A potting heat dissipation structure
By incorporating components within the housing and utilizing a combination of thermally conductive adhesive and thermal pads, the high cost and weight issues of existing potting heat dissipation methods are resolved, achieving efficient heat dissipation and material savings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WANBANG DIGITAL ENERGY CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-06-02
AI Technical Summary
Existing potting heat dissipation methods place the magnetic components entirely in a complex mounting slot, requiring a large amount of thermally conductive adhesive, increasing cost and weight, and resulting in poor heat dissipation.
The design incorporates components within the housing, with thermally conductive adhesive injected between the components and the housing. The components are connected to the housing via top and bottom thermal pads, and heat is conducted using heat sinks and cooling plates, reducing the amount of thermally conductive adhesive used and improving heat dissipation efficiency.
It achieves effective heat dissipation, reduces the amount of thermal conductive adhesive used, lowers manufacturing and installation difficulty, saves potting process and space, and improves heat dissipation capacity.
Smart Images
Figure CN224319732U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, specifically to a potting heat dissipation structure. Background Technology
[0002] Existing magnetic component heat dissipation solutions include forced air cooling, liquid cooling, and potting heat dissipation. Forced air cooling exposes the magnetic component to flowing air, resulting in poor heat dissipation. Liquid cooling uses a cooling plate to bring a heat-conducting liquid close to the magnetic component to absorb heat, achieving excellent results. Potting heat dissipation involves surrounding the magnetic component with thermally conductive adhesive, allowing heat to be conducted through the adhesive, resulting in more even heat distribution and improved heat dissipation. In power supplies, two or all three of these heat dissipation solutions can coexist.
[0003] For example, application CN202411255073.5 discloses an integrated potting structure for transformer inductor electrical components, including a strip-shaped integrated potting heat dissipation shell. The integrated potting heat dissipation shell has at least a first lower groove, a second lower groove, and a third lower groove arranged sequentially along its length. The upper parts of the first, second, and third lower grooves are interconnected, thus forming a potting pool. The inner contours of the first and second lower grooves are adapted to the outer contours of the annular coil elements. Two annular coil elements are respectively placed in the first and second lower grooves, and several rectangular electrical components are evenly arranged in the third lower groove. The potting pool is filled with a thermally conductive potting compound, such as silicone potting compound. The integral potting heat sink is a metal thermally conductive structure. Several left-side strip-shaped heat sinks extending in the front-to-back direction are arranged in an array on the left side of the integral potting heat sink, and right-side strip-shaped heat sinks are arranged in an array on the right side. Strip-shaped heat dissipation grooves extending in the front-to-back direction are formed between adjacent left-side strip-shaped heat sinks and between adjacent right-side strip-shaped heat sinks. The first, second, and third lower grooves of this design can accommodate their respective electrical components, thus allowing each component to operate relatively independently and preventing overheating of one component from affecting the normal operation of other components. Simultaneously, the interconnection of the upper sections of the first, second, and third lower grooves allows the potting process to be completed in one step, avoiding the complexity of separate potting procedures. The potting heat dissipation method described in the above document, where the magnetic component is completely placed in a structurally complex mounting groove for potting, requires a large amount of thermally conductive adhesive, increasing cost and weight. Utility Model Content
[0004] To address the technical problem that existing potting heat dissipation methods require placing the magnetic component entirely in a complex mounting slot, necessitating the use of large amounts of thermally conductive adhesive and increasing cost and weight, this invention provides a potting heat dissipation structure that solves the aforementioned technical problems.
[0005] The technical solution adopted in this utility model is as follows:
[0006] This utility model provides a potting heat dissipation structure, including:
[0007] The outer casing has an opening at its upper end, and a folded edge is formed at the opening.
[0008] The component is placed inside the housing, with its upper surface flush with the opening of the housing, and thermally conductive adhesive is filled into the gap between the component and the housing.
[0009] A top thermal pad is attached to and fixed to the folded edge, and the lower surface of the top thermal pad is attached to the upper surface of the component.
[0010] According to one embodiment of the present invention, the folded edges are arranged opposite to each other.
[0011] According to one embodiment of the present invention, a set of opposite edges of the opening are formed with continuous folds, and another set of opposite edges of the opening are formed with discrete folds; or, both sets of opposite edges of the opening are formed with discrete folds.
[0012] According to one embodiment of the present invention, a groove is formed between the discrete folds.
[0013] According to one embodiment of the present invention, there is a gap between the outer side of the element and the inner sidewall of the outer casing.
[0014] According to one embodiment of the present invention, a bottom thermal pad is also included, which is located between the lower surface of the element and the inner bottom surface of the housing.
[0015] According to one embodiment of the present invention, the element is one or more, and the bottom thermal pad is configured as one or more.
[0016] According to one embodiment of the present invention, all components have the same height and all bottom thermal pads have the same thickness.
[0017] According to one embodiment of the present invention, the bottom of the outer shell has a flat bottom structure and a uniform thickness.
[0018] According to one embodiment of the present invention, the outer casing is a metal casing, and the outer surface of the outer casing and / or the top thermal pad is provided with heat sinks and / or cooling plates.
[0019] Based on the above technical solution, the technical effects that this utility model can achieve are as follows:
[0020] 1. The potting and heat dissipation structure of this utility model, by placing the component inside the housing and filling the gap between the component and the housing with thermally conductive adhesive, allows the heat generated by the component to be transferred to the housing through the thermally conductive adhesive, achieving effective heat dissipation. The upper surface of the component is flush with the opening of the housing, and the component's cable passes through the cable tray at the opening of the housing. When the thermally conductive adhesive is added from top to bottom, the liquid level of the thermally conductive adhesive is at most flush with the lowest point of the cable tray, that is, the height of the thermally conductive adhesive filling is about 80% of the height of the housing, which can reduce the amount of thermally conductive adhesive used. The top thermally conductive pad is fixed to the folded edge of the housing opening and fits against the upper surface of the component. The setting of the top thermally conductive pad facilitates flat installation and heat dissipation. A heat sink or cooling plate is set on the top thermally conductive pad, and the heat generated by the component can be directly conducted through the top thermally conductive pad to the heat sink or cooling plate, increasing the heat dissipation capacity.
[0021] 2. The potting heat dissipation structure of this utility model has folded edges on the outer shell, with connecting holes formed on the folded edges to facilitate fixing the outer shell and the heat sink and / or cooling plate together. Specifically, the top thermal pad is elastic and can generate a certain deformation. The upper surface of the folded edge of the outer shell and the surface of the heat sink and / or cooling plate are not completely flat, and the roughness is relatively high. If they are directly fixed together, the fit will be poor and the heat conduction effect will be poor. When the folded edge of the outer shell and the heat sink and / or cooling plate are bonded together through the top thermal pad, the fit can be guaranteed, the thermal resistance between the folded edge of the outer shell and the heat sink and / or cooling plate can be reduced, and the heat dissipation effect can be improved. The top thermal pad can be attached to the upper surface of the component to conduct the heat generated by the component; the discrete folded edges form a wire passage groove to facilitate the passage of cables on the component.
[0022] 3. In the potting and heat dissipation structure of this utility model, there is a gap between the outer side of the component and the inner side wall of the shell. The injected sealant can horizontally wrap the component, and the heat generated by the component can be evenly conducted to the shell through the sealant and complete the sealing, which helps to dissipate heat and improve durability.
[0023] 4. In the potting and heat dissipation structure of this utility model, a bottom thermally conductive pad is provided between the lower surface of the component and the inner bottom surface of the shell, increasing the safe distance between the component and the shell. The heat generated by the component can be directly conducted to the shell through the bottom thermally conductive pad, which helps with heat dissipation and insulation. Compared with the prior art where the component is in direct contact with the shell, or where aluminum nitride thermal conductive sheets are used, this requires a high degree of flatness between the surface of the component and the shell; if the flatness is not high, the heat conduction effect will be weakened. This utility model adds an elastic bottom thermally conductive pad with a certain deformation at the contact point between the component and the shell, which reduces the flatness requirement of the contact surface and enhances the heat conduction effect.
[0024] 5. The potting and heat dissipation structure of this utility model can dissipate heat for one or more components, and can pot them simultaneously using the same housing. In the case of multiple components, it can save potting steps and reduce space size.
[0025] 6. Compared to existing technologies that require complete potting to dissipate heat, which increases the cost and weight of the thermally conductive adhesive and is difficult to control, or use semi-potting, the thermal conductivity of this invention is poor, with a large amount of heat dissipating into the surrounding air. In this invention, the thermally conductive adhesive is evenly distributed in the gap between the outer surface of the component and the housing. Heat is dissipated through the bottom thermal pad and the top thermal pad, eliminating the need for complete potting and reducing potting requirements. This balances thermal conductivity with the amount of thermally conductive adhesive used, while also reducing manufacturing and installation difficulties. Attached Figure Description
[0026] Figure 1 This is an exploded view of the potting and heat dissipation structure of this utility model;
[0027] Figure 2 This is a top view of the potting and heat dissipation structure;
[0028] Figure 3 for Figure 2 AA section diagram;
[0029] Figure 4 for Figure 3 The diagram shown is a structural schematic of the structure in its un-plastered state;
[0030] Figure 5 This is a schematic diagram of the outer shell structure;
[0031] In the diagram: 1-Outer shell; 11-Continuous folded edge; 12-Discrete folded edge; 13-Wire channel; 2-Component; 21-Cable; 3-Top thermal pad; 4-Bottom thermal pad; 5-Thermal conductive adhesive; 6-Gap. Detailed Implementation
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] like Figure 1-5 As shown, this embodiment provides a potting heat dissipation structure, including a shell 1, a component 2 and a top thermal pad 3. The shell 1 has an opening at the top and a receiving space is formed inside the shell 1. The component 2 is received inside the shell 1. The upper surface of the component 2 is flush with the opening of the shell 1. Thermally conductive adhesive 5 is filled into the gap between the component 2 and the shell 1. The top thermal pad 3 is fixed at the opening of the shell 1 and is attached to the upper surface of the component 2.
[0034] The outer shell 1 can be configured as a cuboid shape. The outer surface of the outer shell 1 is flat, which facilitates the installation of heat dissipation structures such as heat sinks. An opening is formed at the upper end of the outer shell 1, and a folded edge is formed at the opening.
[0035] As a preferred technical solution in this embodiment, the folded edges are arranged oppositely. Specifically, the opening of the outer shell 1 is a square opening, and a set of opposite edges of the opening forms a continuous folded edge 11, which extends continuously along its respective edge; the other set of opposite edges of the opening forms discrete folded edges 12, with at least two discrete folded edges 12 spaced apart on the same edge. In this embodiment, the long edge of the opening forms a continuous folded edge 11, and the short edge of the opening forms a discrete folded edge 12, with two discrete folded edges 12 spaced apart on each short edge. Both the continuous folded edge 11 and the discrete folded edge 12 extend horizontally. In addition to the above arrangement, both sets of opposite edges of the opening of the outer shell 1 can also be arranged to form discrete folded edges 12.
[0036] As a preferred technical solution in this embodiment, a fixing hole is formed on the folded edge to facilitate the passage of fasteners.
[0037] As a preferred embodiment, the opening edge of the outer casing 1 is formed with a wire-passing groove 13 to facilitate wire passing. Preferably, the wire-passing groove 13 is located on the short side edge of the opening and between adjacent discrete folded edges 12.
[0038] As a preferred technical solution in this embodiment, the bottom plane of the outer casing 1 extends and has a uniform thickness, which helps to reduce production difficulty and cost. The outer side wall of the outer casing 1 also extends in a plane, and heat sinks and / or cooling plates can be provided on the outer surface of the outer casing 1 to further facilitate heat dissipation.
[0039] As a preferred technical solution in this embodiment, the outer casing 1 is a metal casing.
[0040] Component 2 is placed inside housing 1, with component 2 flush with the opening of housing 1. There is a gap 6 between the outer side of component 2 and the inner sidewall of housing 1 to facilitate the filling of thermally conductive adhesive 5.
[0041] As a preferred technical solution in this embodiment, there may be one or more components 2. When there are multiple components 2, the multiple components 2 are arranged in a concentrated manner and the multiple components 2 have the same height and are flush with the opening of the outer shell 1.
[0042] As a preferred technical solution in this embodiment, component 2 has a planar upper surface, which facilitates contact with the top heat-conducting pad 3 for heat dissipation; component 2 has a planar lower surface, which facilitates contact.
[0043] As a preferred technical solution in this embodiment, there is a gap 6 between any position on the outer side of the component 2 and the inner sidewall of the outer casing. When the thermally conductive adhesive 5 is poured in, the thermally conductive adhesive 5 can cover the outer side of the component 2.
[0044] As a preferred technical solution in this embodiment, the component 2 may be, but is not limited to, a magnetic component, having a cable 21 thereon, which can pass through the wire groove 13 on the housing 1 to the outside of the housing 1.
[0045] The top thermal pad 3 covers the opening of the housing 1. The lower surface of the top thermal pad 3 is attached to the folded edge of the housing 1 and fixed together. The lower surface of the top thermal pad 3 is also attached to the upper surface of the component 2.
[0046] As a preferred technical solution in this embodiment, the top thermal pad 3 extends in a plane and has a uniform thickness. The top thermal pad 3 can be, but is not limited to, a thermally conductive insulating silicon sheet.
[0047] As a preferred technical solution in this embodiment, a heat sink and / or a cooling plate can be provided on the upper surface of the top thermal pad 3. Specifically, fasteners pass through the fixing holes on the folded edge of the housing 1 to fix the top thermal pad 3 and the heat sink and / or cooling plate to the housing 1.
[0048] As a preferred technical solution in this embodiment, the top thermal pad 3 is elastic and can generate a certain deformation. The top thermal pad 3 can ensure the fit between the structures, reduce the thermal resistance between the folded edges of the outer shell 1 and the heat sink and / or cooling plate, and improve the heat dissipation effect.
[0049] A bottom heat-conducting pad 4 is also provided between the lower surface of component 2 and the inner bottom surface of the outer casing 1, so that the heat generated by component 2 can be conducted to the outer casing 1 through the bottom heat-conducting pad 4.
[0050] As a preferred technical solution of this embodiment, the bottom heat-conducting pad 4 can be one or more. When there is one element 2, one or more bottom heat-conducting pads 4 can be provided accordingly. When there are multiple elements 2, one bottom heat-conducting pad 4 can be provided, or multiple bottom heat-conducting pads 4 can be provided for each element 2.
[0051] The bottom thermal pad 4 can be set correspondingly to the component 2. When there are multiple components 2, there can also be multiple bottom thermal pads 4, which are placed on the components 2 respectively. The shape of the bottom thermal pad 4 can be adapted to the shape of the corresponding component 2.
[0052] As a preferred technical solution in this embodiment, the bottom thermal pad 4 can be, but is not limited to, a flexible thermally conductive insulating silicon sheet, which can increase the safe distance between the component 2 and the inner bottom surface of the housing 1, and can also play a role in heat dissipation. The inner bottom surface of the housing 1 and the lower surface of the component 2 have low flatness and high roughness, resulting in high thermal resistance when in direct contact. The bottom thermal pad 4 is elastic and can generate a certain deformation, which can simultaneously conform to the housing 1 and the component 2, reducing the flatness requirements of the contact surface, reducing the thermal resistance between the housing 1 and the component 2, and enhancing the heat conduction effect.
[0053] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "connection", "linking", "fixing", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two modules or the interaction between two modules.
Claims
1. A potting heat dissipation structure, characterized in that, include: The outer shell (1) has an opening at its upper end, and a folded edge is formed at the opening; Component (2), the component (2) is placed inside the housing (1), the upper surface of the component (2) is flush with the opening of the housing (1), and thermally conductive adhesive (5) is filled into the gap (6) between the component (2) and the housing (1); Top thermal pad (3), the top thermal pad (3) is attached and fixed to the folded edge, and the lower surface of the top thermal pad (3) is attached to the upper surface of the component (2).
2. The potting heat dissipation structure according to claim 1, characterized in that, The folded edges are arranged opposite each other.
3. The potting heat dissipation structure according to claim 2, characterized in that, One set of opposite edges of the opening has a continuous folded edge (11), and the other set of opposite edges of the opening has a discrete folded edge (12); or, both sets of opposite edges of the opening have discrete folded edges (12).
4. The potting heat dissipation structure according to claim 3, characterized in that, A groove (13) is formed between the discrete folds (12).
5. A potting heat dissipation structure according to any one of claims 1-4, characterized in that, There is a gap (6) between the outer side of the component (2) and the inner sidewall of the outer shell (1).
6. The potting heat dissipation structure according to claim 1, characterized in that, It also includes a bottom thermal pad (4) located between the lower surface of the element (2) and the inner bottom surface of the housing (1).
7. The potting heat dissipation structure according to claim 6, characterized in that, The element (2) may be one or more, and the bottom thermal pad (4) may be one or more.
8. The potting heat dissipation structure according to claim 7, characterized in that, All components (2) have the same height, and all bottom thermal pads (4) have the same thickness.
9. A potting heat dissipation structure according to any one of claims 6-8, characterized in that, The bottom of the outer shell (1) is flat and has a uniform thickness.
10. The potting heat dissipation structure according to claim 1, characterized in that, The outer casing (1) is a metal casing (1), and the outer surface of the outer casing (1) and / or the top heat-conducting pad (3) is provided with heat sinks and / or cold water plates.