Liner components and refrigerators

Abstract

The present application relates to the technical field of refrigerators and discloses an inner liner assembly, comprising: an inner liner having a refrigerator compartment internally configured; a windshield disposed within the inner liner and enclosing a dehumidification interlayer with a first sidewall of the inner liner, the dehumidification interlayer being in communication with the refrigerator compartment; a thermal insulation layer covering the outer surface of the inner liner and avoiding the first sidewall; a cold source portion at least partially attached to the outer surface of the thermal insulation layer and at least partially attached to the outer surface of the first sidewall, such that the cold source portion provides cooling to the first sidewall; and a semiconductor dehumidification module disposed within the dehumidification interlayer and comprising a cold-end heat sink and a hot-end heat sink. The cold-end heat sink is configured to dehumidify gas flowing from the refrigerator compartment into the dehumidification interlayer; the hot-end heat sink is disposed proximate the first sidewall to dissipate heat from the first sidewall. The inner liner assembly utilizes the first sidewall, which is at a lower temperature, to dissipate heat from the hot-end heat sink, thereby improving the heat dissipation effect of the hot-end heat sink and the dehumidification efficiency of the semiconductor dehumidification module. The present application also discloses a refrigerator.

Description

Technical Field

[0001] The present application relates to the technical field of refrigerators, for example, to an inner liner assembly and a refrigerator. Background Art

[0002] Refrigerated containers provide a low-temperature environment, maintaining it for extended periods even during power outages. They are widely used in fields such as medicine, cold-chain transportation, and food storage. To ensure the quality of refrigerated goods, the humidity inside the container must be maintained within a suitable range. Exceeding this range can cause the refrigerated items to become wet, potentially deteriorating or even damaging. Therefore, dehumidification is essential.

[0003] In related art, a refrigerator is equipped with an inner container, a dehumidification chamber, and a semiconductor dehumidification module disposed in the dehumidification chamber. The semiconductor dehumidification module includes a semiconductor cooling plate, a hot-end radiator disposed at the hot end of the semiconductor cooling plate, and a cold-end radiator disposed at the cold end of the semiconductor cooling plate. The cold-end radiator is provided with a cold-end cooling fan, which is used to direct the gas in the inner container through the cold-end radiator to dehumidify the gas. The hot-end radiator is provided with a hot-end cooling fan, which is used to accelerate the flow of gas around the hot-end radiator to dissipate heat from the hot-end radiator.

[0004] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0005] In the related art, the heat dissipation effect of the hot end radiator is poor, resulting in low dehumidification efficiency of the semiconductor dehumidification module. In addition, the heat emitted by the hot end radiator is accumulated in the dehumidification room, resulting in large temperature fluctuations in the dehumidification room, affecting the temperature of the inner tank.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The disclosed embodiments provide an inner tank assembly and a cold storage box, which utilize the first side wall with a lower temperature to dissipate heat for the hot end heat sink, thereby improving the heat dissipation effect of the hot end radiator and the dehumidification efficiency of the semiconductor dehumidification module. At the same time, it alleviates the phenomenon of heat accumulation in the dehumidification interlayer, and reduces the temperature fluctuation of the dehumidification interlayer and the temperature fluctuation of the inner tank.

[0009] In some embodiments, the liner assembly includes: an liner, which has a cold storage chamber inside; a wind shield, which is arranged on the liner and encloses a dehumidification interlayer with the first side wall of the liner, and the dehumidification interlayer is connected to the cold storage chamber; an insulation layer, which is coated on the outer surface of the liner and avoids the first side wall; a cold source part, which is at least partially attached to the outer surface of the insulation layer and at least partially attached to the outer surface of the first side wall, so as to use the cold source part to provide cooling for the first side wall; and a semiconductor dehumidification module, which is arranged in the dehumidification interlayer and includes a cold end heat sink and a hot end heat sink; wherein the cold end heat sink is used to dehumidify the gas flowing from the cold storage chamber into the dehumidification interlayer; the hot end heat sink is arranged close to the first side wall, so as to use the first side wall to dissipate heat for it.

[0010] In some embodiments, the wind shield is constructed with an interlayer air inlet, which is used to connect the cold storage room and the dehumidification interlayer; the semiconductor dehumidification module includes: a module shell, which is constructed with a module air duct, an air duct inlet connected to the interlayer air inlet, and an air duct outlet facing the first side wall; and a semiconductor refrigeration plate, which is arranged in the module shell, and its cold end is connected to the cold end heat sink, and its hot end is connected to the hot end heat sink; wherein the cold end heat sink is arranged at the air duct inlet, and the hot end heat sink is arranged at the air duct outlet.

[0011] In some embodiments, the semiconductor dehumidification module also includes: a cooling fan, which is arranged on the outside of the air duct outlet. The cooling fan can rotate to inhale gas from the cold storage chamber, and the gas flows through the cold end heat sink and the hot end heat sink in the module air duct in turn.

[0012] In some embodiments, the air outlet of the air duct is spaced apart from the first side wall by a first distance, L>20%D; wherein L is the first distance, and D is the diameter of the blade of the cooling fan.

[0013] In some embodiments, the cold source portion includes: a cold storage layer, a portion of which is coated on the outer surface of the insulation layer and another portion of which is coated on the outer surface of the first side wall; and an evaporation coil, which is coiled on the outer surface of the cold storage layer.

[0014] In some embodiments, the liner assembly also includes: one or more partitions, vertically arranged in the dehumidification interlayer to separate the dehumidification interlayer into multiple interconnected sub-air ducts, thereby extending the residence time of the gas in the dehumidification interlayer and reducing the air outlet temperature of the dehumidification interlayer.

[0015] In some embodiments, partitions are distributed on both sides of the semiconductor dehumidification module, and the height of the partitions is less than the height of the wind shield to form a gap at the upper / lower end of the partition; wherein, two adjacent sub-air ducts are connected through the gap, and the two adjacent gaps are distributed at opposite ends of the partition.

[0016] In some embodiments, the wind shield is made of an insulation board; and / or the insulation layer is made of multiple insulation boards; and / or the cold storage layer is made of multiple cold storage boards; and / or the evaporating coil is spirally wound along the height direction of the inner tank to form multiple spiral turns.

[0017] In some embodiments, the liner assembly further includes: a controller, which is used to control the semiconductor dehumidification module to reversely supply power when the current dehumidification rate is less than the dehumidification rate threshold, so as to heat the cold end heat sink and defrost the cold end heat sink.

[0018] In some embodiments, the refrigerator includes: a box shell; and the above-mentioned liner assembly, which is arranged in the box shell.

[0019] The liner assembly and refrigerator provided by the embodiments of the present disclosure can achieve the following technical effects:

[0020] The thermal insulation layer of the inner liner assembly provided in the disclosed embodiments is coated on the outer surface of the inner liner and avoids the first side wall. A portion of the cooling source is attached to the outer surface of the thermal insulation layer, while another portion is attached to the outer surface of the first side wall. This allows the cooling source to directly cool the first side wall, resulting in a lower temperature first side wall. The semiconductor dehumidification module includes cold-end heat sinks and hot-end heat sinks. The cold-end heat sinks are used to dehumidify the gas flowing from the cold storage compartment into the dehumidification interlayer to maintain a suitable humidity in the cold storage compartment. The hot-end heat sinks are positioned close to the first side wall, allowing the lower temperature first side wall to dissipate heat for the hot-end heat sinks. This improves the heat dissipation effect of the hot-end heat sink, thereby increasing the dehumidification efficiency of the semiconductor dehumidification module. Furthermore, the lower temperature first side wall allows heat exchange with the gas in the dehumidification interlayer, alleviating the accumulation of heat from the hot-end heat sink in the dehumidification interlayer and reducing temperature fluctuations in the dehumidification interlayer and the inner liner.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0023] Figure 1 is a structural schematic diagram of a refrigerator provided by an embodiment of the present disclosure;

[0024] Figure 2 is a structural schematic diagram of an inner liner assembly provided by an embodiment of the present disclosure;

[0025] Figure 3 is a structural schematic diagram of a semiconductor dehumidification module provided by an embodiment of the present disclosure;

[0026] Figure 4 is a schematic cross-sectional structural diagram of an inner liner assembly provided by an embodiment of the present disclosure;

[0027] Figure 5 is a schematic cross-sectional structural diagram of another liner assembly provided by an embodiment of the present disclosure;

[0028] Figure 6 It is a structural schematic diagram of another liner assembly provided in an embodiment of the present disclosure.

[0029] Reference numerals:

[0030] 100, liner; 101, refrigerating chamber; 102, first side wall; 103, dehumidification interlayer; 104, partition; 105, sub-air duct; 106, notch;

[0031] 200, windshield; 201, interlayer air inlet;

[0032] 300, insulation layer;

[0033] 400, cold source unit; 401, cold storage layer; 402, evaporating coil;

[0034] 500, semiconductor dehumidification module; 501, cold end heat sink; 502, hot end heat sink; 503, module housing; 504, semiconductor cooling fin; 505, cooling fan. DETAILED DESCRIPTION

[0035] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0036] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that such terms are interchangeable where appropriate to describe the embodiments of the present disclosure. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0038] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0039] Unless otherwise stated, the term "plurality" means two or more.

[0040] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0041] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0042] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0043] Refrigerated containers provide a low-temperature environment, maintaining it for extended periods even during power outages. They are widely used in the pharmaceutical, cold-chain transportation, and food storage sectors. For example, they are used to store vegetables, alcoholic beverages, medicines, and vaccines. To ensure the quality of refrigerated goods, the humidity inside the container must be maintained within a suitable range. Exceeding this range can cause the items to become wet, potentially deteriorating or even damaging. Therefore, dehumidification is essential.

[0044] A semiconductor cooler is a thermocouple pair consisting of an N-type semiconductor and a P-type semiconductor. When current flows through the pair, energy is transferred between the two semiconductors. The junction where the current flows from the N-type semiconductor to the P-type semiconductor absorbs heat, becoming the cold junction; the junction where the current flows from the P-type semiconductor to the N-type semiconductor releases heat, becoming the hot junction. However, the semiconductors themselves have resistance, and when current flows through them, heat is generated, which affects the heat transfer efficiency. Furthermore, heat between the two plates is also conducted in the reverse direction through the gas and the semiconductor material itself. When the temperature difference between the hot and cold ends reaches a certain level and the two types of heat conduction are equal, a temperature equilibrium point is reached, where the forward and reverse heat conduction cancel each other out. At this point, the temperature of the hot and cold ends will not change further. Heat dissipation from the hot end is required to lower the temperature of the cold end.

[0045] The disclosed embodiments provide an inner tank assembly and a cold storage box, which utilize the first side wall with a lower temperature to dissipate heat for the hot end heat sink, thereby improving the heat dissipation effect of the hot end radiator and the dehumidification efficiency of the semiconductor dehumidification module. At the same time, it alleviates the phenomenon of heat accumulation in the dehumidification interlayer, and reduces the temperature fluctuation of the dehumidification interlayer and the temperature fluctuation of the inner tank.

[0046] In a first aspect, an embodiment of the present disclosure provides an inner liner assembly.

[0047] Combine Figures 1 to 6 As shown, the liner assembly provided by the embodiment of the present disclosure includes an liner 100 , a wind shield 200 , an insulation layer 300 , a cold source portion 400 and a semiconductor dehumidification module 500 .

[0048] The inner structure of the inner liner 100 is provided with a refrigeration chamber 101. It is understandable that refrigerated items are placed in the refrigeration chamber 101 of the inner liner 100.

[0049] The windshield 200 is disposed on the inner liner 100, and the windshield 200 and the first side wall 102 of the inner liner 100 enclose a dehumidification interlayer 103. The dehumidification interlayer 103 is connected to the refrigeration chamber 101. When the refrigeration chamber 101 needs to be dehumidified, the air in the refrigeration chamber 101 enters the dehumidification interlayer 103, is dehumidified in the dehumidification interlayer 103, and then re-enters the refrigeration chamber 101.

[0050] The insulation layer 300 covers the outer surface of the inner liner 100 and avoids the first side wall 102. The temperature range of the refrigerator compartment is 2°C to 8°C. The insulation layer 300 can separate the inner liner 100 and the cold source portion 400, keeping the temperature of the refrigerator compartment 101 within a suitable range and preventing the refrigerator compartment from becoming too cold. In addition, the insulation layer 300 helps improve the refrigerator's insulation performance. Even in the event of a power outage, the temperature of the refrigerator compartment 101 can be maintained for an extended period of time.

[0051] At least a portion of the cooling unit 400 is attached to the outer surface of the insulation layer 300 and at least a portion of the cooling unit 400 is attached to the outer surface of the first sidewall 102, so that the cooling unit 400 can provide cooling for the first sidewall 102. The cooling unit 400 is directly attached to the outer surface of the first sidewall 102, keeping the temperature of the first sidewall 102 lower than that of the other sidewalls of the liner.

[0052] The semiconductor dehumidification module 500 is arranged in the dehumidification interlayer 103. The semiconductor dehumidification module 500 includes a cold end heat sink 501 and a hot end heat sink 502. Among them, the cold end heat sink 501 is used to dehumidify the gas flowing from the cold storage chamber 101 into the dehumidification interlayer 103. The hot end heat sink 502 is arranged close to the first side wall 102 so as to utilize the first side wall 102 to dissipate heat for it. The main function of the first side wall 102 is to dissipate heat for the hot end heat sink 502. By actively dissipating heat, the hot end temperature of the semiconductor refrigeration plate in the semiconductor dehumidification module 500 is reduced, and the cold end temperature of the semiconductor refrigeration plate will also decrease accordingly, thereby reaching a lower temperature and improving the dehumidification effect of the semiconductor dehumidification module.

[0053] The insulation layer 300 of the inner liner assembly provided in the embodiment of the present disclosure is coated on the outer surface of the inner liner 100, avoiding the first side wall 102. A portion of the cooling unit 400 is attached to the outer surface of the insulation layer 300, while a portion of the cooling unit 400 is attached to the outer surface of the first side wall 102. The cooling unit 400 is used to directly cool the first side wall 102, resulting in a lower temperature first side wall 102. The semiconductor dehumidification module 500 includes a cold-end heat sink 501 and a hot-end heat sink 502. The cold-end heat sink 501 is used to dehumidify the gas flowing from the refrigerated compartment 101 into the dehumidification interlayer 103, thereby maintaining an appropriate humidity in the refrigerated compartment 101. The hot-end heat sink 502 is arranged close to the first side wall 102, so that the lower temperature of the first side wall 102 can be used to dissipate heat from the hot-end heat sink 502. This helps improve the heat dissipation effect of the hot-end heat sink, thereby improving the dehumidification efficiency of the semiconductor dehumidification module 500. At the same time, the first side wall 102 with a lower temperature is set to exchange heat with the gas in the dehumidification interlayer 103, thereby alleviating the phenomenon that the heat emitted by the hot end radiator is concentrated in the dehumidification interlayer 103, and reducing the temperature fluctuation of the dehumidification interlayer 103 and the inner tank 100.

[0054] In some embodiments, combined Figure 2 As shown, the windshield 200 is configured with an interlayer air inlet 201, which is used to connect the refrigeration chamber 101 and the dehumidification interlayer 103. The semiconductor dehumidification module 500 includes a module housing 503 and a semiconductor refrigeration plate 504.

[0055] The module housing 503 is constructed with a module air duct, an air duct inlet, and an air duct outlet. The air duct inlet connects the interlayer air inlet 201 and the module air duct, and the air duct outlet faces the first sidewall 102. A semiconductor cooling fin 504 is disposed in the module housing 503. The cold end of the semiconductor cooling fin 504 is connected to the cold end heat sink 501, and the hot end of the semiconductor cooling fin 504 is connected to the hot end heat sink 502. The cold end heat sink 501 is disposed at the air duct inlet, and the hot end heat sink 502 is disposed at the air duct outlet.

[0056] The cold end temperature of the semiconductor refrigeration chip is lower, while the hot end temperature is higher. By providing cold end heat sink 501, the contact area between the cold end of the semiconductor refrigeration chip and the gas can be expanded, improving the dehumidification effect of the airflow. By providing hot end heat sink 502, the contact area between the hot end of the semiconductor refrigeration chip and the gas can be expanded, improving heat dissipation at the hot end.

[0057] When cold storage compartment 101 requires dehumidification, the air in cold storage compartment 101 enters the air duct inlet of semiconductor dehumidification module 500 through interlayer air inlet 201 and flows through cold-end heat sink 501 at the air duct inlet. Water vapor in the air condenses into water droplets when it cools on cold-end heat sink 501, thus dehumidifying the air. The dehumidified air is at a lower temperature. The dehumidified air then flows through hot-end heat sink 502, dissipating heat from the hot-end heat sink 502 and lowering the temperature of the cold end of the semiconductor refrigeration chip.

[0058] Furthermore, the cooling capacity of the semiconductor refrigeration chip is less than the heating capacity, and the temperature of the air flowing out of the air duct outlet is still higher than the air temperature in the refrigerator compartment. By aligning the air duct outlet with the first side wall 102, the air flowing out of the air duct outlet is blown toward the first side wall 102. This allows the first side wall 102 to cool the air flowing out of the air duct outlet, making the air outlet temperature of the dehumidification interlayer 103 consistent with the air temperature in the refrigerator compartment, thereby reducing temperature fluctuations in the refrigerator compartment.

[0059] Optionally, the windshield 200 is configured with a sandwich air outlet that connects the dehumidification interlayer 103 and the cold storage compartment 101. When the cold storage compartment 101 requires dehumidification, the air in the cold storage compartment 101 enters the module air duct of the semiconductor dehumidification module 500 through the sandwich air inlet 201 and the air duct inlet. After flowing through the module air duct, the air enters the dehumidification interlayer 103 through the air duct outlet, and finally returns to the cold storage compartment through the sandwich air outlet. This cycle dehumidifies the cold storage compartment.

[0060] In some embodiments, combined Figure 3 and Figure 4As shown, the semiconductor dehumidification module 500 also includes a cooling fan 505. The cooling fan 505 is located outside the air duct outlet and rotates to draw air from the refrigerated compartment 101. The air then flows through the cold-end heat sink 501 and the hot-end heat sink 502 within the module's air duct. The cooling fan 505 provides power for the air to circulate between the refrigerated compartment 101 and the dehumidification interlayer.

[0061] Cooling fan 505 is in suction mode. Air in the refrigerator compartment flows sequentially through the cold-end heat sink, the module air duct, the hot-end heat sink, and the cooling fan 505 before being blown toward the first sidewall of the inner container. Positioning cooling fan 505 outside the air duct outlet improves heat dissipation for the hot-end heat sink 502.

[0062] The heat dissipation fan 505 is disposed on the outside of the air outlet of the air duct, that is, the heat dissipation fan 505 is disposed on the side of the air outlet of the air duct facing the first side wall 102 .

[0063] In some embodiments, the air duct outlet is spaced a first distance from the first sidewall 102, where L is greater than 20% D. Here, L is the first distance, and D is the blade diameter of the cooling fan 505. By limiting the first distance to the above range, the impact of obstacles on the exhaust side of the cooling fan on fan performance can be reduced, thereby reducing wind noise.

[0064] The fan blade diameter refers to the diameter of the fan blade's maximum rotation trajectory.

[0065] In some embodiments, combined Figure 6 As shown, the cold source unit 400 includes a cold storage layer 401 and an evaporation coil 402. A portion of the cold storage layer 401 is wrapped around the outer surface of the thermal insulation layer 300, while another portion is wrapped around the outer surface of the first sidewall 102. The evaporation coil 402 is coiled around the outer surface of the cold storage layer 401.

[0066] At the point where the evaporator coil 402 is in close contact with the cold storage layer 401, heat is exchanged between the evaporator coil 402 and the cold storage layer 401, storing the cold energy within the cold storage layer 401. The cold storage layer 401 transfers the cold energy to the inner container through the insulation layer 300. The inner container then exchanges heat with the air in the refrigerator compartment, maintaining the refrigerator compartment temperature between 2°C and 8°C. At the first side wall 102, the cold storage layer 401 is in close contact with the first side wall 102, directly exchanging heat with the first side wall 102, keeping the temperature of the first side wall 102 lower than that of the other side walls of the inner container 100, allowing the first side wall 102 to dissipate heat for the hot end heat sink.

[0067] In some embodiments, combined Figure 5As shown, the liner assembly further includes one or more partitions 104. The partitions 104 are vertically disposed on the dehumidification interlayer 103 to separate the dehumidification interlayer 103 into a plurality of interconnected sub-ducts 105, thereby extending the residence time of the gas in the dehumidification interlayer 103. The design of the sub-ducts 105 prolongs the flow path of the dehumidified gas within the dehumidification interlayer 103, thereby increasing the heat exchange time between the dehumidified gas and the first sidewall 102, thereby lowering the outlet temperature of the dehumidification interlayer 103, ensuring that the outlet temperature of the dehumidification interlayer 103 is consistent with the gas temperature within the refrigerator compartment, thereby helping to reduce temperature fluctuations in the refrigerator compartment.

[0068] In some embodiments, combined Figure 5 As shown, partitions 104 are distributed on both sides of the semiconductor dehumidification module 500, and the height of partitions 104 is less than the height of windshield 200, so as to form notches 106 at the upper and lower ends of partitions 104. Two adjacent sub-ducts are connected through notches 106, and two adjacent notches 106 are distributed at opposite ends of partition 104. That is, partitions 104 are distributed on the first and second sides of semiconductor dehumidification module 500. The sub-ducts located on the first side of semiconductor dehumidification module 500 are connected to form an S-shaped flow path, and the sub-ducts located on the second side of semiconductor dehumidification module 500 are connected to form an S-shaped flow path. This helps to extend the flow path of the dehumidified gas within the dehumidification interlayer 103, increase the heat exchange time between the dehumidified gas and the first sidewall 102, reduce the outlet temperature of the dehumidification interlayer 103, and make the outlet temperature of the dehumidification interlayer 103 consistent with the gas temperature within the cold storage compartment, which helps to reduce temperature fluctuations in the cold storage compartment. Correspondingly, interlayer air outlets are respectively provided on both sides of the wind shield 200 so that the gas on both sides of the semiconductor dehumidification module 500 can flow back to the cold storage room through the interlayer air outlets on the corresponding sides.

[0069] In some embodiments, the windshield 200 is formed of a heat-insulating board, which can reduce the influence of the air temperature in the dehumidifying interlayer 103 on the air temperature in the refrigerating chamber 101 .

[0070] In some embodiments, the insulation layer is formed by splicing a plurality of insulation boards, which facilitates the processing and manufacturing of the refrigerator.

[0071] In some embodiments, the cold storage layer is formed by splicing a plurality of cold storage plates, which facilitates the processing and manufacturing of the refrigerator.

[0072] In some embodiments, the liner assembly further includes a controller. When the current dehumidification rate is less than a dehumidification rate threshold, the controller is configured to control the semiconductor dehumidification module to reversely supply power to heat the cold-end heat sink 501, thereby defrosting the cold-end heat sink 501. Frosting of the cold-end heat sink can cause the current dehumidification rate of the semiconductor dehumidification module to be too low. When the current dehumidification rate is less than the dehumidification rate threshold, the cold-end heat sink needs to be defrosted. In this case, the controller controls the semiconductor dehumidification module to reversely supply power to heat the cold end of the semiconductor refrigeration fins, thereby defrosting the cold-end heat sink 501.

[0073] Optionally, when the current dehumidification rate is less than the dehumidification rate threshold, the controller is further configured to control the cooling fan to stop working.

[0074] Optionally, when the humidity of the air in the refrigerating chamber is greater than a humidity threshold, the semiconductor refrigeration chip is powered on and the heat dissipation fan is rotated, so as to utilize the semiconductor dehumidification module to dehumidify the refrigerating chamber.

[0075] In a second aspect, an embodiment of the present disclosure provides a refrigerator.

[0076] The refrigerator provided in the embodiment of the present disclosure includes a box shell and an inner liner assembly of any of the above embodiments. The inner liner assembly is arranged in the box shell.

[0077] The insulation layer 300 of the inner liner assembly of the refrigerator provided in the embodiment of the present disclosure is coated on the outer surface of the inner liner 100 and avoids the first side wall 102. A portion of the cold source portion 400 is attached to the outer surface of the insulation layer 300, while a portion of the cold source portion 400 is attached to the outer surface of the first side wall 102. The cold source portion 400 is used to directly cool the first side wall 102, resulting in a lower temperature first side wall 102. The semiconductor dehumidification module 500 includes a cold end heat sink 501 and a hot end heat sink 502. The cold end heat sink 501 is used to dehumidify the gas flowing from the refrigeration chamber 101 into the dehumidification interlayer 103 to maintain an appropriate humidity in the refrigeration chamber 101. The hot end heat sink 502 is arranged close to the first side wall 102, so that the lower temperature of the first side wall 102 can be used to dissipate heat from the hot end heat sink 502. This helps improve the heat dissipation effect of the hot end radiator, thereby improving the dehumidification efficiency of the semiconductor dehumidification module 500. At the same time, a first side wall 102 with a lower temperature is provided, which can exchange heat with the gas in the dehumidification interlayer 103, alleviate the phenomenon that the heat emitted by the hot end radiator is accumulated in the dehumidification interlayer 103, reduce the temperature fluctuation of the dehumidification interlayer 103 and the inner liner 100, and improve the refrigeration effect of the refrigerator.

[0078] Optionally, the shell and liner assembly are secured together by foaming. That is, a foam layer is provided between the shell and liner assembly. This facilitates securing the shell and liner assembly and further improves the heat preservation performance of the refrigerator.

[0079] This refrigerator includes a semiconductor dehumidification module 500. Its cold storage layer 401 directly contacts the first sidewall 102 of the inner container 100, maintaining a relatively low temperature. The cooler first sidewall 102 exchanges heat with excess heat generated by the semiconductor dehumidification module 500, which is then removed from the refrigerator through a refrigeration cycle. This dehumidification process maintains the internal temperature between 2°C and 8°C while maintaining humidity. Tests have shown that even with an ambient temperature of 43°C and a power outage, the refrigerator compartment can maintain a temperature between 2°C and 8°C for over 50 hours.

[0080] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An inner liner assembly, characterized in that: include: Inner tank, with a refrigeration compartment inside; A windshield is provided on the inner container and encloses a dehumidification interlayer with the first side wall of the inner container, and the dehumidification interlayer is communicated with the refrigeration chamber; The thermal insulation layer is coated on the outer surface of the inner liner and avoids the first side wall; The cooling source portion is at least partially attached to the outer surface of the thermal insulation layer and at least partially attached to the outer surface of the first side wall, so as to provide cooling to the first side wall by using the cooling source portion; and, The semiconductor dehumidification module is arranged in the dehumidification interlayer and includes a cold end heat sink and a hot end heat sink; Among them, the wind shield is constructed with an interlayer air inlet, which is used to connect the cold storage chamber and the dehumidification interlayer. The cold end heat sink is used to dehumidify the gas flowing from the cold storage chamber into the dehumidification interlayer; the hot end heat sink is arranged close to the first side wall to use the first side wall to dissipate heat for it.

2. The liner assembly according to claim 1, characterized in that: The semiconductor dehumidification module includes: A module housing is constructed with a module air duct, an air duct inlet connected to the interlayer air inlet, and an air duct outlet facing the first side wall; and The semiconductor refrigeration chip is arranged in the module shell, and its cold end is connected to the cold end heat sink, and its hot end is connected to the hot end heat sink; wherein, the cold end heat sink is arranged at the air inlet of the air duct, and the hot end heat sink is arranged at the air outlet of the air duct.

3. The liner assembly according to claim 2, characterized in that: The semiconductor dehumidification module also includes: The cooling fan is arranged outside the air outlet of the air duct. The cooling fan can rotate to suck air from the refrigeration chamber, and the air flows through the cold end heat sink and the hot end heat sink in the module air duct in sequence.

4. The liner assembly according to claim 3, characterized in that: The air outlet of the air duct is spaced from the first side wall by a first distance, L>20%D; wherein L is the first distance, and D is the blade diameter of the cooling fan.

5. The liner assembly according to any one of claims 1 to 4, characterized in that: The cooling source includes: a cold storage layer, a portion of which is coated on the outer surface of the thermal insulation layer, and another portion of which is coated on the outer surface of the first side wall; and The evaporator coil is coiled on the outer surface of the cold storage layer.

6. The liner assembly according to any one of claims 1 to 4, characterized in that: Also includes: One or more partitions are vertically arranged in the dehumidification interlayer to separate the dehumidification interlayer into a plurality of interconnected sub-air ducts, thereby extending the residence time of the gas in the dehumidification interlayer.

7. The liner assembly according to claim 6, characterized in that: The partitions are distributed on both sides of the semiconductor dehumidification module, and the height of the partitions is less than the height of the wind shield to form a gap at the upper end / lower end of the partition; wherein, two adjacent sub-air ducts are connected through the gap, and the two adjacent gaps are distributed at opposite ends of the partition.

8. The liner assembly according to any one of claims 1 to 4, characterized in that: The windshield is made of a thermal insulation board; and / or the thermal insulation layer is formed by splicing a plurality of thermal insulation boards.

9. The liner assembly according to any one of claims 1 to 4, characterized in that: Also includes: The controller is used to control the semiconductor dehumidification module to supply reverse power when the current dehumidification rate is less than the dehumidification rate threshold, so as to heat the cold end heat sink and defrost the cold end heat sink.

10. A refrigerator, comprising: box shell; and, The liner assembly according to any one of claims 1 to 9 is arranged in a box shell.

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