A method of welding a stainless steel target assembly

Abstract

The present application relates to a kind of welding methods of stainless steel target assembly, the welding method includes: in the welding surface of wet back plate, first wire and second wire are arranged alternately, then with wet stainless steel target is buckled, then pressure brazing cooling is carried out, obtains stainless steel target assembly;Wherein, the material of first wire and second wire is different;The surface roughness of first wire is greater than the surface roughness of second wire.The welding method provided by the present application realizes the efficient welding of stainless steel target and back plate by using the cooperation between specific wire, the combination rate of target and back plate after welding is significantly improved, can reach 100%, significantly improves the use performance of stainless steel target assembly, is conducive to solving electromagnetic compatibility problem by electromagnetic shielding.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of target material preparation, in particular to a welding method of a stainless steel target assembly. BACKGROUND

[0002] At present, the main role of packaging is to protect the chip, provide support for the chip, realize electrical interconnection between the chip and the PCB, and assist the chip in heat dissipation. Electromagnetic compatibility refers to the fact that when an electronic device or system is working normally, its interference (caused by radiation sources, etc.) does not affect the normal work of other devices or systems, nor does it affect the normal work of external interference. Therefore, the electromagnetic compatibility problem of electronic products needs to be solved, and electromagnetic shielding can effectively solve the electromagnetic compatibility problem.

[0003] In the current packaging process, sputtering film coating is usually used to package with the help of stainless steel target material. The performance of the stainless steel target material used in the packaging process will significantly affect the packaging result. Specifically, the preparation process of the target material, especially the welding process of the target material and the back plate.

[0004] Although the prior art CN102383099A discloses a manufacturing method of a target structure, the method comprises: providing a target material, the target material is stainless steel; performing a sand blasting process on the surface of the target material; performing an activation treatment on the surface of the target material; performing a water washing treatment on the surface of the target material; forming a metal plating layer on the welding surface of the target material after the water washing treatment by using a chemical plating process; and welding the target material after the chemical plating treatment to a back plate. The metal plating layer is formed on the welding surface of the stainless steel target material by chemical plating, and the metal plating layer is used as an intermediate medium to realize the firm combination of the target material and the back plate after welding, and has high bonding strength.

[0005] However, the stainless steel target assembly obtained after welding in the existing preparation process still has the problem of low welding combination rate. SUMMARY

[0006] In view of the problems in the prior art, the purpose of the present application is to provide a welding method of a stainless steel target assembly to solve the problem of low welding combination rate of the stainless steel target assembly after welding.

[0007] To achieve this purpose, the present application adopts the following technical solutions:

[0008] The present application provides a welding method of a stainless steel target assembly, the welding method comprising:

[0009] The first wire and the second wire are arranged alternately on the welding surface of the back plate after immersion, and then the stainless steel target after immersion is buckled, and then pressure brazing cooling is performed to obtain a stainless steel target assembly;

[0010] The material of the first wire and the second wire is different, the surface roughness of the first wire is greater than the surface roughness of the second wire, and the vertical spacing between the adjacent first wire and the second wire is 10-15% of the equivalent circle diameter of the target material.

[0011] The welding method provided by the application realizes efficient welding of the stainless steel target and the back plate by adopting the cooperation between the specific wires, the combination rate of the target and the back plate after welding is obviously improved, and can reach 100%, and the use performance of the stainless steel target assembly is obviously improved, which is beneficial to solving the electromagnetic compatibility problem by electromagnetic shielding.

[0012] As a preferred technical solution of the application, the first wire comprises aluminum wire and / or zinc wire.

[0013] The second wire comprises copper wire and / or nickel wire.

[0014] As a preferred technical solution of the application, the surface roughness of the first wire is 70-100 μm.

[0015] The surface roughness of the second wire is 20-30 μm.

[0016] As a preferred technical solution of the application, the diameter of the first wire is 0.3-0.5 mm.

[0017] The diameter of the second wire is 0.3-0.5 mm.

[0018] As a preferred technical solution of the application, the back plate after infiltration is obtained by sequentially performing first nickel plating and first infiltration on the welding surface of the back plate.

[0019] Preferably, the surface roughness of the welding surface of the back plate is 1.6-3.2 μm.

[0020] As a preferred technical solution of the application, the thickness of the nickel layer obtained by the first nickel plating is 8-12 μm.

[0021] As a preferred technical solution of the application, the first infiltration is performed by using a filler metal.

[0022] Preferably, the filler metal comprises indium filler metal.

[0023] Preferably, the temperature of the first infiltration is 200-300 °C.

[0024] Preferably, the temperature rising speed of the first infiltration is 3-5 °C / min.

[0025] Preferably, the time of the first infiltration is 10-20 min.

[0026] Preferably, the first infiltration is performed at least 3 times.

[0027] As a preferred technical scheme of the present application, the post-infiltration stainless steel target is obtained by sequentially performing second nickel plating and second infiltration on the welding surface of the stainless steel target;

[0028] Preferably, the surface roughness of the welding surface of the stainless steel target is 5-10 μm.

[0029] As a preferred technical scheme of the present application, the thickness of the nickel layer obtained by the second nickel plating is 10-20 μm.

[0030] As a preferred technical scheme of the present application, the second infiltration is performed by using a solder;

[0031] Preferably, the solder comprises indium solder.

[0032] Preferably, the temperature of the second infiltration is 200-300℃.

[0033] Preferably, the temperature rising speed of the second infiltration is 3-5℃ / min.

[0034] Preferably, the time of the second infiltration is 10-20 min.

[0035] Preferably, the second infiltration is performed at least 3 times.

[0036] Compared with the prior art, the present application has the following beneficial effects:

[0037] (1) The infiltration effect of the welding surface of the stainless steel target and the back plate can be improved, and the welding strength can be improved.

[0038] (2) The effective thickness of the solder layer of the welding surface can be ensured to be 0.3-0.5 mm, which is beneficial to ensuring the welding uniformity.

[0039] (3) The welding combination rate can be improved, and the welding combination rate can reach 100%. DETAILED DESCRIPTION

[0040] In order to better illustrate the present application and facilitate the understanding of the technical scheme of the present application, the typical but non-limiting embodiments of the present application are as follows:

[0041] The present embodiment provides a welding method of a stainless steel target assembly, which comprises:

[0042] The first wire and the second wire are arranged alternately on the welding surface of the post-infiltration back plate, and then the post-infiltration stainless steel target is buckled, and then pressure soldering cooling is performed to obtain a stainless steel target assembly.

[0043] Preferably, the material of the first wire is different from that of the second wire; the surface roughness of the first wire is greater than that of the second wire.

[0044] In the present application, the stainless steel target material can be selected from SUS304, SUS316 and other commonly used stainless steel target materials in the field.

[0045] In the present application, the stainless steel target material can be high-purity stainless steel target material, ultrahigh-purity stainless steel target material and other commonly used target materials in the field.

[0046] In the present application, the high purity is ≥99.99%.

[0047] In the present application, the ultrahigh purity is ≥99.9999%.

[0048] In the present application, the material of the back plate can be selected from aluminum alloy, copper alloy or titanium back plate.

[0049] In the present application, the vertical distance between the adjacent first wire material and the second wire material is 10-15% of the equivalent circle diameter of the target material, for example, it can be 10%, 10.5%, 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, 14%, 14.5% or 15%, but not limited to the listed values, other unlisted values within this range also meet the requirements.

[0050] In the present application, the shape of the back plate and the target material can be reasonably selected according to the actual situation, such as round target material, square target material, strip target material, etc. At this time, the shape of the wire material is the same as the shape of the target material, such as round target material, the shape of the wire material is corresponding to round, square target material, the shape of the wire material is corresponding shape, and so on.

[0051] Specifically, when the target material is round, the distance between the adjacent first wire material and the second wire material is the radial distance, at this time, the wire material is distributed in the welding surface of the back plate as a concentric circle with equal distance, at this time, the distance between the adjacent wire materials is the radial distance. When it is a square target material, the wire material is a square at this time, the wire material is distributed in the welding surface of the back plate as a concentric circle with equal distance, the distance between the adjacent wire materials is the distance between the adjacent edges of the two squares, that is, the vertical distance between the two parallel lines.

[0052] Among them, the outermost circle of the wire material is guaranteed to coincide with the edge of the target material, which can be used as the starting basis for the distribution process of the wire material between the adjacent wire materials. Specifically, the first wire material or the second wire material is not required as the starting point.

[0053] Among them, the pressure applied in the pressurized brazing is 10-15kN, the filler material used includes commonly used filler materials in the field, such as indium filler, etc. The residual heat in the infiltration process can be used to achieve the welding effect, or the heat preservation measures can be used to further strengthen the welding effect.

[0054] The cooling in the pressurized brazing cooling is furnace cooling, or can be achieved by using a cooling method commonly used in the art, such as air cooling, but needs to ensure that the final welding effect is not affected.

[0055] Specifically, the first wire material includes aluminum wire and / or zinc wire.

[0056] Specifically, the second wire material includes copper wire and / or nickel wire.

[0057] Specifically, the surface roughness of the first wire material is 70-100 μm, for example, can be 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm or 100 μm, etc., but is not limited to the listed values, and other unlisted values in the range also meet the requirements.

[0058] Specifically, the surface roughness of the second wire material is 20-30 μm, for example, can be 20 μm, 22 μm, 24 μm, 26 μm, 28 μm or 30 μm, etc., but is not limited to the listed values, and other unlisted values in the range also meet the requirements.

[0059] In the present application, the control of the surface roughness of the wire material and the welding surface can be achieved by the preparation process, or can be achieved by post-processing, such as sandblasting or polishing of the wire material or the welding surface, or etching or polishing, etc. to achieve the roughness limit of the present application.

[0060] The sandblasting is a process that uses compressed air as power to form a high-speed jet beam to spray the blasting material (copper ore sand, quartz sand, emery, iron sand, Hainan sand) at high speed to the surface of the workpiece to be processed, so that the surface of the workpiece or the shape is changed. Due to the impact and cutting action of the blasting material on the workpiece surface, the surface of the workpiece obtains a certain cleanliness and different roughness, and the mechanical properties of the workpiece surface are improved, and in the present application, the pressure is controlled to be 0.3-0.5 MPa during sandblasting.

[0061] The polishing is a process of treating the surface with a polishing medium to make the roughness of the excessively rough surface within the roughness range defined in the present application, such as physical treatment for polishing, specifically, sandpaper, abrasive belt or abrasive wheel can be used for polishing; or mechanical chemical grinding is used for treatment, and specific abrasive particles are used to achieve the smoothness of the rough surface.

[0062] The etching is a process of etching the workpiece surface that needs to be roughened with an etching liquid, so that the roughness can reach the range defined in the present application.

[0063] Specifically, the diameter of the first wire is 0.3-0.5mm, for example, can be 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm or 0.5mm, etc., but not limited to the listed values, other values not listed in the range are also required.

[0064] Specifically, the diameter of the second wire is 0.3-0.5mm, for example, can be 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm or 0.5mm, etc., but not limited to the listed values, other values not listed in the range are also required.

[0065] In the present application, in order to ensure the welding effect, the diameters of the first wire and the second wire are the same in principle.

[0066] Specifically, the infiltrated back plate is obtained by sequentially performing first nickel plating and first infiltration on the back plate welding surface.

[0067] The surface roughness of the back plate welding surface is 1.6-3.2μm, for example, can be 1.6μm, 1.8μm, 2μm, 1.6μm, 2.2μm, 2.4μm, 2.6μm, 2.8μm, 3μm or 3.2μm, etc., but not limited to the listed values, other values not listed in the range are also required.

[0068] The thickness of the nickel layer obtained by the first nickel plating is 8-12μm, for example, can be 8μm, 8.5μm, 9μm, 9.5μm, 10μm, 10.5μm, 11μm, 11.5μm or 12μm, etc., but not limited to the listed values, other values not listed in the range are also required.

[0069] The first infiltration is performed by using a filler material.

[0070] The filler material includes indium filler material.

[0071] The temperature of the first infiltration is 200-300℃, for example, can be 200℃, 220℃, 240℃, 260℃, 280℃ or 300℃, etc., but not limited to the listed values, other values not listed in the range are also required.

[0072] The temperature rising speed of the first infiltration is 3-5℃ / min, for example, it can be 3℃ / min, 3.5℃ / min, 4℃ / min, 4.5℃ / min or 5℃ / min, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0073] The time of the first infiltration is 10-20min, for example, it can be 10min, 12min, 14min, 16min, 18min or 20min, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0074] The first infiltration is carried out at least 3 times, for example, it can be 3 times, 4 times or 5 times, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0075] Specifically, the stainless steel target after the infiltration is obtained by sequentially carrying out the second nickel plating and the second infiltration on the stainless steel target welding surface;

[0076] The surface roughness of the stainless steel target welding surface is 5-10μm, for example, it can be 5μm, 5.5μm, 6μm, 6.5μm, 7μm, 7.5μm, 8μm, 8.5μm, 9μm, 9.5μm or 10μm, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0077] The thickness of the nickel layer obtained by the second nickel plating is 10-20μm, for example, it can be 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm or 20μm, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0078] The second infiltration is carried out by using a solder.

[0079] The solder comprises an indium solder.

[0080] The temperature of the second infiltration is 200-300℃, for example, it can be 200℃, 220℃, 240℃, 260℃, 280℃ or 300℃, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0081] The temperature rising speed of the second infiltration is 3-5℃ / min, for example, it can be 3℃ / min, 3.5℃ / min, 4℃ / min, 4.5℃ / min or 5℃ / min, etc., but is not limited to the listed values, and other values not listed in the range are also required.

[0082] The second infiltration time is 10-20 min, for example, 10 min, 12 min, 14 min, 16 min, 18 min or 20 min, but is not limited to the listed values, and other values not listed in the range are also acceptable.

[0083] The second infiltration is performed at least 3 times, for example, 3 times, 4 times or 5 times, but is not limited to the listed values, and other values not listed in the range are also acceptable.

[0084] In the present application, the first nickel plating and the second nickel plating can be achieved by chemical nickel plating, electroplating, evaporation plating, sputtering plating and other conventional plating methods in the art.

[0085] In the present application, the infiltration process is to completely cover the welding surface with the filler metal, and the thickness of the infiltration layer is as thin as possible under the premise of ensuring the coverage effect.

[0086] Further, in order to illustrate the superiority of the welding method provided by the present application, specific embodiments are provided for illustration as follows.

[0087] Embodiment 1

[0088] The present embodiment provides a welding method for a stainless steel target assembly, which comprises:

[0089] The first wire and the second wire are arranged alternately on the welding surface of the back plate after infiltration, and then the stainless steel target after infiltration is buckled, and then pressure brazing and cooling are performed to obtain a stainless steel target assembly;

[0090] The first wire and the second wire are different in material; the surface roughness of the first wire is greater than that of the second wire.

[0091] The first wire is an aluminum wire; and the second wire is a copper wire.

[0092] The surface roughness of the first wire is 80 μm; and the surface roughness of the second wire is 24 μm.

[0093] The diameter of the first wire is 0.4 mm; and the diameter of the second wire is 0.4 mm.

[0094] The back plate after infiltration is obtained by sequentially performing first nickel plating and first infiltration on the welding surface of the back plate; the surface roughness of the welding surface of the back plate is 2 μm; the thickness of the nickel layer obtained by the first nickel plating is 11 μm; the first infiltration is performed by using a filler metal; the filler metal is an indium filler metal; the temperature of the first infiltration is 260℃; the heating rate of the first infiltration is 4.5℃ / min; the time of the first infiltration is 15 min; and the first infiltration is performed 3 times.

[0095] The infiltrated stainless steel target is obtained by sequentially performing second nickel plating and second infiltration on the welding surface of the stainless steel target; the surface roughness of the welding surface of the stainless steel target is 7 μm; the thickness of the nickel layer obtained by the second nickel plating is 16 μm; the second infiltration is performed by using a solder; the solder is an indium solder; the temperature of the second infiltration is 220 ℃; the temperature increasing speed of the second infiltration is 4.2 ℃ / min; the time of the second infiltration is 18 min; and the second infiltration is performed 5 times.

[0096] In the used target assembly component, the target is a circular target, the back plate corresponds to a circular back plate, the diameter of the target is 350 mm, the diameter of the back plate is 431 mm, and the radial distance between the adjacent first wire and the second wire is 12% of the diameter of the target circle. At this time, the wire used is a circular ring wire.

[0097] The performance of the obtained target assembly is shown in Table 2.

[0098] Example 2

[0099] The embodiment provides a welding method of a stainless steel target assembly, and the welding method comprises the following steps:

[0100] The first wire and the second wire are arranged alternately on the welding surface of the infiltrated back plate, and then the infiltrated stainless steel target is buckled, and then pressure soldering cooling is performed to obtain a stainless steel target assembly;

[0101] The material of the first wire is different from that of the second wire; and the surface roughness of the first wire is greater than that of the second wire.

[0102] The first wire is a zinc wire; and the second wire is a nickel wire.

[0103] The surface roughness of the first wire is 90 μm; and the surface roughness of the second wire is 27 μm.

[0104] The diameter of the first wire is 0.45 mm; and the diameter of the second wire is 0.45 mm.

[0105] The infiltrated back plate is obtained by sequentially performing first nickel plating and first infiltration on the welding surface of the back plate; the surface roughness of the welding surface of the back plate is 2.5 μm; the thickness of the nickel layer obtained by the first nickel plating is 9 μm; the first infiltration is performed by using a solder; the solder is an indium solder; the temperature of the first infiltration is 230 ℃; the temperature increasing speed of the first infiltration is 4 ℃ / min; the time of the first infiltration is 18 min; and the first infiltration is performed 3 times.

[0106] The infiltrated stainless steel target is obtained by sequentially performing second nickel plating and second infiltration on the welding surface of the stainless steel target; the surface roughness of the welding surface of the stainless steel target is 9 μm; the thickness of the nickel layer obtained by the second nickel plating is 12 μm; the second infiltration is performed by using a solder; the solder is an indium solder; the temperature of the second infiltration is 250 ℃; the temperature increasing rate of the second infiltration is 4 ℃ / min; the time of the second infiltration is 14 min; and the second infiltration is performed 4 times.

[0107] In the used target assembly component, the target is a square target, the back plate corresponds to a square back plate, the side length of the target is 100 mm, the side length of the back plate is 150, the radial distance between the adjacent first wire and the second wire is 10% of the diameter of the target, and at this time, the wire used is a square ring wire.

[0108] The performance of the obtained target assembly is shown in Table 2.

[0109] Example 3

[0110] The embodiment provides a welding method of a stainless steel target assembly, and the welding method comprises the following steps:

[0111] The first wire and the second wire are arranged alternately on the welding surface of the infiltrated back plate, then the infiltrated stainless steel target is buckled, then pressure soldering cooling is performed, and finally a stainless steel target assembly is obtained;

[0112] The material of the first wire is different from that of the second wire; the surface roughness of the first wire is greater than that of the second wire.

[0113] The first wire is an aluminum wire; and the second wire is a nickel wire.

[0114] The surface roughness of the first wire is 70 μm; and the surface roughness of the second wire is 20 μm.

[0115] The diameter of the first wire is 0.5 mm; and the diameter of the second wire is 0.5 mm.

[0116] The infiltrated back plate is obtained by sequentially performing first nickel plating and first infiltration on the welding surface of the back plate; the surface roughness of the welding surface of the back plate is 3.2 μm; the thickness of the nickel layer obtained by the first nickel plating is 8 μm; the first infiltration is performed by using a solder; the solder comprises an indium solder; the temperature of the first infiltration is 300 ℃; the temperature increasing rate of the first infiltration is 3 ℃ / min; the time of the first infiltration is 20 min; and the first infiltration is performed 3 times.

[0117] The infiltrated stainless steel target is obtained by sequentially performing second nickel plating and second infiltration on the welding surface of the stainless steel target; the surface roughness of the welding surface of the stainless steel target is 10 μm; the thickness of the nickel layer obtained by the second nickel plating is 20 μm; the second infiltration is performed by using a solder; the solder is an indium solder; the temperature of the second infiltration is 300 ℃; the temperature increasing speed of the second infiltration is 3 ℃ / min; the time of the second infiltration is 10 min; and the second infiltration is performed for 3 times.

[0118] The performance of the obtained target assembly is shown in Table 2.

[0119] In the used target assembly, the target is a strip-shaped target, and the back plate corresponds to a strip-shaped back plate. At this time, the target and the back plate are both rectangular, the length of the target is 400 mm, the width of the target is 200 mm, the length of the back plate is 430 mm, the width of the back plate is 230 mm, the radial distance between the adjacent first wire and the second wire is 15% of the diameter of the target, and at this time, the wire used is a rectangular ring wire.

[0120] Example 4

[0121] The embodiment provides a welding method of a stainless steel target assembly, and the welding method comprises the following steps:

[0122] The first wire and the second wire are arranged alternately on the welding surface of the infiltrated back plate, and then the infiltrated stainless steel target is buckled, and then pressure soldering cooling is performed to obtain a stainless steel target assembly;

[0123] The material of the first wire is different from that of the second wire; the surface roughness of the first wire is greater than that of the second wire.

[0124] The first wire is a zinc wire; and the second wire is a copper wire.

[0125] The surface roughness of the first wire is 100 μm; and the surface roughness of the second wire is 30 μm.

[0126] The diameter of the first wire is 0.3 mm; and the diameter of the second wire is 0.3 mm.

[0127] The infiltrated back plate is obtained by sequentially performing first nickel plating and first infiltration on the welding surface of the back plate; the surface roughness of the welding surface of the back plate is 1.6 μm; the thickness of the nickel layer obtained by the first nickel plating is 12 μm; the first infiltration is performed by using a solder; the solder comprises an indium solder; the temperature of the first infiltration is 200 ℃; the temperature increasing speed of the first infiltration is 5 ℃ / min; the time of the first infiltration is 10 min; and the first infiltration is performed for 3 times.

[0128] The infiltrated stainless steel target is obtained by sequentially performing second nickel plating and second infiltration on the welding surface of the stainless steel target; the surface roughness of the welding surface of the stainless steel target is 5 μm; the thickness of the nickel layer obtained by the second nickel plating is 10 μm; the second infiltration is performed by using a solder; the solder is an indium solder; the temperature of the second infiltration is 200 °C; the temperature rising speed of the second infiltration is 5 °C / min; the time of the second infiltration is 20 min; and the second infiltration is performed 5 times.

[0129] The performance of the obtained target assembly is shown in Table 2.

[0130] In the used target assembly, the target is a circular target, the back plate corresponds to a circular back plate, the diameter of the target is 350 mm, the diameter of the back plate is 431 mm, and the radial spacing between the adjacent first wire and the second wire is 14% of the diameter of the target circle. At this time, the wire used is a circular ring wire.

[0131] Comparative Example 1

[0132] The difference from Example 1 is only that the first wire is replaced by a copper wire, but other parameters remain unchanged, that is, only the material is changed.

[0133] The performance of the obtained target assembly is shown in Table 2.

[0134] Comparative Example 2

[0135] The difference from Example 1 is only that the second wire is replaced by an aluminum wire, but other parameters remain unchanged, that is, only the material is changed.

[0136] The performance of the obtained target assembly is shown in Table 2.

[0137] Comparative Example 3

[0138] The difference from Example 1 is only that the surface roughness of the first wire and the second wire is set to 80 μm.

[0139] The performance of the obtained target assembly is shown in Table 2.

[0140] Comparative Example 4

[0141] The difference from Example 1 is only that the surface roughness of the first wire and the second wire is set to 24 μm.

[0142] The performance of the obtained target assembly is shown in Table 2.

[0143] Comparative Example 5

[0144] The difference from Example 1 is only that the surface roughness of the first wire and the second wire is replaced, that is, the roughness of the first wire is 24 μm, and the surface roughness of the second wire is 80 μm.

[0145] The performance of the obtained target assembly is shown in Table 2.

[0146] The nickel plating process in the above embodiment is performed by using a chemical nickel plating solution, in which the concentration of nickel sulfate (NiSO4·7H2O) is maintained at 30 g / L, and the content of sodium hypophosphite is 30 g / L; the loading of the plating solution is 1 dm 2 / L; the temperature of the plating solution is 90℃, and the working temperature of the solution is maintained within ±2℃ during the chemical nickel plating process; the pH value of the plating solution is adjusted and maintained at 4.8; the sluice and the plating solution are from Shanghai Xinyang Semiconductor Materials Co., Ltd. The plating film time is selected according to the required thickness of the nickel layer; after loading and clamping the indium material with the same thickness as the wire diameter, 15 kN pressure is applied, and cooling is performed by means of preheating by immersion and cooling in the furnace to realize welding.

[0147] The welding bonding effect is verified by C-SCAN detection, and the detection conditions are shown in Table 1, and the results are shown in Table 2.

[0148] Table 1

[0149]

[0150] Table 2

[0151] Welding bond rate / % Welding strength / MPa Example 1 100 8.7 Example 2 100 8.6 Example 3 100 9.5 Example 4 100 8.2 Comparative Example 1 86.7 5.1 Comparative Example 2 88.4 5.7 Comparative Example 3 83.6 5.4 Comparative Example 4 84.5 6.1 Comparative Example 5 76.5 5.4

[0152] It can be seen from the results of the above embodiments that the welding method provided by the present application realizes efficient welding of the stainless steel target and the back plate by using the cooperation between the specific wires, the bonding rate of the target and the back plate after welding is obviously improved, which can reach 100%, the welding strength can reach more than 8 MPa, and the use performance of the stainless steel target assembly is significantly improved, which is beneficial to solving the electromagnetic compatibility problem by electromagnetic shielding.

[0153] It is declared that the detailed structural features of the present application are illustrated by the above embodiments, but the present application is not limited to the above detailed structural features, that is, it does not mean that the present application must rely on the above detailed structural features to be implemented. It should be understood by those skilled in the art that any improvement of the present application, equivalent replacement of the components selected by the present application, increase of auxiliary components, selection of specific modes, etc. fall within the protection scope and disclosure scope of the present application.

[0154] The preferred embodiments of the present application are described in detail above, but the present application is not limited to the specific details in the above embodiments, and various simple modifications can be made to the technical solutions of the present application within the technical concept scope of the present application, and these simple modifications all belong to the protection scope of the present application.

[0155] It should be further noted that each of the various technical features described in the above embodiments can be combined with any other technical features in any suitable manner, and the present application is not limited to the combinations explicitly described herein, in order to avoid unnecessary repetition, the present application will not describe each possible combination.

[0156] Furthermore, any combination of the various embodiments of the present application can be made, as long as it does not deviate from the spirit of the present application, it should also be considered as disclosed by the present application.

Claims

1. A welding method for a stainless steel target assembly, characterized in that, The welding method includes: Alternating first and second wires are set on the welding surface of the back plate after impregnation, and then they are fastened to the impregnated stainless steel target material, and pressure brazing and cooling are performed to obtain the stainless steel target material assembly. The first and second filaments are made of different materials; the surface roughness of the first filament is greater than that of the second filament; the vertical distance between adjacent first and second filaments is 10-15% of the equivalent circle diameter of the target material.

2. The welding method as described in claim 1, characterized in that, The first wire material includes aluminum wire and / or zinc wire.

3. The welding method as described in claim 1, characterized in that, The second wire material includes copper wire and / or nickel wire.

4. The welding method as described in claim 1, characterized in that, The surface roughness of the first filament is 70-100 μm.

5. The welding method as described in claim 1, characterized in that, The surface roughness of the second filament is 20-30 μm.

6. The welding method as described in claim 1, characterized in that, The diameter of the first filament is 0.3-0.5 mm.

7. The welding method as described in claim 1, characterized in that, The diameter of the second filament is 0.3-0.5 mm.

8. The welding method as described in claim 1, characterized in that, The backplate is obtained by sequentially performing a first nickel plating and a first wetting process on the welding surface of the backplate.

9. The welding method as described in claim 8, characterized in that, The surface roughness of the welding surface of the back plate is 1.6-3.2 μm.

10. The welding method as described in claim 8, characterized in that, The thickness of the nickel layer obtained by the first nickel plating is 8-12 μm.

11. The welding method as described in claim 8, characterized in that, The first wetting is performed using brazing filler metal.

12. The welding method as described in claim 11, characterized in that, The solder includes indium solder.

13. The welding method as described in claim 8, characterized in that, The temperature of the first immersion is 200-300℃.

14. The welding method as described in claim 8, characterized in that, The heating rate of the first impregnation is 3-5℃ / min.

15. The welding method as described in claim 8, characterized in that, The first soaking time is 10-20 minutes.

16. The welding method as described in claim 8, characterized in that, The first immersion is performed at least three times.

17. The welding method as described in claim 1, characterized in that, The stainless steel target material after impregnation is obtained by sequentially performing a second nickel plating and a second impregnation on the welding surface of the stainless steel target material.

18. The welding method as described in claim 17, characterized in that, The surface roughness of the stainless steel target welding surface is 5-10 μm.

19. The welding method as described in claim 17, characterized in that, The thickness of the nickel layer obtained by the second nickel plating is 10-20 μm.

20. The welding method as described in claim 17, characterized in that, The second impregnation is performed using brazing filler metal.

21. The welding method as described in claim 20, characterized in that, The solder includes indium solder.

22. The welding method as described in claim 17, characterized in that, The temperature for the second immersion is 200-300℃.

23. The welding method as described in claim 17, characterized in that, The heating rate for the second impregnation is 3-5℃ / min.

24. The welding method as described in claim 17, characterized in that, The second soaking time is 10-20 minutes.

25. The welding method as described in claim 17, characterized in that, The second immersion shall be performed at least three times.

Images