Wafer transfer method that does not rely on task delivery

Abstract

The present invention discloses a wafer transmission method that does not rely on task transmission, including: scanning a wafer box on a map to obtain the number of wafers in the wafer box, the wafer transmission route and the process task; obtaining the process chamber that the wafer is to enter, and then sending the wafer ID and the process task to the scheduling of the corresponding process chamber in sequence; forming a task pool through the scheduling of the process chamber, and obtaining the process task of the process chamber, wherein the process task is a station operation mode, and the station operation mode includes 2×3 and 6×1; each process chamber prepares corresponding execution conditions in advance according to the process task; if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the current wafer is allowed to enter the process chamber. It allows the process chamber to be relatively independent and establishes a corresponding task pool, which can sort the process tasks, so that the process chamber prepares the relevant execution conditions of the process in advance, and at the same time verifies the wafer entering the process chamber.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer transmission, and in particular to a wafer transmission method that is independent of task transfer. Background Art

[0002] Wafer refers to the substrate (also called base) for manufacturing semiconductor transistors or integrated circuits. Because it is a crystalline material and its shape is usually round, it is called a wafer. Various circuit component structures can be processed on the wafer to become integrated circuit products with specific electrical functions.

[0003] The existing wafer transfer logic performs a map search and matching operation when the wafer box is opened, which can determine how many wafers are in the wafer box, as well as the transmission route and process of each wafer; therefore, when the atmospheric robot arm takes out the wafer from the wafer box, it determines whether to put it into the upper LoadLock or the lower LoadLock according to the wafer transmission route and process, and then when the vacuum robot arm takes the wafer from the upper LoadLock or the lower LoadLock, it first reads the information carried on the wafer to determine which process chamber to transmit it to. Only when it enters the corresponding process chamber to read the wafer information can it know the specific process. This task-dependent transmission method causes the process chamber to be delayed in obtaining the information carried by the wafer, and it is impossible to verify whether the current wafer is the wafer to be run in this process, nor can it prepare the relevant execution conditions of the corresponding process in advance, resulting in low work efficiency.

[0004] In the wafer processing process, in order to make the thin film deposited on the wafer surface more uniform, the wafer is usually placed on multiple heaters in turn for chemical vapor deposition. However, when the existing equipment is taking and placing the wafer, the taking and placing equipment is very likely to rub against the wafer, causing damage and scratches to the wafer, resulting in a significant increase in the wafer rejection rate. In addition, the taking and placing equipment has a complex structure and occupies a large space, which is not conducive to the miniaturization of the processing equipment. Summary of the invention

[0005] The purpose of the present invention is to propose a wafer transmission method that is independent of task transfer, which allows the process chamber to be relatively independent and establishes a corresponding task pool. This task pool can sort the process tasks, so that the process chamber can prepare the relevant execution conditions of the process in advance, and at the same time verify the wafers entering the process chamber.

[0006] To achieve the above objectives, the wafer transfer method proposed in this application that does not rely on task transfer includes:

[0007] Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task;

[0008] According to the wafer transmission route and process tasks, the process chamber that each wafer is to enter is obtained, and then the wafer ID and process tasks are sent to the scheduling of the corresponding process chamber in sequence;

[0009] A task pool is formed through the scheduling of the process chamber, and the process task of the process chamber is obtained based on the task pool, wherein the process task is a station operation mode, and the station operation mode includes 2×3 and 6×1;

[0010] Each process chamber prepares corresponding execution conditions in advance according to the process task;

[0011] Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, the current wafer is allowed to enter the process chamber; if they are different, an alarm is issued;

[0012] After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares the corresponding execution conditions for the next task in advance.

[0013] In a preferred manner, the execution conditions are that the ejector pin can be raised and lowered normally and the wafer transfer rack can work normally. If the ejector pin or the wafer transfer rack fails, an alarm will be directly issued. If the ejector pin or the wafer transfer rack has no faults, the process chamber will be preheated, and when the preheating is about to be completed, it will be ready to receive the wafer into the process chamber. At this time, the ejector pin is in a dropped state and the chamber pressure is capable of transmitting the wafer.

[0014] In the preferred mode, the corresponding execution conditions are prepared in advance. At the same time, the atmospheric robot takes the wafer from the wafer box and sends it into the LoadLock. Then the vacuum robot takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber. Before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

[0015] In a preferred manner, if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot arm enters through a door or a double door structure of the process chamber. At this time, the ejector pin rises to support the wafer, and then the vacuum robot arm withdraws and the ejector pin falls, so that the wafer is located on the heater and the door is closed.

[0016] In the preferred manner, the 2×3station operation mode is specifically as follows: wafer No. 1 and wafer No. 2 are directly deposited for the first time after being seated on heater No. 1 and heater No. 2. After the first deposition is completed, the wafer transfer rack rises, lifts up the wafers and rotates them 120° clockwise before descending. Wafer No. 1 and wafer No. 2 are placed on heater No. 3 and heater No. 4. The vacuum robot arm delivers wafer No. 3 and wafer No. 4 into the process chamber and seats them on heater No. 1 and heater No. 2. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. After deposition, the wafer transfer rack rises, lifts up the wafers and rotates them 120° clockwise before descending. ° and then descend, wafer No. 1 and wafer No. 2 are placed on heater No. 5 and heater No. 6, wafer No. 3 and wafer No. 4 are placed on heater No. 3 and heater No. 4, the vacuum robot arm sends wafer No. 5 and wafer No. 6 into the process chamber and places them on heater No. 1 and heater No. 2. At this time, wafer No. 1 and wafer No. 2 are deposited for the third time, wafer No. 3 and wafer No. 4 are deposited for the second time, and wafer No. 5 and wafer No. 6 are deposited for the first time. After deposition, the wafer transfer rack rises, lifts up the wafer, rotates 120° clockwise and then descends, then the vacuum robot arm takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8 for deposition, and the cycle continues.

[0017] In the preferred manner, the 6×1station operation mode is specifically as follows: wafer No. 1 and wafer No. 2 are seated on heater No. 1 and heater No. 2, the wafer transfer rack rises, holds up the wafer and rotates it 120° clockwise and then descends, wafer No. 1 and wafer No. 2 are located on heater No. 3 and heater No. 4; the vacuum robot sends wafer No. 3 and wafer No. 4 into the process chamber and sits on heater No. 1 and heater No. 2, the wafer transfer rack rises, holds up the wafer and rotates it 120° clockwise and then descends, wafer No. 1 and wafer No. 2 are located on heater No. 5 and heater No. 6, wafer No. 3 and wafer No. 4 are located on heater No. 3 and heater No. 4, the vacuum robot sends wafer No. 5 and wafer No. 6 into the process chamber and sits on heater No. 1 and heater No. 2, at this time, all 6 wafers are subjected to the first deposition, after the first deposition is completed, the vacuum robot takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8, and so on.

[0018] In a preferred embodiment, the wafer transfer rack includes a transfer rack body, a lifting mechanism, a rotating mechanism and a main shaft; the main shaft is vertically arranged and the top thereof extends into the vapor deposition chamber in the shell and is fixedly connected to the transfer rack body; the transfer rack body is horizontally arranged and sleeved on the main shaft, and the transfer rack body has a plurality of claw structures circumferentially arranged around the axis of the main shaft, and a wafer placement area is formed between adjacent claw structures; a plurality of heaters are arranged around the main shaft in the shell, and when the wafer is placed on the base of the heater inside the shell, the claw structures are arranged on both sides of the lower end of the wafer side, used for supporting and transporting wafers; the lifting mechanism is arranged on the lower side of the shell and is connected to the main shaft, and is used for driving the transfer rack body to lift and lower by driving the main shaft to lift and lower the wafer, lift the wafer from the base of the heater, and lower the wafer after the wafer rotates to the target heater, so that the wafer drops to the base of the target heater; the rotating mechanism is connected to the main shaft, and can drive the transfer rack body to rotate to a position corresponding to the heater by driving the main shaft to rotate, and the rotating mechanism is used to drive the wafer to rotate to the target heater for vapor phase precipitation treatment by driving the main shaft and the transfer rack body to rotate.

[0019] In a preferred embodiment, the lifting mechanism includes a first drive motor, a guide rod and a slider; the first drive motor is connected to the main shaft through a motor shaft, a first bracket is provided on the first drive motor, the guide rod is vertically arranged on the first bracket, the slider is sleeved on the main shaft, and the first drive motor drives the slider to slide up and down along the guide rod by driving the main shaft to lift and lower.

[0020] In a preferred manner, the rotating mechanism is arranged between the shell and the lifting mechanism, and the rotating mechanism includes a rotating structure, a driving pin, a second driving motor, a belt and a rotating shaft; the rotating driving member is fixed on the vertically arranged rotating shaft, the second driving motor is connected to the rotating shaft through a belt, the rotating structure is sleeved on the motor shaft, and the rotating structure is provided with a number of slots that is consistent with the number of heaters around the motor shaft axis as the center line. The second driving motor drives the driving pin to rotate into the slot, and the driving pin drives the rotating structure to rotate around the rotating shaft, and drives the motor shaft, the main shaft and the transfer frame body to rotate.

[0021] In a preferred manner, the driving pin is arranged on a supporting plate installed on the rotating shaft; a turntable with an arc side wall arranged in a horizontal direction is also installed on the rotating shaft on the upper side of the supporting plate, and an arc-shaped positioning groove is provided between adjacent slots on the rotating structure; the side of the turntable close to the rotating structure is arranged in the positioning groove, and when the second driving motor drives the rotating shaft to rotate, the turntable rotates in the positioning groove.

[0022] Compared with the prior art, the above technical solution adopted by the present invention has the following advantages:

[0023] 1. The process chamber can predict the next process task in advance and prepare the corresponding execution conditions in advance. There is no need to wait until the wafer enters the process chamber to prepare the execution conditions, which greatly improves work efficiency and saves time;

[0024] 2. When the wafer is transferred to the process chamber, the information carried by the wafer can be compared with the task information of the process chamber task pool to play a verification role;

[0025] 3. Wafer transfer rack, the transfer rack body and the claw structure can rise or fall relative to the base under the drive of the lifting mechanism to lift or lower the wafer onto the base, and rotate the wafer to other heaters under the drive of the rotating mechanism. After the wafer is deposited on one heater, the transfer rack body transfers it to the next heater. Since the transfer rack body is arranged on the lower side of the wafer and does not contact the thin film on the surface of the wafer, it can prevent the wafer film from being damaged or scratched. At the same time, the transfer rack has a simple structure, occupies a small space, and is conducive to the miniaturization of processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A structural diagram of a wafer transfer method that does not rely on task delivery;

[0028] Figure 2 This is a schematic diagram of the double doors of the process chamber;

[0029] Figure 3 This is a schematic diagram of a single door of a process chamber;

[0030] Figure 4 It is a schematic diagram of the structure of a transfer rack body of a wafer transfer rack disclosed in Example 1;

[0031] Figure 5 It is a schematic diagram of the structure of a transfer rack body of a wafer transfer rack disclosed in Example 2;

[0032] Figure 6 A schematic diagram of a wafer transfer rack structure disclosed in Example 1 Figure 1 ;

[0033] Figure 7 A schematic diagram of a wafer transfer rack structure disclosed in Example 1 Figure 2 ;

[0034] Figure 8 This is a front view of a wafer transfer rack disclosed in Example 1;

[0035] Fig. 9 A top view of a wafer transfer rack disclosed in Example 1;

[0036] Fig.10 It is a front cross-sectional view of a wafer transfer rack disclosed in Example 1;

[0037] Fig.11 for Figure 6 A magnified view of part A;

[0038] Fig.12 for Figure 8 Enlarged view of part B.

[0039] In the figure: 1. transfer rack body; 11. claw structure; 12. wafer placement area; 2. lifting mechanism; 21. first drive motor; 22. guide rod; 23. slider; 3. rotation mechanism; 31. rotating structure; 311. slot; 312. positioning slot; 32. drive pin; 33. second drive motor; 34. belt; 35. rotating shaft; 36. turntable; 37. positioning plate; 38. support plate; 39. position sensor; 4. spindle; 5. shell; 6. base; 7. first bracket; 8. second bracket; 9. mounting plate; 10. bellows; 13. shaft shell; 14. vacuum pipeline; 15. wafer rack. Specific implementation methods

[0040] The principles of the present disclosure will be described below with reference to several example embodiments shown in the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that these embodiments are described only to enable those skilled in the art to better understand and implement the present disclosure, and are not intended to limit the scope of the present disclosure in any way.

[0041] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment".

[0042] Example 1

[0043] like Figure 1 As shown, this embodiment provides a wafer transmission method that does not rely on task transfer, including:

[0044] S1. Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task;

[0045] Specifically, a wafer box will be loaded on the outermost loading station, and a map search operation will be performed on the wafer box to obtain the number of wafers, the transmission route and task of each wafer.

[0046] S2. Obtain the process chamber that each wafer is to enter according to the wafer transmission route and process task, and then send the wafer ID and process task to the scheduling of the corresponding process chamber in sequence;

[0047] Specifically, in the entire scheduling, each part is separated out, instead of waiting to read the information carried by the wafer, the process chamber to be entered is obtained by analyzing the wafer transmission route and process tasks, so that the process chamber can know the task information in advance.

[0048] S3. A task pool is formed by scheduling the process chamber, and a process task of the process chamber is obtained based on the task pool, wherein the process task is a station operation mode, and the station operation mode includes 2×3 and 6×1;

[0049] Specifically, the task pool corresponding to each process chamber puts the tasks into a queue, and then the process chamber executes the process according to this queue each time.

[0050] In an exemplary embodiment, the 2×3station operation mode is specifically as follows: wafer No. 1 and wafer No. 2 are directly deposited for the first time after being seated on heater No. 1 and heater No. 2. After the first deposition is completed, the wafer transfer rack rises, lifts up the wafers and rotates them 120° clockwise before descending. Wafer No. 1 and wafer No. 2 are placed on heater No. 3 and heater No. 4. The vacuum robot arm delivers wafer No. 3 and wafer No. 4 into the process chamber and seats them on heater No. 1 and heater No. 2. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. After deposition, the wafer transfer rack rises, lifts up the wafers and rotates them 120° clockwise before descending. After 20°, it descends. Wafer No. 1 and wafer No. 2 are located on heater No. 5 and heater No. 6, and wafer No. 3 and wafer No. 4 are located on heater No. 3 and heater No. 4. The vacuum robot sends wafer No. 5 and wafer No. 6 into the process chamber and sits on heater No. 1 and heater No. 2. At this time, wafer No. 1 and wafer No. 2 are deposited for the third time, wafer No. 3 and wafer No. 4 are deposited for the second time, and wafer No. 5 and wafer No. 6 are deposited for the first time. After deposition, the wafer transfer rack rises, holds up the wafer, rotates 120° clockwise, and then descends. Then the vacuum robot takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8 for deposition, and the cycle continues.

[0051] The specific operation mode of 6×1station is as follows: wafer No. 1 and wafer No. 2 are placed on heater No. 1 and heater No. 2, the wafer transfer rack rises, holds up the wafer and rotates it 120° clockwise before descending, wafer No. 1 and wafer No. 2 are placed on heater No. 3 and heater No. 4; the vacuum robot sends wafer No. 3 and wafer No. 4 into the process chamber and sits on heater No. 1 and heater No. 2, the wafer transfer rack rises, holds up the wafer and rotates it 120° clockwise before descending, wafer No. 1 and wafer No. 2 are placed on heater No. 5 and heater No. 6, wafer No. 3 and wafer No. 4 are placed on heater No. 3 and heater No. 4, the vacuum robot sends wafer No. 5 and wafer No. 6 into the process chamber and sits on heater No. 1 and heater No. 2, at this time, all 6 wafers are deposited for the first time, after the first deposition is completed, the vacuum robot takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8, and so on.

[0052] S4. Each process chamber prepares corresponding execution conditions in advance according to the process task;

[0053] In an example embodiment, the execution condition is that the ejector pin can be raised and lowered normally and the wafer transfer rack can work normally. If the ejector pin or the wafer transfer rack fails, an alarm is directly issued; if the ejector pin or the wafer transfer rack is not faulty, the process chamber is preheated, and when the preheating is about to be completed, it is ready to receive the wafer entering the process chamber. At this time, the ejector pin is in a falling state and the chamber pressure is able to transmit the wafer;

[0054] S5. Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, allow the current wafer to enter the process chamber; if they are different, issue an alarm;

[0055] In an example embodiment, while the corresponding execution conditions are prepared in advance, the atmospheric robot arm takes the wafer from the wafer box and sends it into the LoadLock, and then the vacuum robot arm takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber; before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

[0056] In another embodiment, if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, such as Figure 2-3 As shown, the vacuum robot arm enters through a door or a double door structure of the process chamber, at which time the ejector pins rise to support the wafer, and then the vacuum robot arm withdraws and the ejector pins fall, so that the wafer is located on the heater, and the door is closed.

[0057] S6. After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares corresponding execution conditions for the next task in advance.

[0058] like Figure 4 , Figure 6-10 The figure shows a wafer transfer rack provided in this embodiment, which is characterized by comprising a transfer rack body 1, a lifting mechanism 2, a rotating mechanism 3 and a main shaft 4;

[0059] The main shaft 4 is vertically arranged and the top thereof extends into the vapor deposition chamber in the shell 5 and is fixedly connected to the transfer rack body 1;

[0060] The transfer rack body 1 is arranged in the horizontal direction and sleeved on the main shaft 4. The transfer rack body 4 has a plurality of claw structures 11 arranged circumferentially around the main shaft axis, and a wafer placement area 12 is formed between adjacent claw structures. Figure 1 As shown; a number of heaters are arranged around the main axis in the shell 5. When the wafer is placed on the base 6 of the heater inside the shell 5, the claw structure is arranged on both sides of the lower end of the wafer to support and transport the wafer;

[0061] The lifting mechanism 2 is arranged at the lower side of the shell and connected to the spindle 4, and is used to drive the transfer rack body to lift by driving the spindle to lift, lift the wafer from the base of the heater, and lower the wafer after the wafer rotates to the target heater, so that the wafer is lowered to the base of the target heater;

[0062] The rotating mechanism 3 is connected to the main shaft 4, and can drive the transfer rack body to rotate to a position corresponding to the heater by driving the main shaft to rotate. The rotating mechanism is used to drive the wafer to rotate to the target heater for vapor phase deposition treatment by driving the main shaft and the transfer rack body to rotate.

[0063] A wafer transfer rack disclosed in the present invention has a transfer rack body and a claw structure that can rise or fall relative to a base under the drive of a lifting mechanism to lift or lower the wafer onto the base, and can rotate the wafer to a target heater under the drive of a rotating mechanism. After the wafer is deposited on one heater, the transfer rack body transfers it to the next heater to ensure that the wafer is deposited more evenly. Since the transfer rack body is arranged on the lower side of the wafer and does not contact the thin film on the surface of the wafer, it can prevent the wafer film from being damaged or scratched. At the same time, the transfer rack has a simple structure, occupies a small space, and is conducive to the miniaturization of processing equipment.

[0064] In a specific embodiment, Fig.11 As shown, the lifting mechanism 2 includes a first driving motor 21, a guide rod 22 and a slider 23;

[0065] The first drive motor 21 is connected to the spindle 4 through a motor shaft 24. The first drive motor 21 is provided with a first bracket 7. The guide rod 22 is vertically arranged on the first bracket 7. The slider 23 is sleeved on the spindle 4. The first drive motor 21 drives the slider 23 to slide up and down along the guide rod 22 by driving the spindle 4 to rise and fall. The first drive motor drives the transfer rack body to rise and fall relative to the base in the heater by driving the spindle to rise and fall, so that the transfer rack can transfer the wafer to the target heater; the guide rod 22 can slide up and down along the slider 23 under the drive of the first drive motor and the spindle, playing a guiding role in the lifting and lowering of the spindle, making the lifting and lowering process of the spindle more stable.

[0066] In a specific embodiment, Fig.11 , Fig.12 As shown, the rotating mechanism 3 is disposed between the housing 5 and the lifting mechanism 2, and the rotating mechanism 3 includes a rotating structure 31, a driving pin 32, a second driving motor 33, a belt 34 and a rotating shaft 35;

[0067] The rotary drive member 32 is fixed on a vertically arranged rotating shaft 35, the second drive motor 33 is connected to the rotating shaft 35 by a belt 34, the rotating structure 31 is sleeved on the motor shaft, and the rotating structure 31 is surrounded by a number of slots 311 that are consistent with the number of heaters with the motor shaft axis as the center line, the second drive motor 33 drives the drive pin 32 to rotate into the slot 311, and the drive pin 32 drives the rotating structure 31 to rotate around the rotating shaft 35, and drives the motor shaft, the spindle 4 and the transfer rack body 1 to rotate, so that the wafer is transferred from the transfer rack body to the next heater target heater in one heater for vapor deposition, thereby ensuring that the wafer thin film deposition is more uniform. In this embodiment, the number of heaters is 6, and the number of slots is 6.

[0068] In a specific embodiment, Fig. 9 , Fig.10 As shown, the driving pin 32 is arranged on a supporting plate 38 mounted on a rotating shaft 35;

[0069] A rotating disk 36 with arc side walls arranged in the horizontal direction is also installed on the rotating shaft 35 on the upper side of the supporting plate 38. An arc-shaped positioning groove 312 is provided between the adjacent slots 311 on the rotating structure 31. Figure 6As shown; the side of the turntable close to the rotating structure 31 is arranged in the positioning groove, when the second driving motor drives the rotating shaft to rotate, the turntable 36 can rotate in the positioning groove, when the driving pin enters a slot, as the rotating shaft and the supporting plate rotate, the driving pin drives the rotating structure 31 to rotate by driving the slot wall, and after the driving pin rotates 60° (in this embodiment, 6 heaters are used, that is, the circle is divided into 6 parts, each part is 60°, if the number of heaters set is 4, the driving pin rotates 90°), it is separated from the slot, at this time the turntable 36 enters the positioning groove, and the turntable 36 rotates in a positioning groove before the driving pin enters the next slot, at this time the wafer is deposited on one heater, when the driving pin rotates and enters the next slot, the transfer rack is driven to rotate by the driving pin, and the wafer enters the next heater for deposition; in this embodiment, the second driving motor adopts a small motor, which can drive the main shaft and the transfer rack body to rotate, thereby eliminating the rotational inertia, which is convenient for driving the main shaft to rotate and stop.

[0070] In a specific embodiment, Fig.11 , Fig.12 As shown, the rotating mechanism 3 further includes a positioning plate 37 and a position sensor 39;

[0071] The positioning disk 37 is horizontally arranged on the rotating shaft 35 and is arranged on the upper side of the rotating disk 36. The positioning disk is provided with a notch on its periphery, and the position sensors are respectively arranged on the upper and lower sides of the positioning disk. When the rotating shaft of the positioning disk rotates, the position sensor can determine the position of the driving pin by monitoring the position of the positioning disk. When the positioning disk rotates until one end of the notch is located on the upper and lower sides of the sensor, this place is marked as 0. When the positioning disk continues to rotate until the other end of the notch is located on the upper and lower sides of the sensor, it is the angle of rotation of the driving pin, ensuring the accurate rotation angle of the driving pin and the accurate position of the driving pin. In this embodiment, the position sensor laser sensor is a prior art, and its specific principle will not be repeated here.

[0072] In a specific embodiment, a wafer rack 15 is installed on the upper side of the claw structure 11. The wafer rack 15 is a ring-shaped frame structure, which is sleeved on the outside of the base 6. The wafer is placed on the wafer rack and placed on a heater for processing. When the wafer is deposited on a heater, the transfer rack body transfers the wafer rack and the wafer on the wafer rack to the next heater. The setting of the wafer rack improves the convenience of the transfer rack body in transferring wafers, and the transfer of wafers can be achieved without the transfer rack directly contacting the wafer, further preventing the film on the surface of the wafer from being damaged. Figure 1 and Figure 4 In the figure, only one pedestal and one wafer rack are shown. In actual application, the number of pedestals and wafer racks is consistent with the number of heaters.

[0073] In a specific embodiment, Fig.10 As shown, it also includes a bellows 10, which is arranged in the shaft housing 13 on the upper side of the first bracket 7 and is sleeved on the outside of the main shaft 4 to reduce the shock of the main shaft and prevent the main shaft from rotating and causing displacement, thereby ensuring the precise position of the main shaft, and then making the deposition position of the wafer accurate to ensure the deposition effect.

[0074] In a specific embodiment, Fig.12 As shown, the main shaft 4 is provided with a second bracket 8, and the second bracket 8 is arranged between the shaft housing 13 and the first bracket 7, and is fixedly connected to the two, which can enhance the stability of the device; the second bracket 8 is provided with a mounting plate 9, and the second drive motor 33 is installed on the mounting plate 9, and the mounting plate 9 provides an installation position for the second drive motor 33 and plays a supporting role.

[0075] In a specific embodiment, the shaft housing is connected to a vacuum pipeline 14. The interior of the housing requires a vacuum working environment. Connecting the vacuum pipeline facilitates vacuuming to the outside to meet the processing environment requirements.

[0076] Embodiment 2:

[0077] The difference between this embodiment and embodiment 1 is that Figure 5 As shown, in the present embodiment, the number of claw structures provided on the transfer rack body is 8, and the corresponding number of heaters is 4. The claw structure of the transfer rack rotates with the main shaft to place the wafers in sequence on the 4 heaters for vapor deposition; the claw structure is in the shape of a long handle and the end thereof away from the connection with the main shaft is arranged in an arc shape. The claw structure can also be arranged in other shapes that can support and transport the wafers and the wafer rack, and the number of claw structures and the number of heaters can be set according to actual processing requirements.

[0078] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

[0079] Although the claims in this application have been formulated with respect to particular combinations of features, it should be understood that the scope of the present disclosure also includes any novel feature or any novel combination of features disclosed herein, whether explicitly or implicitly or in any generalization thereof, whether or not it relates to the same scheme in any claim currently claimed.

Claims

1. A wafer transfer method that does not rely on task delivery, characterized in that: include: Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task; According to the wafer transmission route and process tasks, the process chamber that each wafer is to enter is obtained, and then the wafer ID and process tasks are sent to the scheduling of the corresponding process chamber in sequence; A task pool is formed through the scheduling of the process chamber, and the process task of the process chamber is obtained based on the task pool. The process task is the station operation mode, and the station operation mode includes 2×3 and 6×1; the 2×3 station operation mode is specifically as follows: wafer No. 1 and wafer No. 2 are directly deposited for the first time after being placed on heater No. 1 and heater No.

2. After the first deposition is completed, the wafer transfer rack rises, holds up the wafer and rotates 120° clockwise before descending. Wafer No. 1 and wafer No. 2 are placed on heater No. 3 and heater No. 4; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on heater No. 1 and heater No.

2. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. Deposition, after deposition, the wafer transfer rack rises, holds up the wafer and rotates it 120° clockwise and then descends. Wafer No. 1 and wafer No. 2 are located on heater No. 5 and heater No. 6, and wafer No. 3 and wafer No. 4 are located on heater No. 3 and heater No.

4. The vacuum robot arm sends wafer No. 5 and wafer No. 6 into the process chamber and places them on heater No. 1 and heater No.

2. At this time, wafer No. 1 and wafer No. 2 undergo the third deposition, wafer No. 3 and wafer No. 4 undergo the second deposition, and wafer No. 5 and wafer No. 6 undergo the first deposition. After deposition, the wafer transfer rack The vacuum robot arm takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8 for deposition, and repeats this cycle. The specific operation mode of 6×1station is as follows: wafer No. 1 and wafer No. 2 are placed on heater No. 1 and heater No. 2, the wafer transfer rack rises, holds up the wafer, rotates 120° clockwise, and then descends. Wafer No. 1 and wafer No. 2 are placed on heater No. 3 and heater No. 4; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the On heater No. 1 and heater No. 2, the wafer transfer rack rises, lifts the wafer and rotates it 120° clockwise before descending. Wafer No. 1 and wafer No. 2 are placed on heater No. 5 and heater No. 6, and wafer No. 3 and wafer No. 4 are placed on heater No. 3 and heater No.

4. The vacuum robot arm sends wafer No. 5 and wafer No. 6 into the process chamber and places them on heater No. 1 and heater No.

2. At this time, all six wafers are deposited for the first time. After the first deposition is completed, the vacuum robot arm takes out wafer No. 1 and wafer No. 2 and puts in wafer No. 7 and wafer No. 8; And so on. Each process chamber prepares corresponding execution conditions in advance according to the process task; Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, the current wafer is allowed to enter the process chamber; if they are different, an alarm is issued; After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares the corresponding execution conditions for the next task in advance.

2. The wafer transmission method that does not rely on task transfer according to claim 1 is characterized in that: The execution conditions are that the ejector pin can be raised and lowered normally and the wafer transfer rack can work normally. If the ejector pin or the wafer transfer rack fails, an alarm will be directly issued. If the ejector pin or the wafer transfer rack has no faults, the process chamber will be preheated, and when the preheating is about to be completed, it will be ready to receive the wafer entering the process chamber. At this time, the ejector pin is in a dropped state and the chamber pressure is capable of transmitting the wafer.

3. The wafer transmission method that does not rely on task transfer according to claim 1 is characterized in that: While preparing the corresponding execution conditions in advance, the atmospheric robot takes the wafer from the wafer box and sends it into the LoadLock, and then the vacuum robot takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber; before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

4. The wafer transmission method independent of task transfer according to claim 1 or 3, characterized in that: If the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot arm enters through a door or a double door structure of the process chamber. At this time, the ejector pin rises to support the wafer, and then the vacuum robot arm withdraws and the ejector pin falls, so that the wafer is placed on the heater and the door is closed.

5. The wafer transmission method that does not rely on task transfer according to claim 1 is characterized in that: The wafer transfer rack comprises a transfer rack body, a lifting mechanism, a rotating mechanism and a main shaft; the main shaft is arranged vertically and the top thereof extends into a vapor deposition chamber in a shell and is fixedly connected to the transfer rack body; the transfer rack body is arranged horizontally and sleeved on the main shaft, and the transfer rack body has a plurality of claw structures arranged circumferentially around the axis of the main shaft, and a wafer placement area is formed between adjacent claw structures; a plurality of heaters are arranged around the main shaft in the shell, and when the wafer is placed on the base of the heater inside the shell, the claw structures are arranged on both sides of the lower end of the wafer, and are used to for supporting and transporting wafers; the lifting mechanism is arranged on the lower side of the shell and is connected to the main shaft, and is used to drive the transfer rack body to rise and fall by driving the main shaft to lift and lower the wafer, lift the wafer from the base of the heater, and lower the wafer after the wafer rotates to the target heater, so that the wafer drops to the base of the target heater; the rotating mechanism is connected to the main shaft, and can drive the transfer rack body to rotate to a position corresponding to the heater by driving the main shaft to rotate, and the rotating mechanism is used to drive the wafer to rotate to the target heater for vapor phase deposition treatment by driving the main shaft and the transfer rack body to rotate.

6. The wafer transmission method independent of task transfer according to claim 5, characterized in that: The lifting mechanism includes a first driving motor, a guide rod and a slider; the first driving motor is connected to the main shaft through a motor shaft, a first bracket is provided on the first driving motor, the guide rod is vertically arranged on the first bracket, the slider is sleeved on the main shaft, and the first driving motor drives the slider to slide up and down along the guide rod by driving the main shaft to lift and lower.

7. The wafer transmission method independent of task transfer according to claim 6, characterized in that: The rotating mechanism is arranged between the shell and the lifting mechanism, and the rotating mechanism includes a rotating structure, a driving pin, a second driving motor, a belt and a rotating shaft; the rotating driving member is fixed on the vertically arranged rotating shaft, the second driving motor is connected to the rotating shaft through a belt, the rotating structure is sleeved on the motor shaft, and the rotating structure is surrounded by a number of slots that is the same as the number of heaters with the motor shaft axis as the center line. The second driving motor drives the driving pin to rotate into the slot, and the driving pin drives the rotating structure to rotate around the rotating shaft, and drives the motor shaft, the main shaft and the transfer frame body to rotate.

8. The wafer transmission method independent of task transfer according to claim 7, characterized in that: The driving pin is arranged on a supporting plate installed on the rotating shaft; a turntable with an arc side wall arranged in a horizontal direction is also installed on the rotating shaft on the upper side of the supporting plate, and an arc-shaped positioning groove is provided between the adjacent slots on the rotating structure; the side of the turntable close to the rotating structure is arranged in the positioning groove, and when the second driving motor drives the rotating shaft to rotate, the turntable rotates in the positioning groove.

Images