A riveting method for connecting multi-layer boards and a multi-layer board

Abstract

The present invention discloses a riveting method and a multi-layer plate body for connecting multi-layer plates. The riveting method includes: preparing at least three plates, namely a first plate body, a second plate body with a middle avoidance hole, and a third plate body; stacking the first plate body, the second plate body, and the third plate body together in sequence, and then fixing the first plate body and the second plate body by at least punching and riveting to form a first riveted structure, or stacking the first plate body and the second plate body together and fixing them by at least punching and riveting to form a first riveted structure, and then stacking the third plate body in sequence on the side of the second plate body facing away from the first plate body; fixing the first plate body and the third plate body at the position corresponding to the middle avoidance hole of the second plate body by at least punching and riveting to form a second riveted structure. The present invention provides a riveting method and a multi-layer plate body for connecting multi-layer plates that can improve the stability of riveting of three-layer and multi-layer plates.

Description

Technical Field

[0001] The present invention relates to riveting technology, and in particular to a riveting method for connecting multi-layer plates and a multi-layer plate. Background Art

[0002] At present, the application of Tox riveting is becoming more and more widespread in the market. Tox riveting is very reliable for riveting two-layer boards, but it is unstable for riveting three-layer and multi-layer boards, which may eventually cause riveting to come off. Summary of the Invention

[0003] On the one hand, the present invention provides a riveting method for connecting multi-layer boards, which can improve the riveting stability of the multi-layer boards.

[0004] In order to achieve the above-mentioned objectives, the present invention discloses a riveting method for connecting multi-layer plates, the riveting method comprising: preparing at least three plates, namely a first plate, a second plate with a middle avoidance hole, and a third plate; stacking the first plate, the second plate, and the third plate in sequence, and then fixing the first plate and the second plate to form a first riveted structure by at least punching and riveting, or stacking the first plate and the second plate together and fixing them by at least punching and riveting to form a first riveted structure, and then superimposing the third plate on the side of the second plate facing away from the first plate; fixing the first plate and the third plate at the position corresponding to the middle avoidance hole of the second plate by at least punching and riveting to form a second riveted structure.

[0005] Optionally, when preparing the third plate body, the third plate body is processed with a surface avoidance hole, and when forming the first riveted structure, the stamping upper die passes through the surface avoidance hole and presses against the second plate body.

[0006] Optionally, when preparing the third plate, a recessed portion is processed on the third plate along a thickness direction of the third plate;

[0007] When the third plate body is stacked on the second plate body, the recessed portion is located within the boundary range of the inner wall of the middle avoidance hole extending in the height direction; when forming the second riveted structure, the stamping upper die extends into the cavity of the recessed portion and applies stamping pressure to at least part of the bottom surface of the recessed portion.

[0008] Optionally, when the stamping upper die applies stamping force to a portion of the bottom surface of the recessed portion, a ratio of a contact area between the stamping upper die and the bottom surface of the recessed portion to an area of ​​the entire bottom surface of the recessed portion is 0.6-0.9.

[0009] On the other hand, the present invention provides a multi-layer board body, which can ensure the riveting stability of the multi-layer board body.

[0010] A multi-layer plate body includes at least three plates: a first plate body, a second plate body and a third plate body. The first plate body, the second plate body and the third plate body are stacked in sequence. The first plate body and the second plate body are fixed by stamping and riveting to form at least one first riveted structure. The second plate body is provided with a middle avoidance hole. The third plate body and the first plate body are fixed by riveting at the position corresponding to the middle avoidance hole to form at least one second riveted structure that is misaligned with the first riveted structure.

[0011] Optionally, the third plate body is provided with a surface avoidance hole, and the first riveted structure is located below the surface avoidance hole; the first riveted structure has a first concave cavity, the first concave cavity is connected to the surface avoidance hole, and the first concave cavity is located within the boundary range of the inner wall corresponding to the surface avoidance hole extending in the height direction.

[0012] Optionally, the second riveting structure includes a recessed portion, which is recessed along the thickness direction of the third plate body, and the bottom surface of the recessed portion is located in the middle avoidance hole or above the middle avoidance hole; the recessed portion forms a second concave cavity; the second riveting structure also includes a third concave cavity, which is connected to the second concave cavity, and the third concave cavity is located within the boundary range of the peripheral side wall of the recessed portion extending in the height direction.

[0013] Compared with the prior art, the beneficial effect of the present invention is that two of the plates are first riveted together, and then the other plate is passed through the middle avoidance hole of the middle plate and riveted together with the remaining plate, thereby forming at least one first riveted structure and a second riveted structure on the multi-layer plate, which can improve the riveting stability of the multi-layer plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic cross-sectional view of a multilayer board at one location disclosed in the present invention;

[0015] Figure 2 It is a cross-sectional schematic diagram of another part of a multilayer board disclosed in the present invention;

[0016] Figure 3 It is a cross-sectional schematic diagram of one stage in a riveting method for connecting multi-layer boards disclosed in the present invention;

[0017] Explanation of the accompanying drawings: 1. First plate body; 2. Second plate body; 3. Third plate body; 41. First riveted structure; 410. First concave cavity; 42. Second riveted structure; 420. Third concave cavity; 5. Surface avoidance hole; 6. Middle avoidance hole; 7. Recessed portion; 70. Second concave cavity. Implementation Method

[0018] The present application is further described in detail below with reference to the accompanying drawings.

[0019] The present application discloses a multi-layer board. Figure 1 and Figure 2 , including at least three plates: a first plate 1, a second plate 2 and a third plate 3. The first plate 1, the second plate 2 and the third plate 3 are arranged in sequence. The first plate 1 and the second plate 2 are fixed by stamping and riveting to form at least one first riveted structure 41. The second plate 2 is provided with a middle avoidance hole 6. The third plate 3 and the first plate 1 are fixed by riveting at a position corresponding to the middle avoidance hole 6 and form at least one second riveted structure 42 that is staggered with the first riveted structure 41.

[0020] In the stacking order of the three plates, the first plate 1 can be located at the bottom layer and the third plate 3 can be located at the top layer. Alternatively, the first plate 1 can also be located at the top layer and the third plate 3 can be located at the bottom layer.

[0021] Adjacent plates have at least partial surfaces that are arranged opposite to each other.

[0022] In this embodiment, the third plate 3 is located at the topmost layer and is provided with a surface avoidance hole 5. The first plate 1 and the second plate 2 are fixed together at positions corresponding to the surface avoidance holes 5 by punching and riveting, forming a first riveted structure 41. The first riveted structure 41 has a first concave cavity 410, which communicates with the surface avoidance hole 5 and is located within the height-extending boundary of the inner wall corresponding to the surface avoidance hole 5.

[0023] The first riveting structure 41 is located below the surface avoidance hole 5. The surface avoidance hole 5 is used to avoid the riveting molds above and below the first plate body 1 and the second plate body 2, so that the riveting molds can pass through the surface avoidance hole 5 to rivet and fix the second plate body 2 and the first plate body 1, and the first riveting structure 41 protrudes in the direction away from the third plate body 3.

[0024] In this embodiment, the surface avoidance hole 5 is a circular hole. The diameter of the surface avoidance hole 5 is larger than the radial dimension of the riveting die used to rivet the plate, so that the riveting die can pass through the surface avoidance hole 5 and perform normal riveting. In this embodiment, the diameter of the surface avoidance hole 5 is 10 mm.

[0025] In this embodiment, the third plate body 3 is provided with a surface avoidance hole 5. Of course, in another embodiment, the third plate body 3 may not be provided with a surface avoidance hole 5. In this case, the contour boundary of the third plate body 3 does not block the first riveted structure 41. The second riveted structure 42 includes a recessed portion 7, which is recessed along the thickness direction of the third plate body 3, and the bottom surface of the recessed portion 7 is located within or above the middle avoidance hole 6; the recessed portion 7 forms a second concave cavity 70; the second riveted structure 42 also includes a third concave cavity 420, which is connected to the second concave cavity 70 and is located within the boundary range of the peripheral side wall of the recessed portion 7 extending in the height direction.

[0026] In this embodiment, the middle avoidance hole 6 on the second plate body 2 is a circular hole, and the diameter of the middle avoidance hole 6 on the second plate body 2 is also larger than the radial dimension of the riveting mold, so that the riveting mold can directly rivet and fix the third plate body 3 and the first plate body 1 from top to bottom and form a second riveted structure 42.

[0027] The middle avoidance hole 6 and the first riveted structure 41 are staggered, the middle avoidance hole 6 and the surface avoidance hole 5 are staggered, and the second riveted structure 42 and the first riveted structure 41 are also staggered, and the staggered arrangement is distributed at different positions.

[0028] A plurality of the first riveted structure 41 and the second riveted structure 42 may be provided.

[0029] In other embodiments, the number of plates can be an integer greater than three, and the plates are also stacked in order, with each additional plate being the Nth plate, where N is an integer greater than three. A surface avoidance hole 5 is set on the Nth plate, and the N-1th plate and the N-2th plate are riveted at positions corresponding to the surface avoidance holes 5, and an intermediate avoidance hole 6 is set on the N-1th plate, and the N-2th plate is riveted at positions corresponding to the intermediate avoidance holes 6 on the N-1th plate. The intermediate avoidance holes 6 and the surface avoidance holes 5 on all plates are staggered.

[0030] The riveting fixation in this embodiment can be punch riveting, or a combination of punch riveting and rivet riveting, screw fixation, welding fixation and other fixing methods.

[0031] The embodiment of the present application also discloses a riveting method for connecting multi-layer boards, which can be used to form a multi-layer board disclosed in the embodiment of the present application.

[0032] The multi-layer plate body targeted by the riveting method includes at least three plates: a first plate body 1 , a second plate body 2 and a third plate body 3 .

[0033] Riveting methods include:

[0034] Prepare at least three plates, namely a first plate 1, a second plate 2 with a middle avoidance hole 6, and a third plate 3;

[0035] In one embodiment, the first plate 1, the second plate 2, and the third plate 3 are stacked together in sequence, and then the first plate 1 and the second plate 2 are fixed by at least stamping and riveting to form a first riveted structure 41. In another embodiment, the first plate 1 and the second plate 2 may be stacked together and fixed by at least stamping and riveting to form the first riveted structure 41, and then the third plate 3 may be stacked on the side of the second plate 2 facing away from the first plate 1.

[0036] "Stacked together" means that adjacent plates have at least partially opposing surfaces. Thus, the first plate 1 and the second plate 2 have at least partially opposing surfaces. In this embodiment, the first plate 1 is located at the bottom layer, and the third plate 3 is located at the top layer. The first plate 1 and the second plate 2 have at least partially opposing surfaces and are bonded together. The second plate 2 and the third plate 3 also have at least partially opposing surfaces and are bonded together. In other embodiments, a certain gap may exist between the portions of the different plates forming the first riveted structure 41 and / or the second riveted structure 42.

[0037] The riveting fixation in the riveting method in this embodiment can be simply stamping riveting fixation, or it can be a combination of stamping riveting fixation and other fixing methods such as rivet riveting fixation, screw fixation, and bonding. The stamping riveting method can be Tox riveting, also known as Tox stamping, or TOX riveting. Using special riveting equipment, multi-layer boards can be riveted and fixed without using rivets. The special riveting equipment generally includes a stamping upper die and a stamping lower die set up above and below.

[0038] In this embodiment, when preparing the third plate body 3, the third plate body 3 is machined with a surface avoidance hole 5. When forming the first riveted structure 41, the stamping upper die passes through the surface avoidance hole 5 and presses against the second plate body 2. The aperture of the surface avoidance hole 5 is larger than the radial dimension of the first riveted structure 41, so that the stamping upper die can pass through the surface avoidance hole 5 and cooperate with the stamping lower die to perform Stokes riveting on the first plate body 1 and the second plate body 2. Of course, in other embodiments, the third plate body 3 does not need to be machined with a surface avoidance hole 5. In this case, the contour boundary of the third plate body 3 only needs to not obstruct the formation of the first riveted structure 41.

[0039] The riveting method further includes machining a recessed portion 7 along the thickness of the third plate 3 during preparation. When the third plate 3 is stacked on the second plate 2, the recessed portion 7 is positioned within the height-extending boundary of the inner wall of the intermediate avoidance hole 6. When forming the second riveted structure 42, the upper stamping die extends into the cavity of the recessed portion 7 and applies a stamping force to at least a portion of the bottom surface of the recessed portion 7. The same stamping die set or different stamping dies may be used to form the first riveted structure 41 and the second riveted structure 42.

[0040] Combine Figure 3 The recessed portion 7 is disposed within the height-extending boundary of the inner wall corresponding to the intermediate avoidance hole 6. The recessed portion 7 and the first plate 1 are fixed by riveting. The radial dimension of the recessed portion 7 is greater than the radial dimension of the stamping upper die. The radial dimension of the intermediate avoidance hole 6 is greater than the radial dimension of the recessed portion 7.

[0041] The recessed portion 7 is a blind hole located within the intermediate avoidance hole 6. The bottom wall of the recessed portion 7 abuts the surface of the first plate 1 facing the second plate 2. The depth of the recessed portion 7 is equal to the thickness of the second plate 2. Before riveting the recessed portion 7 to the first plate 1, the bottom of the recessed portion 7 can at least partially abut the surface of the first plate 1 facing the second plate 2. When riveting the first plate 1 and the third plate 3, the upper punch is aligned with the recessed portion 7, and the lower punch cooperates to complete the riveting of the first plate 1 below the intermediate avoidance hole 6 and the recessed portion 7.

[0042] In other embodiments, the recessed portion 7 can be partially located in the middle avoidance hole 6, and the bottom of the recessed portion 7 is close to the surface of the first plate body 1 facing the second plate body 2, and there is a certain gap between the bottom of the recessed portion 7 and the surface of the first plate body 1 facing the second plate body 2.

[0043] When the stamping die applies stamping pressure to part of the bottom surface of the recessed portion 7, the ratio of the contact area between the stamping die and the bottom surface of the recessed portion 7 to the bottom surface area of ​​the entire recessed portion 7 is 0.6-0.9; this is conducive to improving the reliability of the riveted connection between the first plate body 1 and the third plate body 3.

[0044] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A riveting method for connecting multi-layer boards, characterized in that: The riveting method comprises: At least three plates are prepared, namely a first plate (1), a second plate (2) having a middle avoidance hole (6), and a third plate (3); The first plate body (1), the second plate body (2) and the third plate body (3) are stacked together in sequence, and the first plate body (1) and the second plate body (2) are fixed at least by means of stamping and riveting to form a first riveted structure (41); When preparing the third plate body (3), the third plate body (3) is processed with a surface avoidance hole (5), and when forming the first riveted structure (41), the punching upper die passes through the surface avoidance hole (5) and presses against the second plate body (2); Fixing the first plate body (1) and the third plate body (3) at positions corresponding to the middle avoidance hole (6) of the second plate body (2) by at least punching and riveting to form a second riveted structure (42); The middle avoidance hole (6) and the first riveted structure (41) are staggered, the middle avoidance hole (6) and the surface avoidance hole (5) are staggered, and the second riveted structure (42) and the first riveted structure (41) are also staggered.

2. A riveting method for connecting multi-layer boards according to claim 1, characterized in that: When preparing the third plate body (3), a recessed portion (7) is processed on the third plate body (3) along the thickness direction of the third plate body (3); When the third plate body (3) is stacked on the second plate body (2), the recessed portion (7) is located within the boundary range of the inner wall of the middle avoidance hole (6) extending in the height direction; when forming the second riveted structure (42), the stamping upper die extends into the cavity of the recessed portion (7) and applies a stamping force to at least a portion of the bottom surface of the recessed portion (7).

3. The riveting method for connecting multi-layer boards according to claim 2, characterized in that: When the punching upper die applies a punching force to a portion of the bottom surface of the recessed portion (7), the ratio of the contact area between the punching upper die and the bottom surface of the recessed portion (7) to the bottom surface area of ​​the recessed portion (7) is 0.6-0.

9.

4. A riveting method for connecting multi-layer boards, characterized in that: The riveting method comprises: At least three plates are prepared, namely a first plate (1), a second plate (2) having a middle avoidance hole (6), and a third plate (3); The first plate body (1) and the second plate body (2) are stacked together and fixed at least by punching and riveting to form a first riveted structure (41), and the third plate body (3) is stacked on a side of the second plate body (2) facing away from the first plate body (1); Fixing the first plate body (1) and the third plate body (3) at positions corresponding to the middle avoidance hole (6) of the second plate body (2) by at least punching and riveting to form a second riveted structure (42); The middle avoidance hole (6) and the first riveted structure (41) are staggered, and the second riveted structure (42) and the first riveted structure (41) are also staggered.

5. According to a riveting method for connecting multi-layer plates as described in claim 4, when preparing the third plate (3), the third plate (3) is processed with a surface avoidance hole (5), and when forming the first riveted structure (41), the punching upper die passes through the surface avoidance hole (5) and presses against the second plate (2).

6. The riveting method for connecting multi-layer boards according to claim 4, characterized in that: When preparing the third plate body (3), a recessed portion (7) is processed on the third plate body (3) along the thickness direction of the third plate body (3); When the third plate body (3) is stacked on the second plate body (2), the recessed portion (7) is located within the boundary range of the inner wall of the middle avoidance hole (6) extending in the height direction; when forming the second riveted structure (42), the stamping upper die extends into the cavity of the recessed portion (7) and applies a stamping force to at least a portion of the bottom surface of the recessed portion (7).

7. A riveting method for connecting multi-layer boards according to claim 6, characterized in that: When the punching upper die applies a punching force to a portion of the bottom surface of the recessed portion (7), the ratio of the contact area between the punching upper die and the bottom surface of the recessed portion (7) to the bottom surface area of ​​the entire recessed portion (7) is 0.6-0.

9.

8. A multi-layer board, characterized in that: The invention comprises at least three plates: a first plate (1), a second plate (2) and a third plate (3), wherein the first plate (1), the second plate (2) and the third plate (3) are stacked in sequence, the first plate (1) and the second plate (2) are fixed by punching and riveting to form at least one first riveted structure (41), the second plate (2) is provided with a middle avoidance hole (6), the third plate (3) and the first plate (1) are fixed by punching and riveting at a position corresponding to the middle avoidance hole (6) to form at least one second riveted structure (42) displaced from the first riveted structure (41).

9. The multi-layer board according to claim 8, characterized in that: The third plate body (3) is provided with a surface avoidance hole (5), and the first riveted structure (41) is located below the surface avoidance hole (5); the first riveted structure (41) has a first concave cavity (410), the first concave cavity (410) is communicated with the surface avoidance hole (5), and the first concave cavity (410) is located within the boundary range of the inner wall corresponding to the surface avoidance hole (5) extending in the height direction.

10. The multi-layer board according to claim 8, characterized in that: The second riveting structure (42) includes a recessed portion (7), the recessed portion (7) is recessed along the thickness direction of the third plate body (3), and the bottom surface of the recessed portion (7) is located in the middle avoidance hole (6) or above the middle avoidance hole (6); the recessed portion (7) forms a second concave cavity (70); the second riveting structure (42) further includes a third concave cavity (420), the third concave cavity (420) is connected to the second concave cavity (70), and the third concave cavity (420) is located within the boundary range of the peripheral side wall of the recessed portion (7) extending in the height direction.

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