Method for full tensor characterization of dielectric constant of magneto-optic thin films
By using the transfer matrix method and a modified elliptic polarimeter magnetic field device, combined with positive and negative magnetic field measurements, the full dielectric constant tensor of wafer-level magneto-optical thin films can be directly characterized. This solves the problem of incomplete and non-destructive measurement in existing technologies, achieving rapid and non-destructive dielectric constant characterization and supporting industrial applications of silicon-based optoelectronics.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- UNIV OF ELECTRONICS SCI & TECH OF CHINA
- Filing Date
- 2023-09-08
- Publication Date
- 2026-05-29
AI Technical Summary
Existing technologies cannot directly and completely characterize the full dielectric constant tensor of wafer-level magneto-optical thin films, and existing equipment cannot perform non-destructive measurements without damaging the wafer.
By employing the transfer matrix method and a modified elliptic polarimeter, combined with an applied magnetic field device, the diagonal elements of the dielectric constant tensor are fitted by measuring the ellipticity parameters and Mueller matrix under positive and negative magnetic fields. The off-diagonal elements are then inverted using the difference matrix to characterize the full dielectric constant tensor.
This method enables non-destructive and rapid full tensor characterization of dielectric constants in wafer-level magneto-optical thin films, filling the gap in non-destructive full tensor characterization of dielectric constants in wafer-level magneto-optical thin films and is suitable for industrial applications in silicon-based optoelectronics.
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