Thermosetting resin composition, dry film, cured product, printed wiring board, and electrical and electronic component

Abstract

The present invention provides a thermosetting resin composition which enables easy singulation of chips in a process of singulating the chips one by one after sealing a plurality of chips together using a thermosetting resin composition in the manufacture of a SAW filter. The thermosetting resin composition according to the present invention is a thermosetting resin composition comprising a thermosetting resin, characterized in that a cured product obtained by heating the thermosetting resin composition at 100°C for 30 minutes and then at 180°C for 60 minutes satisfies the following conditions: (i) a breaking point strength of 100 MPa or less; (ii) a linear expansion coefficient of 35 ppm / °C or less; and (iii) a storage modulus at 30°C of 2 GPa or more.

Description

TECHNICAL FIELD

[0001] The present application relates to a thermosetting resin composition. In addition, the present application relates to a dry film having a resin layer composed of a dried coating film of the thermosetting resin composition, a cured product of the thermosetting resin composition, a printed wiring board, and an electrical and electronic component. BACKGROUND

[0002] In the past, a transfer molding method using a powdered epoxy resin composition, a potting method, a dispensing method, a printing method, and the like using a liquid epoxy resin composition, a silicone resin, and the like have been used to seal a chip-type device (chip component) such as a semiconductor element, an electronic component, and the like. However, currently, it is required to be suitable for mounting a device with high integration, and it is required to seal and package all at once on a substrate having a plurality of chip-type devices to efficiently manufacture a device in which the inside after sealing is hollow in a surface acoustic wave (SAW) device, a crystal device, and the like.

[0003] For example, in Patent Literature 1, a thermosetting resin composition is proposed, which is characterized by including (A) a cross-linkable elastomer, (B) an epoxy resin, (C) an epoxy resin curing agent, and (D) an inorganic filler as a composition capable of sealing all at once.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2015-166403 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, in the manufacturing process of a SAW filter in a SAW device, after a plurality of chips as described above are sealed all at once using a thermosetting resin composition, there is a process of singulating the chips one by one. The present inventors and the like have found the following problem: when the chips are singulated one by one, a cured product composed of the thermosetting resin composition is too hard to be broken, heat expansion occurs, or warping occurs, and it is difficult to singulate the chips.

[0009] Therefore, an object of the present application is to provide a thermosetting resin composition capable of easily singulating chips in a process of singulating the chips one by one after a plurality of chips are sealed all at once using a thermosetting resin composition in the manufacturing of a SAW filter.

[0010] In addition, another object of the present application is to provide a dry film using the thermosetting resin composition, a cured product of the thermosetting resin composition or the dry film, a printed wiring board having these cured products, and an electrical and electronic component having the printed wiring board.

[0011] Means for solving the problem

[0012] A thermosetting resin composition according to the aspect of the present application is a thermosetting resin composition containing a thermosetting resin, characterized in that a cured product obtained by curing the thermosetting resin composition by heating the thermosetting resin composition at 100°C for 30 minutes and then at 180°C for 60 minutes satisfies the following conditions: (i) the breaking point strength is 100 MPa or less; (ii) the linear expansion coefficient is 35 ppm / °C or less; and (iii) the storage modulus at 30°C is 2 GPa or more.

[0013] In the aspect of the present application, the thermosetting resin composition preferably further contains a curing agent and an inorganic filler.

[0014] In the aspect of the present application, the content of the inorganic filler is preferably 50% by mass or more of the total amount of the thermosetting resin composition, based on the solid content.

[0015] In the aspect of the present application, the thermosetting resin is preferably an epoxy compound.

[0016] In the aspect of the present application, the curing agent is preferably at least one selected from the group consisting of phenol resins and imidazoles.

[0017] A dry film according to another aspect of the present application is characterized in that the dry film has: a first film; and a resin layer composed of a dried coating film of the above-described thermosetting resin composition formed on the first film.

[0018] A cured product according to another aspect of the present application is characterized in that the cured product is obtained by curing the thermosetting resin composition or the resin layer of the above-described dry film.

[0019] A printed wiring board according to another aspect of the present application is characterized in that the printed wiring board has the cured product.

[0020] An electrical and electronic component according to another aspect of the present application is characterized in that the electrical and electronic component has the printed wiring board.

[0021] Effects of the Invention

[0022] According to the present application, it is possible to provide a thermosetting resin composition that can easily monolithicize chips in a process of monolithicizing the chips one by one after sealing a plurality of chips together using a thermosetting resin composition in the manufacture of a SAW filter.

[0023] Further, in another aspect of the present application, a dry film using the thermosetting resin composition, a cured product of the thermosetting resin composition or the dry film, a printed wiring board having the cured product, and an electrical and electronic component having the printed wiring board can be provided. DETAILED DESCRIPTION

[0024] (Thermosetting resin composition)

[0025] The cured product of the thermosetting resin composition according to the present application, which is cured by heating at 100°C for 30 minutes and then heating at 180°C for 60 minutes, satisfies the following conditions (i) to (iii). In the present application, the cured product used in the measurement of the following conditions (i) to (iii) means a cured product obtained by coating the thermosetting resin composition on a substrate so that the film thickness after curing becomes 100 μm, putting it into a BOX furnace adjusted to 100°C in a hot air circulating type drying furnace, taking it out after 30 minutes, immediately putting it into a BOX furnace adjusted to 180°C, taking it out after 60 minutes and curing it. As a result of intensive studies by the present inventors, it has been found that the above-mentioned cured product satisfies the conditions (i) to (iii), and thus the thermosetting resin composition, which enables easy singulation of the chips in the process of singulating the chips one by one after sealing a plurality of chips using the thermosetting resin composition, can be provided. This is not necessarily clear, but it can be presumed as follows. That is, by adjusting the degree of breakability, thermal expansion and warping of the cured product of the thermosetting resin composition, which is subjected to the singulation of the chips, to be in an appropriate state. Therefore, it is presumed that by optimizing each of the breaking strength, which indicates the breakability of the cured product, the coefficient of thermal expansion, which indicates the degree of thermal expansion (difficulty of thermal expansion), and the storage modulus, which indicates the degree of warping (difficulty of warping), a material which enables easy singulation of the chips is obtained. However, this is only a presumption, and is not necessarily limited thereto.

[0026] Condition (i) is that the breaking point strength is 100 MPa or less. The breaking point strength is preferably 30 MPa or more and 100 MPa or less, and more preferably 35 MPa or more and 95 MPa or less. It has been found that if the breaking point strength is within the above-mentioned numerical range, the chips can be easily singulated.

[0027] Note that, in the present application, the breaking point strength is a value obtained by measuring a cured product having a size of 70 mm x 5 mm x 100 ± 5 μm (thickness) using a tensile testing machine (manufactured by Shimadzu Corporation, EZ-SX) under the following measurement conditions.

[0028] (Measurement conditions)

[0029] Tensile speed: 1 mm / minute.

[0030] Measurement temperature: 23°C.

[0031] Distance between grips: 50 mm.

[0032] Condition (ii) is that the linear expansion coefficient is 35 ppm / °C or less. The linear expansion coefficient is preferably 3 ppm / °C or more and 35 ppm / °C or less, and more preferably 4 ppm / °C or more and 33 ppm / °C or less. It was found that if the linear expansion coefficient is within the above numerical range, the chip can be easily singulated.

[0033] Note that, in the present application, the linear expansion coefficient is measured using a TMA measuring device (manufactured by TA instruments, Q400EM) under the following measurement conditions on a cured product having dimensions of 15 mm x 3 mm x 100 ± 5 μm (thickness), and the value of the average linear expansion rate from 30 to 100°C of the measurement results of the third step is used.

[0034] (Measurement conditions)

[0035] First: 30°C → 300°C, temperature increase at 10°C / minute.

[0036] Second: 300°C → 30°C, temperature decrease at 10°C / minute.

[0037] Third: 30°C → 300°C, temperature increase at 10°C / minute.

[0038] Condition (iii) is that the storage modulus at 30°C is 2 GPa or more. The storage modulus at 30°C is preferably 3 GPa or more and 10 GPa or less, and more preferably 5 GPa or more and 10 GPa or less. It was found that if the storage modulus at 30°C is within the above numerical range, the chip can be easily singulated.

[0039] Note that, in the present application, the storage modulus at 30°C is a value calculated by measuring a cured product having dimensions of 30 mm x 5 mm x 100 ± 5 μm (thickness) using a DMA measuring device (manufactured by Hitachi High-Technologies Corporation, DMA7100) under the following measurement conditions.

[0040] (Measurement conditions)

[0041] Measurement temperature: 30 to 300°C.

[0042] Temperature increase rate: 5°C / minute.

[0043] Load gap: 10 minutes.

[0044] Frequency: 1 Hz.

[0045] Axial force: 0.05 N.

[0046] The thermosetting resin composition satisfying the above conditions (i) to (iii) contains a thermosetting resin, preferably further contains a curing agent and an inorganic filler, and can further contain other components. For the thermosetting resin composition, for example, by appropriately adjusting the kind of the thermosetting resin, the blending amount of the thermosetting resin, the kind of the inorganic filler, and the blending amount of the inorganic filler, and the like, the above conditions (i) to (iii) can be satisfied. Hereinafter, each component is described.

[0047] (Thermosetting resin)

[0048] As the thermosetting resin, a publicly known thermosetting resin can be used. By the thermosetting resin composition containing the thermosetting resin, each optimization of the breaking point strength of the cured coating film, the coefficient of thermal expansion, and the storage modulus can be performed. As the thermosetting resin, for example, an amino resin such as a melamine resin, a benzoguanamine resin, a melamine derivative, a benzoguanamine derivative, or the like; an isocyanate compound, a blocked isocyanate compound, a cyclic carbonate compound, an epoxy compound, an oxetane compound, a cyclic sulfur resin, a bismaleimide, a carbodiimide resin, or the like can be used. Among them, a resin having a plurality of cyclic ether groups or cyclic thioether groups (hereinafter, simply referred to as cyclic (thio)ether groups) in the molecule is preferred. The thermosetting resin can be used alone in one kind, or two or more kinds can be used in combination.

[0049] Such a thermosetting resin having a plurality of cyclic (thio)ether groups in the molecule is a compound having either one or both of a 3-, 4-, or 5-membered ring cyclic ether group or a cyclic thioether group in the molecule, and for example, a compound having a plurality of epoxy groups in the molecule, that is, a multifunctional epoxy compound, a compound having a plurality of oxetanyl groups in the molecule, that is, a multifunctional oxetane compound, a compound having a plurality of thioether groups in the molecule, that is, a cyclic sulfur resin, or the like can be mentioned. Among them, an epoxy compound is preferred.

[0050] As the epoxy compound, for example, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol E type epoxy resins, bisphenol M type epoxy resins, bisphenol P type epoxy resins, bisphenol Z type epoxy resins and the like bisphenol type epoxy resins; bisphenol A novolak type epoxy resins, phenol novolak type epoxy resins, cresol novolak epoxy resins and the like novolak type epoxy resins, biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, arylalkylene type epoxy resins, tetrahydroxyphenyl ethane type epoxy resins, naphthalene type epoxy resins, anthracene type epoxy resins, phenoxy type epoxy resins, dicyclopentadiene type epoxy resins, norbornene type epoxy resins, adamantane type epoxy resins, fluorene type epoxy resins, glycidyl methacrylate copolymer type epoxy resins, copolymer epoxy resins of cyclohexyl maleimide and glycidyl methacrylate, epoxy-modified polybutadiene rubber derivatives, CTBN-modified epoxy resins, trimethylolpropane polyglycidyl ether, phenyl-1,3-diglycidyl ether, biphenyl-4,4'-diglycidyl ether, 1,6-hexanediol diglycidyl ether, diethylene glycol or propylene glycol diglycidyl ether, sorbitol polyglycidyl ether, tris(2,3-epoxypropyl) isocyanurate, trisglycidyl tris(2-hydroxyethyl) isocyanurate and the like can be mentioned. Among these, from the viewpoint of each optimization of the breaking point strength of the cured coating film, the coefficient of thermal expansion and the storage modulus, it is preferable to use bisphenol A type epoxy resins, dicyclopentadiene type epoxy resins and phenol novolak type epoxy resins, more preferable to use two or more of these, and further preferable to use three of these.

[0051] As the commercially available epoxy resins, for example, jER 828, 806, 807, YX8000, YX8034, 834 manufactured by Mitsubishi Chemical Corporation (Mitsubishi Chemical Corporation), YD-128, YDF-170, ZX-1059, ST-3000 manufactured by Nippon Steel Chemical & Material Corporation (Nippon Steel Chemical & Material Corporation), EPICLON 830, 835, 840, 850, N-730A, N-695 manufactured by DIC Corporation, and RE-306 manufactured by Nippon Kayaku Co., Ltd. and the like can be mentioned.

[0052] As the multifunctional oxetane compound, for example, in addition to bis[(3-methyl-3-oxetanylmethoxy)methyl] ether, bis[(3-ethyl-3-oxetanylmethoxy)methyl] ether, 1,4-bis[(3-methyl-3-oxetanylmethoxy)methyl]benzene, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, (3-methyl-3-oxetanyl)methyl acrylate, (3-ethyl-3-oxetanyl)methyl acrylate, (3-methyl-3-oxetanyl)methyl methacrylate, (3-ethyl-3-oxetanyl)methyl methacrylate, oligomers or copolymers of these, and the like multifunctional oxetanes, ethers of oxetanol and a novolak resin, poly(p-hydroxystyrene), Cardotype bisphenols, calixarenes, resorcinol calixarenes, or silsesquioxane, and the like resins having a hydroxyl group, and the like can be given. Further, copolymers of an unsaturated monomer having an oxetane ring and an alkyl (meth)acrylate, and the like can be given.

[0053] As the compound having a plurality of cyclic sulfide groups in the molecule, a bisphenol A type cyclic sulfur resin, and the like can be given. In addition, a cyclic sulfur resin, and the like formed by replacing the oxygen atom of the epoxy group of a novolak type epoxy resin with a sulfur atom by the same synthetic method can also be used.

[0054] As the amino resin such as a melamine derivative, a benzoguanamine derivative, a hydroxymethyl melamine compound, a hydroxymethyl benzoguanamine compound, a hydroxymethyl glycoluril compound, a hydroxymethyl urea compound, and the like can be given.

[0055] As the isocyanate compound, a polyisocyanate compound can be used. As the polyisocyanate compound, aromatic polyisocyanates such as 4,4'-diphenylmethane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, and 2,4-toluene dimer; aliphatic polyisocyanates such as tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis(cyclohexyl isocyanate), and isophorone diisocyanate; alicyclic polyisocyanates such as bicycloheptane triisocyanate; and adducts, biuret bodies, and isocyanurate bodies of the isocyanate compounds listed above, and the like can be given.

[0056] As the capped isocyanate compound, an addition reaction product of an isocyanate compound and an isocyanate capping agent can be used. As the isocyanate compound which can react with the isocyanate capping agent, for example, the above-mentioned polyisocyanate compound and the like can be given. As the isocyanate capping agent, for example, a phenol-based capping agent; a lactam-based capping agent; an active methylene-based capping agent; an alcohol-based capping agent; an oxime-based capping agent; a thiol-based capping agent; an acid amide-based capping agent; an imide-based capping agent; an amine-based capping agent; an imidazole-based capping agent; an imine-based capping agent and the like can be given.

[0057] The blending amount of the thermosetting resin is preferably 3 to 40% by mass, more preferably 4 to 35% by mass, and further preferably 5 to 30% by mass, in terms of solid content, relative to the total amount of the thermosetting resin composition.

[0058] (Thermoplastic Resin)

[0059] The thermosetting resin composition can further contain a thermoplastic resin to improve the mechanical strength of the obtained cured coating film. The thermoplastic resin is preferably soluble in a solvent. When soluble in a solvent, the flexibility of the dry film is improved, and the generation of cracks and the generation of powder can be suppressed. As the thermoplastic resin, a thermoplastic polyhydroxy polyether resin, a phenoxy resin which is a condensate of epichlorohydrin and various 2-functional phenol compounds or a phenoxy resin in which the hydroxyl group of the hydroxyl ether moiety present in the skeleton thereof is esterified using various acid anhydrides and acid chlorides, a polyvinyl acetal resin, a polyamide resin, a polyamide-imide resin, a block copolymer, a high molecular weight resin having a glass transition temperature of 20°C or lower and a weight average molecular weight of 10,000 or more, and the like can be given. Among them, a high molecular weight resin having a glass transition temperature of 20°C or lower and a weight average molecular weight of 10,000 or more is preferred. As the high molecular weight resin, an acrylate copolymer is preferred. The thermoplastic resin can be used alone or two or more kinds can be used in combination.

[0060] The blending amount of the thermoplastic resin is preferably 0.5 to 15% by mass, and more preferably 0.5 to 10% by mass, in terms of solid content, relative to the total amount of the thermosetting resin composition.

[0061] (Curing Agent)

[0062] As the curing agent, a publicly known curing agent generally used to cure a thermosetting resin can be used. As the curing agent, a phenol resin, a polycarboxylic acid and an acid anhydride thereof, a cyanate ester resin, an active ester resin, a maleimide compound, an alicyclic olefin polymer, an amine, an imidazole, and the like can be given. Among them, from the viewpoint of each optimization of the breaking point strength, the thermal expansion coefficient, and the storage modulus of the cured coating film, a phenol resin, an imidazole, and more preferably a phenol resin are preferred. The curing agent can be used alone or two or more kinds can be used in combination.

[0063] As the phenol resin, a phenol novolak resin, an alkylphenol novolak resin, a bisphenol A novolak resin, a dicyclopentadiene type phenol resin, an aralkylphenol type phenol resin (Xylok type phenol resin), a terpene-modified phenol resin, a cresol / naphthol resin, a polyvinylphenol, a phenol / naphthol resin, a phenol resin containing an α-naphthol skeleton, a cresol novolak resin containing a triazine skeleton, a biphenyl aralkyl type phenol resin, a phenol novolak resin of aralkylphenol type (Xylok type phenol novolak resin), and the like can be used alone or in combination of two or more kinds.

[0064] In the phenol resin, a resin having a hydroxyl equivalent weight of 130 g / eq. or more is preferable, and a resin having a hydroxyl equivalent weight of 150 g / eq. or more is more preferable. As the phenol resin having a hydroxyl equivalent weight of 130 g / eq. or more, for example, a dicyclopentadiene skeleton phenol novolak resin (GDP series, manufactured by Gun Ei Chemical Industry Co., Ltd.), a Xylok type phenol novolak resin (MEH-7800, manufactured by Meicen Corporation), a biphenyl aralkyl type phenol novolak resin (MEH-7851, manufactured by Meicen Corporation), a naphthol aralkyl type curing agent (SN series, manufactured by Nippon Steel Chemical & Material Corporation), a cresol novolak resin containing a triazine skeleton (LA-3018-50P, manufactured by DIC Corporation), and the like can be mentioned.

[0065] As the imidazole, for example, a reaction product of an epoxy resin and imidazole, and the like are mentioned. For example, 2-methylimidazole, 4-methyl-2-ethylimidazole, 2-phenylimidazole, 4-methyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and the like can be mentioned. As the imidazole, for example, imidazoles such as 2E4MZ, C11Z, C17Z, 2PZ (all of which are reaction products of an epoxy resin and imidazole); 2MZ-A, 2E4MZ-A, 2MZA-PW (all of which are AZINE compounds of imidazole); 2MZ-OK, 2PZ-OK (all of which are isocyanurates of imidazole); 2PHZ, 2P4MHZ (all of which are imidazole methylol compounds) (all of which are manufactured by Shikoku Chemicals Corporation), and the like can be mentioned.

[0066] The imidazole is preferably contained in an amount of 0.5 to 15% by mass, and more preferably 0.5 to 10% by mass, based on the total amount of the thermosetting resin composition, in terms of solid content.

[0067] (Inorganic Filler)

[0068] The thermosetting resin composition can also contain an inorganic filler. The inorganic filler is preferably one that improves the adhesion, mechanical strength, linear expansion coefficient, and the like of the cured product. As the inorganic filler, for example, there can be mentioned silica, barium sulfate, barium titanate, silicon oxide, calcium carbonate, silicon nitride, aluminum nitride, boron nitride, aluminum oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, titanium oxide, mica, talc, clay, organic bentonite, copper, gold, silver, palladium, and the like. The inorganic filler can be used alone or two or more kinds can be used in combination.

[0069] Among these inorganic fillers, it is preferable to use calcium carbonate, silica, barium sulfate, and aluminum oxide (hereinafter, also referred to as alumina) that are excellent in low volume expansion, and more preferable to use silica, alumina, and calcium carbonate, further preferable to use silica and alumina, and particularly preferable to use silica. As the silica, either amorphous or crystalline, or a mixture thereof can be used. Amorphous (fused) silica is particularly preferable. As the alumina, either spinel type (γ-alumina (low temperature)) or corundum type (α-alumina (high temperature)) can be used. In addition, as the calcium carbonate, either natural heavy calcium carbonate or synthetic precipitated calcium carbonate can be used.

[0070] The shape of the inorganic filler is not particularly limited, and there can be mentioned spherical, acicular, platy, flaky, hollow, amorphous, hexagonal, cubic, flaky, and the like, and from the viewpoint of high compatibility of the inorganic filler, a spherical shape is preferable.

[0071] In addition, the average particle diameter of these inorganic fillers is not particularly limited, and is preferably from 0.1 μm to 25 μm, more preferably from 0.1 μm to 15 μm, and further preferably from 0.3 μm to 10 μm. Note that the average particle diameter refers to the average primary particle diameter, and can be measured by a laser diffraction / scattering method.

[0072] The amount of the inorganic filler to be compounded is preferably 50% by mass or more, more preferably 55% by mass or more and 90% by mass or less, and further preferably 55% by mass or more and 85% by mass or less, based on the total amount of the thermosetting resin composition, in terms of solid content. If the amount of the inorganic filler to be compounded is within the above range, the cured product is less likely to be thermally expanded, and the chip can be easily singulated.

[0073] (Silane Coupling Agent)

[0074] The thermosetting resin composition can also contain a silane coupling agent. By compounding a silane coupling agent, the adhesion of the inorganic filler to the epoxy resin is improved, and the generation of cracks in the cured product thereof can be suppressed.

[0075] As the silane-based coupling agent, for example, an epoxy silane, a vinyl silane, an imidazole silane, a mercapto silane, a methacryloxy silane, an amino silane, a styryl silane, an isocyanate silane, a sulfide silane, a ureido silane, and the like can be mentioned. In addition, the silane-based coupling agent can also be incorporated by using an inorganic filler which has been surface-treated in advance with a silane-based coupling agent.

[0076] From the viewpoint of giving both adhesiveness to the inorganic filler and defoaming property to the epoxy resin, the proportion of the silane-based coupling agent to be incorporated is preferably 0.05 to 2.5 parts by mass, in terms of solid content, relative to 100 parts by mass of the inorganic filler.

[0077] (Coloring agent)

[0078] The thermosetting resin composition can also contain a coloring agent. As the coloring agent, there is no particular limitation, and a well-known coloring agent of red, blue, green, yellow, or the like can be used, and can be any one of a pigment, a dye, and a colorant, and from the viewpoint of reducing environmental load or less influence on the human body, a coloring agent not containing halogen is preferred.

[0079] As the red coloring agent, there are a monoazo-based, a disazo-based, an azo lake-based, a benzimidazolone-based, a perylene-based, a diketopyrrolopyrrole-based, a condensed azo-based, an anthraquinone-based, a quinacridone-based, and the like, and specifically, coloring agents with the following Color Index (C.I.; issued by The Society of Dyers and Colourists) numbers can be mentioned.

[0080] As a single azo-based red colorant, Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269, and the like can be given. In addition, as a disazo-based red colorant, Pigment Red 37, 38, 41, and the like can be given. In addition, as a monoazo lake-based red colorant, Pigment Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58:4, 63:1, 63:2, 64:1, 68, and the like can be given. In addition, as a benzimidazolone-based red colorant, Pigment Red 171, 175, 176, 185, 208, and the like can be given. In addition, as a perylene-based red colorant, Solvent Red 135, 179, Pigment Red 123, 149, 166, 178, 179, 190, 194, 224, and the like can be given. In addition, as a diketopyrrolopyrrole-based red colorant, Pigment Red 254, 255, 264, 270, 272, and the like can be given. In addition, as a condensed azo-based red colorant, Pigment Red 220, 144, 166, 214, 220, 221, 242, and the like can be given. In addition, as an anthraquinone-based red colorant, Pigment Red 168, 177, 216, Solvent Red 149, 150, 52, 207, and the like can be given. In addition, as a quinacridone-based red colorant, Pigment Red 122, 202, 206, 207, 209, and the like can be given.

[0081] As a blue colorant, phthaloquinone, anthraquinone, Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 60 can be given. As a dye, Solvent Blue 35, 63, 68, 70, 83, 87, 94, 97, 122, 136, 67, 70, and the like can be used. In addition to the above, a phthaloquinone compound of metal substitution or non-metal substitution can also be used.

[0082] As yellow colorants, monoazo-based, disazo-based, condensed azo-based, benzimidazolone-based, isoindolinone-based, anthraquinone-based, etc. can be given, for example, as anthraquinone-based yellow colorants, solvent yellow 163, pigment yellow 24, 108, 193, 147, 199, 202, etc. can be given. As isoindolinone-based yellow colorants, pigment yellow 110, 109, 139, 179, 185, etc. can be given. As condensed azo-based yellow colorants, pigment yellow 93, 94, 95, 128, 155, 166, 180, etc. can be given. As benzimidazolone-based yellow colorants, pigment yellow 120, 151, 154, 156, 175, 181, etc. can be given. In addition, as monoazo-based yellow colorants, pigment yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62:1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167, 168, 169, 182, 183, etc. can be given. In addition, as disazo-based yellow colorants, pigment yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198, etc. can be given.

[0083] In addition, colorants such as violet, orange, brown, black, white, etc. can also be added. Specifically, pigment black 1, 6, 7, 8, 9, 10, 11, 12, 13, 18, 20, 25, 26, 28, 29, 30, 31, 32, pigment violet 19, 23, 29, 32, 36, 38, 42, solvent violet 13, 36, C.I. pigment orange 1, 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 61, 63, 64, 71, 73, pigment brown 23, 25, carbon black, titanium oxide, etc. can be given.

[0084] The blending amount of the colorant is not particularly limited, and is preferably 0.01 to 20 mass%, more preferably 0.05 to 10 mass%, further preferably 0.1 to 5 mass% based on the total amount of the thermosetting resin composition, calculated as a solid content.

[0085] (Organic solvent)

[0086] The thermosetting resin composition can also contain an organic solvent for the preparation of the composition, adjustment of viscosity. As the organic solvent, for example, ketones such as methyl ethyl ketone, cyclohexanone, and the like; aromatic hydrocarbons such as toluene, xylene, tetramethyl benzene, and the like; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), tripropylene glycol monomethyl ether, and the like; glycol ethers; esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, propylene carbonate, and the like; aliphatic hydrocarbons such as octane, decane, and the like; petroleum-based solvents such as petroleum ether, petroleum naphtha, solvent naphtha, and the like; and the like can be used. These organic solvents can be used singly or in combination of two or more.

[0087] (Other Components)

[0088] The thermosetting resin composition according to the present invention can be used in combination with a thermosetting resin to contain a photocurable resin. Examples of photocurable resins include curable resins that can be cured via a free radical addition polymerization reaction using active energy lines. Specific examples of free radical addition polymerization reactive components having one or more vinyl unsaturated groups in the molecule include, for example, conventionally known polyester (meth)acrylates, polyether (meth)acrylates, polyurethane (meth)acrylates, carbonate (meth)acrylates, epoxy (meth)acrylates, etc. Specifically, examples include diacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; acrylamides such as N,N-dimethylacrylamide, N-hydroxymethylacrylamide, and N,N-dimethylaminopropylacrylamide; aminoalkyl acrylates such as N,N-dimethylaminoacrylate and N,N-dimethylaminoacrylate; polyols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tri-hydroxyethyl isocyanurate, or their ethylene oxide adducts, propylene oxide adducts, or ε-caprolactone adducts; phenoxy acrylates, bisphenol A diacrylates, etc. Acrylates and their phenolic ethylene oxide adducts or propylene oxide adducts, etc., are polyacrylates; polyacrylates of glycidyl ethers such as glycerol diglycidyl ether, glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; not limited to the foregoing, examples include acrylates obtained by directly acrylate-esterifying polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadiene, and polyester polyols, or by polyurethane acrylate-esterifying polyurethane with diisocyanate, as well as melamine acrylates, and at least one of the various methacrylates corresponding to the aforementioned acrylates. It should be noted that in this specification, (meth)acrylate is a general term for acrylates, methacrylates, and mixtures thereof, and the same applies to other similar expressions. The above-mentioned photocurable resin is preferably in liquid form.

[0089] Furthermore, in cases where the thermosetting resin composition of the present invention promotes the thermosetting reaction with the epoxy compound, and when the composition of the present invention is used as an alkali-developable thermosetting resin composition, it may contain a carboxyl-containing resin. The carboxyl-containing resin may be a carboxyl-containing photosensitive resin having vinyl unsaturated groups, and may or may not have an aromatic ring.

[0090] When a photocurable resin is used, a photopolymerization initiator is preferably added to the thermocurable resin composition of the present application. As the photopolymerization initiator, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin methyl ketal, and the like can be mentioned; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-l-phenylpropan-l-one, diethoxyacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-l-[4-(methylthio)phenyl]-2-morpholinopropan-l-one, and the like can be mentioned; anthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-pentylanthraquinone, and the like can be mentioned; thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-methylthioxanthone, 2,4-diisopropylthioxanthone, and the like can be mentioned; ketal, such as acetophenone dimethyl ketal, benzyl dimethyl ketal, and the like can be mentioned; benzophenone, 4,4-bis(methylamino)benzophenone, and the like can be mentioned; oxime ester, such as l-[4-(phenylthio)phenyl-l,2-octanedione 2-(O-benzoyl oxime)], l-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone O-acetyloxime, and the like can be mentioned. These can be used alone or in combination of two or more, and further, can be used in combination with tertiary amines, such as triethanolamine, methyldiethanolamine, and the like; benzoic acid derivatives, such as 2-dimethylaminoethyl benzoate, 4-dimethylaminobenzoic acid ethyl ester, and the like; and photopolymerization initiator aids, such as the like.

[0091] When used for the post-exposure heating curing described later, the photopolymerization initiator is preferably one having a function as a photobase generator. As the photopolymerization initiator having a function as such a photobase generator, for example, α-aminoacetophenones, oxime esters; compounds having acyloxyimino groups, N-formylated aromatic amino groups, N-acylated aromatic amino groups, nitrobenzyl carbamato groups, alkoxybenzyl carbamato groups, and the like can be mentioned.

[0092] [Use]

[0093] The thermosetting resin composition according to the present application can be preferably used for sealing and protecting purposes for SAW filters. In addition, the thermosetting resin composition according to the present application can be preferably used for purposes of forming a cured film of a printed wiring board, more preferably for purposes of forming a permanent protective film, particularly preferably for purposes of an interlayer insulating material, a coverlay, a solder resist composition, or a via filler. In addition, since the thermosetting resin composition according to the present application can form a cured product having excellent film strength even if it is a thin film, it can be applied to form a patterned film in a printed wiring board, such as a package substrate (a printed wiring board used in semiconductor packaging), which requires thinning. Further, the thermosetting resin composition according to the present application can be preferably used for flexible printed wiring boards.

[0094] [Dry film]

[0095] The dry film according to the present application has a first film and a resin layer composed of a dry coating film of the above-mentioned thermosetting resin composition formed on the first film. At the time of dry film formation, the thermosetting resin composition is diluted with the above-mentioned organic solvent and adjusted to an appropriate viscosity, and coated on the first film at a uniform thickness by a comma coater, a doctor blade coater, a lip coater, a bar coater, a squeeze coater, a reverse coating method, a transfer roll coater, a gravure coater, a spray coater, or the like, and generally dried at a temperature of 50 to 130°C for 1 to 30 minutes, whereby a film can be obtained. The coating film thickness is not particularly limited, and from the viewpoint of easier monolithicization, it is appropriately selected in the range of 10 to 250 μm, preferably 30 to 200 μm, based on the film thickness after drying.

[0096] As the first film, any publicly known film can be used without particular limitation, and for example, a film composed of a thermoplastic resin such as a polyethylene terephthalate film, a polyethylene naphthalate film, a polyimide film, a polyamide-imide film, a polypropylene film, a polystyrene film, or the like can be preferably used. Among them, from the viewpoints of heat resistance, mechanical strength, handleability, and the like, a polyester film is preferred. In addition, a laminate of these films can also be used as the first film.

[0097] In addition, from the viewpoint of improving the mechanical strength, the thermoplastic resin film as described above is preferably a film stretched in a uniaxial direction or a biaxial direction.

[0098] The thickness of the first film is not particularly limited, and for example, it can be set to 10 μm to 150 μm.

[0099] The dry film has a first film for the purpose of supporting the resin layer of the structure, and the like. The first film in the present application refers to a film that is at least bonded to the resin layer when laminated and integrally formed with the substrate or the like in contact with the resin layer side composed of the above-mentioned cured resin layer formed on the dry film by heating or the like. The first film can be peeled from the resin layer in a process after lamination. In particular, in the present application, it is preferable to be peeled from the resin layer in a process after curing. After forming the resin layer composed of the dried coating film of the curable resin composition on the first film, further, for the purpose of preventing dust from adhering to the surface of the resin layer or the like, it is preferable to laminate a second film (cover film) that can be peeled on the surface of the resin layer. The second film in the present application refers to a film that is peeled from the structure before lamination when laminated and integrally formed with the substrate or the like in contact with the resin layer side of the dry film by heating or the like. As the second film that can be peeled, for example, polyethylene film, polytetrafluoroethylene film, polypropylene film, paper after surface treatment, or the like can be cited, and when peeling the second film, it is only necessary that the adhesive force of the resin layer to the second film is smaller than the adhesive force of the resin layer to the first film.

[0100] The thickness of the second film is not particularly limited, and can be set to 10 μm to 150 μm, for example.

[0101] In order to produce a cured product on a printed wiring board using the dry film, the second film is peeled from the dry film, the exposed resin layer of the dry film is overlapped on the substrate on which a circuit is formed, and is attached using a laminator or the like to form a resin layer on the substrate on which a circuit is formed. Next, if the formed resin layer is subjected to heat curing, a cured product can be formed. In addition, as necessary, before heat curing, exposure and development can also be performed. The first film can be peeled before or after curing, and when exposure is performed, it can be peeled before or after exposure.

[0102] [Cured product]

[0103] The cured product of the present application is obtained by curing the above-mentioned thermosetting resin composition. The cured product of the present application can be applied to a printed wiring board, an electrical and electronic component, and the like. The cured product of the present application is easily broken, difficult to thermally expand, and difficult to warp, and thus, after sealing a plurality of chips together, the chips can be easily singulated in a process of singulating the chips one by one.

[0104] [Printed wiring board]

[0105] The printed wiring board of the present application has the cured product described above. As a method for producing the printed wiring board of the present application, for example, the thermosetting resin composition of the present application is adjusted to a viscosity suitable for a coating method by using the organic solvent described above, and is coated on a substrate by a dipping coating method, a flow coating method, a roll coating method, a bar coating method, a screen printing method, a curtain coating method, or the like, and then, under temperature conditions of 60 to 100°C, the organic solvent contained in the thermosetting resin composition is volatilized and dried (pre-drying) to form a tack-free resin layer. Further, by heating at a high temperature, the resin layer can be cured. In the case of a dry film, after being attached to the substrate with the resin layer in contact with the substrate by a laminator or the like, the first film is peeled off to form the resin layer on the substrate.

[0106] As the substrate described above, in addition to a printed wiring board or a flexible printed wiring board in which a circuit is formed in advance by copper or the like, there are substrates of a high-frequency circuit copper-clad laminate or the like using a material such as a paper phenol, a paper epoxy, a glass cloth epoxy, a glass polyimide, a glass cloth / non-woven cloth epoxy, a glass cloth / paper epoxy, a synthetic fiber epoxy, a fluororesin-polyethylene-polyphenyl ether, a polyphenylene oxide-cyanate ester, or the like, and thus, a copper-clad laminate of all grades (FR-4 or the like), a metal substrate, a polyimide film, a polyethylene terephthalate film, a polyethylene naphthalate (PEN) film, a glass substrate, a ceramic substrate, a wafer board, and the like can be cited.

[0107] When the thermosetting resin composition is dry-filmed, it is preferable to attach it to a substrate under pressure and heating conditions using a vacuum laminator or the like. By using such a vacuum laminator, even in the case of using a circuit-formed substrate, the circuit substrate is adhered even if there are irregularities on the surface of the circuit substrate, and thus, air bubbles are not mixed in, and the filling property of the recessed portions of the substrate surface is also improved. The pressure conditions are preferably around 0.1 to 2.0 MPa, and the heating conditions are preferably 40 to 120°C.

[0108] For the curing after coating the thermosetting resin composition, a hot air circulation type drying furnace, an IR furnace, a hot plate, a convection oven, or the like (a method in which a heat source having an air heating system with steam is used, and hot air in the drying machine is brought into contact by convection, and a method in which a nozzle is used to spray a support) can be used. Among them, from the viewpoint of the curing property, it is preferable to use a hot air circulation drying furnace. For example, after performing the first stage of heating at 80 to 120°C, preferably 90 to 110°C, for 10 to 60 minutes, preferably 20 to 40 minutes, and then performing the second stage of heating at 180 to 220°C, preferably 190 to 210°C, for 30 to 120 minutes, preferably 50 to 70 minutes, a cured product can be formed. By performing two-stage curing, it is preferable from the aspect that the generation of bubbles at the time of curing can be suppressed. Specifically, by causing the residual solvent to be partially volatilized in the first stage, the generation of bubbles at the time of main curing can be suppressed. Then, by further curing at a high temperature in the second stage, the curing can be completed.

[0109] [Electrical and Electronic Component]

[0110] The electrical and electronic component of the present application has the printed wiring board described above. The electrical and electronic component of the present application can be used for various electrical devices known in the past. Among them, a SAW filter is preferable.

[0111] As the substrate described above, for example, a printed wiring board, a LTCC (Low Temperature Co-fired Ceramics) board (hereinafter, also referred to as a low temperature co-fired ceramic board), a ceramic board, a silicon board, a metal board, or the like can be given. As the electrical and electronic component, a sensor, a MEMS, a SAW chip, or the like can be given. Among them, a pressure sensor, a vibration sensor, a SAW chip, and particularly a SAW chip can be preferably used.

[0112] When the thermosetting resin composition is dried, it is preferable to be attached to the substrate under pressure and heating conditions using a vacuum laminator or the like. By using such a vacuum laminator, even if there are irregularities in the case where a substrate on which a component is mounted is used, it is adhered to the substrate, and therefore, bubbles are not mixed, and in addition, the sealing property of the electrical and electronic component is improved. The pressure condition is preferably around 0.1 to 2.0 MPa, and in addition, the heating condition is preferably 40 to 120°C.

[0113] For the curing after coating the thermosetting resin composition, a hot air circulation type drying furnace, an IR furnace, a hot plate, a convection oven, or the like (a method in which a heat source having an air heating system with steam is used, hot air in a drying machine is brought into contact by convection, or a method in which a nozzle is used) can be used. Among them, from the viewpoint of the curability, a hot air circulation drying furnace is preferably used. For example, after heating for 10 to 60 minutes, preferably 20 to 40 minutes, at 80 to 120°C, preferably 90 to 110°C, in a first stage, and then heating and curing for 30 to 120 minutes, preferably 50 to 70 minutes, at 180 to 220°C, preferably 190 to 210°C, in a second stage, a cured product can be formed. By performing two-stage curing, it is preferable from the aspect that the generation of bubbles at the time of curing can be suppressed. Specifically, by volatilizing the residual solvent portion in the first stage, the generation of bubbles at the time of main curing can be suppressed. Then, by further curing at a high temperature in the second stage, the curing can be completed.

[0114] In addition, when the thermosetting resin composition contains, for example, a photopolymerization initiator, a photobase generator, which also has a function as a photobase generator, by performing light irradiation before the heating step, the generated base and the liquid thermosetting resin (an epoxy resin having a bisphenol skeleton, or the like) undergo an addition reaction, and thus the coating film of the thermosetting resin composition can be cured to a deeper portion.

[0115] Example

[0116] Hereinafter, the present application will be described in more detail using examples, but the present application is not limited to the following examples. Note that "parts" and "%" in the following are all on a mass basis, unless otherwise specified.

[0117] Preparation of the thermosetting resin composition

[0118] (Examples 1 to 3, 5, Comparative Examples 1 to 4)

[0119] The solvent having the composition shown in each of the examples and comparative examples of the following Table 1 was put into a container, warmed to 50°C so that the solvent did not volatilize, and the respective epoxy resins were added, and sufficiently stirred to dissolve. Next, the additives and the fillers were added, and mixed by a three-roll mill, and then the curing agent, the curing accelerator, and other resins were added, and sufficiently stirred by a stirrer, to obtain a curable resin composition.

[0120] (Example 4)

[0121] Each component was mixed in accordance with the formulation shown in the following Table 1, and dispersed by a three-roll mill, to obtain a curable resin composition.

[0122] Table 1

[0123]

[0124] In Table 1, the blending amount of each component is based on parts by mass.

[0125] *1: jER828 manufactured by Mitsubishi Chemical Corporation. *2: XD-1000 manufactured by Nippon Shokubai Co., Ltd.

[0126] *3: HP-7200L manufactured by DIC Corporation.

[0127] *4: EPICLON N-740 manufactured by DIC Corporation.

[0128] *5: HP-4032D manufactured by DIC Corporation.

[0129] *6: YX6954BH30 (solid content: 30 mass%) manufactured by Mitsubishi Chemical Corporation.

[0130] *7: Teisan Resin SG-P3 (solid content: 15 mass%) manufactured by Nagase Chemtex Corporation.

[0131] *8: SG-80H (solid content: 15 mass%) manufactured by Nagase Chemtex Corporation.

[0132] *9: HF-1 manufactured by Meiji Chemicals Co., Ltd.

[0133] *10: 2E4MZ manufactured by Shikoku Chemicals Corporation.

[0134] *11: SO-C2 (silicon dioxide, amorphous, spherical, average particle diameter (D50) 0.5 μm) manufactured by Admatechs Co., Ltd.

[0135] *12: FB-7SDX (silicon dioxide, amorphous, spherical, average particle diameter (D50) 5.5 μm) manufactured by Denki Kagaku K.K.

[0136] *13: DAW-07 (alumina, spherical, average particle diameter (D50) 8.2 μm) manufactured by Denki Kagaku K.K.

[0137] *14: KBM-403 manufactured by Nissan Chemical Industries, Ltd.

[0138] *15: Carbon black.

[0139] *16: Cyclohexanone.

[0140] *17: diethylene glycol monoethyl ether acetate

[0141] <Manufacture of dry film and cured product thereof>

[0142] The thermosetting resin composition obtained in each of the examples and comparative examples was coated on a first film (PET film; TN200 manufactured by Toyo Rikaku Co., Ltd., thickness 38 μm, size 30 cm x 30 cm) using a bar coater so that the film thickness of the cured resin layer would be 100 μm. Next, a resin layer was formed on the first film by drying the resin layer composed of the thermosetting resin composition using a hot air circulating type drying furnace at 70 to 120°C (average 100°C) for 5 to 10 minutes so that the residual solvent of the resin layer would be 0.5 to 2.5 mass%. Next, an OPP film (ALPHAN FG-201, Fish Eye less, manufactured by Oji F-Tex Co., Ltd., thickness 16 μm, size 30 cm x 30 cm) was attached to the surface of the resin layer as a second film using a roll laminator set at a temperature of 80°C to manufacture a dry film.

[0143] Next, the second film was peeled from the dry film, and the dry film was attached to a 18 μm thick copper foil (GTS-MP foil, manufactured by Furukawa Electric Co., Ltd.) using a vacuum laminator (MVLP-500 manufactured by Nippon Steel & Sumikin Engineering Co., Ltd.) at a lamination temperature of 80 to 110°C and a pressure of 0.3 MPa. Next, the first film was peeled, and the resin layer was cured by heating at 100°C for 30 minutes using a hot air circulating type drying furnace, and immediately after the removal from the drying furnace, heating at 200°C for 60 minutes using another hot air circulating type drying furnace. Next, the cured product was peeled from the copper foil. Note that the film thickness of the cured product after the curing was 100 μm.

[0144] <Measurement of (i) breaking point strength>

[0145] The cured product obtained above was cut into a long strip of 70 mm x 5 mm to obtain a measurement sample. The measurement sample obtained was measured using a tensile testing machine (EZ-SX manufactured by Shimadzu Corporation) under the measurement conditions described below. The results are shown in Table 2.

[0146] (Measurement conditions)

[0147] Tensile speed: 1 mm / minute.

[0148] Measurement temperature: 23°C.

[0149] Distance between grips: 50 mm.

[0150] Number of samples n = 5.

[0151] <Measurement of (ii) coefficient of linear expansion>

[0152] The cured product obtained above was cut into a 15 mm x 3 mm long strip to obtain a measurement sample. The measurement sample obtained was measured using a TMA measurement device (manufactured by TA instruments, Q400EM) under the measurement conditions described below. The average linear expansion rate of the measurement results of the third step in the range of 30 to 100°C was taken as the linear expansion coefficient. The results are shown in Table 2.

[0153] (Measurement conditions)

[0154] First: 30°C → 300°C, temperature increase at 10°C / minute.

[0155] Second: 300°C → 30°C, temperature decrease at 10°C / minute.

[0156] Third: 30°C → 300°C, temperature increase at 10°C / minute.

[0157] < (iii) Measurement of Storage Elastic Modulus >

[0158] The cured product obtained above was cut into a 30 mm x 5 mm long strip to obtain a measurement sample. The measurement sample obtained was measured using a DMA measurement device (manufactured by Hitachi High-Tech Science Corporation, DMA7100) under the measurement conditions described below. The storage elastic modulus at 30°C was calculated from the measurement results. The results are shown in Table 2.

[0159] (Measurement conditions)

[0160] Measurement temperature: 30 to 300°C.

[0161] Temperature increase rate: 5°C / minute.

[0162] Loading gap: 10 minutes.

[0163] Frequency: 1 Hz.

[0164] Axial force: 0.05 N.

[0165] <Monolithic Test>

[0166] The 18-μm-thick copper foil was changed to a 9.5-cm x 11-cm, 0.8-μm-thick etched substrate (a substrate on which a copper-clad laminate manufactured by Showa Denko Materials Co., Ltd. was etched) and the resin layer was cured in accordance with <Production of Dry Film and Cured Product>. Next, the test was performed without peeling the cured product from the etched substrate. Specifically, the cured product on the etched substrate was cut to a size of 5 cm x 5 cm together with the etched substrate using a cutting device (manufactured by RITOKU Co., Ltd., cutting knife: diamond cutter) to obtain each test piece. The cut end surface of the test piece obtained was observed by a microscope and the ease of singulation was evaluated in accordance with the following criteria. The evaluation results are shown in Table 2.

[0167] (Evaluation Criteria)

[0168] O: No burr on the end surface of the cured product.

[0169] X: Burr on the end surface of the cured product.

[0170] Table 2

[0171]

[0172] As is also clear from Table 2, the heat-curable resin composition of the embodiment of the present application can easily singulate the chip by performing each optimization of the breaking point strength, the coefficient of thermal expansion, and the storage modulus.

Claims

1. A thermosetting resin composition comprising a thermosetting resin, a thermoplastic resin, a curing agent, and an inorganic filler, characterized in that, The thermosetting resin includes phenolic varnish-type epoxy resin. The thermoplastic resin is a polymeric resin with a glass transition temperature below 20°C and a weight-average molecular weight of over 10,000, and the polymeric resin is an acrylate copolymer. Based on the conversion of solid components, the content of the thermoplastic resin relative to the total amount of the thermosetting resin composition is 0.5% to 10% by mass. The curing agent is at least one selected from phenolic resin and imidazole resins. The inorganic filler is at least one selected from silicon dioxide and aluminum oxide. Based on the conversion of solid components, the content of the inorganic filler is more than 50% by mass of the total amount of the thermosetting resin composition. The cured product obtained by heating the thermosetting resin composition at 100°C for 30 minutes and then at 180°C for 60 minutes satisfies the following conditions: (i) The fracture point strength is below 100 MPa; (ii) The coefficient of linear expansion is below 35 ppm / ℃; and (iii) The energy storage modulus at 30°C is above 2 GPa.

2. The thermosetting resin composition of claim 1, wherein, The thermosetting resin further includes at least one of bisphenol A type epoxy resin and dicyclopentadiene type epoxy resin.

3. The thermosetting resin composition according to claim 1 or 2, wherein, Based on the conversion of solid components, the content of the inorganic filler is more than 55% by mass and less than 85% by mass of the total amount of the thermosetting resin composition.

4. The thermosetting resin composition according to claim 1 or 2, wherein, Based on the conversion of solid components, the content of the thermosetting resin is 3 to 40% by mass relative to the total amount of the thermosetting resin composition.

5. The thermosetting resin composition according to claim 1 or 2, wherein, Based on the solid content conversion, the content of the curing agent is 0.5 to 15% by mass relative to the total amount of the thermosetting resin composition.

6. A dry film, characterized in that, The dry film comprises: a first film; and a resin layer consisting of a dried coating of the thermosetting resin composition of claim 1 or 2 formed on the first film.

7. A cured product, characterized in that, The cured product is obtained by curing the thermosetting resin composition according to claim 1 or 2.

8. A printed wiring board, characterized in that, The printed wiring board has the cured material as described in claim 7.

9. An electrical and electronic component, characterized in that, The electrical and electronic component has the printed wiring board as described in claim 8.

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