments, forming the reflective layer includes sputtering a metallic material onto at least a portion of the first protective layer located on the selected side surface away from the backplate to form the reflective layer.

[0031] In some embodiments, the reflective layer further includes a second portion located on one side of the second main surface. Forming the reflective layer includes sputtering a metallic material onto the portion of the first protective layer located on the selected side surface and the second main surface, away from the backplate, to form the reflective layer.

[0032] or,

[0033] The reflective layer further includes a third portion located on one side of the first main surface. Forming the reflective layer includes sputtering metallic material onto the portion of the first protective layer located on the selected side surface and the first main surface, away from the backplate, to form the reflective layer.

[0034] In some embodiments, the method for manufacturing the display panel further includes: forming a second protective layer after disposing of a plurality of light-emitting devices on the second main surface.

[0035] The formation of the second protective layer includes: attaching a second protective layer film material to the second main surface.

[0036] A pressing process is used to press the back plate and the second protective layer film together, so that the plurality of light-emitting devices are embedded in the second protective layer film, and the second protective layer film fills the gap area between the plurality of light-emitting devices, and covers the plurality of light-emitting devices.

[0037] The second protective layer film is cut along the cutting position on the second protective layer film using a laser cutting process to form a second protective layer that matches the size of the back plate.

[0038] Wherein, the cutting position is parallel to the boundary edge between the second main surface and the selected side surface, and the cutting position is flush with the plane where the first part of the reflective layer is located; or, if the reflective layer further includes a second part, the cutting position is parallel to the boundary edge between the second main surface and the selected side surface, and the cutting position is located on the second part.

[0039] In some embodiments, the method for manufacturing a display panel further includes forming a third protective layer after forming the second protective layer.

[0040] The formation of the third protective layer includes: coating the side of the reflective layer away from the back plate, the first protective layer located on the side of the first main surface away from the back plate, and the surface of the second protective layer near the selected side surface with a fluorinated material to form the third protective layer. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0042] Figure 1 Structural diagrams of splicing display devices provided for some embodiments of the present invention;

[0043] Figure 2A Structural diagrams of a display panel provided for some embodiments of the present invention;

[0044] Figure 2B for Figure 2A A partial structural diagram of the provided display panel;

[0045] Figure 3 A cross-sectional structural diagram of a display panel provided for some embodiments of the present invention;

[0046] Figure 4 The cross-sectional structure diagram obtained along CC' is based on the partial structure diagram of the display panel provided in Figure 2.

[0047] Figure 5 Structural diagrams of multiple connecting leads of a display panel provided for some embodiments of the present invention;

[0048] Figure 6 Partial structural diagrams of a display panel provided for some embodiments of the present invention;

[0049] Figure 7 According to Figure 6 The provided cross-sectional structural diagram of the display panel along AA';

[0050] Figure 8 for Figure 7 A magnified view of region G1 in the image;

[0051] Figure 9 A structural diagram of the protective layer of a display panel provided for some embodiments of the present invention;

[0052] Figure 10 According to Figure 9 A cross-sectional view of a protective layer for the provided display panel;

[0053] Figure 11 for Figure 10 A magnified view of region G2 in the image;

[0054] Figure 12 A cross-sectional view of another protective layer for a display panel provided in some other embodiments of the present invention;

[0055] Figure 13 A cross-sectional view of a reflective layer of a display panel provided in other embodiments of the present invention;

[0056] Figure 14A A cross-sectional view of another reflective layer of a display panel provided in some other embodiments of the present invention;

[0057] Figure 14B According to Figure 14A A cross-sectional view of another protective layer for the provided display panel;

[0058] Figure 15 A cross-sectional view of yet another reflective layer of a display panel provided in some other embodiments of the present invention;

[0059] Figure 16A A cross-sectional view of yet another reflective layer of a display panel provided in some other embodiments of the present invention;

[0060] Figure 16B According to Figure 16A A cross-sectional view of another protective layer for the provided display panel;

[0061] Figure 17 A cross-sectional view of a protective layer for a display panel provided in some other embodiments of the present invention;

[0062] Figure 18 A cross-sectional view of another protective layer for a display panel provided in some further embodiments of the present invention;

[0063] Figure 19 A cross-sectional view of yet another protective layer for a display panel provided in some further embodiments of the present invention;

[0064] Figure 20 A cross-sectional view of yet another protective layer for a display panel provided in some further embodiments of the present invention;

[0065] Figure 21 A step diagram illustrating a method for manufacturing a display panel according to some embodiments of the present invention;

[0066] Figure 22A step diagram illustrating another method for manufacturing a display panel provided in some embodiments of the present invention;

[0067] Figure 23 A step diagram illustrating another method for manufacturing a display panel according to some embodiments of the present invention;

[0068] Figure 24 A flowchart illustrating a method for manufacturing a display panel according to some embodiments of the present invention;

[0069] Figure 25 Another flowchart illustrating a method for manufacturing a display panel according to some embodiments of the present invention;

[0070] Figure 26 Another flowchart illustrating a method for manufacturing a display panel provided in some embodiments of the present invention;

[0071] Figure 27 Another flowchart illustrating a method for manufacturing a display panel provided in some embodiments of the present invention;

[0072] Figure 28 Another flowchart illustrating a method for manufacturing a display panel provided in some embodiments of the present invention;

[0073] Figure 29 Another flowchart illustrating a method for manufacturing a display panel provided in some embodiments of the present invention;

[0074] Figure 30 This is another flowchart illustrating a method for manufacturing a display panel according to some embodiments of the present invention. Detailed Implementation

[0075] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0076] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0077] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0078] In describing some embodiments, the terms "connection" and "electrical connection" and their derivative expressions may be used. For example, the term "connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "electrical connection" may be used in describing some embodiments to indicate that two or more components have direct electrical contact. However, the term "electrical connection" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0079] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0080] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0081] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0082] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0083] Currently, to narrow the bezel of display devices and ensure electrical connection between conductive patterns on opposite surfaces of the display panel, side traces can be used. The inventors discovered that each lead in a side trace is an independent electrical path. Since each lead is composed of at least one layer of metal, after etching to form the leads, certain areas of the metal (such as the etched cross-section) are exposed. With prolonged contact with water and oxygen, the metal gradually corrodes, and the corrosion penetrates inwards from the exposed areas, leading to increased resistance and even breakage of the side traces. Typically, a protective layer is placed on the backplate side of multiple side traces away from the display panel, covering the traces to protect them from water and oxygen corrosion.

[0084] Furthermore, to protect the circuit structure of the display area located on the light-emitting side of the display panel, the display panel also includes a second protective layer disposed on the light-emitting side. This second protective layer can simultaneously protect the circuit structure and the light-emitting elements. Moreover, the color of this second protective layer can be dark, such as black, dark gray, or dark green, which can improve the contrast of the displayed image. To obtain a second protective layer that matches the size of the display panel, during the laser cutting process, the laser can easily cut into the protective layer on the side traces or even the side traces themselves, causing the side traces to be directly exposed to the air, making them susceptible to corrosion, and even causing short circuits or open circuits.

[0085] Some embodiments of the present invention provide a splicing display device 1000, such as... Figure 1 As shown, the splicing display device 1000 includes multiple small-sized display devices 100. These multiple display devices 100 are spliced ​​together. Because the bezel size of each display device 100 used for splicing is very small, for example, no more than half the distance between two adjacent pixels in each display device, the seam between two adjacent display devices 100 is difficult to detect with the naked eye at the viewing distance when actually viewed, thus presenting a better display effect.

[0086] like Figures 2A to 4 As shown, the display device 100 includes a display panel 10 and a driving circuit board 20. The display panel 10 includes a back plate 1, multiple connecting leads 4 and multiple light-emitting devices 2. The driving circuit board 20 is disposed on the first main surface 1a of the back plate 1 of the display panel 10. The driving circuit board 20 is electrically connected to the multiple light-emitting devices 2 of the display panel 10 through the multiple connecting leads 4 of the display panel 10.

[0087] In some embodiments, such as Figure 2A and Figure 2B As shown, the display panel 10 also includes a plurality of first electrodes 3 and a plurality of second electrodes 5. The plurality of first electrodes 3 are electrically connected to the plurality of connecting leads 4, and the plurality of second electrodes 5 are electrically connected to the plurality of connecting leads 4, respectively. The driving circuit board 20 is electrically connected to the plurality of second electrodes 5, so as to realize the electrical connection between the driving circuit board 20 and the plurality of light-emitting devices 2 through the electrical connection between the plurality of second electrodes 5 and the plurality of connecting leads 4. In some embodiments, the above-mentioned display device 100 is a Mini LED display device or a Micro LED display device.

[0088] In a splicing display device 1000 formed by splicing multiple display devices 100, the smaller the splicing seam between adjacent display devices 100, the better the image display effect of the splicing display device 1000. Mini LED display devices or Micro LED display devices adopt a side-wiring method, which can reduce the bezel width and splicing seam width of the display device 100. Therefore, encapsulating and protecting the side wiring of the display panel 10 in the display device 100 can improve the lifespan of the splicing display device 1000 for image display.

[0089] In some embodiments, the display device 100 is a Mini LED display device or a Micro LED display device.

[0090] like Figure 2AAs shown, in some embodiments, the display panel 10 includes: a display area AA (Active Area, also known as effective display area) and a peripheral area BB located on at least one side of the AA area.

[0091] In the aforementioned display panel 10, the display area AA is provided with multiple pixels P' and multiple signal lines. The multiple signal lines are electrically connected to the multiple pixels P'. For example, each pixel includes at least three sub-pixels P of different colors. The sub-pixels P of different colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel. The first color, the second color, and the third color are three primary colors (e.g., red, green, and blue).

[0092] like Figures 3-6 As shown, in some embodiments, the display panel 10 includes a backplate 1, a plurality of light-emitting devices 2, and a plurality of connecting leads 4.

[0093] Please see Figure 3 The backplate 1 includes a first main surface 1a and a second main surface 1b opposite to each other, and a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b, wherein at least one of the plurality of side surfaces 1c is a selected side surface 1cc. As shown in FIG2, the first main surface 1a and the second main surface 1b of the backplate 1 are, for example, rectangular in shape, and the backplate 1 includes four side surfaces 1c.

[0094] like Figure 3 and Figure 4 As shown, in some examples, the selected side surface 1cc includes a side sub-surface 1c1, a first transition sub-surface 1c2, and a second transition sub-surface 1c3. The side sub-surface 1c1 is perpendicular or substantially perpendicular to the first main surface 1a and the second main surface 1b; the first transition sub-surface 1c2 connects the first main surface 1a and the side surface 1c1; and the second transition sub-surface 1c3 connects the second main surface 1b and the side surface 1c1.

[0095] For example, the backplate 1 includes a substrate and a driving circuit layer disposed on one side of the substrate. The substrate material can be a rigid material such as glass, quartz, or plastic. The driving circuit layer includes, for example, a thin film transistor (TFT) or a micro-driving chip and the aforementioned multiple signal lines. The driving circuit layer is coupled to multiple light-emitting devices 2 and is configured to drive the multiple light-emitting devices 2 to emit light.

[0096] like Figure 3 As shown, the thickness d1 of the back plate 1 is 0.5mm to 1mm. For example, the thickness d1 of the back plate 1 is 0.5mm, 0.7mm, or 1mm.

[0097] like Figures 2A to 4As shown, multiple light-emitting devices 2 are disposed on the second main surface 1b of the backplate 1. These light-emitting devices 2 include, but are not limited to, organic light-emitting diodes (OLEDs), quantum dot light-emitting diodes (QLEDs), mini light-emitting diodes (Mini LEDs), and micro light-emitting diodes (Micro LEDs). Exemplarily, each subpixel P includes at least one light-emitting device 2.

[0098] like Figure 4 As shown, multiple connecting leads 4 are disposed on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b of the back plate. Each connecting lead 4 passes sequentially from the first main surface 1a through the selected side surface 1cc and the second main surface 1b; each connecting lead 4 includes a first portion 41 located on the first main surface 1a, a second portion 42 located on the selected side surface 1cc, and a third portion 43 located on the second main surface 1b.

[0099] The multiple connecting leads 4 are configured to connect the first main surface 1a and the second main surface 1b of the back panel. For example, the multiple light-emitting devices 2 are electrically connected to the driving circuit board 20 on the back of the display panel 10 through the multiple connecting leads 4, so that the driving circuit board 20 can provide electrical signals to control the multiple light-emitting devices 2 to emit light.

[0100] like Figure 5 As shown, in some embodiments, multiple connecting leads 4 are arranged parallel to each other and spaced apart, with each connecting lead 4 extending along its length direction Y. The width of each connecting lead 4 is not limited and depends on the dimensions of its electrical connection structure, and can be selected according to actual needs.

[0101] In some embodiments, such as Figures 6-8 As shown, Figure 7 According to Figure 6 The cross-sectional view of a partial area of ​​the display panel 10 obtained by the cross-sectional line AA' shows that each connecting lead 4 is a stacked structure including a main conductive pattern 4c, a first buffer conductive pattern 4a, and a second buffer conductive pattern 4b. The first buffer conductive pattern 4a, the main conductive pattern 4c, and the second buffer conductive pattern 4b are stacked sequentially, with the first buffer conductive pattern 4a closer to the back plate 1 than the main conductive pattern 4c. The adhesion between the first buffer conductive pattern 4a and the back plate 1 is greater than that between the main conductive pattern 4c and the back plate 1; the oxidation resistance of the second buffer conductive pattern 4b is better than that of the main conductive pattern 4c.

[0102] The first buffer conductive pattern 4a, the main conductive pattern 4c, and the second buffer conductive pattern 4b are all conductive. The main conductive pattern 4c has strong conductivity and low resistivity, and its material is, for example, copper (Cu). While ensuring strong conductivity and low signal loss for the multiple connecting leads 4, and achieving stable signal transmission, the first buffer conductive pattern 4a and the second buffer conductive pattern 4b are placed on both sides of the main conductive pattern 4c of each connecting lead 4. This enhances the adhesion between the multiple connecting leads 4 and the backplate 1, making it less likely for the multiple connecting leads 4 to detach. The second buffer conductive pattern 4b protects the main conductive pattern 4c, enhances the oxidation resistance of the multiple connecting leads 4, making them less susceptible to water and oxygen corrosion, and extending their service life.

[0103] In some examples, the material of the first buffer conductive pattern 4a is selected as a material with strong adhesion, such as a material with strong bonding force to glass, and the material of the second buffer conductive pattern 4b is selected as a material with strong oxidation resistance. Exemplarily, the material of the first buffer conductive pattern 4a includes any one of titanium (Ti), chromium (Ge), molybdenum (Mo), and molybdenum-niobium alloy (MoNb). The material of the second buffer conductive pattern 4c includes any one of titanium (Ti), chromium (Ge), molybdenum (Mo), and molybdenum-niobium alloy (MoNb). For example, the material of the first buffer conductive pattern 4a is the same as the material of the second buffer conductive pattern 4c, and the materials of the first buffer conductive pattern 4a and the second buffer conductive pattern 4c are Ti, Ge, Mo, or MoNb.

[0104] It is understandable that the first buffer conductive pattern 4a and the second buffer conductive pattern 4c can also be a mixture of Ti and Ge, or a mixture of Ti, Ge and Mo, etc.

[0105] In some examples, the first buffer conductive pattern 4a and the second buffer conductive pattern 4b are both elemental metals, such as Ti. In this case, a metal alloy, such as a titanium-copper alloy, is also provided between the first buffer conductive pattern 4a and the main conductive pattern 4c, and between the second buffer conductive pattern 4b and the main conductive pattern 4c, to increase the adhesion between the material layers of the connecting leads. For example, the materials of the first buffer conductive pattern 4a and the second buffer conductive pattern 4b are Ti, and the material of the main conductive pattern 4c is Cu. A TiCu alloy is provided between the first buffer conductive pattern 4a and the main conductive pattern 4c, and between the second buffer conductive pattern 4b and the main conductive pattern 4c. Each connecting lead 4 is a stacked structure comprising five film layers.

[0106] In some examples, such as Figure 8 As shown, the thickness d2 of the main conductive pattern 4c is 0.4μm to 1μm, for example, 0.4μm, 0.6μm or 1μm; the thickness d3 of the first buffer conductive pattern 4a is 30nm to 70nm, for example, 30nm, 50nm or 70nm; and the thickness d4 of the second buffer conductive pattern 4b is 50nm to 120nm, for example, 50nm, 80nm or 120nm.

[0107] In some embodiments, the multiple connecting leads 4 are fabricated by depositing metal layers on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b of the backplate 1, sequentially forming a first buffer conductive layer, a main conductive layer, and a second buffer conductive layer, and then patterning each film layer by an etching process to obtain multiple connecting leads 4. The etching process can be, for example, wet etching or laser etching.

[0108] Thus, as Figure 7 and Figure 8 As shown, after the etching process is completed, the main conductive pattern 4c is exposed on both sides of the width direction X of each connecting lead 4 (see [reference]). Figure 7 and Figure 8 (The structure within the dashed box). Because the first buffer conductive pattern 4a and the second buffer conductive pattern 4b are much thinner than the main conductive pattern 4c, when patterning the stacked structure of the first buffer conductive layer, the main conductive layer, and the second buffer conductive layer using an etching process, both the first buffer conductive pattern 4a and the second buffer conductive layer 4b of the formed multiple connecting leads 4 will be over-etched, with the over-etching of the second buffer conductive layer 4b being more severe. At the same time, the main conductive layer is relatively thick, resulting in a large exposed surface area on both sides of the width direction X of each connecting lead 4. The main conductive pattern 4c is more noticeably exposed. Please refer to [link to relevant documentation]. Figure 7 and Figure 8 The exposed surface of the main conductive pattern 4c within the dashed box indicated by the arrow. Without the protection of the second buffer conductive pattern 4b, the exposed main conductive pattern 4c will gradually corrode under prolonged contact with water and oxygen. The corroded area will gradually penetrate inwards from the exposed location, leading to increased resistance in the connecting leads and even breakage.

[0109] It is understandable that, since each connecting lead 4 is a sandwich structure in which the first buffer conductive pattern 4a, the main pad pattern 4c, and the second buffer conductive pattern 4c are stacked in sequence, the main conductive pattern 4c will also be exposed on both sides of each connecting lead 4 along its length direction Y. The two sides of the main conductive pattern 4c along its length direction Y are flush with the two sides of the first buffer conductive pattern and the second buffer conductive pattern along its length direction Y.

[0110] It should be noted that the width direction X of each connecting lead 4 is perpendicular to its length direction Y, that is, perpendicular to the extension direction of the connecting lead 4, and the width direction X of each connecting lead 4 is parallel to the plane of the surface of the back plate 1 on which the connecting lead 4 is located. For example, the width direction X of the portion of each connecting lead 4 located on the selected side surface 1cc is perpendicular to the length direction Y of the portion of the selected side surface 1cc, and parallel to the plane of the selected side surface 1cc. The width direction X of the portion of each connecting lead 4 located on the first main surface 1a is perpendicular to the length direction Y of the portion of the connecting lead 4 located on the second main surface 1b, and parallel to the plane of the first main surface 1a. The width direction X of the portion of each connecting lead 4 located on the second main surface 1b is perpendicular to the length direction Y of the portion of the connecting lead 4 located on the second main surface 1b, and parallel to the plane of the second main surface 1b.

[0111] Based on this, such as Figures 9-11 As shown, in some embodiments, the display panel 10 further includes a first protective layer 7, which covers the plurality of connecting leads 4. The first protective layer 7 is disposed on the side of the plurality of connecting leads 4 away from the back panel 1 to isolate the main conductive pattern 4c from the outside. Thus, the first protective layer 7 can not only protect the main conductive pattern 4c exposed on both sides of the width direction X of the plurality of connecting leads 4, but also cover the entire plurality of connecting leads 4, avoiding the multiple connecting leads 4 being carried on the back, and extending the service life of the display panel.

[0112] The first protective layer 7 is made of a material with high oxidation resistance, capable of blocking external water and oxygen to prevent corrosion of the main conductive pattern 4c. For example, the material of the first protective layer 7 includes OC (Over Cover) adhesive or dark ink material. OC adhesive includes black and white adhesive. For example, the first protective layer 7 is a black adhesive layer. The dark ink material has high hardness and good corrosion resistance, capable of covering the exposed main conductive pattern 4c on both sides of the width direction X of multiple connecting leads 4, thereby better protecting the connecting leads 4.

[0113] In some embodiments, such as Figure 10 and Figure 11As shown, the thickness d5 of the portion of the first protective layer 7 disposed on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b ranges from 5 μm to 8 μm. For example, the thickness d5 of the portion of the first protective layer 7 disposed on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b can be 5 μm to 8 μm; for example, the thickness of the first protective layer 7 can be 5 μm, 7 μm, or 8 μm. This ensures the adhesion between the first protective layer 7 and the connecting leads 4, and also ensures the protective effect of the first protective layer 7 on multiple connecting leads 4.

[0114] The thickness of the portion of the first protective layer 7 disposed on the first main surface 1a and the second main surface 1b is the dimension of the first protective layer 7 in the direction perpendicular to the plane of the back plate 1, and the thickness of the portion of the first protective layer 7 disposed on the selected side surface 1cc is the dimension of the first protective layer 7 in the direction parallel to the plane of the back plate 1.

[0115] In some embodiments, such as Figure 2A and Figure 2B As shown, the display panel 10 also includes a plurality of first electrodes 5 and a plurality of second electrodes 3. The plurality of first electrodes 5 are disposed on a first main surface 1a of the back panel, and each first electrode 5 is electrically connected to a portion of a connecting lead 4 located on the first main surface 1a. Each first electrode 5 is also electrically connected to a drive circuit board 20, which controls the signal transmission of the corresponding connecting lead 4.

[0116] Multiple second electrodes 3 are disposed on the second main surface 1b of the back plate 1, and each second electrode 3 is electrically connected to the portion of the connecting lead 4 located on the second main surface 1b. Each second electrode 3 is also electrically connected to each light-emitting element 2, outputting the signal transmitted by the connecting lead 4 to the corresponding light-emitting element 2 to achieve image display.

[0117] In some embodiments, such as Figure 2A , Figures 12-23 As shown, the display panel 10 also includes a baffle 6. This baffle 6 is disposed in the peripheral area BB of the back panel 1 and in the gap area between the plurality of light-emitting devices 2 and the plurality of second electrodes 3. For example, as... Figure 2A As shown, the barrier 6 can be set around the display area AA, for example, around the display area AA, or the barrier 6 can be set only on the side of the peripheral area BB near the selected side surface 1cc.

[0118] The barrier 6 is manufactured before the multiple connecting leads 4, so that during the manufacturing process of the multiple connecting leads 4, for example, by using a sputtering process to sputter the material of the multiple connecting leads 4, the barrier 6 can prevent the material of the multiple connecting leads 4 from sputtering onto the display area AA of the display panel 10, thus preventing it from affecting the manufacturing accuracy of the components in the display area AA.

[0119] In some examples, the thickness of the barrier 6 is greater than the thickness of the portion of the multiple connecting leads 4 located on the second main surface 1b, but less than the total thickness of the multiple connecting leads 4 and the stacked film layers disposed on its surface. For example, the thickness of the barrier 6 ranges from 3 μm to 10 μm, such as 7 μm or 10 μm.

[0120] In some examples, the material of the barrier 6 is not limited, as long as it can prevent the material of the multiple connecting leads 4 from splashing onto the display area AA. For example, the barrier 6 is made of an elastic material, such as a resin material or a combination of resin material and metal film material.

[0121] In some embodiments, such as Figure 12 As shown, the display panel 10 also includes a second protective layer 30. The second protective layer 30 is disposed on the second main surface 1b of the back panel 1, covering the plurality of light-emitting devices 2 and filling the gap area between the plurality of light-emitting devices 2.

[0122] In some embodiments, the second protective layer 30 further covers the plurality of second electrodes 3 and fills the gap region between the plurality of second electrodes 3. The second protective layer 30 also covers the portion of the first protective layer 7 located on the second main surface 1b, thereby further protecting the circuit structure, such as protecting the plurality of light-emitting devices 2 and preventing subsequent processes from causing impact damage to the light-emitting devices.

[0123] In some examples, the material of the second protective layer 30 has high light transmittance and is dark in color. For example, the material of the second protective layer 30 can be black silicone or black resin. This protects multiple light-emitting devices 2 while ensuring the light emission efficiency of multiple light-emitting devices 2, and can prevent the problem of reduced screen contrast caused by the reflection of external ambient light after it shines on the metal material pattern in the display panel, thereby improving the contrast.

[0124] In some embodiments, a second protective layer film can be formed on the second main surface 1b of the back panel 1 by attaching a material for the second protective layer 30, such as black adhesive material, and then pressing the second protective layer film together. At this time, the area of ​​the second protective layer film is larger than the area of ​​the second main surface 1b of the back panel 1. Then, the second protective layer film is cut using a laser process. For example, a gas laser can be used for cutting, such as an infrared laser generated by a CO2 laser, to cut the second protective layer film to form a second protective layer 30 that matches the size of the back panel.

[0125] In the above cutting steps, cutting needs to be performed along a preset cutting line, such as the cutting position R on the second protective layer film. This is necessary to ensure the splicing effect when multiple display devices are assembled together, and to avoid damage to other film layers of the display devices during laser cutting.

[0126] For example, if the cutting position R on the second protective layer film is minimized to avoid overlapping with the film structure on the back panel, for example, if the cutting position R extends beyond the plane of the outermost film structure (e.g., the first protective layer 7) on the selected side surface of the back panel by a certain distance, such as 35μm to 70μm, the edge of the second protective layer 30 formed in this way extends beyond the edge of the display panel 100. When multiple display devices 100 are subsequently spliced ​​and assembled to form a spliced ​​display device 1000, if two adjacent second protective layers 30 have a direct contact portion, the second protective layers 30 of the corresponding two display devices 100 will have wrinkled edges at the splicing seam; if there is a gap between two adjacent second protective layers 30, the splicing seam between the corresponding two display devices 100 will have a recessed void area. In either case, the flatness of the entire spliced ​​display device will decrease, affecting the yield of the spliced ​​display device.

[0127] If the cutting position R on the second protective layer film is flush with the portion of the first protective layer 7 located on the selected side surface 1cc, during the laser cutting process, if the laser energy is too high, it is easy to cut the first protective layer 7 on the selected side surface 1cc of the back plate 1, causing the first protective layer 7 to be damaged. This may expose the connecting lead 4 to the air and cause it to be corroded by water and oxygen; or it may directly cut the connecting lead 4, causing the circuit to be open.

[0128] Based on this, such as Figure 13 As shown, in some embodiments, the display panel 10 further includes a reflective layer 8. The reflective layer 8 includes at least a first portion 81 that covers a portion of the first protective layer 7 located on a selected side surface 1cc. See also... Figures 13-14B In the direction MM' perpendicular to the plane where the first main surface 1a of the back plate 1 is located, the boundary of the first part 81 of the reflective layer 8 coincides with the boundary of the selected side surface 1cc.

[0129] The reflective layer 8 is configured to reflect the laser during laser cutting, preventing the laser from damaging the film layer located inside the reflective layer, thereby protecting the multiple side traces 4.

[0130] In some embodiments, such as Figure 13 and Figure 14BAs shown, in the above laser cutting step, the cutting position R on the second protective layer film is flush with the plane where the first part 81 is located. In this way, when the laser irradiates the first part 81 of the reflective layer 8, the first part 81 can reflect the laser, avoiding damage to the film layer inside the reflective layer 8 by the laser energy. As a result, the boundary of the second protective layer 30 near the selected side surface 1cc is flush with or approximately flush with the plane where the first part 81 of the reflective layer 8 is located.

[0131] In some embodiments, please continue reading Figure 13 When the selected side surface includes a first transition sub-surface 1c2, a side sub-surface 1c1, and a second transition sub-surface 1c3, the reflective layer 8 includes a first portion 81 located on the first transition sub-surface 1c2, the side sub-surface 1c1, and the second transition sub-surface 1c3. A second protective layer 30 covers the portion of the reflective layer 8 located on the second transition sub-surface 1c3, and the boundary of the second protective layer 30 near the side surface 1c1 is flush or substantially flush with the plane containing the portion of the reflective layer 8 located on the side surface 1c1.

[0132] It should be explained that, since the first part 81 of the reflective layer 8 includes portions located on the first transition sub-surface 1c2, the side sub-surface 1c1, and the second transition sub-surface 1c3, and these three portions are not located in the same plane perpendicular to the first main surface 1b, the surface of the first part 81 is not completely flat. Therefore, the cutting position R on the second protective layer film being flush with the plane of the first part 81 of the reflective layer 8 means that the cutting position R' is tangent to the outer surface of the first part 81 and parallel to the direction perpendicular to the first main surface, so that the boundary of the second protective layer 30 near the selected side surface 1cc is flush with or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1.

[0133] In other embodiments, such as Figure 14A and Figure 14B As shown, the reflective layer 8 further includes a second portion 82. The second portion 82 is disposed on the side of the first protective layer 7 located on the second main surface 1b away from the back plate 1. The second protective layer 30 covers the portion of the reflective layer 8 located on the second main surface 1b.

[0134] In some examples, please refer to [link / reference]. Figure 14A In the case where the reflective layer 8 also includes a second part 82, in the above-mentioned laser cutting step, the cutting position R on the second protective layer film is located on the second part 82. In this way, when the laser irradiates the second part 82 of the reflective layer 8, the second part 82 can reflect the laser, avoiding damage to the film layer inside the reflective layer 8 by the laser energy. Thus, the boundary of the second protective layer 30 near the selected side surface 1cc is located on the second part 82 of the reflective layer 8.

[0135] For example, such as Figure 14A As shown, the distance between the boundary of the second protective layer 30 on the side closest to the selected side surface 1cc and the plane containing the first portion 81 of the reflective layer 8 is in the range of 20μm to 30μm. For example, the distance c1 between the boundary of the second protective layer 30 on the side closest to the selected side surface 1cc and the plane containing the first portion 91 of the reflective layer 9 is 20μm or 30μm. This allows the distance c1 between the boundary of the second protective layer 30 on the side closest to the selected side surface 1cc and the plane containing the first portion 91 of the reflective layer 9 to be set within a reasonable range. This prevents a depression from appearing at the splicing seam area between two adjacent display devices when multiple display devices 100 are subsequently spliced ​​and assembled, because the boundary of the second protective layer 30 is too far from the plane containing the side surface 1c1 (for example, the boundary of the second protective layer 30 is 60μm or 100μm from the plane containing the side surface 1c1).

[0136] In other examples, such as Figure 14B As shown, when the reflective layer 8 further includes a second portion 82, the boundary of the second protective layer 30 near the selected side surface 1cc is flush or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1.

[0137] In some other embodiments, such as Figures 15-16B As shown, the reflective layer 8 also includes a third portion 83. The third portion 83 is disposed on the side of the first protective layer 7 located on the first main surface 1a away from the back plate 1.

[0138] In some examples, such as Figure 15 As shown, the reflective layer 8 includes a first portion 81 and a third portion 83. During the laser cutting process to form the second protective layer 30, the laser irradiation direction can be from the first main surface 1a to the second main surface 1b, or from the second main surface 1b to the first main surface 1a. Thus, the boundary of the second protective layer 30 formed after cutting is flush or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1. In the laser cutting step, when the laser irradiation direction is from the first main surface 1a to the second main surface 1b, the third portion 81 of the reflective layer 8 can reflect laser light radiated to the first main surface 1a of the backplate when the energy is too high, preventing damage to the film layer located on the first main surface 1a by the laser, thereby further protecting the multiple side leads 4.

[0139] In other examples, such as Figure 16A and Figure 16BAs shown, the reflective layer 8 includes a first part 81, a second part 82, and a third part 83. During the process of forming the second protective layer 30 using a laser cutting process, the laser irradiation direction can be from the first main surface 1a to the second main surface 1b, or from the second main surface 1b to the first main surface 1a.

[0140] like Figure 16A As shown, when cutting along the direction from the first main surface 1a to the second main surface 1b, the boundary of the cut second protective layer 30 near the selected side surface 1cc is flush or approximately flush with the plane containing the portion of the reflective layer 8 located on the side sub-surface 1c1. (Continue reading...) Figure 16A and Figure 16B As shown, when the laser irradiates and cuts along the direction from the second main surface 1b to the first main surface 1a, the boundary of the second protective layer 30 formed after cutting is flush or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1; or, the boundary of the second protective layer 30 near the selected side surface 1cc is located on the second portion 82 of the reflective layer 8, and the distance between the second protective layer 30 and the plane of the first portion 81 of the reflective layer 8 is in the range of 20μm to 30μm.

[0141] The material of the aforementioned reflective layer 8 can be a material with high reflectivity, such as a metal. For example, the material of the reflective layer 8 is a metal or metal alloy with a reflectivity greater than 80%, in order to reflect the infrared laser irradiated on the reflective layer 8 and prevent the infrared laser from damaging the first protective layer 7, thus exposing the multiple connecting leads 4 located below the first protective layer 7 to the air.

[0142] In some examples, the material of reflective layer 8 includes any one of copper, molybdenum, titanium, silver, and gold. For example, the material of reflective layer 8 is copper. Or, the material of reflective layer 8 is titanium.

[0143] In some embodiments, the thickness of the reflective layer 8 ranges from 80 nm to 200 nm. For example, the thickness of the reflective layer 8 is 80 nm, 100 nm, or 120 nm. In this way, the reflective layer 8 can reflect more infrared laser energy, avoiding laser cutting to the first protective layer 7 and exposing multiple connecting leads 4, and without affecting the narrow bezel effect of the splicing display device.

[0144] Compared to existing technologies, some embodiments of this application provide a display panel 10 including a reflective layer 8. Thus, when the material layer of the second protective layer 30 is laser-cut, the reflective layer 8 can reflect the laser energy irradiated onto its surface, preventing damage to the first protective layer and side traces, protecting multiple side traces. Furthermore, due to the presence of the reflective layer 8, the cutting position R on the material layer of the second protective layer 30 can be as close as possible to the display panel 10, such that the boundary of the second protective layer 30 near the selected side surface 1cc is flush or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1, or the boundary of the second protective layer 30 near the selected side surface 1cc is located on the second main surface 1b. This reduces the outer dimension of the second protective layer 30 relative to the boundary of the display panel 10. Therefore, when assembling multiple display devices, it avoids problems such as reduced flatness caused by the boundary of the second protective layer 30 exceeding the boundary of the display panel 10 by too much, leading to issues like the boundary of two adjacent second protective layers 30 pressing against each other in the splicing seam area of ​​adjacent display devices, thus improving product yield.

[0145] In some embodiments, such as Figures 12-20 As shown, the surface of the second protective layer 30 that is away from the second main surface 1b is approximately parallel to the second main surface 1b, that is, the surface of the second protective layer 30 is flat.

[0146] For example, the thickness c2 of the second protective layer 30 ranges from 200μm to 400μm. It should be noted that the thickness of the light-emitting element 2 is less than the thickness of the second protective layer 30, for example, around 100μm to 200μm, or even less than 100μm, for example, 80μm or 50μm; and the total thickness of the connecting lead 4, the first protective layer 7, and the reflective layer 8 stacked sequentially is approximately no more than 20μm, that is, the total thickness of the connecting lead 4, the first protective layer 7, and the reflective layer 8 located on the second main surface 1b is approximately no more than 20μm. Therefore, when the second protective layer 30 is attached to the second main surface 1b, the thickness of each component disposed on the second main surface 1b does not affect the flatness of the surface of the second protective layer 30 away from the second main surface 1b.

[0147] In some embodiments, such as Figures 17-20 As shown, the display panel 10 also includes a third protective layer 9. The third protective layer 9 at least covers the first portion 81 of the reflective layer 8.

[0148] In some examples, such as Figure 17As shown, when the reflective layer 8 only includes the first portion 81, the third protective layer 9 is a continuous film layer covering the portion of the first protective layer 7 located on the first main surface 1a, the first portion 81 of the reflective layer 8, and the surface of the second protective layer 30 near one end of the selected side surface 1cc.

[0149] In other examples, such as Figure 18 As shown, when the reflective layer 8 includes a first portion 81 and a second portion 82, and the boundary of the second protective layer 30 near the selected side surface 1cc is located on the second portion 82 of the reflective layer 8, the third protective layer 9 also covers the second portion 82, so that the third protective layer 9 is a film layer that continuously covers the portion of the first protective layer 7 located on the first main surface 1a, a portion of the first portion 81 and the second portion 82 of the reflective layer 8, and the surface of the second protective layer 30 near the end of the selected side surface 1cc.

[0150] In some other examples, such as Figure 19 As shown, when the reflective layer 8 includes a first portion 81 and a third portion 83, and the boundary of the second protective layer 30 near the selected side surface 1cc is flush or substantially flush with the plane where the first portion 81 of the reflective layer 8 is located, the third protective layer 9 also covers the third portion 83. Thus, the third protective layer 9 is a film layer that continuously covers the portion of the first protective layer 7 located on the first main surface 1a, the first portion 81 and the third portion 83 of the reflective layer 8, and the surface of the second protective layer 30 near the end of the selected side surface 1cc.

[0151] In some other examples, such as Figure 20 As shown, when the reflective layer 8 includes a first portion 81, a second portion 82, and a third portion 83, and the boundary of the second protective layer 30 near the selected side surface 1cc is flush or substantially flush with the plane where the first portion 81 of the reflective layer 8 is located, the third protective layer 9 covers the first portion 81 and the third portion 83. Thus, the third protective layer 9 is a film layer that continuously covers the portion of the first protective layer 7 located on the first main surface 1a, the first portion 81 and the third portion 83 of the reflective layer 8, and the surface of the second protective layer 30 near the end of the selected side surface 1cc.

[0152] In other words, the third protective layer 9, as the outermost film layer of the display panel 10, can cover the surfaces of other film layers exposed to the air. In this way, it can further protect the side surfaces of the first protective layer, the reflective layer, and the second protective layer, avoid water and oxygen corrosion, and improve the service life of the display panel.

[0153] It is understandable that the cutting position R is related to whether the reflective layer 8 includes the second part 82. If the reflective layer 8 includes the second part 82, the boundary of the second protective layer 30 near the selected side surface 1cc can be flush with or approximately flush with the plane containing the first part 81 of the reflective layer 8. Alternatively, the boundary of the second protective layer 30 near the selected side surface 1cc can also be located on the second part 82 of the reflective layer 8. For example, the distance between this boundary and the plane containing the first part 81 of the reflective layer 8 can be in the range of 20μm to 30μm. Therefore, the coverage area of ​​the third protective layer 9 formed for different situations will also be different, which will not be elaborated further here.

[0154] In some embodiments, the thickness of the third protective layer 9 ranges from 3 μm to 5 μm. Exemplarily, the third protective layer 9 covers a portion of the first protective layer 7 located on the first main surface 1a, and the thickness of the first portion 81 (and the second portion 82) of the reflective layer 8 and the portion of the second protective layer 30 near the selected side surface 1cc is 3 μm or 5 μm. This prevents the adverse effects of pores caused by the inherent properties of the first protective layer 7 (which is an organic material) on the multiple connecting leads 4, and isolates the metallic reflective layer 8 from air contact, further reducing water and oxygen corrosion.

[0155] In some examples, the third protective layer 9 is made of a material with high hydrophobic properties, capable of blocking external water and oxygen, and preventing corrosion of the multiple connecting leads 4. For example, the material of the third protective layer 9 includes a fluoropolymer using hydrofluoroether as a solvent. For instance, the third protective layer 9 is a fluorinated layer.

[0156] It should be noted that after the fluorinated material is coated on the surface of the first protective layer and the reflective layer, the fluorinated material can quickly form a thin film at room temperature without the need for an additional curing process, making the manufacturing process simple.

[0157] Some embodiments of the present invention also provide a method for manufacturing the display panel 10, such as... Figures 21-27 As shown, the preparation method includes steps S1 to S7. Among them,

[0158] S1, such as Figure 21 As shown in (a), a backplate 1 is provided. The backplate 1 includes a first main surface 1a and a second main surface 1b opposite to each other, and a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b; at least one of the plurality of side surfaces 1c is a selected side surface 1cc.

[0159] S2, such as Figure 21 (b) and Figure 21As shown in (c), a plurality of connecting leads 4 are formed on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b. Each of the plurality of connecting leads 4 passes sequentially from the first main surface 1a through the selected side surface 1cc and the second main surface 1b. Each connecting lead 4 includes at least a main conductive pattern 4c.

[0160] For example, S2, forming multiple connecting leads 4 on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b, includes: S21 to S22, wherein,

[0161] S21, such as Figure 21 As shown in (b), a metal layer is formed on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b of the back plate.

[0162] For example, electroplating, vapor deposition, pad printing, sputtering (e.g., multi-arc magnetron sputtering) can be used to deposit a metal layer on the first main surface 1a, the selected side surface 1cc, and the second main surface 1b of the back plate 1.

[0163] In some embodiments, the metal layer includes a first buffer conductive layer, a main conductive layer, and a second buffer conductive layer. The first buffer conductive layer, the main conductive layer, and the second buffer conductive layer are deposited sequentially using the above-described process to obtain a stacked three-layer metal layer. The first buffer conductive layer is closer to the backplane 1 than the main conductive layer. For example, the thickness of the first buffer conductive layer is 30 nm to 70 nm, the thickness of the second buffer conductive layer is 50 nm to 120 nm, and the thickness of the main conductive layer ranges from 0.4 μm to 1 μm.

[0164] For example, the material of the first buffer conductive layer is the same as that of the second buffer conductive layer, and the material of the first buffer conductive layer includes any one of Ti, Ge, Mo, and Monb. The material of the second buffer conductive layer includes any one of Ti, Ge, Mo, and Monb. The material of the main conductive layer has strong conductivity; for example, the material of the main conductive layer is Cu.

[0165] S22, such as Figure 21 As shown in (c), a patterned metal layer is formed to obtain multiple connecting leads 4. Each of the multiple connecting leads 4 passes sequentially from the first main surface 1a of the backplate 1 through a selected side surface 1cc and a second main surface 1b.

[0166] In some examples, a high-precision laser etching process is used to pattern the metal layer to obtain multiple connecting leads 4. Thus, the etched interface of each connecting lead 4 exposes a main conductive pattern 4c, and each connecting lead 4 includes a first buffer conductive pattern 4a, a main conductive pattern 4c, and a second buffer conductive pattern 4b stacked sequentially.

[0167] S3. A first protective layer 7 is formed, which covers multiple connecting leads 4.

[0168] In some examples, such as Figure 21 As shown in (d), the first protective layer 7 is an OC (overcoating) adhesive or an ink layer. In some examples, the first protective layer 7 can be formed by spraying, deposition, or other methods.

[0169] For example, a deposition process is used to form the material of the first protective layer 7 on the side of the plurality of connecting leads 4 away from the back plate 1, and simultaneously on the gaps between the plurality of connecting leads 4 and on the surface of the back plate 1, thereby forming a continuous first protective layer 7 that covers the plurality of connecting leads 4 and a portion of the first main surface 1a, a selected side surface 1cc, and a portion of the second main surface 1b.

[0170] In some embodiments, the thickness of the portion of the first protective layer 7 formed on the first main surface 1a, the selected side surface 1c, and the second main surface 1b ranges from 5 μm to 8 μm.

[0171] S4. Form a reflective layer 8, which includes at least a first portion 81 that covers the portion of the first protective layer 7 located on a selected side surface 1cc.

[0172] In some embodiments, forming the reflective layer 8 includes sputtering metal material onto at least the portion of the first protective layer 7 located on a selected side surface 1cc away from the back plate 1 to form the reflective layer 8. By employing a sputtering process to form a continuous, full-surface reflective layer 8 covering the portion of the first protective layer 7 located on the selected side surface 1cc away from the back plate 1, during laser cutting, the laser irradiates the reflective layer 8 and is reflected, thus the reflective layer 8 can better protect the first protective layer 7 and the multiple connecting leads 4 located beneath it.

[0173] In some examples, such as Figure 21 As shown in (e), the reflective layer 8 includes a first portion 81 disposed on a selected side surface 1cc of the backplate 1. The selected side surface 1cc includes a side sub-surface 1c1 perpendicular or substantially perpendicular to the first main surface 1a and the second main surface 1b; a first transition sub-surface 1c2 connecting the first main surface 1a and the side surface 1c1; and a second transition sub-surface 1c3 connecting the second main surface 1b and the side surface 1c1. Thus, the first portion 81 of the reflective layer 8 includes portions located on the side surface 1c1, the first transition sub-surface 1c2, and the second transition sub-surface 1c3.

[0174] Forming the reflective layer 8 includes: S4-1, sputtering metal material on the side of the first protective layer 7 located on the side surface 1c1, the first transition surface 1c2 and the second transition surface 1c3 away from the back plate 1 to form the reflective layer 8.

[0175] In other examples, the reflective layer 8 further includes a second portion 82 disposed on one side 1b of the second main surface. For example... Figure 14A and Figure 14B As shown, the reflective layer 8 includes a first portion 81 and a second portion 82. The first portion 81 is disposed on the side of the first protective layer 7 located on the selected side surface 1cc, away from the backplate 1. The second portion 82 is disposed on the side of the first protective layer 7 located on the second main surface 1b, away from the backplate 1.

[0176] Forming the reflective layer 8 includes: S4-2, sputtering metal material on the side of the first protective layer 7 located on the selected side surface 1cc and the second main surface 1b away from the back plate 1 to form the reflective layer 8.

[0177] In some other examples, the reflective layer 8 also includes a third portion 83 located on one side of the first main surface 1a. For example... Figure 15 As shown, the reflective layer 8 includes a first part 81 and a third part 83.

[0178] Forming the reflective layer 8 includes: S4-3, sputtering metal material on the side of the first protective layer 7 located on the selected side surface 1cc and the first main surface 1a away from the back plate 1 to form the reflective layer 8.

[0179] Or, such as Figure 16A and Figure 16B As shown, the reflective layer 8 includes a first part 81, a second part 82, and a third part 83.

[0180] Forming the reflective layer 8 includes: S4-4, sputtering metal material on the side away from the backplate 1 of the portion of the first protective layer 7 located on the selected side surface 1cc, the portion located on the first main surface 1a, and the portion on the second main surface 1b to form the reflective layer 8.

[0181] S5. Multiple light-emitting devices 2 are disposed on the second main surface 1b.

[0182] In some embodiments, such as Figure 21 As shown in (f), the method for preparing the display panel 10 further includes: S6, forming a second protective layer 30, including: S61 to S63, wherein,

[0183] S61. A second protective layer film 30' is attached to the second main surface 1b. The second protective layer film 30' is an initial film layer formed from the material of the second protective layer 30.

[0184] S62, such as Figure 22 and Figure 23 As shown, a pressing process is used to press the back plate 1 and the second protective layer film together, so that multiple light-emitting devices 2 are embedded in the second protective layer film 30', and a portion of the second protective layer film 30' fills the gap area between the multiple light-emitting devices 2, and the second protective layer film 30' covers the multiple light-emitting devices 2.

[0185] In some embodiments, the types of the above-described pressing process include a variety.

[0186] For example, the above-described pressing process may include a vacuum pressing process.

[0187] like Figure 22 As shown, during the vacuum pressing process for pressing the backplate 1 and the second protective layer film 30' on which multiple light-emitting devices 2 are formed, a vacuum operation can be performed simultaneously while pressing the second protective layer film 30' as a whole. This allows the second protective layer film 30' to be close to the surface of the multiple light-emitting devices 2, making contact with them substantially simultaneously. This enables the multiple light-emitting devices 2 to extend into and embed into the interior of the second protective layer film 30' substantially simultaneously. Furthermore, it avoids the formation of air bubbles between the second protective layer film 30' and the backplate 1.

[0188] For example, the above pressing process may include a rolling process.

[0189] like Figure 23 As shown, during the rolling process of pressing the backplate 1 on which multiple light-emitting devices 2 are formed and the second protective layer film 30', one end of the backplate 1 on which multiple light-emitting devices 2 are formed (e.g., ...) can be pressed first. Figure 23 The right end shown), and one end of the second protective layer membrane 30' (e.g., the ...). Figure 23 The light-emitting device 2 at the right end (as shown in the diagram) is pressed together so that it is completely embedded inside the second protective layer film 30'. Then the pressing position is gradually moved towards the opposite end (e.g., the right end). Figure 23 The left end (as shown in the diagram) moves, causing multiple light-emitting devices 2 to be sequentially embedded into the interior of the second protective layer film 30' from one end of the back plate 1 to the opposite end, followed by a heating and degassing operation. This can reduce or even eliminate air bubbles that may appear between the second protective layer film 30' and the back plate 1.

[0190] S63. Using laser cutting technology, the second protective layer membrane 30' is cut along the cutting position RR on the second protective layer membrane 30' to form a second protective layer 30 that matches the size of the back plate 1.

[0191] For example, the cutting position R is parallel to the boundary edge between the second main surface 1b and the selected side surface 1cc, and the cutting position R is flush with the plane containing the first portion 81 of the reflective layer 8. Figure 13 As shown, in some examples, the reflective layer 8 only includes the first portion 81. The cutting position R is parallel to the plane where the reflective layer 8 is located on the side surface 1c1. Thus, during the laser cutting of the second protective layer film 30', since the first portion 81 of the reflective layer 8 includes portions located on the side surface 1c1, the first transition surface 1c2, and the second transition surface 1c3, the laser will not irradiate the first protective layer 7, and the reflective layer 8 located on the side surface 1c1 will reflect the laser energy away.

[0192] In other examples, as shown in Figure 14, when the reflective layer 8 also includes a second portion 82, the cutting position R is parallel to the boundary edge between the second main surface 1b and the selected side surface 1cc, and the cutting position R is located on the second portion 82. During the laser cutting of the second protective layer film 30', laser cutting is performed in the area where the second protective layer film 30' of the second portion 82 of the reflective layer 8 is located, and the distance c1 between the cutting position R and the plane where the first portion 81 of the reflective layer 8 is located ranges from 20μm to 30μm. Therefore, after multiple display panels 10 are spliced ​​together, the splicing seam between adjacent display panels 10 is small, and no subsequent film layer depressions occur, resulting in a better visual effect when the spliced ​​display device 1000 displays the image.

[0193] Alternatively, the boundary of the cut second protective layer 30 near the selected side surface 1cc is flush or approximately flush with the plane of the portion of the reflective layer 8 located on the side sub-surface 1c1.

[0194] In some other examples, such as Figure 15 and Figure 16A As shown, when the cutting position R is parallel to the boundary edge between the second main surface 1b and the selected side surface 1cc, and the cutting position R is flush with the plane where the first part 81 of the reflective layer 8 is located, and the reflective layer 8 also includes a third part 83, a laser cutting process is used to cut the second protective layer film 30' along the cutting position R on the second protective layer film 30'. The direction of the laser cutting is from the first main surface 1a to the second main surface 1b.

[0195] For example, such as Figure 15 As shown, the reflective layer 8 includes a first part 81 and a third part 83. The laser cutting direction is from the first main surface 1a to the second main surface 1b, and the cutting position R of the laser on the second protective layer film 30' is flush with the plane where the first part 81 of the reflective layer 8 is located.

[0196] For example, such as Figure 16A and Figure 16BAs shown, the reflective layer 8 includes a first portion 81, a second portion 82, and a third portion 83. The laser cutting direction is from the first main surface 1a to the second main surface 1b, and the cutting position R of the laser on the second protective layer film 30' is flush with the plane where the first portion 81 of the reflective layer 8 is located. Alternatively, the laser cutting direction is from the second main surface 1b to the first main surface 1a, and the cutting position R of the laser on the second protective layer film 30' is flush with the plane where the first portion 81 of the reflective layer 8 is located, or the distance between the boundary of the second protective layer 30 near the selected side surface 1cc and the plane where the side sub-surface 1 layer is located is within the range of 20μm to 30μm.

[0197] In some embodiments, such as Figure 21 As shown in (g), the method for manufacturing the display panel 10 further includes:

[0198] S7, Forming the third protective layer 9.

[0199] For example, forming the third protective layer 9 includes coating a fluorinated material on the side of the reflective layer 8 away from the back plate 1, the side of the first protective layer 7 located on the side of the first main surface 1a away from the back plate 1, and the surface of the second protective layer 1b near the selected side surface 1cc, to form the third protective layer 9.

[0200] In some examples, the third protective layer 9 is made of a material with high hydrophobic properties, capable of blocking external water and oxygen, and preventing water and oxygen corrosion of the multiple connecting leads 4. For example, the material of the third protective layer 9 includes a fluoropolymer using hydrofluoroether as a solvent.

[0201] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, characterized in that, include: A backplate, the backplate including opposing first and second main surfaces, and a plurality of side surfaces connecting the first and second main surfaces; At least one of the plurality of side surfaces is a selected side surface; Multiple light-emitting devices disposed on the second main surface of the back plate; Multiple connecting leads are disposed on the first main surface, the selected side surface, and the second main surface; each of the multiple connecting leads passes sequentially from the first main surface through the selected side surface and the second main surface; A retaining wall is located in the peripheral area of ​​the back plate and on the side of the plurality of light-emitting devices near the connecting leads; A first protective layer covers the plurality of connecting leads; A reflective layer comprising at least a first portion and a second portion, the first portion covering a portion of the first protective layer located on the selected side surface; the second portion being disposed on the side of the first protective layer located on the second main surface away from the back plate; The material of the reflective layer includes metal.

2. The display panel according to claim 1, characterized in that, The material of the reflective layer is a metal or metal alloy with a reflectivity greater than 80%.

3. The display panel according to claim 2, characterized in that, The material of the reflective layer includes any one of copper, molybdenum, titanium, silver, and gold.

4. The display panel according to claim 1, characterized in that, The thickness of the reflective layer ranges from 80nm to 200nm.

5. The display panel according to claim 1, characterized in that, The reflective layer also includes a third part; The third portion is disposed on the side of the first protective layer located on the first main surface away from the back plate.

6. The display panel according to claim 1, characterized in that, The display panel further includes a second protective layer disposed on the second main surface of the back panel; The second protective layer covers the plurality of light-emitting devices and fills the gap area between the plurality of light-emitting devices; The second protective layer covers the portion of the first protective layer located on the second main surface.

7. The display panel according to claim 6, characterized in that, The boundary of the second protective layer on the side closest to the selected side surface is flush with or approximately flush with the plane of the reflective layer. If the reflective layer further includes a second portion, the second protective layer covers the portion of the reflective layer located on the second main surface.

8. The display panel according to claim 7, characterized in that, The selected side surface includes a first transition sub-surface, a second transition sub-surface, and a side sub-surface; The side surface is perpendicular or substantially perpendicular to the first main surface and the second main surface; the first transition surface connects the first main surface and the side surface; and the second transition surface connects the second main surface and the side surface. The reflective layer includes portions located on the first transition sub-surface, the side sub-surface, and the second transition sub-surface; The second protective layer covers the portion of the reflective layer located on the second transition sub-surface; The boundary of the second protective layer on the side closest to the selected side surface is flush or substantially flush with the plane of the portion of the reflective layer located on the side sub-surface.

9. The display panel according to claim 6, characterized in that, In the case where the reflective layer also includes a second portion, The second protective layer is disposed on the side of the second portion of the reflective layer away from the back plate, and the boundary of the second protective layer on the side near the selected side surface is located on the second portion of the reflective layer.

10. The display panel according to claim 9, characterized in that, The distance between the boundary of the second protective layer on the side closest to the selected side surface and the plane containing the first part of the reflective layer ranges from 20μm to 30μm.

11. The display panel according to claim 6, characterized in that, The surface of the second protective layer that is away from the second main surface is approximately parallel to the second main surface.

12. The display panel according to claim 6, characterized in that, Also includes: The third protective layer; The third protective layer at least covers a first portion of the reflective layer; If the reflective layer further includes a second portion and / or a third portion, the third protective layer also covers the second portion and / or the third portion; The third protective layer also covers the portion of the first protective layer located on the first main surface.

13. The display panel according to claim 12, characterized in that, If the display panel also includes a second protective layer, the third protective layer further covers the surface of the second protective layer near one end of the selected side surface.

14. The display panel according to claim 12, characterized in that, The material of the third protective layer includes a fluorinated agent.

15. The display panel according to claim 12, characterized in that, The thickness of the third protective layer ranges from 3 μm to 5 μm.

16. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 15; and, A driving circuit board is disposed on the first main surface of the back panel of the display panel, and the driving circuit board is electrically connected to multiple light-emitting devices of the display panel through multiple connecting leads of the display panel.

17. A splicing display device, characterized in that, include: Multiple display devices as described in claim 16, wherein the multiple display devices are spliced ​​and assembled.

18. A method for manufacturing a display panel, characterized in that, include: Provide back panel; The back plate includes a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface; At least one of the plurality of side surfaces is a selected side surface; A barrier is formed in the peripheral area of ​​the back plate and on the side of the plurality of light-emitting devices near the connecting leads; Multiple connecting leads are formed on the first main surface, the selected side surface, and the second main surface; each of the multiple connecting leads passes sequentially from the first main surface through the selected side surface and the second main surface; a first protective layer is formed, which covers the multiple connecting leads; A reflective layer is formed, the reflective layer comprising at least a first portion and a second portion, the first portion covering a portion of the first protective layer located on the selected side surface; the second portion being disposed on the side of the first protective layer located on the second main surface away from the back plate; Multiple light-emitting devices are disposed on the second main surface.

19. The method for manufacturing a display panel according to claim 18, characterized in that, The formation of the reflective layer includes: Metallic material is sputtered onto at least a portion of the first protective layer located on the selected side surface, away from the backplate, to form the reflective layer.

20. The method for manufacturing a display panel according to claim 18 or 19, characterized in that, The formation of the reflective layer includes: Metallic material is sputtered onto the portion of the first protective layer located on the selected side surface and the second main surface away from the back plate to form the reflective layer; or, The reflective layer also includes a third portion located on one side of the first main surface; The formation of the reflective layer includes: Metallic material is sputtered onto the portion of the first protective layer located on the selected side surface and the first main surface away from the backplate to form the reflective layer.

21. The method for manufacturing a display panel according to claim 20, characterized in that, Also includes: After multiple light-emitting devices are disposed on the second main surface, a second protective layer is formed; The formation of the second protective layer includes: A second protective layer film is attached to the second main surface; A pressing process is used to press the back plate and the second protective layer film together, so that the plurality of light-emitting devices are embedded in the second protective layer film, and the second protective layer film fills the gap area between the plurality of light-emitting devices and covers the plurality of light-emitting devices. The second protective layer film is cut along the cutting position on the second protective layer film using laser cutting technology to form a second protective layer that matches the size of the back plate. The cutting position is parallel to the boundary between the second main surface and the selected side surface, and the cutting position is flush with the plane containing the first part of the reflective layer. or, In the case where the reflective layer further includes a second portion, the cutting position is parallel to the junction edge of the second main surface and the selected side surface, and the cutting position is located on the second portion.

22. The method for manufacturing a display panel according to claim 21, characterized in that, Also includes: After the second protective layer is formed, a third protective layer is formed; The formation of the third protective layer includes: On the side of the reflective layer away from the backplate, the first protective layer is located on the side of the first main surface away from the backplate, and the surface of the second protective layer near the selected side surface is coated with a fluorinated material to form the third protective layer.

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