A temperature measurement method for a non-contact temperature measurement device capable of penetrating glass material

Abstract

The present invention discloses a temperature measurement method for a non-contact temperature measurement device that can penetrate glass and belongs to the technical field of induction cookers. The device comprises a microcrystalline plate with heat conduction, a heating component with a hollowed-out center portion disposed directly below the microcrystalline plate, a pot placed on the microcrystalline plate, and a temperature measurement module disposed below the microcrystalline plate. The temperature measurement module is located at the center of the heating component and includes a built-in medium-wave infrared temperature sensor, a near-infrared temperature sensor, and a ferrite shielding cover. The medium-wave infrared temperature sensor and the near-infrared temperature sensor are both located within the ferrite shielding cover. The present invention utilizes the ferrite shielding cover to shield the medium-wave infrared temperature sensor and the near-infrared temperature sensor, preventing magnetic flux from entering and reducing the impact of magnetic interference on detection. The device can obtain the actual temperature of the pot and has the advantages of being transparent to glass, non-contact, having a short temperature measurement time, shielding electromagnetic interference, and accurate temperature measurement.

Description

Technical Field

[0001] The invention belongs to the technical field of induction cookers and relates to a temperature measurement method of a non-contact temperature measurement device capable of penetrating glass material. Background Art

[0002] In the field of kitchen stoves, traditional cookware, such as induction cookers, uses a temperature measurement solution that places a thermistor underneath the glass microcrystalline plate of the battery stove. The thermistor measures the temperature of the glass directly as the temperature of the object being measured (such as the cookware). However, the temperature measurement takes a long time and there is electromagnetic interference, resulting in inaccurate data readings. This structural technology has disadvantages such as poor reliability and accuracy.

[0003] The induction cooker temperature measurement device, application number CN201720514710.5, utilizes a temperature-measuring module and a heating coil electrically connected at the temperature control center. The cookware is placed above a microcrystalline plate, and the heating coil is mounted below the plate. The plate is provided with a temperature-measuring through-hole. The temperature-measuring module includes a thermal conductive plate, a thermistor, and an encapsulation module. The thermal conductive plate is mounted above the temperature-measuring through-hole, and the thermistor is located below the thermal conductive plate. The encapsulation module encapsulates the temperature-measuring through-hole and securely mounts the thermistor and thermal conductive plate. The microcrystalline plate uses a hole to allow the thermistor to directly measure the temperature at the bottom of the cookware. Because the glass microcrystalline plate is heat-resistant and thermally shock-resistant, its use in kitchen stoves can prevent the volatilization of high-temperature substances. However, electromagnetic interference and noise can occur during use, leading to inaccurate cookware temperature measurements.

[0004] Therefore, it is necessary to design a technology for temperature detection of a cookware device, which has the characteristics of being transparent to glass material, non-contact, short temperature measurement time, shielding electromagnetic interference and accurate temperature detection. Utility Model Content

[0005] The present invention provides a temperature measurement method using a non-contact temperature measurement device that can measure temperature through glass, aiming to solve the problems of long temperature measurement time and electromagnetic interference in the existing induction cooker temperature measurement method using contact temperature measurement or microcrystalline plate opening temperature measurement, which leads to inaccurate temperature measurement.

[0006] To achieve the above-mentioned object, the present invention provides a non-contact temperature measuring device capable of measuring temperature through glass, comprising:

[0007] A microcrystalline plate for conducting heat, with a heating component with a hollow center provided directly below the microcrystalline plate;

[0008] a pot placed on the microcrystalline plate;

[0009] A temperature measurement module is provided below the microcrystalline plate, and the temperature measurement module is located at the center of the heating component;

[0010] The temperature measurement module includes a built-in medium-wave infrared temperature sensor, a near-infrared temperature sensor and a ferrite shielding cover. The medium-wave infrared temperature sensor and the near-infrared temperature sensor are both located in the ferrite shielding cover. The medium-wave infrared temperature sensor emits medium-wave infrared rays that can penetrate the microcrystalline plate to reach the bottom of the pot for temperature measurement, and the near-infrared temperature sensor is used to measure the temperature of the lower end surface of the microcrystalline plate.

[0011] Preferably, the temperature measurement module also includes a base, a PCB board, an SMBus bus and a single-chip microcomputer. The base is provided with a accommodating cavity, the ferrite shielding cover is attached to the inner wall of the accommodating cavity, the bottom of the accommodating cavity is provided with a PCB board, and the PCB board is embedded with a single-chip microcomputer. The single-chip microcomputer is connected to the medium-wave infrared temperature sensor and the near-infrared temperature sensor through the SMBus bus.

[0012] Preferably, the wavelength range of the medium-wave infrared temperature sensor is 0-3 μm, and the wavelength range of the near-infrared temperature sensor is 5.5-14 μm.

[0013] Preferably, the heating assembly includes a heating coil disk with a hollow center formed by winding a plurality of coils, and a plurality of magnets arranged in the center of the heating coil disk. The magnets are arranged in a circular array and attached to the inner side of the heating coil disk.

[0014] Preferably, the distance between the temperature measuring module and the cookware is set to at least 30 mm.

[0015] In addition, to achieve the above-mentioned object, the present invention further provides a temperature measurement method applied to the non-contact temperature measurement device capable of transmitting glass material as described in any one of the above items, the method comprising the following steps:

[0016] S1. Place the cookware on the microcrystalline board, start the heating element and drive it through the single chip microcomputer to generate heat energy and transfer it to the microcrystalline board and the cookware, including releasing the radiation energy of the microcrystalline board and the radiation energy of the cookware;

[0017] S2. Set the temperature measurement module to a distance of at least 30 mm below the cookware, use the near-infrared temperature sensor built into the temperature measurement module to detect the radiation energy released by the microcrystalline plate, obtain the microcrystalline plate temperature T1, and send it to the single-chip microcomputer of the temperature measurement module;

[0018] S3, using the medium-wave infrared temperature sensor built into the temperature measurement module, which has a specific wavelength that can penetrate the microcrystalline plate, to detect the pot temperature T2 corresponding to the radiation energy released by the pot, and send it to the single-chip microcomputer of the temperature measurement module;

[0019] S4. The single chip microcomputer calculates the actual temperature of the bottom of the cookware using a target formula within a preset cycle time.

[0020] As an example, the target formula is: T=Vir pot / (Tr*ε pot )+Ta 4 ,

[0021] Among them, Ta 4 =[(T1+T2) / 2] 4 ;

[0022] T is the actual temperature of the pot bottom, Vir pot is the radiation energy of the pot detected by the medium-wave infrared temperature sensor, Tr is the optical transmittance of the microcrystalline plate, ε pot is the emissivity of the pot, and Ta is the average temperature of the pot and the temperature of the microcrystalline plate.

[0023] Preferably, the specific wavelength range is 0-3um.

[0024] Preferably, the preset cycle time is 400 milliseconds to 600 milliseconds.

[0025] The beneficial effects of the present invention compared to the prior art are as follows:

[0026] The present invention provides a non-contact temperature measurement device that can penetrate glass materials. A temperature measurement module is arranged in a heating component with a hollow center. The temperature measurement module has a built-in ferrite shielding cover to shield the medium-wave infrared temperature sensor and the near-infrared temperature sensor, thereby preventing magnetic flux from entering and reducing the impact of magnetic interference on detection. It breaks the traditional NTC temperature measurement method and does not require drilling holes in the microcrystalline plate to cause damage or contact with the microcrystalline plate. The actual temperature of the cookware can be obtained. It has the advantages of being transparent to glass materials, non-contact, short temperature measurement time, shielding electromagnetic interference, and accurate temperature detection.

[0027] The present invention provides a non-contact temperature measurement method that can penetrate glass materials. The method uses a medium-wave infrared temperature sensor with a specific wavelength that can penetrate a microcrystalline plate to reach the bottom of the cookware for temperature measurement, and a near-infrared temperature sensor to measure the temperature of the lower end surface of the microcrystalline plate. The actual temperature of the bottom of the cookware is calculated based on a target formula, achieving the advantages of being able to penetrate glass materials, being non-contact, having fast temperature measurement, shielding electromagnetic interference, and accurate temperature measurement.

[0028] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the cross-sectional structure of the temperature measuring device of the present invention;

[0030] Figure 2 Schematic diagram of the cross-sectional structure of the temperature measurement module in the present invention;

[0031] Figure 3 Schematic diagram of the temperature measurement method of the present invention;

[0032] Reference numerals:

[0033] 1. Microcrystalline board; 2. Heating component; 3. Cookware; 4. Temperature measurement module; 5. Base; 6. PCB board; 7. SMBus bus; 8. Single-chip microcomputer; 9. Accommodation cavity; 10. Medium-wave infrared temperature sensor; 11. Near-infrared temperature sensor; 12. Hollow center; 13. Heating coil disk; 14. Magnet; 15. Ferrite shielding cover. DETAILED DESCRIPTION

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0035] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0036] To achieve the above objectives, an embodiment of the present invention provides a non-contact temperature measurement device that can be made of a transparent glass material, as shown in Figures 1-2, comprising:

[0037] A microcrystalline plate 1 for conducting heat is provided, and a heating component 2 with a hollow center 12 is provided directly below the microcrystalline plate 1;

[0038] A pot 3 placed on the microcrystalline plate 1;

[0039] A temperature measurement module 4 is provided below the microcrystalline plate 1 and is located at the center of the heating component 2;

[0040] The temperature measurement module 4 includes a built-in medium-wave infrared temperature sensor 10, a near-infrared temperature sensor 11 and a ferrite shielding cover 15. The medium-wave infrared temperature sensor 10 and the near-infrared temperature sensor 11 are both located in the ferrite shielding cover 15. The medium-wave infrared temperature sensor 10 emits medium-wave infrared rays that can penetrate the microcrystalline board 1 to reach the bottom of the pot 3 for temperature measurement, and the near-infrared temperature sensor 11 is used to measure the temperature of the lower end surface of the microcrystalline board 1.

[0041] In this embodiment, the microcrystalline plate 1 is a glass plate with a surface grain shape formed by the manufacture of glass material, which can be a circular microcrystalline plate 1, a square microcrystalline plate 1 or a microcrystalline plate 1 of other shapes. Glass can be simply divided into flat glass, tempered glass, frosted glass, sandblasted glass, embossed glass, etc. Because the traditional technology of induction cookers is to install a thermistor in the microcrystalline plate 1 to measure the temperature of the pot 3, or directly measure the temperature of the lower end surface of the microcrystalline plate 1 as the temperature of the pot 3, the measured temperature is not accurate, and there is electromagnetic interference, and the measured temperature data is unreliable. In addition to using the near-infrared temperature sensor 11 to detect the temperature of the lower end surface of the microcrystalline board 1, this embodiment also uses a medium-wave infrared temperature sensor 10 to emit medium-wave infrared rays that can penetrate the microcrystalline board 1 to reach the bottom of the pot 3 for temperature measurement. The wavelength range of the medium-wave infrared rays is 0-3um. This wavelength range can pass through the microcrystalline board 1 to detect the temperature of the pot 3, avoiding the damage and destruction of the stress in the microcrystalline board 1 caused by traditional openings, realizing non-contact temperature measurement technology, and the temperature measurement data is accurate and reliable. Among them, the wavelength range of the near-infrared temperature sensor 11 is 5.5-14um.

[0042] It should be noted that the shielding cover of this embodiment is a ferrite shielding cover 15. The ferrite material is a metal oxide with ferromagnetism, which can block or reduce the entry of magnetic flux, and can reduce the interference of noise on temperature measurement during the use of the induction cooker, making the temperature measurement more reliable.

[0043] Furthermore, the temperature measurement module 4 also includes a base 5, a PCB board 6, an SMBus bus 7 and a single-chip computer 8. The base 5 is provided with a accommodating cavity 9, and the ferrite shielding cover 15 is attached to the inner wall of the accommodating cavity 9. The bottom of the accommodating cavity 9 is provided with a PCB board 6, and the PCB board 6 is embedded with a single-chip computer 8. The single-chip computer 8 is connected to the medium-wave infrared temperature sensor 10 and the near-infrared temperature sensor 11 through the SMBus bus 7. The distance between the temperature measurement module 4 and the pot 3 is set to at least 30 mm. The heating component 2 includes a heating coil disk 13 with a hollow middle part 12 formed by winding a plurality of coils, and a plurality of magnets 14 arranged in the center of the heating coil disk 13. The magnets 14 are arranged in a circular array and attached to the inner side of the heating coil disk 13.

[0044] In this embodiment, a accommodating cavity 9 is dug on the base 5, and a ferrite shielding cover 15 built into the accommodating cavity 9 is used to shield the medium-wave infrared temperature sensor 10 and the near-infrared temperature sensor 11, blocking the entry of external magnetic flux, reducing electromagnetic interference during temperature measurement, and ensuring accurate temperature measurement. The SMBus bus 7 is used to connect the temperature measurement module 4, and the temperature measurement speed is less than 500ms, which is fast and efficient.

[0045] Of course, in this embodiment, the temperature measurement module 4 can have a small hole on the upper end surface of its base 5 to facilitate the infrared emission of the installed medium-wave infrared temperature sensor 10 and near-infrared temperature sensor 11; the ferrite shielding cover 15 can also have a small hole, and the accommodating cavity 9 of the base 5 can be opened, and the entire ferrite shielding cover 15 is placed and fixed, so that the infrared emission of the medium-wave infrared temperature sensor 10 and near-infrared temperature sensor 11 can be emitted; or a bottom plate can be set at the bottom of the base 5, and the entire ferrite shielding cover 15 is placed in the accommodating cavity 9, and a small hole can be opened on the upper end surface of the base 5 to facilitate infrared emission. The specific temperature measurement module 4 can be set according to needs and is not limited here.

[0046] In summary, the present invention provides a non-contact temperature measuring device that can penetrate glass material. A temperature measuring module 4 is arranged in a heating component 2 with a hollow middle portion 12. The temperature measuring module 4 has a built-in ferrite shielding cover 15 to shield the medium-wave infrared temperature sensor 10 and the near-infrared temperature sensor 11, thereby preventing magnetic flux from entering and reducing the impact of magnetic interference on detection. It breaks the traditional NTC temperature measurement method and does not require opening a hole in the microcrystalline plate 1 to cause damage or contact with the microcrystalline plate 1. The actual temperature of the pot 3 can be obtained, and it has the advantages of being transparent to glass material, non-contact, short temperature measurement time, shielding electromagnetic interference, and accurate temperature detection.

[0047] In addition, referring to FIG3 , to achieve the above-mentioned purpose, the present invention further provides a temperature measurement method for the non-contact temperature measurement device capable of transmitting glass material as described above, the method comprising the following steps:

[0048] S1. Place the cookware 3 on the microcrystalline board 1, start it, and drive the heating component 2 through the single chip microcomputer 8 to generate heat energy and conduct it to the microcrystalline board 1 and the cookware 3, including releasing the radiation energy of the microcrystalline board 1 and the radiation energy of the cookware 3.

[0049] The microcrystalline plate 1 is a glass plate with a granular surface, made of glass. It can be round, square, or any other shape. Glass can be simply categorized as flat glass, tempered glass, frosted glass, sandblasted glass, or patterned glass. The heating assembly 2 utilizes a heating coil disk 13 with a central hollow portion 12 and a ring-shaped array of magnets 14 to transfer heat, heating the microcrystalline plate 1 and the cookware 3 to release radiant energy.

[0050] It's important to note that the atoms and molecules that make up matter are in thermal motion, constantly changing their energy states. When an energy state transitions from a higher to a lower level, electromagnetic waves are radiated, carrying energy away in the form of photons. The most common form of thermal radiation is generated by the thermal motion of molecules. When the temperature is above absolute zero (-273.15°C), infrared radiation is emitted. The amount of radiation energy and its distribution by wavelength are determined by the surface temperature of the object.

[0051] S2. Set the temperature measuring module 4 to a distance of at least 30 mm below the cookware 3, and use the near-infrared temperature sensor 11 built into the temperature measuring module 4 to detect the radiation energy released by the microcrystalline board 1, obtain the microcrystalline board temperature T1 and send it to the single chip microcomputer 8 of the temperature measuring module 4.

[0052] In this embodiment, the temperature measurement module 4 is at least 30 mm away from the cookware 3, forming a non-contact setting with the microcrystalline plate 1, but is relatively close to the microcrystalline plate 1. The wavelength range of the near-infrared temperature sensor 11 is 5.5-14 μm. The near-infrared temperature sensor 11 can directly detect the microcrystalline plate temperature T1 corresponding to the radiation energy released by the microcrystalline plate 1.

[0053] S3. The medium-wave infrared temperature sensor 10 built into the temperature measurement module 4 has a specific wavelength that can penetrate the microcrystalline plate 1 to detect the pot temperature T2 corresponding to the radiation energy released by the pot 3 and send it to the single chip microcomputer 8 of the temperature measurement module 4.

[0054] In addition to using the near-infrared temperature sensor 11 to detect the temperature of the lower end surface of the microcrystalline board 1, this embodiment also uses a medium-wave infrared temperature sensor 10 to emit medium-wave infrared rays that can penetrate the microcrystalline board 1 to reach the bottom of the pot 3 for temperature measurement. The specific wavelength range used by the medium-wave infrared rays is 0-3um. Only the medium-wave infrared temperature sensor 10 within this range can receive the signal of this band. This wavelength range can pass through the microcrystalline board 1 to detect the pot temperature T2, avoiding the damage and destruction of the stress in the microcrystalline board 1 caused by traditional openings, and realizing non-contact temperature measurement technology that can penetrate glass materials, and the temperature measurement data is accurate and reliable.

[0055] S4. The single chip microcomputer 8 calculates the actual temperature of the bottom of the pot 3 using a target formula within a preset cycle time.

[0056] Specifically, the preset cycle time is 400 milliseconds to 600 milliseconds. Preferably, the temperature is detected and acquired once in a preset cycle time of 500 milliseconds for timely update.

[0057] The target formula is: T=Vir pot / (Tr*ε pot )+Ta 4,

[0058] Among them, Ta 4 =[(T1+T2) / 2] 4 ;

[0059] T is the actual temperature of the bottom of pot 3, Vir pot is the radiation energy of the pot 3 detected by the medium-wave infrared temperature sensor 10, Tr is the optical transmittance of the microcrystalline plate 1, ε pot is the emissivity of the pot 3, and Ta is the average temperature of the pot temperature T2 and the microcrystalline plate temperature T1.

[0060] In a temperature measurement embodiment, a comparative experiment is conducted using the following scenario 1 and scenario 2:

[0061] Scenario 1: Kitchen applications (such as range hoods and induction cookers). A PT100 (platinum resistance thermometer) is used to directly measure the bottom temperature of a pot 3. To ensure accurate temperature measurement, a groove is cut under the pot bottom. The PT100 is embedded in the groove. The pot can then be placed flat on a glass micro-ceramic plate 1 to directly measure the temperature of the pot 3.

[0062] Scenario 2: In the embodiment of this case, the microcrystalline plate 1 is made of any glass material, such as flat glass, tempered glass, frosted glass, sandblasted glass, embossed glass, etc. The temperature measurement module 4 can measure the actual temperature T of the pot bottom through the glass material without contact.

[0063] Comparing the temperature values ​​obtained in Scenario 1 and Scenario 2 shows that the actual pot bottom temperature T obtained in Scenario 2 is approximately equal to the temperature detected by the PT100 sensor in Scenario 1. The temperature tolerance range is plus or minus 1 degree, and the temperature difference is very small, far less than the traditional temperature measurement error (about 10 degrees). This confirms that the specific wavelength of 0-3 μm used in this embodiment has the ability to penetrate glass, which is not available in traditional induction cooker technology and has a good technical prospect.

[0064] In summary, the present invention provides a non-contact temperature measurement method that can penetrate glass materials. It uses a medium-wave infrared temperature sensor 10 with a specific wavelength that can penetrate the microcrystalline plate 1 to reach the bottom of the pot 3 for temperature measurement, and a near-infrared temperature sensor 11 to measure the temperature of the lower end surface of the microcrystalline plate 1. The actual temperature of the bottom of the pot 3 is calculated based on the target formula, achieving the advantages of being able to penetrate glass materials, non-contact, fast temperature measurement, shielding electromagnetic interference and accurate temperature measurement.

[0065] The technical principles of the present invention have been described above in conjunction with specific embodiments, which are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions based on the principles of the present invention fall within the scope of protection of the present invention. Those skilled in the art will be able to conceive of other specific embodiments of the present invention without inventive effort and will fall within the scope of protection of the present invention.

Claims

1. A temperature measurement method for a non-contact temperature measurement device that can penetrate glass, characterized in that: Non-contact temperature measurement devices that can measure temperature through glass include: A microcrystalline plate for conducting heat, with a heating component with a hollow center provided directly below the microcrystalline plate; a pot placed on the microcrystalline plate; A temperature measurement module is provided below the microcrystalline plate, and the temperature measurement module is located at the center of the heating component; The temperature measurement module includes a built-in medium-wave infrared temperature sensor, a near-infrared temperature sensor and a ferrite shielding cover. The medium-wave infrared temperature sensor and the near-infrared temperature sensor are both located in the ferrite shielding cover. The medium-wave infrared light emitted by the medium-wave infrared temperature sensor can penetrate the microcrystalline plate to reach the bottom of the cookware for temperature measurement, and the near-infrared temperature sensor is used to measure the temperature of the lower end surface of the microcrystalline plate. The method comprises the following steps: S1. Place the cookware on the microcrystalline board, start the heating element and drive it through the single chip microcomputer to generate heat energy and transfer it to the microcrystalline board and the cookware, including releasing the radiation energy of the microcrystalline board and the radiation energy of the cookware; S2. Set the temperature measurement module to a distance of at least 30 mm below the cookware, use the near-infrared temperature sensor built into the temperature measurement module to detect the radiation energy released by the microcrystalline plate, obtain the microcrystalline plate temperature T1, and send it to the single-chip microcomputer of the temperature measurement module; S3, using the medium-wave infrared temperature sensor built into the temperature measurement module, which has a specific wavelength that can penetrate the microcrystalline plate, to detect the pot temperature T2 corresponding to the radiation energy released by the pot, and send it to the single-chip microcomputer of the temperature measurement module; S4. The single chip microcomputer calculates and obtains the actual temperature of the bottom of the cookware within a preset cycle time.

2. The temperature measurement method of the non-contact temperature measurement device for transparent glass material according to claim 1, characterized in that: The preset cycle time is 400 milliseconds to 600 milliseconds.

3. The temperature measurement method for a non-contact temperature measurement device that can penetrate glass material according to claim 1, characterized in that: The temperature measurement module also includes a base, a PCB board, an SMBus bus and a single-chip microcomputer. The base is provided with a accommodating cavity, the ferrite shield is attached to the inner wall of the accommodating cavity, the bottom of the accommodating cavity is provided with a PCB board, and the PCB board is embedded with a single-chip microcomputer. The single-chip microcomputer is connected to the medium-wave infrared temperature sensor and the near-infrared temperature sensor through the SMBus bus.

4. The temperature measurement method for a non-contact temperature measurement device that can penetrate glass material according to claim 1, characterized in that: The heating assembly includes a plurality of coils wound to form a heating coil disk with a hollow center, and a plurality of magnets arranged in the center of the heating coil disk. The magnets are arranged in a ring array and attached to the inner side of the heating coil disk.

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