Method for manufacturing a curved structure

Abstract

This application relates to the field of display technology, and its embodiments provide a method for fabricating a curved structure. The method involves first bonding a stress-relieving film to a film to be formed, then hot-pressing to form the corresponding curved structure. Subsequently, a stress-relieving structure is formed on the stress-relieving film using a cutting process, and the film to be formed is then cut to obtain the final film. Since at least a portion of the stress-relieving structure is located in the second part of the stress-relieving film, and the stress-relieving structure is formed after the hot-pressing step, it can release the stress at the edges of the film to be formed after hot pressing, improving edge warping or deformation, and enhancing the cutting accuracy of the film to be formed. This, in turn, improves the bonding effect between the final film and the curved substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for fabricating curved structures. Background Technology

[0002] In related technologies, to facilitate the bonding of flexible display films to curved substrates, the flexible display film is usually pre-formed into the desired shape before being bonded to the curved substrate. However, there are situations where the pre-formed flexible display film and the curved substrate are difficult to align and bond. Summary of the Invention

[0003] Therefore, it is necessary to provide a method for fabricating curved structures to improve the bonding effect between flexible display films and curved substrates.

[0004] This application provides a method for fabricating a curved surface structure, including:

[0005] A stress-relieving membrane is adhered to a film to be formed to form a component to be formed; the stress-relieving membrane includes a first portion adhered to the film to be formed, and a second portion surrounding the first portion; the stress-relieving membrane is located on the side of the film to be pressed.

[0006] The component to be formed is subjected to hot pressing to form a curved surface structure in the corresponding area of ​​the component to be formed, thereby obtaining the component to be cut.

[0007] The component to be cut is cut to form a stress relief structure on the stress relief film, and a preset contour is formed on the edge of the film to be formed to obtain a formed film; at least a portion of the stress relief structure is located in the second portion.

[0008] In one embodiment, along the extending direction of the stress relief structure, there are unconnected portions between the portions of the stress relief membrane located on both sides of the stress relief structure.

[0009] In one embodiment, the stress-relieving membrane has a first surface that conforms to the film to be formed, and a second surface that is opposed to the film to be formed.

[0010] The stress relief structure is disposed on the first surface and / or the second surface.

[0011] In one embodiment, the stress relief structure is configured as a notch; or

[0012] The stress relief structure is constructed as a slit.

[0013] In one embodiment, the stress-relieving membrane has a first surface that conforms to the film to be formed, and a second surface that is opposed to the film to be formed.

[0014] The stress relief structure is constructed as a slit that runs through the first surface and the second surface.

[0015] In one embodiment, the stress relief membrane has multiple sides in the circumferential direction of the stress relief membrane;

[0016] At least one of the multiple sides is provided with the stress relief structure.

[0017] In one embodiment, the side of the stress relief membrane provided with the stress relief structure is defined as the target side;

[0018] Each target side is provided with a plurality of stress relief structures, which are arranged sequentially at intervals along the edge of the corresponding target side.

[0019] In one embodiment, the plurality of stress-relieving structures are arranged at equal intervals along the edges of the corresponding target sides; or

[0020] The plurality of stress relief structures are arranged at unequal intervals along the edges of the corresponding target sides.

[0021] In one embodiment, the stress relief structure includes a plurality of sub-stress relief structures arranged at intervals;

[0022] The arrangement direction of the plurality of sub-stress relief structures in the same stress relief structure intersects with the arrangement direction of the stress relief structure on the target side where the plurality of sub-stress relief structures are located.

[0023] In one embodiment, the arrangement direction of the plurality of sub-stress relief structures in the same stress relief structure is perpendicular to the arrangement direction of the stress relief structure on the target side where the plurality of sub-stress relief structures are located.

[0024] In one embodiment, the extension direction of the stress relief structure intersects with the arrangement direction of the stress relief structure on the corresponding target side.

[0025] In one embodiment, the extension direction of the stress relief structure is perpendicular to the arrangement direction of the stress relief structure on the corresponding target side.

[0026] In one embodiment, the stress relief structure is located in the second portion; or

[0027] One part of the stress relief structure is located in the first part, and the other part is located in the second part.

[0028] In one embodiment, the film to be formed is configured as a flexible display film; and / or

[0029] The stress relief membrane is made of materials including polyethylene terephthalate, polyimide, polyethylene naphthalate, polycarbonate, or acrylonitrile-butadiene-styrene copolymer.

[0030] In one embodiment, the stress-relieving membrane is bonded to the film to be formed using an adhesive.

[0031] The adhesive is configured to change its tackiness in response to environmental parameters, including temperature and / or light exposure; or

[0032] The release force between the stress-relieving membrane and the adhesive is greater than the release force between the membrane to be formed and the adhesive.

[0033] In one embodiment, the step of cutting the component to be cut to form a stress-relieving structure on the stress-relieving membrane, and forming a predetermined contour at the edge of the membrane to be formed to obtain a formed membrane, includes the following steps:

[0034] Remove the stress-relieving membrane from the molded membrane.

[0035] In the above-described method for fabricating curved structures, a stress-relieving film is first bonded to a film to be formed, followed by hot pressing to form the corresponding curved structure. Then, a stress-relieving structure is formed on the stress-relieving film using a cutting process, and the film to be formed is cut to obtain the final film. Since at least a portion of the stress-relieving structure is located in the second part of the stress-relieving film, and the stress-relieving structure is formed after the hot pressing step, it can release the stress at the edges of the film to be formed after hot pressing, improving edge warping or deformation, and enhancing the cutting accuracy of the film to be formed. This, in turn, improves the bonding effect between the final film and the curved substrate.

[0036] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0037] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0038] Figures 1a-1d This is a schematic diagram of the process for forming the film to be formed in one embodiment of the related technology;

[0039] Figure 2This is a partial structural diagram of the molded film in one embodiment of the related technology;

[0040] Figure 3 This is a schematic diagram of another part of the structure of the molded film in one embodiment of the related technology;

[0041] Figure 4 This is a flowchart illustrating a method for fabricating a curved surface structure according to an embodiment of this application;

[0042] Figure 5 This is a top view schematic diagram of the stress relief membrane being attached to the membrane to be formed in one embodiment of this application;

[0043] Figure 6 This is a schematic diagram of a stress relief structure formed on a stress relief membrane in one embodiment of this application;

[0044] Figure 7 This is a side view of the component to be formed in one embodiment of this application;

[0045] Figure 8 This is a schematic diagram of the first state of cutting processing in one embodiment of this application;

[0046] Figure 9 This is a schematic diagram of the second state of cutting processing in one embodiment of this application;

[0047] Figure 10 This is a side view of the component to be formed in another embodiment of this application;

[0048] Figure 11 This is a schematic diagram of the stress relief structure in one embodiment of this application;

[0049] Figure 12 This is a schematic diagram of a stress relief structure formed on a stress relief membrane in another embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] The film to be formed is m0, the film to be formed is m1, the curved part is m11, the edge part is m12, and the gaps are f1 and f2.

[0052] Mold 10, curved surface 11, hot pressing mechanism body 20;

[0053] Stress relief membrane S, first part S1, second part S2, stress relief structure x, sub-stress relief structure x1, first surface b1, second surface b2;

[0054] Film to be formed M0;

[0055] Adhesive J;

[0056] Cutting part Q;

[0057] First direction F1, second direction F2, third direction F3;

[0058] Extension length d, spacing h, thickness L1, L2;

[0059] Steps S110, S120, and S130. Detailed Implementation

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0061] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0062] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0064] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0065] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0066] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application and in its specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0067] Figures 1a-1d A schematic diagram of the process of forming the film m0 to be formed in one embodiment of the related technology is shown; for ease of explanation, only the content related to the embodiment of the related technology is shown.

[0068] In one embodiment of the related technology, since the curved substrate and the film to be formed m0 have different melting points and different structural expansion rates after lamination, the film to be formed m0 is usually pre-formed into the required shape before being laminated with the curved substrate. For example... Figure 1a As shown, a film m0 to be formed is provided. Figure 1b As shown, a mold 10 is provided, the mold 10 having a curved surface 11 (for illustration only). The mold 10 is placed at the corresponding position on the hot pressing mechanism body 20. Figure 1b Only a portion of the structure of the hot pressing mechanism body 20 is shown in the image. (For example...) Figure 1c As shown, the film m0 to be formed is placed on the side of the mold 10 away from the hot pressing mechanism body 20, and hot pressing is performed using a hot pressing head (not shown in the figure). Figure 1d As shown, the film to be formed m0 is formed into a molded film m1 by hot pressing. The molded film m1 has a curved part m11 and an edge part m12.

[0069] Figure 2 A partial structural schematic diagram of the molded film m1 in one embodiment of the related technology is shown; Figure 3 A schematic diagram of another part of the structure of the molded film m1 in one embodiment of the related technology is shown; for ease of explanation, only the content related to the embodiment of the related technology is shown.

[0070] Before bonding the molded film m1 to the curved substrate, the molded film m1 is cut to a size that fits the curved substrate. For example... Figure 2 As shown, at the position of the curved surface 11 of the mold 10, there is a gap (i.e., gap f1) between the curved portion m11 of the molding film m1 and the curved surface 11, and thus... Figure 3 As shown, this causes the edge m12 of the molded film m1 to warp (i.e., gap f2 appears) or deform, which affects the cutting accuracy when cutting the molded film m1 and affects the bonding between the molded film m1 and the curved substrate.

[0071] Based on this, the embodiments of this application improve the manufacturing method of the molded film to reduce the occurrence of warping or deformation at the edges of the molded film, thereby improving the quality of the molded film and its bonding effect. The following description, in conjunction with the relevant accompanying drawings and the content illustrated in some embodiments of this application, will further illustrate this.

[0072] Figure 4 A flowchart illustrating a method for fabricating a curved surface structure according to an embodiment of this application is shown; for ease of explanation, only content related to the embodiment of this application is shown.

[0073] In some embodiments, please refer to Figure 4 This application provides a method for fabricating a curved surface structure, including the following steps:

[0074] Step S110: The stress relief membrane is attached to the film to be formed to form the component to be formed; the stress relief membrane includes a first part attached to the film to be formed and a second part surrounding the first part; the stress relief membrane is located on the pressing side of the film to be formed.

[0075] Step S120: Perform hot pressing molding on the component to be molded to form a curved surface structure in the corresponding area of ​​the component to be molded, and obtain the component to be cut.

[0076] Step S130: Cut the component to be cut to form a stress relief structure on the stress relief film, and form a preset contour on the edge of the film to be formed to obtain a formed film; at least part of the stress relief structure is located in the second part.

[0077] In step S110, the stress relief membrane S is a membrane element used to relieve stress. The material of the stress relief membrane S may include polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), polycarbonate (PC), or acrylonitrile-butadiene-styrene copolymer (ABS). (Refer to reference...) Figure 5 , Figure 5 This illustration shows a top view of a stress-relieving membrane S bonded to a membrane M0 to be formed, according to one embodiment of this application. Figure 5 The stress-relieving membrane S is shown as a dotted line below the stress-relieving membrane S, and the following related illustrations can be understood in the same way, without further elaboration. The stress-relieving membrane S includes a first part S1 and a second part S2. The first part S1 is located in the middle region of the stress-relieving membrane S, and the second part S2 is located in the edge region of the stress-relieving membrane S. The first part S1 is used to bond the stress-relieving membrane M0. It can be understood that the area of ​​the stress-relieving membrane S is larger than that of the stress-relieving membrane M0, and it can cover the stress-relieving membrane M0, and has a portion that extends beyond the stress-relieving membrane M0 (and the second part S2). The stress-relieving membrane M0 can be placed on a bonding fixture (not shown in the figure), and the first region of the stress-relieving membrane S is bonded to the stress-relieving membrane M0 to form the component to be formed. The side to be pressed of the stress-relieving membrane M0 refers to the side away from the mold 10 shown in the related art embodiment, and in subsequent processes, the side to be pressed is also the side away from the curved substrate.

[0078] In step S120, the hot pressing molding method illustrated in the aforementioned related technical embodiments can be used for, for example... Figure 5 The component to be formed shown is subjected to hot pressing to obtain the component to be cut.

[0079] In step S130, the cutting process can employ laser cutting, which facilitates improved cutting accuracy for components with curved surfaces. The stress relief structure x can be located in the second part S2 of the stress relief membrane S, or it can be partially located in the first part S1 of the stress relief membrane S and partially located in the second part S2 of the stress relief membrane S. (Refer to reference...) Figure 6 , Figure 6 This illustration shows a schematic diagram of a stress-relieving structure x formed on a stress-relieving membrane S according to an embodiment of this application. Figure 6 This illustrates the case where the stress-relieving structure x is located in the second part S2.

[0080] For better understanding, please refer to the reference. Figure 7 , Figure 7 This paper shows a side view of the component to be formed according to an embodiment of the present application. It should be noted that... Figure 7The diagram shows the approximate location of the stress relief structure x, and does not imply that the stress relief structure x is actually installed on the component to be formed. The diagrams related to the stress relief structure x shown later can be understood with reference to this diagram, and will not be repeated here. The stress relief structure x can be located on either side of the curved portion of the stress relief membrane S. When the stress relief structure x is located in the second portion S2 of the stress relief membrane S, it is located on the side of the curved portion of the stress relief membrane S closer to the edge. When part of the stress relief structure x is located in the first portion S1 of the stress relief membrane S, and another part is located in the second portion S2 of the stress relief membrane S, the stress relief structure x can be located on both sides of the curved portion of the stress relief membrane S.

[0081] It is understandable that when the stress relief structure x is located in the second part S2 of the stress relief membrane S, it is more beneficial to improve the situation where the edge part of the molded membrane warps and deforms.

[0082] For example, in some embodiments, the part to be cut Q is cut after the component to be cut has cooled. This reduces the risk of the stress-relieving structure x expanding due to heat generated during thermoforming or heat still present in the part to be cut Q itself, thereby further reducing the risk of deformation of the film to be formed M0 during thermoforming. It is understood that after the component to be cut cools, the cooling stress present within the component can be released through the stress-relieving structure x, thereby improving the situation where the film to be formed M0 shrinks during the cooling process, leading to warping deformation. Furthermore, it can also reduce the impact of manufacturing tolerances in the mold 10 and the inherent stiffness of the film to be formed M0 itself. When the film to be formed M0 comprises multiple layers, the stress in each layer can also be released using the stress-relieving structure x.

[0083] When cutting components, refer to... Figure 8 , Figure 8 This diagram illustrates a first state of cutting using a cutting element Q according to an embodiment of this application. A stress-relieving structure x can be formed first, followed by cutting the film M0 to be formed. Alternatively, as... Figure 9 As shown, Figure 9 This diagram illustrates a second state of cutting using a cutting element Q in one embodiment of this application, which allows for the simultaneous cutting of the film to be formed M0 and the stress-relieving film S. The desired cutting process can be achieved by controlling the laser direction during laser cutting; no specific limitations are specified here.

[0084] Therefore, by first bonding the stress-relieving film S to the film to be formed M0, then hot-pressing to form the corresponding curved structure, and then forming the stress-relieving structure x on the stress-relieving film S through a cutting process, the film to be formed M0 is cut to obtain the formed film. Since at least a portion of the stress-relieving structure x is located in the second part S2 of the stress-relieving film S, and the stress-relieving structure x is formed after the hot-pressing step, it can release the stress at the edge of the film to be formed M0 after hot pressing, making the film to be formed M0 fit more tightly with the corresponding mold 10, improving the edge warping or deformation of the film to be formed M0, and improving the cutting accuracy of the film to be formed M0, thereby improving the bonding effect between the formed film and the curved substrate. Compared with the method of fixing the edge of the film to be formed M0 with tape, the time for applying and removing tape can be reduced, improving production efficiency.

[0085] It should be noted that the molded film in the embodiments of this application refers to the film after the hot pressing and cutting steps. Before the cutting step, it is referred to as the film to be molded M0. The film to be molded M0 in this application includes, but is not limited to, flexible display films, and may also be other film components, without specific limitations.

[0086] In some embodiments, please continue to refer to Figure 6 and Figure 7 Along the extension direction of the stress relief structure x, there are unconnected portions between the parts of the stress relief membrane S located on both sides of the stress relief structure x.

[0087] "The existence of unconnected parts" refers to the fact that in the region where a stress-relieving structure x exists, the stress-relieving membrane S can be considered as having parts separated by the stress-relieving structure x, with the stress-relieving structure x as the boundary. Because a weak region is formed at this separation, the relevant stress can be released from the weak region.

[0088] In some embodiments, please continue to refer to Figure 6 and Figure 7 The stress-relieving membrane S has a first surface b1 that adheres to the membrane M0 to be formed, and a second surface b2 that faces away from the membrane M0. The first surface b1 and the second surface b2 are disposed opposite each other along a first direction F1, where F1 is the thickness direction of the stress-relieving membrane S, F2 is the length direction of the stress-relieving membrane S, and F3 is the width direction of the stress-relieving membrane S. The first direction F1, the second direction F2, and the third direction F3 are perpendicular to each other. A stress-relieving structure x is disposed on the first surface b1 and / or the second surface b2. Figure 7For example, the illustration shows the case where the stress relief structure x is located on the second surface b2, that is, the stress relief structure x does not penetrate the first surface b1. Of course, the stress relief structure x can also be located on the second surface b2 without penetrating the first surface b1. It can be set according to specific usage requirements, and this application embodiment does not impose specific limitations on this.

[0089] In this way, the corresponding stress relief structure x can be flexibly set to meet different usage requirements.

[0090] In some embodiments, please continue to refer to Figure 6 and Figure 7 The stress relief structure x can be constructed as a notch; or, the stress relief structure x can be constructed as a slit. It can be understood that notches and slits are relative terms. A "notch" can be viewed as a groove opened on the corresponding surface, while a "slit" can be viewed as an opening on the corresponding surface that is narrower than a "notch." Based on the size of the stress relief structure in the first direction F1, a "slit" can be approximated as a cutting line or a cutting surface.

[0091] Figure 10 A side view of the component to be formed according to another embodiment of this application is shown; for ease of explanation, only the situation related to the embodiment of this application is shown.

[0092] In some embodiments, please refer to Figure 10 The stress-relieving membrane S has a first surface b1 that adheres to the membrane M0 to be formed, and a second surface b2 that faces away from the membrane M0 to be formed. The stress-relieving structure x is constructed as a slit that penetrates through the first surface b1 and the second surface b2. The "slit" can be understood in the same way as a "slit," but unlike a slit, it penetrates through the stress-relieving membrane S.

[0093] Thus, by constructing the stress relief structure x, a structure is partially removed or partially separated on the stress relief membrane S, thereby forming a weak area on the stress relief membrane S. In the process of stress transmission, the stress can be guided to the stress relief structure x and released through the stress relief structure x.

[0094] It is understandable that when the stress relief structure x is constructed as a slotted structure (slit or open), cutting time can be reduced and cutting efficiency can be improved.

[0095] In some embodiments, please continue to refer to Figure 6 The stress relief membrane S has multiple sides in its circumferential direction. At least one of the multiple sides is provided with a stress relief structure x. For example, the stress relief membrane S may have two sides disposed opposite to each other along a second direction F2, and two sides disposed opposite to each other along a third direction F3. Figure 6The diagram illustrates a case where stress relief structures x are provided on both sides of the stress relief membrane S along the second direction F2 and on both sides along the third direction F3.

[0096] In this way, the settings can be customized according to usage requirements to meet different stress relief needs. It is understandable that having stress relief structures x on each side of the stress relief membrane S is more conducive to achieving better stress relief effects and can further improve the aforementioned warping and deformation.

[0097] In some embodiments, please continue to refer to Figure 6 The side of the stress-relieving membrane S with stress-relieving structures x is defined as the target side. Multiple stress-relieving structures x are provided on each target side, and these multiple stress-relieving structures x are arranged sequentially and at intervals along the edge of the corresponding target side. For example, using... Figure 6 For example, the multiple stress relief structures x can be arranged at equal intervals along the edge of the corresponding target side. Alternatively, the multiple stress relief structures x can be arranged at unequal intervals along the edge of the corresponding target side.

[0098] It should be noted that the number of stress relief structures x on different sides can be the same or different. The stress relief structures x on different sides can be arranged at equal intervals or at unequal intervals. It is understandable that when stress relief structures x are provided on each side of the stress relief membrane S, and the stress relief structures x on each side are arranged at equal intervals, it is more conducive to releasing stress more evenly.

[0099] Figure 11 A schematic diagram of the stress relief structure x in one embodiment of this application is shown; Figure 12 A schematic diagram of a stress relief structure x formed on a stress relief membrane S is shown in another embodiment of this application; for ease of explanation, only the content related to the embodiments of this application is shown.

[0100] In some embodiments, please refer to Figure 11 The stress relief structure x includes multiple sub-stress relief structures x1 arranged at intervals. The arrangement direction of the multiple sub-stress relief structures x1 in the same stress relief structure x intersects with the arrangement direction of the stress relief structure x on the target side where the multiple sub-stress relief structures x1 are located. For example, the arrangement direction of the multiple sub-stress relief structures x1 in the same stress relief structure x is perpendicular to the arrangement direction of the stress relief structure x on the target side where the multiple sub-stress relief structures x1 are located. Figure 12The diagram illustrates that on each side of the same stress relief structure x, which is positioned opposite each other along the second direction F2, the arrangement direction of multiple sub-stress relief structures x1 within the same stress relief structure x is the second direction F2, and the arrangement direction of the stress relief structure x is the third direction F3. Of course, the arrangement direction of the multiple sub-stress relief structures x1 within the same stress relief structure x can also be at other angles to the arrangement direction of the stress relief structure x on the target side where the multiple sub-stress relief structures x1 are located; no specific restrictions are imposed here.

[0101] In this way, the corresponding stress relief structure x can be flexibly arranged to meet the usage requirements.

[0102] In some embodiments, please continue to refer to Figure 6 The extension direction of stress relief structure x intersects with the arrangement direction of stress relief structure x on the corresponding target side. For example, the extension direction of stress relief structure x may be perpendicular to the arrangement direction of stress relief structure x on the corresponding target side. Figure 6 For example, on each of the two sides opposite each other along the second direction F2, the extension direction of the stress relief structure x is the third direction F3, and the arrangement direction of the stress relief structure x is the second direction F2. Of course, the extension direction of the stress relief structure x and the arrangement direction of the stress relief structure x on the corresponding target side can also be set at other angles, and no specific restrictions are made here.

[0103] It is understandable that when the extension direction of the stress relief structure x on each side is consistent with the setting direction of that side, and the arrangement direction of the stress relief structure x is consistent with the setting direction of that side, it is more conducive to stress relief in conjunction with the direction on that side, and it is more conducive to improving the stress relief effect.

[0104] In some embodiments, please continue to refer to Figure 6 The extension length d of the stress relief structure x is 1 cm to 3 cm; and / or, along the edge direction of the corresponding target side, the spacing h of two adjacent stress relief structures x is 0.5 cm to 2.5 cm. For example, the extension length d can be 1 cm, 1.5 cm, 2 cm, or 3 cm, and the spacing h can be 0.5 cm, 1 cm, 1.5 cm, 1.8 cm, 2 cm, or 2.5 cm. Accordingly, the thickness L1 of the stress relief membrane S and the thickness L2 of the membrane to be formed M0 can be 50 mm to 250 mm. The thickness L1 of the stress relief membrane S and the thickness L2 of the membrane to be formed M0 can be the same or different, and the extension length d and the spacing h can be adjusted according to the thickness L1 of the stress relief membrane S and the thickness L2 of the membrane to be formed M0.

[0105] This not only helps to improve the aforementioned warping or deformation, but also improves cutting efficiency.

[0106] In some embodiments, after step S130, the stress relief film S can be removed from the molded film. For example, it can be removed after the molded film is bonded to the curved substrate, or it can be left unremoved and removed after the next process is completed. That is, the stress relief film S can be used to protect the molded film.

[0107] In some embodiments, please continue to refer to Figure 7 and Figure 10 The stress-relieving membrane S is bonded to the membrane M0 to be formed using adhesive J.

[0108] Adhesive J can be configured to change its viscosity in response to environmental parameters, including temperature and / or light exposure. That is, adhesive J can be a debonding adhesive. Adhesive J can be a UV-type debonding adhesive, which may include a base copolymer, crosslinking agent, oligomer, and photoinitiator, with a debonding exposure energy of 400~3000 mJ / cm². 2 Adhesive J can also be a heat-release adhesive, which may include a base copolymer, a crosslinking agent, and thermally expandable microcapsules. Adhesive J can be released by heating at 100°C to 120°C for 1 minute.

[0109] Of course, adhesive J can also be a low-viscosity pressure-sensitive adhesive, where the release force between the stress-relieving membrane S and adhesive J is greater than the release force between the membrane to be formed M0 and adhesive J. Adhesive J can be formulated from compounds such as elastomers, tackifying resins, plasticizers, and fillers. For example, adhesive J can include types such as natural rubber, styrene-butadiene rubber (SBR), and acrylic (acrylate copolymer). The viscosity of adhesive J can range from 200 cps to 10000 cps.

[0110] Since adhesive J is an existing adhesive and is not the focus of this application, its components will not be described in detail. It can be selected according to usage requirements, and this application does not impose specific limitations in this regard.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for fabricating a curved surface structure, characterized in that, include: The stress-relieving membrane is bonded to the membrane to be formed to form the component to be formed; The stress-relieving membrane includes a first portion that is adhered to the membrane to be formed, and a second portion surrounding the first portion; The stress relief membrane is located on the side of the membrane to be formed to be pressed, and the side to be pressed is the side away from the curved substrate; The component to be formed is subjected to hot pressing to form a curved surface structure in the corresponding area of ​​the component to be formed, thereby obtaining the component to be cut. The cooled component to be cut is cut to form a stress relief structure on the stress relief film, and a preset contour is formed at the edge of the film to be formed to obtain a formed film. At least a portion of the stress relief structure is located in the second portion; Remove the stress-relieving membrane from the molded membrane and attach the molded membrane to the curved substrate.

2. The method for fabricating a curved surface structure according to claim 1, characterized in that, Along the extending direction of the stress relief structure, there are unconnected portions between the portions of the stress relief membrane located on both sides of the stress relief structure.

3. The method for fabricating a curved surface structure according to claim 2, characterized in that, The stress relief membrane has a first surface that is in contact with the film to be formed, and a second surface that is away from the film to be formed. The stress relief structure is disposed on the first surface and / or the second surface.

4. The method for fabricating a curved surface structure according to claim 3, characterized in that, The stress relief structure is constructed with a notch; or The stress relief structure is constructed as a slit.

5. The method for fabricating a curved surface structure according to claim 2, characterized in that, The stress relief membrane has a first surface that is in contact with the film to be formed, and a second surface that is away from the film to be formed. The stress relief structure is constructed as a slit that runs through the first surface and the second surface.

6. The method for fabricating a curved surface structure according to any one of claims 1-5, characterized in that, The stress relief membrane has multiple sides in the circumferential direction of the stress relief membrane; At least one of the multiple sides is provided with the stress relief structure.

7. The method for fabricating a curved surface structure according to claim 6, characterized in that, The side of the stress relief membrane with the stress relief structure is defined as the target side; Each target side is provided with a plurality of stress relief structures, which are arranged sequentially at intervals along the edge of the corresponding target side.

8. The method for fabricating a curved surface structure according to claim 7, characterized in that, The plurality of stress relief structures are arranged at equal intervals along the edges of the corresponding target sides; or The plurality of stress relief structures are arranged at unequal intervals along the edges of the corresponding target sides.

9. The method for fabricating a curved surface structure according to claim 7, characterized in that, The stress relief structure includes multiple sub-stress relief structures arranged at intervals; The arrangement direction of the plurality of sub-stress relief structures in the same stress relief structure intersects with the arrangement direction of the stress relief structure on the target side where the plurality of sub-stress relief structures are located.

10. The method for fabricating a curved surface structure according to claim 9, characterized in that, The arrangement direction of the plurality of sub-stress relief structures in the same stress relief structure is perpendicular to the arrangement direction of the stress relief structure on the target side where the plurality of sub-stress relief structures are located.

11. The method for fabricating a curved surface structure according to claim 7, characterized in that, The extension direction of the stress relief structure intersects with the arrangement direction of the stress relief structure on the corresponding target side.

12. The method for fabricating a curved surface structure according to claim 11, characterized in that, The extension direction of the stress relief structure is perpendicular to the arrangement direction of the stress relief structure on the corresponding target side.

13. The method for fabricating a curved surface structure according to any one of claims 1-5, characterized in that, The stress relief structure is located in the second part; or One part of the stress relief structure is located in the first part, and the other part is located in the second part.

14. The method for fabricating a curved surface structure according to any one of claims 1-5, characterized in that, The film to be formed is configured as a flexible display film; and / or The stress relief membrane is made of materials including polyethylene terephthalate, polyimide, polyethylene naphthalate, polycarbonate, or acrylonitrile-butadiene-styrene copolymer.

15. The method for fabricating a curved surface structure according to any one of claims 1-5, characterized in that, The stress-relieving membrane is bonded to the membrane to be formed using an adhesive. The adhesive is configured to change its tackiness in response to environmental parameters, including temperature and / or light exposure; or The release force between the stress-relieving membrane and the adhesive is greater than the release force between the membrane to be formed and the adhesive.

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