A spring-loaded refrigeration device and its refrigeration method based on unidirectional heat transfer

Abstract

This invention discloses a trolley-based refrigeration device and its refrigeration method based on unidirectional heat transfer, comprising a heat sink, a heat source, n unidirectional heat transfer structures, and (n-1) trolley refrigerants. The heat source is positioned below the heat sink. The unidirectional heat transfer structures are positioned between the heat sink and the heat source, and their thermal conductivity is adjustable. A trolley refrigerant is positioned between two adjacent unidirectional heat transfer structures. When the thermal conductivity of the unidirectional heat transfer structure is adjusted to its maximum, heat is rapidly transferred under the forward temperature difference; when the thermal conductivity is adjusted to its minimum, heat is almost not transferred under the reverse temperature difference. This invention can control heat transfer in the trolley-based refrigeration device through the unidirectional heat transfer structure, eliminating the need for complex fluid heat exchange devices containing pumps and valves. This allows the trolley-based refrigeration device to operate at high frequencies, increasing the refrigeration frequency and achieving a large cooling capacity. It can also be miniaturized and integrated as needed.

Description

Technical Field

[0001] This invention relates to a refrigeration device, and more particularly to a spring-loaded refrigeration device based on unidirectional heat transfer and its refrigeration method. Background Technology

[0002] There is a huge demand for refrigeration, which plays a vital role in improving people's comfort and industrial production. However, traditional gas compression refrigeration machines have many problems: on the one hand, the energy conversion rate of gas compression refrigeration is low; for example, the energy efficiency ratio of a typical air conditioner is about 3, resulting in a significant waste of public resources due to energy loss. On the other hand, large quantities of hydrofluorocarbon (HFC) refrigerants used in gas compression refrigeration machines are manufactured and released. Although they are not harmful to living organisms, they have a high greenhouse effect, and the Earth's atmosphere has suffered irreversible damage under the chemical effects of these refrigerants. The ozone content in the atmosphere has dropped sharply, allowing more ultraviolet radiation to reach the Earth's surface, increasing the overall global temperature, and inducing more extreme weather events, sea-level rise, and many other problems. Although the industry has been developing new low-greenhouse-effect fluid refrigerants, these refrigerants have low latent heat of phase change and face a series of problems such as short lifespan, flammability, and high toxicity. To address this challenge, the academic community has taken a different approach, developing green solid-state refrigeration technology that uses solid materials as refrigerants. This type of refrigeration method does not produce any direct carbon emissions, demonstrating unique advantages in environmental protection and sustainable development.

[0003] Solid-state bombardment refrigeration technology is a novel refrigeration technology that utilizes the heat absorption and release effects of a first-order phase change in materials. Since its introduction in 2004, this new technology has attracted the attention of researchers worldwide. In recent years, research on solid-state bombardment refrigeration has yielded numerous research results and achieved excellent cooling effects. Most traditional bombardment refrigeration prototypes use fluid systems for heat exchange, where the heat exchange fluid comes into contact with the loaded / unloaded solid bombardment refrigerant, carrying away the refrigerant's heat through convection, thus achieving a cooling effect. In these prototypes, the operation of the fluid system requires pumps and valves for drive and control. During the operation of the bombardment refrigeration system, the pumps and valves need to be periodically switched during loading and unloading to adjust the fluid flow direction, making the structure of such bombardment devices complex and difficult to miniaturize. Due to limitations in pump and valve response time, and certain deviations in signal synchronization between the control system and the loading system, the operating frequency of these unidirectional heat transfer-based bombardment refrigeration devices is relatively low, mostly limited to between 0.1Hz and 1Hz. Summary of the Invention

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a spring-loaded refrigeration device based on unidirectional heat transfer, which eliminates the need for the fluid system in traditional spring-loaded refrigeration devices and can operate at high frequencies, thereby obtaining a large cooling capacity.

[0005] The present invention also proposes a refrigeration method based on the above-mentioned spring-loaded refrigeration device.

[0006] According to a first aspect of the present invention, a cartridge-type refrigeration device based on unidirectional heat transfer includes a heat sink, a heat source, n unidirectional heat transfer structures, and (n-1) cartridge-type refrigerants. The heat source is disposed below the heat sink. n ≥ 2. The unidirectional heat transfer structures are disposed between the heat sink and the heat source, and the thermal conductivity of the unidirectional heat transfer structures is adjustable. One cartridge-type refrigerant is disposed between two adjacent unidirectional heat transfer structures.

[0007] A spring-loaded refrigeration device based on unidirectional heat transfer according to an embodiment of the present invention has at least the following beneficial effects:

[0008] Applying the invention of the above embodiments, when the thermal conductivity of the unidirectional heat transfer structure is adjusted to its maximum, heat is rapidly transferred under the forward temperature difference; when the thermal conductivity of the unidirectional heat transfer structure is adjusted to its minimum, heat is almost not transferred under the reverse temperature difference. In this embodiment, firstly, the thermal conductivity of the unidirectional heat transfer structure between the refrigerant and the heat sink is adjusted to its maximum, and the thermal conductivity of the unidirectional heat transfer structure between the heat source and the refrigerant is adjusted to its minimum. Simultaneously, pressure is applied to the refrigerant, causing it to undergo a forward phase change and release heat. The heat is transferred from the refrigerant to the heat sink under the action of the unidirectional heat transfer structure, and the temperature of the refrigerant decreases. Then, the thermal conductivity of the unidirectional heat transfer structure between the heat source and the refrigerant is adjusted to its maximum, and the thermal conductivity of the unidirectional heat transfer structure between the refrigerant and the heat sink is adjusted to its minimum. Simultaneously, the pressure of the refrigerant is removed, causing it to undergo a reverse phase change and absorb heat. The heat is transferred from the heat source to the refrigerant under the action of the unidirectional heat transfer structure, and the temperature of the heat source decreases. This invention can control the heat transfer in a unidirectional heat transfer-based cassette refrigeration device by means of a unidirectional heat transfer structure, without the need for a complex fluid heat exchange device containing pumps and valves. This allows the unidirectional heat transfer-based cassette refrigeration device to operate at high frequencies, increasing the refrigeration frequency and obtaining a large refrigeration capacity. The unidirectional heat transfer-based cassette refrigeration device of this invention can be miniaturized and integrated as needed.

[0009] According to some embodiments of the present invention, the unidirectional heat transfer structure is provided with a heat insulation frame, the heat insulation frame extending downwards to form an installation space, and at least one heat transfer roller is rotatably mounted on the heat insulation frame within the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and two heat-insulating parts, the heat-insulating part being an arc-shaped cylindrical structure, and the two heat-insulating parts being symmetrically arranged about the axis of the heat transfer roller.

[0010] According to some embodiments of the present invention, the unidirectional heat transfer structure is provided with a heat insulation frame, the heat insulation frame extends from top to bottom to form an installation space, and at least one heat transfer roller is rotatably installed in the heat insulation frame within the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and a heat-insulating part, and both the heat-conducting part and the heat-insulating part are semi-cylindrical structures.

[0011] According to some embodiments of the present invention, the unidirectional heat transfer structure is provided with a heat insulation frame, the heat insulation frame extends from top to bottom to form an installation space, and at least one heat transfer roller is rotatably installed in the heat insulation frame within the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and a heat-insulating part, and the heat-conducting part is a semi-circular arc-shaped plate structure.

[0012] According to some embodiments of the present invention, a filler is provided between the heat insulation frame and the heat transfer roller, and the filler is thermally conductive silicone grease.

[0013] According to some embodiments of the present invention, the heat insulation frame is made of heat insulation material, the heat conducting part is made of metal, and the heat insulation part is made of thermal insulation material.

[0014] According to some embodiments of the present invention, the heat insulation frame is made of heat insulation materials such as polymer and acrylic, and can be prepared by resin 3D printing or by machining.

[0015] According to some embodiments of the present invention, the heat-conducting part is made of copper or aluminum.

[0016] According to some embodiments of the present invention, the heat insulation part is made of polymer or acrylic.

[0017] According to some embodiments of the present invention, the cartridge refrigerant is made of shape memory alloy, natural rubber, or shape memory polymer.

[0018] According to some embodiments of the present invention, each of the unidirectional heat transfer structures is provided with three heat transfer rollers, and the three heat transfer rollers of each unidirectional heat transfer structure rotate synchronously.

[0019] According to some embodiments of the present invention, each of the heat transfer rollers is connected to a drive shaft at its end, and the drive shafts of the same unidirectional heat transfer structure are connected to a gearbox, and each gearbox is connected to a drive motor.

[0020] According to some embodiments of the present invention, the cartridge refrigerant is rectangular in shape.

[0021] According to a second aspect of the present invention, a refrigeration method based on a spring-loaded refrigeration device utilizes a spring-loaded refrigeration device based on unidirectional heat transfer as described in the above embodiment. The spring-loaded refrigeration device is provided with two unidirectional heat transfer structures. The unidirectional heat transfer structure closer to the heat sink is a first thermal switch, and the unidirectional heat transfer structure closer to the heat source is a second thermal switch. When the thermal conductivity is highest under a forward temperature difference, either the first thermal switch or the second thermal switch is in an open state; when the thermal conductivity is lowest under a reverse temperature difference, either the first thermal switch or the second thermal switch is in a closed state. The refrigeration method based on the spring-loaded refrigeration device includes the following steps:

[0022] S1. The first thermal switch is closed and the second thermal switch is opened. At the same time, the refrigerant is rapidly stressed, thereby causing the refrigerant to undergo a positive phase change and release heat.

[0023] S2, continue to maintain the loading state of the refrigerant in the cartridge, and the heat is transferred from the high temperature of the refrigerant in the cartridge to the heat sink under the heat conduction effect of the second thermal switch, and the temperature of the refrigerant in the cartridge decreases;

[0024] S3, the first thermal switch is turned on and the second thermal switch is turned off. At the same time, the stress on the refrigerant is quickly removed, causing the refrigerant to undergo a reverse phase change and absorb heat.

[0025] S4, continue to maintain the unloading state of the refrigerant in the cartridge, and the heat is transferred from the heat sink to the low-temperature refrigerant in the cartridge under the heat conduction effect of the first thermal switch, thereby realizing the cooling of the heat sink.

[0026] A refrigeration method based on a spring-loaded refrigeration device according to an embodiment of the present invention has at least the following beneficial effects:

[0027] Applying the invention of the above embodiments, when the thermal conductivity of the unidirectional heat transfer structure is adjusted to its maximum, heat is rapidly transferred under the forward temperature difference; when the thermal conductivity of the unidirectional heat transfer structure is adjusted to its minimum, heat is almost not transferred under the reverse temperature difference. In this embodiment, firstly, the thermal conductivity of the unidirectional heat transfer structure between the refrigerant and the heat sink is adjusted to its maximum, and the thermal conductivity of the unidirectional heat transfer structure between the heat source and the refrigerant is adjusted to its minimum. Simultaneously, pressure is applied to the refrigerant, causing it to undergo a forward phase change and release heat. The heat is transferred from the refrigerant to the heat sink under the action of the unidirectional heat transfer structure, and the temperature of the refrigerant decreases. Then, the thermal conductivity of the unidirectional heat transfer structure between the heat source and the refrigerant is adjusted to its maximum, and the thermal conductivity of the unidirectional heat transfer structure between the refrigerant and the heat sink is adjusted to its minimum. Simultaneously, the pressure of the refrigerant is removed, causing it to undergo a reverse phase change and absorb heat. The heat is transferred from the heat source to the refrigerant under the action of the unidirectional heat transfer structure, and the temperature of the heat source decreases. This invention can control the heat transfer in a unidirectional heat transfer-based cassette refrigeration device by means of a unidirectional heat transfer structure, without the need for a complex fluid heat exchange device containing pumps and valves. This allows the unidirectional heat transfer-based cassette refrigeration device to operate at high frequencies, increasing the refrigeration frequency and obtaining a large refrigeration capacity. The unidirectional heat transfer-based cassette refrigeration device of this invention can be miniaturized and integrated as needed.

[0028] According to some embodiments of the present invention, the refrigerant in the cartridge is loaded by uniaxial tension or uniaxial compression.

[0029] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0031] Figure 1 This is a first-view view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to a first embodiment of the present invention.

[0032] Figure 2 This is a second perspective view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to the first embodiment of the present invention.

[0033] Figure 3 The evolution law of thermal conductivity of the unidirectional heat transfer structure of the unidirectional heat transfer cooling device based on unidirectional heat transfer as a function of the rotation angle of the heat transfer roller, according to the first embodiment of the present invention.

[0034] Figure 4 This is a first-view view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to a second embodiment of the present invention.

[0035] Figure 5 This is a second perspective view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to a second embodiment of the present invention.

[0036] Figure 6 The evolution law of thermal conductivity of the unidirectional heat transfer structure of the unidirectional heat transfer cooling device based on unidirectional heat transfer as a function of the rotation angle of the heat transfer roller, according to the second embodiment of the present invention.

[0037] Figure 7 This is a first-view view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to a third embodiment of the present invention.

[0038] Figure 8 This is a second perspective view of the unidirectional heat transfer structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to a third embodiment of the present invention.

[0039] Figure 9 The evolution law of thermal conductivity of the unidirectional heat transfer structure of the unidirectional heat transfer cooling device based on unidirectional heat transfer as a function of the rotation angle of the heat transfer roller, according to the third embodiment of the present invention.

[0040] Figure 10 This is a schematic diagram of the structure of a spring-loaded refrigeration device based on unidirectional heat transfer according to an embodiment of the present invention;

[0041] Figure 11 This is a schematic diagram of a spring-loaded refrigeration device based on unidirectional heat transfer according to the first embodiment of the present invention under the condition of spring-loaded refrigerant loading;

[0042] Figure 12 This is a schematic diagram of a spring-loaded refrigeration device based on unidirectional heat transfer according to the first embodiment of the present invention under the condition of unloading the spring-loaded refrigerant.

[0043] Icon labels:

[0044] 100. Heat sink;

[0045] 200. Heat source;

[0046] 300. Unidirectional heat transfer structure; 301. Heat insulation frame; 302. Heat transfer roller; 303. Heat conducting part; 304. Heat insulation part; 305. Drive shaft; 306. Gearbox; 307. Drive motor;

[0047] 400. Refrigerant cartridges.

[0048] in, Figure 11 The arrow in the image indicates that the refrigerant cartridge 400 is in the loading state. Detailed Implementation

[0049] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0050] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0051] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0052] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0053] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0054] Reference Figures 1 to 12 As shown, an embodiment of the present invention provides a cartridge-based refrigeration device based on unidirectional heat transfer, comprising a heat sink 100, a heat source 200, n unidirectional heat transfer structures 300, and (n-1) cartridge refrigerants 400. The heat source 200 is disposed below the heat sink 100. n≥2. The unidirectional heat transfer structures 300 are disposed between the heat sink 100 and the heat source 200, and the thermal conductivity of the unidirectional heat transfer structures 300 is adjustable. A cartridge refrigerant 400 is disposed between two adjacent unidirectional heat transfer structures 300.

[0055] Applying the invention of the above embodiments, when the thermal conductivity of the unidirectional heat transfer structure 300 is adjusted to its maximum, heat is rapidly transferred under the forward temperature difference; when the thermal conductivity of the unidirectional heat transfer structure 300 is adjusted to its minimum, heat is almost not transferred under the reverse temperature difference. In this embodiment, the thermal conductivity of the unidirectional heat transfer structure 300 between the refrigerant 400 and the heat sink 100 is first adjusted to its maximum, while the thermal conductivity of the unidirectional heat transfer structure 300 between the heat source 200 and the refrigerant 400 is adjusted to its minimum. Simultaneously, pressure is applied to the refrigerant 400, causing it to undergo a forward phase change and release heat. The heat is transferred from the refrigerant 400 to the heat sink 100 under the action of the unidirectional heat transfer structure 300. The temperature is reduced; then the thermal conductivity of the unidirectional heat transfer structure 300 between the heat source 200 and the refrigerant 400 is adjusted to the highest level, and the thermal conductivity of the unidirectional heat transfer structure 300 between the refrigerant 400 and the heat sink 100 is adjusted to the lowest level. Simultaneously, the pressure of the refrigerant 400 is removed, causing the refrigerant 400 to undergo a reverse phase change and absorb heat. Heat is transferred from the heat source 200 to the refrigerant 400 under the action of the unidirectional heat transfer structure 300, thus reducing the temperature of the heat source 200. This invention can control heat transfer in a unidirectional heat transfer-based refrigerant refrigeration device through the unidirectional heat transfer structure 300, eliminating the need for complex fluid heat exchange devices including pumps and valves. This allows the unidirectional heat transfer-based refrigerant refrigeration device to operate at high frequencies, increasing the cooling frequency and achieving a large cooling capacity. The unidirectional heat transfer-based refrigerant refrigeration device of this invention can be miniaturized and integrated as needed.

[0056] Reference Figures 1 to 3 , Figure 11 and Figure 12 As shown, the unidirectional heat transfer structure 300 is provided with a heat insulation frame 301. The heat insulation frame 301 extends downwards to form an installation space. At least one heat transfer roller 302 is rotatably mounted on the heat insulation frame 301 within the installation space. The heat transfer roller 302 is a cylindrical structure composed of a heat-conducting part 303 and two heat-insulating parts 304. The heat-insulating parts 304 are arc-shaped cylindrical structures, and the two heat-insulating parts 304 are symmetrically arranged about the axis of the heat transfer roller 302. It can be understood that since the two heat-insulating parts 304 are symmetrical, the heat-conducting part 303 is an irregularly shaped columnar structure between the two heat-insulating parts 304 to form a complete cylinder. When the heat transfer roller 302 rotates and the line connecting the two heat-insulating parts 304 is perpendicular to the line connecting the heat sink 100 and the refrigerant cartridge 400, refer to... Figure 2 and Figure 11 When the unidirectional heat transfer structure 300 is in the open state, heat can be quickly transferred along the heat conduction part 303, which has the highest thermal conductivity and facilitates heat transfer. Conversely, when the heat transfer roller 302 rotates to the point where the line connecting the two heat insulation parts 304 is parallel to the line connecting the heat sink 100 and the refrigerant cartridge 400, refer to... Figure 12 The unidirectional heat transfer structure 300 in which it is located is in a closed state, and most of the heat is blocked by the heat insulation part 304, which has the lowest thermal conductivity and is not conducive to heat transmission. Figure 3 As can be seen, the thermal conductivity of the unidirectional heat transfer structure 300 is 16.3 W / m² when it is in the open state. -1 K -1 The thermal conductivity of the unidirectional heat transfer structure 300 when it is in the closed state is only 3.3 W / m². -1 K -1 .

[0057] Understandably, the volume ratio of the heat-conducting part 303 and the heat-insulating part 304 in the assembled cylindrical structure can be adjusted according to actual needs.

[0058] Reference Figures 4 to 6 As shown, the unidirectional heat transfer structure 300 is provided with a heat insulation frame 301. The heat insulation frame 301 extends downwards to form an installation space. At least one heat transfer roller 302 is rotatably mounted on the heat insulation frame 301 within the installation space. The heat transfer roller 302 is a cylindrical structure formed by splicing a heat-conducting part 303 and a heat insulation part 304. Both the heat-conducting part 303 and the heat insulation part 304 are semi-cylindrical structures. It can be understood that when the heat transfer roller 302 rotates to the point where the boundary line between the heat-conducting part 303 and the heat insulation part 304 is parallel to the line connecting the heat source 200 and the refrigerant 400, the unidirectional heat transfer structure 300 is in an open state, i.e., it has the highest thermal conductivity, and heat can be quickly transferred along the heat-conducting part 303, facilitating heat transfer. When the heat transfer roller 302 rotates to the point where the boundary line between the heat insulation part 304 and the heat insulation part 304 is perpendicular to the line connecting the heat source 200 and the refrigerant 400, referring to... Figure 4 As shown, the unidirectional heat transfer structure 300 in which it is located is in a closed state, that is, it has the lowest thermal conductivity, which is not conducive to the passage of heat. Figure 5 The evolution of the thermal conductivity of the thermal switch with the rotation angle of the cylindrical structure is shown. It can be seen that the thermal conductivity is 17.1 W / m² when the unidirectional heat transfer structure 300 is in the open state. -1 K -1 The thermal conductivity of the unidirectional heat transfer structure 300 when it is in the closed state is only 1.2 W / m². -1 K -1 .

[0059] Reference Figures 7 to 9As shown, the unidirectional heat transfer structure 300 is provided with a heat insulation frame 301. The heat insulation frame 301 extends downwards to form an installation space. At least one heat transfer roller 302 is rotatably mounted on the heat insulation frame 301 within the installation space. The heat transfer roller 302 is a cylindrical structure formed by splicing a heat-conducting part 303 and a heat insulation part 304. The heat-conducting part 303 is a semi-circular arc-shaped plate structure. It can be understood that when the heat transfer roller 302 rotates to the point where the boundary line between the heat-conducting part 303 and the heat insulation part 304 is parallel to the line connecting the heat source 200 and the refrigerant 400, the unidirectional heat transfer structure 300 is in an open state, i.e., it has the highest thermal conductivity, facilitating heat transfer. When the heat transfer roller 302 rotates to the point where the boundary line between the heat insulation part 304 and the heat insulation part 304 is perpendicular to the line connecting the heat source 200 and the refrigerant 400, referring to... Figure 8 The unidirectional heat transfer structure 300 in which it is located is in a closed state, meaning it has the lowest thermal conductivity, which is not conducive to heat transfer. From Figure 5 It can be seen that the thermal conductivity of the unidirectional heat transfer structure 300 is 12 W / m² when it is in the open state. -1 K -1 The thermal conductivity of the unidirectional heat transfer structure 300 when it is in the closed state is only 0.9 W / m². -1 K -1 .

[0060] Reference Figure 2 , Figure 5 and Figure 8 As shown, each unidirectional heat transfer structure 300 is provided with three heat transfer rollers 302, and the three heat transfer rollers 302 of each unidirectional heat transfer structure 300 rotate synchronously.

[0061] It is understandable that a filler material, namely thermally conductive silicone grease, is provided between the heat insulation frame 301 and the heat transfer roller 302.

[0062] Understandably, the insulation frame 301 is made of insulation material.

[0063] Understandably, the thermal insulation frame 301 is made of thermal insulation materials such as polymer and acrylic, and can be prepared by resin 3D printing or machined.

[0064] Understandably, the heat-conducting part 303 is made of metal, and the heat-insulating part 304 is made of thermal insulation material.

[0065] Understandably, the heat-conducting part 303 is made of copper or aluminum.

[0066] It is understandable that the heat insulation part 304 is made of polymer or acrylic.

[0067] Reference Figure 10As shown, each heat transfer roller 302 is connected to a drive shaft 305 at its end. The drive shaft 305 of the same unidirectional heat transfer structure 300 is connected to a gearbox 306, and each gearbox 306 is connected to a drive motor 307.

[0068] It is understandable that the refrigerant 400 is made of shape memory alloy, natural rubber, or shape memory polymer.

[0069] It is understandable that the refrigerant cartridge 400 is rectangular in shape.

[0070] According to a second aspect of the present invention, a cooling method based on a spring-loaded refrigeration device utilizes a spring-loaded refrigeration device based on unidirectional heat transfer as described in the above embodiment. The spring-loaded refrigeration device based on unidirectional heat transfer has two unidirectional heat transfer structures 300. The unidirectional heat transfer structure 300 closer to the heat sink 100 serves as a first thermal switch, and the unidirectional heat transfer structure 300 closer to the heat source 200 serves as a second thermal switch. When the thermal conductivity is highest under a forward temperature difference, either the first thermal switch or the second thermal switch is in the open state; when the thermal conductivity is lowest under a reverse temperature difference, either the first thermal switch or the second thermal switch is in the closed state. The cooling method based on the spring-loaded refrigeration device based on unidirectional heat transfer includes the following steps:

[0071] S1. The first thermal switch is closed and the second thermal switch is opened. At the same time, the refrigerant 400 is rapidly stressed, which causes the refrigerant 400 to undergo a positive phase change and release heat.

[0072] S2, continue to maintain the loading state of the refrigerant 400. Under the heat conduction of the second thermal switch, heat is transferred from the high temperature of the refrigerant 400 to the heat sink 100, and the temperature of the refrigerant 400 decreases.

[0073] S3, the first thermal switch is turned on and the second thermal switch is turned off. At the same time, the stress on the refrigerant 400 is quickly removed, causing the refrigerant 400 to undergo a reverse phase change and absorb heat.

[0074] S4, continue to maintain the unloading state of the refrigerant 400 in the spring, and the heat is transferred from the heat sink 100 to the low-temperature refrigerant 400 under the heat conduction effect of the first thermal switch, thereby realizing the cooling of the heat sink 100.

[0075] Applying the invention of the above embodiments, when the thermal conductivity of the unidirectional heat transfer structure 300 is adjusted to its maximum, heat is rapidly transferred under the forward temperature difference; when the thermal conductivity of the unidirectional heat transfer structure 300 is adjusted to its minimum, heat is almost not transferred under the reverse temperature difference. In this embodiment, the thermal conductivity of the unidirectional heat transfer structure 300 between the refrigerant 400 and the heat sink 100 is first adjusted to its maximum, while the thermal conductivity of the unidirectional heat transfer structure 300 between the heat source 200 and the refrigerant 400 is adjusted to its minimum. Simultaneously, pressure is applied to the refrigerant 400, causing it to undergo a forward phase change and release heat. The heat is transferred from the refrigerant 400 to the heat sink 100 under the action of the unidirectional heat transfer structure 300. The temperature is reduced; then the thermal conductivity of the unidirectional heat transfer structure 300 between the heat source 200 and the refrigerant 400 is adjusted to the highest level, and the thermal conductivity of the unidirectional heat transfer structure 300 between the refrigerant 400 and the heat sink 100 is adjusted to the lowest level. Simultaneously, the pressure of the refrigerant 400 is removed, causing the refrigerant 400 to undergo a reverse phase change and absorb heat. Heat is transferred from the heat source 200 to the refrigerant 400 under the action of the unidirectional heat transfer structure 300, thus reducing the temperature of the heat source 200. This invention can control heat transfer in a unidirectional heat transfer-based refrigerant refrigeration device through the unidirectional heat transfer structure 300, eliminating the need for complex fluid heat exchange devices including pumps and valves. This allows the unidirectional heat transfer-based refrigerant refrigeration device to operate at high frequencies, increasing the cooling frequency and achieving a large cooling capacity. The unidirectional heat transfer-based refrigerant refrigeration device of this invention can be miniaturized and integrated as needed.

[0076] It is understandable that the loading method of the refrigerant 400 is uniaxial tension or uniaxial compression.

[0077] The following is for reference. Figures 1 to 3 , Figures 10 to 12 The first embodiment of the present invention, a spring-loaded refrigeration device based on unidirectional heat transfer, is described in detail with reference to a specific example. It is to be understood that the following description is merely illustrative and not intended to limit the invention.

[0078] In the first embodiment of the present invention, the unidirectional heat transfer-based spring-loaded refrigeration device is provided with two unidirectional heat transfer structures 300. Each unidirectional heat transfer structure 300 is provided with a heat insulation frame 301, which extends downwards from the top to form an installation space. At least one heat transfer roller 302 is rotatably mounted on the heat insulation frame 301 within the installation space. The heat transfer roller 302 is a cylindrical structure composed of a heat-conducting part 303 and two heat insulation parts 304. The heat insulation parts 304 are arc-shaped cylindrical structures, and the two heat insulation parts 304 are symmetrically arranged about the axis of the heat transfer roller 302. Each heat transfer roller 302 is connected to a drive shaft 305 at its end. The drive shafts 305 of the same unidirectional heat transfer structure 300 are connected to a gearbox 306, and each gearbox 306 is connected to a drive motor 307. The three heat transfer rollers 302 can rotate synchronously. Specifically, the unidirectional heat transfer structure 300 near the heat sink 100 is the first thermal switch, and the unidirectional heat transfer structure 300 near the heat source 200 is the second thermal switch. It can be understood that the unidirectional heat transfer-based cartridge refrigeration device in this embodiment includes, from top to bottom, the heat sink 100, the first thermal switch, the cartridge refrigerant 400, the second thermal switch, and the heat source 200. In this embodiment, a machined copper block is used to make the heat-conducting part 303 (thermal conductivity of 386 W / m²). -1 K -1 The heat insulation part is made of 304 stainless steel (thermal conductivity 0.3 W / m²) using 3D printed photosensitive resin. -1 K -1 ), using a thermal conductivity of 5Wm -1 K -1Thermally conductive silicone grease is filled between the heat transfer roller 302 and the heat insulation frame 301. Nickel-titanium alloy (NiTi, atomic ratio 50.6%:49.4%) is used as the refrigerant 400, aluminum alloy is used as the heat sink 100, and copper is used as the target heat source 200. In this embodiment, the outer diameter of the cylindrical structure formed by the thermally conductive part 303 and the heat insulation part 304 is 5 mm, and the axial length is 10 mm. In this embodiment, the drive motor 307 turns on to control the rotation of the heat transfer roller 302, causing the second thermal switch to open and the first thermal switch to close. Simultaneously, stress is rapidly applied to the refrigerant 400, causing it to undergo a forward phase change and release heat. Then, the refrigerant 400 remains in a loaded state for 0.2 seconds, and heat is transferred from the high-temperature refrigerant 400 to the heat sink 100 under the thermal conductivity of the second thermal switch, causing the temperature of the refrigerant 400 to decrease. Next, the drive motor 307 turns on to control the rotation of the heat transfer roller 302, causing the first thermal switch to open and the second thermal switch to close. Simultaneously, the stress on the refrigerant 400 is rapidly removed, causing it to undergo a reverse phase change and absorb heat. Then, the refrigerant 400 remains in an unloaded state for 0.2 seconds, and heat is transferred from the heat sink 100 to the low-temperature refrigerant 400 under the thermal conductivity of the first thermal switch, thereby achieving cooling of the heat sink 100. By repeating the above steps, heat can be continuously transferred from the heat source 200 to the heat sink 100, thus achieving the purpose of cooling the heat source 200.

[0079] The following is for reference. Figures 4 to 6 , Figure 10 A spring-loaded refrigeration device based on unidirectional heat transfer according to a second embodiment of the present invention is described in detail with reference to a specific example. It is to be understood that the following description is merely illustrative and not intended to limit the invention in any specific way.

[0080] In the second embodiment of the present invention, the unidirectional heat transfer-based spring-loaded refrigeration device is provided with two unidirectional heat transfer structures 300. Each unidirectional heat transfer structure 300 is provided with a heat insulation frame 301, which extends downwards from the top to form an installation space. At least one heat transfer roller 302 is rotatably mounted within the heat insulation frame 301. The heat transfer roller 302 is a cylindrical structure formed by splicing a heat-conducting part 303 and a heat-insulating part 304, both of which are semi-cylindrical structures. In this embodiment, the outer diameter of the heat-conducting part 303 and the heat-insulating part 304 is 7.5 mm, and the axial length is 15 mm. In this embodiment, the heat-conducting part 303 (thermal conductivity of 385 W / m²) is made from a machined copper block. -1 K -1 The insulation part is made of PDMS 304 (thermal conductivity 0.2 W / m). -1 K -1 Silver-containing thermal grease (thermal conductivity 9 W / m²) -1K -1 As the filler, nickel-titanium-vanadium alloy (NiTiV, atomic ratio 50%:45.2%:4.8%) is used as the refrigerant 400, aluminum alloy is used as the heat sink 100, and aluminum alloy is used as the target heat source 200. The refrigeration method in this example is the same as in the first embodiment, and will not be described again here.

[0081] The following is for reference. Figures 7 to 10 A spring-loaded refrigeration device based on unidirectional heat transfer according to a third embodiment of the present invention is described in detail with reference to a specific example. It is to be understood that the following description is merely illustrative and not intended to limit the invention in any specific way.

[0082] In the third embodiment of the present invention, the unidirectional heat transfer-based spring-loaded refrigeration device is provided with two unidirectional heat transfer structures 300. Each unidirectional heat transfer structure 300 is provided with a heat insulation frame 301, which extends downwards from the top to form an installation space. At least one heat transfer roller 302 is rotatably mounted within the heat insulation frame 301. The heat transfer roller 302 is a cylindrical structure formed by splicing a heat-conducting part 303 and a heat-insulating part 304. The heat-conducting part 303 is a semi-circular arc-shaped plate structure. A drive shaft 305 is connected to the end of each heat transfer roller 302. The drive shafts 305 of the same unidirectional heat transfer structure 300 are connected to a gearbox 306. Each gearbox 306 is connected to a drive motor 307, enabling the three heat transfer rollers 302 to rotate synchronously. In this embodiment, the outer diameter of the cylindrical structure formed by the heat-conducting part 303 and the heat-insulating part 304 is 10 mm, and the axial length is 20 mm. In this embodiment, a machined copper block is used to make the heat-conducting part 303 (thermal conductivity of 385 W / m). -1 K -1 The insulation part is made of 304 stainless steel (thermal conductivity 0.13 W / m²) using 3D-printed PLA. - 1 K -1 Nano-silver thermal grease (thermal conductivity 16 W / m²) is used. -1 K -1As filler, nickel-titanium-vanadium alloy (NiFeGaCo, atomic ratio 56%:17%:25%:2%) is used as refrigerant 400, aluminum alloy is used as heat sink 100, and aluminum alloy is used as target heat source 200. In this embodiment, the drive motor 307 turns on to control the rotation of the heat transfer roller 302, causing the second thermal switch to open and the first thermal switch to close. Simultaneously, stress is rapidly applied to the refrigerant 400, causing it to undergo a forward phase change and release heat. Then, the refrigerant 400 remains in a loaded state for 0.2 seconds, and heat is transferred from the high-temperature refrigerant 400 to the heat sink 100 under the thermal conductivity of the second thermal switch, causing the temperature of the refrigerant 400 to decrease. Next, the drive motor 307 turns on to control the rotation of the heat transfer roller 302, causing the first thermal switch to open and the second thermal switch to close. Simultaneously, the stress on the refrigerant 400 is rapidly removed, causing it to undergo a reverse phase change and absorb heat. Then, the refrigerant 400 remains in an unloaded state for 0.2 seconds, and heat is transferred from the heat sink 100 to the low-temperature refrigerant 400 under the thermal conductivity of the first thermal switch, thereby achieving cooling of the heat sink 100. By repeating the above steps, heat can be continuously transferred from the heat source 200 to the heat sink 100, thus achieving the purpose of cooling the heat source 200.

[0083] In some embodiments of the present invention, the unidirectional heat transfer-based cartridge refrigeration device can be configured as a multi-stage structure, that is, three or more unidirectional heat transfer structures 300 are set, and two or more cartridge refrigerants 400 are set accordingly. The purpose is to increase the maximum temperature range that the system can output, that is, the temperature difference between the heat sink 100 and the heat source 200. Its refrigeration method is similar to that in the above embodiments, and will not be described in detail here.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0085] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A spring-loaded refrigeration device based on unidirectional heat transfer, characterized in that, include: Heat sink; A heat source, wherein the heat source is disposed below the heat sink; n unidirectional heat transfer structures, n≥2, wherein each unidirectional heat transfer structure is disposed between the heat sink and the heat source, and the thermal conductivity of each unidirectional heat transfer structure is adjustable; and (n-1) cartridge refrigerants, with one cartridge refrigerant disposed between two adjacent unidirectional heat transfer structures.

2. The spring-loaded refrigeration device based on unidirectional heat transfer according to claim 1, characterized in that: The unidirectional heat transfer structure is provided with a heat insulation frame, which extends from top to bottom to form an installation space. At least one heat transfer roller is rotatably installed in the heat insulation frame within the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and two heat insulation parts. The heat insulation part is an arc-shaped cylindrical structure. The two heat insulation parts are symmetrically arranged with the axis of the heat transfer roller as the center.

3. The spring-loaded refrigeration device based on unidirectional heat transfer according to claim 1, characterized in that: The unidirectional heat transfer structure is provided with a heat insulation frame, which extends from the top to the bottom to form an installation space. At least one heat transfer roller is rotatably installed in the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and a heat-insulating part, both of which are semi-cylindrical structures.

4. The spring-loaded refrigeration device based on unidirectional heat transfer according to claim 1, characterized in that: The unidirectional heat transfer structure is provided with a heat insulation frame, which extends from top to bottom to form an installation space. At least one heat transfer roller is rotatably installed in the installation space. The heat transfer roller is a cylindrical structure composed of a heat-conducting part and a heat-insulating part, and the heat-conducting part is a semi-circular arc-shaped plate structure.

5. The spring-loaded refrigeration device based on unidirectional heat transfer according to any one of claims 2 to 4, characterized in that: A filler, namely thermally conductive silicone grease, is provided between the heat insulation frame and the heat transfer roller.

6. The spring-loaded refrigeration device based on unidirectional heat transfer according to any one of claims 2 to 4, characterized in that: The heat insulation frame is made of heat insulation material, the heat conduction part is made of metal, and the heat insulation part is made of thermal insulation material.

7. The spring-loaded refrigeration device based on unidirectional heat transfer according to any one of claims 2 to 4, characterized in that: The refrigerant in the cartridge is made of shape memory alloy, natural rubber, or shape memory polymer.

8. The spring-loaded refrigeration device based on unidirectional heat transfer according to any one of claims 2 to 4, characterized in that: Each of the unidirectional heat transfer structures is provided with three heat transfer rollers, and the three heat transfer rollers of each unidirectional heat transfer structure rotate synchronously.

9. The spring-loaded refrigeration device based on unidirectional heat transfer according to any one of claims 2 to 4, characterized in that: Each of the heat transfer rollers is connected to a drive shaft at its end. The drive shafts of the same unidirectional heat transfer structure are connected to a gearbox, and each gearbox is connected to a drive motor.

10. A refrigeration method based on a spring-loaded refrigeration device, characterized in that, The unidirectional heat transfer-based cartridge refrigeration device as described in claim 1 is provided with two unidirectional heat transfer structures. The unidirectional heat transfer structure closer to the heat sink is a first thermal switch, and the unidirectional heat transfer structure closer to the heat source is a second thermal switch. When the thermal conductivity is highest under a forward temperature difference, either the first thermal switch or the second thermal switch is in the open state; when the thermal conductivity is lowest under a reverse temperature difference, either the first thermal switch or the second thermal switch is in the closed state. The refrigeration method of the unidirectional heat transfer-based cartridge refrigeration device includes the following steps: S1. The first thermal switch is closed and the second thermal switch is opened. At the same time, the refrigerant is rapidly stressed, thereby causing the refrigerant to undergo a positive phase change and release heat. S2, continue to maintain the loading state of the refrigerant in the cartridge, and the heat is transferred from the high temperature of the refrigerant in the cartridge to the heat sink under the heat conduction effect of the second thermal switch, and the temperature of the refrigerant in the cartridge decreases; S3, the first thermal switch is turned on and the second thermal switch is turned off. At the same time, the stress on the refrigerant is quickly removed, causing the refrigerant to undergo a reverse phase change and absorb heat. S4, continue to maintain the unloading state of the refrigerant in the cartridge, and the heat is transferred from the heat sink to the low-temperature refrigerant in the cartridge under the heat conduction effect of the first thermal switch, thereby realizing the cooling of the heat sink.

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