Optical module temperature control device and method

Abstract

This invention discloses an optical module temperature control device and method. An inner box containing an optical module is placed inside an outer box. A TEC (Digital Temperature Control Unit) is connected to both the inner and outer boxes to regulate the temperature of the optical module inside the inner box. This ensures that when the optical module is working inside the inner box, the ambient temperature of the inner box can be maintained within the normal operating temperature range of the optical module. When operating at low temperatures, the optical module is heated to quickly reach its normal operating temperature. When operating at high temperatures, the optical module is cooled to stabilize it within the normal operating temperature range, thus ensuring excellent optical performance.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of optical communication, and more particularly relates to an optical module temperature control device and method. BACKGROUND

[0002] As an important active optical device, an optical module (Optical transceiver) realizes electrical-optical conversion and optical-electrical conversion at the sending end and the receiving end respectively. Since the transmission of communication signals mainly uses optical fibers as the medium, the sending end, the forwarding end, the processing end and the receiving end process electrical signals. The optical module has a wide and growing market space. The upstream of the optical module is mainly optical chips and passive optical devices, and the downstream customers are mainly telecom main equipment manufacturers, operators and Internet cloud computing enterprises.

[0003] The optical module follows the packaging sequence of chip-assembly-module. Laser chips and detector chips form TOSA (Transmitter Optical Subassembly, optical transmitter subassembly) and ROSA (Receiver Optical Subassembly, optical receiver subassembly) through traditional TO packaging, and at the same time, the supporting electrical chips are mounted on a PCB (Printed Circuit Board). The optical channel and the optical fiber are connected through precise coupling, and finally a complete optical module is packaged. It is mainly applied to short-distance multi-mode COB (Chip On board, chip on board packaging), adopts hybrid integration method, and through special bonding welding process, the chip is mounted on the PCB, and non-hermetic packaging is adopted.

[0004] Among them, the SFP (Small Form-factor Pluggable) + AOC (Active Optical Cables) optical module is mainly applied to short distance. With the development of cloud computing, Internet of Things, mobile Internet and other applications, the sharply increasing data traffic puts higher and higher requirements on bandwidth. In the past two years, the "Broadband China" strategy and the strategy of accelerating the construction of a network power have been put forward. As one of the most important information communication infrastructure, optical communication plays an increasingly important role in supporting China's social informatization, broadband construction and network power. The optical communication industry develops rapidly, drives the upgrading of optical modules, and in the increasingly fierce market competition of optical communication, the demand for smaller and smaller communication equipment, the interface density and the interface board contain higher, and in order to meet the demand, the optical communication equipment develops towards the direction of highly integrated small package.

[0005] From the demand side, the growing demand for bandwidth drives the demand for high-speed optical modules to grow rapidly, bringing sustained growth in revenue to optical module manufacturers; At the same time, due to the fact that optical module products belong to non-standard products, there are more customization requirements, which also makes the development of optical modules more difficult. No matter optical, circuit or structure, it puts forward higher requirements for optical modules.

[0006] In the field of optical communication, in order to ensure the stability of the optical module, the optical module needs to be heated when working at low temperature, so that it can quickly rise to the working point; When working at high temperature, the optical module needs to be cooled to ensure good optical indicators within a certain temperature range.

[0007] Therefore, overcoming the shortcomings of the prior art product is a problem to be solved in the technical field. SUMMARY

[0008] In view of the above defects or improvement needs of the prior art, the present application provides an optical module, which aims to ensure the stability of the optical module, and heat the optical module when working at low temperature, so that it can quickly rise to the working point; When working at high temperature, the optical module needs to be cooled to ensure good optical indicators within a certain temperature range.

[0009] In a first aspect, an optical module temperature control device comprises: an inner box 1, an outer box 2, a mounting hole 11, a threaded column 21 and a TEC 3;

[0010] The optical module is accommodated in the inner box 1, the inner box 1 is arranged inside the outer box 2, and the connection between the inner box 1 and the outer box 2 is realized through the cooperation between the mounting hole 11 arranged on the outer side of the inner box 1 and the threaded column 21 arranged on the inner surface of the outer box 2.

[0011] The inner box 1 is provided with an inner box heat sink surface 12 on both sides, the inner surface of the outer box 2 is provided with an outer box heat sink surface 22 corresponding to the position of the inner box heat sink surface 12, and the TEC 3 is arranged between the inner box heat sink surface 12 and the outer box heat sink surface 22, used to control the environment temperature of the inner box 1 to maintain it within the working temperature range of the optical module.

[0012] Preferably, a heat insulation and shock absorption ring 4 is arranged between the cooperation positions of the mounting hole 11 on the outer side of the inner box 1 and the threaded column 21 on the inner surface of the outer box 2, used to reduce the relative displacement between the inner box 1 and the outer box 2, and block the heat dissipation path between the inner box 1 and the outer box 2.

[0013] Preferably, the heat insulation and shock absorption ring 4 comprises a fixing hole 41 and a step 42, wherein:

[0014] The step 42 is located at the lower end of the fixing hole 41 and has a diameter greater than the outer diameter of the fixing hole 41.

[0015] The fixing hole 41 is used for inserting the threaded column 21 on the inner surface of the outer box 2, so as to set the heat insulation and shock absorption ring 4 on the threaded column 21 on the inner surface of the outer box 2.

[0016] The mounting hole 11 on the outer side of the inner box 1 is inserted from the outer side of the fixing hole 41 and is placed on the upper end of the step 42, so as to complete the sequential connection of the mounting hole 11, the heat insulation and shock absorption ring 4 and the threaded column 21.

[0017] Preferably, the inner box 1 is not in contact with the upper surface inside the outer box 2, the lower surface inside the outer box 2 and the side surface inside the outer box 2 to form an air gap, so as to reduce the heat transfer efficiency between the inner box 1 and the outer box 2.

[0018] Preferably, the upper surface and the lower surface of the TEC 3 are coated with a thermal conductive silicone grease, which is used to increase the thermal conductivity of the contact surface between the TEC 3 and the inner box heat sink surface 12 and the outer box heat sink surface 22.

[0019] Preferably, the outer box 2 is provided with a heat dissipation fin 23 on the outer side wall, which is used to dissipate heat to the air through the heat dissipation fin 23 on the outer box 2 when the TEC 3 cools the inner box 1.

[0020] In the second aspect, a light module temperature control method is provided, wherein a first heat sink surface and a second heat sink surface are located on one side of an inner box 1, and a third heat sink surface is located on the other side of the inner box 1, and the method comprises the following steps:

[0021] A control end of a TEC 3 obtains a light module model and a layout space position relationship of a current inner box 1;

[0022] According to the light module model and the layout space position relationship, a temperature control proportion model of a first TEC, a second TEC and a third TEC corresponding to the first heat sink surface, the second heat sink surface and the third heat sink surface is determined;

[0023] When the TEC 3 is triggered to adjust according to the temperature detected by a temperature sensor located inside the inner box 1, the temperature control output of the first TEC, the second TEC and the third TEC is adjusted according to the temperature control proportion model.

[0024] Preferably, the light module model comprises a transmitting light module and / or a receiving light module, and a package shape matched with the light module model; and the layout space position relationship comprises one or more of a single horizontal arrangement, a single vertical arrangement, a double parallel arrangement and a three-array arrangement.

[0025] Preferably, the light module model comprises one or more of an EDFA, an OPM, a TOF and a WSS.

[0026] Preferably, the temperature control proportion model is specifically obtained by testing the distribution characteristics of the corresponding heat generation on the first heat sink surface, the second heat sink surface and the third heat sink surface according to the model, number and layout space position relationship of the layout of the light emitting module and / or the light receiving module, so as to obtain the temperature control proportion model of the first TEC, the second TEC and the third TEC, and store in the control end of the TEC3.

[0027] Compared with the prior art, the present application has the following beneficial effects:

[0028] The present application provides a light module temperature control device and method, which sets the inner box 1 containing the light module in the outer box 2, and the TEC3 and the inner box 1 are connected with the outer box 2, which is used for adjusting the temperature of the light module in the inner box 1, so as to ensure that the environment temperature of the inner box 1 can be maintained within the normal working temperature range of the light module when the light module works in the inner box 1. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a structure diagram of a light module temperature control device provided by an embodiment of the present application;

[0030] Figure 2 is a structure diagram of an inner box of a light module temperature control device provided by an embodiment of the present application;

[0031] Figure 3 is a structure diagram of an outer box of a light module temperature control device provided by an embodiment of the present application;

[0032] Figure 4 is a sectional view of an outer box of a light module temperature control device provided by an embodiment of the present application;

[0033] Figure 5 is a structure diagram of a heat insulation and shock absorption ring of a light module temperature control device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0035] In the description of the present application, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and does not require the present application to be constructed and operated in a particular orientation, therefore should not be understood as a limitation of the present application.

[0036] In addition, the technical features involved in each embodiment of the application described below can be combined with each other as long as they do not conflict with each other.

[0037] Embodiment 1:

[0038] The embodiment provides an optical module temperature control device, which comprises an inner box 1, an outer box 2, a mounting hole 11, a threaded column 21 and a TEC 3.

[0039] The optical module is accommodated in the inner box 1, the inner box 1 is arranged inside the outer box 2, and the connection between the inner box 1 and the outer box 2 is realized through cooperation between the mounting hole 11 arranged on the outer side of the inner box 1 and the threaded column 21 arranged on the inner surface of the outer box 2.

[0040] A window corresponding to the contour shape of the inner box 1 is arranged on the lower surface in the inner box 2, and the window is used for accommodating the inner box 1, wherein the contour size of the window is slightly larger than the contour size of the inner box 1, so as to ensure that the inner box 1 has sufficient space in the window and does not contact the outer box 2.

[0041] The mounting hole 11 is arranged on both sides of the inner box 1 and one side of the cut corner, and the threaded column 21 corresponding to the position of the mounting hole 11 is arranged on the lower surface in the inner box 2; the cooperation and connection between the mounting hole 11 and the threaded column 21 at the corresponding position are completed, so as to ensure the fixed support of the inner box 1 in the window of the outer box 2.

[0042] The inner box 1 is provided with an inner box heat sink surface 12 on both sides, the outer box 2 is provided with an outer box heat sink surface 22 corresponding to the position of the inner box heat sink surface 12 on the inner surface, and the TEC 3 is arranged between the inner box heat sink surface 12 and the outer box heat sink surface 22, and is used for regulating the environment temperature of the inner box 1 to maintain the working temperature range of the optical module.

[0043] The TEC 3 (Thermo Electric Cooler) is a semiconductor cooler.

[0044] The inner box heat sink surface 12 and the outer box heat sink surface 22 are used for heat transfer or heat receiving, the size and shape of the inner box heat sink surface 12 and the outer box heat sink surface 22 are determined according to the size and shape of the TEC 3, and the TEC 3 can be completely covered; one side of the inner box 1 is provided with one inner box heat sink surface 12, and the other side is provided with two inner box heat sink surfaces 12; in actual situation, the number and position of the inner box heat sink surface 12 are designed according to one or more of the following factors: the position of the inner box 1 in the outer box 2, the position of other components in the outer box 2, and the size of each component; all the situations involved here should be within the protection scope of the present application; the inner box heat sink surface 12 and the corresponding outer box heat sink surface 22 form a group, the more the number of heat sink surface groups and the more dispersed and uniform the distribution of the heat sink surface groups on the side of the inner box 1, the higher the temperature control efficiency of the optical module in the inner box 1.

[0045] The TEC 3 is arranged between the inner box heat sink surface 12 and the outer box heat sink surface 22, so that the inner box heat sink surface 12 and the outer box heat sink surface 22 do not contact each other.

[0046] If only the mounting hole 11 on the inner box 1 and the threaded column 21 on the outer box 2 are used, the inner box 1 cannot be firmly fixed in the outer box 2, and the mounting hole 11 on the threaded column 21 can be relatively displaced, so that the inner box 1 shakes in the outer box 2, causing damage to related components, and in order to ensure the heating or cooling effect of the TEC 3 on the optical module in the inner box 1, when the TEC 3 heats the inner box 1, the heat of the inner box 1 can be lost from the joint between the mounting hole 11 and the threaded column, greatly reducing the heating efficiency of the TEC 3 on the inner box 1, so the mounting hole 11 on the inner box 1 and the threaded column 21 on the outer box 2 should not be directly connected.

[0047] The mounting hole 11 on the outer side of the inner box 1 and the threaded column 21 on the inner surface of the outer box 2 are provided with a heat insulation and shock absorption ring 4 therebetween, which is used to reduce the relative displacement between the inner box 1 and the outer box 2, and block the heat dissipation path between the inner box 1 and the outer box 2.

[0048] The heat insulation and shock absorption ring 4 includes a fixing hole 41 and a step 42, wherein:

[0049] The step 42 is located at the lower end of the fixing hole 41, and the diameter is greater than the outer diameter of the fixing hole 41;

[0050] The fixing hole 41 is used to insert the threaded column 21 on the inner surface of the outer box 2, so as to arrange the heat insulation and shock absorption ring 4 on the threaded column 21 on the inner surface of the outer box 2;

[0051] The mounting hole 11 outside the inner box 1 is inserted from outside the fixing hole 41 and placed on the upper end of the step 42, completing the connection of the mounting hole 11, the heat insulation and shock absorption ring 4, and the threaded column 21 in sequence.

[0052] The heat insulation and shock absorption ring 4 is made of a material with a low thermal conductivity, so as to block the heat transfer path.

[0053] The threaded column 21 has a cylindrical threaded groove in the center through hole, which is used to set a screw therein. The diameter of the hole of the mounting hole 11 should be larger than the outside diameter of the corresponding threaded column 21. When the mounting hole 11 is arranged on the upper end of the step 42, the mounting hole 11 is pressed by the nut of the screw, so that the mounting hole 11 cannot be displaced up and down on the threaded column 21, thereby fixing the inner box 1 in the outer box 2. When the mounting hole 11 cooperates with the threaded column 21, a heat insulation and shock absorption ring 4 is arranged therebetween to compensate for the tightness, and further to ensure that the mounting hole 11 and the threaded column 21 are not directly in contact, thereby avoiding unnecessary heat loss.

[0054] In order to further ensure that the TEC 3 heats or cools the inner box 1, and that the inner box 1 and the outer box 2 do not have unnecessary heat loss and heat transfer, thereby reducing the temperature control efficiency of the TEC 3 on the optical module in the inner box 1, it is necessary to reduce the heat transfer efficiency between the inner box 1 and the outer box 2.

[0055] The upper surface inside the inner box 1 and the outer box 2, the lower surface inside the outer box 2, and the side surface inside the outer box 2 are not in contact with each other to form an air gap, so as to reduce the heat transfer efficiency between the inner box 1 and the outer box 2.

[0056] According to the structure requirement that the upper surface inside the inner box 1 and the outer box 2, the lower surface inside the outer box 2, and the side surface inside the outer box 2 are not in contact with each other to form an air gap, the embodiment provides a design as a reference:

[0057] An upper cover is arranged on the upper surface of the outer box 2, which covers the top of the inner box 1 arranged in the outer box 2, blocks the inner box 1, and isolates the inner box 1 from the outside, thereby blocking most of the heat exchange between the inner box 1 and the outside. The upper cover is shaped to match the upper surface of the outer box 2, and needs to completely cover the top of the inner box 1. Screw holes are arranged on the edge of the upper cover, and screw columns corresponding to the screw holes of the upper cover are arranged inside the outer box 2. The upper cover is arranged on the upper surface of the outer box 2 and covers the top of the inner box 1. Screws are inserted into the screw holes of the upper cover and cooperate with the screw columns on the outer box 2 to fix the upper cover on the upper surface of the outer box 2.

[0058] A lower cover is arranged on the lower surface of the outer box 2, which is used to cover the bottom of the inner box 1 arranged in the outer box 2, and plays a role of blocking the inner box 1 and isolating the inner box 1 from the outside, so as to block most of the heat exchange between the inner box 1 and the outside. The lower cover is shaped to match the lower surface of the outer box 2, and needs to completely cover the bottom of the inner box 1. The edge of the lower cover is provided with a screw hole, and the lower surface of the outer box 2 is provided with a screw column at a position corresponding to the screw hole of the lower cover. The lower cover is arranged on the lower surface of the outer box 2 and covers the bottom of the inner box 1. The screw is inserted into the screw hole of the lower cover and cooperates with the screw column on the outer box 2 to fix the lower cover on the lower surface of the outer box 2.

[0059] When the upper cover is arranged on the upper surface of the outer box 2, the upper cover is away from the upper surface of the inner box 1 arranged in the outer box 2, so that the upper cover is not in contact with the upper surface of the inner box 1. When the lower cover is arranged on the lower surface of the outer box 2, the lower cover is away from the lower surface of the inner box 1 arranged in the outer box 2, so that the lower cover is not in contact with the lower surface of the inner box 1.

[0060] When the inner box 1 is arranged in the outer box 2, the side surface of the inner box 1 is away from the inner side surface of the outer box 2, and the inner box heat sink surface 12 arranged on the side surface of the inner box 1 is also not in contact with the inner side surface of the outer box 2.

[0061] According to the positional relationship between the upper cover, the lower cover, the inner side surface of the outer box 2 and the inner box 1, it can be ensured that the inner box 1 is not in contact with the upper surface inside the outer box 2, the lower surface inside the outer box 2 and the side surface inside the outer box 2, so that an air gap can be formed between the inner box 1 and the outer box 2, and the inner box 1 has a heat preservation effect in the outer box 2.

[0062] The upper surface and the lower surface of the TEC 3 are coated with thermal conductive silicone grease, which is used to increase the thermal conductivity of the contact surface between the TEC 3 and the inner box heat sink surface 12 and the outer box heat sink surface 22.

[0063] In addition to the thermal conductive silicone grease, other materials commonly used by those skilled in the art to increase the thermal conductivity between the TEC 3 and the inner box heat sink surface 12 and the outer box heat sink surface 22 should be within the protection scope of the present application.

[0064] The semiconductor cooler of the TEC3 is made by using the Peltier effect of semiconductor material. The Peltier effect refers to the phenomenon that one end absorbs heat and the other end releases heat when a direct current passes through an electric couple composed of two semiconductor materials. The heavily doped N-type and P-type bismuth telluride are mainly used as the semiconductor material of the TEC3. The bismuth telluride elements are electrically connected in series and are in parallel heat generation. The TEC3 includes some P-type and N-type pairs which are connected by electrodes and are clamped between two ceramic electrodes. When a current passes through the TEC3, the heat generated by the current is transferred from one side of the TEC3 to the other side, so that the TEC3 has the functions of heating and cooling.

[0065] When the ambient temperature is higher than the operating temperature of the optical module, the TEC3 cools down, the heat of the inner box 1 is transferred to the TEC3 through the lower surface of the inner box heat sink surface 12, and the TEC3 transfers the heat to the outer box 2 through the upper surface of the outer box heat sink surface 22. At this time, an efficient method is needed to dissipate the heat received by the outer box 2 to the air. If the heat cannot be quickly dissipated from the outer box 2, the temperature of the inner box 1 arranged in the outer box 2 will be affected, and the cooling efficiency of the TEC3 will be reduced. Therefore, a component for dissipating heat to the outside needs to be arranged in the outer box 2.

[0066] The outer side wall of the outer box 2 is provided with a heat dissipation fin 23, which is used to transfer the heat of the inner box 1 to the outer box 2 through the TEC3 when the TEC3 cools down the inner box 1, and dissipate the heat to the air through the heat dissipation fin 23 on the outer box 2.

[0067] Because the different side edges in the outer box 2 are different distances from the outer box heat sink surface 22 arranged in the outer box 2, and considering that the heat dissipation fin 23 is used to dissipate the heat received by the outer box 2 from the TEC3 from the inner box 1, the heat dissipation fin 23 should be arranged as close as possible to the outer side of the outer box 2 which is closer to most of the outer box heat sink surface 22, so that most of the heat received by the outer box 2 can be dissipated as quickly as possible.

[0068] The optical module is arranged in the inner box 1, and the optical module still needs to interact with the circuit board, so the circuit board also needs to be arranged in the outer box 2, and the circuit board interface cooperates with the optical module in the inner box 1. Therefore, the size of the outer box 2 needs to be designed to accommodate the inner box 1 and the circuit board at the same time, and to provide space for the air gap of the inner box 1. The circuit board is connected to the outer box 2 by cooperating the screw holes on the inner surface of the outer box 2 with the screws, and the circuit board is arranged in the outer box 2.

[0069] Embodiment 2:

[0070] The embodiment 2 of the present application provides a light module temperature control method, and the foregoing embodiment focuses on the light module temperature control device, and the light module temperature control method is specifically described below in combination with the light module temperature control device of the embodiment 1.

[0071] In the present embodiment, there are three inner box heat sink surfaces 12 in the inner box 1, and therefore the corresponding outer box heat sink surfaces 22 and TECs 3 also each have three, wherein the first heat sink surface and the second heat sink surface are located on one side of the inner box 1, and the third heat sink surface is located on the other side of the inner box 1, and therefore the fins 23 should be arranged on the outer side of the outer box 2 corresponding to the first heat sink surface and the second heat sink surface, so as to increase the cooling efficiency of the TEC 3.

[0072] Among them, due to different shapes of different light module models and different working temperature ranges, the position and layout of the inner box heat sink surface 12 corresponding to the inner box 1 are also different.

[0073] The control end of the TEC 3 obtains the light module model and the layout space position relationship of the current inner box 1;

[0074] Among them, the light module model includes one or more of EDFA, OPM, TOF and WSS.

[0075] Different positions of the TEC 3 have different distances from the outside, and the corresponding TEC 3 also has different temperature control efficiencies for the light module. The TEC 3 close to the outside has lower heating efficiency but higher cooling efficiency for the light module, and the TEC 3 close to the inside has higher heating efficiency but lower cooling efficiency for the light module, and therefore the following method is also involved:

[0076] According to the light module model and the layout space position relationship, a temperature control proportion model of the first TEC, the second TEC and the third TEC corresponding to the first heat sink surface, the second heat sink surface and the third heat sink surface is determined.

[0077] When the TEC 3 adjustment is triggered according to the temperature detected by the temperature sensor located inside the inner box 1, the temperature control output of the first TEC, the second TEC and the third TEC is adjusted according to the temperature control proportion model.

[0078] According to the layout space position relationship, the heating or cooling efficiency of each TEC 3 is known, when the ambient temperature is higher than the working temperature range corresponding to the optical module model, the optical module needs to be cooled, the cooling efficiency of the TEC 3 relatively close to the outer side is higher, so the temperature control proportion of the TEC 3 close to the outer side is larger, and the cooling efficiency of the TEC 3 close to the inner side is relatively low, so the temperature control proportion of the TEC 3 close to the inner side is relatively small; when the ambient temperature is lower than the working temperature range corresponding to the optical module model, the optical module needs to be heated, the heating efficiency of the TEC 3 relatively close to the outer side is relatively low, so the temperature control proportion of the TEC 3 close to the outer side is relatively small, and the heating efficiency of the TEC 3 close to the inner side is relatively high, so the temperature control proportion of the TEC 3 close to the inner side is relatively large;

[0079] The optical module model includes a transmitting optical module and / or a receiving optical module, and a package shape matched with the optical module model; the layout space position relationship includes one or more of a single horizontal arrangement, a single vertical arrangement, a double parallel arrangement, and a three-array arrangement.

[0080] The temperature control proportion model is specifically that, according to the model, the number and the layout space position relationship of the transmitting optical module and / or the receiving optical module of the layout, the distribution characteristics of the corresponding heat generation on the first heat sink surface, the second heat sink surface and the third heat sink surface are tested, so as to obtain the temperature control proportion model of the first TEC, the second TEC and the third TEC, and store in the control end of the TEC 3.

[0081] Embodiment 3:

[0082] The embodiment 3 of the present application provides a light module temperature control method, and the embodiment 3 shows the use method of the light module temperature control device from a more specific scene on the basis of the embodiment 1 and the embodiment 2.

[0083] The TEC 3 first acquires the optical module model and the layout space position relationship of the current inner box 1, according to the optical module model and the related layout space relationship of the light module collected in the inner box 1 in the current device, the temperature control proportion model of each TEC 3 is determined, so as to adjust the temperature control output of each TEC 3, and the temperature control proportion model of each TEC 3 is stored in the control end of the corresponding TEC 3.

[0084] When the ambient temperature of the inner box 1 is lower than the working temperature range of the optical module, the TEC 3 control end heats the inner box 1 according to the corresponding temperature control proportion model, so that the temperature of the optical module in the inner box 1 is increased, and at the same time, due to the air gap between the inner box 1 and the outer box 2, and the connection between the inner box 1 and the outer box 2 through the heat insulation and shock absorption ring 4, the heat dissipation path of the inner box 1 is blocked, and under the heating action of the TEC 3, the ambient temperature of the inner box 1 is maintained within the working temperature range of the optical module;

[0085] When the ambient temperature of the inner box 1 is higher than the working temperature range of the optical module, the TEC 3 control end cools the inner box 1 according to the corresponding temperature control proportion model, so that the temperature of the optical module in the inner box 1 is reduced, and the heat of the inner box 1 is transferred to the outer box 2 through the TEC 3, and dissipated through the heat dissipation fins 23 on the outer box 2, so that the ambient temperature of the inner box 1 is maintained within the working temperature range of the optical module.

[0086] Those skilled in the art will easily understand that the above description is only the preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature control device for an optical module, characterized in that, Comprise: Inner box (1), outer box (2), mounting hole (11), threaded column (21) and TEC (3); Wherein, the optical module is contained in the inner box (1), the inner box (1) is arranged in the outer box, and the connection between the inner box (1) and the outer box (2) is realized by the cooperation between the mounting hole (11) arranged on the outer side of the inner box and the threaded column (21) arranged on the inner surface of the outer box; The inner box (1) is provided with inner box heat sink surface (12) on both sides, the inner surface of the outer box (2) is provided with outer box heat sink surface (22) corresponding to the position of the inner box heat sink surface (12), and the TEC (3) is arranged between the inner box heat sink surface (12) and the outer box heat sink surface (22), used for controlling the environment temperature of the inner box (1) to maintain it within the working temperature range of the optical module; Wherein, the first heat sink surface and the second heat sink surface are located on one side of the inner box (1), the third heat sink surface is located on the other side of the inner box (1), and the control end of the TEC (3) obtains the model and layout space position relationship of the current optical module in the inner box (1); According to the model and layout space position relationship of the optical module, the temperature control proportion model of the first TEC, the second TEC and the third TEC corresponding to the first heat sink surface, the second heat sink surface and the third heat sink surface is determined; The temperature control proportion model is specifically that according to the model, number and layout space position relationship of the layout of the emitting optical module and / or receiving optical module, the distribution characteristics of the corresponding heat generation on the first heat sink surface, the second heat sink surface and the third heat sink surface are tested, so that the temperature control proportion model of the first TEC, the second TEC and the third TEC is obtained; When the TEC (3) is adjusted according to the temperature detected by the temperature sensor located in the inner box (1), the temperature control output of the first TEC, the second TEC and the third TEC is adjusted according to the temperature control proportion model.

2. The optical module temperature control device according to claim 1, wherein The mounting hole (11) on the outer side of the inner box (1) and the threaded column (21) on the inner surface of the outer box (2) are provided with a heat insulation and shock absorption ring (4) between the cooperation positions, which is used for reducing the relative displacement between the inner box (1) and the outer box (2), and blocking the heat dissipation path between the inner box (1) and the outer box (2).

3. The optical module temperature control device according to claim 2, wherein The heat insulation and shock absorption ring (4) comprises a fixed hole (41) and a step (42), wherein: The step (42) is located at the lower end of the fixed hole (41), and the diameter is greater than the outer diameter of the fixed hole (41); The fixed hole (41) is used for inserting the threaded column (21) on the inner surface of the outer box (2), so that the heat insulation and shock absorption ring (4) is arranged on the threaded column (21) on the inner surface of the outer box (2); The mounting hole (11) on the outer side of the inner box (1) is inserted from the outer side of the fixed hole (41) and placed on the upper end of the step (42), so that the mounting hole (11), the heat insulation and shock absorption ring (4) and the threaded column (21) are sequentially connected.

4. The optical module temperature control device according to claim 3, wherein The inner box (1) and the upper surface inside the outer box (2), the lower surface inside the outer box (2) and the side surface inside the outer box (2) are not in contact to form an air gap, so as to reduce the heat transfer efficiency between the inner box (1) and the outer box (2).

5. The optical module temperature control device according to claim 1, wherein The upper surface and the lower surface of the TEC (3) are coated with thermal conductive silicone grease, which is used to increase the thermal conductivity of the contact surface between the TEC (3) and the inner box heat sink surface (12) and the outer box heat sink surface (22).

6. The optical module temperature control device according to claim 1, wherein The outer box (2) is provided with a heat dissipation fin (23) on the outer side wall, which is used to transfer the heat of the inner box (1) to the outer box (2) through the TEC (3) when the TEC (3) cools the inner box (1), and the heat is dissipated to the air through the heat dissipation fin (23) on the outer box (2).

7. A method of temperature control of an optical module, the method comprising: The optical module temperature control device according to any one of claims 1-6, wherein the first heat sink surface and the second heat sink surface are located on one side of the inner box (1), and the third heat sink surface is located on the other side of the inner box (1), and the method comprises: The control end of the TEC (3) obtains the optical module model and the layout space position relationship of the current inner box (1); According to the optical module model and the layout space position relationship, the temperature control proportion model of the first TEC, the second TEC and the third TEC corresponding to the first heat sink surface, the second heat sink surface and the third heat sink surface is determined; When the TEC (3) is triggered to adjust according to the temperature detected by the temperature sensor located inside the inner box (1), the temperature control output of the first TEC, the second TEC and the third TEC is adjusted according to the temperature control proportion model.

8. The optical module temperature control method according to claim 7, wherein The optical module model includes transmitting optical modules and / or receiving optical modules, and the package shape matched with the optical module model; the layout space position relationship includes one or more of single horizontal arrangement, single vertical arrangement, double parallel arrangement and three array arrangement.

9. The optical module temperature control method according to claim 8, wherein The optical module model includes one or more of EDFA, OPM, TOF and WSS.

10. The optical module temperature control method according to claim 8, wherein The temperature control proportion model is specifically obtained by testing the distribution characteristics of the corresponding heat generation on the first heat sink surface, the second heat sink surface and the third heat sink surface according to the type, number and layout space position relationship of the transmitting optical modules and / or receiving optical modules in the layout, so as to obtain the temperature control proportion model of the first TEC, the second TEC and the third TEC, and store it in the control end of the TEC (3). The temperature control proportion model is specifically obtained by testing the distribution characteristics of the corresponding heat generation on the first heat sink surface, the second heat sink surface and the third heat sink surface according to the type, number and layout space position relationship of the transmitting optical modules and / or receiving optical modules in the layout, so as to obtain the temperature control proportion model of the first TEC, the second TEC and the third TEC, and store it in the control end of the TEC (3).

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