Cooling system and its cooling control method

Abstract

This invention relates to a cooling system. The target unit includes a first heat exchange device for acquiring heat from a target object. The heat exchange unit includes a coupling device and a second heat exchange device. The first heat exchange device is connected to the second heat exchange device in a closed loop via the coupling device. A heat exchange medium circulates in a closed loop between the first heat exchange device, the coupling device, and the second heat exchange device. The heat dissipation unit includes a cooling device connected to the second heat exchange device via heat exchange. Therefore, based on the pressure balance effect formed on both sides by the coupling device, the cooling system can independently adjust the flow rate of the heat exchange medium to each electronic component in the path connected to different electronic components on the branch side during operation. This ensures a uniform distribution of the heat exchange medium relative to different electronic components, guarantees the stability of the cooling system operation, and allows multiple electronic components to obtain the same cooling effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cooling technology, in particular to a cooling system and a cooling control method thereof. BACKGROUND

[0002] In an electronic system, electronic components generate heat during operation, which reduces the operating efficiency or service life of the electronic components, and is not conducive to the operation of the electronic components. At present, the electronic system can be cooled by a cooling system such as a cooling tower. For example, the outlet water temperature of the cooling tower can be limited to about 35℃, which is supplied to different electronic components in the electronic system by a pump, and heat exchange is performed between the heat exchange device and the electronic components to achieve cooling of the electronic components.

[0003] At present, in order to improve the working efficiency of the cooling system, multiple electronic components are usually connected to the cooling system in parallel, and the cooling system is used to independently cool different electronic components. However, although multiple electronic components are connected to the cooling system in parallel, there are still differences in the objective factors such as the height and position of different electronic components. When the heat exchange medium flows to different electronic components in the cooling system, it will cause uneven distribution due to objective factors such as height and position, and thus it is impossible to ensure that the electronic components are subjected to the same cooling effect. SUMMARY

[0004] Therefore, it is necessary to provide a cooling system and a cooling control method thereof in view of the above technical problems.

[0005] The present application provides a cooling system, which comprises:

[0006] a target unit comprising a first heat exchange device, configured to obtain heat of a target object;

[0007] a heat exchange unit comprising a coupling device and a second heat exchange device, the first heat exchange device being connected to the second heat exchange device in a closed loop circulation through the coupling device, and a heat exchange medium being circulated in a closed loop between the first heat exchange device, the coupling device and the second heat exchange device;

[0008] a heat dissipation unit comprising a cooling device, the cooling device being in heat exchange connection with the second heat exchange device.

[0009] In the technical solution, based on the pressure balance effect of the two sides formed by the coupling device, the cooling system can independently adjust the flow of the heat exchange medium flowing to each electronic component in the branch side connected to different electronic components during operation, so that the heat exchange medium can be uniformly distributed with respect to different electronic components, the stability of the cooling system is ensured, and multiple electronic components can obtain the same cooling effect.

[0010] In one embodiment, the cooling system comprises:

[0011] a first pump body arranged between the first heat exchange device and the coupling device;

[0012] and / or,

[0013] a second pump body arranged between the coupling device and the second heat exchange device;

[0014] and / or,

[0015] a third pump body arranged between the cooler and the second heat exchange device.

[0016] In the technical solution, the first pump body, the second pump body and the third pump body can control the flow of the heat exchange medium according to actual conditions or requirements, so as to increase or decrease the flow of the medium in the corresponding passage and ensure that different electronic components can obtain the same cooling effect.

[0017] In one embodiment, the cooling system comprises:

[0018] a distribution unit, the number of the first heat exchange devices is multiple, the multiple first heat exchange devices are connected in parallel with the distribution unit, and the distribution unit is connected in a closed loop with the coupling device.

[0019] In the technical solution, the distribution unit is connected in a closed loop with the coupling device, so that multiple electronic components can be independently cooled in the same cooling system.

[0020] In one embodiment, the target unit comprises a first passage and a second passage, the distribution unit comprises a third passage and a fourth passage, an input end of the first passage is connected with a first output end of the coupling device through the third passage, an output end of the first passage is connected with an input end of the first heat exchange device, an input end of the second passage is connected with an output end of the first heat exchange device, and an output end of the second passage is connected with a first input end of the coupling device through the fourth passage, wherein multiple third passages are connected in parallel, and multiple fourth passages are connected in parallel.

[0021] and / or, the heat exchange unit comprises a fifth passage and a sixth passage, an input end of the fifth passage is connected with an output end of the second heat exchange device, an output end of the fifth passage is connected with a second input end of the coupling device, an input end of the sixth passage is connected with a second output end of the coupling device, and an output end of the sixth passage is connected with an input end of the second heat exchange device.

[0022] In one of the embodiments, the first output of the coupling device is at the same height as the second input of the coupling device; or, the first output of the coupling device is higher than the second input of the coupling device.

[0023] And / or, the first input of the coupling device is at the same height as the second output of the coupling device; or, the first input of the coupling device is higher than the second output of the coupling device; or, the first input of the coupling device is lower than the second output of the coupling device.

[0024] The present application also provides a cooling control method of the cooling system, comprising the following steps:

[0025] Obtaining the actual medium temperature of the heat exchange medium flowing between the target unit and the heat exchange unit, and comparing the actual medium temperature with the target medium temperature;

[0026] Adjusting the medium flow of the heat exchange medium flowing between the target unit and the heat exchange unit according to the comparison result.

[0027] In the technical solution, the medium flow of the first heat exchange device for each electronic component can be independently controlled based on the pressure balance of the decoupling device, so as to meet the actual cooling demand of the current electronic component and achieve the maximum cooling efficiency.

[0028] In one of the embodiments, the target medium temperature comprises a target supply flow temperature and a target return flow temperature.

[0029] And / or, the actual medium temperature comprises an actual supply flow temperature and an actual return flow temperature.

[0030] And / or, the medium flow comprises a supply flow and / or a return flow.

[0031] In the technical solution, at least one of the actual supply flow temperature and the actual return flow temperature can be compared with at least one of the target supply flow temperature and the target return flow temperature, so as to form a diversified comparison scheme.

[0032] In one of the embodiments, the target supply flow temperature comprises a first target supply flow temperature between the first heat exchange device and the coupling device and a second target supply flow temperature between the coupling device and the second heat exchange device; and / or,

[0033] The target return flow temperature comprises a first target return flow temperature between the first heat exchange device and the coupling device and a second target return flow temperature between the coupling device and the second heat exchange device; and / or,

[0034] The actual supply flow temperature includes a first actual supply flow temperature between the first heat exchange device and the coupling device and a second actual supply flow temperature between the coupling device and the second heat exchange device; and / or,

[0035] The actual return flow temperature includes a first actual return flow temperature between the first heat exchange device and the coupling device and a second actual return flow temperature between the coupling device and the second heat exchange device; and / or,

[0036] The supply flow rate includes a first supply flow rate between the first heat exchange device and the coupling device and a second supply flow rate between the coupling device and the second heat exchange device; and / or,

[0037] The return flow rate includes a first return flow rate between the first heat exchange device and the coupling device and a second return flow rate between the coupling device and the second heat exchange device.

[0038] In the technical solution, at least one of the first target supply flow temperature, the second target supply flow temperature, the first target return flow temperature and the second target return flow temperature is compared with at least one of the first actual supply flow temperature, the second actual supply flow temperature, the first actual return flow temperature and the second actual return flow temperature to form a more detailed and diversified comparison scheme.

[0039] In one of the embodiments, the medium flow rate is adjusted so that the temperature difference between the target supply flow temperature and the actual supply flow temperature is within a set temperature difference range.

[0040] And / or, the medium flow rate is adjusted so that the temperature difference between the target return flow temperature and the actual return flow temperature is within a set temperature difference range.

[0041] In one of the embodiments, the second supply flow rate is adjusted so that the temperature difference between the first target supply flow temperature and the second actual supply flow temperature is within a set temperature difference range; and / or,

[0042] The first return flow rate is adjusted so that the temperature difference between the first target return flow temperature and the first actual return flow temperature is within a set temperature difference range.

[0043] In the technical solution, part of the medium flow rate is adjusted, and the cooling efficiency is ensured by ensuring that the first target supply flow temperature and the second actual supply flow temperature are in a reasonable difference state and that the first target return flow temperature and the first actual return flow temperature are in a reasonable difference state. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1System structure schematic diagram of cooling system provided in one embodiment of the present application;

[0045] Figure 2 Heat exchange medium flow schematic diagram of cooling system as shown in Figure 1

[0046] Figure 3 System structure schematic diagram of cooling system provided in another embodiment of the present application;

[0047] Figure 4 System structure schematic diagram of cooling system provided in yet another embodiment of the present application;

[0048] Figure 5 Different state comparison schematic diagram of coupling device provided in one embodiment of the present application;

[0049] Figure 6 Size structure schematic diagram of coupling device provided in one embodiment of the present application;

[0050] Figure 7 Size structure schematic diagram of coupling device provided in another embodiment of the present application;

[0051] Figure 8 Size structure schematic diagram of coupling device provided in yet another embodiment of the present application.

[0052] Reference signs:

[0053] 100, target unit; 200, distribution unit; 300, heat exchange unit; 500, heat dissipation unit;

[0054] 10, electronic system; 11, target object; 12, first heat exchange device; 13, first passage; 14, second passage; 15, first connecting device; 16, second connecting device;

[0055] 21, first pump body; 23, third passage; 24, fourth passage;

[0056] 30, coupling device; 31, third connecting device; 32, fourth connecting device; 33, fifth passage; 34, sixth passage; 35, second pump body;

[0057] 40, second heat exchange device; 41, seventh passage; 42, eighth passage; 43, fifth connecting device; 44, sixth connecting device;

[0058] 50, cooling device; 51, ninth passage; 52, tenth passage; 53, third pump body; DETAILED DESCRIPTION

[0059] ​In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described below in detail with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in many different manners without the specific details, and it is to be understood that the present application is not limited to the specific embodiments described below and that the specific embodiments are given for the purposes of exemplification only.

[0060] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0061] In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0062] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0063] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0064] It is to be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on the other element or intervening elements can also be present. In addition, the term "connected" as used herein means the element is directly connected to the other element or intervening elements can also be present.

[0065] Referring to Figure 1 and Figure 2 , an embodiment of the present application provides a cooling system, which comprises a target unit 100, a heat exchange unit 300, and a heat dissipation unit 500. The target unit 100 comprises a first heat exchange device 12 for obtaining heat of a target object 11. The target object 11 represents an electronic component which generates heat during operation of an electronic system 10. The electronic component is not limited in type, as long as it generates heat during operation and the heat needs to be dissipated. Moreover, the electronic component can be one or more, and the electronic system 10 can also be one or more, without limitation. For example, referring to Figure 1 and Figure 2 , when the electronic component is multiple, the cooling system can further comprise a distribution unit 200. Since the first heat exchange device 12 is multiple, the multiple first heat exchange devices 12 can be connected in parallel with the distribution unit 200, and then the multiple first heat exchange devices 12 can be connected in a closed loop with the coupling device 30 through the distribution unit 200, so that the multiple electronic components can be independently cooled in the same cooling system. Continuing to refer to Figure 3 and Figure 4 , when the electronic system 10 is multiple, the multiple electronic systems 10 can still be connected in parallel with the second heat exchange device 40 through one or more coupling devices 30, or connected in parallel with the cooling device 50 through one or more second heat exchange devices 40. Those skilled in the art can set the parallel structure in the cooling system according to actual needs, which is not limited herein.

[0066] Continuing to refer to Figure 1 and Figure 2 , the heat exchange unit 300 comprises the coupling device 30 and the second heat exchange device 40. The first heat exchange device 12 is connected in a closed loop with the second heat exchange device 40 through the coupling device 30. The heat exchange medium flows in a closed loop among the first heat exchange device 12, the coupling device 30, and the second heat exchange device 40. The heat dissipation unit 500 comprises the cooling device 50, which is in heat exchange connection with the second heat exchange device 40.

[0067] Reference is made to Figure 2 As shown, the closed loop circulation refers to that the passage structure between the first heat exchange device 12 and the second heat exchange device 40 is annularly, closedly and circularly, and the flow direction and the return flow direction of the passage structure both pass through the coupling device 30, so that the heat exchange medium can flow circularly between the first heat exchange device 12 and the second heat exchange device 40 and circularly pass through the coupling device 30 in the flow direction and the return flow direction. Therefore, when the heat exchange medium flows in the direction of the black arrow, Figure 2 When the heat exchange medium flows in the direction of the black arrow, it can form heat exchange with the corresponding target object 11 when passing through the first heat exchange device 12, and continue to flow to the second heat exchange device 40 after absorbing the heat of the target object 11. The second heat exchange device 40 is connected in a closed loop circulation with the cooling device 50, and the cooling device 50 can dissipate heat through the heat exchange medium and then flow to the second heat exchange device 40. When the two heat exchange media in the second heat exchange device 40 exchange heat with each other, the heat of the target object 11 can be continuously transferred to the cooling device 50 for dissipation, thereby achieving heat dissipation of the target object 11. The heat exchange medium can be gaseous medium or liquid medium, such as liquid refrigerant.

[0068] Continuing to refer to Figure 2 As shown, in the process of continuous flow of the heat exchange medium, the heat exchange medium circularly flows between the first heat exchange device 12 and the second heat exchange device 40 and passes through the coupling device 30 in the flow direction and the return flow direction. The coupling device 30 can adopt a decoupling tank or the like to realize decoupling function, so that the two sides of the coupling device 30 can be independently operated and not interfere with each other, and the pressure balance between the two sides and the resistance are nearly zero. If one side between the coupling device 30 and the first heat exchange device 12 is defined as a branch side, and one side between the coupling device 30 and the second heat exchange device 40 is defined as a main side, the branch side and the main side of the coupling device 30 can be independently operated and not interfere with each other, and the pressure balance between the branch side and the main side and the resistance are nearly zero. Based on the pressure balance effect of the two sides of the coupling device 30, the cooling system can independently adjust the flow of the heat exchange medium to each electronic component in the branch side and the main side when working, so that the heat exchange medium can be uniformly distributed relative to different electronic components, the stability of the cooling system is ensured, and the same cooling effect can be obtained for multiple electronic components.

[0069] Regarding the decoupling function of the coupling device 30, reference can be made to Figure 5 As shown, when the flow rate of the coupling device 30 in the main side is different from the flow rate in the branch side, the pressure balance between the main side and the branch side of the coupling device 30 will be broken, and the heat exchange medium will flow to the main side and the branch side of the coupling device 30 in the flow direction and the return flow direction, and the heat exchange medium will flow to the main side and the branch side of the coupling device 30 in the flow direction and the return flow direction. Figure 5three operating conditions in the three cases. In the first case, the flow rate of the main path side = the total flow rate of the branch path side, the supply flow direction and the return flow direction do not interfere with each other, in the second case, the flow rate of the main path side < the total flow rate of the branch path side, the return flow part of the branch path side can bypass to the branch path side supply in the coupling device 30. In the third case, the flow rate of the main path side > the total flow rate of the branch path side, the supply flow part of the main path side can bypass to the main path side return in the coupling device 30.

[0070] Therefore, the coupling device 30 can generate a pressure point with almost zero pressure for the cooling system, which can ensure that the branch path side and the main path side of the coupling device 30 operate relatively independently and do not interfere with each other. On this basis, the flow rate of the heat exchange medium can be adjusted according to the heat dissipation requirement of each electronic component, so that the flow rate of the heat exchange medium flowing through the first heat exchange device 12 matches the heat dissipation amount, and the independent control of the branch path side and the main path side can overcome the problem of uneven flow rate of the medium in height and horizontally, and provide heat exchange medium on demand.

[0071] Next, regarding the specific structure of the coupling device 30, it can be set according to the requirements, such as Figure 5 As shown, the coupling device 30 is defined to have a first input end and a first output end located on the branch path side, and a second input end and a second output end located on the main path side, in combination with Figure 5 the black arrows pointing to the first input end, the first output end, the second input end and the second output end on the coupling device 30. In one embodiment, the first output end of the coupling device 30 can be equal in height to the second input end of the coupling device 30, the first output end of the coupling device 30 can also be higher than the second input end of the coupling device 30, similarly, the first input end of the coupling device 30 can be equal in height to the second output end, the first input end of the coupling device 30 can also be higher than the second output end of the coupling device 30, and the first input end of the coupling device 30 can also be lower than the second output end of the coupling device 30.

[0072] As shown in Figures 6 to 8 three structure forms of the coupling device 30 are provided, such as Figure 6 As shown in Figure 7 the structure of the coupling device 30 satisfies: 6d≥D≥d, 6d≥L1≥d, 6d≥L2≥d, 6d≥L3≥d, 6d≥L4≥d, 6d≥L5≥d. As shown in Figure 8As shown, the structure of the coupling device 30 satisfies: 6d≥D≥d, 6d≥L1≥d, 6d≥L2≥d, 6d≥L3≥d, 6d≥L4≥d, 6d≥L5≥d.

[0073] It should be noted that, although the first heat exchange device 12 and the second heat exchange device 40 are connected in a closed loop circulation through the coupling device 30, which can make the branch side and the main side of the coupling device 30 form a pressure balance effect, but the flow of the heat exchange medium of different electronic components still needs to be effectively controlled, and such control can be achieved by using pumps, valves and other devices, for example, in one embodiment, the cooling system can be provided with a first pump body 21, which is arranged between the first heat exchange device 12 and the coupling device 30, and the first pump body 21 can increase or decrease the flow of the heat exchange medium in the corresponding passage. Similarly, the cooling system can also be provided with a second pump body 35, which is arranged between the coupling device 30 and the second heat exchange device 40, and the second pump body 35 can also increase or decrease the flow of the heat exchange medium in the corresponding passage, and the cooling system can also be provided with a third pump body 53, which is arranged between the cooling device 50 and the second heat exchange device 40, and the third pump body 53 can also increase or decrease the flow of the heat exchange medium in the corresponding passage. Therefore, at different stages or positions of the pipeline in the cooling system, the first pump body 21, the second pump body 35 and the third pump body 53 can all control the flow of the heat exchange medium according to the actual situation or demand, so as to increase or decrease the flow of the medium in the corresponding passage, and ensure that different electronic components can obtain the same cooling effect, which is not limited here.

[0074] The target unit 100 and the heat exchange unit 300, and the heat exchange unit 300 and the heat dissipation unit 500, can be connected in a closed loop circulation through any structure, as described above, the purpose of the closed loop circulation is to make the heat exchange medium form a circular, closed loop and continuous circulation between the target unit 100 and the heat exchange unit 300, and between the heat exchange unit 300 and the heat dissipation unit 500, so as to continuously transfer the heat of the electronic components to the cooling device 50 for dissipation, for example, referring to Figures 1 to 4As shown, in one embodiment, the target unit 100 includes a first path 13 and a second path 14, and the distribution unit 200 includes a third path 23 and a fourth path 24. The input terminal of the first path 13 is connected to the first output terminal of the coupling device 30 through the third path 23, and the output terminal of the first path 13 is connected to the input terminal of the first heat exchange device 12. The input terminal of the second path 14 is connected to the output terminal of the first heat exchange device 12, and the output terminal of the second path 14 is connected to the first input terminal of the coupling device 30 through the fourth path 24. Multiple third paths 23 and multiple fourth paths 24 are connected in parallel. The input terminal of the first path 13 and the third path 23 can be connected via a first connecting device 15, and the output terminal of the second path 14 and the fourth path 24 can be connected via a second connecting device 16. Among them, multiple third channels 23 connected in parallel can be simultaneously connected to the first output terminal of the coupling device 30 through the third connecting device 31, and multiple fourth channels 24 connected in parallel can be simultaneously connected to the first input terminal of the coupling device 30 through the fourth connecting device 32.

[0075] Furthermore, the heat exchange unit 300 includes a fifth passage 33 and a sixth passage 34. The input end of the fifth passage 33 is connected to the output end of the second heat exchange device 40, and the output end of the fifth passage 33 is connected to the second input end of the coupling device 30. The input end of the sixth passage 34 is connected to the second output end of the coupling device 30, and the output end of the sixth passage 34 is connected to the input end of the second heat exchange device 40. Similarly, the heat exchange unit 300 includes a seventh passage 41 and an eighth passage 42, and the heat dissipation unit 500 includes a ninth passage 51 and a tenth passage 52. The seventh passage 41 and the ninth passage 51 can be connected by a fifth connecting device 43, and the eighth passage 42 and the tenth passage 52 can be connected by a sixth connecting device 44. Then, the second heat exchange device 40 and the cooling device 50 can form a closed-loop circular connection through the seventh passage 41, the eighth passage 42, the ninth passage 51, and the tenth passage 52, continuously removing heat between the second heat exchange device 40 and the cooling device 50. Of course, in addition to these, those skilled in the art can also achieve closed-loop connection between the target unit 100 and the heat exchange unit 300, and between the heat exchange unit 300 and the heat dissipation unit 500 through other structural forms, which are not limited here.

[0076] Among them, the first channel 13, the second channel 14, the third channel 23, the fourth channel 24, the fifth channel 33, the sixth channel 34, the seventh channel 41, the eighth channel 42, the ninth channel 51 and the tenth channel 52 can be constructed in any structural form. For example, they can be constructed by opening up corresponding channels inside one or more basic structures, or they can be constructed by several rigid or flexible pipes. Those skilled in the art can set the corresponding structural form according to the requirements, and no limitation is made here.

[0077] In one embodiment, the cooling system includes a temperature sensing device disposed on the target unit 100 and the heat exchange unit 300. In this technical solution, the temperature sensing device can be used to obtain the actual temperature of the heat exchange medium flowing between the target unit 100 and the heat exchange unit 300.

[0078] In one embodiment, the temperature sensing device includes a temperature sensor element disposed between the first heat exchanger 12 and the second heat exchanger 40. The temperature sensor element includes a first sensor element and a second sensor element. The first sensor element is disposed between the first heat exchanger 12 and the coupling device 30, and the second sensor element is disposed between the coupling device 30 and the second heat exchanger 40. In this technical solution, the first sensor element can be used to specifically acquire a first target reflux temperature and a first actual supply temperature between the first heat exchanger 12 and the coupling device 30, while the second sensor element can be used to specifically acquire a second target reflux temperature and a second actual supply temperature between the coupling device 30 and the second heat exchanger 40.

[0079] In one embodiment, there are two first sensors, which are respectively disposed on the first passage 13 and the second passage 14. There are also two second sensors, which are respectively disposed on the fifth passage 33 and the sixth passage 34. In this technical solution, the two first sensors can be used to obtain the first target reflux temperature and the first actual supply temperature between the first heat exchanger 12 and the coupling device 30, respectively. The two second sensors can be used to obtain the second target reflux temperature and the second actual supply temperature, respectively.

[0080] In one embodiment, the cooling system includes a data processing device and a control device. The data processing device is connected to the temperature sensing device and the control device. The control device is connected to at least one of the first pump body, the second pump body, and the third pump body. In this technical solution, the data processing device can compare the actual medium temperature with a set target medium temperature, and then the control device can adjust the flow rate of the heat exchange medium flowing between the target unit and the heat exchange unit based on the comparison result.

[0081] This invention also provides a cooling control method for the aforementioned cooling system, comprising the following steps: obtaining the actual medium temperature of the heat exchange medium flowing between the target unit 100 and the heat exchange unit 300; comparing the actual medium temperature with a set target medium temperature; generating a corresponding comparison result after comparison; and adjusting the medium flow rate of the heat exchange medium flowing between the target unit 100 and the heat exchange unit 300 based on the comparison result. During the operation of the cooling system, this cooling control method can be defined as an automatically executed logic program. When the actual medium temperature forms a corresponding relationship with the target medium temperature, the logic program can be automatically executed to adjust the medium flow rate in a timely manner. This allows the heat exchange medium to control the efficiency of heat exchange with the first heat exchange device 12 by accelerating or decelerating its flow during flow. Furthermore, based on the pressure balance formed by the decoupling devices, the first heat exchange device 12 can independently control the medium flow rate for each electronic component, meeting the actual cooling requirements of the current electronic component and achieving maximum cooling efficiency.

[0082] In one embodiment, the target medium temperature can be the supply and return temperatures in the cooling system, referred to as the target supply temperature and target return temperature. The target supply temperature represents the expected or desired temperature reached by the heat exchange medium when it is supplied to the first heat exchange device 12, typically around 35°C. The target return temperature represents the expected or desired temperature reached by the heat exchange medium when it returns after heat exchange with the first heat exchange device 12, typically around 55°C. Since the temperature of the heat exchange medium increases after heat exchange with the first heat exchange device 12, the target supply temperature is lower than the target return temperature. Similarly, the actual medium temperature can also be the supply and return temperatures in the cooling system, referred to as the actual supply temperature and actual return temperature. The actual supply temperature represents the actual temperature reached by the heat exchange medium when it is supplied to the first heat exchange device 12, and the actual return temperature represents the actual temperature reached by the heat exchange medium when it returns after heat exchange with the first heat exchange device 12. Since the temperature of the heat exchange medium increases after heat exchange with the first heat exchange device 12, the actual supply temperature is lower than the actual return temperature. Similarly, the medium flow rate can be the supply flow rate and the return flow rate in the cooling system. The supply flow rate represents the flow rate that the heat exchange medium needs to reach when it is supplied to the first heat exchange device 12, and the return flow rate represents the flow rate that the heat exchange medium needs to reach when it returns from the first heat exchange device 12 after heat exchange.

[0083] Therefore, when the cooling control method makes logical judgments, it can compare at least one of the actual supply flow temperature and the actual return flow temperature with at least one of the target supply flow temperature and the target return flow temperature to form a diversified comparison scheme. This allows the difference between the actual temperature of different passage parts in the cooling system and the target temperature. Then, based on the actual situation of different passage parts, the adjustment requirement of at least one of the supply flow rate and the return flow rate can be determined, which can effectively improve the accuracy of the adjustment.

[0084] Furthermore, see Figures 1 to 4As shown, in one embodiment, the target supply temperature is further subdivided into a first target supply temperature located between the first heat exchanger 12 and the coupling device 30 and a second target supply temperature located between the coupling device 30 and the second heat exchanger 40; the target return temperature is further subdivided into a first target return temperature located between the first heat exchanger 12 and the coupling device 30 and a second target return temperature located between the coupling device 30 and the second heat exchanger 40; and the actual supply temperature is further subdivided into a first actual supply temperature located between the first heat exchanger 12 and the coupling device 30 and a second actual supply temperature located between the coupling device 30 and the second heat exchanger 40. The second actual supply flow temperature is between 0 and 0. The actual return flow temperature is further subdivided into a first actual return flow temperature between the first heat exchanger 12 and the coupling device 30 and a second actual return flow temperature between the coupling device 30 and the second heat exchanger 40. The supply flow rate is further subdivided into a first supply flow rate between the first heat exchanger 12 and the coupling device 30 and a second supply flow rate between the coupling device 30 and the second heat exchanger 40. The return flow rate is further subdivided into a first return flow rate between the first heat exchanger 12 and the coupling device 30 and a second return flow rate between the coupling device 30 and the second heat exchanger 40.

[0085] Therefore, when the cooling control method makes logical judgments, it can compare at least one of the first target supply temperature, the second target supply temperature, the first target return temperature, and the second target return temperature with at least one of the first actual supply temperature, the second actual supply temperature, the first actual return temperature, and the second actual return temperature to form a more detailed and diversified comparison scheme. This allows the difference between the actual temperature of different passage parts in the cooling system and the target temperature. Then, based on the actual situation of different passage parts, the adjustment requirements of at least one of the first supply flow rate, the second supply flow rate, the first return flow rate, and the second return flow rate can be determined, further improving the accuracy of the adjustment.

[0086] For example, in one embodiment, the control logic of the cooling control method can adjust the medium flow rate to ensure that the temperature difference between the target supply temperature and the actual supply temperature is within a set temperature difference range. Because the actual supply temperature and the target supply temperature are within a reasonable temperature difference range, it can be ensured that the heat exchange medium, when supplied to the first heat exchange device 12, has a sufficiently low temperature, allowing for a large temperature rise space to exchange heat with the first heat exchange device 12, thus fully removing the heat from the electronic components. The medium flow rate can be adjusted by the first pump body 21 or the second pump body 35. Similarly, the control logic of the cooling control method can adjust the medium flow rate to ensure that the temperature difference between the target return temperature and the actual return temperature is within a set temperature difference range. Because the actual return temperature and the target return temperature are within a reasonable temperature difference range, it can be ensured that the heat exchange medium, after passing through the first heat exchange device 12 and achieving heat exchange, removes sufficient heat, thus fully removing the heat from the electronic components. The medium flow rate can be adjusted by the first pump body 21 or the second pump body 35.

[0087] Furthermore, in one embodiment, the control logic of the cooling control method can further adjust the second supply flow rate to ensure that the temperature difference between the first target supply temperature and the second actual supply temperature is within a set temperature difference range. This specifically adjusts the medium flow rate. Specifically, by adjusting the second supply flow rate, the first target supply temperature and the second actual supply temperature are kept in a reasonable difference state. If the second actual supply temperature is more in line with the setting of the first target supply temperature, it means that when the heat exchange medium flows from the second heat exchange device 40 to the first heat exchange device 12, the temperature of the heat exchange medium is relatively reasonable, thus ensuring that the heat exchange medium has a good heat exchange foundation. Similarly, the control logic of the cooling control method can further adjust the first return flow rate to ensure that the temperature difference between the first target return temperature and the first actual return temperature is within a set range. This also specifically adjusts the medium flow rate. Specifically, by adjusting the first return flow rate, the first target return temperature and the first actual return temperature are kept within a reasonable range. If the first actual return temperature is close to the set first target return temperature, it means that when the heat exchange medium exits the first heat exchange device 12, it has indeed carried away the ideal heat and reached the preset temperature. Therefore, this round of heat exchange has high heat exchange efficiency. The second supply flow rate and the first return flow rate can be adjusted accordingly by the first pump body 21 or the second pump body 35. When the flow rate increases and the flow velocity increases, the heat exchange efficiency decreases accordingly. Conversely, when the flow rate decreases and the flow velocity decreases, there is sufficient time for heat exchange, thus increasing the heat exchange efficiency.

[0088] In addition, based on the detailed breakdown of medium flow rate, target medium temperature and actual medium temperature mentioned above, those skilled in the art can arbitrarily choose appropriate target medium temperature and actual medium temperature as the basis for comparison and adjust the medium flow rate, without any limitation.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A cooling system, characterized by, The cooling system comprises: a target unit comprising a first heat exchange device for obtaining heat of a target object; a heat exchange unit comprising a coupling device and a second heat exchange device, the first heat exchange device being connected in closed loop circulation with the second heat exchange device through the coupling device, a heat exchange medium flowing in closed loop circulation among the first heat exchange device, the coupling device and the second heat exchange device; one side between the coupling device and the first heat exchange device being a branch side, one side between the coupling device and the second heat exchange device being a trunk side; when the flow of the trunk side is equal to the total flow of the branch side, the supply flow direction and the return flow direction of the heat exchange medium are not interfered with each other; when the flow of the trunk side is less than the total flow of the branch side, the return flow part of the heat exchange medium of the branch side can bypass to the supply flow of the branch side in the coupling device; when the flow of the trunk side is greater than the total flow of the branch side, the supply flow part of the heat exchange medium of the trunk side can bypass to the return flow of the trunk side in the coupling device; a heat dissipation unit comprising a cooling device, the cooling device being in heat exchange connection with the second heat exchange device.

2. The cooling system of claim 1, wherein, The cooling system comprises: a first pump body arranged between the first heat exchange device and the coupling device; and / or, a second pump body arranged between the coupling device and the second heat exchange device; and / or, a third pump body arranged between the cooling device and the second heat exchange device.

3. The cooling system of claim 1, wherein, The cooling system comprises: a distribution unit, the number of the first heat exchange devices is multiple, multiple first heat exchange devices are connected in parallel with the distribution unit, and the multiple first heat exchange devices are connected in closed loop circulation with the coupling device through the distribution unit.

4. The cooling system of claim 3, wherein, The target unit comprises a first passage and a second passage, the distribution unit comprises a third passage and a fourth passage, an input end of the first passage is connected with a first output end of the coupling device through the third passage, an output end of the first passage is connected with an input end of the first heat exchange device, an input end of the second passage is connected with an output end of the first heat exchange device, and an output end of the second passage is connected with a first input end of the coupling device through the fourth passage, wherein multiple third passages are connected in parallel, and multiple fourth passages are connected in parallel; and / or, the heat exchange unit comprises a fifth passage and a sixth passage, an input end of the fifth passage is connected with an output end of the second heat exchange device, an output end of the fifth passage is connected with a second input end of the coupling device, an input end of the sixth passage is connected with a second output end of the coupling device, and an output end of the sixth passage is connected with an input end of the second heat exchange device.

5. The cooling system of claim 4, wherein, The first output end of the coupling device is equal in height to the second input end of the coupling device; or, the first output end of the coupling device is higher than the second input end of the coupling device; and / or, the first input end of the coupling device is equal in height to the second output end of the coupling device. Alternatively, the first input end of the coupling device is higher than the second output end of the coupling device; or, the first input end of the coupling device is lower than the second output end of the coupling device.

6. A cooling control method based on the cooling system according to any one of claims 1 to 5, characterized by, The method comprises the following steps: acquiring an actual medium temperature of the heat exchange medium flowing between the target unit and the heat exchange unit, and comparing the actual medium temperature with a set target medium temperature; adjusting a medium flow of the heat exchange medium flowing between the target unit and the heat exchange unit according to the comparison result.

7. The cooling control method according to claim 6, characterized by, The target medium temperature comprises a target supply flow temperature and a target return flow temperature. And / or, the actual medium temperature comprises an actual supply flow temperature and an actual return flow temperature. And / or, the medium flow comprises a supply flow and / or a return flow.

8. The cooling control method according to claim 7, characterized by, The target supply flow temperature comprises a first target supply flow temperature between the first heat exchange device and the coupling device and a second target supply flow temperature between the coupling device and the second heat exchange device. And / or, The target return flow temperature comprises a first target return flow temperature between the first heat exchange device and the coupling device and a second target return flow temperature between the coupling device and the second heat exchange device. And / or, The actual supply flow temperature comprises a first actual supply flow temperature between the first heat exchange device and the coupling device and a second actual supply flow temperature between the coupling device and the second heat exchange device. And / or, The actual return flow temperature comprises a first actual return flow temperature between the first heat exchange device and the coupling device and a second actual return flow temperature between the coupling device and the second heat exchange device. And / or, The supply flow comprises a first supply flow between the first heat exchange device and the coupling device and a second supply flow between the coupling device and the second heat exchange device. And / or, The return flow comprises a first return flow between the first heat exchange device and the coupling device and a second return flow between the coupling device and the second heat exchange device.

9. The cooling control method according to claim 8, characterized by, Adjust the medium flow so that the temperature difference between the target supply flow temperature and the actual supply flow temperature is within a set temperature difference range. And / or, adjust the medium flow so that the temperature difference between the target return flow temperature and the actual return flow temperature is within a set temperature difference range.

10. The cooling control method according to claim 9, characterized by Adjust the second supply flow so that the temperature difference between the first target supply flow temperature and the second actual supply flow temperature is within a set temperature difference range. And / or, Adjust the first return flow so that the temperature difference between the first target return flow temperature and the first actual return flow temperature is within a set temperature difference range.

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