Silicon wafer turntable and screen printing turn line body thereof

By employing a combination of elastic limiting components and sensing probes on the silicon wafer flipping stage, the problems of bumps and jamming during the silicon wafer flipping process are solved, ensuring stable transmission and smooth delivery of the silicon wafers, and improving the stability and safety of screen printing.

CN117261409BActive Publication Date: 2026-01-02徐州中辉光伏科技有限公司
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
CN202311313617.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-10-11
Publication Date
2026-01-02
Estimated Expiration
2043-10-11

AI Technical Summary

Technical Problem

Existing flippers are prone to causing silicon wafers to bump or break during the flipping process due to poor coordination between the conveyor belt and the flipper, and they also have jamming problems, which affect the stability and safety of screen printing.

Method used

The system employs a combination of elastic limiting components and sensing probes. The elastic limiting components provide buffer protection, while the sensing probes perform detection and judgment to ensure stable insertion and delivery of the silicon wafer and prevent jamming failures.

Benefits of technology

It achieves stability and safety during the silicon wafer flipping process, preventing bumps and jams, and ensuring the smooth progress of the screen printing process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117261409B_ABST
    Figure CN117261409B_ABST
Patent Text Reader

Abstract

The application discloses a silicon wafer overturning table and a screen printing overturning line body thereof, and relates to the technical field of photovoltaic cell production. The silicon wafer overturning table comprises a rotating shaft and two overturning pieces fixedly sleeved at both ends of the rotating shaft, a plurality of notches are axially formed on the two overturning pieces in correspondence; further comprising a shaft sleeve; the shaft sleeve is fixedly sleeved on the rotating shaft and located between the two overturning pieces; a plurality of sets of elastic limiters and sensing probes are arranged on the shaft sleeve, each set of the elastic limiters and the sensing probes corresponds to a set of notches of the two overturning pieces in correspondence, and the elastic limiters protrude from the circumferential surface of the shaft sleeve. The screen printing overturning line body comprises the silicon wafer overturning table, and an inlet conveying line body and an outlet conveying line body arranged on both sides of the silicon wafer overturning table. The silicon wafer overturning table with the buffering and detecting effects is adopted, so that the stability and safety of the silicon wafer can be ensured in the process of transmission and overturning, and the error prevention effect is better.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic cell production, in particular to a screen printing process, and more particularly to a silicon wafer turnover table and a screen printing turnover line body thereof. BACKGROUND

[0002] Generally, the process steps of a solar cell silicon wafer include the following steps:

[0003] 1. Texturing, etching the surface of the silicon wafer into a pyramid shape;

[0004] 2. Diffusion, forming a PN junction on the surface of the silicon wafer;

[0005] 3. Etching, removing the PN junction at the edge of the silicon wafer to prevent short circuit of the cell;

[0006] 4. PSG removal, cleaning the surface of the silicon wafer to remove the silicon dioxide layer;

[0007] 5. PECVD, depositing a layer of anti-reflective film on the surface of the silicon wafer;

[0008] 6. Printing and sintering, printing electrodes and back field, and drying and sintering.

[0009] Printing and sintering, i.e. the screen printing process, is to print metal electrodes on both sides of the silicon wafer to facilitate the conduction of the current converted by light. The existing printing process flow is as follows:

[0010] Back silver paste printing - drying - back aluminum paste printing - drying - turnover - front silver paste printing, wherein the turnover step is completed by a turnover device.

[0011] The structure of the existing turnover device is shown in the structures provided in the prior art 201511019230.3 and 201710667300.9. The structure of the existing turnover device has been relatively mature. The general problem encountered at present is that the silicon wafer is broken due to the bumping during the cooperation of the conveying belt and the turnover device, or due to the failure of the turnover device to achieve good transmission.

[0012] Therefore, how to provide a silicon wafer turnover table and a screen printing turnover line body thereof that can ensure more stable and accurate turnover in the screen printing process is a problem that needs to be solved by those skilled in the art. SUMMARY

[0013] Therefore, the present application provides a silicon wafer turnover table and a screen printing turnover line body thereof, which aims to solve the above technical problems.

[0014] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0015] The utility model provides a silicon wafer turnover platform, which comprises a rotating shaft and two turnover pieces fixedly sleeved on both ends of the rotating shaft, and a plurality of notches are axially formed on the two turnover pieces; and an axle sleeve is further arranged between the two turnover pieces.

[0016] The axle sleeve is fixedly sleeved on the rotating shaft; a plurality of sets of elastic limiters and inductive probes are arranged on the axle sleeve; each set of the elastic limiters and the inductive probes corresponds to a set of notches of the two turnover pieces; the elastic limiters protrude from the circumferential surface of the axle sleeve; and the radial distance of the elastic limiters relative to the axle sleeve is greater than the radial distance of the bottom of the notch relative to the axle sleeve.

[0017] The silicon wafer turnover platform provided by the utility model can prevent the damage of the traditional structure to the silicon wafer and various fault problems, and the elastic limiters and the inductive probes are used for double protection; the elastic limiters can buffer and protect the silicon wafer and dynamically follow the silicon wafer, so that the silicon wafer can be stably inserted and smoothly sent out; the inductive probes can detect and judge whether the silicon wafer is inserted and whether the silicon wafer is sent out, so that the jamming fault in the turnover process is prevented; the utility model has simple structure and reliable detection effect, and can better ensure the stable turnover of the silicon wafer in the screen printing process.

[0018] Preferably, in the above-mentioned silicon wafer turnover platform, a sink groove is formed in the axle sleeve, and the lower part of the elastic limiter is installed in the sink groove, so as to ensure the stability of the elastic limiter and limit the stable movement of the elastic limiter.

[0019] Preferably, in the above-mentioned silicon wafer turnover platform, the elastic limiter comprises a spring and a limiting head, one end of the spring is fixed in the sink groove, the limiting head is fixed at the other end of the spring, and the lower part of the limiting head is slidably connected with the sink groove; the spring and the limiting head are combined, so that the structure is simple and reliable.

[0020] Preferably, in the above-mentioned silicon wafer turnover platform, a silica gel pad is fixed to the top end of the limiting head, and the cross section of the silica gel pad is in U shape; the silica gel pad can buffer and protect the silicon wafer, and the U-shaped structure has better limiting effect.

[0021] Preferably, in the above-mentioned silicon wafer turnover platform, two elastic limiters are arranged between a set of notches of the two turnover pieces, and the inductive probe is arranged between the two elastic limiters; the rationality of the structure layout is further improved, and the stable cooperation effect is ensured.

[0022] Preferably, in the above-mentioned silicon wafer turnover table, the spring elastic coefficient and the weight of the limiting head are set to meet the following requirements: when the limiting head is located at the highest position of the shaft sleeve rotation state, the spring can be compressed to produce deformation; when the limiting head is located at the lowest position of the shaft sleeve rotation state, the spring can be stretched to produce deformation. In order to ensure the stable receiving and sending of the silicon wafer by the elastic limiting piece, the spring elastic coefficient and the weight of the limiting head are reasonably matched, so that the spring can produce different compression and stretching actions under the action of the limiting head during the rotation of the shaft sleeve, thereby driving the silicon wafer to move, ensuring the stable receiving and smooth sending of the silicon wafer, and preventing the silicon wafer from being completely stationary to cause jamming.

[0023] Preferably, in the above-mentioned silicon wafer turnover table, the sensing probe is an infrared sensing probe. The infrared sensing probe can meet the sensing detection requirements.

[0024] The application also provides a screen printing turnover line body, which comprises the above-mentioned silicon wafer turnover table and an inlet conveying line body and an outlet conveying line body arranged on both sides of the silicon wafer turnover table.

[0025] Through the above technical solution, the screen printing turnover line body of the application adopts the silicon wafer turnover table with buffering and detection effects, so that the stability and safety of the silicon wafer during transmission and turnover can be ensured, and better error prevention effect is achieved.

[0026] Preferably, in the above-mentioned screen printing turnover line body, the inlet conveying line body and the outlet conveying line body each comprise two conveying belt structures, and the two conveying belt structures are arranged outside the two turnover pieces. The two conveying belt structures are arranged outside the turnover pieces, which can improve the stability of conveying.

[0027] Preferably, in the above-mentioned screen printing turnover line body, a driving mechanism for driving the rotating shaft to rotate and driving the inlet conveying line body and the outlet conveying line body to run is further included. The driving mechanism adopts a conventional motor driving structure, which is a conventional structure in the prior art and will not be described here.

[0028] Through the above technical solution, compared with the prior art, the application discloses a silicon wafer turnover table and a screen printing turnover line body thereof, which have the following beneficial effects:

[0029] 1. The silicon wafer turnover platform provided by the application prevents damage to the silicon wafer by a traditional structure and various failure problems, and adopts elastic limit pieces and an induction probe for double protection, the elastic limit pieces can provide buffer protection and dynamic follow-up for the silicon wafer, ensure that the silicon wafer can be stably inserted and smoothly sent out, and the induction probe can detect and judge whether the silicon wafer is inserted and whether the silicon wafer is sent out, preventing jamming failure in the turnover process; the application has simple structure, reliable detection and use effect, and can better ensure the stable wafer turnover in the screen printing process.

[0030] 2. In order to ensure that the elastic limit pieces stably receive and send out the silicon wafer, the spring elastic coefficient and the weight of the limit head are reasonably matched, so that the spring can produce different compression and stretching actions under the action of the limit head in the rotating process of the shaft sleeve, thereby driving the silicon wafer to act, ensuring the stable reception and smooth sending out of the silicon wafer, and preventing the jamming problem caused by the complete static state of the silicon wafer by using micro action control.

[0031] 3. The screen printing turnover line body of the application adopts the silicon wafer turnover platform with buffering and detection effect, so that the silicon wafer can ensure stability and safety during transmission and wafer turnover, and has better error prevention effect. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0033] Figure 1 The drawings are structural schematic diagrams of the silicon wafer turnover platform and the silicon wafer turnover platform in the screen printing turnover line body thereof provided by the application;

[0034] Figure 2 The drawings are top views of the silicon wafer turnover platform and the silicon wafer turnover platform in the screen printing turnover line body thereof provided by the application;

[0035] Figure 3 The drawings are side views of the silicon wafer turnover platform and the silicon wafer turnover platform in the screen printing turnover line body thereof provided by the application;

[0036] Figure 4 The drawings are sectional views of the silicon wafer turnover platform and the silicon wafer turnover platform in the screen printing turnover line body thereof provided by the application;

[0037] Figure 5 The drawings are structural schematic diagrams of the shaft sleeve in the silicon wafer turnover platform and the screen printing turnover line body thereof provided by the application;

[0038] Figure 6 The drawing is a structural schematic view of the elastic limiting member in the screen printing turnover line of the silicon wafer turnover table and the screen printing turnover line thereof provided by the present application.

[0039] Figure 7 The drawing is an exploded view of the elastic limiting member in the screen printing turnover line of the silicon wafer turnover table and the screen printing turnover line thereof provided by the present application.

[0040] Figure 8 The drawing is a structural schematic view of the screen printing turnover line in the screen printing turnover line of the silicon wafer turnover table and the screen printing turnover line thereof provided by the present application.

[0041] Figure 9 The drawing is a structural schematic view of the screen printing turnover line in the screen printing turnover line of the silicon wafer turnover table and the screen printing turnover line thereof provided by the present application.

[0042] Wherein:

[0043] 1-rotation shaft;

[0044] 2-turnover piece;

[0045] 21-slot;

[0046] 3-shaft sleeve;

[0047] 31-sink groove;

[0048] 4-elastic limiting member;

[0049] 41-spring; 42-limiting head; 43-silica gel pad;

[0050] 5-sensing probe;

[0051] 6-feeding conveying line;

[0052] 7-discharging conveying line;

[0053] 8-silicon wafer. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0055] Embodiment 1:

[0056] Referring to the drawings, Figure 1 to the drawings, Figure 5The embodiment of the present application discloses a silicon wafer turnover platform, which comprises a rotating shaft 1 and two turnover pieces 2 fixedly sleeved on both ends of the rotating shaft 1, and a plurality of slots 21 are axially formed on the two turnover pieces 2 correspondingly; the turnover platform further comprises a shaft sleeve 3;

[0057] The shaft sleeve 3 is fixedly sleeved on the rotating shaft 1 and located between the two turnover pieces 2; a plurality of groups of elastic limit pieces 4 and induction probes 5 are arranged on the shaft sleeve 3, each group of the elastic limit pieces 4 and the induction probes 5 correspond to a group of slots of the two turnover pieces 2, the elastic limit pieces 4 protrude from the circumferential surface of the shaft sleeve 3, and the radial distance of the elastic limit pieces 4 relative to the shaft sleeve 3 is greater than the radial distance of the slot bottom of the slots 21 relative to the shaft sleeve 3.

[0058] In order to further optimize the above technical scheme, a sinking groove 31 is formed on the shaft sleeve 3, and the lower part of the elastic limit piece 4 is installed in the sinking groove 31.

[0059] Referring to the accompanying drawings Figure 6 to the accompanying drawings Figure 7 The elastic limit piece 4 comprises a spring 41 and a limiting head 42, one end of the spring 41 is fixed in the sinking groove 31; the limiting head 42 is fixed at the other end of the spring 41, and the lower part of the limiting head 42 is in sliding connection with the sinking groove 31.

[0060] In order to further optimize the above technical scheme, a silica gel pad 43 is fixed to the top end of the limiting head 42, and the cross section of the silica gel pad 43 is U-shaped.

[0061] In order to further optimize the above technical scheme, two elastic limit pieces 4 are arranged between a group of slots 21 of the two turnover pieces 2 correspondingly, and the induction probe 5 is arranged between the two elastic limit pieces 4.

[0062] In order to further optimize the above technical scheme, the elastic coefficient of the spring 41 and the weight of the limiting head 42 are arranged to meet the following requirements: when the limiting head 42 is located at the highest position in the rotating state of the shaft sleeve 3, the spring 41 can be compressed to deform; when the limiting head 42 is located at the lowest position in the rotating state of the shaft sleeve 3, the spring 41 can be stretched to deform.

[0063] In order to further optimize the above technical scheme, the induction probe 5 is an infrared induction probe.

[0064] Embodiment 2:

[0065] Referring to the accompanying drawings Figure 8 The embodiment of the present application discloses a silk screen printing turnover line body, which comprises the silicon wafer turnover platform of embodiment 1, and a feeding conveying line body 6 and a discharging conveying line body 7 arranged on both sides of the silicon wafer turnover platform.

[0066] In order to further optimize the above technical solutions, the feeding conveying line body 6 and the discharging conveying line body 7 each include two conveying belt structures arranged at the outer sides of the two turnover pieces 2.

[0067] In the embodiment, a driving mechanism for driving the rotating shaft 1 to rotate and driving the feeding conveying line body 6 and the discharging conveying line body 7 to operate is further included. Here, it is a conventional structure in the prior art and is not the focus of the embodiment, and thus will not be described here again.

[0068] The effect of the screen printing turnover line body provided by the embodiment is double-protected by the elastic limiting piece 4 and the inductive probe 5, and specifically:

[0069] Regarding the effect of the elastic limiting piece 4: under the action of the feeding conveying line body 6, the silicon wafer 8 is conveyed forward into the slot 21. The silicon wafer 8 entering the slot 21 first touches the silica gel pad 43 of the elastic limiting piece 4, and then the rotating shaft 1 rotates. As the position of the elastic limiting piece 4 gradually rises, the gravity acting on the spring 41 gradually increases, and the silicon wafer 8 gradually descends and stably falls on the bottom of the slot 21, thereby ensuring stability. As the rotating shaft 1 rotates, the position of the elastic limiting piece 4 reaches the highest point and then gradually decreases from the highest point. At this time, the gravity acting on the spring 41 gradually decreases, and the spring 41 generates a certain pushing force, so that the silicon wafer 8 moves a small amount outward from the slot 21. However, this small amount of movement breaks the state of rest, and when the silicon wafer 8 contacts the discharging conveying line body 7, it can be stably taken away by the discharging conveying line body 7, thereby preventing the occurrence of a jamming phenomenon.

[0070] In addition, when the elastic limiting piece 4 rotates to the lowermost position, the limiting head 42 is stretched due to the gravity of the limiting head 42, so that the limiting head 42 extends and can play a buffering role when receiving the silicon wafer 8 next time.

[0071] Regarding the effect of the inductive probe 5: the inductive probe 5 continuously senses a signal that a plurality of continuous slots 21 have the silicon wafer 8. The alarm content of the inductive probe 5 includes:

[0072] ① The signal that a plurality of continuous slots 21 have the silicon wafer 8 has a break;

[0073] ② Under normal circumstances: among the signals that a plurality of continuous slots 21 have the silicon wafer 8, the frontmost slot 21 detects the signal of the silicon wafer 8 inserted, and the rearmost slot 21 can detect the signal of the silicon wafer 8 leaving. If the signal of the silicon wafer 8 leaving is not detected, an alarm is given.

[0074] Under the alarm condition, an emergency stop can be started to prevent machine failure.

[0075] The various embodiments described in this specification are implemented in a progressive manner, each embodiment focusing on the differences from other embodiments, and the same or similar parts between embodiments can be mutually referred to. For the apparatus disclosed by the embodiments, since it corresponds to the method disclosed by the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0076] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Therefore, the application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A silicon wafer flipper station comprising: A rotating shaft (1) and two flip plates (2) fixedly sleeved on both ends of the rotating shaft (1), a plurality of notches (21) are axially and correspondingly formed on the two flip plates (2); characterized in that further comprising: a shaft sleeve (3); The shaft sleeve (3) is fixedly sleeved on the rotating shaft (1) and located between the two flip plates (2); a plurality of groups of elastic limit members (4) and induction probes (5) are arranged on the shaft sleeve (3), each group of the elastic limit members (4) and the induction probe (5) correspond to a group of notches of the two flip plates (2), the elastic limit members (4) protrude from the circumferential surface of the shaft sleeve (3), and the radial distance of the elastic limit members (4) relative to the shaft sleeve (3) is greater than the radial distance of the notch bottom relative to the shaft sleeve (3); A sink groove (31) is formed on the shaft sleeve (3), and the lower part of the elastic limit member (4) is mounted in the sink groove (31); The elastic limit member (4) comprises a spring (41) and a limiting head (42), one end of the spring (41) is fixed in the sink groove (31), and the limiting head (42) is fixed at the other end of the spring (41); the lower part of the limiting head (42) is in sliding connection with the sink groove (31); Two elastic limit members (4) are arranged between a group of notches (21) of the two flip plates (2), and the induction probe (5) is arranged between the two elastic limit members (4); The elastic coefficient of the spring (41) and the weight of the limiting head (42) satisfy the following requirements: when the limiting head (42) is located at the highest position in the rotating state of the shaft sleeve (3), the spring (41) can be deformed by being compressed; and when the limiting head (42) is located at the lowest position in the rotating state of the shaft sleeve (3), the spring (41) can be deformed by being stretched.

2. The silicon wafer turner of claim 1 wherein, The top end of the limiting head (42) is fixed with a silica gel pad (43), and the cross section of the silica gel pad (43) is U-shaped.

3. The silicon wafer turner of claim 1 wherein: The induction probe (5) is an infrared induction probe.

4. A screen printed flip-chip body, characterized by The silicon wafer flipping table, an input conveying line body (6) and an output conveying line body (7) arranged on both sides of the silicon wafer flipping table.

5. A screen printed flip-chip according to claim 4, wherein The input conveying line body (6) and the output conveying line body (7) each comprise two conveying belt structures, and the two conveying belt structures are arranged outside the two flip plates (2), respectively.

6. A screen printed flip-chip according to claim 4, wherein Further comprising a driving mechanism for driving the rotating shaft (1) to rotate and driving the input conveying line body (6) and the output conveying line body (7) to run.

Citation Information

Patent Citations

  • Novel silicon wafer overturning device

    CN105692150A

  • Silicon wafer rapid turning mechanism

    CN107452656A

  • Automatic film turning device

    CN102285204A

  • Silk screen basket of flowers material loading machine transmission device

    CN207712926U

  • Graphite boat calibration device

    CN210403677U