Laminated assembly, method for preparing laminated assembly and vehicle

Abstract

The present application relates to a laminated component, a method for preparing the laminated component, and a vehicle. The laminated component includes a first supporting layer and a first conductive layer, the first conductive layer is arranged on the first supporting layer, and at least one blocking groove is arranged on the first conductive layer, and the at least one blocking groove separates the first conductive layer to form a plurality of conductive areas electrically isolated from each other; each conductive area includes a sub-connection area and a sub-functional area arranged adjacent to each other; each blocking groove includes a first groove section, a transition groove section, and a second groove section connected in sequence; the first groove section is electrically isolated and arranged between the sub-connection areas of two adjacent conductive areas separated by the blocking groove; the second groove section is electrically isolated and arranged between the sub-functional areas of two adjacent conductive areas separated by the blocking groove; wherein the groove width of the transition groove section is respectively greater than the groove width of the first groove section and the groove width of the second groove section. The laminated component uses the blocking groove to electrically isolate two adjacent conductive areas, which can reduce the probability of current shunting when the current flows through the blocking groove.

Description

Technical Field

[0001] The present application relates to the technical field of laminated assemblies, and in particular to laminated assemblies, methods for preparing laminated assemblies, and vehicles. Background Art

[0002] Glass with multiple functions is becoming more and more popular in the market, among which glass with zoning control function is more popular. The zoning control function can be understood as dividing the glass into multiple light-transmitting areas, each of which can be controlled separately. For example, one of the light-transmitting areas can be dark, and another light-transmitting area can be transparent, so as to display different states according to user needs.

[0003] In actual use, glass with zone control function is prone to the phenomenon that when a certain light-transmitting area is electrically controlled, another light-transmitting area is also controlled, thus affecting the user's operating experience. Summary of the invention

[0004] Based on this, it is necessary to provide a laminated component, a method for preparing a laminated component, and a vehicle to address the problem of electrical connection between mutually independent light-transmitting areas.

[0005] A laminated assembly comprising:

[0006] a first supporting layer;

[0007] A first conductive layer, disposed on the first supporting layer, wherein at least one blocking groove is disposed on the first conductive layer, and the at least one blocking groove separates the first conductive layer into a plurality of conductive areas electrically isolated from each other;

[0008] Each of the conductive areas includes a sub-electrical connection area and a sub-functional area that are adjacently arranged; each of the blocking grooves includes a first groove section, a transition groove section, and a second groove section that are sequentially connected;

[0009] The first slot section is electrically isolated and arranged between the sub-electrical areas of two adjacent conductive areas separated by the blocking slot; the second slot section is electrically isolated and arranged between the sub-functional areas of two adjacent conductive areas separated by the blocking slot;

[0010] Wherein, the groove width of the transition groove section is respectively larger than the groove width of the first groove section and the groove width of the second groove section.

[0011] In one embodiment, the sub-connection area and the sub-functional area of ​​each conductive area are distributed along the first direction, the sub-connection areas of two adjacent conductive areas are arranged side by side along the second direction, and the sub-functional areas of two adjacent conductive areas are arranged side by side along the second direction;

[0012] The second direction intersects with the first direction.

[0013] In one embodiment, the first slot segments of each of the sub-power connection areas extend along the second direction and are arranged at intervals in the first direction, and the second slot segments of each of the sub-functional areas extend along the first direction and are arranged at intervals in the second direction.

[0014] In one of the embodiments, in the orthographic projection on the first supporting layer, a section of the first slot section of each of the sub-connection regions close to the transition slot section is in an arc-shaped structure.

[0015] In one embodiment, the outer ring radius of the arc-shaped structure is r, 1mm≤r≤10mm.

[0016] In one embodiment, the transition groove section is located between the arc-shaped structure of the first groove section and the second groove section, and the groove width of the transition groove section is L, 0.2mm≤L≤0.8mm.

[0017] In one embodiment, the slot width of the first slot section is greater than the slot width of the second slot section.

[0018] In one embodiment, the stacked component further includes an electrode layer, which is used to electrically connect each of the sub-power connection areas and the power connection pins. When projected on the first support layer, the projection area of ​​the electrode layer is smaller than the projection area of ​​the first conductive layer.

[0019] A method for preparing a laminated component, comprising:

[0020] Manufacturing a first workpiece, wherein the first workpiece comprises a first conductive layer and a first supporting layer, wherein the first conductive layer is disposed on the first supporting layer;

[0021] Processing at least one first groove segment penetrating through the first conductive layer on the first workpiece;

[0022] Processing at least one transition groove segment and at least one second groove segment penetrating through the first conductive layer on the first processed part to obtain a second processed part;

[0023] Wherein, each of the transition grooves is connected between a first groove section and a second groove section in a one-to-one correspondence, and the groove width of the transition groove section is respectively greater than the groove width of the first groove section and the groove width of the second groove section.

[0024] In one embodiment, in the manufacturing of the first processed part, the first processed part includes a first conductive layer and a first supporting layer, and after the first conductive layer is disposed on the first supporting layer, the method further includes:

[0025] forming an electrode layer in a first region of the first workpiece;

[0026] The step of machining at least one first groove segment penetrating through the first conductive layer on the first machining piece comprises:

[0027] At least one first groove segment penetrating the first conductive layer and the electrode layer is processed in a first region of the first processing piece.

[0028] In one embodiment, after processing at least one first groove segment penetrating the first conductive layer on the first workpiece, the method further includes:

[0029] An electrode layer is formed on the first conductive layer located in a first region of the first workpiece and between adjacent first slot segments.

[0030] In one embodiment, at least one transition groove segment and at least one second groove segment penetrating the first conductive layer are processed on the first processed part to obtain the second processed part, comprising:

[0031] At least one transition groove segment penetrating the first conductive layer is processed in the second region of the first workpiece, and at least one second groove segment penetrating the first conductive layer is processed in the third region of the first workpiece; wherein the first region, the second region and the third region are sequentially connected in the first direction.

[0032] In one embodiment, the obtaining of the first processed part, the manufacturing of the first processed part, the first processed part comprising a first conductive layer and a first supporting layer, the first conductive layer being disposed on the first supporting layer, comprises:

[0033] The first processed part includes a functional layer, a second conductive layer and a second supporting layer. The functional layer is arranged on a side of the first conductive layer away from the first supporting layer. The second conductive layer and the second supporting layer are sequentially stacked on a side of the functional layer away from the first conductive layer.

[0034] In one embodiment, after processing at least one transition groove segment and at least one second groove segment penetrating the first conductive layer on the first processed part to obtain the second processed part, the process further includes:

[0035] Along the stacking direction of the stacked component, stacking a functional layer and a second conductive layer in sequence on the second processed piece;

[0036] Disposing a first supporting layer on a side of the first conductive layer away from the functional layer, and disposing a second supporting layer on a side of the second conductive layer away from the functional layer;

[0037] A first transparent substrate is disposed on a side of the first supporting layer away from the functional layer, and a second transparent substrate is disposed on a side of the second supporting layer away from the functional layer.

[0038] A vehicle comprises a vehicle body and the above-mentioned laminated assembly, wherein the laminated assembly is installed on the vehicle body.

[0039] The stacked assembly, the method for preparing the stacked assembly and the vehicle, use the first slot section of the blocking slot to electrically isolate the sub-connection areas of two adjacent conductive areas, and the second slot section of the blocking slot to electrically isolate the sub-functional areas of two adjacent conductive areas. When each sub-connection area is energized, the current flowing into each sub-connection area can flow to the corresponding sub-functional area, and the user can control the sub-functional area electrically connected to it by controlling each sub-connection area. Since there is a height difference between the first slot section and the second slot section, a transition slot section is set between the first slot section and the second slot section as a buffer, so that its slot width is respectively greater than the slot width of the first slot section and the slot width of the second slot section, and is used to connect the first slot section and the second slot section, thereby improving the electrical isolation capability of the blocking slot, reducing the shunting when the current flows through the transition slot section, resulting in a part of the current flowing to the sub-functional area of ​​the first conductive area and the other part of the current flowing to the sub-functional area of ​​the second conductive area, thereby causing the probability of the phenomenon that the sub-connection area of ​​the first conductive area can simultaneously electrically control the sub-functional area of ​​the first conductive area and the sub-functional area of ​​the second conductive area. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A cross-sectional view of the first conductive layer and the first supporting layer of a stacked component provided in some embodiments of the present application.

[0041] Figure 2 A top view of a first conductive layer of a stacked assembly provided in some embodiments of the present application.

[0042] Figure 3 A top view of a first conductive layer of a stacked assembly provided in some other embodiments of the present application.

[0043] Figure 4 A top view of a first conductive layer of a stacked component provided in some further embodiments of the present application.

[0044] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0045] Figure 6 for Figure 4 A partial enlarged view of point B in the middle.

[0046] Figure 7 A cross-sectional view of a stacked assembly provided for some embodiments of the present application.

[0047] Figure 8 for Figure 7 A partial enlarged view of point C in the middle.

[0048] Fig. 9 A top view of a stacked assembly provided for some embodiments of the present application.

[0049] Fig.10 A cross-sectional view of a stacked assembly provided for some embodiments of the present application includes only a first conductive layer and a first supporting layer.

[0050] Description of reference numerals:

[0051] 10. First supporting layer; 20. First conductive layer; 20a. Conductive area; 21. Blocking groove; 211. First groove section; 212. Transition groove section; 213. Second groove section; 22. Sub-connection area; 221. Electrode sheet; 23. Sub-functional area; 24. First connection pin; 30. Electrode layer; 40. Functional layer; 50. Second conductive layer; 51. Second connection pin; 60. Second supporting layer; 70. Connection piece; 80. First transparent substrate; 90. Second transparent substrate; 91. Adhesive layer; a. First area; b. Second area; c. Third area; X. First direction; Y. Second direction; 100. Laminated component. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0053] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0055] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0056] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0057] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0058] See also Figure 1 and Figure 2 Some embodiments of the present application provide a stacked component 100. The stacked component 100 includes a first support layer 10 and a first conductive layer 20. The first conductive layer 20 is disposed on the first support layer 10, and at least one blocking groove 21 is disposed on the first conductive layer 20. The at least one blocking groove 21 separates the first conductive layer 20 to form a plurality of conductive areas 20a electrically isolated from each other.

[0059] Each conductive area 20a includes a sub-connection area 22 and a sub-functional area 23 that are adjacently arranged; each blocking groove 21 includes a first groove section 211, a transition groove section 212 and a second groove section 213 that are connected in sequence; the first groove section 211 is electrically isolated and arranged between the sub-connection areas 22 of two adjacent conductive areas 20a separated by the blocking groove 21; the second groove section 213 is electrically isolated and arranged between the sub-functional areas 23 of two adjacent conductive areas 20a separated by the blocking groove 21; the transition groove section 212 is electrically isolated and arranged between the two adjacent conductive areas 20a separated by the blocking groove 21; wherein the groove width of the transition groove section 212 is greater than the groove width of the first groove section 211 and the groove width of the second groove section 213.

[0060] The material of the first conductive layer 20 is not limited to conductive materials such as indium tin oxide (ITO). The sub-connection area 22 is an area that can be connected to an external power source. For example, the sub-connection area 22 can be provided with an electrode sheet. One end of the wire is electrically connected to the electrode sheet of the sub-connection area 22, and the other end is electrically connected to an external power source. Then, an external current can be passed into the sub-connection area 22, and then flow to the sub-functional area 23 through the sub-connection area 22.

[0061] The blocking groove 21 can divide the first conductive layer 20 into two, three or more conductive areas 20a that are electrically isolated from each other. The specific number of the conductive areas 20a can be determined according to actual conditions. The transition groove section 212 can be a protrusion that is protruding relative to the first groove section 211 and the second groove section 213. The orthographic projection shape of the transition groove section 212 on the first supporting layer 10 can be, but is not limited to, a rectangle, a circle, etc.

[0062] In the orthographic projection on the first supporting layer 10, the projected areas of the sub-functional areas 23 of each conductive area 20a may be equal or unequal. The sub-connection areas 22 of all conductive areas 20a may be concentrated and arranged at one part of the first conductive layer 20, or may be distributed at multiple parts of the first conductive layer 20.

[0063] For example, when the sub-contact areas 22 of the entire conductive area 20a are distributed at multiple locations of the first conductive layer 20, as shown in FIG. Figure 2 As shown, it is assumed that a cross is drawn on the first conductive layer 20 to divide it into four conductive areas 20a arranged in a square shape. The sub-functional area 23 of each conductive area 20a is located in the middle area of ​​the first conductive layer 20, and its sub-connection area 22 is located in the edge area of ​​the first conductive layer 20. Two adjacent sub-connection areas 22 are distributed along the second direction Y, and the remaining two adjacent sub-connection areas 22 are also distributed along the second direction Y. At this time, all the sub-connection areas 22 can be roughly divided into two parts, and the two parts are distributed in the first conductive layer 20 along the first direction X at intervals.

[0064] When the sub-connection areas 22 of all the conductive areas 20a are concentrated and arranged at one part of the first conductive layer 20, the sub-connection areas 22 of all the conductive areas 20a can be arranged side by side in the same direction, and the sub-functional areas 23 of all the conductive areas 20a are also arranged side by side in the same direction. Figure 3 In the example shown, the sub-connection areas 22 of all the conductive areas 20 a are arranged side by side along the second direction Y, and the sub-functional areas 23 of all the conductive areas 20 a are also arranged side by side along the second direction Y.

[0065] The stacked component 100 is described below in conjunction with an embodiment in which the projection areas of the sub-functional regions 23 of each conductive region 20 a are equal.

[0066] like Figure 1 As shown, along the stacking direction of the stacked component 100, the first support layer 10 is covered with a first conductive layer 20 having the same area as the first support layer 10. Figure 3 , the first conductive layer 20 can be divided into four conductive areas 20a, and two adjacent conductive areas 20a are separated by a blocking groove 21. Among them, the first groove section 211 of the blocking groove 21 is located between the sub-connection areas 22 of the two adjacent conductive areas 20a, and the second groove section 213 of the blocking groove 21 can be located between the sub-functional areas 23 of the two adjacent conductive areas 20a.

[0067] When each sub-power connection area 22 is energized, because the first slot section 211 of the blocking slot 21 can electrically isolate the sub-power connection areas 22 of two adjacent conductive areas 20a, and the second slot section 213 of the blocking slot 21 can electrically isolate the sub-functional areas 23 of two adjacent conductive areas 20a, the current flowing into each sub-power connection area 22 can flow to the corresponding sub-functional area 23. The user can control each sub-power connection area 22 to control the sub-functional area 23 electrically connected thereto.

[0068] In the process of current flowing from the sub-connection area 22 of the conductive area 20a to the sub-functional area 23, for example, the first conductive area and the second conductive area are arranged adjacently, and when the current starts to flow from the sub-connection area 22 of the first conductive area, the flow path of the current is the same as the shape of the blocking groove 21 arranged between the first conductive area and the second conductive area. That is, the current can pass through the first groove section 211, the transition groove section 212 and the second groove section 213 in sequence.

[0069] Since there is a height difference between the first slot section 211 and the second slot section 213, a transition slot section 212 is provided between the first slot section 211 and the second slot section 213 as a buffer, so that the slot width of the transition slot section 212 is larger than the slot width of the first slot section 211 and the slot width of the second slot section 213, which can improve the electrical isolation capability of the blocking slot 21, reduce the current shunting when flowing through the transition slot section 212, and cause part of the current to flow to the sub-functional area 23 of the first conductive area and the other part of the current to flow to the sub-functional area 23 of the second conductive area, thereby resulting in the probability of the phenomenon that the sub-connection area 22 of the first conductive area can simultaneously electrically control the sub-functional area 23 of the first conductive area and the sub-functional area 23 of the second conductive area.

[0070] Furthermore, the blocking groove 21 is divided into three groove sections, and each groove section of the blocking groove 21 is used to electrically isolate different parts of two adjacent conductive areas 20a. The corresponding groove sections can be changed according to changes in different parts of the conductive area 20a to expand the application scope of the blocking groove 21 without affecting the electrical isolation effect of the blocking groove 21.

[0071] Please refer to Figure 4 In some embodiments, the sub-connection areas 22 and the sub-functional areas 23 of each conductive area 20a are distributed along the first direction X, the sub-connection areas 22 of two adjacent conductive areas 20a can be arranged side by side along the second direction Y, and the sub-functional areas 23 of two adjacent conductive areas 20a can be arranged side by side along the second direction Y; wherein the second direction Y intersects with the first direction X.

[0072] For example, Figure 4 As shown, the first conductive layer 20 is divided into four conductive areas 20 a, all of the conductive areas 20 a are sequentially distributed along the second direction Y, and their sub-contact areas 22 are arranged side by side along the second direction Y, and their sub-functional areas 23 are also arranged side by side along the second direction Y. In other words, the sub-contact areas 22 of all the conductive areas 20 a are all gathered at a certain part of the first conductive layer 20 .

[0073] The sub-connecting regions 22 of all the conductive regions 20 a are arranged at a certain position of the first conductive layer 20 , so as to facilitate operations on the sub-connecting regions 22 of all the conductive regions 20 a , such as sequentially arranging electrode sheets on each sub-connecting region 22 to electrically connect to an external power source, etc., which can reduce the difficulty of processing the sub-connecting regions 22 .

[0074] For a specific embodiment, please continue to refer to Figure 4 The first slot sections 211 of each sub-power connection area 22 may extend along the second direction Y and be arranged at intervals in the first direction X, and the second slot sections 213 of each sub-functional area 23 may extend along the first direction X and be arranged at intervals in the second direction Y.

[0075] exist Figure 4In the example shown, the first conductive layer 20 is divided into four conductive areas 20a, all of which are sequentially distributed along the second direction Y, and the sub-functional areas 23 and sub-connection areas 22 of all of the conductive areas 20a are also arranged side by side along the second direction Y. The sub-functional areas 23 and sub-connection areas 22 of each conductive layer are distributed along the first direction X, the second slot segment 213 disposed between two adjacent sub-functional areas 23 extends along the first direction X, and the first slot segment 211 disposed between two adjacent sub-connection areas 22 extends along the second direction Y.

[0076] In this way, the starting ends of all the first slot segments 211 are located on one side of the first conductive layer 20, and the starting end is arranged side by side with one of the sub-functional areas 23 arranged at the periphery of the first conductive layer 20 along the first direction X. The above-mentioned starting end can be understood as the current input end of the first conductive layer 20, so the starting end is usually provided with a component such as an electrode sheet 221 that can be electrically connected to an external power source. Compared with setting the starting end at other positions, setting the starting end at the above-mentioned position can reduce the size of the electrode sheet 221 and the like that need to be set as much as possible, and reduce the amount of wiring connected to the starting end.

[0077] See also Figure 4 and Figure 5 In some embodiments, in the orthographic projection on the first supporting layer 10, a section of the first slot section 211 of each sub-power-connecting area 22 close to the transition slot section 212 is in an arc-shaped structure. Compared with setting the section of the first slot section 211 close to the transition slot section 212 as a right angle, setting it as an arc-shaped structure can reduce the probability of explosion points occurring at this part due to excessive energy concentration.

[0078] like Figure 5 As shown, specifically, in some embodiments, the radius of the outer ring of the arc-shaped structure is r, and the value range of r is 1mm≤r≤10mm. r can be 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 10mm, etc., and the specific value of r can be changed according to actual conditions. When r is 5mm, the energy accumulated at the part of the first slot section 211 close to the transition slot section 212 is more appropriate, which can reduce the probability of explosion point occurring at this part due to excessive energy.

[0079] For more details, please refer to Figure 4 and Figure 5 In some embodiments, the transition groove section 212 is located between the arc-shaped structure of the first groove section 211 and the second groove section 213, and the groove width of the transition groove section 212 is L, and the value range of L is 0.2mm≤L≤0.8mm. The value of L can be 0.2mm, 0.5mm, 0.7mm, 0.8mm, etc., and the specific value of L can be changed according to actual conditions. When the value of L is 0.5mm, the transition groove section 212 can achieve the best effect.

[0080] Please refer to Figure 4 In some embodiments, the slot width of the first slot segment 211 is greater than the slot width of the second slot segment 213 .

[0081] During actual use of the stacked assembly 100, the sub-functional area 23 where the second slot section 213 is located is actually located in the light-transmitting area of ​​the entire stacked assembly 100, that is, the area where the user can visually observe changes in the stacked assembly 100. The sub-power connection area 22 where the first slot section 211 is located is actually located in the wiring area of ​​the entire stacked assembly 100, and is in a blocked state during use and cannot be seen by the user.

[0082] The width of the first slot section 211 of the blocking slot 21 is set to be greater than the width of the second slot section 213 of the blocking slot 21. On the one hand, the width of the second slot section 213 can be reduced as much as possible without affecting the electrical isolation effect of the blocking slot 21, so as to reduce the distance between two adjacent sub-functional areas 23. During the use of the stacked component 100, the probability of cracks between two adjacent sub-functional areas 23 can be reduced, and the visual effect of the stacked component 100 during use is beautified.

[0083] On the other hand, because voltage is lost in the process of current flowing from the sub-power connection area 22 to the sub-functional area 23, in order to allow enough current to flow to the sub-functional area 23, the slot width of the first slot segment 211 is set to be larger than the slot width of the second slot segment 213 of the blocking slot 21, so as to transmit as much current as possible, thereby realizing control of the area in the sub-functional area 23 that is far away from the sub-power connection area 22.

[0084] In summary, the above arrangement can reduce the probability of cracks between two adjacent sub-functional areas 23 without affecting the electrical isolation effect of the blocking groove 21, beautify the visual effect of the stacked component 100 when in use, and realize the control of the area in the sub-functional area 23 that is far away from the sub-power-connecting area 22.

[0085] like Figure 6 As shown, in some embodiments, the spacing between two adjacent first slot segments 211 is h1, and the value range of h1 is 2mm≤h1≤10mm. The value of h1 can be 2mm, 4mm, 5mm, 7mm, 8mm, 10mm, etc., and the specific value of h1 can be changed according to actual conditions. When the value of h1 is 4mm, the width of the first slot segment 211 can be as thin as possible without affecting the insulation effect of the first slot segment 211, so that the first slot segment 211 is visually inconspicuous.

[0086] Because the voltage drop of the sub-connection area 22 between two adjacent first slot segments 211 can gradually increase as the distance between the two adjacent first slot segments 211 decreases, the probability of excessive voltage drop can be reduced by controlling the distance between the two adjacent first slot segments 211 within a certain range.

[0087] Please refer to Figure 4 , Figure 6 and Figure 8 The stacked component 100 further includes an electrode layer 30 , which is used to electrically connect each sub-power connection area 22 and the power connection pins. When projected on the first supporting layer 10 , the projection area of ​​the electrode layer 30 is smaller than the projection area of ​​the first conductive layer 20 .

[0088] The electrode layer 30 can be made of a material that has both adhesive and conductive properties, such as silver paste. To distinguish the power pins on the electrode layer 30 from the power pins in other areas, the power pins on the electrode layer 30 can be named the first power pins 24 .

[0089] For example, Figure 8 As shown, the first power connection pin 24 can be a conductive copper sheet, and the first power connection pin 24 can be bonded to each sub-power connection area 22 by silver paste. Each first power connection pin 24 can also be electrically connected to a wire, and the wire is electrically connected to an external power source, so that the stacked component 100 can be powered. In the process of coating the electrode layer 30, the projected area of ​​the electrode layer 30 is smaller than the projected area of ​​the first conductive layer 20. Such a configuration can not only reduce the probability of the electrode layer 30 overflowing into the first groove section 211 and causing a short circuit, but also simplify the way in which each sub-power connection area 22 is electrically connected to the external power source.

[0090] Please continue to refer to Figure 7 In some embodiments, the stacked component 100 further includes a functional layer 40 and a second conductive layer 50. The functional layer 40 is located on a side of the first conductive layer 20 away from the first supporting layer 10. The second conductive layer 50 is located on a side of the functional layer 40 away from the first conductive layer 20. A second supporting layer 60 is also provided on the side of the second conductive layer 50 away from the functional layer 40.

[0091] The second conductive layer 50 includes a functional area and a power connection area. The functional area of ​​the second conductive layer 50 corresponds to the light-transmitting area of ​​the stacked component 100, and the power connection area of ​​the second conductive layer 50 corresponds to the wiring area of ​​the stacked component 100. In the orthographic projection on the second supporting layer 60, the projection area of ​​the functional area of ​​the second conductive layer 50 can cover the projection area of ​​all sub-functional areas 23, and the projection area of ​​the power connection area of ​​the second conductive layer 50 does not overlap with the projection area of ​​the sub-power connection area 22 of the first conductive layer 20. The power connection area is electrically connected to a second power connection pin 51, and the second power connection pin 51 and the first power connection pin 24 have different electrical properties.

[0092] The preparation material of the above-mentioned functional layer 40 is not limited to one or a combination of more than two of PDLC (polymer dispersed liquid crystal), GHLC (guest-host effect liquid crystal), EC (electrochromic device), SPD (suspended particle device), LC, LED, thermal insulation film, color-changing film, light-guiding film, display film, etc.

[0093] For example, in Figure 8 In the example shown, the first supporting layer 10, the first conductive layer 20, the functional layer 40, the second conductive layer 50 and the second supporting layer 60 are sequentially stacked along the stacking direction of the stacked component 100. In the orthographic projection on the first supporting layer 10, the projection range of the functional area of ​​the second conductive layer 50, the projection range of the light-transmitting area of ​​the first conductive layer 20 and the projection range of all the sub-functional areas 23 of the first conductive layer 20 all overlap, while the projection range of the power connection area of ​​the second conductive layer 50 and the projection range of the sub-power connection area 22 of the first conductive layer 20 do not overlap.

[0094] In the stacking direction of the stacked component 100, all the sub-connection areas 22 of the first conductive layer 20 are provided with avoidance spaces on the side facing the functional layer 40. That is, the first conductive layer 20 is provided with the first connection pins 24, and the side facing the functional layer 40 is provided with avoidance spaces.

[0095] Similarly, the side of the power connection area of ​​the second conductive layer 50 facing the functional layer 40 is also provided with an escape space. That is, the part of the second conductive layer 50 where the second power connection pin 51 is provided is provided with an escape space on the side facing the functional layer 40. Each escape space can respectively escape the component electrically connected to the first power connection pin 24 or the component electrically connected to the second power connection pin 51.

[0096] When currents with different electrical properties are passed through the first power pin 24 and the second power pin 51, the first conductive layer 20 and the second conductive layer 50 can generate an electric field, under the action of the electric field, the liquid crystal in the functional layer 40 can turn, so that the stacked component 100 presents different visual effects, such as fog or transparency, etc. Because each conductive area 20a of the first conductive layer 20 is electrically connected to a first power pin 24, the sub-functional area 23 electrically connected thereto can be controlled by the corresponding first power pin 24. It can also be understood that the light-transmitting area of ​​the stacked component 100 is divided into a plurality of mutually independent sub-light-transmitting areas, and each sub-light-transmitting area can be controlled separately.

[0097] like Fig. 9 As shown, in some embodiments, the stacked assembly 100 further includes a power connector 70, one end of which is electrically connected to the first power pin 24 and the second power pin 51, respectively, and the other end of the power connector 70 is used to electrically connect to an external power source. The power connector 70 can be understood as a plug, and the entire stacked assembly 100 can be powered by connecting the plug to an external power source.

[0098] See also Figure 7 and Figure 8 In some embodiments, the stacked component 100 further includes a first transparent substrate 80 and a second transparent substrate 90. Along the stacking direction of the stacked component 100, one of the first transparent substrate 80 and the second transparent substrate 90 is covered on the first supporting layer 10, and the other is covered on the second supporting layer 60.

[0099] For example, Figure 7 and Figure 8 As shown, the projection range of the first transparent substrate 80 and the projection range of the second transparent substrate 90 can be overlapped by the orthographic projection on the first transparent substrate 80, and the projection range of the first supporting layer 10 and the like all fall within the projection range of the first transparent substrate 80. An adhesive layer 91 can be provided between each transparent substrate and the supporting layer to bond the transparent substrate and the supporting layer together and to increase the bonding effect between the transparent substrate and the supporting layer.

[0100] It should be noted that the adhesive layer 91 can be made of adhesive materials such as PVB, PU and EVA, and the first transparent substrate 80 and the second transparent substrate 90 can both be ordinary glass.

[0101] like Fig.10 and Figure 4 As shown, some embodiments of the present application also provide a method for preparing a stacked assembly 100. The preparation method comprises:

[0102] Making a first workpiece, the first workpiece comprising a first conductive layer 20 and a first supporting layer 10, wherein the first conductive layer 20 is disposed on the first supporting layer 10;

[0103] Processing at least one first groove section 211 penetrating the first conductive layer 20 on the first workpiece;

[0104] Processing at least one transition groove section 212 and at least one second groove section 213 penetrating the first conductive layer 20 on the first processed part to obtain a second processed part;

[0105] Among them, each transition groove is connected between a first groove section 211 and a second groove section 213 in a one-to-one correspondence, and the groove width of the transition groove section 212 is greater than the groove width of the first groove section 211 and the groove width of the second groove section 213 .

[0106] In the actual preparation process, a first support layer 10 may be provided first, and a first conductive layer 20 of equal area may be covered on the surface of the first support layer 10 to obtain a first workpiece. Next, operations may be performed on the first conductive layer 20, such as etching, to etch a groove penetrating the first conductive layer 20 along a preset route in the first conductive layer 20 to form a blocking groove 21. The blocking groove 21 may include a first groove section 211, a transition groove section 212, and a second groove section 213 that are connected in sequence. When etching the transition groove section 212, the groove width of the transition groove section 212 is made larger than the groove width of the first groove section 211 and the groove width of the second groove section 213, thereby obtaining a second workpiece.

[0107] In this way, the first conductive layer 20 can be divided into several independent parts by the blocking grooves 21. For example, when the number of the etched grooves is one, the first conductive layer 20 is divided into two parts. When the number of the etched blocking grooves 21 is two, the first conductive layer 20 is divided into three parts, etc. Each part is divided into a sub-connection area 22 and a sub-functional area 23. Two adjacent sub-connection areas 22 are located on both sides of the first groove segment 211, and two adjacent sub-functional areas 23 are located on both sides of the second groove segment 213.

[0108] For example, please refer to Figure 2 After etching a blocking groove 21 along the first direction X and another blocking groove 21 along the second direction Y on the first conductive layer 20, the first conductive layer 20 can be divided into four conductive areas 20a arranged in a shape of a square. The sub-functional area 23 of each conductive area 20a is located in the middle area of ​​the first conductive layer 20, and the sub-connection area 22 is located in the edge area of ​​the first conductive layer 20. Two adjacent sub-connection areas 22 are distributed along the first direction X, and the remaining two adjacent sub-connection areas 22 are also distributed along the first direction X. In this way, the processing method of the first conductive layer 20 is simplified.

[0109] Please refer to Figure 4 In some embodiments, after the first conductive layer 20 is disposed on the first supporting layer 10 to obtain the first processed part, the method further includes:

[0110] forming an electrode layer 30 in a first region a of a first workpiece;

[0111] Processing at least one first groove section 211 penetrating the first conductive layer 20 on the first workpiece includes:

[0112] At least one first groove section 211 penetrating the first conductive layer 20 and the electrode layer 30 is processed in the first region a of the first workpiece.

[0113] Before processing the first workpiece, the first workpiece can be divided into a first area a and a second area b. The first area a is an area where wiring and other operations can be performed in subsequent processes, and the second area b corresponds to the light-transmitting area of ​​the stacked component 100, that is, the area that can change visually.

[0114] Before etching the first groove segment 211, an electrode layer 30 may be formed on the surface of the entire first region a, wherein the preparation method of the electrode layer 30 may be, but is not limited to, coating, printing or spraying processes, such as coating the surface of the first region a with silver paste to form the electrode layer 30. Subsequently, a whole large electrode sheet 221 may be arranged on the electrode layer 30, and then a groove (i.e., the first groove segment 211) penetrating the electrode sheet 221, the electrode layer 30 and the first conductive layer 20 may be etched on the surface of the silver paste. In this way, the electrode sheet 221, the electrode layer 30 and the first region a of the first conductive layer 20 are divided into a plurality of equal and independent blocks.

[0115] In this way, a whole electrode sheet 221 can be directly attached to the first region a. When etching the first region a, the electrode sheet 221, the electrode layer 30 and the first conductive layer 20 can be etched simultaneously, thus simplifying the operation steps.

[0116] Specifically, in some embodiments, when the electrode layer 30 is coated on the first region a of the first workpiece, a carbon dioxide laser etching technique may be used to form at least one first groove segment 211 penetrating the first conductive layer 20 on the first workpiece.

[0117] The electrode sheet 221 has a certain hardness, and the energy of carbon dioxide laser etching is higher than that of ultraviolet laser etching. Therefore, the electrode sheet 221 can be easily divided into several small electrode sheets 221, reducing the difficulty of dividing the electrode sheet 221.

[0118] In other embodiments, after processing at least one first groove segment 211 penetrating the first conductive layer 20 on the first workpiece, the method further includes: coating an electrode layer 30 on the first conductive layer 20 located in the first region a of the first workpiece and between adjacent first groove segments 211 .

[0119] After etching a groove (i.e., the first groove section 211) through the first conductive layer 20 in the first area a of the first workpiece, silver paste or the like can be coated on the unetched portion of the first area a as the electrode layer 30. After the silver paste coating is completed, operations such as attaching the electrode sheet 221 can be performed.

[0120] The area of ​​the area to be coated obtained after etching the first area a is smaller than the area of ​​the initial first area a, and each area to be coated is separated by the first groove section 211, which can reduce the probability of silver paste overflowing into the first groove section 211, connecting two adjacent sub-connection areas 22 and causing a short circuit in the conductive area.

[0121] In some embodiments, at least one transition groove segment 212 and at least one second groove segment 213 penetrating the first conductive layer 20 are processed on the first workpiece to obtain a second workpiece, including: at least one transition groove segment 212 penetrating the first conductive layer 20 is processed in the second area b located on the first workpiece, and at least one second groove segment 213 penetrating the first conductive layer is processed in the third area c of the first workpiece; wherein the first area a, the second area b and the third area c are connected in the first direction X.

[0122] When operating on the first conductive layer 20, the first groove segment 211 may be etched in the first region a first, the transition groove segment 212 may be etched in the second region b, and the second groove segment 213 may be etched in the third region c. The etching order of each region may also be reversed.

[0123] For example, Figure 4 As shown, when etching a single blocking groove 21, the second groove segment 213 may be etched in the third region along the first direction X, and then the transition groove segment 212 may be etched in the second region b to connect the transition groove segment 212 and the second groove segment 213. Subsequently, the first groove segment 211 may be etched in the first region a to connect the first groove segment 211 and the transition groove segment 212, wherein the first groove segment 211 may extend along the second direction Y. By analogy, the blocking groove 21 is repeatedly etched until a corresponding number of conductive areas 20a are obtained, thereby simplifying the processing method of each groove segment.

[0124] When preparing each groove segment of the barrier groove 21 , the steps of the processing technology can be determined according to actual conditions. The specific processing steps of the barrier groove 21 can be mainly divided into two steps or three steps.

[0125] Exemplarily, when the processing steps for preparing the barrier groove 21 are divided into two steps, in the case where the first area a is first coated with silver paste and then etched, the second groove segment 213 is etched in the third area by ultraviolet laser etching technology, and the transition groove segment 212 is etched in the second area b, and then the first groove segment 211 is etched in the first area a by carbon dioxide laser etching technology, so as to simultaneously penetrate the silver paste layer, the electrode sheet 221 attached to the silver paste layer, and the first area a of the first conductive layer 20.

[0126] In other embodiments, the first groove segment 211 can be etched in the first region a by using carbon dioxide laser etching technology, the transition groove segment 212 can be etched in the second region b, and the second groove segment 213 can be etched in the third region c by using ultraviolet laser etching technology, thereby obtaining the blocking groove 21.

[0127] When the processing steps for preparing the barrier groove 21 are divided into three steps, in the case where the first region a is first etched and then coated with silver paste, when etching a single barrier groove 21, the second groove segment 213, the transition groove segment 212 and the first groove segment 211 can be etched in the third region c, the second region b and the first region a by ultraviolet laser etching technology. That is, three discontinuous etchings are performed in the three regions.

[0128] In this way, the first region a of the first conductive layer 20 is first etched into a plurality of independent small regions, and then operations such as coating silver paste can be performed on each small region.

[0129] It should be noted that three discontinuous etchings may be performed when etching the first slot segment 211, the second slot segment 213 and the transition slot segment 212. Alternatively, the transition slot segment 212 may be etched in the same manner as the first slot segment 211 and the second slot segment 213, so that two discontinuous etchings may be performed when etching the first slot segment 211, the second slot segment 213 and the transition slot segment 212.

[0130] With such a configuration, it is possible to select which process to use for processing the first conductive layer 20 according to actual operating conditions, thereby enriching the process types.

[0131] In some embodiments, a first processed part is obtained, the first processed part includes a first conductive layer 20 and a first supporting layer 10, the first conductive layer 20 is arranged on the first supporting layer 10, including; the first processed part includes a functional layer 40, a second conductive layer 50 and a second supporting layer 60, the functional layer 40 is arranged on the side of the first conductive layer 20 away from the first supporting layer 10, and the second conductive layer 50 and the second supporting layer 60 are stacked in sequence on the side of the functional layer 40 away from the first conductive layer 20.

[0132] In other words, a first workpiece having a five-layer film structure including the first conductive layer 20 , the first supporting layer 10 , the functional layer 40 , the second conductive layer 50 and the second supporting layer 60 is first obtained, and then operations are performed on the first workpiece to obtain structures such as the first groove segment 211 .

[0133] In some embodiments, after processing at least one transition groove section 212 and at least one second groove section 213 penetrating the first conductive layer 20 on the first processed part to obtain the second processed part, the process further includes:

[0134] Along the stacking direction of the stacked component 100, the functional layer 40 and the second conductive layer 50 are sequentially stacked on the second processed piece;

[0135] A first supporting layer 10 is disposed on a side of the first conductive layer 20 away from the functional layer 40 , and a second supporting layer 60 is disposed on a side of the second conductive layer 50 away from the functional layer 40 ;

[0136] A first transparent substrate 80 is disposed on a side of the first supporting layer 10 away from the functional layer 40 , and a second transparent substrate 90 is disposed on a side of the second supporting layer 60 away from the functional layer 40 .

[0137] For example, after obtaining the second workpiece, the functional layer 40 may be firstly disposed in the light-transmitting area of ​​the second workpiece. After the functional layer 40 is disposed, the second conductive layer 50 may be disposed on the side of the functional layer 40 away from the second workpiece. In the orthographic projection on the second workpiece, the projection range of the second conductive layer 50 completely covers the functional layer 40 and has a non-overlapping area with the second workpiece.

[0138] After the second conductive layer 50 is disposed, the first supporting layer 10 may be disposed on the side of the first conductive layer 20 away from the functional layer 40, and the second supporting layer 60 may be disposed on the side of the second conductive layer 50 away from the functional layer 40. In the orthographic projection on the second workpiece, the projection range of the first supporting layer 10 coincides with the projection range of the first conductive layer 20, and the projection range of the second supporting layer 60 coincides with the projection range of the second conductive layer 50.

[0139] Then, a first transparent substrate 80 and a second transparent substrate 90 may be arranged, wherein the first transparent substrate 80 is arranged on the side of the first supporting layer 10 away from the functional layer 40, and the second transparent substrate 90 is arranged on the side of the second supporting layer 60 away from the functional layer 40. In the orthographic projection on the second workpiece, the projection range of the first transparent substrate 80 covers the first supporting layer 10 and the second supporting layer 60, and the projection range of the second transparent substrate overlaps with the projection range of the first transparent substrate 80.

[0140] In this way, a stacked assembly 100 can be obtained. The above preparation method can improve the connection stability between the film layers on the basis of simplifying the preparation method. It should be noted that the film layers can be connected together by gluing.

[0141] In addition, some embodiments of the present application further provide a vehicle. The vehicle includes a vehicle body and the above-mentioned laminated assembly 100, and the laminated assembly 100 is installed on the vehicle body. For the introduction of the laminated assembly 100, please refer to the above-mentioned contents, which will not be described in detail here. Because the vehicle includes the laminated assembly 100, the vehicle has the functions and beneficial effects of the laminated assembly 100 provided in the above-mentioned embodiments, which will not be described in detail here.

[0142] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0143] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laminated assembly, characterized in that: include: a first supporting layer; A first conductive layer, disposed on the first supporting layer, wherein at least one blocking groove is disposed on the first conductive layer, and the at least one blocking groove separates the first conductive layer into a plurality of conductive areas electrically isolated from each other; Each of the conductive areas includes a sub-electrical connection area and a sub-functional area that are adjacently arranged; each of the blocking grooves includes a first groove section, a transition groove section, and a second groove section that are sequentially connected; The first slot section is electrically isolated and arranged between the sub-electrical areas of two adjacent conductive areas separated by the blocking slot; the second slot section is electrically isolated and arranged between the sub-functional areas of two adjacent conductive areas separated by the blocking slot; Wherein, the groove width of the transition groove section is respectively greater than the groove width of the first groove section and the groove width of the second groove section; The stacked component further includes a functional layer and a second conductive layer. The functional layer is located on a side of the first conductive layer away from the first supporting layer, and the second conductive layer is located on a side of the functional layer away from the first conductive layer.

2. The stacked assembly according to claim 1, characterized in that: The sub-connection areas and the sub-functional areas of each of the conductive areas are distributed along the first direction, the sub-connection areas of two adjacent conductive areas are arranged side by side along the second direction, and the sub-functional areas of two adjacent conductive areas are arranged side by side along the second direction; The second direction intersects with the first direction.

3. The stacked assembly according to claim 2, characterized in that: The first slot sections of each of the sub-power connection areas extend along the second direction and are arranged at intervals in the first direction, and the second slot sections of each of the sub-functional areas extend along the first direction and are arranged at intervals in the second direction.

4. The stacked assembly according to claim 2, characterized in that: In the orthographic projection on the first supporting layer, a section of the first slot section of each of the sub-connection regions close to the transition slot section is in an arc-shaped structure.

5. The stacked assembly according to claim 4, characterized in that: The outer ring radius of the arc-shaped structure is r, 1mm≤r≤10mm.

6. The stacked assembly according to claim 4, characterized in that: The transition groove section is located between the arc-shaped structure of the first groove section and the second groove section, and the groove width of the transition groove section is L, 0.2mm≤L≤0.8mm.

7. The stacked assembly according to any one of claims 1 to 6, characterized in that: The groove width of the first groove section is greater than the groove width of the second groove section.

8. The stacked assembly according to any one of claims 1 to 6, characterized in that: The stacked assembly further comprises an electrode layer, which is used to electrically connect each of the sub-power connection areas and the power connection pins. When projected on the first support layer, the projection area of ​​the electrode layer is smaller than the projection area of ​​the first conductive layer.

9. A method for preparing a laminated component, characterized in that: include: Manufacturing a first workpiece, wherein the first workpiece comprises a first conductive layer and a first supporting layer, wherein the first conductive layer is disposed on the first supporting layer; Processing at least one first groove segment penetrating through the first conductive layer on the first workpiece; Processing at least one transition groove segment and at least one second groove segment penetrating through the first conductive layer on the first processed part to obtain a second processed part; Wherein, each of the transition grooves is connected between a first groove section and a second groove section in a one-to-one correspondence, and the groove width of the transition groove section is respectively greater than the groove width of the first groove section and the groove width of the second groove section.

10. The preparation method according to claim 9, characterized in that: In the manufacturing of the first processed piece, the first processed piece includes a first conductive layer and a first supporting layer, and after the first conductive layer is disposed on the first supporting layer, the method further includes: forming an electrode layer in a first region of the first workpiece; The step of machining at least one first groove segment penetrating through the first conductive layer on the first machining piece comprises: At least one first groove segment penetrating the first conductive layer and the electrode layer is processed in a first region of the first processing piece.

11. The preparation method according to claim 9, characterized in that: After processing at least one first groove segment penetrating the first conductive layer on the first workpiece, the method further includes: An electrode layer is formed on the first conductive layer located in a first region of the first workpiece and between adjacent first slot segments.

12. The preparation method according to any one of claims 10-11, characterized in that: Processing at least one transition groove segment and at least one second groove segment penetrating the first conductive layer on the first processed part to obtain a second processed part, comprising: At least one transition groove segment penetrating the first conductive layer is processed in the second region of the first workpiece, and at least one second groove segment penetrating the first conductive layer is processed in the third region of the first workpiece; wherein the first region, the second region and the third region are sequentially connected in the first direction.

13. The preparation method according to claim 9, characterized in that: The first processed piece is manufactured, the first processed piece includes a first conductive layer and a first supporting layer, and the first conductive layer is arranged on the first supporting layer, including: The first processed part includes a functional layer, a second conductive layer and a second supporting layer. The functional layer is arranged on a side of the first conductive layer away from the first supporting layer. The second conductive layer and the second supporting layer are sequentially stacked on a side of the functional layer away from the first conductive layer.

14. The preparation method according to claim 9, characterized in that: After processing at least one transition groove section and at least one second groove section penetrating the first conductive layer on the first processed part to obtain the second processed part, the method further includes: Along the stacking direction of the stacked component, stacking a functional layer and a second conductive layer in sequence on the second processed piece; Disposing a first supporting layer on a side of the first conductive layer away from the functional layer, and disposing a second supporting layer on a side of the second conductive layer away from the functional layer; A first transparent substrate is disposed on a side of the first supporting layer away from the functional layer, and a second transparent substrate is disposed on a side of the second supporting layer away from the functional layer.

15. A vehicle, characterized in that: It comprises a vehicle body and a laminated assembly as claimed in any one of claims 1 to 8, wherein the laminated assembly is mounted on the vehicle body.

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