Support and battery pack

Abstract

The application provides a support and a battery pack, the support is used for fixing a BMS master controller, a first slave controller and a second slave controller, the support comprises a main plate and two side plates which are bently connected to two ends of the main plate, the main plate comprises a first layer main plate and a second layer main plate which are different in height, the first layer main plate comprises a first part and a second part which are arranged at intervals, the second layer main plate is located between the first part and the second part, and the second layer main plate is connected with the first part and the second part respectively, the first part is used for fixing one end of the first slave controller, the second part is used for fixing the other end of the first slave controller, the second layer main plate is used for supporting the BMS master controller, and the support is further provided with a containing cavity which is used for containing the second slave controller.

Description

Technical Field

[0001] This invention relates to the field of battery technology, and more specifically to a bracket and a battery pack. Background Technology

[0002] The battery pack includes a BMS (Battery Management System), which is a master-slave architecture system. Specifically, the BMS includes one BMS master controller and multiple BMS slave controllers. The size of the BMS master controller and the multiple BMS slave controllers are different. In related technologies, multiple brackets are usually designed inside the battery pack. One bracket is used to support the BMS master controller, and the other brackets are used to support the multiple BMS slave controllers. Since multiple brackets need to be fixed to the frame inside the battery pack, the battery pack assembly process is increased. At the same time, the weight of multiple brackets is also relatively heavy, increasing the overall weight of the battery pack and making it difficult to achieve a lightweight design for the battery pack. Summary of the Invention

[0003] Embodiments of the present invention provide a bracket and a battery pack, which can improve the technical problem that the battery pack requires multiple brackets for fixing the BMS master controller and multiple BMS slave controllers, thus making the battery pack assembly complex.

[0004] In a first aspect, embodiments of the present invention provide a bracket for fixing a BMS master controller, a first slave controller, and a second slave controller. The bracket includes a main board and two side plates bent and connected to both ends of the main board. The main board includes a first-layer main board and a second-layer main board with different heights. The first-layer main board includes a first portion and a second portion spaced apart. The second-layer main board is located between the first portion and the second portion and is connected to both the first portion and the second portion. The first-layer main board supports the first slave controller, and the second-layer main board supports the BMS master controller. The bracket also provides a receiving cavity for accommodating the second slave controller. A portion of the receiving cavity is defined by the second-layer main board and the two side plates, or a portion of the receiving cavity is defined by the first-layer main board and the two side plates.

[0005] In one embodiment, the second motherboard is located between the plane where the ends of the first motherboard and the two side panels are located. Along the height direction of the bracket, a first longitudinal gap is formed between the first motherboard and the second motherboard, and a second longitudinal gap is formed between the plane where the ends of the second motherboard and the two side panels are located. The first slave controller is fixed to the top surface of the first motherboard, the BMS master controller is housed in the first longitudinal gap, and the second slave controller is housed in the second longitudinal gap.

[0006] In one embodiment, the bracket further includes a third side plate and a fourth side plate, wherein the third side plate is bent and connected between the first part and the second layer motherboard, and the fourth side plate is bent and connected between the second part and the second layer motherboard. The third side plate, the fourth side plate, and the second layer motherboard together form a concave first receiving cavity, which is used to receive the BMS main controller.

[0007] In one embodiment, the first motherboard is located between the plane where the ends of the second motherboard and the two side panels are located. Along the height direction of the bracket, a first longitudinal gap is formed between the second motherboard and the first motherboard, and a second longitudinal gap is formed between the plane where the ends of the first motherboard and the two side panels are located. The BMS main controller is fixed on the top surface of the second motherboard, the first slave controller is housed in the first longitudinal gap, and the second slave controller is housed in the second longitudinal gap.

[0008] In one embodiment, the bracket further includes a third side plate and a fourth side plate, wherein the third side plate is bent and connected between the first part and the second layer main board, and the fourth side plate is bent and connected between the second part and the second layer main board. The third side plate, the fourth side plate, and the second layer main board together form a convex second receiving cavity, which is used to receive the first slave controller.

[0009] In one embodiment, the first motherboard and the second motherboard are arranged in parallel.

[0010] In one embodiment, the length of the second layer motherboard is greater than the length of either the first portion or the second portion.

[0011] In one embodiment, the length of the second-layer motherboard is 200mm to 300mm.

[0012] In one embodiment, the second motherboard is located between the plane where the ends of the first motherboard and the two side panels are located, and the height difference between the first motherboard and the second motherboard is 300mm to 400mm.

[0013] In one embodiment, the side plate includes a first side plate and a second side plate, and the bracket further includes a third side plate and a fourth side plate of the same height, wherein the third side plate is connected between the first part and the second layer motherboard, the fourth side plate is connected between the second part and the second layer motherboard, and the height of the third side plate is less than the height of the first side plate.

[0014] In one embodiment, the third side plate is flush with one end of the first side plate and is arranged parallel to the first side plate; or the fourth side plate is flush with one end of the second side plate and is arranged parallel to the second side plate.

[0015] In one embodiment, the height difference between the first side plate and the third side plate is 350mm to 450mm, or the height difference between the second side plate and the fourth side plate is 350mm to 450mm.

[0016] In one embodiment, the end of the first side plate is provided with a first flange, and the end of the second side plate is provided with a second flange. The first flange includes two first fixing holes, and the second flange includes two second fixing holes.

[0017] In one embodiment, a first reinforcing rib is provided between the first flange and the first side plate, and a second reinforcing rib is provided between the second flange and the second side plate.

[0018] In one embodiment, the first side plate includes a first wire harness fixing hole and a second wire harness fixing hole spaced apart, with the first wire harness fixing hole and the second wire harness fixing hole located near the other end of the first side plate.

[0019] In one embodiment, the second motherboard includes heat dissipation holes, and the inner wall of the heat dissipation holes is further provided with a flange.

[0020] In one embodiment, the second-layer motherboard includes heat dissipation holes, and two through holes are respectively provided on both sides of the heat dissipation holes, the through holes being used for bolts that fix the BMS main controller to pass through.

[0021] Secondly, embodiments of the present invention provide a battery pack, the battery pack including a BMS master controller, a first slave controller and a second slave controller, wherein the length of the BMS master controller extending along a first direction is less than the length of either the first slave controller or the second slave controller extending along the first direction, and the battery pack also includes the aforementioned bracket.

[0022] In one embodiment, the first slave controller, the BMS master controller, and the second slave controller are stacked along the height direction of the bracket.

[0023] In one embodiment, the BMS main controller is bolted to the first motherboard, the first slave controller is bolted to the second motherboard, and the second slave controller is bolted to the frame inside the battery pack.

[0024] The beneficial effects of the embodiments of the present invention are as follows:

[0025] In an embodiment of the present invention, a bracket is used to support and house a BMS master controller and two BMS slave controllers. The bracket includes a first motherboard and a second motherboard of different heights. The first motherboard includes a first part and a second part spaced apart, which are used to fix the two ends of the first slave controller, respectively. The second motherboard supports the BMS master controller. The bracket also has a receiving cavity for housing the second slave controller, thereby reducing the use of multiple brackets inside the battery pack, thereby increasing the assembly speed of the bracket and facilitating the lightweight design of the battery pack. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a perspective view of the battery pack provided in an embodiment of the present invention;

[0028] Figure 2 This is a perspective view of the bracket provided in one embodiment of the present invention;

[0029] Figure 3 This is a front view of a bracket provided in one embodiment of the present invention;

[0030] Figure 4 This is a top view of a bracket provided in one embodiment of the present invention;

[0031] Figure 5 This is a perspective view of a BMS hardware system fixed on a bracket according to an embodiment of the present invention;

[0032] Figure 6 This is a front view of a bracket provided in yet another embodiment of the present invention;

[0033] Icon labels:

[0034] 100. Battery Pack; 11. Battery Module; 12. Frame; 13. Housing; 20. BMS Hardware Control System; 21. BMS Main Controller; 22. BMS Slave Controller; 221. First Slave Controller; 222. Second Slave Controller; 30. Liquid Cooling System; 40. BDU; 50. Bracket; 51. Main Board; 511. First Layer Main Board; 5111. First Part; Second Part; 512. Second Layer Main Board; 52. Side Panel; 521. First Side Panel; 522. Second Side Panel; 523. Third Side Panel; 524. Fourth Side Panel; 5 3. Receiving cavity; 531. First receiving cavity; 532. Second receiving cavity; 541. First flange; 542. Second flange; 543. First fixing hole; 544. Second fixing hole; 551. First reinforcing rib; 552. Second reinforcing rib; 561. First through hole; 562. Second through hole; 563. Third through hole; 564. Fourth through hole; 57. Wire harness fixing hole; 61. First wire harness interface; 62. Second wire harness interface; 63. Third wire harness interface; 64. First wire harness; 65. Second wire harness; 66. Third wire harness; 70. Heat dissipation hole. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0036] One embodiment of this application provides a battery pack 100, see reference Figure 1 As shown, the battery pack 100 includes a housing, a plurality of battery modules 11 housed inside the housing, a frame 12 for housing the plurality of battery modules 11, a BMS hardware control system 20 for controlling the operating state of the plurality of battery modules 11, a liquid cooling system 30 for cooling the plurality of battery modules 11, and a BDU (Battery Distribution Unit) 40 for controlling the plurality of battery modules 11, wherein the BDU 40 is used to control the charging and discharging system of the battery system to operate smoothly.

[0037] The shell can be composed of several sub-shells, see further reference. Figure 1 As shown, the housing includes a top cover (not shown) and a box 13. The top cover covers the open end of the box 13. In the embodiments of this application, the box 13 and the frame 12 are integrated into one unit. That is, multiple partitions are provided inside the box 13, and the multiple partitions divide multiple chambers. A portion of the multiple chambers is used to accommodate multiple battery modules 11, wherein each chamber is used to accommodate one battery module 11. The other portion of the chambers is used to accommodate the BDU40 and the BMS hardware control system 20.

[0038] The liquid cooling system 30 includes an inlet and an outlet on the housing 13, an inlet pipe and an outlet pipe inside the housing 13, and a liquid cooling plate inside the battery module. One end of the inlet pipe is connected to the inlet, and the other end is connected to the inlet of the liquid cooling plate. One end of the outlet pipe is connected to the outlet of the liquid cooling plate, and the other end is connected to the outlet. Coolant is supplied to the liquid cooling plate inside the battery module 11 through the inlet and the inlet pipe. The coolant in the liquid cooling plate is used to cool down multiple battery modules through heat exchange. The circulating liquid in the cooling plate flows into the outlet pipe and then flows out through the outlet.

[0039] The BMS hardware control system manages multiple battery modules 11. It uses sensors to monitor the voltage, current, and temperature of the battery modules in real time. It also performs leakage detection, thermal management, battery balancing management, alarm reminders, calculates SOC (State of Charge) and discharge power, reports SOH (State of Health) and remaining SOC (State of Charge), and uses algorithms to control the maximum output power and obtain the maximum driving range of the electric vehicle based on the battery voltage, current, and temperature. It also uses algorithms to control the charger to charge at the optimal current. The system communicates in real time with the vehicle's main controller, motor controller, energy control system, and vehicle display system via a CAN (Controller Area Network) bus interface.

[0040] The BMS hardware control system mainly consists of a BMU (Battery Management Unit) main controller, a CSC slave controller, a CSU equalization control module, an HVU high-voltage controller, a BTU battery status indicator unit, and a GPS communication module. Depending on the capacity and size of the battery pack, the BMS hardware control system includes a control system with an integrated main controller and slave controller architecture, as well as a distributed architecture control system with separate main controller and slave controller. The integrated architecture control system is mostly used in power tools, robots, electric low-speed vehicles (electric bicycles, electric motorcycles, electric sightseeing vehicles, electric patrol vehicles, electric golf carts, etc.), electric forklifts, intelligent robots, IoT smart homes (robot vacuum cleaners, electric vacuum cleaners), mild hybrid vehicles, etc. The distributed architecture control system is mostly used in plug-in hybrid electric vehicles, pure electric vehicles, pure electric ships, etc.

[0041] The distributed architecture BMS control system can better realize hierarchical management at the module and system levels. The slave controller is responsible for voltage detection, temperature detection, equalization management and corresponding diagnostics of the individual units in the module. The slave controller sends the analyzed data to the master controller, which performs system evaluation of the battery pack, electrical system status detection, contactor management, thermal management, operation management, charging management, diagnostic management and management of internal and external communication networks.

[0042] The advantage of a distributed architecture control system is that it can be efficiently configured according to different series and parallel designs of battery pack systems, making the wiring distance between the control system and the battery modules shorter, more uniform, and more reliable, while also supporting larger battery pack system designs.

[0043] One embodiment of this application provides a distributed architecture BMS hardware control system 20, with reference to... Figure 5 As shown, the BMS hardware control system 20 includes a BMS master controller 21 and two BMS slave controllers 22. The two BMS slave controllers 22 include a first slave controller 221 and a second slave controller 222. The BMS master controller 21 includes three wiring harness connection interfaces, the first slave controller 221 includes five wiring harness connection interfaces, and the second slave controller 222 includes five wiring harness connection interfaces. The size of the BMS master controller 21 is smaller than that of the first slave controller 221, or the size of the BMS master controller 21 is smaller than that of the second slave controller 222. The size of the first slave controller 221 and the size of the second slave controller 222 can be configured to be close to or the same, wherein the size includes the length extending along the first direction X.

[0044] Further reference Figures 2 to 5As shown, this application also provides a bracket 50 for fixing the BMS main controller 21 and the two BMS slave controllers 22. Compared with the related technology, which fixes the main controller 21 and the two BMS slave controllers 22 on multiple brackets and then fixes the multiple brackets on the frame 12, the BMS main controller 21 and the two BMS slave controllers 22 can be fixed at the same time by one bracket 50, which can effectively improve the assembly efficiency, save the use of fixing bolts, and reduce the total weight of the entire battery pack.

[0045] The bracket 50 includes a main board 51 and two side plates 52 vertically connected to both ends of the main board 51. The main board includes a first main board 511 and a second main board 512 of different heights. The first main board 511 includes a first portion 5111 and a second portion 5112 spaced apart and on the same horizontal plane. The second main board 512 is located between the first portion 5111 and the second portion 5112. The first main board 511 supports the first slave controller 221, and the second main board 512 supports the BMS master controller 21. The bracket 50 also includes a receiving cavity 53 for accommodating the second slave controller 222. A portion of the boundary of the receiving cavity 53 is defined by the second main board 512 and the two side plates 52. Alternatively, in other alternative examples, a portion of the boundary of the receiving cavity 53 is defined by the first main board 511 and the two side plates 52.

[0046] In one embodiment, along the height direction of the support 50, such as Figure 3 In the Y direction shown, the second motherboard 512 is located between the plane where the first motherboard 511 and the ends of the two side plates 52 are located. Specifically, a first longitudinal interval h1 is defined between the first motherboard 511 and the second motherboard 512, and a second longitudinal interval h2 is defined between the plane where the ends of the second motherboard 512 and the two side plates 52 are located. The first slave controller 221 is fixed on the top surface of the first motherboard 511, the BMS master controller 21 is housed inside the first longitudinal interval h1, and the receiving cavity 53 for housing the second slave controller 222 is defined by the second longitudinal interval h2.

[0047] Further reference Figure 2As shown, the first motherboard 511 and the second motherboard 512 are arranged in parallel, and the height difference h1 between the first motherboard 511 and the second motherboard 512 is 300mm to 400mm. In one example, the height difference h1 between the first motherboard 511 and the second motherboard 512 is 320mm. It is understood that the height difference h1 between the first motherboard 511 and the second motherboard 512 can be any value between 300mm and 400mm, or any range between 300mm and 400mm. These are not all listed in the embodiments of this application.

[0048] The length d0 of the bracket 50 extending along the first direction X includes the length d11 of the first part 5111 of the first motherboard, the length d12 of the second part 5112 of the first motherboard, and the length d2 of the second motherboard 512. In a preferred embodiment, the first part 5111 and the second part 5112 are symmetrically arranged about the second motherboard 512, and the length d2 of the second motherboard 512 is greater than the length d11 of the first part 5111, or the length d2 of the second motherboard 512 is greater than the length d12 of the second part 5112.

[0049] The aforementioned bracket 50 extends in the first direction with a length d0 of 300mm to 500mm, wherein the second motherboard 512 extends in the first direction with a length d2 of 200mm to 300mm, the first portion 5111 extends in the first direction with a length d11 of 50mm to 100mm, and the second portion 5112 extends in the first direction with a length d12 of 50mm to 100mm. In one example, the length d0 of the bracket 50 is 360mm, the length d2 of the second motherboard 512 is 220mm, the length d11 of the first portion 5111 of the first motherboard is 70mm, and the length d12 of the second portion 5112 of the first motherboard is 70mm. It is understood that the length d0 of the bracket 50 extending in the first direction can be any value between 300mm and 500mm, or any range between 300mm and 500mm; these are not all listed in the embodiments of this application. The length d2 of the second-layer motherboard 512 extending along the first direction can be any value between 200mm and 300mm, or the length d2 of the second-layer motherboard 512 extending along the first direction can be any range between 200mm and 300mm. The length of the first part 5111 or the second part 5112 of the first-layer motherboard 511 extending along the first direction can be any value between 50mm and 100mm, or the length of the first part 5111 or the second part 5112 of the first-layer motherboard 511 extending along the first direction can be any range between 50mm and 100mm.

[0050] Further reference Figures 2 to 4 As shown, the side plate 52 of the bracket 50 includes two sets of side plates arranged in parallel. The first set of side plates includes a first side plate 521 and a second side plate 522 of the same height. The top end of the first side plate 521 is connected to one end of the first part 5111, and the top end of the second side plate 522 is connected to one end of the second part 5112. The second set of side plates includes a third side plate 523 and a fourth side plate 524 of the same height. The top end of the third side plate 523 is connected to the other end of the first part 5111, and the end end of the third side plate 523 is connected to one end of the second main board 512. The top end of the fourth side plate 524 is connected to the other end of the second part 5112, and the end end of the fourth side plate 524 is connected to the other end of the second main board 512.

[0051] The third side plate 523, the fourth side plate 524 and the second main board 512 together form a concave first receiving cavity 531, and the BMS main controller is housed inside the first receiving cavity 531.

[0052] In the above implementation, the top of the third side plate 523 is roughly flush with the top of the first side plate 521, and the height of the third side plate 523 is less than the height of the first side plate 521. The top of the fourth side plate 524 is roughly flush with the top of the second side plate 522, and the height of the fourth side plate 524 is less than the height of the second side plate 522.

[0053] In other alternative examples, the heights of the first side plate 521 and the second side plate 522 used to fix the bracket 50 may also be different, for example, the first side plate 521 and the second side plate 522 may be fixed to frame support beams of different heights respectively.

[0054] In a preferred embodiment, the height difference h2 between the first side plate 521 and the third side plate 523 is 350mm to 450mm, or the height difference h2 between the second side plate 522 and the fourth side plate 524 is 350mm to 450mm. In one example, the height difference h2 between the first side plate 521 and the third side plate 523 is 390mm, or the height difference h2 between the second side plate 522 and the fourth side plate 524 is 390mm. It is understood that the height difference h2 between the first side plate 521 and the third side plate 523 can be any range between 350mm and 450mm, or any value between 350mm and 450mm; these are not all listed in the embodiments of this application.

[0055] In yet another embodiment of the bracket provided in this application, reference is made to... Figure 6As shown, unlike the above embodiment, along the height Y direction of the bracket 50, the first motherboard 511 is located between the plane where the ends of the second motherboard 512 and the two side plates 52 are located. The second motherboard 512 and the first motherboard 511 define a third longitudinal interval h3, and the plane where the ends of the first motherboard 511 and the two side plates 52 are located defines a fourth longitudinal interval h4. The BMS main controller 21 is fixed on the top surface of the second motherboard 512, the first slave controller 221 is housed in the third longitudinal interval h3, and the receiving cavity 53 is defined by the fourth longitudinal interval h4.

[0056] The bottom end of the third side plate 523 is connected to the first part 5111 of the first motherboard, and the top end of the third side plate 523 is connected to the second motherboard 512. The bottom end of the fourth side plate 524 is connected to the second part 5112 of the first motherboard, and the top end of the fourth side plate 524 is connected to the second motherboard 512.

[0057] The aforementioned third side plate, fourth side plate, and first main board 511 enclose a convex second receiving cavity 532, and the first slave controller 221 is housed inside the second receiving cavity 532.

[0058] Alternatively, in the third embodiment of the bracket provided in this application, along the height Y direction of the bracket 50, the planes containing the ends of the second main board 512 and the two side plates 52 are on the same horizontal plane. The bracket 50 includes two receiving cavities 53, and the side plates 52 include a first side plate 521 and a second side plate 522 of the same height. One end of the first side plate 521 and the second main board 512 defines one receiving cavity 53, and the other end of the second side plate 522 and the second main board 512 defines another receiving cavity 53. It is understood that this type of receiving cavity 53 is suitable for accommodating a smaller second slave controller 222.

[0059] The bracket 50 is fixedly connected to the frame 12 inside the housing 13 by bolts. Specifically, a first flange 541 is provided at the end of the first side plate 521, and a second flange 542 is provided at the end of the second side plate 522. The first flange 541 is provided with two first fixing holes 543, and the second flange 542 is provided with two second fixing holes 544.

[0060] In the above embodiment, along the height direction of the bracket, the second motherboard 512 is located below the first motherboard 511. In other alternative embodiments, the second motherboard 512 is located above the first motherboard 511. In this case, the second motherboard 512 is used to support the BMS master controller 21, and the first motherboard 511 is used to support the first slave controller 221. The first slave controller 221 is fixed to the bottom surface of the first motherboard 511. The receiving cavity 53 inside the bracket 50 is defined by the first side plate 521, the second side plate 522 and the first motherboard 511. The second slave controller 222 is further accommodated inside the receiving cavity 53.

[0061] Compared to existing technologies, where a BMS main controller requires one double-sided mounting bracket and two slave controllers require two single-sided mounting brackets, and where a double-sided mounting bracket typically requires four bolts to be fixed to the frame inside the enclosure, and two single-sided mounting brackets typically require four bolts to be fixed to the frame inside the enclosure, the bracket 50 provided in this application embodiment can fix one BMS main controller 21 and two BMS slave controllers 22. Therefore, by using the bracket 50 provided in this application embodiment, the battery pack 100 can reduce the use of four fixing bolts, thereby improving installation efficiency.

[0062] Furthermore, compared to the prior art, where one BMS main controller requires one double-sided mounting bracket and two slave controllers require two single-sided mounting brackets, and the mounting brackets are typically made of stainless steel, the weight of the double-sided mounting bracket used to fix the BMS main controller is typically 0.511 kg, and the combined weight of the two single-sided mounting brackets used to fix the two slave controllers is typically 0.655 kg. However, using the integrated bracket 50 provided in the above embodiments of this application, the weight of bracket 50 is approximately 0.644 kg. Therefore, using the bracket 50 provided in the embodiments of this application can reduce the total weight of the mounting bracket by approximately 0.522 kg, thus basically reducing the total weight of the original mounting bracket by half, thereby effectively reducing the total weight of the battery pack 100 and contributing to the lightweight design of the battery pack 100.

[0063] In a preferred embodiment, in order to prevent the bracket 50 from deforming during installation, a first reinforcing rib 551 is provided between the first side plate 521 and the first flange 541, and a second reinforcing rib 552 is provided between the second side plate 522 and the second flange 542.

[0064] Further reference Figure 5As shown, two first through holes 561 are provided on the first part 5111 of the first layer motherboard, and two second through holes 562 are provided on the second part 5112 of the first layer motherboard. The first through holes 561 and the second through holes 562 are symmetrically arranged. One side of the first slave controller 221 is fixed to the two first through holes 561 by two bolts, and the other side of the first slave controller 221 is fixed to the two second through holes 562 by two bolts. A part of the first slave controller 221 is suspended above the BMS main controller 21.

[0065] Two third through holes 563 are provided on one side of the second motherboard 512, and two fourth through holes 564 are provided on the other side of the second motherboard 512. The third through holes 563 and the fourth through holes 564 are arranged symmetrically. One end of the BMS main controller 21 is fixed to the two third through holes 563 by two bolts, and the other end of the BMS main controller 21 is fixed to the two fourth through holes 564 by two bolts.

[0066] Since there is a height difference between the third side plate 523 and the first side plate 521, and the same height difference between the fourth side plate 524 and the second side plate 522, the second main plate 512, together with the first side plate 521 and the second side plate 522, defines a receiving cavity 53. The receiving cavity 53 is configured to accommodate the second slave controller 222, which is further fixed to the frame 12 inside the housing 13 by bolts.

[0067] In the above embodiment, by optimizing the spatial structure of the bracket 50, the first slave controller 221, the BMS master controller 21 and the second slave controller 222 can be stacked sequentially along the height direction Y of the bracket 50, thereby concentrating the BMS master controller 21, the first slave controller 221 and the second slave controller 222 as much as possible, thereby improving the utilization rate of the internal space of the battery pack 100.

[0068] In a preferred embodiment, the BMS master controller 21 includes a plurality of first wiring harness interfaces 61, the first slave controller 221 includes a plurality of second wiring harness interfaces 62, and the second slave controller 222 includes a plurality of third wiring harness interfaces 63. The number of first wiring harness interfaces 61 is less than the number of any one of the second wiring harness interfaces 62 or the number of any one of the third wiring harness interfaces 63. Furthermore, the plurality of first wiring harness interfaces 61, the plurality of second wiring harness interfaces 62, and the plurality of third wiring harness interfaces 63 are all arranged facing the same side, thereby optimizing the wiring harness connection structure inside the battery pack 100.

[0069] In a further preferred embodiment, at least two wire harness fixing holes 571 are provided on the first side plate 521 of the bracket 50. These at least two wire harness fixing holes 571 facilitate fixing by at least two wire harness fixing devices. Multiple first wire harnesses 64 connected to the first wire harness interface 61, multiple second wire harnesses 65 connected to the second wire harness interface 62, and multiple third wire harnesses 66 connected to the third wire harness interface 63 are fixed and guided by at least two wire harness fixing devices, so as to avoid the multiple first wire harnesses 64, multiple second wire harnesses 65 and multiple third wire harnesses 66 being arranged in a disorderly manner, thereby causing excessive local wire harness entanglement, resulting in overheating and burnout.

[0070] In a preferred embodiment, considering that the BMS master controller 21 is stacked with the first slave controller 221 and the second slave controller 222, and the BMS master controller 21 is arranged between the first slave controller 221 and the second slave controller 222, in order to facilitate heat dissipation of the BMS master controller 21, a heat dissipation hole 70 is provided on the second motherboard 512. The heat dissipation hole 70 is located between the third through hole 563 and the fourth through hole 564. The heat dissipation hole 70 is configured as a square hole, which facilitates the release of heat generated by the BMS master controller 21 during operation through the heat dissipation hole 70.

[0071] In the above embodiments, the size of the BMS main controller 21 that is suitable for fixing in the bracket 50 is smaller than the size of either of the two slave controllers 22. In other alternative examples, the BMS main controller 21 and the two slave controllers 22 of the same size can also be fixed by improving the structure of the bracket. For example, the length of the second motherboard can be increased, the third side plate can be tilted or bent toward the first side plate, the fourth side plate can be tilted or bent toward the second side plate, etc.

[0072] The embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A bracket for fixing a BMS master controller, a first slave controller, and a second slave controller, characterized in that, The bracket includes a main board and two side plates bent and connected to both ends of the main board. The main board includes a first main board and a second main board with different heights. The first main board includes a first part and a second part spaced apart. The second main board is located between the first part and the second part and is connected to the first part and the second part respectively. The first part is used to fix one end of the first slave controller, and the second part is used to fix the other end of the first slave controller. The second main board is used to support the BMS main controller. The bracket has a receiving cavity for accommodating the second slave controller. A portion of the receiving cavity is defined by the second main board and the two side plates. The second motherboard is located between the plane where the ends of the first motherboard and the two side panels are located, and the length of the second motherboard is greater than the length of either the first part or the second part; The bracket also includes a third side plate and a fourth side plate, wherein the third side plate is bent and connected between the first part and the second layer motherboard, and the fourth side plate is bent and connected between the second part and the second layer motherboard. The third side plate, the fourth side plate and the second layer motherboard together form a concave first receiving cavity, which is used to receive the BMS main controller.

2. The bracket according to claim 1, characterized in that, Along the height direction of the bracket, a first longitudinal gap is formed between the first motherboard and the second motherboard, and a second longitudinal gap is formed between the second motherboard and the plane where the ends of the two side plates are located. The first slave controller is fixed on the top surface of the first motherboard, the BMS master controller is housed in the first longitudinal gap, and the second slave controller is housed in the second longitudinal gap.

3. The stent according to any one of claims 1-2, characterized in that, The first-layer motherboard and the second-layer motherboard are arranged in parallel.

4. The stent according to any one of claims 1-2, characterized in that, The length of the second-layer motherboard is 200mm~300mm.

5. The stent according to any one of claims 1-2, characterized in that, The height difference between the first motherboard and the second motherboard is 300mm~400mm.

6. The stent according to any one of claims 1-2, characterized in that, The two side panels include a first side panel and a second side panel of the same height. The third side panel and the fourth side panel are of the same height. The height of the third side panel is less than the height of the first side panel, and the height of the fourth side panel is less than the height of the second side panel.

7. The stent according to claim 6, characterized in that, The third side plate is flush with one end of the first side plate, and the third side plate is arranged parallel to the first side plate; Alternatively, the fourth side plate may be flush with one end of the second side plate, and the fourth side plate may be arranged parallel to the second side plate.

8. The bracket according to claim 7, characterized in that, The height difference between the first side plate and the third side plate is 350mm~450mm, or the height difference between the second side plate and the fourth side plate is 350mm~450mm.

9. The stent according to claim 6, characterized in that, The first side plate has a first flange at its end, and the second side plate has a second flange at its end. The first flange includes two first fixing holes, and the second flange includes two second fixing holes.

10. The stent according to claim 9, characterized in that, A first reinforcing rib is provided between the first flange and the first side plate, and a second reinforcing rib is provided between the second flange and the second side plate.

11. The bracket according to claim 6, characterized in that, The first side plate includes a first wire harness fixing hole and a second wire harness fixing hole arranged at intervals, with the first wire harness fixing hole and the second wire harness fixing hole located near the top of the first side plate.

12. The stent according to claim 6, characterized in that, The second-layer motherboard includes heat dissipation holes, and two through holes are provided on each side of the heat dissipation holes. The through holes are used for the bolts that fix the BMS main controller to pass through.

13. A battery pack, the battery pack comprising a BMS master controller, a first slave controller, and a second slave controller, wherein the length of the BMS master controller extending along a first direction is less than the length of either the first slave controller or the second slave controller extending along the first direction, characterized in that, The battery pack further includes the bracket as described in any one of claims 1-12.

14. The battery pack according to claim 13, characterized in that, The first slave controller, the BMS master controller, and the second slave controller are stacked along the height direction of the bracket.

15. The battery pack according to claim 14, characterized in that, The BMS main controller is fixed to the first layer motherboard by bolts, the first slave controller is fixed to the second layer motherboard by bolts, and the second slave controller is fixed to the frame inside the battery pack by bolts.

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