The utility model relates to the technical field of bonding wire
electroplating, in particular to equipment for bonding wire
electroplating, the equipment for bonding wire
electroplating comprises an electroplating bath, supporting columns, a supporting plate, a
drying box and a bottom plate, the outer side surface of the electroplating bath is fixedly connected with the bottom plate, the bottom surface of the electroplating bath is fixedly connected with the supporting columns in sequence, and the supporting plate is fixedly connected with the supporting columns. According to the equipment for bonding wire electroplating, through cooperation of the
moving frame and the
threaded rod, when the rotating motor operates, the
threaded rod is driven to rotate, the
threaded rod rotates to drive the
moving frame connected with the outer side in a meshed mode to move, and therefore the bonding wire electroplating effect is improved; as the top of the movable frame is fixedly connected with the first connecting
pipe, when the movable frame moves downwards, the first connecting
pipe is driven to slide downwards in the fixed cylinder, so that a first wire guide wheel and a second wire guide wheel which are mounted on the first connecting
pipe and the second connecting pipe are driven to move downwards, and the bonding wires mounted on the wire guide wheels are electroplated.