Solid-state battery package

Abstract

A solid-state battery package having a substrate and a solid-state battery provided on the substrate is provided. In the solid-state battery package, a water vapor barrier layer is provided between the substrate and the solid-state battery.

Description

Technical Field

[0001] This invention relates to solid-state battery encapsulation. More specifically, this invention relates to solid-state batteries that are encapsulated to facilitate installation. Background Technology

[0002] Previously, rechargeable batteries were used for various purposes. For example, they were used as power sources for electronic devices such as smartphones and laptops.

[0003] In secondary batteries, liquid electrolytes are generally used as the medium for ion movement, which facilitates charging and discharging. That is, the so-called electrolyte is used in secondary batteries. However, such secondary batteries generally require safety measures to prevent electrolyte leakage. Furthermore, organic solvents and other flammable substances used in the electrolyte also require safety measures in this regard.

[0004] Therefore, solid-state batteries that use solid electrolytes instead of liquid electrolytes were studied.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-220107

[0008] Patent Document 2: Japanese Patent Application Publication No. 2007-5279 Summary of the Invention

[0009] The technical problem that the invention aims to solve

[0010] The inventors of this application have noticed that there are still technical problems to be overcome in previously proposed solid-state batteries, and have found it necessary to take measures to address these problems. Specifically, the inventors of this application have identified the following technical problems.

[0011] Considering that solid-state batteries can be mounted and used alongside other electronic components on printed circuit boards, a suitable mounting structure is required. For example, a package in which the solid-state battery is disposed on a substrate facilitates mounting by allowing the substrate to assume electrical connections to the outside.

[0012] However, the inventors of this application have noted that a package in which a solid-state battery is disposed on a substrate may not be able to adequately prevent water vapor from seeping in from the substrate side. That is, the inventors of this application have found that while the substrate itself is a component with thickness and can prevent water vapor from seeping in to some extent, this may not be sufficient for a solid-state battery and may cause degradation of the solid-state battery's characteristics in the long run.

[0013] The present invention was made in view of the above-mentioned technical problems. That is, the main object of the present invention is to provide a solid-state battery technology having a substrate that facilitates installation and can more effectively prevent the permeation of water vapor associated with the substrate.

[0014] Technical solutions for solving technical problems

[0015] The inventors of this application attempted to solve the aforementioned technical problems by taking measures in a new direction, rather than by extending and expanding upon existing technology. As a result, an invention of a solid-state battery that can achieve the aforementioned main objectives was completed.

[0016] In this invention, a solid battery package is provided, which has a substrate and a solid battery disposed on the substrate, and a water vapor barrier layer is provided between the substrate and the solid battery.

[0017] The effects of the invention

[0018] The solid-state battery package of the present invention has a substrate that facilitates installation and has superior water vapor permeability prevention.

[0019] More specifically, the present invention is a solid-state battery package that appropriately considers preventing water vapor from permeating through a substrate that facilitates mounting. In the solid-state battery package of the present invention, a water vapor barrier layer is provided between the substrate and the solid-state battery, reducing the undesirable permeation of water vapor from the external environment to the solid-state battery via the substrate. Therefore, from a longer-term perspective, the solid-state battery package of the present invention is less likely to cause degradation of the solid-state battery characteristics, resulting in higher reliability. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view of a solid-state battery package.

[0021] Figure 2 This is a schematic cross-sectional view of a solid-state battery package.

[0022] Figure 3 It is a schematic cross-sectional view of a solid-state battery package, particularly used to illustrate the "layers constituting the substrate" and the "layers constituting the solid-state battery".

[0023] Figure 4 It schematically shows a cross-sectional view of a solid-state battery package and a partial enlarged view, especially a diagram used to illustrate the extensive extension of the water vapor barrier layer, etc.

[0024] Figure 5 It schematically shows a cross-sectional view of a solid-state battery package and a partial enlarged view thereof, particularly illustrating the diagram associated with the resist layer.

[0025] Figure 6 It schematically shows a cross-sectional view of a solid-state battery package and a schematic diagram showing the substrate structure.

[0026] Figure 7 This is a schematic diagram showing the layers that make up the substrate.

[0027] Figure 8 It schematically shows a cross-sectional view of a solid-state battery package and a top view showing the metal layers contained in the substrate.

[0028] Figure 9 (A) to (E) are schematic cross-sectional views illustrating the process of obtaining a solid-state battery package.

[0029] Figure 10 It is a schematic cross-sectional view of a solid-state battery package, specifically used to illustrate a method without a resist.

[0030] Figure 11 It is a schematic cross-sectional view of a solid-state battery package, specifically used to illustrate the manner in which the inorganic layer is covered.

[0031] Figure 12 This is a schematic cross-sectional view of a solid-state battery package, and a schematic diagram showing a particular example of a substrate structure.

[0032] Figure 13 It schematically shows a cross-sectional view of a solid-state battery package and a partially enlarged view thereof, particularly the diagrams associated with the conductive paste. Detailed Implementation

[0033] The solid-state battery package of the present invention will now be described in detail. Although the description is based on the accompanying drawings as needed, the illustrations are merely schematic and exemplary for the purpose of understanding the invention, and the appearance and / or size ratios may differ from the actual product.

[0034] In this specification, "solid-state battery package" refers broadly to a solid-state battery device (or solid-state battery product) configured to protect a solid-state battery from the influence of the external environment, and narrowly to a solid-state battery product having a substrate that facilitates mounting and protects the solid-state battery from the influence of the external environment.

[0035] The term "sectional view" as used in this specification refers to the shape viewed from a direction approximately perpendicular to the stacking direction of the solid-state battery's layered structure (in short, the shape when cut from a plane parallel to the thickness direction of the layers). Furthermore, the term "top view" or "top view shape" as used in this specification refers to a schematic diagram viewed from above or below along the thickness direction of the layer (i.e., the aforementioned stacking direction). In short, the shape of the surface of the object viewed from its normal direction can be described as the "top view shape."

[0036] In this specification, the terms "up and down" and "left and right" as used directly or indirectly correspond to the up and down and left and right directions in the figures, respectively. Unless otherwise stated, the same reference numerals or symbols denote the same parts and / or locations or have the same meaning. In a preferred embodiment, it can be understood that the vertical direction downward (i.e., the direction of gravity) corresponds to the "downward direction" / "bottom side", and its opposite direction corresponds to the "upward direction" / "top side".

[0037] In this invention, "solid-state battery" broadly refers to a battery whose constituent elements are made of solids, and narrowly refers to an all-solid-state battery whose constituent elements (particularly preferably all constituent elements) are made of solids. In a preferred embodiment, the solid-state battery of this invention is a stacked solid-state battery in which the layers constituting the battery constituent units are stacked on top of each other, preferably such layers are made of sintered bodies. "Solid-state battery" includes not only so-called "secondary batteries" that can be repeatedly charged and discharged, but also "primary batteries" that can only be discharged. According to a preferred embodiment of the invention, "solid-state battery" is a secondary battery. The term "secondary battery" is not overly limited, and may also include, for example, energy storage devices. In this invention, the solid-state battery contained in the package can also be called a "solid-state battery element".

[0038] The basic structure of the solid-state battery of the present invention will be described below. The structure of the solid-state battery described herein is merely an example for understanding the invention and is not intended to limit the invention.

[0039] [Basic Structure of Solid-State Batteries]

[0040] Solid-state batteries have at least two electrode layers (positive and negative electrodes) and a solid electrolyte. Specifically, such as... Figure 1 As shown, the solid-state battery 100 has a solid-state battery stack, which includes a battery constituent unit consisting of a positive electrode layer 110, a negative electrode layer 120 and at least a solid electrolyte 130 therebetween.

[0041] It should be noted that in solid-state batteries, the various layers constituting them can be formed by firing, and the positive electrode layer, negative electrode layer, and solid electrolyte can also be formed as fired layers. Preferably, the positive electrode layer, negative electrode layer, and solid electrolyte are fired together as a single, integrally fired body, thus it is preferable that the solid-state battery stack is formed as an integrally fired body.

[0042] The positive electrode layer 110 is an electrode layer containing at least a positive electrode active material. The positive electrode layer may also contain a solid electrolyte. In a preferred embodiment, the positive electrode layer is composed of a sintered body containing at least positive electrode active material particles and solid electrolyte particles. Conversely, the negative electrode layer is an electrode layer containing at least a negative electrode active material. The negative electrode layer may also contain a solid electrolyte. In a preferred embodiment, the negative electrode layer is composed of a sintered body containing at least negative electrode active material particles and solid electrolyte particles.

[0043] Positive and negative electrode active materials are substances that participate in electron exchange in a solid-state battery. Ions move (or are conducted) between the positive and negative electrode layers via the solid electrolyte, facilitating electron exchange and thus enabling charging and discharging. The electrode layers of both the positive and negative electrode layers are particularly preferably layers capable of intercalating or deintercalating lithium ions or sodium ions. That is, the solid-state battery is preferably an all-solid-state secondary battery in which lithium ions or sodium ions move between the positive and negative electrode layers via the solid electrolyte for charging and discharging.

[0044] (Positive electrode active material)

[0045] The positive electrode active material included in the positive electrode layer 110 can be, for example, at least one selected from the group consisting of lithium phosphate compounds having a NASICON-type structure, lithium phosphate compounds having an olivine-type structure, lithium-containing layered oxides, and lithium-containing oxides having a spinel-type structure. Examples of lithium phosphate compounds having a NASICON-type structure include Li3V2(PO4)3. Examples of lithium phosphate compounds having an olivine-type structure include Li3Fe2(PO4)3, LiFePO4, and / or LiMnPO4. Examples of lithium-containing layered oxides include LiCoO2 and / or LiCo... 1 / 3 Ni 1 / 3 Mn 1 / 3 O2, etc. Examples of lithium-containing oxides with a spinel-type structure include LiMn2O4 and / or LiNi. 0.5 Mn 1.5O4, etc. The types of lithium compounds are not particularly limited; for example, they can be lithium transition metal complex oxides and lithium transition metal phosphates. Lithium transition metal complex oxides are a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and lithium transition metal phosphates are a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The types of transition metal elements are not particularly limited; for example, they can be cobalt (Co), nickel (Ni), manganese (Mn), and iron (Fe).

[0046] Furthermore, as a positive electrode active material capable of intercalating and deintercalating sodium ions, at least one can be selected from the group consisting of sodium phosphate compounds having a NASICON-type structure, sodium phosphate compounds having an olivine-type structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel-type structure. For example, in the case of sodium phosphate compounds, at least one can be selected from the group consisting of Na3V2(PO4)3, NaCoFe2(PO4)3, Na2Ni2Fe(PO4)3, Na3Fe2(PO4)3, Na2FeP2O7, Na4Fe3(PO4)2(P2O7), and NaFeO2 as a sodium-containing layered oxide.

[0047] Furthermore, the positive electrode active material can be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. Oxides can be, for example, titanium oxide, vanadium oxide, or manganese dioxide. Disulfides can be, for example, titanium disulfide or molybdenum sulfide. Chalcogenides can be, for example, niobium selenide. Conductive polymers can be, for example, disulfides, polypyrrole, polyaniline, polythiophene, poly(p-styrene), polyacetylene, or poly(phenylene oxide).

[0048] (Negative electrode active material)

[0049] The negative electrode active material included in the negative electrode layer 120 can be, for example, at least one selected from the group consisting of oxides, carbon materials such as graphite, graphite-lithium compounds, lithium alloys, lithium phosphate compounds with a NASICON-type structure, lithium phosphate compounds with an olivine-type structure, and lithium oxides with a spinel-type structure, wherein the oxide contains at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb), and molybdenum (Mo). Examples of lithium alloys include Li-Al. Examples of lithium phosphate compounds with a NASICON-type structure include Li3V2(PO4)3 and / or LiTi2(PO4)3. Examples of lithium phosphate compounds with an olivine-type structure include Li3Fe2(PO4)3 and / or LiCuPO4. Examples of lithium oxides with a spinel-type structure include Li4Ti5O. 12 wait.

[0050] In addition, as a negative electrode active material capable of intercalating and deintercalating sodium ions, at least one can be selected from the group consisting of sodium phosphate compounds with a NASICON-type structure, sodium phosphate compounds with an olivine-type structure, and sodium oxides with a spinel-type structure.

[0051] It should be noted that in solid-state batteries, the positive electrode layer and the negative electrode layer can also be made of the same material.

[0052] The positive and / or negative electrode layers may contain conductive materials. Examples of conductive materials contained in the positive and negative electrode layers include at least one material composed of metals such as silver, palladium, gold, platinum, aluminum, copper, and nickel, as well as carbon.

[0053] Furthermore, the positive and / or negative electrode layers may contain sintering aids. Examples of sintering aids include at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0054] The thickness of the positive electrode layer and the negative electrode layer is not particularly limited. For example, they can be 2 μm or more and 50 μm or less, especially 5 μm or more and 30 μm or less.

[0055] (Positive electrode current collector layer / Negative electrode current collector layer)

[0056] Although not a necessary element of the electrode layer, the positive electrode layer 110 and the negative electrode layer 120 may also each have a positive current collector layer and a negative current collector layer, respectively. The positive and negative current collector layers may each have a foil-like form. However, if the focus is on improving electronic conductivity, reducing the manufacturing cost of solid-state batteries, and / or reducing the internal resistance of solid-state batteries through integral firing, the positive and negative current collector layers may also have a fired body form. Materials with high conductivity are preferably used as the positive current collector forming the positive electrode layer and the negative current collector forming the negative electrode layer, such as silver, palladium, gold, platinum, aluminum, copper, and / or nickel. The positive and negative current collectors may each have an electrical connection portion for external electrical connection, or they may be configured to be electrically connected to the end electrode. It should be noted that when the positive and negative current collector layers have a fired body form, they may also be composed of a fired body containing a conductive material and a sintering aid. The conductive materials contained in the positive and negative current collector layers can be selected from materials that may be contained in the positive and negative electrode layers. The sintering aids contained in the positive and negative current collector layers can be selected from materials that may be contained in the positive and negative electrode layers. As described above, in a solid-state battery, the positive and negative current collector layers are not essential, and it is also possible to consider solid-state batteries without such positive and negative current collector layers. That is, the solid-state battery contained in the package of the present invention can also be a solid-state battery without current collector layers.

[0057] (Solid electrolyte)

[0058] Solid electrolytes are materials capable of conducting lithium ions or sodium ions. Specifically, in a solid-state battery, the solid electrolyte 130 constituting a battery cell can form a lithium-ion-conducting layer between the positive electrode layer 110 and the negative electrode layer 120. It should be noted that the solid electrolyte only needs to be disposed at least between the positive and negative electrode layers. That is, the solid electrolyte can exist around the positive and / or negative electrode layers in a manner that extends from between them. Specific solid electrolytes include, for example, any one or more of crystalline solid electrolytes, glass-based solid electrolytes, and glass-ceramic-based solid electrolytes.

[0059] Crystalline solid electrolytes include, for example, oxide-based and sulfide-based crystalline materials. Examples of oxide-based crystalline materials include lithium-phosphate compounds with a NASICON structure, oxides with a perovskite structure, oxides with garnet-type or garnet-like structures, and oxide glass-ceramic lithium-ion conductors. Lithium-phosphate compounds with a NASICON structure include, for example, Li... x M y(PO4)3 (1≤x≤2, 1≤y≤2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga), and zirconium (Zr). As an example of a lithium phosphate compound having a NASICON structure, Li can be cited as an example. 1.2 Al 0.2 Ti 1.8 (PO4)3, etc. As an example of oxides with a perovskite structure, La can be cited. 0.55 Li 0.35 TiO3, etc. As an example of garnet-type or garnet-like oxides, Li7La3Zr2O can be cited. 12 Etc. Additionally, examples of sulfide-based crystalline materials include thio-LISICON, such as Li... 3.25 Ge 0.25 P 0.75 S4 and Li 10 GeP2S 12 Crystalline solid electrolytes may also contain polymeric materials (e.g., polyethylene oxide (PEO)).

[0060] Glass-based solid electrolytes include oxide-based glass materials and sulfide-based glass materials. Examples of oxide-based glass materials include 50Li₄SiO₄·50Li₃BO₃. Examples of sulfide-based glass materials include 30Li₂S·26B₂S₃·44LiI, 63Li₂S·36SiS₂·1Li₃PO₄, 57Li₂S·38SiS₂·5Li₄SiO₄, 70Li₂S·30P₂S₅, and 50Li₂S·50GeS₂.

[0061] Glass-ceramic solid electrolytes include, for example, oxide-based and sulfide-based glass-ceramic materials. As oxide-based glass-ceramic materials, examples include lithium-aluminum-titanium phosphate compounds (LATP) and lithium-aluminum-germanium phosphate compounds (LAGP). For example, Li... 1.07 Al 0.69 Ti 1.46 (PO4)3, etc. Additionally, LAGP, for example, is Li 1.5 Al 0.5 Ge 1.5 (PO4), etc. Additionally, as a sulfide-based glass-ceramic material, there is, for example, Li7P3S. 11 And Li 3.25 P 0.95 S4, etc.

[0062] In addition, examples of solid electrolytes capable of conducting sodium ions include sodium-containing phosphate compounds with a NASICON structure, oxides with a perovskite structure, and oxides with garnet-type or garnet-like structures. Among sodium-containing phosphate compounds with a NASICON structure, Na... x M y (PO4)3 (1≤x≤2, 1≤y≤2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0063] Solid electrolytes may also contain sintering aids. The sintering aids contained in the solid electrolyte may be selected from the same materials as those that may be contained in the positive and negative electrode layers.

[0064] There is no particular limitation on the thickness of the solid electrolyte. The thickness of the solid electrolyte layer located between the positive electrode layer and the negative electrode layer can be, for example, more than 1 μm and less than 15 μm, especially more than 1 μm and less than 5 μm.

[0065] (End face electrode)

[0066] Solid-state batteries typically include end-face electrodes 140. Specifically, end-face electrodes are provided on the side of the solid-state battery. More specifically, an end-face electrode 140A connected to the positive electrode layer 110 and an end-face electrode 140B connected to the negative electrode layer 120 are provided (see reference). Figure 1 Such end-face electrodes preferably contain materials with high conductivity. There are no particular limitations on the specific material of the end-face electrode; at least one material selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel can be listed.

[0067] [Features of the solid-state battery package of the present invention]

[0068] This invention relates to a solid-state battery encapsulation device that encapsulates a solid-state battery. Specifically, it is a solid-state battery encapsulation device that includes a substrate that facilitates mounting and a structure that protects the solid-state battery from external environmental influences.

[0069] The solid-state battery package of the present invention has the feature of more effectively preventing the permeation of water vapor associated with the substrate. That is, preventing water vapor permeation is taken into account not only the encapsulation but also the substrate that facilitates mounting.

[0070] Specifically, the solid-state battery package of the present invention has a substrate and a solid-state battery disposed on the substrate, with a water vapor barrier layer between them. That is, as Figure 2As shown, the solid-state battery package 1000 includes a substrate 200 to support the solid-state battery 100, and a water vapor barrier layer 300 is disposed between the solid-state battery 100 and the substrate 200. In such a solid-state battery package, since the undesirable transmission of water vapor from the external environment through the substrate to the solid-state battery is reduced, the degradation of the solid-state battery characteristics can be reduced or prevented from a longer-term perspective.

[0071] The substrate 200 is positioned close to one of the main surfaces of the solid-state battery 100 to shield that main surface from the external environment. Therefore, while it is generally believed that the presence of the substrate can prevent water vapor from penetrating the solid-state battery, the inventors of this application have specifically focused on the fact that the substrate alone cannot sufficiently prevent water vapor transmission. This is because, in the long term, due to the material and / or structure of the substrate, it may exhibit permeability to water vapor from the external environment. Therefore, in this invention, a water vapor barrier layer 300 is provided between the solid-state battery 100 and the substrate 200, effectively suppressing the transmission of water vapor reaching the solid-state battery 100 via the substrate 200. Thus, undesirable conditions such as a decrease in the ionic conductivity of the solid electrolyte due to the reaction of water vapor (or moisture) penetrating from the substrate with the solid electrolyte can be suppressed or prevented.

[0072] The term "water vapor" as used in this specification is not specifically limited to water in a gaseous state, but also includes water in a liquid state. That is, the term "water vapor" broadly encompasses matters related to water, regardless of physical state. Therefore, "water vapor" can also refer to moisture, especially water in a liquid state, and can also include condensation, such as dew formed by the condensation of water in a gaseous state.

[0073] This invention relates to an encapsulated solid-state battery, which not only has a substrate but can also have a structure that helps prevent water vapor permeation. For example, the solid-state battery encapsulation of this invention can be covered by a covering material, so that the solid-state battery disposed on the substrate is completely surrounded. That is, it can be encapsulated by covering the sides and main surface of the solid-state battery on the substrate with the covering material. In such a structure, all surfaces constituting the solid-state battery are not exposed to the outside, which can more effectively prevent water vapor permeation.

[0074] For example, the covering material can consist of a covering insulating layer and a covering inorganic film. That is, such as... Figure 2 As shown, a solid-state battery 100 disposed on a substrate 200 may be covered by a covering insulating layer 160 as a covering material 150 and an inorganic covering layer 170 thereon. The covering insulating layer 160 is a layer disposed in a manner that covers the main surface and side surfaces of the solid-state battery 100. Figure 2As shown, a covering insulating layer 160 is provided to at least cover the top surface 100A and side surface 100B of the solid-state battery 100, and the solid-state battery 100 on the substrate 200 is largely enclosed by the covering insulating layer 160. The material of the covering insulating layer 160 can be any kind of insulating material. For example, the covering insulating layer 160 can contain resin (i.e., it can be a resin layer), which can be either a thermosetting resin or a thermoplastic resin. That is, the covering material can be a resin layer (covering resin layer). In a preferred embodiment, the covering material 150 can be composed of a resin layer (covering resin layer) 160 and a covering inorganic layer 170 disposed thereon. The covering insulating layer 160 can contain inorganic fillers. Although this is only an example, the covering insulating layer 160 can also be composed of an epoxy resin containing inorganic fillers such as SiC. The covering inorganic layer 170 is provided to cover the covering insulating layer 160. Figure 2 As shown, the inorganic covering layer 170 is located on the insulating covering layer 160, thus having a form that, together with the insulating covering layer 160, substantially encapsulates the solid-state battery 100 on the substrate 200. The insulating covering layer 160 and the inorganic covering layer 170 together constitute a suitable water vapor barrier, and the inorganic covering layer 170 also forms a suitable water vapor barrier together with the insulating covering layer 160. The material of the inorganic covering layer 170 is not particularly limited and can be metal, glass, oxide ceramic, or mixtures thereof. The inorganic covering layer 170 can be an inorganic film. That is, the inorganic covering layer 170 can be equivalent to an inorganic layer having a thin film form, such as a metal film. Although this is only an example, the inorganic covering layer 170 can be composed of Cu-based and / or Ni-based materials with a thickness of 2 μm or more and 50 μm or less formed by plating.

[0075] In the solid-state battery package 1000 of the present invention, the substrate 200 can be a package component provided in a manner that supports the solid-state battery 100. That is, the substrate 200 provided near one main surface side of the solid-state battery 100 (the main surface opposite to the main surface constituting the top surface) can serve as a supporting substrate. Figure 2 As shown, substrate 200 has, for example, a main surface larger than that of solid-state battery 100. Alternatively, substrate 200 can be a resin substrate. Or, substrate 200 can also be a ceramic substrate. In short, substrate 200 can be a printed circuit board, flexible substrate, LTCC substrate, or HTCC substrate, etc.

[0076] The substrate 200 is preferably a component for the external terminals of the encapsulated solid-state battery. That is, the substrate 200 can be a terminal substrate for the external terminals of the solid-state battery 100. A solid-state battery package having such a substrate can mount the solid-state battery onto other external substrates (i.e., secondary substrates) such as printed wiring boards in a manner that clamps the substrate. For example, the solid-state battery can be surface-mounted via the substrate by means of solder reflow. Therefore, the solid-state battery package of the present invention is preferably an SMD (Surface Mount Device) type battery package.

[0077] Since it is a terminal substrate, the substrate preferably has wiring and / or electrode layers, etc. In particular, the substrate may have an electrode layer that electrically connects the upper and lower main surfaces. That is, a preferred embodiment of the substrate 200 has an electrode layer (upper main surface electrode layer 210, lower main surface electrode layer 220) that electrically connects the upper and lower main surfaces of the substrate, serving as a component for an external terminal of a packaged solid-state battery (see reference). Figure 2 In a solid-state battery package having such a substrate, the electrode layer of the substrate is interconnected with the terminal portion of the solid-state battery. Preferably, the electrode layer of the substrate is electrically connected to the end-face electrodes of the solid-state battery. For example, the end-face electrode 140A on the positive electrode side of the solid-state battery is electrically connected to the electrode layer (210A, 220A) on the positive electrode side of the substrate, while the end-face electrode 140B on the negative electrode side of the solid-state battery is electrically connected to the electrode layer (210B, 220B) on the negative electrode side of the substrate. Thus, the electrode layers on the positive and negative electrode sides of the substrate (especially the electrode layers located on the lower / bottom side of the package or the pads connected thereto) are provided as the positive and negative terminals of the solid-state battery package, respectively.

[0078] The solid-state battery package 1000 of the present invention, in order to appropriately provide barrier properties that prevent moisture from penetrating into the solid-state battery, has a form in which a water vapor barrier layer 300 exists between the solid-state battery 100 and the substrate 200 (see reference). Figure 2 The term "barrier" in this specification refers to the property of preventing water vapor from permeating, thus preventing water vapor from the external environment from causing adverse performance degradation of the solid-state battery. In a narrower sense, "barrier" in this specification refers to a water vapor permeability of less than 5 × 10⁻⁶. -3 g / (m 2 ·Day). Therefore, in short, the water vapor barrier layer preferably has 0 g / (m 2 • Day) or more but less than 5 × 10 -3 g / (m 2 The water vapor transmission rate of (e.g., 0.5 × 10⁻⁶) per day (day) can be 0.5 × 10⁻⁶. -3 g / (m 2 • Day) or more but less than 5 × 10-3 g / (m 2 (Day), etc. It should be noted that the "water vapor transmission rate" mentioned in this instruction manual refers to the transmission rate obtained by the MA method using a gas transmission rate measuring device manufactured by MORESCO, model WG-15S, under the conditions of 85℃ and 85%RH.

[0079] like Figure 2 As shown, the water vapor barrier layer 300 can be configured to contact the covering insulating layer 160. That is, the covering insulating layer 160 is preferably configured to cover not only the sides of the solid-state battery 100 but also its lower surface, and the water vapor barrier layer 300 can be configured to contact the covering insulating layer 160 covering the sides and / or lower surface of the solid-state battery 100. This means that a water vapor barrier layer is provided between the sealing resin surrounding the solid-state battery and the substrate. If a resist layer 400 is provided on the substrate 200 (the manner in which the resist layer is provided will be described later), the water vapor barrier layer 300 can be disposed between the covering insulating layer 160 and the resist layer 400.

[0080] In a preferred embodiment, the water vapor barrier layer is thinner than the layers constituting the solid-state battery. That is, as... Figure 3 As shown, the thickness of the water vapor barrier layer 300 located between the solid-state battery 100 and the substrate 200 can be smaller than the layer thickness of layers 110, 120, 130 (e.g., at least one of them) constituting the laminated structure of the solid-state battery. In other words, the water vapor barrier layer can be smaller than the layer thickness of the positive electrode layer, smaller than the layer thickness of the negative electrode layer, and / or smaller than the layer thickness of the solid electrolyte layer. Furthermore, in another preferred embodiment, the water vapor barrier layer is thinner than each layer constituting the substrate. That is, as shown... Figure 3 As shown, the thickness of the water vapor barrier layer 300 located between the solid-state battery 100 and the substrate 200 can be smaller than the layer thickness of the layers 200' (e.g., at least one of them) constituting the laminated structure of the substrate 200. For example, the water vapor barrier layer can be smaller than the layer thickness of the metal layers included in the substrate, smaller than the layer thickness of each resin layer constituting the substrate when the substrate is a resin substrate, and smaller than the layer thickness of each ceramic layer constituting the substrate when the substrate is a ceramic substrate. In this way, when the water vapor barrier layer is relatively thinner than the various constituent layers of the solid-state battery package, undesirable water vapor permeation can be prevented without violating the design of reducing the height or miniaturization of the solid-state battery package. That is, while preventing water vapor permeation, the resulting impact on other aspects is suppressed. It should be noted that the water vapor barrier layer can also be, for example, in the form of a film.

[0081] In this specification, the term "layer constituting the stacked structure of a solid-state battery" broadly refers to the layers that constitute the battery building blocks of a solid-state battery, and narrowly refers to any one of the positive electrode layer, the negative electrode layer, and the solid electrolyte layer between them. For example, the water vapor barrier layer is thinner than the battery electrode layers such as the positive and / or negative electrode layers of a solid-state battery, and / or the water vapor barrier layer is thinner than the solid electrolyte layer of a solid-state battery.

[0082] Furthermore, the term "layers constituting the substrate" as used in this specification refers, for example, to the individual layers envisioned when a substrate is constructed by lamination. Taking a resin substrate as an example, from a macroscopic perspective, when a substrate is constructed by laminating a resin layer (e.g., a layer composed of resin material impregnated in a substrate such as fiberglass cloth) and a metal layer, each of these layers, including the resin layer and / or the metal layer, is equivalent to "layers constituting the substrate." Similarly, in a ceramic substrate, from a macroscopic perspective, when a substrate is constructed by laminating a ceramic layer and other metal layers, each of these layers, including the ceramic layer and the metal layer, is equivalent to "layers constituting the substrate."

[0083] The thicknesses of the water vapor barrier layer, as well as the layers constituting the solid-state battery and the substrate, can be based on electron microscopy images. For example, the thickness of the water vapor barrier layer and the thicknesses of the layers constituting the substrate and the solid-state battery can be based on images obtained using a scanning electron microscope (SEM) (Hitachi High-Tech Corporation model SU-8040) after cross-sections have been cut using an ion milling apparatus (Hitachi High-Tech Corporation model IM4000PLUS). That is, the thickness dimensions in this specification can refer to values ​​calculated from dimensions measured based on images obtained by such methods.

[0084] In a solid-state battery package, the water vapor barrier layer can extend in a direction along the surface of the substrate. For example... Figures 1-3 As shown in the cross-sectional view, the water vapor barrier layer 300 can extend in the width direction of the solid-state battery package 1000, and can extend in a manner that cuts across the solid-state battery package. The phrase "extending in the direction along the surface" means extending in a direction parallel to the main surface of the substrate. That is, it can also be said that the water vapor barrier layer extends in a direction orthogonal to the stacking direction of the solid-state battery. Preferably, the water vapor barrier layer extends in all directions (all directions) orthogonal to the "stacking direction of the solid-state battery". This water vapor barrier layer, extending extensively in the surface direction of the substrate, can more effectively prevent water vapor from seeping in from the external environment via the substrate. In other words, the water vapor barrier layer can function more effectively, ensuring that water vapor seeping in from outside the package does not ultimately reach the solid-state battery, thereby providing a preferred solid-state battery package that suppresses the degradation of solid-state battery characteristics from a longer-term perspective.

[0085] Preferably, a water vapor barrier layer extending along the surface direction of the substrate is configured to be widely disposed in the region outside the solid-state battery. That is, the water vapor barrier layer is preferably disposed widely in a manner that extends from the area where the solid-state battery is disposed. In this respect, the water vapor barrier layer can extend to the periphery of the solid-state battery package, for example, the water vapor barrier layer can extend to the cover material covering the solid-state battery. It can be said that the water vapor barrier layer can extend to the outer periphery of the solid-state battery package (especially extending along the surface direction of the substrate) with the outer periphery of the water vapor barrier layer (preferably all outer peripheries).

[0086] For example, the water vapor barrier layer may extend to the outer surface of the cover insulating layer of the solid-state battery on the cover substrate. That is, when the solid-state battery package 1000 has a cover insulating layer 160 on the substrate 200 that is provided to at least cover the top surface 100A and the side surface 100B of the solid-state battery 100, it is preferable that the water vapor barrier layer 300 extends to the outer surface 160A of the cover insulating layer 160 covering the side surface 100B (see reference). Figure 4 This is because, from Figure 4 As can be seen from the cross-sectional view, water vapor that can be introduced from the external environment via the substrate 200 can be prevented more reliably. That is, the water vapor barrier layer can function more reliably, so that external water vapor introduced via the substrate will not reach the solid-state battery, and a better solid-state battery package that suppresses the degradation of solid-state battery characteristics from a longer-term perspective can be obtained.

[0087] In a preferred embodiment, the water vapor barrier layer becomes an insulating film. That is, the water vapor barrier layer becomes an insulating film or insulating layer with electrical insulating properties. In this regard, the water vapor barrier layer can be a film comprising a material with high electrical insulation properties. As used in this specification, "insulating" means that due to the insulating properties of general insulators, it can have a resistivity, although this is only an example, it can also have a resistivity of at least 1.0 × 10⁻⁶. 5 Ω·m or higher, preferably 1.0×10 6 Ω·m or more, preferably 1.0 × 10 7A resistivity of Ω·m or higher (at room temperature 20°C). This is because it can further suppress adverse conditions such as short circuits. That is, while preventing water vapor penetration, it can appropriately suppress the resulting electrical adverse effects. Such a water vapor barrier film or layer can be made of any insulating material, without particular limitation. Specific examples of such materials include inorganic insulators such as glass and alumina, and organic insulators such as resins. They can be used alone or in combination of two or more. For example, the water vapor barrier layer can be an inorganic film containing inorganic materials, or an insulating film that exhibits electrical insulation in relation to the inorganic material. Alternatively, it can be an organic film containing organic materials, or an insulating film that exhibits electrical insulation in relation to the organic material. Furthermore, it can also be a film combining such inorganic and organic materials. It should be noted that the term "film" or "thin film" in this specification refers to a form with a small layer thickness, for example, it can be understood as having a "nanometer-scale thickness" (10 nm or more and 900 nm or less) as described later.

[0088] The water vapor barrier layer can be a single layer. Alternatively, it can be composed of multiple layers (i.e., the multi-layered form described below). There are no particular limitations on these forms as long as the desired water vapor impermeability can be achieved.

[0089] In a preferred embodiment, the water vapor barrier layer is an insulating multilayer film. Multilayering improves the water vapor barrier properties of the water vapor barrier layer. Such an insulating multilayer film can be formed multiple times with the same film (e.g., a film of the same material), or different films can be formed (e.g., films of different materials). In the case of different films, an organic insulating barrier layer can be formed on an inorganic insulating barrier layer.

[0090] In a preferred embodiment, the water vapor barrier layer is provided in such a way that it substantially occupies the top view area of ​​the solid-state battery package. Specifically, the water vapor barrier layer can be provided in such a way that it occupies the entire top view area of ​​the solid-state battery package except for the connection area (i.e., the connection portion) between the end electrode of the solid-state battery and the electrode layer on the main surface of the substrate. This large-area water vapor barrier layer, when viewed from above, can more reliably prevent water vapor from the external environment from seeping in through the substrate. It should be noted that this water vapor barrier layer 300 can extend at the height level of the bonding member 600 disposed between the end electrode and the electrode layer on the main surface of the substrate (see reference). Figure 4For example, in a cross-sectional view, the water vapor barrier layer 300 may extend across and through the bonding member 600. Alternatively, in a cross-sectional view, the water vapor barrier layer 300 may extend in contact with the bonding member 600 and further outward to contact the outer surface 160A covering the insulating layer. The bonding member 600 at least provides electrical connection between the end electrode of the solid-state battery and the substrate, and may contain, for example, a conductive adhesive (although this is only one example, the bonding member 600 may be made of an epoxy-based conductive adhesive containing a metal filler such as Ag).

[0091] The water vapor barrier layer is preferably a silicon-containing layer. This is because it is a preferred layer in terms of electrical insulation. For example, the water vapor barrier layer can be an inorganic layer or inorganic film containing silicon. As a silicon-containing water vapor barrier layer, it can be a layer composed of a molecular structure containing not only silicon atoms but also nitrogen atoms and / or oxygen atoms. This is because it is a preferred layer in terms of electrical insulation and thin-film properties. For example, the water vapor barrier layer has both Si-O bonds and Si-N bonds. That is, both Si-O bonds and Si-N bonds can exist in the molecular structure of the layer material constituting the water vapor barrier layer. If both Si-O bonds and Si-N bonds are present in the molecular structure of the layer, it is easy to become a dense layer even though it is a thin layer, and it is easy to become a water vapor barrier layer that more appropriately exhibits the property of preventing water vapor permeation. In other words, it is not only preferred in terms of electrical insulation and thin-film properties, but it is also easy to become a water vapor barrier layer that exhibits even better water vapor permeation prevention properties. This means that water vapor can be appropriately prevented from permeating, and the resulting adverse effects can be suppressed (especially from the perspective of reducing the height and / or miniaturization of solid-state battery packages and / or from an electrical point of view). It should be noted that the aforementioned "silicon-containing water vapor barrier layer" and "water vapor barrier layer having both Si-O bonds and Si-N bonds" are not siloxane-based layers. That is, the water vapor barrier layer involved in this invention preferably has a molecular structure containing silicon and Si-O bonds but without a siloxane backbone.

[0092] The "Si-O bond" and "Si-N bond" mentioned in this specification refer to bonds that can be confirmed, for example, based on Fourier transform infrared spectroscopy (FT-IR). That is, the Si-O and Si-N bonds involved in this morphology can be confirmed by measuring the absorption of light in the infrared region. It should be noted that, in this specification, the FT-IR measurements were performed using a Spotlight 150 microscope manufactured by PerkinElmer, for example, using the micro-ATR method.

[0093] In terms of film morphology, the water vapor barrier layer having Si-O bonds and Si-N bonds is, for example, a film thinner than each layer of the stacked structure constituting the solid-state battery, and / or a film thinner than each layer constituting the substrate. Therefore, water vapor permeation can be appropriately prevented without compromising the design of a low-profile or miniaturized solid-state battery package. For example, the water vapor barrier layer having Si-O bonds and Si-N bonds preferably has a thickness in the nanometer range, preferably 10 nm or more and 900 nm or less, more preferably 50 nm or more and 700 nm or less, and even more preferably 50 nm or more and 500 nm or less, such as 50 nm or more and 400 nm or less, 50 nm or more and 300 nm or less, or 100 nm or more and 300 nm or less.

[0094] Furthermore, the water vapor barrier layer containing Si-O and Si-N bonds can be a layer with relatively high toughness. This means that the water vapor barrier layer can function properly during the charging and discharging of the solid-state battery. During the charging and discharging of the solid-state battery, the solid-state battery may expand and contract due to the movement of ions between the positive and negative electrode layers via the solid electrolyte layer. However, even under such expansion and contraction stress, the water vapor barrier layer, being highly tough, is unlikely to crack or break. Generally, layers with high water vapor barrier properties are dense and hard, and tend to crack or break easily due to stress, while softer layers that do not crack or break tend to have reduced water vapor barrier properties. In this respect, the water vapor barrier layer containing Si-O and Si-N bonds according to the present invention is unlikely to crack or break even under the expansion and contraction stress caused by the solid-state battery, and its water vapor permeability is also very high, resulting in higher reliability as a solid-state battery encapsulation.

[0095] The water vapor barrier layer involved in this invention may, for example, contain SiON and / or SiNH in its molecular structure. That is, a water vapor barrier layer having Si-O bonds and Si-N bonds may contain SiON and / or SiNH. Furthermore, a water vapor barrier layer having Si-O bonds and Si-N bonds may have different molecular or atomic concentrations in its thickness direction. For example, more SiNH may be formed in the lower layer region, while more SiON may be formed in the upper layer region. In other words, the water vapor barrier layer disposed between the substrate and the solid-state battery may also have a relatively higher Si-O bond concentration in the upper layer region (i.e., the side closer to the solid-state battery), and a relatively higher Si-N bond concentration in the lower layer region (i.e., the side closer to the substrate). For example, the upper half of the water vapor barrier layer (the upper half region closer to the solid-state battery) may contain more Si-O bonds, while the lower half of the water vapor barrier layer (the lower half region closer to the substrate) may contain more Si-N bonds. That is, it can be said that the concentration of H atoms is relatively high in the lower layer region of the water vapor barrier layer, and the concentration of O atoms is relatively high in the upper layer region. In this case, the effect of the water vapor barrier layer, which is characterized by "difficulty in causing cracks and fractures even under the stress of expansion and contraction caused by a solid-state battery, and high water vapor permeability," becomes readily apparent. Alternatively, in the layer region with more SiON atoms on the upper side, the concentration of oxygen atoms is relatively high on the upper side and relatively low on the lower side. From this perspective, the water vapor barrier layer (especially a water vapor barrier layer with Si-O and Si-N bonds) can be a layer whose molecular structure contains both SiON and SiNH sites. A water vapor barrier layer containing both SiON and SiNH sites is a dense layer and can become a layer with superior water vapor permeability prevention properties.

[0096] Preferably, the water vapor barrier layer having both Si-O and Si-N bonds is formed from a liquid raw material. Specifically, it is preferable to form the water vapor barrier layer having both Si-O and Si-N bonds by coating the substrate with the liquid raw material and then irradiating it with light. This allows the water vapor barrier layer to be formed without applying higher temperatures, suppressing adverse thermal effects on the substrate. Furthermore, vacuum evaporation methods generally require expensive evaporation equipment, but this liquid raw material formation method eliminates the need for such expensive equipment, thus relatively reducing costs. Moreover, layers formed by vacuum evaporation methods may warp on the substrate due to the stress acting upon them, but as mentioned above, layers formed from liquid raw materials experience less or virtually no stress. Therefore, when manufacturing the water vapor barrier layer from a liquid raw material, the possibility of warping on the substrate is reduced or prevented.

[0097] The solid-state battery package of the present invention can be implemented in various ways. For example, the following approaches can be considered.

[0098] (How the resist is set)

[0099] This method features a resist layer disposed between the substrate and the solid-state battery. Specifically, due to the resist present on the substrate 200, the solid-state battery package 1000 can have a resist layer 400 between the substrate 200 and the solid-state battery 100 (see reference). Figure 5 ).

[0100] In particular, a resist layer 400 is disposed on the main surface of the substrate 200. The resist layer is a layer that at least partially covers the surface of the substrate to prevent physical processing or chemical reactions. Therefore, the resist layer can be an insulating layer comprising a resin material disposed on the main surface of the substrate 200. Such a resist layer can be understood as a heat-resistant coating disposed on the main surface of the substrate 200. For example, it can also be a resist used to maintain insulation and protect conductive portions of the substrate, such as electrode layers, when the solid-state battery is connected to the substrate. The resist layer 400 disposed on the main surface of such a substrate 200 can be a layer of so-called "solder resist".

[0101] When a solid-state battery package has a resist layer, the water vapor barrier layer can have a higher barrier effect than the resist layer. For example, when a resist layer 400 is provided on the substrate 200, it is preferable that the water vapor barrier layer 300 has a lower water vapor permeability than the resist layer 400. This is because, for example, a resist layer composed of solder resist may not be sufficient to prevent water vapor permeation, but it can more adequately prevent water vapor from seeping in from the external environment via the substrate. For example, when the resist layer is composed of a solder resist containing resins such as epoxy and / or acrylic, the resist layer can have a barrier effect equivalent to 1 g / (m 2 An insulating layer with a water vapor transmission rate of · Day) or higher. That is, a water vapor barrier layer can have a lower water vapor transmission rate than such an insulating layer (i.e., for example, 0 g / (m²)). 2 • Day) or more and less than 1g / (m 2 Water vapor transmission rate (Day).

[0102] like Figure 5 As shown, in the solid-state battery package 1000 of the present invention, a resist layer 400 may be provided on the main surface of the substrate 200 (particularly the main surface relatively close to the solid-state battery 100). In this case, a water vapor barrier layer 300 may be disposed at least on the resist layer 400. Figure 5In the illustrated configuration, the water vapor barrier layer 300 is disposed in direct contact with the photoresist layer 400, with the water vapor barrier layer 300 and the photoresist layer 400 stacked on top of each other. This allows for more effective prevention of water vapor from the external environment from penetrating through the substrate and the photoresist layer above it when the water vapor barrier layer is disposed on the photoresist layer.

[0103] When the solid-state battery package has a resist layer, a water vapor barrier layer can also be partially formed on the substrate surface. For example, Figure 5 As shown in the extraction diagram, the water vapor barrier layer 300 on the resist layer 400 can also be partially located on the substrate 200 (in Figure 5 In the diagram, the portion of the water vapor barrier layer located on the substrate 200 is shown as 310. That is, in the cross-sectional view, the water vapor barrier layer overlapping the resist layer in the lamination direction extends beyond the resist layer and is partially laterally aligned with it. In this way, when a portion of the water vapor barrier layer is also located on the substrate, the water vapor barrier performance of the solid-state battery package can be improved. For example, when the substrate is a resin substrate, the water vapor barrier layer can more reliably cover the boundary between the electrode layer of a substrate made of a metal with high water vapor barrier performance and the resin portion of the substrate with low water vapor barrier performance, thereby improving the water vapor barrier performance of the solid-state battery package. From this perspective, the water vapor barrier layer, which is disposed in a manner overlapping the resist layer, can be at least partially located on the electrodes of the substrate.

[0104] (Moisture permeates through the delayed substrate metal layer 1)

[0105] In this approach, the substrate has a metal layer as its moisture permeation delay structure. That is, the substrate of the solid-state battery package itself has a structure that helps prevent water vapor from permeating.

[0106] For example, a metal layer 240 is used as a layer constituting a substrate 200, and the outer contour of the top view shape of the substrate 200 overlaps with the outer contour of the top view shape of the metal layer 240 (see reference). Figure 6 as well as Figure 7 That is, the metal layer 240 extends extensively to the periphery of the substrate 200. In the case of a resin substrate, the metal layer can be said to extend to the exposed portion at the outermost periphery of the resin substrate. It should be noted that, in a preferred embodiment, the outer contour of the top-view shape of the substrate 200 overlaps with the outer contour of the top-view shape of the metal layer 240, and the metal layer 240, as the inner region forming the inner side of this outer contour, has a solid overall shape (for example, a solid shape except for the opening region described below).

[0107] In the substrate, the metal layer is denser than the resin and / or ceramic portions, which helps prevent water vapor permeation. Therefore, water vapor ingress from the external environment can be prevented at the substrate location beforehand. That is, combined with the effect of the water vapor barrier layer, the effect of preventing external water vapor from penetrating the substrate and reaching the solid-state battery becomes more reliable, resulting in a better solid-state battery package that suppresses the degradation of solid-state battery characteristics from a longer-term perspective. For example, when the substrate has a metal layer that helps delay moisture permeation, the solid-state battery package can have a water vapor permeability of less than 2.5 × 10⁻⁶. -3 g / (m 2 Water vapor barrier properties (the lower limit of which can be 0 g / (m)) 2 ·Day).

[0108] The metal layer can be, for example, a layer made of at least one metallic material selected from the group consisting of copper, aluminum, stainless steel, nickel, silver, gold, and tin. The metal layer can be a metal foil, such as copper foil.

[0109] The metal layer can be equivalent to a layer located inside the substrate. That is, when the substrate has a first electrode layer for electrical connection with a solid-state battery on one of its main surfaces and a second electrode layer for mounting a solid-state battery package to an external substrate on its other main surface, the metal layer can be located between the first electrode layer and the second electrode layer. For example, a metal layer 240 can be provided in the substrate interior region between the first electrode layer 210 (equivalent to the mounting layer of the solid-state battery 100) and the second electrode layer 220 (e.g., the second electrode layer 220 (equivalent to the so-called customer mounting layer)). Figure 6Thus, since a metal layer specifically designed to prevent water vapor transmission can be provided separately from the electrode layer, the substrate can be used more effectively to prevent water vapor transmission. It should be noted that this metal layer may or may not provide electrical connection between the upper and lower main surfaces of the substrate. When it does not provide electrical connection between the upper and lower main surfaces of the substrate, the metal layer 240 is equivalent to a non-electrically connected metal layer disposed in the internal region of the substrate. That is, in this case, the metal layer 240 is not electrically connected to the first electrode layer 210 and the second electrode layer 220. On the other hand, when it provides electrical connection between the upper and lower main surfaces of the substrate, the metal layer 240 is equivalent to a metal layer for electrical connection disposed in the internal region of the substrate. That is, in this case, the metal layer 240 is electrically connected to the first electrode layer 210 and the second electrode layer 220. In a preferred embodiment, the metal layer may be a dummy electrode layer that does not provide electrical connection between the upper and lower main surfaces. That is, it may be a metal layer specifically provided to prevent water vapor transmission that is not electrically connected to the aforementioned first and second electrode layers. Alternatively, the metal layer may be a ground layer. That is, a metal layer for preventing water vapor transmission may be used as a ground layer. Such a metal layer that prevents water vapor from passing through can be a single layer, but is not limited to this. If further enhancing the effect of preventing water vapor from passing through is of greater importance, then at least two metal layers can be formed on the substrate. Figure 8 As shown, when a metal layer 240 is provided on the substrate 200, the substrate base material layer 250, such as the resin layer, has a serpentine shape when viewed from the substrate cross-section. That is, the water vapor entry path of the substrate becomes circuitous, which can more effectively prevent water vapor from passing through to the solid-state battery.

[0110] In a preferred embodiment, the metal layer extending in a manner that crosses the substrate has a shape that substantially occupies the entire horizontal plane of the substrate. In other words, the metal layer disposed within the substrate, i.e., the metal layer extending along the surface direction of the substrate, substantially occupies the entire substrate surface (an imaginary plane within the substrate) at such an extension level. For example, the area of ​​the metal layer 240 in its top view shape is 90% or more, preferably 95% or more, and more preferably 99% or more, relative to the area of ​​the substrate 200 in its top view shape. That is, the metal area ratio in the substrate can be 90% or more, preferably 95% or more, and more preferably 99% or more. The upper limit of such area ratio can be 100% (other area ratios / occupancy rates mentioned in this specification can also be an upper limit of 100%). It should be noted that this metal area ratio, etc., can also be understood to include the metal portion (e.g., through-holes) of the openings in the metal layer described later. It should be noted that, although this is only an example, the area of ​​the top-view shape of the metal layer 240 relative to the area of ​​the top-view shape of the substrate 200 can be 90% or more and 99.5% or less, or 95% or more and 99.5% or less, etc. The substrate surface occupancy of the metal layer extending along the substrate surface direction inside the substrate can be 90% or more, preferably 95% or more, and more preferably 99% or more. This means that the top-view shape of the metal layer 240 and the top-view shape of the substrate 200 are substantially the same macroscopically (see reference). Figure 7 Therefore, it is possible to more reliably prevent water vapor from seeping in from the external environment at the substrate location.

[0111] (Moisture permeates through the delayed substrate metal layer 2)

[0112] In this method, the metal layer, which serves as a structure for delaying the permeation of moisture through the substrate, has a specific opening shape. Specifically, the opening region of the metal layer, when viewed from above, is circular. For example... Figure 8 As shown, the metal layer 240, which extends extensively to the periphery of the substrate 200, has an opening 245 whose top-view shape (or top-view profile) can be circular. A circular shape has low anisotropy, which easily contributes to increasing the metal area ratio. That is, such an opening can increase the metal area ratio within the top-view shape of the substrate, further improving the effect of preventing water vapor permeation. Therefore, it is easier to obtain a long-life solid-state battery package that more appropriately suppresses the degradation of solid-state battery characteristics from a longer-term perspective.

[0113] For example, the top view shape of the opening region of a through-hole used to provide electrical connection between the upper and lower main surfaces can be circular. In this case, the metal portion or conductive portion that connects the upper and lower layers in the substrate is preferably circular (circular in top view).

[0114] In this specification, the term "circle" is not limited to a perfect circle (i.e., not limited to "circle" or "perfect circle"), but also includes a general circular shape that, even with modifications, would generally be considered "circular" by those skilled in the art. For example, it can be not only a circle or perfect circle, but also a shape with locally different curvatures of its arcs, and further, for example, a shape derived from a circle or perfect circle such as an ellipse.

[0115] It should be noted that the aforementioned "metal area ratio" can also include the metal region containing the through-hole portion. That is, the metal layer with the opening region includes the area of ​​the through-hole located in the opening region (the area of ​​the through-hole's top view shape on the same plane as the metal layer), and the area of ​​the metal layer's top view shape can be 90% or more, preferably 95% or more, and more preferably 99% or more.

[0116] (Resin substrate method)

[0117] In this approach, the substrate is particularly a resin substrate. That is, the solid-state battery package includes a substrate comprising a resin as a base material. This approach can include a resin layer in the laminated structure of the substrate. The resin material of such a resin layer can be any thermoplastic resin and / or any thermosetting resin. Alternatively, the resin layer can be formed by impregnating a fiber cloth and / or paper, etc., as a substrate, with a resin material. For example, it can also be formed by impregnating a glass fiber cloth with a resin material such as epoxy resin.

[0118] The resin substrate functions appropriately during the charging and discharging of solid-state batteries. During charging and discharging, solid-state batteries expand and contract due to the movement of ions between the positive and negative electrode layers via the solid electrolyte layer. The resin substrate can adequately absorb the stress during charging and discharging, reducing the load on the water vapor barrier layer. In other words, when using a solid-state battery package, the possibility of damage to the water vapor barrier layer is reduced, and the reliability of the package is improved in terms of preventing water vapor permeation.

[0119] The inventors of this application have discovered that resins exhibit considerable permeability to water vapor (e.g., various forms of moisture, including water vapor in the air). In a solid-state battery package, moisture can potentially seep into the package through the resin portion of the substrate. Therefore, when the substrate is a resin substrate, the effect of a substrate metal layer that delays moisture permeation—that is, a metal layer that more reliably prevents water vapor from the external environment from passing through the substrate—becomes readily apparent.

[0120] [Manufacturing method of solid-state battery package]

[0121] The packaged product of the present invention can be obtained by preparing a solid battery comprising a positive electrode layer, a negative electrode layer and a solid electrolyte between these electrodes, and then packaging the solid battery.

[0122] The manufacturing of the solid-state battery package of the present invention can be broadly divided into the manufacturing of the solid-state battery itself (hereinafter also referred to as "package pre-battery"), which is equivalent to the pre-encapsulation stage, the preparation of the substrate, and the encapsulation.

[0123] Manufacturing method of front battery of package

[0124] The pre-encapsulation battery can be manufactured using printing methods such as screen printing, green sheet methods using green sheets, or a combination thereof. That is, the pre-encapsulation battery itself can be manufactured according to conventional solid-state battery manufacturing methods (therefore, the raw materials such as solid electrolyte, organic binder, solvent, any additives, positive electrode active material, and negative electrode active material described below can be substances known to be used in the manufacture of solid-state batteries).

[0125] Hereinafter, to better understand the present invention, one method of manufacturing will be illustrated, but the present invention is not limited to this method. Furthermore, the chronological order of the following descriptions is for ease of explanation only and is not necessarily limiting.

[0126] (Formation of stacked blocks)

[0127] A slurry is prepared by mixing a solid electrolyte, an organic binder, a solvent, and any additives. The prepared slurry is then fired to form a sheet containing the solid electrolyte.

[0128] • A paste for the positive electrode is prepared by mixing the positive electrode active material, solid electrolyte, conductive material, organic binder, solvent, and any additives. Similarly, a paste for the negative electrode is prepared by mixing the negative electrode active material, solid electrolyte, conductive material, organic binder, solvent, and any additives.

[0129] • Print a positive electrode paste onto the sheet material. Additionally, print a current collector layer and / or a negative electrode layer as needed. Similarly, print a negative electrode paste onto the sheet material. Additionally, print a current collector layer and / or a negative electrode layer as needed.

[0130] • A laminate is obtained by alternately stacking sheets printed with positive electrode paste and sheets printed with negative electrode paste. It should be noted that the outermost layer (top and / or bottom) of the laminate can be an electrolyte layer, an insulating layer, or an electrode layer.

[0131] (Formation of the sintered battery body)

[0132] After the laminates are pressed together, they are cut to specified dimensions. The resulting cut laminates are then degreased and fired. This yields a fired laminate. It should be noted that the laminates can also be degreased and fired before cutting.

[0133] (End face electrode formation)

[0134] The end-face electrode on the positive electrode side can be formed by coating the exposed positive electrode side of the sintered laminate with a conductive paste. Similarly, the end-face electrode on the negative electrode side can be formed by coating the exposed negative electrode side of the sintered laminate with a conductive paste. The end-face electrodes on both the positive and negative electrode sides can be configured to reach the main surface of the sintered laminate. This is because in the next process, they can be connected to the main electrode layer of the substrate with a small area (more specifically, the end-face electrode configured to reach the main surface of the sintered laminate has a folded-back portion on the main surface, but such folded-back portion can be electrically connected to the main electrode layer of the substrate). The composition of the end-face electrode can be selected from at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel.

[0135] It should be noted that the end electrodes on the positive and negative sides are not limited to being formed after the lamination is fired; they can also be formed before firing and fired simultaneously.

[0136] By going through the processes described above, the desired packaged front battery can finally be obtained.

[0137] Substrate preparation

[0138] (Resin substrate)

[0139] When the substrate is a resin substrate, its preparation can be carried out by laminating multiple layers and subjecting them to heating and pressurization. For example, at least one resin sheet and at least one metal sheet (e.g., a sheet of metal foil) made by impregnating a fiber cloth and / or paper as a substrate with resin raw materials are prepared, and they are overlapped to form a substrate precursor. Then, the substrate precursor is heated and pressurized using a press, thereby obtaining a resin substrate.

[0140] The main electrode layer on the main surface of the substrate where the electrical wiring is located can be appropriately patterned.

[0141] It should be noted that when the above-mentioned "substrate metal layer with delayed moisture transmission" is provided, the metal sheet can be any sheet having the desired shape. By laminating the metal sheet, which at least includes the sheet for delayed moisture transmission, and the resin sheet in different layers to form a substrate precursor, a resin substrate having a metal layer with delayed moisture transmission can be obtained by performing heating and pressurization treatment.

[0142] (Ceramic substrate)

[0143] When the substrate is a ceramic substrate, it can be prepared, for example, by stacking multiple green sheets and firing them.

[0144] The ceramic substrate may have through-holes and / or pads. In such cases, for example, holes can be formed on the green sheet using a punch press or a carbon dioxide laser, and the holes can be filled with a conductive paste material, or precursors for metal or conductive portions such as through-holes, pads, wiring layers, and / or electrode layers can be formed by performing a printing method. Furthermore, the ceramic substrate preferably has a non-connected metal layer that is not electrically connected as a water vapor permeation barrier layer. In this case, this metal layer (especially its precursor) can be formed on the green sheet. This metal layer can be formed by printing or by arranging metal foil. Next, a green sheet laminate is formed by overlapping a predetermined number of such green sheets and hot-pressing them. By firing the green sheet laminate, a ceramic substrate can be obtained. It should be noted that pads, etc., can also be formed after firing the green sheet laminate.

[0145] By going through the processes described above, the desired substrate can finally be obtained.

[0146] (Formation of the water vapor barrier layer)

[0147] The water vapor barrier layer can be formed on the substrate. That is, the water vapor barrier can also be formed on the substrate before the encapsulation of combining the substrate and the solid-state battery.

[0148] The water vapor barrier layer can be formed as long as the desired barrier layer can be formed, without any particular limitation. For example, in the case of a "water vapor barrier layer having Si-O bonds and Si-N bonds", it can be formed by coating a liquid raw material and irradiating it with ultraviolet light. Preferably, a "water vapor barrier layer having Si-O bonds and Si-N bonds" can be obtained by irradiating a precursor layer obtained by coating a liquid raw material containing a silicon compound, such as a silicon compound containing Si-N-Si bonds and a solvent (e.g., an organic solvent) with ultraviolet light. That is, without using vapor phase evaporation methods such as CVD and PVD, the water vapor barrier layer is formed from a liquid raw material under relatively low temperature conditions (e.g., around 100°C).

[0149] Specifically, as a liquid raw material, such as a silicon-containing compound like silazane, the liquid raw material is coated onto a substrate by spin coating or spraying and then dried to form a barrier precursor. Next, the barrier precursor is subjected to UV irradiation in an atmosphere containing nitrogen and / or oxygen, thereby obtaining a "water vapor barrier layer having both Si-O and Si-N bonds." For example, a "water vapor barrier layer with a relatively high number of Si-O bonds in the layer region closer to the solid-state battery and a relatively high number of Si-N bonds in the layer region closer to the substrate" can be obtained by UV irradiating a barrier precursor layer containing a silicon compound (e.g., silazane) with Si-N-Si bonds in an ambient atmosphere containing nitrogen and oxygen. In particular, during the UV irradiation process of the barrier precursor layer, active oxygen is generated in the ambient atmosphere by the UV irradiation, and this active oxygen penetrates from the outer surface of the barrier precursor layer, thereby obtaining the aforementioned water vapor barrier layer. More specifically, reactive oxygen species are generated in an atmosphere containing oxygen and nitrogen, and UV irradiation is continued in the barrier precursor layer to promote the breaking of molecular bonds in silicon compounds containing Si-N-Si bonds. This causes reactive oxygen species invading from the outer surface of the barrier precursor layer to bind to the broken molecular sites. The outer surface of the barrier precursor layer and the adjacent intralayer region contain relatively more Si-O bonds, while the intralayer region relatively far from the outer surface of the barrier precursor layer has a relatively smaller effect from UV irradiation and is less likely to promote the breaking of the aforementioned molecular bonds, thus containing relatively more Si-N bonds. By obtaining a water vapor barrier layer on the substrate in this way, a water vapor barrier layer can be obtained where the layer region relatively close to the solid-state battery contains relatively more Si-O bonds, and the layer region relatively close to the substrate contains relatively more Si-N bonds.

[0150] When forming the water vapor barrier layer, it is preferable to partially remove the barrier layer at that location, so that there is no water vapor barrier layer at the junction of the conductive portion of the substrate and the end electrode of the solid-state battery. Alternatively, a mask can be used to prevent the formation of the water vapor barrier layer only at the junction. That is, a mask can be applied to the area that becomes the junction to form the water vapor barrier layer as a whole, and then the mask can be removed.

[0151] It should be noted that when a resist layer is provided on the main surface of the substrate, such as Figure 9 (A) and Figure 9As shown in (B), a water vapor barrier layer 300 can be formed on the resist layer 400. At this time, as described above, it is preferable to form the water vapor barrier layer 300 in a manner that removes the bonding region 500 with the solid-state battery 100. That is, it is preferable to prepare a substrate 200 in which the resist layer 400 and the water vapor barrier layer 300 are formed, exposing the surface electrode of the substrate. It should be noted that, if necessary, the water vapor barrier layer can also be formed on the resist layer such that a portion of the water vapor barrier layer is located on the surface electrode of the substrate.

[0152] Encapsulation

[0153] During encapsulation, the battery and substrate obtained above are used. Figure 9 (C) to (E) schematically illustrate the process of obtaining the solid battery package of the present invention by encapsulation.

[0154] First, such as Figure 9 As shown in (C) and 9(D), the front battery 100' of the package is disposed on the substrate 200. That is, an "unpackaged solid battery" (hereinafter, the battery used for packaging will be referred to as "solid battery") is disposed on the substrate.

[0155] The solid-state battery is preferably disposed on the substrate in such a way that the conductive portion of the substrate and the end electrode of the solid-state battery are electrically connected to each other. For example, a conductive paste can be provided on the substrate (especially for the area of ​​the "bonding portion" mentioned above), thereby electrically connecting the conductive portion of the substrate and the end electrode of the solid-state battery to each other. More specifically, the electrode layer on the main surface of the substrate is aligned with the folded-back portion of the end electrode on the positive electrode side of the solid-state battery, and another electrode layer on the main surface of the substrate is aligned with the folded-back portion of the end electrode on the negative electrode side of the solid-state battery, and the bonding connection is made using a conductive paste (e.g., Ag conductive paste). That is, a precursor 600' for the bonding member that bears the electrical connection between the solid-state battery 100 and the substrate 200 can be provided in advance. In addition to Ag conductive paste, the precursor 600' for the bonding member can also be provided using conductive pastes such as printed nano paste, alloy paste, solder, etc., which do not require cleaning of flux after formation. Next, the solid battery 100 is disposed on the substrate in such a way that the end face electrode of the solid battery is in contact with the precursor 600' of the bonding member. By performing a heat treatment, the precursor 600' forms a bonding member 600 that facilitates the electrical connection between the solid battery 100 and the substrate 200.

[0156] Next, a covering material is formed. For example... Figure 9 As shown in (E), the covering material 150 may include an insulating covering layer 160 and an inorganic covering layer 170.

[0157] First, a covering insulating layer 160 is formed to cover the solid-state battery 100 on the substrate 200. Therefore, the raw material for the covering insulating layer 160 is provided to cover the solid-state battery integrally on the substrate. When the covering insulating layer is made of a resin material, a resin precursor is placed on the substrate and cured to form the covering insulating layer. In a preferred embodiment, the covering insulating layer can also be formed by applying pressure using a mold. Although this is only an example, a covering insulating layer that seals the solid-state battery on the substrate can be formed by compression and molding. If the resin material is generally used in molding, the raw material for the covering insulating layer can be in granular form, and it can also be thermoplastic. It should be noted that such forming is not limited to mold forming; it can also be performed by grinding, laser processing, and / or chemical treatment.

[0158] After the insulating layer 160 is formed, an inorganic layer 170 is formed. Specifically, the inorganic layer 170 is formed on the "precursor to the cover of each solid-state battery 100 on the support substrate 200, which is covered by the insulating layer 160". For example, a plating is formed. Although this is only an example, dry plating can also be performed, and a dry plating film can be provided as the inorganic layer.

[0159] Through the above processes, a package can be obtained in which a water vapor barrier layer is provided between the substrate and the solid-state battery, and the solid-state battery on the substrate is completely covered by an insulating layer and an inorganic layer. That is, the "solid-state battery package" involved in this invention can be obtained.

[0160] The embodiments of the present invention have been described above, but only typical examples have been illustrated. The present invention is not limited thereto, and those skilled in the art will readily understand that various methods can be considered without changing the spirit of the present invention.

[0161] For example, the above description used drawings illustrating a solid-state battery package having a resist layer, but the present invention is not particularly limited thereto. For example, a resist layer may not be provided between the substrate 200 and the solid-state battery 100 (see [reference]). Figure 10 That is, it is also possible not to set, for example, about Figure 5 The resist layer is 400 as described. (For example...) Figure 10 As shown, since there is no resist layer between the substrate 200 and the solid battery 100, the water vapor barrier layer 300 can be directly disposed on the base material portion (e.g., resin portion or ceramic portion) on the substrate and / or on the electrode layer 210 (electrode layer 210A on the positive electrode side and / or electrode layer 210B on the negative electrode side) on the substrate surface.

[0162] Furthermore, while the above description focused on the manner in which the package contains the covering material 150, the present invention can also be implemented in a manner in which the solid-state battery 100 is extensively covered by the covering material 150. For example, the inorganic covering layer 170 disposed on the insulating covering layer 160 covering the solid-state battery 100 on the substrate 200 can reach the lower main surface of the substrate 200 (see reference). Figure 2 That is, as the covering material 150, the covering inorganic layer 170 on the covering insulating layer 160 can extend to the side of the substrate 200 and beyond its side to the lower main surface of the substrate 200 (especially its peripheral portion). In this manner, a solid-state battery package that more adequately prevents moisture penetration (moisture penetration from the outside to the solid-state battery stack) can be obtained. It should be noted that, as Figure 11 As shown, the inorganic layer 170 can also be configured as a multi-layer structure consisting of at least two layers. Figure 11 The diagram shows a two-layer inorganic cover layer 170 with structures 170A and 170B. This multi-layer structure is not particularly limited to dissimilar materials; it can also be between similar materials. Providing such a multi-layer inorganic cover layer improves the overall water vapor barrier properties of the package. It should be noted that when an inorganic cover layer is provided, the water vapor barrier layer can extend to or contact this inorganic cover layer. Specifically, the water vapor barrier layer 300 can extend to or contact the inorganic cover layer 170 covering the side of the solid-state battery 100 (see reference). Figure 2 as well as Figure 11 ).from Figure 2 as well as Figure 11 As can be seen from the cross-sectional view, this is because it can more reliably prevent water vapor from seeping in from the external environment via the substrate 200. In other words, when the inorganic covering layer 170 is provided on the insulating layer 160 to at least cover the insulating layer 160, the water vapor barrier layer 300 can extend to the inorganic covering layer 170 covering the side of the solid-state battery 100 (especially its inner side or inner surface). In this way, the water vapor barrier layer can function more reliably, so that external water vapor seeping in via the substrate will not reach the solid-state battery, thereby obtaining a solid-state battery package that suppresses the degradation of solid-state battery characteristics from a longer-term perspective. It should be noted that when the inorganic covering layer 170 is provided on the insulating layer 160, it can be said that the water vapor barrier layer 300 extending to the outer side or outer surface of the insulating layer 160 can contact the inorganic covering layer 170.

[0163] Furthermore, while the above description focused on metal layers with a high "metal area ratio," the present invention can also achieve a high metal area ratio using multiple substrate metal layers. For example... Figure 12As shown, multiple metal layers, such as metal layers 240A, 240B, and 240C, can achieve a metal area ratio of 90% or more, preferably 95% or more, and more preferably 99% or more. This means that the sum of the planar areas of multiple metal layers such as metal layers 240A, 240B, and 240C can be 90% or more, preferably 95% or more, and more preferably 99% or more (area ratio relative to the area of ​​the shape viewed from above the substrate 200). It can be said that the metal layers of the object generally have a metal area ratio of 99% or more when viewed from above. It should be noted that such multiple metal layers (e.g., metal layers 240A, 240B, and 240C) can be located on different planes inside the substrate (in short, different height or depth levels), and / or do not overlap each other in the planar perspective view of the substrate.

[0164] Furthermore, while the above description focused on the through-holes in the opening region of the metal layer, it can also be understood that the metal layer or metal portion connecting the first electrode layer and the second electrode layer may have a through-hole structure. That is, a metal structure or metal portion communicating with one or more layers in cross-sectional view can be provided on the substrate. In view of this, the substrate according to the present invention can be manifested in various metal layer forms. For example, in the substrate, a first metal layer may be located between a first electrode layer (an electrode layer for electrically connecting to a solid-state battery on one main surface of the substrate) and a second electrode layer (an electrode layer for mounting a solid-state battery package to an external substrate on another main surface of the substrate), and the substrate may also have a second metal layer that is not connected to the first electrode layer and the second electrode layer. The first metal layer is preferably a metal layer (or metal portion, such as a through-hole portion) that can electrically connect the first electrode layer and the second electrode layer to each other. In this case, the substrate may have a first metal layer (or metal portion, such as a through-hole portion) electrically connected to both the first electrode layer and the second electrode layer between the first electrode layer and the second electrode layer, and a second metal layer that is not electrically connected to either the first electrode layer or the second electrode layer. The first and second metal layers can be made of the same metal material or different metal materials. In this manner, the encapsulation substrate serves as a terminal substrate for the external terminals of the solid-state battery, and water vapor permeation from the external environment to the solid-state battery can be appropriately prevented within the solid-state battery package. The first and second metal layers can be located on the same plane (in short, at the same height or depth) within the substrate, or they can be located on different planes (in short, at different height or depth). Furthermore, the area of ​​the top-view shape of the first and second metal layers relative to the area of ​​the top-view shape of the substrate can, for example, be 90% or more. More specifically, the combined area of ​​the top-view shape of the first and second metal layers relative to the area of ​​the top-view shape of the substrate is preferably 90% or more, more preferably 95% or more, and even more preferably 99% or more (the upper limit of such area ratio can be 100%). Using such an area relationship can more effectively prevent water vapor permeation from the external environment to the solid-state battery.

[0165] Furthermore, the above description mentions a method of electrically connecting the conductive portion of the substrate and the end electrode of the solid-state battery to each other using a conductive paste provided to the substrate. However, the provided conductive paste 610' can also ultimately have... Figure 13The solid-state battery 100 and the substrate 200 are electrically bonded via the conductive paste 610'. Pressure is applied from the solid-state battery 100 to the conductive paste 610', causing the end electrode 140 of the solid-state battery 100 to easily become slightly embedded in the conductive paste 610'. That is, the conductive paste 610' easily has a shape where it is slightly raised on its outer side due to being pressed by the end electrode 140. Figure 13 (The "M" part). Additionally, when the solid-state battery 100 and the substrate 200 are electrically bonded via the conductive paste 610', due to the pressing of the conductive paste 610', a portion of the conductive paste 610' can flow across the resist layer 400. That is, as... Figure 13 As shown, the conductive paste 610' is located on the main electrode layer 210 of the substrate inside the resist layer 400 and the water vapor barrier layer 300, and a portion of it 610'' reaches the water vapor barrier layer 300. This is related to the fact that the resist layer 400 and the water vapor barrier layer 300 act as a "dam" for the conductive paste 610'. More specifically, the openings of the resist layer 400 and the water vapor barrier layer 300 that expose the conductive portions of the substrate (especially the main electrode layer 210 of the substrate) have edges that partially prevent the movement of the conductive paste 610'. Therefore, a portion of the conductive paste 610' temporarily supplied to the opening flows onto the water vapor barrier layer 300 with pressure, while most of the conductive paste 610' remains in the openings of the resist layer 400 and the water vapor barrier layer 300. That is, preferably, the resist layer (e.g., solder resist layer) and the water vapor barrier layer above it act as a dam to suppress the seepage of the conductive paste. If the seepage of the conductive paste is suppressed, it is easier to ensure the bonding area between the water vapor barrier layer 300 and the covering insulation layer 160 (especially the covering insulation layer 160 disposed between the solid battery 100 and the substrate 200), and the fixing force between them can be more stable. It should be noted that the conductive paste 610' is a manifestation under the premise of manufacturing, but for the manufactured solid battery, the conductive paste 610' is equivalent to the bonding component 600. Therefore, in the solid battery package 1000 according to one embodiment of this disclosure, as Figure 13 As shown, the bonding member 600 is located inside the resist layer 400 and the water vapor barrier layer 300 (particularly in the area on the upper main electrode layer 210 of the substrate), and a portion of it extends onto the water vapor barrier layer 300.

[0166] It should be noted that the present invention relates to a solid-state battery package, but the package can also be provided as an electronic device mounted on an external substrate different from the substrate. That is, the substrate of the solid-state battery package can become a terminal substrate for external terminals of the solid-state battery, and the solid-state battery package can be surface-mounted on an external substrate (i.e., a secondary substrate) such as a printed wiring board via the terminal substrate, and the solid-state battery package can also be provided as such an electronic device.

[0167] Industrial availability

[0168] The solid-state battery package of the present invention can be applied to various fields where batteries or energy storage are envisioned. Although only examples, the solid-state battery package of the present invention can also be applied to electrical / information / communication fields using mobile devices, etc. (e.g., electrical / electronic equipment fields or mobile device fields including mobile phones, smartphones, laptops, digital cameras, activity meters, ARM computers, electronic paper, RFID tags, card-type electronic money, smartwatches, etc.), home / small industrial applications (e.g., power tools, golf carts, home / care / industrial robots), large industrial applications (e.g., forklifts, elevators, port cranes), transportation systems (e.g., hybrid vehicles, electric vehicles, buses, trams, electric-assisted bicycles, electric motorcycles, etc.), power system applications (e.g., various power generation, load conditioners, smart grids, general home-setup energy storage systems, etc.), medical applications (medical devices such as headphones and hearing aids), pharmaceutical applications (medical management systems, etc.), and IoT fields, space / deep-sea applications (e.g., space probes, underwater research vessels, etc.), etc.

[0169] Explanation of reference numerals in the attached figures

[0170] 100: Solid-state battery; 100A: Top surface (upper surface) of solid-state battery; 100B: Side surface of solid-state battery; 110: Positive electrode layer; 120: Negative electrode layer; 130: Solid electrolyte or solid electrolyte layer; 140: End electrode; 140A: End electrode on the positive electrode side; 140B: End electrode on the negative electrode side; 150: Covering material; 160: Covering insulating layer; 160A: Outer surface of the covering insulating layer; 170: Covering inorganic layer; 170A: Auxiliary covering inorganic layer (auxiliary lower layer); 170B: Auxiliary covering inorganic layer (auxiliary upper layer); 200: Substrate; 200': Layer constituting the laminated structure of the substrate; 210: Main electrode layer (on the substrate) 210A: Upper main electrode layer on the positive electrode side; 210B: Upper main electrode layer on the negative electrode side; 220: Main electrode layer (underside of substrate); 220A: Lower main electrode layer on the positive electrode side; 220B: Lower main electrode layer on the negative electrode side; 240: Metal layer of substrate; 245: Opening of metal layer; 300: Water vapor barrier layer; 310: Part of water vapor barrier layer located on substrate; 400: Resist layer; 500: Bonding area between end electrode of solid battery and electrode layer of substrate; 600: Bonding component; 600': Precursor of bonding component; 1000: Solid battery package; M: Conductive paste / protrusion of bonding component.

Claims

1. A solid-state battery encapsulation, It has a substrate and a solid-state battery disposed on the substrate. It is formed by having a water vapor barrier layer between the substrate and the solid-state battery. The water vapor barrier layer has both Si-O bonds and Si-N bonds. The water vapor barrier layer contains a relatively large number of Si-O bonds in the layer region relatively close to the solid-state battery, and the water vapor barrier layer contains a relatively large number of Si-N bonds in the layer region relatively close to the substrate.

2. The solid-state battery package according to claim 1, wherein, The water vapor barrier layer is thinner than the layers constituting the solid-state battery's stacked structure.

3. The solid-state battery package according to claim 1 or 2, wherein, The water vapor barrier layer is an insulating film.

4. The solid-state battery package according to claim 1 or 2, wherein, The water vapor barrier layer has a density of less than 5 × 10⁻⁶. -3 g / (m 2 Water vapor transmission rate (Day).

5. The solid-state battery package according to claim 1 or 2, wherein, A photoresist layer is disposed on the substrate, and the water vapor barrier layer has a lower water vapor permeability than the photoresist layer.

6. The solid-state battery package according to claim 1 or 2, wherein, The water vapor barrier layer extends in a direction along the surface of the substrate.

7. The solid-state battery package according to claim 6, wherein, It also has a covering insulating layer disposed in a manner that covers the main surface and sides of the solid-state battery. The water vapor barrier layer extends to the outer surface of the covering insulation layer that covers the side.

8. The solid-state battery package according to claim 6, wherein, It also has a covering insulating layer disposed in a manner that covers the main surface and the side surface of the solid-state battery, and a covering inorganic layer disposed on the covering insulating layer, wherein the water vapor barrier layer extends to the inner side surface of the covering inorganic layer covering the side surface of the solid-state battery.

9. The solid-state battery package according to claim 1 or 2, wherein, The substrate has a metal layer as a constituent layer. The outer contour of the substrate's top-view shape overlaps with the outer contour of the metal layer's top-view shape.

10. The solid-state battery package according to claim 9, wherein, The substrate has a first electrode layer on one main surface for electrical connection with the solid-state battery, and a second electrode layer on another main surface for mounting the solid-state battery package to an external substrate, with the metal layer located between the first electrode layer and the second electrode layer.

11. The solid-state battery package according to claim 9, wherein, The area of ​​the top-view shape of the metal layer is more than 99% of the area of ​​the top-view shape of the substrate.

12. The solid-state battery package according to claim 9, wherein, The metal layer extends to the side of the substrate.

13. The solid-state battery package according to claim 9, wherein, The opening area of ​​the metal layer has a circular shape when viewed from above.

14. The solid-state battery package according to claim 1 or 2, wherein, The substrate has a first electrode layer on one main surface for electrical connection with the solid-state battery, and a second electrode layer on the other main surface for mounting the solid-state battery package to an external substrate. Between the first electrode layer and the second electrode layer, there is a first metal layer electrically connected to the first electrode layer and the second electrode layer, and a second metal layer not electrically connected to the first electrode layer and the second electrode layer.

15. The solid-state battery package according to claim 14, wherein, The combined area of ​​the top view shape of the first metal layer and the top view shape of the second metal layer is more than 99% of the area of ​​the top view shape of the substrate.

16. The solid-state battery package according to claim 1 or 2, wherein, The substrate is a resin substrate.

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